Display panel, preparation method thereof and display device

Abstract

The embodiment of the present application discloses a display panel, a preparation method thereof and a display device. The preparation method of the display panel comprises the following steps: providing a transfer substrate and transferring a plurality of light emitting diodes on the transfer substrate to obtain a transfer substrate; providing a driving substrate and preparing a driving circuit on the driving substrate to obtain a driving substrate; and aligning and bonding the transfer substrate and the driving substrate to obtain a diode display panel. By using the above technical scheme, a plurality of light emitting diodes are transferred on the transfer substrate to obtain a transfer substrate comprising the plurality of light emitting diodes, and then the transfer substrate and the driving substrate are aligned and bonded at one time to obtain a large-size diode display panel. The preparation method of the display panel provided by the present application can obtain a large-size diode display panel through one-time alignment and bonding, which is different from the technical scheme of obtaining a diode display panel through batch alignment and bonding in the prior art, reduces the number of alignment and bonding, and ensures that the preparation process of the diode display panel is simple.

Description

[0001] This application is a divisional application filed on June 29, 2020, with application number 202010611465.6, entitled "A display panel and its preparation method, display device". Technical Field

[0002] This invention relates to the field of display technology, and more particularly to a display panel, its manufacturing method, and a display device. Background Technology

[0003] Micro-LED (micro light-emitting diode) is a new display technology. Compared with existing OLED (organic light-emitting diode) displays, it has higher brightness, better luminous efficiency, and smaller size, making it possible to achieve transparent displays.

[0004] For large-area transparent displays, current mature Micro-LED transfer equipment can only support the transfer of substrates up to 8 inches in size. Therefore, it is impossible to directly form a large-area transparent substrate in one go, such as to achieve a large-area transparent display directly on a car window. Summary of the Invention

[0005] In view of this, embodiments of the present invention provide a display panel and its manufacturing method and display device, which achieve large-area transparent display through a single alignment and bonding.

[0006] In a first aspect, embodiments of the present invention provide a method for manufacturing a display panel, comprising:

[0007] A transfer substrate is provided, and multiple light-emitting diodes are transferred on the transfer substrate to obtain a transfer substrate;

[0008] A driving substrate is provided, and a driving circuit is fabricated on the driving substrate to obtain a driving substrate;

[0009] Align and bond the transfer substrate and the driving substrate to obtain the diode display panel.

[0010] In a second aspect, embodiments of the present invention also provide a display panel, which is prepared by the display panel preparation method of the first aspect. The display panel includes a transfer substrate and a driving substrate, and the transfer substrate and the driving substrate are aligned and connected.

[0011] The transfer substrate includes a transfer substrate and multiple light-emitting diodes transferred to the transfer substrate;

[0012] The driving substrate includes a driving substrate and a driving circuit disposed on the side of the driving substrate facing the transfer substrate.

[0013] Thirdly, embodiments of the present invention also provide a display device, including the display panel of the second aspect.

[0014] The display panel fabrication method provided in this invention involves transferring multiple light-emitting diodes (LEDs) onto a transfer substrate to obtain a transfer substrate containing multiple LEDs. Then, the transfer substrate and the driving substrate are aligned and bonded in one step to obtain a large-size diode display panel. In this way, a large-size diode display panel can be obtained through a single alignment and bonding process. This differs from the prior art, which requires multiple alignment and bonding processes to obtain a diode display panel. The display panel fabrication method provided in this invention can reduce the number of alignment and bonding processes, ensuring a simple diode display panel fabrication process. Attached Figure Description

[0015] Other features, objects, and advantages of the invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0016] Figure 1 This is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present invention;

[0017] Figure 2 This is a schematic flowchart of a method for manufacturing a display panel according to another embodiment of the present invention;

[0018] Figure 3 Is with Figure 2 A top view of a display panel corresponding to the fabrication method shown;

[0019] Figure 4 yes Figure 3 A schematic diagram of the driving substrate and its driving circuit in the display panel shown.

[0020] Figure 5 yes Figure 4 The diagram shows a cross-sectional view of the driving substrate taken along AA'.

[0021] Figure 6 yes Figure 4 The diagram shows a cross-sectional view of the driving substrate taken along BB'.

[0022] Figure 7 yes Figure 4 The diagram shows a cross-sectional view of the driving substrate taken along DD'.

[0023] Figure 8 It is a transfer substrate and Figure 4 A schematic diagram of the structure of the driving substrate after alignment and bonding;

[0024] Figure 9 yes Figure 3 A schematic diagram of the driving circuit in the display panel shown.

[0025] Figure 10 This is a schematic flowchart of a method for manufacturing a display panel according to another embodiment of the present invention;

[0026] Figure 11 yes Figure 3 Another schematic diagram of the driving circuit in the display panel shown;

[0027] Figure 12 This is a schematic flowchart of a method for manufacturing a display panel according to another embodiment of the present invention;

[0028] Figure 13 yes Figure 11 The schematic layout of the driving circuit shown is shown.

[0029] Figure 14 yes Figure 13 The circuit layout shown is a schematic diagram of the cross-sectional structure of the driving substrate taken along EE'.

[0030] Figure 15 It is an array substrate and Figure 14 The diagram shows the structure of the drive substrate after alignment.

[0031] Figure 16 This is a schematic flowchart of a method for manufacturing a display panel according to another embodiment of the present invention;

[0032] Figures 17-19 Is with Figure 16 The fabrication process flow diagram of the transfer substrate corresponding to the fabrication method shown;

[0033] Figure 20 yes Figure 19 A schematic diagram of the structure after the transfer substrate and the driving substrate are bonded together;

[0034] Figure 21 This is a schematic flowchart of a method for manufacturing a display panel according to another embodiment of the present invention;

[0035] Figures 22-23 Is with Figure 21 The fabrication process flow diagram of the transfer substrate corresponding to the fabrication method shown;

[0036] Figure 24 This is a schematic flowchart of a method for manufacturing a display panel according to another embodiment of the present invention;

[0037] Figure 25 Is with Figure 24 A top view of a display panel corresponding to the fabrication method shown;

[0038] Figure 26 yes Figure 25 The diagram shows the structure of the transfer substrate in the display panel.

[0039] Figure 27 yes Figure 25 The diagram shows a cross-sectional view of the display panel taken along FF'.

[0040] Figure 28 yes Figure 25 The diagram shows a cross-sectional view of the display panel taken along HH'.

[0041] Figure 29 yes Figure 25 The diagram shows a cross-sectional view of the display panel taken along II'.

[0042] Figure 30 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention;

[0043] Figure 31 This is a schematic diagram of the structure of a display device provided in another embodiment of the present invention. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be fully described below with reference to the accompanying drawings in the embodiments of this invention, through specific implementation methods. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort fall within the protection scope of this invention.

[0045] Figure 1 This is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present invention. See also: Figure 1 The preparation method includes the following steps:

[0046] S110. Provide a transfer substrate and transfer multiple light-emitting diodes on the transfer substrate to obtain a transfer substrate.

[0047] For example, the transfer substrate can be a transparent substrate, and a transfer substrate is obtained by transferring multiple light-emitting diodes on the transfer substrate. It should be noted that the embodiments of the present invention do not limit how multiple light-emitting diodes are transferred on the transfer substrate; they can be transferred in multiple batches or simultaneously in one go.

[0048] Furthermore, the light-emitting diode can be a micro-LED with a size of approximately 50 μm or a mini-LED with a size of approximately 100 μm. Both micro-LEDs and mini-LEDs are much smaller than traditional LEDs and can be used to achieve transparent displays. Those skilled in the art can choose according to their needs, and the embodiments of the present invention do not limit this choice.

[0049] S120. Provide a driving substrate and fabricate a driving circuit on the driving substrate to obtain a driving substrate.

[0050] For example, the driving substrate can be a transparent substrate. The driving circuit mainly includes a driving element and traces connecting the driving element and the light-emitting diode electrode, so as to provide control signals to the light-emitting diode using the traces to control its light emission. Depending on the driving method of the light-emitting diode, an active driving circuit or a passive driving circuit can be designed accordingly. Those skilled in the art can design it themselves, and the embodiments of the present invention do not limit it.

[0051] S130, alignment and bonding transfer substrate and driving substrate, to obtain diode display panel.

