A thermoelectric cooler with an integrated needle-fin type microchannel heat sink and its manufacturing process

Abstract

This invention discloses a thermoelectric cooler with an integrated needle-fin microchannel heat sink and its manufacturing process, comprising: a needle-fin microchannel heat sink assembly, including a channel substrate and a cover plate located on the lower side of the channel substrate; both ends of the channel substrate are provided with confluence channels; needle fins are arranged inside the channel substrate; and a cooling medium flows through the confluence channels; an upper substrate is disposed above the needle-fin microchannel heat sink assembly; upper electrodes are arranged in an array on the lower side of the upper substrate; and lower electrodes corresponding to the upper electrodes are disposed on the upper surface of the channel substrate; and a thermoelectric arm array is disposed within the encapsulation layer formed between the upper substrate and the needle-fin microchannel heat sink assembly, forming a series connection with the upper and lower electrodes. This invention can solve the problem in traditional thermal encapsulation where the heat sink and heat source are connected using thermal interface materials such as thermally conductive silicone grease, which introduces additional interfacial thermal resistance and affects the overall heat transfer efficiency.

Description

Technical Field

[0001] This invention relates to the field of thermal management technology for electronic devices, specifically to a thermoelectric cooler with an integrated needle-fin microchannel heat sink and its manufacturing process. Background Technology

[0002] With the rapid development of the electronics industry towards higher integration and higher power, the heat flux density of electronic devices has increased dramatically, currently reaching as high as 1000 W / cm². 2 The equipment's operational performance and reliability face unprecedented challenges. Traditional heat dissipation technologies, including natural / forced air cooling, heat pipe heat exchange, and liquid cooling, can adequately meet requirements of less than 100W / cm². 2 While meeting the heat flux density requirements for heat dissipation, it is difficult to satisfy the thermal management needs of modern power electronic devices.

[0003] Thermoelectric cooling technology offers a promising solution for the thermal management of modern power devices. Based on the Peltier effect, thermoelectric cooling demonstrates that when current flows through a circuit composed of different conductors, heat absorption or release occurs at the junctions. Heat absorption can be used for heat dissipation in electronic devices. Thermoelectric coolers are characterized by high reliability, fast temperature response, and high compatibility with semiconductor fabrication processes, making them ideal for power device heat dissipation. However, their relatively low cooling capacity limits their widespread application in thermal management. Enhancing the heat transfer capacity of the thermoelectric cooler's heat sink is an effective way to improve its cooling capacity. Microchannel heat sinks, in particular, are characterized by their small size and simple structure. Utilizing forced convection heat transfer and a large liquid-solid heat transfer area, they exhibit excellent heat transfer performance. Specifically, microchannels can be fabricated not only through metal 3D printing and machining but also through etching techniques, requiring no additional space and meeting the requirements of compact heat exchangers. In traditional thermal encapsulation, thermal interface materials such as thermally conductive silicone grease are used to connect the heat sink and the heat source. These materials introduce additional interfacial thermal resistance, which affects the overall heat transfer efficiency. Therefore, integrating the microchannel with the heat dissipation end of the thermoelectric cooler is the key to solving the above-mentioned problems. Summary of the Invention

[0004] This invention provides a thermoelectric cooler with an integrated needle-fin microchannel heat sink and its manufacturing process, which can solve the problem in traditional thermal encapsulation where the heat sink and heat source are connected by thermal interface materials such as thermally conductive silicone grease. These thermal interface materials introduce additional interfacial thermal resistance and affect the overall heat transfer efficiency.

[0005] To achieve the above objectives, in a first aspect, the present invention provides the following technical solution: a thermoelectric cooler integrating a needle-fin type microchannel heat sink, comprising: a needle-fin type microchannel heat sink assembly, which includes a channel substrate and a cover plate located on the lower side of the channel substrate, wherein both ends of the channel substrate are provided with confluence channels, needle fins are arranged inside the channel substrate, and a cooling working fluid flowing through the needle fins circulates between the confluence channels; an upper substrate, disposed above the needle-fin type microchannel heat sink assembly, wherein upper electrodes are arranged in an array on the lower side of the upper substrate, and lower electrodes corresponding to the upper electrodes are disposed on the upper side of the channel substrate; and a thermoelectric arm array, disposed on the... Within the encapsulation layer formed between the upper substrate and the needle-fin microchannel heat sink assembly, it is connected in series with the upper and lower electrodes. The needle-fin microchannel heat sink assembly is integrated on the thermoelectric cooler, effectively avoiding the use of insulating ceramic sheets at the hot end of commercial thermoelectric coolers, and directly replacing them with insulating heat sinks. This forms an integrated connection between the thermoelectric cooler and the needle-fin microchannel heat sink, reducing the use of thermal interface materials, reducing thermal resistance, and enhancing the efficiency of heat transfer from the cold end of the thermoelectric cooler to the heat sink. By setting a large number of needles, the heat exchange uniformity of the needle-fin microchannel heat sink assembly can be increased, the heat exchange area inside the heat sink can be increased, and the convergence of the cooling working fluid can be enhanced, thereby strengthening heat transfer.

