Uniform temperature plate assembly

Abstract

The invention provides a vapor chamber assembly (1000) comprising two segments (1200) and one or more vapor chamber elements (100), wherein each segment (1200) comprises at least a portion of one or more vapor chamber elements (100), wherein each vapor chamber element (100) comprises a vapor chamber (200) at least partially defined by two parallel arranged plate portions (211, 221), wherein the two segments (1200) define a bend (1100), wherein the bend (1100) has a bending angle a b wherein 0° < a b <180°.

Description

Technical Field

[0001] This invention relates to a heat spreader assembly. It also relates to a heat spreader segment. Furthermore, it relates to an apparatus comprising a heat spreader assembly. Background Technology

[0002] Vapor chambers are known in the art. For example, US2010226138A1 describes a street lamp retainer structure comprising a lampshade, LED units mounted at the bottom of the lampshade, and a heat dissipation device mounted within the lampshade and having a base, a vapor chamber, and two heat dissipation elements attached to the LED units. The vapor chamber includes a heating section attached to the base, two heat transfer sections that bend upwards and extend from both sides of the heating section, a condensation section that bends laterally and extends from each of the two heat transfer sections, two heat dissipation elements having a heating base, and heat sinks disposed on the heating base. The two heating bases are respectively attached to the outer sides of the two heat transfer sections of the vapor chamber, and the two condensation sections of the vapor chamber are attached to the inner periphery of the top of the lampshade. Summary of the Invention

[0003] For example, in the context of LED lighting, the compactness of electronic components may become increasingly important. With the growing demand for miniaturization, next-generation electronic components may require new technologies and solutions.

[0004] Existing technologies may describe electronic components, such as drivers, housed within a casing, where additional empty spaces within the casing are filled with thermal interface materials. However, thermal interface materials, such as polymer-based composites and graphite-based thermal interface materials, typically have a maximum thermal conductivity of less than 400 W / mK. Furthermore, vapor chambers with thermal conductivity in the range of 15,000–27,000 W / mK appear to be possible. However, vapor chambers cannot be easily adapted for device miniaturization. In particular, prior art vapor chambers can be limited either to a planar configuration that allows for maximum heat exchange or to a bent configuration with a bending radius (e.g., 10 mm), which may hinder device miniaturization. Specifically, prior art vapor chambers may collapse when bent with a smaller bending radius suitable for device miniaturization.

[0005] Therefore, one aspect of the present invention is to provide an alternative heat spreader that preferably also at least partially eliminates one or more of the aforementioned disadvantages. The object of the present invention may be to overcome or improve at least one of the disadvantages of the prior art, or to provide a useful alternative.

[0006] Therefore, in a first aspect, the present invention can provide a (curved) heat spreader assembly. The heat spreader assembly may include two segments. The heat spreader assembly may also include one or more heat spreader elements. In embodiments, each segment may include at least a portion of one or more heat spreader elements. Furthermore, each heat spreader element may include a heat spreader at least partially defined by two parallel plate portions. In embodiments, the two segments may define a bend, particularly a bend disposed between the two segments, wherein the bend has a bend angle α. b Especially where 0°≤α b <180°.

[0007] The vapor chamber assembly of the present invention can provide the following benefits: the vapor chamber element can be provided in a manner suitable for device miniaturization. Specifically, a vapor chamber assembly can be provided that provides the vapor chamber element at an acute angle or provides a bend with a small bending radius for the vapor chamber element. Specifically, the present invention provides embodiments in which a (bent) vapor chamber assembly is obtained without vapor chamber collapse.

[0008] The term "acute angle" in this document may specifically refer to a vapor chamber element being provided by two adjacent vapor chamber segments, rather than by bending of the element, such as bending of the substrate (see below). Thus, in such an embodiment, the "bending" may be "immediate," rather than a smooth transition between adjacent segments.

[0009] In a specific embodiment, the heat spreader assembly includes two segments and one or more heat spreader elements, wherein each segment includes at least a portion of the one or more heat spreader elements, wherein each heat spreader element includes a heat spreader at least partially defined by two parallel plate portions, wherein the two segments define a bend, wherein the bend has a bend angle α. b , where 0°≤α b <180°.

[0010] Therefore, the present invention can provide a heat spreader assembly, particularly a curved heat spreader assembly. The term "heat spreader assembly" herein may specifically refer to a physical connection unit comprising at least one heat spreader element.