[0052] The alignment and bonding of the transfer substrate and the driving substrate mainly refers to the alignment and bonding of the electrodes of each light-emitting diode in the transfer substrate with the lines in the driving circuit that provide control signals to them. Since the transfer substrate contains multiple light-emitting diodes, corresponding to the multiple light-emitting diodes required for a large-area transparent display, and the driving substrate contains the corresponding driving circuit, compared to the existing batch-by-batch bonding fabrication method, the fabrication method provided in this invention requires only one alignment and bonding to obtain a large-size diode display panel, making the fabrication process simpler and more efficient.

[0053] The display panel fabrication method provided in this invention involves transferring multiple light-emitting diodes (LEDs) onto a transfer substrate to obtain a transfer substrate containing multiple LEDs. Then, the transfer substrate and the driving substrate are aligned and bonded in one step to obtain a large-size diode display panel. In this way, a large-size diode display panel can be obtained through a single alignment and bonding process. This differs from the prior art, which requires multiple alignment and bonding processes to obtain a diode display panel. The display panel fabrication method provided in this invention can reduce the number of alignment and bonding processes, ensuring a simple diode display panel fabrication process.

[0054] Based on the above embodiments, the display panel fabrication method provided by the present invention can fabricate connection electrodes electrically connected to light-emitting diodes and connection electrode traces electrically connected to the connection electrodes on the driving substrate; it can also fabricate connection electrodes electrically connected to light-emitting diodes on the transfer substrate and connection electrode traces electrically connected to the connection electrodes on the driving substrate; at the same time, the driving method of the light-emitting diodes in the display panel fabrication method provided by the present invention can be passive driving or active driving. The following will describe in detail the different configurations of the connection electrodes and the different driving methods of the light-emitting diodes.

[0055] First, the fabrication method of fabricating a passively driven light-emitting diode (LED) is explained, which involves separately fabricating a connection electrode electrically connected to the LED and a connection electrode trace electrically connected to the connection electrode on the driving substrate.

[0056] Based on the above embodiments, Figure 2 This is a schematic flowchart illustrating a method for fabricating a display panel according to another embodiment of the present invention. The method for fabricating the driving substrate is further refined, showing a method for fabricating a passive driving circuit on the driving substrate. See also... Figure 2 The method includes the following steps:

[0057] S210. Provide a transfer substrate and transfer multiple light-emitting diodes on the transfer substrate to obtain a transfer substrate.

[0058] S220 provides a driving substrate.

[0059] S230. A first connecting electrode and a second connecting electrode are fabricated in a first region of the driving substrate, and a first connecting electrode trace, a first connecting electrode trace and a bonding terminal are fabricated in a second region of the driving substrate; the first connecting electrode trace is electrically connected to the first connecting electrode and the bonding terminal respectively, and the first connecting electrode trace is electrically connected to the second connecting electrode and the bonding terminal respectively.

[0060] For example, Figure 3 Is with Figure 2 The schematic diagram shown is a top view of a display panel corresponding to the fabrication method described, illustrating the relative positional relationship between the transfer substrate 100 and the driving substrate 200. Figure 4 yes Figure 3 The schematic diagram of the driving substrate and its driving circuit in the display panel shown illustrates the structure of the passive driving circuit and the electrical connection between the light-emitting diode 101 and the driving circuit. (See also...) Figure 3 and Figure 4The transfer substrate 100 includes a plurality of light-emitting diodes 101. Each light-emitting diode 101 includes a light-emitting structure 1011 and a first electrode 1012 and a second electrode 1013 disposed on one side of the light-emitting structure 1011. The driving substrate 201 includes a first region Q1 and a second region Q2. The vertical projection of the transfer substrate 100 onto the plane of the driving substrate 201 at least partially overlaps with the first region Q1. The first region Q1 of the driving substrate 201 is provided with a first connecting electrode 202 and a second connecting electrode 203. The second region Q2 of the driving substrate 201 is provided with a first connecting electrode trace 204, a second connecting electrode trace 205, and a bonding terminal 206. The bonding terminal 206 is disposed on the side of the second region Q2 away from the first region Q1. The first connecting electrode trace 204 is electrically connected to the first connecting electrode 202 and the bonding terminal 206, respectively. The second connecting electrode trace 205 is electrically connected to the second connecting electrode 203 and the bonding terminal 206, respectively.

[0061] It should be noted that the embodiments of the present invention are described only with the binding terminal 206 disposed on the side of the second region Q2 away from the first region Q1 as an example. However, this arrangement is not limiting; for example, see [link to relevant documentation]. Figure 4 The binding terminal can also be set on the upper or lower side of the second area, which can be set by those skilled in the art according to their needs.

[0062] In this circuit, the first electrode 1012 can be the anode of the LED 101, and the second electrode 1013 can be the cathode of the LED 101. In the passive driving circuit of the LED 101, its light emission is controlled by providing control signals to both the anode and cathode of the LED 101. The bonding terminal 206 is the output terminal of the control signal. For example, the bonding terminal 206 can be bonded to a driver chip or to a flexible circuit board. Bonding the driver chip to the flexible circuit board allows for a narrow bezel design. Those skilled in the art can design the bonding terminal 206 themselves; this embodiment of the invention does not limit this design. Figure 4 As shown, the first electrode 1012 is electrically connected to the first connecting electrode 202, and the second electrode 1013 is electrically connected to the second connecting electrode 203. The bonding terminal 206 transmits control signals to the first electrode 1012 through the first connecting electrode 202 and the first connecting electrode trace 204. The bonding terminal 206 also transmits control signals to the second electrode 1013 through the second connecting electrode 203 and the second connecting electrode trace 205 to control its light emission.

[0063] For ease of description, the driving substrate 201 is divided into a first region Q1 and a second region Q2. The first region Q1 corresponds to the display area, and the connection electrodes in the first region Q1 are electrically connected to the bonding terminals in the second region Q2 via traces within the second region Q2. It should be noted that the length of the traces within the second region Q2 can be set according to actual conditions. Specifically, taking the display panel 10 located within the interlayer of a car window glass as an example, if the first region Q1 is located at the center of the car window glass, the traces in the second region Q2 are longer, allowing the lines to extend to the edge of the car window and electrically connect to the bonding terminals 206 located on the edge of the car window. Conversely, if the first region Q1 is located at the edge of the car window glass, the second region Q2 can be a bonding area with shorter lead lengths, as long as there are leads within this bonding area corresponding to the connection electrodes in the first region Q1. The following explanation will use the example of the first region Q1 being located at the center of the car window and the second region Q2 having longer traces; similarities will not be repeated.

[0064] from Figure 4 As can be seen, the first connecting electrode 202 and the second connecting electrode 203 can intersect each other. Therefore, when fabricating the driving circuit, the first connecting electrode 202 and the second connecting electrode 203 need to be disposed in different film layers to achieve mutual independence of electrical signals. For example, Figure 5 yes Figure 4 The diagram shows a cross-sectional view of the driving substrate taken along AA'. Figure 6 yes Figure 4 The diagram shows a cross-sectional view of the driving substrate taken along BB'. Figure 7 yes Figure 4 The schematic diagram shows a cross-sectional view of the driving substrate taken along DD', illustrating the structure of the driving substrate 200 within the first region Q1 from different perspectives. (See also...) Figures 5-7 The surface of the driving substrate 201 is sequentially provided with a first connecting electrode 202, an insulating layer 207, and a second connecting electrode 203 from bottom to top. By forming a through hole in the insulating layer 207 and filling the through hole with a conductive electrode 2021, the first connecting electrode 202 located in the lower layer can be extended to the film layer where the second connecting electrode 203 is located, preparing for the subsequent electrical connection between the first electrode 1012 of the light-emitting diode 101 and the first connecting electrode 202. For example, the conductive electrode 2021 can be fabricated in the same mask process as the second connecting electrode 203.

[0065] Different fabrication methods can be used to obtain the connecting electrodes in the first region Q1 and the connecting electrode traces in the second region Q2. The following describes several feasible implementation methods as examples.

