一种埋阻电路板及加工方法
By creating buried resistor grooves on the substrate and embedding resistors, and performing surface polishing before lamination, the problems of low buried resistor accuracy and low yield rate are solved, achieving high-precision buried resistor control and improved circuit board reliability.
CN115915595BActive Publication Date: 2026-07-17SHENNAN CIRCUITS
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENNAN CIRCUITS
- Filing Date
- 2021-08-26
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
Existing buried resistor circuit boards have low buried resistor precision and low yield, making it difficult to achieve high-frequency and high-speed applications.
Method used
Embedded resistor grooves are made on the substrate, and resistors are embedded in the grooves. Precision is ensured by laser technology, and the surface is polished before lamination to ensure flatness.
Benefits of technology
High-precision buried resistance control was achieved, which improved the reliability and yield of the circuit board and reduced the cost.
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Figure CN115915595B_ABST
Abstract
本申请提供一种埋阻电路板及加工方法，通过在基板上开设埋阻槽，并在埋阻槽内埋入电阻，得到包含内置电阻的电路板。通过开设埋阻槽，能够非常容易实现对埋设电阻形状以及厚度的高精度控制，实现超高的埋阻精度，且容易实现高精度批量化加工。在埋阻层中，电阻是内置在基板中的，那么在压合过程中，也就不会因为埋阻层的凹凸不平而导致压合后出现裂纹以及较大的变形，从而提高了电路板可靠性和良品率。
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