[0011] In embodiments, the vapor chamber assembly may include at least two segments, such as at least three segments, and particularly at least four segments (see below). These segments may include non-overlapping portions of the vapor chamber assembly. Specifically, the vapor chamber assembly may be divided into at least two segments, i.e., these segments may together constitute the entire vapor chamber assembly. In another embodiment, the vapor chamber assembly may be divided (or “segmented”) into at least two segments along the longitudinal dimension of the vapor chamber assembly.

[0012] In one embodiment, each segment may have a segment plane, particularly wherein the segment planes (of different segments) do not overlap. In another embodiment, the segment planes (of different segments) are at an angle α. p Arrangement, where 0° < α p <180°, meaning that the planes of different sections are not arranged in parallel.

[0013] In embodiments, the vapor chamber assembly may also include one or more vapor chamber elements. Vapor chamber elements are known in the art and can be based on substantially the same principle as heat pipes (which are also known in the art). Both systems are referred to as “two-phase devices.” Both two-phase devices can include a core structure (sintered powder, screen, and / or grooves) applied to the inner wall of the housing (tube or planar shape). Liquids, such as water (e.g. for copper devices) or acetone (e.g. for aluminum devices), can be added to the device, and the device can be vacuum-sealed. The core can distribute the liquid throughout the device. However, when heat is applied to one area of ​​the two-phase device, the liquid turns into vapor and moves to a low-pressure area, where it cools and returns to liquid form, then moves back to the heat source by capillary action (through the core). A common core structure can be a sintered core type because it offers high versatility in terms of power handling capacity and resistance to gravity. Screened cores can allow the heat pipe or vapor chamber to be thinner relative to the sintered core. Additionally, slotted cores can be applied. The grooves can act as internal fin structures, facilitating evaporation and condensation. The difference between heat pipes and vapor chambers may lie in the fact that heat pipes can have a essentially rod-like shape, while vapor chambers generally consist of two essentially flat plates with a relatively short distance between them (e.g., at most 5 mm). Furthermore, vapor chambers offer relatively more freedom in selecting hot spots, whereas heat pipes have a hot side and a cold side.

[0014] A vapor chamber element may include a vapor chamber at least partially defined by two parallel plates, i.e., in embodiments, the vapor chamber element may include a first plate and a second plate, particularly with a vapor chamber between them. The first and second plates may be arranged in parallel. Thus, in embodiments, the vapor chamber may be defined by at least a first plate and a second plate having an average plate distance equal to a first height H1, i.e., the first and second plates may define a first height H1. At the edges of the plates, the plates may be welded together to provide a closed chamber. The plates may also define the vapor chamber together with one or more edges. In embodiments, the plates may be configured to be parallel over a large portion of the first plate and a large portion of the second plate. For example, the plates may be configured to be parallel over at least 50%, such as at least 80%, or at least 90%, of the area of ​​the first plate and over at least 50%, such as at least 80%, or at least 90%, of the area of ​​the second plate. Thus, the distance between the plates may remain substantially unchanged over a large portion of the first plate and a large portion of the second plate. The first and second plates may be approximately (identical) rectangular shapes, such as a circular rectangular shape. Specifically, the term "parallel" in relation to parallel plates can refer in this document to two plates that are substantially the same (closest) distance from each other over most of the plate. Thus, for example, two plates can be curved, especially with the same radius of curvature, and are still considered parallel.

[0015] The materials of the first and second plates can be selected from the group consisting of copper, stainless steel, aluminum, and titanium. Therefore, in one embodiment, the first plate may include a material selected from the group consisting of copper, stainless steel, aluminum, and titanium. In another embodiment, the second plate may include a material selected from the group consisting of copper, stainless steel, aluminum, and titanium. In particular, both plates may be composed of the same material. In specific embodiments, combinations of materials, such as alloys, may also be used.

[0016] In another embodiment, the first and second plates may be formed from a single piece (material). Specifically, the single piece (material) may have been bent to provide the first and second plates, in particular, separated by a distance H1.

[0017] In another embodiment, the first plate and the second plate may be two separate plates. Specifically, the first plate and the second plate may be welded together at their edges to provide a closed chamber. In another embodiment, the heat spreader element may also include a plurality of side plates bridging the first plate (also: "top plate") and the second plate (also: "bottom plate"), wherein the chamber is arranged between the first plate, the second plate, and the plurality of side plates. The heat spreader element, particularly the chamber defined by the plates, may have an approximately cuboid shape, especially a rod, such as a cuboid with rounded (interior) corners.