[0066] Optionally, a first connection electrode 202 can be fabricated in a first region Q1 of the driving substrate 201, and a first connection electrode trace 204 can be fabricated in a second region Q2 of the driving substrate 201. Then, a second connection electrode 203 can be fabricated in the first region Q1 of the driving substrate 201, and a second connection electrode trace 205 can be fabricated in the second region Q2 of the driving substrate 201. In other words, the first connection electrode 202 and the first connection electrode trace 204 can be fabricated under the same mask process, and then the second connection electrode 203 and the second connection electrode trace 205 can be fabricated under the same mask process. Of course, before fabricating the second connection electrode 203 and the second connection electrode trace 205, an insulating layer 207 needs to be fabricated first, which will not be elaborated here.

[0067] In addition, the first connecting electrode trace 204 and the second connecting electrode trace 205 can also be fabricated simultaneously with the first connecting electrode 202 under the same mask process. Electrical connection between the second connecting electrode 203 and the second connecting electrode trace 205 is achieved by providing a through-hole in the insulating layer 207 to expose the second connecting electrode trace 205. Alternatively, the first connecting electrode trace 204 and the second connecting electrode trace 205 can also be fabricated simultaneously with the second connecting electrode 203 under the same mask process. Electrical connection between the first connecting electrode 202 and the first connecting electrode trace 204 is achieved by providing a through-hole in the insulating layer 207 to expose the first connecting electrode 202. Those skilled in the art can choose any of the above methods to fabricate a passive driving circuit on the driving substrate 201; this embodiment of the invention does not limit this. In subsequent designs, the corresponding electrically connected connecting electrodes (or signal lines) and traces in the first region Q1 and the second region Q2 can also be fabricated using any of the above three methods, which will not be elaborated further below.

[0068] S240. By aligning the first electrode with the first connecting electrode and the second electrode with the second connecting electrode, the transfer substrate and the driving substrate are bonded to obtain a diode display panel.

[0069] Figure 8 It is a transfer substrate and Figure 4 The schematic diagram shown illustrates the alignment relationship between the electrodes of the light-emitting diode in the transfer substrate and the connecting electrodes in the driving substrate. (See attached diagram.) Figure 8 The second electrode 1013 is aligned with the second connecting electrode 203. The first connecting electrode 202 extends to the film layer where the second connecting electrode 203 is located through the conductive electrode 2021. In this way, the first electrode 1012 can be aligned with the first connecting electrode 202 by aligning with the conductive electrode 2021. After alignment, the transfer substrate and the driving substrate can be bonded at one time to obtain the diode display panel.

[0070] In summary, the above embodiments have provided a detailed description of how to fabricate connection electrodes electrically connected to the light-emitting diode (LED) and connection electrode traces electrically connected to the connection electrodes on a driving substrate, while simultaneously fabricating a passively driven LED. Next, a method for fabricating actively driven LEDs will be described, whereby connection electrodes electrically connected to the LED and connection electrode traces electrically connected to the connection electrodes are fabricated on a driving substrate.

[0071] First, let's take the active drive circuit as an example, which is "1T" (one drive transistor). Figure 9 yes Figure 3 The diagram shows a schematic of the driving circuit in the display panel, illustrating an active driving circuit structure using only one LED 101 as an example. (See also...) Figure 3 Similar to the previous embodiment, in this embodiment, the light-emitting diode includes a light-emitting structure 1011 and a first electrode 1012 and a second electrode 1013 disposed on one side of the light-emitting structure 1011; the driving substrate 201 includes a first region Q1 and a second region Q2, and the vertical projection of the transfer substrate 100 on the plane of the driving substrate 201 at least partially overlaps with the first region Q1. Specifically, Figure 10 This is a schematic flowchart of a method for manufacturing a display panel according to another embodiment of the present invention, as shown below. Figure 10 As shown, if a material such as is to be fabricated on the driving substrate 201... Figure 9 The driving circuit shown, and the specific method for manufacturing the display panel may include the following steps:

[0072] S310. Provide a transfer substrate and transfer multiple light-emitting diodes on the transfer substrate to obtain a transfer substrate.

[0073] S320 provides a driving substrate.

[0074] S330. Multiple first scan lines, multiple first data lines, multiple first transistors, and multiple second connection electrodes are fabricated in a first region of the driving substrate. The control terminal of the first transistor is electrically connected to the corresponding first scan line, and the input terminal of the first transistor is electrically connected to the corresponding first data line.

[0075] S340. In the second region of the driving substrate, a plurality of first scan connection lines, a plurality of first data connection lines, a plurality of second connection electrode lines and bonding terminals are fabricated; the first scan connection lines are electrically connected to the first scan lines and bonding terminals respectively, the first data connection lines are electrically connected to the first data lines and bonding terminals respectively, and the second connection electrode lines are electrically connected to the second connection electrodes and bonding terminals respectively.

[0076] See Figure 9 The first scan line and the first scan connection trace are as follows: Figure 9As shown in G1, the routing of the first data line and the first data connection is as follows: Figure 9 As shown in S1, the routing of the second connecting electrode is as follows: Figure 9 As shown in Vss.

[0077] S350. By aligning the first electrode with the output terminal of the first transistor and the second electrode with the second connecting electrode, the bonding transfer substrate and the driving substrate are aligned to obtain a diode display panel.

[0078] By aligning the first electrode (anode) with the output terminal of the first transistor and aligning the second electrode (cathode) with the second connecting electrode, a one-time bonding transfer substrate and a driving substrate can be achieved to obtain a diode display panel.

[0079] Next, we will use a "2T1C" active drive circuit (two drive transistors and one capacitor) as an example for explanation. In diode display panels, the active drive circuit often adopts a 2T1C design. See [link / reference] Figure 11 , Figure 11 yes Figure 3 The diagram shown illustrates another principle of the driving circuit in the display panel, demonstrating another active driving circuit for the light-emitting diode. Figure 9 The fabrication method of the driving circuit shown can be implemented with reference to the fabrication method of this embodiment. Here, only the fabrication of the 2T1C type active driving circuit is described as an example. For the same embodiments as above, see [link to embodiment]. Figure 3 In this embodiment, the light-emitting diode 101 includes a light-emitting structure 1011 and a first electrode 1012 and a second electrode 1013 disposed on one side of the light-emitting structure 1011; the driving substrate 201 includes a first region Q1 and a second region Q2, and the vertical projection of the transfer substrate 100 on the plane of the driving substrate 201 at least partially overlaps with the first region Q1. Specifically, Figure 12 This is a schematic flowchart of a method for manufacturing a display panel according to another embodiment of the present invention, as shown below. Figure 12 As shown, if a material such as... is to be fabricated on the driving substrate... Figure 11 Given the driving circuit shown, the specific steps for manufacturing the display panel may include the following:

[0080] S410. Provide a transfer substrate and transfer multiple light-emitting diodes on the transfer substrate to obtain a transfer substrate.

[0081] S420 provides a driving substrate.

[0082] S430. In the first region of the driving substrate, multiple second scan lines, multiple second data lines, multiple voltage signal lines, multiple second transistors, multiple third transistors, multiple storage capacitors, and multiple second connection electrodes are fabricated. The control terminal of the second transistor is electrically connected to its corresponding second scan line, the input terminal of the second transistor is electrically connected to its corresponding second data line, the output terminal of the second transistor is electrically connected to the control terminal of the third transistor and the first plate of the storage capacitor, and the input terminal of the third transistor is electrically connected to its corresponding voltage signal line.

[0083] Specifically, Figure 13 yes Figure 11 The schematic layout of the driving circuit shown is as follows. Figure 14 yes Figure 13 The circuit layout shown is a cross-sectional view of the driving substrate taken along EE', as shown in the diagram. Figure 11 , Figure 13 and Figure 14 As shown, the control terminal 221 (gate) of the second transistor T2 is electrically connected to its corresponding second scan line G2; the input terminal 222 of the second transistor T2 is electrically connected to its corresponding second data line S2; the output terminal 223 of the second transistor T2 is electrically connected to the control terminal 231 of the third transistor T3 and the first plate 241 of the storage capacitor C; and the input terminal 232 of the third transistor T3 is electrically connected to its corresponding voltage signal line PVDD. Figure 11 It can be seen that the output terminal of the third transistor T3 is electrically connected to the anode (first electrode 1012) of the light-emitting diode 101, and the cathode (second electrode 1013) of the light-emitting diode 101 is electrically connected to the PVEE signal line. Therefore, Figure 13 The circuit layout shown also includes pads 208 and 209, see [reference]. Figure 13 and Figure 14 Pad 208 is electrically connected to the output terminal 233 of the third transistor T3, and pad 209 is electrically connected to the second connecting electrode 203.