[0006] Preferably, the channel substrate has multiple baffles arranged side by side inside, forming a diversion channel between the baffles with both ends corresponding to the confluence channel. The needle fins are arranged along the length of the baffles in the diversion channel. By forming multiple diversion channels, the flow resistance can be reduced.

[0007] Preferably, the number of needle fins in the diversion channel is 7 to 11, and they are located in the middle of the diversion channel, resulting in low resistance and a large heat exchange area.

[0008] Preferably, the thermoelectric arm array includes N-type thermoelectric arms and P-type thermoelectric arms arranged in an alternating pattern. The N-type thermoelectric arms and P-type thermoelectric arms are connected to the corresponding upper and lower electrodes. The series connection of the N-type thermoelectric arms and P-type thermoelectric arms can realize the sequential alignment of the current direction, providing a stronger electrical output.

[0009] Preferably, a positioning plate is provided between the upper substrate and the needle-fin type microchannel heat sink assembly. The positioning plate is provided with positioning grooves in an array corresponding to the upper electrode and the lower electrode. The N-type thermoelectric arm and the P-type thermoelectric arm are positioned in the positioning grooves. The positioning plate can quickly achieve uniform placement of the N-type thermoelectric arm and the P-type thermoelectric arm.

[0010] Preferably, the N-type thermoelectric arm and the P-type thermoelectric arm are made of bismuth telluride-based material plated with nickel or tin, which has good performance.

[0011] Preferably, the cooling medium is deionized water, which helps protect the environment, and the refrigeration process does not produce greenhouse gases such as carbon dioxide, which is also beneficial to environmental protection.

[0012] Secondly, a manufacturing process for a thermoelectric cooler with an integrated needle-fin microchannel heat sink according to the first aspect includes the following steps:

[0013] S1: Cover the lower surface of the upper substrate with a layer of copper, place it in a nitrogen environment with low oxygen concentration for high temperature heating, cool it down, expose and develop it with film, and form the upper electrode of the upper substrate by etching.

[0014] S2: After thoroughly mixing the tin-silver-copper lead-free solder paste, print a solder paste layer corresponding to the shape of the thermoelectric arm end face onto the upper electrode formed in step S1.

[0015] S3: Place the thermoelectric arms at intervals at the corresponding positions of the upper electrode covered with tin-silver-copper lead-free solder paste to form an array of thermoelectric arms with intervals.

[0016] S4: Transfer the fixed thermoelectric arm array and upper substrate to the heating table for extrusion heating. After the tin-silver-copper lead-free solder paste has completely melted, cool to room temperature to form a whole.

[0017] S5: The channel substrate and cover plate of the needle-fin type microchannel heat sink component are processed by metal 3D printing, and the channel substrate and cover plate are integrated by high-temperature heating of brazing sheet;

[0018] S6: After cutting the lower electrode into the corresponding shape, apply thermally conductive insulating adhesive to one side and attach it to the upper side of the channel substrate corresponding to the position of the thermoelectric arm. Fix the wire to the two lower electrodes located at the edge of the channel substrate.

[0019] S7: Coat the lower electrode with tin-silver-copper lead-free solder paste, and then press and heat the thermoelectric arm and upper substrate that were soldered in step S3 onto the lower electrode on the upper side of the channel substrate. After the tin-silver-copper lead-free solder paste has completely melted, cool it to room temperature to form a whole.

[0020] Preferably, the extrusion heating in steps S4 and S7 involves placing the module on a heating platform, extruding and fixing it on the top, preheating the module to 200°C and holding it for 3 minutes, then heating it to 250°C and holding it for 3 minutes.

[0021] Preferably, in step S5, after the channel substrate and the cover plate are integrally welded, the upper surface of the channel substrate is ground and polished, and then a 2-5 micrometer thick diamond-like coating is sprayed on.

