Glass-ceramic and laminated ceramic electronic components
By optimizing the ratio of SiO2/B2O3 and Al2O3/ZnO, and adding appropriate amounts of TiO2, ZrO2, SnO2, SrO, etc., the problems of dielectric properties and thermal expansion coefficient caused by unstable boron content were solved, resulting in a glass-ceramic material with low dielectric loss and high thermal expansion, suitable for electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- MURATA MFG CO LTD
- Filing Date
- 2021-06-14
- Publication Date
- 2026-07-17
AI Technical Summary
The boron content in existing low-temperature sintered substrate glass-ceramic materials is unstable, resulting in high dielectric loss, large temperature variation of dielectric constant, and low coefficient of thermal expansion, making them unsuitable for use in electronic devices such as filters.
Glass-ceramic materials containing Si, B, Al, and Zn are used, with the weight ratio of SiO2/B2O3 controlled to be above 1.21 and the weight ratio of Al2O3/ZnO controlled to be 0.8 to 1.3. TiO2, ZrO2, SnO2, SrO, etc. are added as aggregates to optimize dielectric properties and coefficient of thermal expansion.
A glass-ceramic with low boron content has been developed, exhibiting low dielectric constant and dielectric loss, low temperature dependence of dielectric constant, and high coefficient of thermal expansion, making it suitable for low-temperature sintering and high-frequency electrical signal transmission.
Smart Images

Figure CN115916717B_ABST