[0084] S440. In the second region of the driving substrate, a plurality of second scan connection lines, a plurality of second data connection lines, a plurality of voltage connection lines, a plurality of second connection electrode lines, and bonding terminals are fabricated; the second scan connection lines are electrically connected to the second scan lines and bonding terminals respectively, the second data connection lines are electrically connected to the second data lines and bonding terminals respectively, the voltage connection lines are electrically connected to the voltage signal lines and bonding terminals respectively, and the second connection electrode lines are electrically connected to the second connection electrodes and bonding terminals respectively.

[0085] Among them, the second connecting electrode trace is Figure 11 and Figure 13The PVEE signal line shown is electrically connected to the second connection electrode 203 to transmit control signals to the second electrode 1013. The fabrication methods of the second scan connection line, the second data connection line, the voltage connection line, and the second connection electrode line can refer to any of the three methods provided by the passive drive circuit described above, and will not be repeated here.

[0086] S450. By aligning the first electrode with the output terminal of the third transistor and the second electrode with the second connecting electrode, the bonding transfer substrate and the driving substrate are aligned to obtain a diode display panel.

[0087] Figure 15 It is an array substrate and Figure 14 The schematic diagram of the drive substrate after alignment is shown below. Figure 15 The first electrode 1012 is aligned with the output terminal of the third transistor T3 via the pad 208, and the second electrode 1013 is aligned with the second connecting electrode 203 via the pad 209. After alignment, the bonding and transfer substrate and the driving substrate can be achieved in one step to obtain the diode display panel.

[0088] In summary, the above embodiments provide a detailed description of how to fabricate connection electrodes electrically connected to the light-emitting diodes and connection electrode traces electrically connected to the connection electrodes on the driving substrate, while simultaneously fabricating an actively driven light-emitting diode.

[0089] It should be noted that those skilled in the art can prepare the driving substrate according to their needs, referring to any of the embodiments of the passive driving circuit and the active driving circuit described above, and the embodiments of the present invention do not limit this. Based on any of the embodiments describing the preparation method of the driving substrate described above, two methods for preparing the transfer substrate are provided below, and the preparation of the driving substrate will not be described again.

[0090] First, we will introduce the preparation method of the first type of transfer substrate. Figure 16 This is a schematic flowchart of a method for fabricating a display panel according to another embodiment of the present invention, which further refines the fabrication of the transfer substrate. See also... Figure 16 The manufacturing method of the display panel may include the following steps:

[0091] S510 provides a transfer substrate.

[0092] Figures 17-19 Is with Figure 16 The flowchart illustrates the fabrication process of the transfer substrate corresponding to the fabrication method shown. (See also...) Figure 17 A transfer substrate 102 is provided. For example, the transfer substrate 102 is a transparent substrate, and its size can be set according to the required display size.

[0093] S520. Multiple first through-holes are fabricated in the transfer substrate.

[0094] See Figure 18 The transfer substrate 102 has a plurality of first through holes 1021. The number of first through holes 1021 can be set according to the display resolution. If the resolution is X*Y (RGB), the number of first through holes is 2X*3Y. Specifically, the first through holes 1021 are disposed in the transfer substrate 102 at positions corresponding to the first electrode 1012 and the second electrode 1023 of the light-emitting diode 101.

[0095] S530, Deposit electrode terminals in the first through hole, the electrode terminals including a first electrode terminal and a second electrode terminal.

[0096] See Figure 19 A first electrode terminal 103 and a second electrode terminal 105 are deposited within the first through-hole 1021. For example, a masking process can be used to deposit metal, such as copper, within the first through-hole 1021 to form the first electrode terminal 103 and the second electrode terminal 105.

[0097] S540. Multiple light-emitting diodes are transferred by aligning the first electrode with the first electrode terminal and the second electrode with the second electrode terminal to obtain a transfer substrate.

[0098] Continue to participate Figure 19 For example, the light-emitting diodes can be transferred in batches or in one go, so that the first electrode 1012 is aligned with the first electrode terminal 103 and the second electrode 1013 is aligned with the second electrode terminal 105 to form a transfer substrate.

[0099] S550: Provide a driving substrate and fabricate a driving circuit on the driving substrate to obtain a driving substrate.

[0100] The fabrication of the driving substrate can be carried out with reference to any of the above embodiments of the passive driving circuit and the active driving circuit, and will not be described again here.

[0101] S560, alignment bonding transfer substrate and driving substrate, to obtain diode display panel.

[0102] Figure 20 yes Figure 19 The schematic diagram shown illustrates the structure after the transfer substrate and the driving substrate are bonded. The explanation uses a passive driving circuit as an example. (See also...) Figure 20 The alignment and bonding of the transfer substrate 100 and the driving substrate 200 can specifically be achieved by aligning and bonding the first electrode terminal 103 with the first connecting electrode 202, and aligning and bonding the second electrode terminal 105 with the second connecting electrode 203.

[0103] Furthermore, to achieve a good transparent display effect, optionally, both the first connecting electrode 202 and the second connecting electrode 203 are transparent electrodes. For example, the material of the transparent electrodes can be ITO (indium tin oxide). The material of the electrode terminals can be copper, which is different from the material of the transparent electrodes. To make the bonding between the first connecting electrode 202 and the first electrode terminal 103, and between the second connecting electrode 203 and the second electrode terminal 105, a bonding metal 211 can be prepared on the surface of the first connecting electrode 202 and the second connecting electrode 203 away from the driving substrate 201 before aligning and bonding the transfer substrate 100 and the driving substrate 200 to obtain the diode display panel (see...). Figure 20 Then, by aligning the first electrode terminal 103 and the second electrode terminal 105 with the bonding metal 211, the transfer substrate 100 and the driving substrate 200 are bonded to obtain a diode display panel. For example, the bonding metal 211 can be prepared using an electroplating copper process.

[0104] Similarly, the scan lines, data lines, voltage signal lines, second connection electrodes, and second connection electrode traces in the active drive circuit can also be made of transparent materials. Furthermore, bonding metals can be used to strengthen the electrical connections between the bonded structures; this will not be elaborated further.

[0105] The second method for preparing the transfer substrate is described below. Figure 21 This is a schematic flowchart of a method for fabricating a display panel according to another embodiment of the present invention. The transfer substrate is fabricated using a different method than in the above embodiments. See [link to relevant documentation]. Figure 21 The manufacturing method of the display panel may include the following steps:

[0106] S610. Provide a transfer substrate and prepare an adhesive layer on the transfer substrate.

[0107] Figures 22-23 Is with Figure 21 The flowchart illustrates the fabrication process of the transfer substrate corresponding to the fabrication method shown. (See also...) Figure 22 An adhesive layer 104 is provided on the transfer substrate 102.

[0108] S620. Multiple light-emitting diodes are transferred on a substrate with the light-emitting structure facing the adhesive layer to obtain a transfer substrate.

[0109] See Figure 23 The light-emitting structure 1011 is attached to the adhesive layer 104. In this embodiment, the light-emitting diode 101 is attached to the transfer substrate 102 in a flip-chip manner, so that the first electrode 1012 and the second electrode 1013 can be directly exposed, and the process is simpler.

[0110] S630. Provide a driving substrate and fabricate a driving circuit on the driving substrate to obtain a driving substrate.

[0111] S640, alignment bonding transfer substrate and driving substrate, to obtain diode display panel.

[0112] The alignment method can be referred to Figure 8 In addition, you can refer to Figure 20 A bonding metal 211 is prepared on the side surface of the first connecting electrode 202 and the second connecting electrode 203 away from the driving substrate 201. Then, the transfer substrate 100 and the driving substrate 200 are bonded by aligning the first electrode 1012 and the second electrode 1013 with the bonding metal 211 respectively, to obtain a diode display panel.

[0113] Optionally, after aligning and bonding the transfer substrate 100 and the driving substrate 200 to obtain the diode display panel (S640), the transfer substrate 102 can be peeled off. This reduces the thickness of the display panel 10 and increases its transmittance.

[0114] It should be noted that those skilled in the art can choose whether or not to retain the transfer substrate 102 as needed, and the embodiments of the present invention do not limit this. The beneficial effect of retaining the transfer substrate 102 is that it facilitates a better adhesion effect of the display panel through the transfer substrate. For example, when the display panel 10 is placed between two layers of glass in a car window, by attaching the transfer substrate 102 to the glass, it can be ensured that the display panel 10 is adhered more firmly.