[0018] In an embodiment, the chamber may have a first height (H1), specifically the average distance between the first and second plates. Specifically, since the first and second plates can be arranged substantially parallel to each other, the first height H1 can be substantially constant throughout the chamber. In a specific embodiment, the first height (H1) can be selected from the range of 50 μm to 5 mm. In an embodiment, the first height can be a maximum of 1 mm. The first height can even be equal to or less than 0.4 mm, for example, in the range of 100-400 μm, such as 200-400 μm, or at least 250 μm.

[0019] The chamber may have a (first) height defined by the (average) distance between the first plate and the second plate. The chamber may also have a (first) length (L1) and a (first) width (Wl) perpendicular to the first height (H1). Therefore, in an embodiment, each segment may also have a (first) width (Wl).

[0020] The vapor chamber element may include a first chamber end and a second chamber end defining a first length (L1). Generally, the length and width of the chambers will be significantly greater than the height. Furthermore, the cross-section of the chambers is generally rectangular. The vapor chamber element, especially the chambers, may have an extending axis. The extending axis may, in particular, be an axis that defines the length of the vapor chamber. Thus, the vapor chamber element may have an elongated shape with a longitudinal axis, especially where the first axis (A) is the longitudinal axis (of the vapor chamber element).

[0021] Furthermore, the height can generally be much smaller than the length and / or width of the chamber. Therefore, in a specific embodiment, the first length (L1) and the first height (H1) can have a ratio selected from the range L1 / H1 ≥ 10, such as L1 / H1 ≥ 20, for example, a ratio selected from the range of 10-10,000. Alternatively or additionally, in a specific embodiment, the first width (W1) and the first height (H1) can have a ratio selected from the range W1 / H1 ≥ 10, such as W1 / H1 ≥ 20, for example, a ratio selected from the range of 10-10,000. In another embodiment, the first axis (A) has a first length (L1) defining the length of the vapor chamber element, wherein the vapor chamber element has a first width (W1) (perpendicular to the first axis (A)), wherein 0.2 ≤ L1 / W1 ≤ 5.

[0022] In an embodiment, the first length L1 can be selected, for example, from the range of 1-50 cm, such as 2-40 cm, such as from the range of 2-20 cm, such as from the range of 4-15 cm, such as 5-12 cm. Similarly, this can apply to the first width. Generally, in an embodiment, the first width can be smaller than the first length.

[0023] In this embodiment, the chamber volume of the heat spreader can be at least about 1 mm.3 Even more so, at least about 1cm 3 In this embodiment, the chamber volume can be a maximum of approximately 25 cm³. 3 Even more especially, the largest is about 10cm 3 .

[0024] In embodiments, the first plate and the second plate may (respectively) have a first thickness (d1) and a second thickness (d2) independently selected from the range of 50-5000 μm, such as 100-2000 μm, especially 300-2000 μm. The phrase "independently selected" and similar phrases can refer to embodiments in which the same parameter values ​​are selected for the relevant elements, i.e., in these embodiments, the two plates may have the same thickness, but can also refer to embodiments in which different parameter values ​​are selected for the relevant elements, i.e., in these embodiments, the two plates may have thicknesses selected from the indicated range, but they may have different thicknesses. Furthermore, in embodiments, the first thickness and the second thickness may also vary with the first plate and / or the second plate.

[0025] The thicknesses of the first and second plates, as well as the space between the plates, can substantially define the thickness of the heat spreader element. Therefore, in this embodiment, the heat spreader element can have an element thickness d. e , where d e =d1+d2+H l Specifically, the component thickness d e It can be related to the segment thickness d s Basically the same (see below).

[0026] In another embodiment, the two segments may define a curved portion, which is particularly arranged between the two segments, i.e., (directly) at the boundary between the two (adjacent) segments. The curved portion may have a bending angle α. b The bending angle can be, in particular, the minimum angle between two segments, especially where 0°≤α b <180°. Specifically, the two (adjacent) segments have different segment planes, i.e., a bending angle α. b The angle is less than 180°, or the planar segments can be arranged at a certain distance from each other. Therefore, in the embodiment, two (adjacent) segments can be arranged in parallel, wherein the bending angle α is less than 180°. b It can be (essentially) 0°. In the embodiment, the bending angle α b It can be at least 5°, such as at least 15°, especially at least 30°, such as at least 45°, especially at least 60°, such as at least 75°. In another embodiment, the bending angle α b It can be up to 175°, such as up to 165°, especially up to 150°, such as up to 135°, especially up to 120°, such as up to 105°. In a particular embodiment, the bending angle αb The angle can be selected from the range of 5° to 135°, and especially from the range of 80° to 100°. The bending angle can be, in particular, about 90°.

