LED package light source and method for manufacturing LED package light source

Abstract

The present application relates to the technical field of LED semiconductor light-emitting, in particular to a LED packaging light source and a preparation method thereof, the LED packaging light source comprises: a substrate, LED chips arranged on one side of the substrate; the LED chips comprise first blue light chips with a main wavelength of 445-447.5 nm, green light chips with a main wavelength of 514-532 nm, second blue light chips with a main wavelength of 455-457.5 nm, third blue light chips with a main wavelength of 467.5-470 nm and fourth blue light chips with a main wavelength of 477.5-480 nm arranged according to a preset order and connected in series; at least two layers of fluorescent glue layers are arranged on the side of the substrate on which the LED chips are arranged from the side close to the LED chips to the side far away from the LED chips, wherein the fluorescent glue layer close to the LED chips is a red fluorescent glue layer, and diffusion particles and / or anti-sedimentation particles are arranged in the fluorescent glue layers, so that the energy intensity of blue light is reduced and the saturation of color is improved. The present application also provides a preparation method of the LED packaging light source, which is used for preparing the above-mentioned LED packaging light source and has the same beneficial effects as the above-mentioned LED packaging light source.

Description

[Technical Field]

[0001] This invention relates to the field of LED semiconductor light-emitting technology, and in particular to an LED packaged light source and a method for preparing the LED packaged light source. [Background Technology]

[0002] As living standards improve, people's requirements for light sources have gradually shifted from simple high-efficiency, low-cost lighting to contextualized applications of high-quality, human-centered lighting. LEDs, as an emerging lighting source, offer advantages such as high luminous efficacy, small size, long lifespan, low voltage, rich colors, energy saving, and environmental friendliness, making them the preferred choice for future mainstream lighting sources.

[0003] Currently, the commonly used LED light source in the industry uses blue or violet light chips to excite phosphors of various colors, including aluminates, oxides, silicates, and nitrides, to emit light. By adjusting the wavelength of the phosphors, white light of different color temperatures can be achieved. However, the blue light energy of this method is still too high, and the green and red light are not saturated enough, which reduces the quality of the light. [Summary of the Invention]

[0004] To address the problems in the prior art, this invention provides an LED packaged light source and a method for preparing the LED packaged light source.

[0005] The solution to the technical problem of the present invention is to provide an LED packaged light source, the LED packaged light source comprising: a substrate and an LED chip disposed on one side of the substrate;

[0006] The LED chip includes a first blue light chip with a main wavelength of 445-447.5nm, a green light chip with a main wavelength of 514-532nm, a second blue light chip with a main wavelength of 455-457.5nm, a third blue light chip with a main wavelength of 467.5-470nm, and a fourth blue light chip with a main wavelength of 477.5-480nm, arranged in a preset order and connected in series.

[0007] On the substrate, at least two layers of phosphor adhesive are disposed on one side from the direction closest to the LED chip to the direction furthest from the LED chip. The phosphor adhesive layer closest to the LED chip is a red phosphor adhesive layer, and the phosphor adhesive layer contains diffusion particles and / or anti-precipitation particles.

[0008] Preferably, the fluorescent adhesive layer consists of two layers, wherein the fluorescent adhesive layer furthest from the LED chip is a mixed fluorescent adhesive layer, and the red fluorescent adhesive layer and the mixed fluorescent adhesive layer have the same thickness.

[0009] Preferably, the red fluorescent adhesive layer includes a first nitride red powder, the peak wavelength of the first nitride red powder is 630-680nm, and the half-width of the first nitride red powder is 70-100nm.

[0010] Preferably, the mixed fluorescent adhesive layer comprises oxynitride green powder, yellow-green powder, YAG yellow powder, and second nitride red powder, wherein the ratio of oxynitride green powder, yellow-green powder, YAG yellow powder, and second nitride red powder is (2.5%-8.8%):(59.6%-85.9%):(3.5%-14.6%):(8.2%-16.8%), and the peak wavelength of the mixed fluorescent adhesive layer is 380-780 nm.

[0011] Preferably, the yellow-green powder includes at least one of Lu-Ga co-doped yellow-green powder, Ga-YAG yellow-green powder, and LuAG yellow-green powder.

[0012] Preferably, the diffused particles are micron-sized particles, and the refractive index of the diffused particles is greater than 1.4.

[0013] Preferably, the diffused particles account for 3%-5% of the glue weight in the red fluorescent adhesive layer or the mixed fluorescent adhesive layer.

[0014] Preferably, the anti-precipitation particles comprise silicon powder, and the anti-precipitation particles are nano-sized particles.

[0015] Preferably, the anti-precipitation particles are added using a centrifugal process or a non-centrifugal process. When the anti-precipitation particles are added using the centrifugal process, the anti-precipitation particles account for 0.3% of the weight of the adhesive in the red fluorescent adhesive layer or the mixed fluorescent adhesive layer. When the anti-precipitation particles are added using a non-centrifugal process, the anti-precipitation particles account for 1.2% of the weight of the adhesive in the red fluorescent adhesive layer or the mixed fluorescent adhesive layer.