[0115] In summary, the above embodiments, using passive and active driving circuits as examples, have provided detailed explanations of how to fabricate connection electrodes electrically connected to the light-emitting diodes (LEDs) and connection electrode traces electrically connected to the connection electrodes on the driving substrate. Next, a detailed explanation will be provided of how to fabricate connection electrodes electrically connected to the LEDs on the transfer substrate and how to fabricate connection electrode traces electrically connected to the connection electrodes on the driving substrate.

[0116] Before introducing the solution of this embodiment, it should be noted that, for ease of distinction, different reference numerals are used for the substrate, connecting electrodes, wiring and bonding terminals in this embodiment and the display panel embodiment corresponding to the preparation method of this embodiment.

[0117] Figure 24 This is a schematic flowchart illustrating a method for manufacturing a display panel according to another embodiment of the present invention. See also... Figure 24 The specific steps in the manufacturing process of the display panel may include the following:

[0118] S710 provides a transfer substrate.

[0119] S720. A first connecting electrode and a second connecting electrode are fabricated on one side of the transfer substrate.

[0120] S730. Multiple light-emitting diodes are transferred by aligning the first electrode with the first connecting electrode and the second electrode with the second connecting electrode to obtain a transfer substrate.

[0121] Figure 25 Is with Figure 24 The diagram shows a top view of a display panel corresponding to the fabrication method shown. Figure 26 yes Figure 25 The diagram shows the structure of the transfer substrate in the display panel. (See also...) Figure 26 A first connecting electrode 302 and a second connecting electrode 303 are stacked on one side of the transfer substrate 301. An insulating layer 308 is disposed between the first connecting electrode 302 and the second connecting electrode 303. The first electrode 1012 of the light-emitting diode is aligned with the first connecting electrode 301 through the conductive electrode 3021, and the second electrode 1013 is aligned with the second connecting electrode 303.

[0122] Optionally, after fabricating the first connecting electrode 302 and the second connecting electrode 303 on the transfer substrate 301, it can be referred to Figure 20 First, bonding metals are prepared on the surfaces of the first connecting electrode 302 and the second connecting electrode 303. The first electrode 1012 and the second electrode 1013 are aligned with the bonding metals respectively to achieve alignment between the first electrode 1012 and the first connecting electrode 302 and between the second electrode 1013 and the second connecting electrode 303, so that the electrical connection between the first electrode 1012 and the first connecting electrode 302 and between the second electrode 1013 and the second connecting electrode 303 is more secure.

[0123] S740, Prepare the first connecting electrode trace and the second connecting electrode trace and bonding terminal in the second region.

[0124] See Figure 25 The second region Q2 of the driving substrate 401 is provided with a first connecting electrode trace 402, a second connecting electrode trace 403, and a bonding terminal 404. The first connecting electrode trace 402 and the second connecting electrode trace 403 can be fabricated using the same mask process.

[0125] S750, Multiple second through-holes are fabricated in the transfer substrate.

[0126] See Figure 25The transfer substrate 100 and the second region Q2 of the driving substrate 200 have an overlapping region Q3, and the second through-hole can be disposed in this overlapping region. The number of the second through-hole can be set according to the display resolution. If the resolution is X*Y (RGB), the number of the second through-hole is X+3Y. Specifically, the location of the second through-hole corresponds to the location of the first electrode terminal 305 and the second electrode terminal 306. This solution can greatly reduce the number of through-holes on the transfer substrate.

[0127] S760. Deposit a connection electrode terminal in the second through hole. The connection electrode terminal includes a first connection electrode terminal and a second connection electrode terminal. The first connection electrode terminal is electrically connected to the first connection electrode, and the second connection electrode terminal is electrically connected to the second connection electrode.

[0128] See Figure 25 The first connecting electrode terminal 305 is electrically connected to the first connecting electrode 302, and the second connecting electrode terminal 306 is electrically connected to the second connecting electrode 303. For example, to simplify the process, the second through-hole can be formed after the first connecting electrode 302 and the second connecting electrode 303 are fabricated. Thus, the bonding metal on the surface of the connecting electrodes, as well as the first connecting electrode terminal 305 and the second connecting electrode terminal 306, can be obtained under the same masking process.

[0129] For example, Figure 27 yes Figure 25 The diagram shows a cross-sectional view of the display panel taken along FF'. Figure 28 yes Figure 25 The diagram shows a cross-sectional view of the display panel taken along HH'. Figure 29 yes Figure 25 The diagram shows a cross-sectional view of the display panel taken along line II', illustrating the panel's structure from different perspectives. (See also...) Figures 27-29 The first connecting electrode 302 and the second connecting electrode 303 are located on different film layers, and the electrical signals are isolated between them by the insulating layer 308. The first connecting electrode terminal 305 and the second connecting electrode terminal 306 are both disposed on the same layer as the first connecting electrode 302. The first connecting electrode 302 is electrically connected to the first connecting electrode trace 402 through the first connecting electrode terminal 305, and the second connecting electrode 303 is electrically connected to the second connecting electrode trace 403 through the second connecting electrode terminal 306. Thus, the technical solution of this embodiment only requires aligning the connecting electrode terminals on the transfer substrate 100 with the corresponding connecting electrode traces to achieve one-time bonding of the transfer substrate 100 and the driving substrate 200, as detailed in S770.

[0130] S770: By aligning the first connecting electrode terminal with the first connecting electrode trace and aligning the second connecting electrode terminal with the second connecting electrode trace, the transfer substrate and the driving substrate are bonded to obtain a diode display panel.

[0131] Optionally, the above embodiments illustrate the fabrication methods for connecting electrodes in the transfer substrate and connecting electrode traces in the driving substrate, using a passively driven LED. The following briefly describes how to fabricate scan lines, data lines, and connecting electrodes in the transfer substrate, and how to fabricate scan signal connecting traces, data signal connecting traces, and connecting electrode traces in the driving substrate when the LED is actively driven.

[0132] First, the preparation method corresponding to the active driving mode of the "1T" structure will be explained.

[0133] For example, a light-emitting diode includes a light-emitting structure and a first electrode and a second electrode disposed on one side of the light-emitting structure;

[0134] The driving substrate includes a first region and a second region, and the vertical projection of the transfer substrate onto the plane of the driving substrate at least partially overlaps with the first region;

[0135] A transfer substrate is provided, and multiple light-emitting diodes are transferred on the transfer substrate to obtain a transfer substrate, comprising:

[0136] Provide transfer substrate;

[0137] Multiple first scan lines, multiple first data lines, multiple first transistors, and multiple second connection electrodes are fabricated on one side of the transfer substrate. The control terminal of the first transistor is electrically connected to the corresponding first scan line, and the input terminal of the first transistor is electrically connected to the corresponding first data line.

[0138] By aligning the first electrode with the output terminal of the first transistor and the second electrode with the second connecting electrode, multiple light-emitting diodes are transferred to obtain a transfer substrate.

[0139] Providing a driving substrate and fabricating a driving circuit on the driving substrate to obtain a driving substrate, comprising:

[0140] Provide driving substrate;

[0141] Multiple first scan connection lines, multiple first data connection lines, multiple second connection electrode lines, and bonding terminals are fabricated in the second region of the driving substrate. The bonding terminals are located on the side of the second region away from the first region, and a driving chip is bonded to the bonding terminals. The bonding terminals are electrically connected to the first scan connection lines, the first data connection lines, and the second connection electrode lines, respectively.

[0142] By aligning and bonding the transfer substrate and the driving substrate, a diode display panel is obtained, comprising:

[0143] Multiple third through-holes are fabricated in the transfer substrate;

[0144] A first connection structure is deposited in a third through-hole. The connection structure includes a first sub-connection structure, a second sub-connection structure, and a third sub-connection structure. The first sub-connection structure is electrically connected to a first scan line, the second connection structure is electrically connected to a first data line, and the third connection structure is electrically connected to a second connection electrode.

[0145] By aligning the first sub-connection structure with the first scan connection trace, the second sub-connection structure with the first data connection trace, and the third sub-connection structure with the second connection electrode trace, the transfer substrate and the driving substrate are bonded to obtain a diode display panel.

