一种叠层电路板补强和故障修复的装置和使用方法
By using a thin-film flexible structure device with conductive properties in the multilayer circuit board, connecting the motherboard circuits and reserving buffer space, the problem of easy breakage of the multilayer circuit board connection is solved, the connection strength and maintenance efficiency are improved, and the maintenance cost is reduced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- EFFICIENCY STACK (WUHAN) TECH CO LTD
- Filing Date
- 2022-05-18
- Publication Date
- 2026-07-17
AI Technical Summary
The connection points of existing multilayer circuit boards are prone to breakage due to structural defects and external impacts. The repair process is time-consuming and laborious, and the structural strength is poor, which leads to the connection falling off and breaking again.
The device body, which employs a thin-film flexible structure with conductive properties, includes a frame, a first connector, and a second connector. It utilizes an FPC flexible circuit board to connect to the main board circuitry, reserves buffer space to enhance connection strength, and connects to the main board circuitry via soldering or a connector.
It improves the connection strength and service life of the multilayer circuit board, reduces maintenance workload and costs, reduces secondary damage to the motherboard, and ensures that the motherboard can work normally under external impact.
Smart Images
Figure CN115911911B_ABST