[0016] The present invention also provides a method for preparing an LED packaged light source, which is used to prepare the LED packaged light source as described above, comprising the following steps:

[0017] An LED chip is disposed on one side of the substrate. The LED chip includes a first blue light chip with a main wavelength of 445-447.5nm, a green light chip with a main wavelength of 514-532nm, a second blue light chip with a main wavelength of 455-457.5nm, a third blue light chip with a main wavelength of 467.5-470nm, and a fourth blue light chip with a main wavelength of 477.5-480nm, arranged in a preset order and connected in series.

[0018] At least two phosphor layers are disposed on the side of the substrate where the LED chip is disposed, from the direction close to the LED chip to the direction away from the LED chip, to form an LED packaged light source, wherein the phosphor layer close to the LED chip is a red phosphor layer, and the phosphor layer contains diffusion particles and / or anti-deposition particles.

[0019] Compared with the prior art, the LED packaged light source and the method for preparing the LED packaged light source provided by the present invention have the following advantages:

[0020] 1. The LED packaged light source of the present invention includes: a substrate and an LED chip disposed on one side of the substrate; the LED chip includes a first blue light chip with a main wavelength of 445-447.5nm, a green light chip with a main wavelength of 514-532nm, a second blue light chip with a main wavelength of 455-457.5nm, a third blue light chip with a main wavelength of 467.5-470nm, and a fourth blue light chip with a main wavelength of 477.5-480nm arranged in a preset order and connected in series; at least two layers of phosphor adhesive are disposed on the side of the substrate where the LED chip is disposed, from the direction close to the LED chip to the direction away from the LED chip, wherein the phosphor adhesive layer close to the LED chip is a red phosphor adhesive layer, and the phosphor adhesive layer contains diffusion particles and / or anti-deposition particles. By setting the main wavelength of multiple blue light chips to be greater than 445nm, harmful blue light around 440nm is avoided, and the energy intensity of blue light is reduced. When a red phosphor layer is set on the side of the substrate close to the LED chip, the color coverage of the light source can be improved, resulting in better color saturation. Therefore, when the LED chip is combined with at least two phosphor layers, the spectrum covers a richer range of colors, and the reproduction of the true color of the object after the light shines on it is also higher. This enables the LED light source to achieve full spectrum and high color rendering, making the white light emitted by the LED packaged light source closer to sunlight. Furthermore, when diffusion particles and / or anti-deposition particles are set in the phosphor layer, the distribution of phosphor in the phosphor layer can be more uniform, further improving the quality of the formed LED packaged light source.

[0021] 2. The fluorescent adhesive layer of this invention consists of two layers, wherein the fluorescent adhesive layer furthest from the LED chip is a mixed fluorescent adhesive layer, and the red fluorescent adhesive layer and the mixed fluorescent adhesive layer have the same thickness. By setting the thicknesses of the fluorescent adhesive layer and the mixed fluorescent adhesive layer, the luminescence of the red fluorescent adhesive layer and the mixed fluorescent adhesive layer is balanced, thereby avoiding unnatural and uneven luminous color in the LED package light source, which would affect the luminous effect.

[0022] 3. The red fluorescent adhesive layer of the present invention includes a first nitride red powder, the peak wavelength of which is 630-680nm and the half-width at half-maximum (WWHM) of which is 70-100nm. By using a first nitride red powder with a peak wavelength of 630-680nm and a WWHM of 70-100nm, it is beneficial to improve the saturation of red light when the red fluorescent adhesive layer encapsulates the LED chip, which is more conducive to improving brightness.

[0023] 4. The mixed fluorescent adhesive layer of the present invention comprises oxynitride green powder, yellow-green powder, YAG yellow powder, and second nitride red powder, wherein the proportion of oxynitride green powder, yellow-green powder, YAG yellow powder, and second nitride red powder is (2.5%-8.8%).

[0024] The peak wavelength of the mixed phosphor layer is 380-780nm, calculated as (59.6%-85.9%):(3.5%-14.6%):(8.2%-16.8%). When nitride green powder, yellow-green powder, YAG yellow powder, and second nitride red powder are mixed in the corresponding proportions (2.5%-8.8%):(59.6%-85.9%):(3.5%-14.6%):(8.2%-16.8%) to form a mixed phosphor layer, the peak wavelength of the mixed phosphor layer is 380-780nm. This mixed phosphor layer has a wide peak wavelength range, and the LED package light source formed with the LED chip and the red phosphor layer can achieve full-spectrum high color rendering. Furthermore, it restores the solar spectrum as much as possible through bridging, meeting the needs of human lighting.

[0025] 5. The yellow-green phosphor of the present invention includes at least one of Lu-Ga co-doped yellow-green phosphor, Ga-YAG yellow-green phosphor, and LuAG yellow-green phosphor. At least one of Lu-Ga co-doped yellow-green phosphor, Ga-YAG yellow-green phosphor, and LuAG yellow-green phosphor can be mixed with other colored phosphors to form a mixed phosphor layer, which, together with the LED chip and the red phosphor layer, forms an LED packaged light source, thereby improving the brightness and color rendering index of the LED packaged light source.