[0146] The preparation method corresponding to the active driving mode of the "2T1C" structure will be explained next.

[0147] A light-emitting diode includes a light-emitting structure and a first electrode and a second electrode disposed on one side of the light-emitting structure;

[0148] The driving substrate includes a first region and a second region, and the vertical projection of the transfer substrate onto the plane of the driving substrate at least partially overlaps with the first region;

[0149] A transfer substrate is provided, and multiple light-emitting diodes are transferred on the transfer substrate to obtain a transfer substrate, comprising:

[0150] Provide transfer substrate;

[0151] Multiple second scan lines, multiple second data lines, multiple voltage signal lines, multiple second transistors, multiple third transistors, multiple storage capacitors, and multiple second connection electrodes are fabricated on one side of the transfer substrate. The control terminal of the second transistor is electrically connected to its corresponding second scan line, the input terminal of the second transistor is electrically connected to its corresponding second data line, the output terminal of the second transistor is electrically connected to the control terminal of the third transistor and the first plate of the storage capacitor, and the input terminal of the third transistor is electrically connected to its corresponding voltage signal line.

[0152] By aligning the first electrode with the output terminal of the third transistor and the second plate of the storage capacitor, and by aligning the second connecting electrode with the second electrode, multiple light-emitting diodes are transported to obtain a transport substrate.

[0153] Providing a driving substrate and fabricating a driving circuit on the driving substrate to obtain a driving substrate, comprising:

[0154] Provide driving substrate;

[0155] Multiple second scan connection lines, multiple second data connection lines, multiple voltage connection lines, multiple second connection electrode lines, and bonding terminals are fabricated in the second region of the driving substrate. The bonding terminals are located on the side of the second region away from the first region, and a driving chip is bonded to the bonding terminals. The bonding terminals are electrically connected to the second scan connection lines, the second data connection lines, the voltage connection lines, and the second connection electrode lines, respectively.

[0156] By aligning and bonding the transfer substrate and the driving substrate, a diode display panel is obtained, comprising:

[0157] Multiple fourth through-holes are fabricated in the transfer substrate;

[0158] A second connection structure is deposited in the fourth through-hole. The second connection structure includes a fourth sub-connection structure, a fifth sub-connection structure, a sixth sub-connection structure and a seventh sub-connection structure. The fourth sub-connection structure is electrically connected to the second scan line, the fifth sub-connection structure is electrically connected to the second data line, the sixth sub-connection structure is electrically connected to the voltage signal line, and the seventh sub-connection structure is electrically connected to the second connection electrode.

[0159] By aligning the fourth sub-connection structure with the second scan connection trace, the fifth sub-connection structure with the second data connection trace, the sixth sub-connection structure with the voltage connection trace, and the seventh sub-connection structure with the second connection electrode trace, the transfer substrate and the driving substrate are bonded to obtain a diode display panel.

[0160] It should be noted that the fabrication method of the active driving type driving circuit located in the transfer substrate is basically the same as that of the active driving type driving circuit located in the driving substrate. The only difference is whether it is fabricated on the transfer substrate or the driving substrate, and the connection traces corresponding to the second region need to be connected by a drilling process. The specific fabrication process will not be described in detail here. You can refer to the aforementioned fabrication method of fabricating the active driving type driving circuit in the driving substrate.

[0161] Based on the same inventive concept, this embodiment of the invention also provides a display panel, which can be prepared by any of the above-described preparation methods. Therefore, the display panel provided by this embodiment of the invention has the technical effects of the technical solutions in any of the above-described embodiments. The explanations of the same or corresponding structures and terms as those in the above-described preparation method embodiments will not be repeated here.

[0162] See Figure 3 and Figure 4The display panel includes a transfer substrate 100 and a driving substrate 200, which are aligned and connected. The transfer substrate 100 includes a transfer substrate 102 and a plurality of light-emitting diodes 101 transferred to the transfer substrate 102. The driving substrate 200 includes a driving substrate 201 and a driving circuit disposed on the side of the driving substrate 201 facing the transfer substrate 100. The display panel provided in this embodiment of the invention obtains a large-size diode display panel by aligning and bonding the transfer substrate and the driving substrate in one step, thereby achieving transparent display of a large-size display panel.

[0163] Optionally, in the display panel provided in the embodiments of the present invention, the connecting electrodes and connecting electrode traces can both be located on the driving substrate, or the connecting electrodes can be located in the transfer substrate and the connecting electrode traces can be located in the driving substrate; furthermore, the driving method of the light-emitting diode can be passive driving or active driving, and the different structures of the display panel are described below.

[0164] First, we will take the example of a passive driving method where both the connecting electrode and the connecting electrode trace are located on the driving substrate.

[0165] See Figures 4-8 The light-emitting diode 101 includes a light-emitting structure 1011 and a first electrode 1012 and a second electrode 1013 disposed on one side of the light-emitting structure 1011; the driving substrate 201 includes a first region Q1 and a second region Q2, and the vertical projection of the transfer substrate 100 on the plane of the driving substrate 201 at least partially overlaps with the first region Q1; the driving substrate 200 also includes a first connecting electrode 202 and a second connecting electrode 203 stacked on the first region Q1 of the driving substrate 201, and a first connecting electrode trace 204, a second connecting electrode trace 205 and a bonding terminal 206 disposed on the second region Q2 of the driving substrate 201; the first connecting electrode trace 204 is electrically connected to the first connecting electrode 202 and the bonding terminal 206 respectively, and the second connecting electrode trace 205 is electrically connected to the second connecting electrode 203 and the bonding terminal 206 respectively; the first electrode 1012 is aligned and connected to the first connecting electrode 202, and the second electrode 1013 is aligned and connected to the second connecting electrode 203.

[0166] Furthermore, the first connecting electrode 202 and the first connecting electrode trace 204 are disposed on the same layer; the second connecting electrode 203 and the second connecting electrode trace 205 are disposed on the same layer; or, the first connecting electrode 202, the first connecting electrode trace 204, and the second connecting electrode trace 205 are disposed on the same layer; or, the second connecting electrode 203, the first connecting electrode trace 204, and the second connecting electrode trace 205 are disposed on the same layer. In this way, the connecting electrodes and connecting electrode traces are all located on the driving substrate, and some connecting electrodes and some connecting electrode traces can be disposed on the same layer and formed by masking in the same process, ensuring a simple driving substrate structure and a simple fabrication process.

[0167] The following explanation will take the case where both the connecting electrodes and the connecting electrode traces are located on the driving substrate, and the LED is driven by active driving as an example.

[0168] Reference Figure 9 The driving circuit shown optionally includes a light-emitting diode 101 comprising a light-emitting structure 1011 and a first electrode 1012 and a second electrode 1013 disposed on one side of the light-emitting structure 1011; a driving substrate 201 comprising a first region Q1 and a second region Q2, wherein the vertical projection of the transfer substrate 100 on the plane of the driving substrate 201 at least partially overlaps with the first region Q1; the first region Q1 of the driving substrate 201 is provided with multiple first scan lines G1, multiple first data lines S1, multiple first transistors T1, and multiple second connection electrodes 203, wherein the control terminal of the first transistor T1 is electrically connected to the corresponding first scan line G1. The input terminal of the first transistor T1 is electrically connected to the corresponding first data line S1; the second region Q2 of the driving substrate 201 is provided with multiple first scan connection lines, multiple first data connection lines, multiple second connection electrode lines and bonding terminals; the first scan connection lines are electrically connected to the first scan line and the bonding terminal respectively, the first data connection lines are electrically connected to the first data line and the bonding terminal respectively, and the second connection electrode lines are electrically connected to the second connection electrode and the bonding terminal 206 respectively; the first electrode 1012 is aligned and connected to the output terminal of the first transistor T1, and the second electrode 1013 is aligned and connected to the second connection electrode 203.