[0022] Compared with the prior art, the beneficial effects of the present invention are:

[0023] Integrating microchannels with simple internal structures, high heat transfer coefficients, and low flow resistance into the hot end of a thermoelectric cooler not only significantly enhances heat transfer but also avoids introducing additional interfacial thermal resistance. This is beneficial for increasing the cooling capacity of the cold end of the thermoelectric device and holds promise for solving the heat dissipation problem of high-power electronic devices. Specifically, by setting multiple baffles and fins, the uniformity of heat transfer in the finned microchannel heat sink is ensured, increasing the heat transfer area inside the heat sink and enhancing the convergence of the cooling medium, thereby strengthening heat transfer. Simultaneously, the symmetrically distributed cooling medium inlets and outlets parallel to the flow direction of the cooling medium do not significantly increase the flow resistance of the internal channels. The manufacturing process of the thermoelectric cooler with integrated finned microchannel heat sink of this invention effectively avoids the use of insulating ceramic sheets at the hot end of commercial thermoelectric coolers, directly replacing them with an insulating heat sink. This forms an integrated connection between the thermoelectric cooler and the finned microchannel heat sink, reducing the use of thermal interface materials, decreasing thermal resistance, and enhancing the efficiency of heat transfer from the cold end of the thermoelectric cooler to the heat sink. In addition, by improving the input current of the thermoelectric cooler and the flow rate of the cooling medium in the needle-fin microchannel, the cooling requirements of chips or other heat sources with different heat fluxes can be met. While achieving the purpose of cooling, unnecessary overall power consumption is effectively reduced, and it has good universality for cooling heat sources. Attached Figure Description

[0024] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0025] Figure 2 This is a diagram showing the internal structure of the needle-fin type microchannel heat sink assembly of the present invention;

[0026] Figure 3 This is a schematic diagram of the arrangement of the upper electrodes of the present invention;

[0027] Figure 4 This is a schematic diagram of the arrangement of the lower electrode of the present invention;

[0028] Figure 5 This is a three-dimensional schematic diagram of the positioning plate of the present invention;

[0029] Figure 6 This is a flowchart illustrating the dynamic thermal management process of this invention. (Please provide a CAD file of this diagram if possible, as this will improve clarity.)

[0030] Figure label:

[0031] 1-1. Upper substrate; 2-1. Upper electrode; 2-2. Lower electrode; 3-1. N-type thermoelectric arm; 3-2. P-type thermoelectric arm; 4. Needle-fin type microchannel heat sink assembly; 4-1. Channel substrate; 4-1-1. Needle fin; 4-1-2. Separator; 4-1-4. Diverter channel; 4-2. Cover plate; 4-3. Convergence channel; 5. Positioning plate. Detailed Implementation

[0032] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0033] like Figure 1-6 As shown, to address the problem that traditional thermal interface materials such as thermally conductive silicone grease introduce additional interfacial thermal resistance and affect overall heat transfer efficiency when connecting the heat sink and heat source in thermal packaging, this invention provides an embodiment: a thermoelectric cooler with an integrated needle-fin microchannel heat sink, comprising: a needle-fin microchannel heat sink assembly 4, which includes a channel substrate 4-1 and a cover plate 4-2 located on the lower side of the channel substrate 4-1; both ends of the channel substrate 4-1 are provided with a confluence channel 4-3; needle fins 4-1-1 are arranged inside the channel substrate 4-1; and a cooling medium flows through the confluence channels 4-3; an upper substrate 1-1 is disposed above the needle-fin microchannel heat sink assembly 4; and upper electrodes 2-1 are arranged in an array on the lower side of the upper substrate 1-1. A lower electrode 2-2 corresponding to the upper electrode 2-1 is provided on the upper side of the channel substrate 4-1; a thermoelectric arm array is disposed in the encapsulation layer formed between the upper substrate 1-1 and the needle-fin type microchannel heat sink assembly 4, forming a series connection with the upper electrode 2-1 and the lower electrode 2-2. The needle-fin type microchannel heat sink assembly 4 is integrated on the thermoelectric cooler, effectively avoiding the use of insulating ceramic sheets at the hot end of commercial thermoelectric coolers and directly replacing them with insulating heat sinks, forming an integrated connection between the thermoelectric cooler and the needle-fin type microchannel heat sink, reducing the use of thermal interface materials, reducing thermal resistance, and enhancing the efficiency of heat transfer from the cold end of the thermoelectric cooler to the heat sink. By setting a large number of needles 4-1-1, the uniformity of heat exchange of the needle-fin type microchannel heat sink assembly 4 can be increased, the heat exchange area inside the heat sink can be increased, and the convergence of the cooling working fluid can be enhanced, thereby strengthening heat transfer.