[0026] 6. The diffused particles of this invention are micron-sized particles. The refractive index of the diffused particles is greater than 1.4. The diffused particles account for 3%-5% of the adhesive weight in the red fluorescent adhesive layer or the mixed fluorescent adhesive layer. By setting diffused particles with a refractive index greater than 1.4 in the red fluorescent adhesive layer and the mixed fluorescent adhesive layer, and by setting the diffused particles in 3%-5% of the adhesive weight in the red fluorescent adhesive layer and the mixed fluorescent adhesive layer, the occurrence of light spots is reduced, making the light emission of the LED packaged light source more uniform.

[0027] 7. The anti-precipitation particles of this invention include silicon powder, and the anti-precipitation particles are nano-sized particles. The anti-precipitation particles are added using either a centrifugal or non-centrifugal process. When added using a centrifugal process, the anti-precipitation particles account for 0.3% of the adhesive weight in the red fluorescent adhesive layer and the mixed fluorescent adhesive layer. When added using a non-centrifugal process, the anti-precipitation particles account for 1.2% of the adhesive weight in the red fluorescent adhesive layer and the mixed fluorescent adhesive layer. By using nano-sized silicon powder as the anti-precipitation particles and simultaneously setting the proportion of anti-precipitation particles in the adhesive weight of the red fluorescent adhesive layer and the mixed fluorescent adhesive layer during the centrifugal or non-centrifugal process, the phenomenon of uneven precipitation of phosphor particles due to gravity during the encapsulation process is avoided.

[0028] 8. The present invention also provides a method for preparing an LED packaged light source, which is used to prepare the LED packaged light source as described above, and has the same beneficial effects as the LED packaged light source described above, which will not be elaborated here. [Attached Image Description]

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a top view of the LED packaged light source provided in the first embodiment of the present invention.

[0031] Figure 2 This is a front view of the LED packaged light source provided in the first embodiment of the present invention.

[0032] Figure 3 This is a front view of the cup-shaped LED packaged light source provided in the first embodiment of the present invention.

[0033] Figure 4 This is the 5000K spectrum of the LED packaged light source provided in the first embodiment of the present invention.

[0034] Figure 5 This is the 2700K spectrum of the LED packaged light source provided in the first embodiment of the present invention.

[0035] Figure 6 These are the excitation and emission spectra of Ga-YAG, LuAG, and nitride red powder provided in the first embodiment of the present invention.

[0036] Figure 7 This is a schematic flowchart of the method for preparing an LED packaged light source provided in the second embodiment of the present invention.

[0037] Explanation of reference numerals in the attached diagram:

[0038] 1. LED packaged light source;

[0039] 10. Substrate; 20. LED chip; 30. Red fluorescent adhesive layer; 40. Mixed fluorescent adhesive layer; 50. Diffusion particles; 60. Anti-precipitation particles;

[0040] 210, First blue light chip; 220, Green light chip; 230, Second blue light chip; 240, Third blue light chip; 250, Fourth blue light chip.

Detailed Implementation Methods

[0041] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0042] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0043] Please combine Figure 1 and Figure 2 The first embodiment of the present invention provides an LED packaged light source 1, including a substrate 10 and an LED chip 20 disposed on one side of the substrate 10. The LED chip 20 includes a first blue light chip 210 with a main wavelength of 445-447.5nm, a green light chip 220 with a main wavelength of 514-532nm, a second blue light chip 230 with a main wavelength of 455-457.5nm, a third blue light chip 240 with a main wavelength of 467.5-470nm, and a fourth blue light chip 250 with a main wavelength of 477.5-480nm, arranged in a preset order and connected in series. At least two phosphor layers are disposed on one side of the substrate 10 where the LED chip 20 is disposed, from the direction close to the LED chip 20 to the direction away from the LED chip 20, wherein the phosphor layer close to the LED chip is a red phosphor layer 30, and the phosphor layer contains diffusion particles 50 and / or anti-deposition particles 60.

[0044] Understandably, the substrate 10 can be flat, which facilitates the placement of LED chips 20 and makes the arrangement of LED chips 20 more orderly.

[0045] Please see Figure 3As another optional implementation, the substrate 10 can be cup-shaped, and the LED chip 20 can be disposed in the cavity formed in the cup-shaped substrate 10, which can concentrate the light and improve the brightness of the light source.

[0046] Understandably, a first blue light chip 210 with a main wavelength of 445-447.5nm, a green light chip 220 with a main wavelength of 514-532nm, a second blue light chip 230 with a main wavelength of 455-457.5nm, a third blue light chip 240 with a main wavelength of 467.5-470nm, and a fourth blue light chip with a main wavelength of 477.5-480nm can be arranged sequentially on the substrate 10 according to a preset order and connected in series. That is, multiple blue light chips can be arranged sequentially according to the minimum threshold value of the main wavelength. The green light chip 220 is placed between the first blue light chip 210 and the second blue light chip 230 so that all the green light emitted by the green light chip 220 is fused with the blue light emitted by the multiple blue light chips to prevent the loss of green light.