[0027] In one embodiment, two segments may together define at least a portion of one or more vapor chamber elements. Specifically, one of the one or more vapor chamber elements (or "shared vapor chamber element") may be defined by at least two segments, such as by three segments. In another embodiment, each of the at least two segments may include a vapor chamber element portion, wherein the vapor chamber element portion (of both segments) gradually decreases towards the bend, and wherein the vapor chamber element portion defines at least a portion of one or more vapor chamber elements.

[0028] Therefore, for example, in another specific embodiment, the vapor chamber assembly may include (at least) three segments, wherein every two adjacent segments (i.e., the first segment and the second segment, and the second segment and the third segment) define a bend (between the two adjacent segments), wherein each of the three (adjacent) segments includes a vapor chamber element portion, wherein the vapor chamber element portion gradually decreases toward the bend, and wherein each vapor chamber element portion defines at least a portion of one or more vapor chamber elements. In such an embodiment, the vapor chamber element portion of the second segment may therefore gradually decrease toward two bends, while the vapor chamber element portions of the first and third segments may gradually decrease toward a single bend.

[0029] Specifically, the heat exchanger elements of two adjacent sections can be adjacent at the bend (defined by the two adjacent sections).

[0030] The heat exchanger elements (of two adjacent sections) can be arranged (at the bend) such that the first plate portion (at the bend) of the heat exchanger elements is adjacent to each other and the second plate portion (at the bend) of the heat exchanger elements is adjacent to each other.

[0031] Therefore, in another embodiment, the heat spreader may be defined at least partially by two plates, wherein the first plate of the two plates includes at least two first plate portions adjacent to each other at the bend, and wherein the second plate of the two plates includes at least two second plate portions adjacent to each other at the bend, and in particular, wherein each of the first plate portions is configured to be parallel to a corresponding second plate portion of the second plate portions.

[0032] In another embodiment, the heat spreader may be defined at least partially by two plates, wherein the first plate of the two plates is composed of a single piece comprising two (or more) first plate portions, and wherein the second plate of the two plates comprises two (or more) second plate portions adjacent at a bend, wherein each of the first plate portions is configured to be parallel to one of the second plate portions.

[0033] In another embodiment, the vapor chamber assembly may include a substrate, wherein the vapor chamber assembly includes a plurality of vapor chamber elements arranged on the substrate, particularly along the length (L) of the substrate, wherein two adjacent vapor chamber elements are bent apart. In another embodiment, the vapor chamber assembly may include three or more vapor chamber elements, wherein two or more sets of adjacent vapor chamber elements may be bent apart (correspondingly). Furthermore, two adjacent vapor chamber elements are not necessarily bent apart; that is, a segment may include multiple vapor chamber elements.

[0034] In another embodiment, two adjacent heat spreader elements can be separated by a curved region of the substrate, wherein the curved region has a curved length l along the substrate length (L). b , where l b The range is selected from 0.1-40 mm, particularly from 0.2-30 mm, such as from 0.5-20 mm, and particularly from 1-10 mm. In another embodiment, l b The thickness can be selected to be at least 0.1 mm, such as at least 0.2 mm, particularly at least 0.5 mm, such as at least 1 mm, particularly at least 2 mm, such as at least 5 mm. In another embodiment, l b The diameter can be selected to be at most 40 mm, especially at most 30 mm, such as at most 25 mm, especially at most 20 mm, such as at most 15 mm, especially at most 10 mm. Therefore, in a specific embodiment, l b Selected from the range of 0.1-20mm. Bending length l b This can be especially true for the desired bending angle α. b That is, bending length l b (Before bending) can be selected to provide a bending angle α. b Especially considering the (average) thickness d of the substrate p And taking into account the first height (H1). In this document, the term "bending length l" is used. b "This refers especially to the length of the curved area."