[0034] Specifically, the upper substrate 1-1 can be made of aluminum nitride ceramic plate, and the overall dimensions of the upper substrate 1-1 can be selected as 40×40×1mm. 3 The external dimensions of the channel substrate 4-1 can be 40×50×10mm. 3 The needle fins have a diameter or side length of 0.5mm-2.5mm, with equal spacing between adjacent needle fins and a spacing length of 0.5mm-5mm. The confluence channels 4-3 at both ends can be used as coolant inlets and outlets. The confluence channels 4-3 are symmetrically distributed about the central axis of the channel base 4-1. The coolant inlet and outlet can be welded with pagoda heads, with an outer diameter of 9mm and an inner diameter of 7mm at the front end. The overall dimensions of the cover plate 4-2 are 40×50×2mm. 3The cooling medium is deionized water, which helps protect the environment, and the refrigeration process does not produce greenhouse gases such as carbon dioxide, thus contributing to environmental protection.

[0035] Among them, such as Figure 2 As shown, multiple baffles 4-1-2 are arranged side-by-side inside the channel base 4-1. These baffles 4-1-2 form branching channels 4-1-4 with their ends corresponding to the confluence channels 4-3. The fins 4-1-1 are arranged along the length of the baffles 4-1-2 in the branching channels 4-1-4. Forming multiple branching channels 4-1-4 reduces flow resistance. The cross-sections of the fins 4-1-1 can be circular, hexagonal, square, or rhomboid, and they can be used individually or in combination. Specifically, the number of fins 4-1-1 in the branching channels 4-1-4 is 7 to 11, and they are located in the middle of the branching channels 4-1-4, resulting in low resistance and a large heat exchange area.

[0036] As a specific embodiment of the thermoelectric arm array, the array includes alternating N-type thermoelectric arms 3-1 and P-type thermoelectric arms 3-2. The N-type thermoelectric arms 3-1 and P-type thermoelectric arms 3-2 are connected to corresponding upper electrodes 2-1 and lower electrodes 2-2. In the P-type thermoelectric material, the main charge carriers are holes, and their movement direction is the same as the current direction. In the N-type thermoelectric material, the main charge carriers are electrons, and their movement direction is opposite to the current direction. Therefore, in a thermoelectric device with a fixed hot and cold end, the series connection of the P-type and N-type thermoelectric materials can achieve sequential alignment of the current direction, providing a stronger electrical output. The N-type thermoelectric arms 3-1 and P-type thermoelectric arms 3-2 are made of nickel-plated or tin-plated bismuth telluride-based materials, which offer good performance.

[0037] To facilitate the arrangement of the thermoelectric arm array, a positioning plate 5 is provided between the upper substrate 1-1 and the needle-fin type microchannel heat sink assembly 4. The positioning plate 5 has positioning grooves arranged in an array corresponding to the upper electrode 2-1 and the lower electrode 2-2. The N-type thermoelectric arm 3-1 and the P-type thermoelectric arm 3-2 are positioned within these positioning grooves. The positioning plate 5 allows for the rapid and uniform placement of the N-type thermoelectric arm 3-1 and the P-type thermoelectric arm 3-2. The size of each positioning hole on the positioning plate 5 can be 1.3 × 1.3 × 2.3 mm. 3 Positioning plate 5 can remain in the encapsulation layer or be removed during the process.

[0038] Secondly, a manufacturing process for a thermoelectric cooler with an integrated needle-fin microchannel heat sink according to the first aspect includes the following steps:

[0039] S1: Cover the lower surface of the upper substrate 1-1 with a layer of copper with a thickness of 100μm, place it in a nitrogen environment with low oxygen concentration and heat it at high temperature. Specifically, the oxygen concentration can be as low as 0.0005%. After cooling, expose and develop it with film, and form the upper electrode 2-1 of the upper substrate 1-1 by etching. The array of upper electrode 2-1 can be an 8×16 array.

[0040] S2: After thoroughly mixing the tin-silver-copper lead-free solder paste (SAC305), screen print a solder paste layer corresponding to the shape of the thermoelectric arm end face onto the upper electrode 2-1 formed in step S1. The size of the solder paste layer can be 1.26×1.26×2.24mm. 3 ;

[0041] S3: Place the thermoelectric arms at the corresponding positions of the upper electrode (2-1) covered with tin-silver-copper lead-free solder paste in an intermittent manner to form an intermittent array of thermoelectric arms. The positioning plate (5) can be used for positioning during the arrangement.

