声波器件及其制造方法
By setting bumps on the piezoelectric layer and adjusting their position and distance according to the circuit connection method, the energy loss problem caused by transverse shear waves in acoustic devices was solved, the global quality factor Q value was improved, and the device performance was enhanced.
CN115913162BActive Publication Date: 2026-07-17WUHAN YANXI MICRO COMPONENTS CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- WUHAN YANXI MICRO COMPONENTS CO LTD
- Filing Date
- 2022-11-23
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
There is room for improvement in the performance of existing acoustic wave devices in communication equipment, especially due to energy loss and Q-value degradation caused by transverse shear waves.
Method used
Multiple bumps are set on the piezoelectric layer, and the bumps are at a preset distance from the second electrode layer. The position and distance of the bumps are adjusted according to the connection method of the resonator circuit in the acoustic device to suppress the propagation of transverse shear waves and improve the global quality factor Q value.
Benefits of technology
By suppressing transverse shear waves and reducing energy loss, the global quality factor Q of acoustic devices is significantly improved, thereby enhancing device performance.
✦ Generated by Eureka AI based on patent content.
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Figure CN115913162B_ABST
Abstract
本申请提供声波器件及其制造方法，其中，声波器件包括多个体声波谐振结构，每个体声波谐振结构，包括：衬底；依次层叠于所述衬底上的反射结构、第一电极层、压电层和第二电极层；多个凸块，均位于所述压电层上且围绕所述第二电极层周向布置；所述凸块与所述第二电极层具有预设距离，所述预设距离取决于所述体声波谐振结构与其它体声波谐振结构的连接方式。
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