[0035] Therefore, in the embodiment, the bent section can have a bending length l along the substrate length (L). b The bending length can be specifically selected to provide a bend. Bending length l bThe selection can be based specifically on the desired bend. Specifically, the smaller the desired bend angle (i.e., the more bend to be made), the longer the bend length l... b The larger the thickness d, the better to achieve the desired bend. Similarly, the substrate thickness d p The larger the value, the longer the required bending length l b It may be necessary to make it larger to achieve a specific angle. Therefore, in the embodiment, l b ≥π*(r b +d p )*(180-α b ) / 180, where r b It is the bending radius, and where α b This is the bending angle. As is known to those skilled in the art, the neutrality factor of the material can also affect the bending length required to provide the desired bend. Therefore, in another embodiment, l b ≥π*(r b +(K*d p ))*(180-α b ) / 180, where K is the neutrality factor of the material. For thin plates, the effect of the neutrality factor is usually small.

[0036] Bending length l b It can be determined, particularly at the center of the substrate, relative to the thickness, i.e., at 0.5*d. p The thickness is determined.

[0037] In embodiments, the substrate may include a thinning region, particularly a thinning region configured to provide a bend. Therefore, the bend region may include a thinning region. In embodiments, the thinning region includes a groove. In embodiments, the length of the groove may be perpendicular to the length L of the substrate. Furthermore, in embodiments, the length of the groove may be perpendicular to the extension axis of the heat spreader.

[0038] In another embodiment, the thickness of the substrate can be d. p Especially the average thickness, or especially the median thickness, especially where d p Selected from the range of 0.05-2mm, such as the range of 0.1-1.5mm.

[0039] In another embodiment, the curved region may include a (minimum) thickness d. T The thinning region, especially where 0.1≤d T / d p ≤0.9. In another embodiment, d T / d p ≥0.1, especially d T / d p ≥0.2, such as d T / dp ≥0.3, especially d T / d p ≥0.4, such as d T / d p ≥0.5. In another embodiment, d T / d p ≤0.9, such as d T / d p ≤0.8, especially d T / d p ≤0.7, such as d T / d p ≤0.6, especially d T / d p ≤0.5, such as d T / d p ≤0.4, especially d T / d p ≤0.3. The substrate material can be selected based on a variety of criteria, such as suitability to provide appropriate mechanical strength for the sheet, and good thermal conductivity. Thus, for example, the substrate may include materials selected from the group consisting of metallic materials.

[0040] Specifically, in an embodiment, the substrate may include a material selected from the group consisting of copper, stainless steel and titanium.

[0041] Therefore, in embodiments, the substrate and the first and second plates may include a thermally conductive material, particularly composed of a thermally conductive material. Two or more may include the same thermally conductive material, but two or more may include different thermally conductive materials. The thermal conductivity of the thermally conductive material may be, in particular, at least about 20 W / m / K, such as at least about 30 W / m / K, such as at least about 100 W / m / K, such as particularly at least about 200 W / m / K. In yet another specific embodiment, the thermal conductivity of the thermally conductive material may be, in particular, at least about 10 W / m / K. In embodiments, the thermally conductive material may include one or more of copper, aluminum, silver, gold, silicon carbide, aluminum nitride, boron nitride, aluminum silicon carbide, beryllium oxide, silicon carbide composite, aluminum silicon carbide, copper-tungsten alloy, copper-molybdenum carbide, carbon, diamond, and graphite. Alternatively or additionally, the thermally conductive material may include or be composed of alumina. Particular reference is made to the above-described materials concerning the substrate and the first and second plates.

[0042] In another embodiment, the heat spreader assembly may include n segments and n-1 bends, wherein every two adjacent segments define one of the n-1 bends, and n is selected from the range of 2-10, particularly from the range of 2-6, such as from the range of 2-4. In another embodiment, n ≥ 2, such as n ≥ 3, particularly n ≥ 4. In another embodiment, n ≤ 10, such as n ≤ 6, particularly n ≤ 4, such as n ≤ 3, particularly n = 3, or particularly n = 2.

[0043] Those skilled in the art will understand that the aforementioned type of bends can also be combined in a heat spreader assembly, i.e., the heat spreader assembly can include heat spreader elements defined by two or more heat spreader element portions, wherein the heat spreader element is arranged along the bend, and heat spreader element composed of (single) segments, wherein the heat spreader element is separated from another heat spreader element by the bend, particularly by the bend provided by the bend of the bent substrate.