[0047] Understandably, the number of phosphor layers must be at least two, and among these at least two phosphor layers, the phosphor layer on the substrate closest to the LED chip is a red phosphor layer. This allows the red phosphor layer to cover all the LED chips, improving the color coverage of the light source and resulting in better color saturation for the LED packaged light source 1. Therefore, the LED chip and at least one other phosphor layer besides the red phosphor layer are isolated by the red phosphor layer 30. Thus, when the LED chip 20 emits light, the red phosphor in the red phosphor layer 30 first absorbs the energy emitted by the LED chip 20, reducing the reabsorption of phosphors from other phosphor layers. The green light chip 220 emits green light, and the blue light emitted by multiple blue light chips first excites the red phosphor layer 30 to emit red light, and then excites the mixed light emitted by other phosphor layers. While improving brightness, it also enriches the colors covered by the spectrum, improves the reproduction of the true colors of objects after the formed LED packaged light source 1 shines on them, so as to achieve full-spectrum high color rendering. The white light formed by mixing green, blue and red light and mixed light is closer to natural sunlight. Furthermore, when diffusion particles 50 and / or anti-precipitation particles 60 are set in the phosphor layer, the distribution of phosphor can be more uniform, improving the luminous efficacy of the LED packaged light source 1 and further improving the quality of the LED packaged light source 1.

[0048] Please combine Figure 4 and Figure 5 Understandably, the main wavelengths of the multiple blue light chips used in this example are all greater than 440nm, which shifts the peak value of blue light to a higher wavelength band. As a result, the intensity of the LED packaged light source 1 at a wavelength of 440nm is controlled below 0.6, which reduces the energy intensity of harmful blue light at around 440nm while avoiding harmful blue light at around 440nm.

[0049] Please see Figure 2 Furthermore, the fluorescent adhesive layer consists of two layers, with the fluorescent adhesive layer furthest from the LED chip 20 being a mixed fluorescent adhesive layer 40, and the red fluorescent adhesive layer 30 having the same thickness as the mixed fluorescent adhesive layer 40.

[0050] Understandably, the number of fluorescent adhesive layers other than the red fluorescent adhesive layer 30 is not limited. In this embodiment, preferably, the fluorescent adhesive layer consists of two layers: in addition to the red fluorescent adhesive layer 30, it also includes a mixed fluorescent adhesive layer 40 away from the LED chip. The mixed fluorescent adhesive layer 40 includes at least two different colors of phosphor. Therefore, on the side of the substrate 10 where the LED chip 20 is disposed, the fluorescent adhesive layer closer to the LED chip 20 is the red fluorescent adhesive layer 30, and the fluorescent adhesive layer away from the LED chip is the mixed fluorescent adhesive layer 40. That is, the red fluorescent adhesive layer 30 is disposed on the side of the substrate 10 where the LED chip 20 is disposed and covers the entire LED chip 20, while the mixed fluorescent adhesive layer 40 is disposed on the side of the red fluorescent adhesive layer 30 away from the LED chip 20 and completely covers the red fluorescent adhesive layer 30. Therefore, the thickness M of the mixed fluorescent adhesive layer 40 (e.g., ...) is... Figure 2 As shown in the figure, M) and the thickness N of the red fluorescent adhesive layer 30 (e.g., M) Figure 2 When N is the same, it can balance the luminescence of the red fluorescent adhesive layer 30 and the mixed fluorescent adhesive layer 40, avoiding the formation of unnatural and uneven white light emitted by the LED package light source 1.

[0051] Furthermore, the red phosphor layer 30 includes a first nitride red powder with a peak wavelength of 630-680 nm and a half-width of 70-100 nm. Specifically, the nitride red powder has a wide excitation and emission range, high luminous efficiency, and higher chemical and thermal stability. Using a nitride red powder with a peak wavelength of 630-680 nm and a half-width of 70-100 nm as the first nitride red powder can improve the saturation of red light when the red phosphor layer 30 encapsulates the LED chip 20, thus further enhancing brightness.

[0052] Furthermore, the mixed fluorescent layer 40 includes oxynitride green powder, yellow-green powder, YAG yellow powder, and second nitride red powder. When the ratio of oxynitride green powder, yellow-green powder, YAG yellow powder, and second nitride red powder is (2.5%-8.8%):(59.-85.9%):(3.%-14.6%):(8.2%-16.8%), the peak wavelength of the mixed fluorescent layer 40 is 380-780 nm.