[0042] S4: Transfer the fixed thermoelectric arm array and upper substrate 1-1 to the heating table for extrusion heating. After the tin-silver-copper lead-free solder paste is completely melted, cool to room temperature to form a whole. Specifically, the extrusion heating is to place it on the heating table, and after the upper side is extruded and fixed, preheat the module to 200°C and hold for 3 minutes, then heat it to 250°C and hold for 3 minutes.

[0043] S5: The channel substrate 4-1 and cover plate 4-2 of the needle-fin type microchannel heat sink component 4 are processed by metal 3D printing. The channel substrate 4-1 and cover plate 4-2 are integrated by high-temperature heating with brazing tabs. The channel substrate 4-1 and cover plate 4-2 can be made of aluminum alloy or stainless steel. After the channel substrate 4-1 and cover plate 4-2 are integrated and welded, the upper surface of the channel substrate 4-1 is polished and then sprayed with a 2-5 micrometer thick diamond-like coating.

[0044] S6: After cutting the lower electrode 2-2 into the appropriate shape, apply thermally conductive insulating adhesive to one side. The thickness of the lower electrode 2-2 can be 0.1mm, and the area should be approximately 1.5×4mm. 2 The surface shape corresponds to the position of the thermoelectric arm and is attached to the upper side of the channel substrate 4-1, and the wire is fixed to the two lower electrodes 2-2 located at the edge of the channel substrate 4-1;

[0045] S7: Apply tin-silver-copper lead-free solder paste to the lower electrode 2-2, and then press and heat the thermoelectric arm and upper substrate 1-1 that were soldered in step S3 onto the lower electrode 2-2 on the upper side of the channel substrate 4-1. After the tin-silver-copper lead-free solder paste has completely melted, cool it to room temperature to form a whole. The pressing and heating is also specifically done by placing it on a heating table, pressing and fixing it on the upper side, preheating the module to 200°C and holding it for 3 minutes, and then heating it to 250°C and holding it for 3 minutes.

[0046] like Figure 6 As shown, the dynamic thermal management process of the thermoelectric cooler of the present invention is as follows: When the system starts to execute, it first detects the temperature T on the upper surface of the needle-fin microchannel heat sink component (4). 面 , will T 面 With normal operating temperature T 正常运行 Compare, if T 面 >T 正常运行 The LabVIEW system can then control the workpiece current I > 0 and the cooling fluid flow rate v > 0; if T 面 <T 正常运行 This allows controlling the workpiece current I to be less than 0, and the cooling fluid flow rate v = 0; if T 面 ≈T 正常运行 Then, with no workpiece current input, the cooling fluid flow rate v = 0; where T 面 <T 正常运行 After the completion of the judgment and control, further judgment is needed to determine whether T is complete. 面 ≈T 正常运行 If the result is negative, then the temperature T of the upper surface is re-evaluated. 面 Perform the test; if the result is positive, proceed according to T. 面 ≈T 正常运行 The execution will proceed according to the specified circumstances.

[0047] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0048] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly and specifically defined.

[0049] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0050] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