[0044] In embodiments, the vapor chamber element may further include a bridging element that bridges at least a portion of the first height (H1). The bridging element can provide support for the vapor chamber element, particularly for the chamber. Specifically, in embodiments, the bridging element can connect the first plate and the second plate, thereby improving the stability (or “rigidity”) of the vapor chamber element. In embodiments, the bridging element may particularly include a (supporting) column. In embodiments, the column is solid (i.e., not hollow). In yet other embodiments, the column may be hollow.

[0045] In an embodiment, the bent portion may have a bending radius r. b Especially the inner bending radius, or especially the outer bending radius, where the bending radius r b ≤3mm, such as r b ≤2mm, especially r b ≤1.5mm, such as r b ≤1mm.

[0046] The term "bending radius" in this document may specifically refer to the radius of the circle that most closely approximates the bend. The bend may specifically correspond to at least 10% of the circumference of the circle, such as at least 20%, and particularly at least 45%. In a specific embodiment, the bend may correspond to approximately 25% of the circumference of the circle, i.e., the heat spreader element may be bent at an angle α of approximately 90°. b Bending. In another embodiment, the bend may correspond to approximately 50% of the circumference of the circle, that is, the heat spreader element may be bent at an angle α of approximately 180°. bBending. In particular, bending can exceed, for example, 45°, 90°, or 180°, but other angles are also possible. When bending a plate-like element, the plate can provide an inner bend and an outer bend, wherein the outer bend can have a (slightly) larger bend radius, which depends particularly on the thickness of the plate-like element. Therefore, the bend radius can specifically refer to the inner bend radius. In yet another specific embodiment, the term "bend radius" can specifically refer to the outer bend radius.

[0047] Therefore, in this embodiment, the heat spreader element can be bent at the curved section, wherein the curved section has a bending radius r. b Where the bending radius r b ≤2mm.

[0048] In embodiments, the bridging element can bridge at least 50% of the first height H1, such as at least 70%, particularly at least 90%, including 100%. Specifically, the bridging element can connect the first plate and the second plate, i.e., the first plate and the second plate can be connected (at least) via the bridging element. Thus, the height of the bridging element can be at least 0.5*H1, more particularly at least 0.7*H1, and even more particularly at least about 0.9*H1. In embodiments, the bridging element is a metal bridging element. For example, the bridging element can be a copper element. Alternatively or additionally, the bridging element can be a ceramic bridging element. Alternatively or additionally, the bridging element can be a plastic bridging element. It will be apparent to those skilled in the art that the plastic bridging element will comprise a plastic having a suitable glass transition temperature (for use in a vapor chamber) and will (substantially) not react with the liquid in the vapor chamber. In another embodiment, the bridging element can comprise a (metallic) pillar. Specifically, the pillar can have a cross-sectional shape selected from the group consisting of spheres, plates, and cylinders. However, other shapes are also possible.

[0049] In another embodiment, the bridging element may have an equivalent circular diameter selected from the range of about 0.8 * H1 to H1. The equivalent circular diameter (or ECD) of an irregularly shaped two-dimensional shape is the diameter of a circle with an equivalent area. For example, the equivalent circular diameter of a square with side a is 2 * a * SQRT(l / π). For a circle, the diameter is the same as the equivalent circular diameter. If a circle with diameter D in the xy plane is deformed into any other shape (in the xy plane) without changing its area, the equivalent circular diameter of that shape will be D. However, the cross-section of the bridging element may also have a larger equivalent circular diameter, such as selected from the range of about 0.8 * H1 to H1. In particular, the cross-section of the bridging element may have an equivalent circular diameter equal to or less than about 0.2 * W1, or even more particularly, a maximum of 0.05 * W1.

[0050] In this embodiment, the bridging element is provided by a corrugated element. Therefore, in this embodiment, the vapor chamber may surround elements, such as corrugated elements, which may consist of bridging elements or may consist of bridging elements and connector elements between bridging elements. In a specific embodiment, the bridging element is a connecting element that can form a corrugated structure. The bridging elements can be interconnected. The bridging elements can be configured as a 1D or 2D array.

[0051] In another embodiment, the chamber may include a core structure. Specifically, the chamber, and in particular the core structure, may include a first core structure associated with the first plate, particularly arranged in physical contact with the first plate, and / or a second core structure associated with the second plate, particularly arranged in physical contact with the second plate. In particular, in embodiments, bridging elements may therefore extend from the core structure. For example, in embodiments, the height of the core structure may be a maximum of 0.4*H1, such as a maximum of 0.25*H1. In another embodiment, the core structure may include at least a portion of the bridging elements, i.e., the bridging elements may be at least partially constituted by the core structure.