[0053] Understandably, the mixed phosphor layer 40 includes various phosphors of different colors, specifically, it may include oxynitride green phosphor, yellow-green phosphor, YAG yellow phosphor, and second nitride red phosphor. The peak wavelength of the oxynitride green phosphor is 490-500nm and its half-width at half-maximum (WWHM) is less than 40nm; the peak wavelength of the YAG yellow phosphor is 540-560nm and its WWHM is less than 120nm; and the peak wavelength of the second nitride red phosphor is 605-625nm and its WWHM is less than 90nm. When the oxynitride green phosphor in the mixed phosphor layer 40 is combined with the first nitride red phosphor in the red phosphor layer 30, it can enrich the colors covered by the spectrum and improve the illumination of the object by the LED package light source 1. The red fluorescent adhesive layer 30 encapsulates the LED chip 20, and when the mixed fluorescent adhesive layer 40 covers the red fluorescent adhesive layer 30, the LED chip 20 emits light. The first nitride red powder in the red fluorescent adhesive layer 30 can absorb the energy emitted by the LED chip 20 and be excited to emit red light. The various different colored phosphors in the mixed fluorescent adhesive layer 40 can absorb the energy emitted by the LED chip 20 and be excited to emit mixed light. The first nitride red powder first absorbs the energy emitted by the LED chip 20, thus reducing the reabsorption of green and yellow-green phosphors in the mixed fluorescent adhesive layer 40 by the first nitride red powder, which is beneficial to the improvement of brightness.

[0054] Understandably, the proportions of oxynitride green powder, yellow-green powder, YAG yellow powder, and second nitride red powder in the mixed fluorescent adhesive layer 40 can be set according to specific circumstances. In this embodiment, preferably, after mixing the oxynitride green powder, yellow-green powder, YAG yellow powder, and second nitride red powder in the corresponding proportions of (2.5%-8.8%):(59.6%-85.9%):(3.5%-14.6%):(8.2%-16.8%), the peak wavelength of the mixed fluorescent adhesive layer 40 formed is 380-780nm. The peak wavelength range of this mixed fluorescent adhesive layer is wide, and the LED packaged light source 1 formed with the LED chip 20 and the red fluorescent adhesive layer 30 can achieve full-spectrum high color rendering and restore the solar spectrum as much as possible in a bridging manner to meet the needs of human lighting.

[0055] Please see Figure 6 Furthermore, the yellow-green powder includes at least one of Lu-Ga co-doped yellow-green powder, Ga-YAG yellow-green powder, and LuAG yellow-green powder.

[0056] Understandably, the peak wavelength of Lu-Ga co-doped yellow-green phosphor is 505-515nm, and its half-width at half-maximum (WWHM) is less than 110nm; the peak wavelength of Ga-YAG yellow-green phosphor is 515-535nm, and its WWHM is less than 110nm; and the peak wavelength of LuAG yellow-green phosphor is 515-535nm, and its WWHM is less than 120nm. At least one of Lu-Ga co-doped yellow-green phosphor, Ga-YAG yellow-green phosphor, and LuAG yellow-green phosphor can be mixed with other phosphors of different colors to form a mixed phosphor layer 40. This mixed phosphor layer 40, together with the LED chip 20 and the red phosphor layer 30, forms the LED packaged light source 1, thereby improving the brightness and color rendering index of the LED packaged light source 1.

[0057] As a first optional implementation, the yellow-green powder in this embodiment can be a single type of yellow-green powder, that is, the yellow-green powder can be a single Lu-Ga co-doped yellow-green powder, Ga-YAG yellow-green powder, or LuAG yellow-green powder.

[0058] As a second optional implementation, the yellow-green powder in this embodiment can be a mixture of two yellow-green powders. Specifically, it can be a mixture of Lu-Ga co-doped yellow-green powder and Ga-YAG yellow-green powder in a ratio of (1-2.3):1.

[0059] As a third optional implementation, the yellow-green powder in this embodiment can be a mixture of two yellow-green powders. Specifically, it can be a mixture of Lu-Ga co-doped yellow-green powder and LuAG yellow-green powder in a ratio of (0.56-1.2):1.

[0060] As a fourth optional implementation, the yellow-green powder in this embodiment can be a mixture of two yellow-green powders. Specifically, it can be a mixture of Ga-YAG yellow-green powder and LuAG yellow-green powder in a ratio of 1:(2-3.5).

[0061] As a fifth optional implementation, the yellow-green powder in this embodiment can be a mixture of three types of yellow-green powder. Specifically, it can be a mixture of yellow-green powder formed by the ratio of Lu-Ga co-doped yellow-green powder: Ga-YAG yellow-green powder: LuAG yellow-green powder equal to (1.5-2):1:(1.8-3.0).

[0062] Furthermore, the diffused particles 50 are micrometer-sized particles with a refractive index of 1.4.

[0063] Understandably, the diffused particles 50 can be micron-sized particles with a refractive index greater than 1.4 formed by SiO2, barium sulfate, TiO2, or PMMA powder. The refractive index of the diffused particles can be greater than that of silicone. When the refractive index of the diffused particles 50 is greater than 1.4, the light emitted by the LED chip 20 has a strong refractive ability, reducing the appearance of light spots and making the light emission of the LED packaged light source 1 more uniform.

[0064] Furthermore, the diffused particles 50 account for 3%-5% of the glue weight in the red fluorescent adhesive layer 30 or the mixed fluorescent adhesive layer 40.