Claims

1. A manufacturing process for a thermoelectric cooler with an integrated needle-fin type microchannel heat sink, characterized in that, The thermoelectric cooler includes: A needle-fin type microchannel heat sink assembly (4) includes a channel substrate (4-1) and a cover plate (4-2) located on the lower side of the channel substrate (4-1). Both ends of the channel substrate (4-1) are provided with a confluence channel (4-3). Needle fins (4-1-1) are arranged inside the channel substrate (4-1). Cooling medium flowing through the needle fins (4-1-1) circulates between the confluence channels (4-3). The upper substrate (1-1) is disposed above the needle-fin type microchannel heat sink assembly (4). The upper electrode (2-1) is arranged in an array on the lower side of the upper substrate (1-1), and the lower electrode (2-2) corresponding to the upper electrode (2-1) is disposed on the upper side of the channel substrate (4-1). The thermoelectric arm array is disposed in the encapsulation layer formed between the upper substrate (1-1) and the needle-fin type microchannel heat sink assembly (4), and is connected in series with the upper electrode (2-1) and the lower electrode (2-2); The production process includes the following steps: S1: Cover the lower surface of the substrate (1-1) with a layer of copper, place it in a nitrogen environment with an oxygen concentration of 0.0005% for high-temperature heating, and after cooling, expose and develop it with film, and form the upper electrode (2-1) of the substrate (1-1) by etching. S2: After thoroughly mixing the tin-silver-copper lead-free solder paste, print the solder paste layer corresponding to the shape of the thermoelectric arm end face on the upper electrode (2-1) formed in step S1; S3: Place the thermoelectric arms at intervals at the corresponding positions of the upper electrode (2-1) covered with tin-silver-copper lead-free solder paste to form an array of thermoelectric arms with intervals. S4: Transfer the fixed thermoelectric arm array and upper substrate (1-1) to the heating stage for pressure heating. After the tin-silver-copper lead-free solder paste has completely melted, cool it to room temperature to form a whole. S5: The channel substrate (4-1) and cover plate (4-2) of the needle-fin type microchannel heat sink component (4) are processed by metal 3D printing, and the channel substrate (4-1) and cover plate (4-2) are integrated by high temperature heating of brazing sheet; S6: After cutting the lower electrode (2-2) into the corresponding shape, apply thermally conductive insulating adhesive to one side and attach it to the upper side of the channel substrate (4-1) corresponding to the position of the thermoelectric arm. Fix the wire to the two lower electrodes (2-2) located at the edge of the channel substrate (4-1). S7: Coat the lower electrode (2-2) with tin-silver-copper lead-free solder paste, and then press and heat the thermoelectric arm and upper substrate (1-1) welded in step S3 onto the lower electrode (2-2) on the upper side of the channel substrate (4-1). After the tin-silver-copper lead-free solder paste has completely melted, cool it to room temperature to form a whole.

2. The manufacturing process of the thermoelectric cooler with integrated needle-fin microchannel heat sink according to claim 1, characterized in that: The channel substrate (4-1) has multiple partitions (4-1-2) arranged side by side inside, and the partitions (4-1-2) form a diversion channel (4-1-4) with both ends corresponding to the confluence channel (4-3). The needle fins (4-1-1) are arranged along the length of the partitions (4-1-2) in the diversion channel (4-1-4).

3. The manufacturing process of the thermoelectric cooler with integrated needle-fin microchannel heat sink according to claim 2, characterized in that: The number of needle fins (4-1-1) in the diversion channel (4-1-4) is 7 to 11, and they are located in the middle of the diversion channel (4-1-4).

4. The thermoelectric cooler with an integrated needle-fin microchannel heat sink according to claim 1, characterized in that: The thermoelectric arm array includes N-type thermoelectric arms (3-1) and P-type thermoelectric arms (3-2) arranged in an alternating pattern, and the N-type thermoelectric arms (3-1) and P-type thermoelectric arms (3-2) are connected to the corresponding upper electrode (2-1) and lower electrode (2-2).

5. The manufacturing process of the thermoelectric cooler with integrated needle-fin microchannel heat sink according to claim 4, characterized in that: A positioning plate (5) is provided between the upper substrate (1-1) and the needle-fin type microchannel heat sink assembly (4). The positioning plate (5) is provided with positioning grooves in an array corresponding to the upper electrode (2-1) and the lower electrode (2-2). The N-type thermoelectric arm (3-1) and the P-type thermoelectric arm (3-2) are positioned in the positioning grooves.

6. The manufacturing process of the thermoelectric cooler with integrated needle-fin microchannel heat sink according to claim 4, characterized in that: The N-type thermoelectric arm (3-1) and P-type thermoelectric arm (3-2) are made of bismuth telluride-based material plated with nickel or tin.

7. The manufacturing process of the thermoelectric cooler with integrated needle-fin microchannel heat sink according to claim 1, characterized in that: The cooling medium is deionized water.

8. The manufacturing process of the thermoelectric cooler with integrated needle-fin microchannel heat sink according to claim 1, characterized in that: The extrusion heating in steps S4 and S7 specifically involves placing the module on a heating platform, pressing and fixing it on the upper side, preheating the module to 200°C and maintaining it for 3 minutes, then heating it to 250°C and maintaining it for 3 minutes.

9. The manufacturing process of the thermoelectric cooler with integrated needle-fin microchannel heat sink according to claim 1, characterized in that: In step S5, after the channel substrate (4-1) and the cover plate (4-2) are integrally welded, the upper surface of the channel substrate (4-1) is ground and polished, and then a diamond-like coating with a thickness of 2-5 micrometers is sprayed on.

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