[0169] See Figure 3 and Figures 13-15Optionally, the light-emitting diode 101 includes a light-emitting structure 1011 and a first electrode 1012 and a second electrode 1013 disposed on one side of the light-emitting structure 1011; the driving substrate 201 includes a first region Q1 and a second region Q2, and the vertical projection of the transfer substrate 100 on the plane of the driving substrate 201 at least partially overlaps with the first region Q1; the first region Q1 of the driving substrate 201 is provided with multiple second scan lines G2, multiple second data lines S2, multiple voltage signal lines PVDD, multiple second transistors T2, multiple third transistors T3, multiple storage capacitors C, and multiple second connection electrodes 203; the control terminal 211 of the second transistor T2 is electrically connected to the corresponding second scan line G2, the input terminal 222 of the second transistor T2 is electrically connected to the corresponding second data line S2, and the output terminal 223 of the second transistor T2 is connected to the third transistor T3. The control terminal 231 and the first plate 241 of the storage capacitor C are electrically connected. The input terminal 232 of the third transistor T3 and its corresponding voltage signal line PVDD are electrically connected. The second region Q2 of the driving substrate 201 is provided with multiple second scan connection lines, multiple second data connection lines, multiple voltage connection lines, multiple second connection electrode lines and bonding terminals. The second scan connection lines are electrically connected to the second scan line G2 and the bonding terminal, the second data connection lines are electrically connected to the second data line S2 and the bonding terminal, the voltage connection lines are electrically connected to the voltage signal line PVDD and the bonding terminal, and the second connection electrode lines (PVEE signal lines) are electrically connected to the second connection electrode 203 and the bonding terminal. The first electrode 1012 is aligned with the output terminal 233 of the third transistor T3, and the second electrode 1013 is aligned with the second connection electrode 203.

[0170] The above embodiments illustrate the specific structure of the display panel using two feasible active driving methods: a "1T" active driving structure and a "2T1C" active driving structure. The LEDs in the display panel provided by this invention can be driven passively or actively, offering diverse driving methods suitable for different driving situations.

[0171] Based on the above embodiments, the specific structure of the transfer substrate will be described below in two feasible cases.

[0172] See Figures 18-19 Optionally, the transfer substrate 100 further includes a plurality of first through holes 1021 located in the transfer substrate 102 and electrode terminals located in the first through holes 1021. The electrode terminals include a first electrode terminal 103 and a second electrode terminal 105. The first electrode 1012 is aligned with the first electrode terminal 103, and the second electrode 1013 is aligned with the second electrode terminal 105.

[0173] See Figures 22-23The transfer substrate 100 also includes an adhesive layer 104 located on one side surface of the transfer substrate 102, and the light-emitting diode 101 is bonded to one side of the transfer substrate 102 with the light-emitting structure 1011 facing the adhesive layer 104.

[0174] In the display panel provided in the embodiments of the present invention, the transfer substrate may include different structures, and the present invention does not limit the specific structure of the transfer substrate.

[0175] The following explanation will take the example of the connecting electrode being located on the transfer substrate and the connecting electrode trace being located on the drive substrate.

[0176] See Figure 25 Optionally, the light-emitting diode 101 includes a light-emitting structure 1011 and a first electrode 1012 and a second electrode 1013 disposed on one side of the light-emitting structure 1011; the driving substrate 401 includes a first region Q1 and a second region Q2, and the vertical projection of the transfer substrate 100 on the plane of the driving substrate 401 at least partially overlaps with the first region Q1; the transfer substrate 100 includes a transfer substrate 301 and a first connecting electrode 302 and a second connecting electrode 303 stacked on one side of the transfer substrate 301; the first electrode 1012 is aligned and connected to the first connecting electrode 302, and the second electrode 1013 is aligned and connected to the second connecting electrode 303; the driving substrate 200 includes the driving substrate 401 and a first connecting electrode 1012 disposed on the driving substrate 301. The second region Q2 of 401 includes a first connecting electrode trace 402, a second connecting electrode trace 403, and a bonding terminal 404, with a driver chip bonded in the bonding terminal 404; the transfer substrate 100 also includes a plurality of second through holes located in the transfer substrate 301 and connecting electrode terminals located in the second through holes; the connecting electrode terminals include a first connecting electrode terminal 305 and a second connecting electrode terminal 306, the first connecting electrode terminal 305 being electrically connected to the first connecting electrode 302, and the second connecting electrode terminal 306 being electrically connected to the second connecting electrode 303; the first connecting electrode terminal 305 is aligned and connected to the first connecting electrode trace 402, and the second connecting electrode terminal 306 is aligned and connected to the second connecting electrode 403.

[0177] The above embodiments illustrate the specific structure of the display panel when the connecting electrodes are located on the transfer substrate, using a passive driving method as an example. The structure of the display panel when the light-emitting diodes are actively driven is briefly described below.

[0178] First, the structure corresponding to the active drive mode of the "1T" structure will be explained.

[0179] For example, a light-emitting diode includes a light-emitting structure and a first electrode and a second electrode disposed on one side of the light-emitting structure;

[0180] The driving substrate includes a first region and a second region, and the vertical projection of the transfer substrate onto the plane of the driving substrate at least partially overlaps with the first region;

[0181] The transfer substrate includes a transfer substrate and multiple first scan lines, multiple first data lines, multiple first transistors and multiple second connection electrodes disposed on one side of the transfer substrate. The control terminal of the first transistor is electrically connected to the corresponding first scan line, and the input terminal of the first transistor is electrically connected to the corresponding first data line.

[0182] The first electrode is aligned and connected to the output terminal of the first transistor, and the second electrode is aligned and connected to the second connecting electrode.

[0183] The driving circuit includes multiple first scan connection lines, multiple first data connection lines, multiple second connection electrode lines, and bonding terminals located in the second region of the driving substrate. The bonding terminals are located on the side of the second region away from the first region, and a driving chip is bonded to the bonding terminals. The bonding terminals are electrically connected to the first scan connection lines, the first data connection lines, and the second connection electrode lines, respectively.

[0184] The transfer substrate has multiple third through-holes; a first connection structure is formed in the third through-holes, the connection structure includes a first sub-connection structure, a second sub-connection structure and a third sub-connection structure, the first sub-connection structure is electrically connected to the first scan line, the second connection structure is electrically connected to the first data line, and the third connection structure is electrically connected to the second connection electrode;

[0185] The first sub-connection structure is aligned and connected to the first scan connection trace, the second sub-connection structure is aligned and connected to the first data connection trace, and the third sub-connection structure is aligned and connected to the second connection electrode trace.

[0186] The structure corresponding to the active drive mode of the "2T1C" structure will be explained next.

[0187] A light-emitting diode includes a light-emitting structure and a first electrode and a second electrode disposed on one side of the light-emitting structure;

[0188] The driving substrate includes a first region and a second region, and the vertical projection of the transfer substrate onto the plane of the driving substrate at least partially overlaps with the first region;

[0189] The transfer substrate includes a transfer substrate and multiple second scan lines, multiple second data lines, multiple voltage signal lines, multiple second transistors, multiple third transistors, multiple storage capacitors, and multiple second connection electrodes disposed on one side of the transfer substrate. The control terminal of the second transistor is electrically connected to its corresponding second scan line, the input terminal of the second transistor is electrically connected to its corresponding second data line, the output terminal of the second transistor is electrically connected to the control terminal of the third transistor and the first plate of the storage capacitor, and the input terminal of the third transistor is electrically connected to its corresponding voltage signal line.

[0190] The first electrode is aligned and connected to the output terminal of the third transistor and the second plate of the storage capacitor, and the second connecting electrode is aligned and connected to the second electrode.

[0191] The driving circuit includes multiple second scan connection lines, multiple second data connection lines, multiple voltage connection lines, multiple second connection electrode lines, and bonding terminals located in the second region of the driving substrate. The bonding terminals are located on the side of the second region away from the first region, and a driving chip is bonded to the bonding terminals. The bonding terminals are electrically connected to the second scan connection lines, the second data connection lines, the voltage connection lines, and the second connection electrode lines, respectively.

[0192] The transfer substrate has multiple fourth through-holes; a second connection structure is provided in the fourth through-holes, the second connection structure includes a fourth sub-connection structure, a fifth sub-connection structure, a sixth sub-connection structure and a seventh sub-connection structure, the fourth sub-connection structure is electrically connected to the second scan line, the fifth sub-connection structure is electrically connected to the second data line, the sixth connection structure is electrically connected to the voltage signal line, and the seventh sub-connection structure is electrically connected to the second connection electrode.

[0193] The fourth sub-connection structure is aligned and connected to the second scan connection trace; the fifth sub-connection structure is aligned and connected to the second data connection trace; the sixth sub-connection structure is aligned and connected to the voltage connection trace; and the seventh sub-connection structure is aligned and connected to the second connection electrode trace.