[0065] Understandably, diffusion particles 50 can be added to the red fluorescent adhesive layer 30 and the mixed fluorescent adhesive layer 40 according to the color temperature. Preferably, in this embodiment, when the diffusion particles 50 account for 3%-5% of the glue weight in the red fluorescent adhesive layer 30 or the mixed fluorescent adhesive layer 40, the phosphor diffusion effect in the red fluorescent adhesive layer 30 and / or the mixed fluorescent adhesive layer 40 is good, and the light emission of the LED packaged light source 1 is more uniform.

[0066] Furthermore, the anti-precipitation particles 60 include silicon powder, and the anti-precipitation particles 60 are nano-sized particles.

[0067] Understandably, with a reasonable particle size distribution of silicon powder, when using nano-sized silicon powder as anti-precipitation particles 60, the precipitation of phosphor particles in the red fluorescent adhesive layer 30 and the mixed fluorescent adhesive layer 40 can be eliminated.

[0068] Furthermore, the anti-precipitation particles 60 are added using either a centrifugal or non-centrifugal process. When added using a centrifugal process, the anti-precipitation particles 60 account for 0.3% of the glue weight in the red fluorescent adhesive layer 30 and the mixed fluorescent adhesive layer 40. When added using a non-centrifugal process, the anti-precipitation particles 60 account for 1.2% of the glue weight in the red fluorescent adhesive layer 30 and the mixed fluorescent adhesive layer 40.

[0069] Understandably, the amount of anti-precipitation particles 60 added to the red fluorescent adhesive layer 30 and the mixed fluorescent adhesive layer 40 can be set according to different processes. In this embodiment, preferably, when using a centrifugal process, the amount of anti-precipitation particles 60 added can be 0.3% of the glue weight in the red fluorescent adhesive layer 30 and the mixed fluorescent adhesive layer 40; when using a non-centrifugal process, the amount of anti-precipitation particles 60 is 1.2% of the glue weight in the red fluorescent adhesive layer 30 and the mixed fluorescent adhesive layer 40. The setting of anti-precipitation particles 60 can effectively avoid the phenomenon of uneven precipitation of phosphor particles due to gravity during the encapsulation process. When used in conjunction with diffusion particles 50, it can make the distribution of phosphor particles in the red fluorescent adhesive layer 30 and the mixed fluorescent adhesive layer 40 more uniform, thereby making the light emission of the formed LED encapsulated light source 1 more uniform.

[0070] Please combine Figure 2 and Figure 7 The second embodiment of the present invention provides a method for preparing an LED packaged light source 1, the method comprising the following steps:

[0071] S1: An LED chip 20 is disposed on one side of the substrate 10. The LED chip 20 includes a first blue light chip 210 with a main wavelength of 445-447.5nm, a green light chip 220 with a main wavelength of 514-532nm, a second blue light chip 230 with a main wavelength of 455-457.5nm, a third blue light chip 240 with a main wavelength of 467.5-470nm, and a fourth blue light chip 250 with a main wavelength of 477.5-480nm, arranged in a preset order and connected in series.

[0072] S3: At least two phosphor layers are disposed on the side of the substrate 10 where the LED chip 20 is disposed, from the direction close to the LED chip 20 to the direction away from the LED chip 20, to form an LED packaged light source 1, wherein the phosphor layer close to the LED chip 20 is a red phosphor layer 30, and the phosphor layer is provided with diffusion particles 50 and / or anti-deposition particles 60.

[0073] Understandably, in this embodiment, the main wavelengths of the multiple blue light chips used are all greater than 440nm, causing the peak value of blue light to shift to a higher wavelength band. This avoids harmful blue light around 440nm while reducing the energy intensity of harmful blue light around 440nm. Furthermore, on the side of the substrate 10 where the LED chip 20 is located, at least two layers of phosphor adhesive are provided from the direction closest to the LED chip 20 to the direction furthest from the LED chip 20. The phosphor adhesive layer closest to the LED chip 20 is a red phosphor adhesive layer 30. That is, a red phosphor adhesive layer 30 is provided on the side of the substrate 10 where the LED chip is located. The red phosphor adhesive layer 30 can completely encapsulate the LED chip 20 to form a semi-encapsulated LED structure. On the side of the semi-encapsulated LED structure furthest from the LED chip 20, at least one other phosphor adhesive layer besides the red phosphor adhesive layer 30 is provided. This other phosphor adhesive layer completely covers the red phosphor adhesive layer 30. When LED packaged light source 1 is formed, the red phosphor in the red phosphor layer 30 first absorbs the energy emitted by the LED chip 20, reducing the reabsorption of phosphors in other phosphor layers. That is, the green light chip 220 emits green light, and the blue light emitted by multiple blue light chips first excites the red phosphor layer 30 to emit red light, and then excites the mixed light emitted by other phosphor layers. While improving brightness, it also makes the spectrum cover a richer range of colors, improving the reproduction of the true color of the object after the formed LED packaged light source 1 shines on it, so as to achieve full-spectrum high color rendering. The white light formed by mixing green light, blue light, red light and mixed light is closer to natural sunlight. In addition, when diffusion particles 50 and / or anti-precipitation particles 60 are set in the phosphor layer, the distribution of phosphor can be more uniform, improving the luminous efficiency of LED packaged light source 1 and further improving the quality of LED packaged light source 1.

[0074] Compared with the prior art, the LED packaged light source and the method for preparing the LED packaged light source provided by the present invention have the following advantages:

[0075] 1. The LED packaged light source of the present invention includes: a substrate and an LED chip disposed on one side of the substrate; the LED chip includes a first blue light chip with a main wavelength of 445-447.5nm, a green light chip with a main wavelength of 514-532nm, a second blue light chip with a main wavelength of 455-457.5nm, a third blue light chip with a main wavelength of 467.5-470nm, and a fourth blue light chip with a main wavelength of 477.5-480nm arranged in a preset order and connected in series; at least two layers of phosphor adhesive are disposed on the side of the substrate where the LED chip is disposed, from the direction close to the LED chip to the direction away from the LED chip, wherein the phosphor adhesive layer close to the LED chip is a red phosphor adhesive layer, and the phosphor adhesive layer contains diffusion particles and / or anti-deposition particles. By setting the main wavelength of multiple blue light chips to be greater than 445nm, harmful blue light around 440nm is avoided, and the energy intensity of blue light is reduced. When a red phosphor layer is set on the side of the substrate close to the LED chip, the color coverage of the light source can be improved, resulting in better color saturation. Therefore, when the LED chip is combined with at least two phosphor layers, the spectrum covers a richer range of colors, and the reproduction of the true color of the object after the light shines on it is also higher. This enables the LED light source to achieve full spectrum and high color rendering, making the white light emitted by the LED packaged light source closer to sunlight. Furthermore, when diffusion particles and / or anti-deposition particles are set in the phosphor layer, the distribution of phosphor in the phosphor layer can be more uniform, further improving the quality of the formed LED packaged light source.

[0076] 2. The fluorescent adhesive layer of this invention consists of two layers, wherein the fluorescent adhesive layer furthest from the LED chip is a mixed fluorescent adhesive layer, and the red fluorescent adhesive layer and the mixed fluorescent adhesive layer have the same thickness. By setting the thicknesses of the fluorescent adhesive layer and the mixed fluorescent adhesive layer, the luminescence of the red fluorescent adhesive layer and the mixed fluorescent adhesive layer is balanced, thereby avoiding unnatural and uneven luminous color in the LED package light source, which would affect the luminous effect.

[0077] 3. The red fluorescent adhesive layer of the present invention includes a first nitride red powder, the peak wavelength of which is 630-680nm and the half-width at half-maximum (WWHM) of which is 70-100nm. By using a first nitride red powder with a peak wavelength of 630-680nm and a WWHM of 70-100nm, it is beneficial to improve the saturation of red light when the red fluorescent adhesive layer encapsulates the LED chip, which is more conducive to improving brightness.

[0078] 4. The mixed fluorescent adhesive layer of the present invention comprises oxynitride green powder, yellow-green powder, YAG yellow powder, and second nitride red powder, wherein the proportion of oxynitride green powder, yellow-green powder, YAG yellow powder, and second nitride red powder is (2.5%-8.8%).

[0079] The peak wavelength of the mixed phosphor layer is 380-780nm, calculated as (59.6%-85.9%):(3.5%-14.6%):(8.2%-16.8%). When nitride green powder, yellow-green powder, YAG yellow powder, and second nitride red powder are mixed in the corresponding proportions (2.5%-8.8%):(59.6%-85.9%):(3.5%-14.6%):(8.2%-16.8%) to form a mixed phosphor layer, the peak wavelength of the mixed phosphor layer is 380-780nm. This mixed phosphor layer has a wide peak wavelength range, and the LED package light source formed with the LED chip and the red phosphor layer can achieve full-spectrum high color rendering. Furthermore, it restores the solar spectrum as much as possible through bridging, meeting the needs of human lighting.

[0080] 5. The yellow-green phosphor of the present invention includes at least one of Lu-Ga co-doped yellow-green phosphor, Ga-YAG yellow-green phosphor, and LuAG yellow-green phosphor. At least one of Lu-Ga co-doped yellow-green phosphor, Ga-YAG yellow-green phosphor, and LuAG yellow-green phosphor can be mixed with other colored phosphors to form a mixed phosphor layer, which, together with the LED chip and the red phosphor layer, forms an LED packaged light source, thereby improving the brightness and color rendering index of the LED packaged light source.

[0081] 6. The diffused particles of this invention are micron-sized particles. The refractive index of the diffused particles is greater than 1.4. The diffused particles account for 3%-5% of the adhesive weight in the red fluorescent adhesive layer or the mixed fluorescent adhesive layer. By setting diffused particles with a refractive index greater than 1.4 in the red fluorescent adhesive layer and the mixed fluorescent adhesive layer, and by setting the diffused particles in 3%-5% of the adhesive weight in the red fluorescent adhesive layer and the mixed fluorescent adhesive layer, the occurrence of light spots is reduced, making the light emission of the LED packaged light source more uniform.