[0194] It should be noted that the structure of the active drive type drive circuit located in the transfer substrate is basically the same as the structure of the active drive type drive circuit located in the drive substrate. The only difference is whether it is set in the transfer substrate or the drive substrate, and the specific connection relationship between the connection traces and the connection electrodes corresponding to the second region. The specific structure will not be described in detail here. You can refer to the structure of the active drive type drive circuit set in the drive substrate mentioned above.

[0195] Optionally, both the first connecting electrode 202 and the second connecting electrode 203 are transparent electrodes; both the first connecting electrode trace 204 and the second connecting electrode trace 205 are transparent traces, so as to achieve a good transparent display effect.

[0196] See Figure 20 Optionally, the driving substrate 200 also includes a bonding metal 211 located on the side surface of the first connecting electrode 202 and the second connecting electrode 203 away from the driving substrate 201. The first electrode 1012 and the second electrode 1013 are respectively aligned and connected to the bonding metal 211 to make the electrical connection between the first electrode and the first connecting electrode and between the second electrode and the second connecting electrode more secure.

[0197] Based on the same inventive concept, embodiments of the present invention also provide a display device, exemplarily, Figure 30 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention. See also: Figure 30 The display device 20 includes the display panel 10 of any embodiment of the present invention. Therefore, the display device provided by the embodiments of the present invention has the technical effects of the technical solutions in any of the above embodiments. Explanations of structures and terms that are the same as or corresponding to those in the above embodiments will not be repeated here. The display device provided by the embodiments of the present invention can be... Figure 20 The vehicle display shown can also be any electronic product with a large-area transparent display function, and the embodiments of the present invention do not limit it.

[0198] See also Figure 30 The display device 20 also includes a first transparent substrate 500 and a second lens substrate 600, with a transfer substrate 100 and a driving substrate 200 disposed between the first transparent substrate 500 and the second transparent substrate 600.

[0199] For example, the first transparent substrate 500 and the second transparent substrate 600 can be two glass substrates of a vehicle window. By placing the aligned and bonded transfer substrate 100 and driving substrate 200 between the first transparent substrate 500 and the second transparent substrate 600, a transparent display can be achieved on the vehicle window.

[0200] Figure 31 This is a schematic diagram of the structure of a display device provided in another embodiment of the present invention. See also: Figure 31 The display device 20 also includes a transparent encapsulant 700 disposed between the first transparent substrate 500 and the second transparent substrate 600. The transparent encapsulant is used to fill the gaps between the transfer substrate 100 and the driving substrate 200 and the first transparent substrate 500 and / or the second transparent substrate 600.

[0201] In this embodiment, by providing transparent encapsulant 700, the stability of the transfer substrate 100 and the driving substrate 200 is improved, and the loosening of the transfer substrate 100 and the driving substrate 200 due to the presence of pores is avoided.

[0202] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein. Features of various embodiments of the present invention can be partially or wholly coupled or combined with each other, and can cooperate and be technically driven in various ways. Various obvious changes, readjustments, combinations, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Many other equivalent embodiments may be included without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that, include: A first substrate, and a driving electrode disposed on one side of the first substrate; A second substrate is disposed opposite to the first substrate. The second substrate is provided with a plurality of through holes and a plurality of electrode terminals are filled in the plurality of through holes. The plurality of electrode terminals include a first electrode terminal and a second electrode terminal. A light-emitting diode disposed on one side of the second substrate, the light-emitting diode including a light-emitting structure and a first electrode and a second electrode disposed on one side of the light-emitting structure; The first electrode is electrically connected to the first electrode terminal, and the second electrode is electrically connected to the second electrode terminal; The first electrode terminal and the second electrode terminal overlap with the light-emitting diode, and the light-emitting diode overlaps with the through hole.

2. The display panel according to claim 1, characterized in that, The first substrate includes a first region and a second region. A first connection electrode and a second connection electrode are disposed in the first region. A first connection electrode trace, a second connection electrode trace, and a bonding terminal are disposed in the second region. The first connection electrode trace is electrically connected to the first connection electrode and the bonding terminal, respectively. The second connection electrode trace is electrically connected to the second connection electrode and the bonding terminal, respectively. The first electrode is electrically connected to the first connection electrode, and the second electrode is electrically connected to the second connection electrode.

3. The display panel according to claim 2, characterized in that, The first connecting electrode and the first connecting electrode trace are disposed on the same layer; the second connecting electrode and the second connecting electrode trace are disposed on the same layer. Alternatively, the first connecting electrode, the first connecting electrode trace, and the second connecting electrode trace are disposed on the same layer; Alternatively, the second connecting electrode, the first connecting electrode trace, and the second connecting electrode trace can be disposed on the same layer.

4. The display panel according to claim 1, characterized in that, The first substrate includes a first region and a second region; Multiple first scan lines, multiple first data lines, multiple first transistors, and multiple second connection electrodes are provided in the first region. The control terminal of the first transistor is electrically connected to the first scan line corresponding to it, and the input terminal of the first transistor is electrically connected to the first data line corresponding to it. Multiple first scan connection lines, multiple first data connection lines, multiple second connection electrode lines, and bonding terminals are provided in the second region; the first scan connection lines are electrically connected to the first scan line and the bonding terminal respectively, the first data connection lines are electrically connected to the first data line and the bonding terminal respectively, and the second connection electrode lines are electrically connected to the second connection electrode and the bonding terminal respectively. The first electrode is connected to the output terminal of the first transistor, and the second electrode is connected to the second connecting electrode.

5. The display panel according to claim 1, characterized in that, The first substrate includes a first region and a second region; Multiple second scan lines, multiple second data lines, multiple voltage signal lines, multiple second transistors, multiple third transistors, multiple storage capacitors, and multiple second connection electrodes are provided in the first region. The control terminal of the second transistor is electrically connected to the corresponding second scan line, the input terminal of the second transistor is electrically connected to the corresponding second data line, the output terminal of the second transistor is electrically connected to the control terminal of the third transistor and the first plate of the storage capacitor, and the input terminal of the third transistor is electrically connected to the corresponding voltage signal line. Multiple second scan connection lines, multiple second data connection lines, multiple voltage connection lines, multiple second connection electrode lines, and bonding terminals are provided in the second area; the second scan connection lines are electrically connected to the second scan lines and the bonding terminals respectively, the second data connection lines are electrically connected to the second data lines and the bonding terminals respectively, the voltage connection lines are electrically connected to the voltage signal lines and the bonding terminals respectively, and the second connection electrode lines are electrically connected to the second connection electrodes and the bonding terminals respectively. The first electrode is aligned with the output terminal of the third transistor, and the second electrode is aligned with the second connecting electrode.

6. The display panel according to claim 2, characterized in that, Both the first connecting electrode and the second connecting electrode are transparent electrodes.

7. The display panel according to claim 6, characterized in that, Both the first connecting electrode trace and the second connecting electrode trace are transparent traces.

8. The display panel according to claim 7, characterized in that, The first substrate further includes a bonding metal located on the side surface of the first connecting electrode and the second connecting electrode away from the first substrate, and the first electrode and the second electrode are respectively aligned and connected to the bonding metal.

9. The display panel according to claim 2, characterized in that, The first connecting electrode is connected to the first electrode terminal, the second connecting electrode is connected to the second electrode terminal, and the first connecting electrode and the second connecting electrode overlap with the corresponding through hole.

10. The display panel according to claim 9, characterized in that, The first substrate and the second substrate have an overlapping area, and the through hole is located in the overlapping area.

11. The display panel according to claim 1, characterized in that, It also includes a driver chip, which is disposed in the region of the first substrate that extends beyond the second substrate.

12. A display device, characterized in that, Includes the display panel as described in any one of claims 1-11.

13. The display device according to claim 12, characterized in that, The display device further includes a first transparent substrate and a second transparent substrate; The first substrate and the second substrate are disposed between the first transparent substrate and the second transparent substrate.

14. The display device according to claim 13, characterized in that, The display device further includes a transparent encapsulant disposed between the first transparent substrate and the second transparent substrate, the transparent encapsulant being used to fill the gaps between the transfer substrate and the driving substrate and the first transparent substrate and / or the second transparent substrate.

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