[0082] 7. The anti-precipitation particles of this invention include silicon powder, and the anti-precipitation particles are nano-sized particles. The anti-precipitation particles are added using either a centrifugal or non-centrifugal process. When added using a centrifugal process, the anti-precipitation particles account for 0.3% of the adhesive weight in the red fluorescent adhesive layer and the mixed fluorescent adhesive layer. When added using a non-centrifugal process, the anti-precipitation particles account for 1.2% of the adhesive weight in the red fluorescent adhesive layer and the mixed fluorescent adhesive layer. By using nano-sized silicon powder as the anti-precipitation particles and simultaneously setting the proportion of anti-precipitation particles in the adhesive weight of the red fluorescent adhesive layer and the mixed fluorescent adhesive layer during the centrifugal or non-centrifugal process, the phenomenon of uneven precipitation of phosphor particles due to gravity during the encapsulation process is avoided.

[0083] 8. The present invention also provides a method for preparing an LED packaged light source, which is used to prepare the LED packaged light source as described above, and has the same beneficial effects as the LED packaged light source described above, which will not be elaborated here.

[0084] The foregoing has provided a detailed description of an LED packaged light source and its preparation method according to embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent substitutions, and improvements made within the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An LED packaged light source, characterized in that: The LED packaged light source includes: a substrate and an LED chip disposed on one side of the substrate; The LED chip includes a first blue light chip with a main wavelength of 445-447.5nm, a green light chip with a main wavelength of 514-532nm, a second blue light chip with a main wavelength of 455-457.5nm, a third blue light chip with a main wavelength of 467.5-470nm, and a fourth blue light chip with a main wavelength of 477.5-480nm, arranged in a preset order and connected in series. On the substrate, at least two phosphor layers are disposed on one side of the LED chip, from the direction close to the LED chip to the direction away from the LED chip. The phosphor layer close to the LED chip is a red phosphor layer, and the phosphor layer contains diffusion particles and / or anti-precipitation particles. The phosphor layer away from the LED chip is a mixed phosphor layer, and the mixed phosphor layer emits mixed light when excited.

2. The LED packaged light source as described in claim 1, characterized in that: The fluorescent adhesive layer consists of two layers, and the red fluorescent adhesive layer and the mixed fluorescent adhesive layer have the same thickness.

3. The LED packaged light source as described in claim 1, characterized in that: The red fluorescent adhesive layer includes a first nitride red powder, the peak wavelength of which is 630-680nm and the half-width of which is 70-100nm.

4. The LED packaged light source as described in claim 2, characterized in that: The mixed fluorescent adhesive layer comprises oxynitride green powder, yellow-green powder, YAG yellow powder, and second nitride red powder, wherein the ratio of oxynitride green powder, yellow-green powder, YAG yellow powder, and second nitride red powder is (2.5%-8.8%):(59.6%-85.9%):(3.5%-14.6%):(8.2%-16.8%), and the peak wavelength of the mixed fluorescent adhesive layer is 380-780nm.

5. The LED packaged light source as described in claim 4, characterized in that: The yellow-green powder includes at least one of Lu-Ga co-doped yellow-green powder, Ga-YAG yellow-green powder, and LuAG yellow-green powder.

6. The LED packaged light source as described in claim 2, characterized in that: The diffused particles are micron-sized particles with a refractive index greater than 1.

4.

7. The LED packaged light source as described in claim 6, characterized in that: The diffused particles account for 3%-5% of the glue weight in the red fluorescent adhesive layer or the mixed fluorescent adhesive layer.

8. The LED packaged light source as described in claim 2, characterized in that: The anti-precipitation particles include silicon powder, and the anti-precipitation particles are nano-sized particles.

9. The LED packaged light source as described in claim 8, characterized in that: The anti-precipitation particles are added using a centrifugal process or a non-centrifugal process. When the anti-precipitation particles are added using the centrifugal process, the anti-precipitation particles account for 0.3% of the glue weight in the red fluorescent adhesive layer or the mixed fluorescent adhesive layer. When the anti-precipitation particles are added using a non-centrifugal process, the anti-precipitation particles account for 1.2% of the glue weight in the red fluorescent adhesive layer or the mixed fluorescent adhesive layer.

10. A method for preparing an LED packaged light source, used to prepare the LED packaged light source as described in claim 1, characterized in that: Includes the following steps: An LED chip is disposed on one side of the substrate. The LED chip includes a first blue light chip with a main wavelength of 445-447.5nm, a green light chip with a main wavelength of 514-532nm, a second blue light chip with a main wavelength of 455-457.5nm, a third blue light chip with a main wavelength of 467.5-470nm, and a fourth blue light chip with a main wavelength of 477.5-480nm, arranged in a preset order and connected in series. At least two phosphor layers are disposed on the side of the substrate where the LED chip is disposed, from the direction close to the LED chip to the direction away from the LED chip, to form an LED packaged light source, wherein the phosphor layer close to the LED chip is a red phosphor layer, and the phosphor layer contains diffusion particles and / or anti-deposition particles. The phosphor layer furthest from the LED chip is a mixed phosphor layer, which emits mixed light when excited.

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