[0052] In a second aspect, the present invention can also provide a (unbent) heat spreader segment. The heat spreader segment may include at least a portion of a heat spreader element. The heat spreader segment may have a segment thickness d perpendicular to its extension axis (A). s In particular, the average or median thickness. In an embodiment, the heat spreader segment may include a (minimum) thickness d. T The thinning region, where d T ≤0.5*d s , such as d T ≤0.4*d s , especially d T ≤0.3*d s , such as d T ≤0.2*d s , especially d T ≤0.15*d s , such as d T ≤0.1*d s In another embodiment, d T ≥0.01*d s , such as d T ≥0.05*d s , especially d T ≥0.1*d s , such as d T ≥0.15*d s , especially d T ≥0.2*d s , such as d T ≥0.3*d s .

[0053] The vapor chamber segment can be adapted to provide a vapor chamber assembly according to the present invention.

[0054] Specifically, in an embodiment, two or more vapor chamber segments may be combined to provide a vapor chamber assembly. In such an embodiment, the vapor chamber segments may substantially correspond to sections of the vapor chamber assembly.

[0055] In another embodiment, the vapor chamber segment may be bent to provide a vapor chamber assembly. In such an embodiment, the vapor chamber segment may substantially correspond to multiple segments of the vapor chamber assembly.

[0056] In another embodiment, the vapor chamber assembly can be provided by bending and combining vapor chamber segments, such as by bending a first vapor chamber segment (to provide two segments) and connecting the first vapor chamber segment to a second vapor chamber segment (in particular, thereby providing a third segment).

[0057] In an embodiment, the thinning region may be arranged relative to the extension axis (A) at a first end of the heat spreader segment, particularly wherein the heat spreader segment gradually decreases in size toward the first end. This gradual decrease may provide a triangular shape, particularly at the end of the heat spreader segment. Specifically, the heat spreader segment may gradually decrease in size with a cone angle αt, wherein the cone angle is specifically the angle of the apex of the triangular shape at the first end. In an embodiment, the cone angle αt may be selected from the range of 5° to 85°, particularly from the range of 15° to 75°, such as from the range of 30° to 60°.

[0058] In such an embodiment, the heat spreader assembly can be provided by connecting two such heat spreader segments, in particular, the two heat spreader segments gradually decrease in size with the same cone angle.

[0059] In embodiments, at least a portion of the heat spreader segment, particularly the heat spreader element, may include a groove, particularly a V-shaped groove. The groove may be arranged particularly at the thinning region, i.e., the groove may define the (location) of the thinning region.

[0060] In such an embodiment, the heat spreader assembly can be provided by bending the heat spreader segment to close the groove. For example, the heat spreader segment may include: a first plate including a first plate portion, wherein the first plate is composed of a single piece; and a second plate including two second plate portions, wherein the second plate portions are separated by grooves. The heat spreader assembly can then be provided by bending the heat spreader segment to connect (or "adjoin") the second plate portions. For example, the two second plate portions may be welded together after connection.

[0061] Those skilled in the art will appreciate that, in such embodiments, the heat spreader segment can be designed to provide the desired bending angle and bending radius. Specifically, the depth and / or width of the groove can define the achievable bend.

[0062] In one embodiment, the vapor chamber segment may include a plurality of vapor chamber elements arranged sequentially on the substrate along an extension axis (A). In another embodiment, two adjacent vapor chamber elements may be separated by a curved region of the substrate, particularly wherein the curved region has a bending length l along the extension axis (A). b In another embodiment, l b The range is selected from 0.1mm to 40mm. The curved region may particularly include a thinned region. For example, in another embodiment, the curved region may include a groove, particularly a V-shaped groove.

[0063] Specifically, the bending region may not be part of the heat spreader element. Therefore, the thickness of the bending region can be primarily, and especially solely, defined by the thickness of the substrate.

[0064] In another embodiment, the heat spreader segment may include multiple curved regions, such as 2, 3 or 4 curved regions.

[0065] In such an embodiment, the heat spreader assembly can be provided by bending the heat spreader segment at the bending region.

[0066] In another aspect, the present invention can provide a method for providing a heat exchanger assembly from heat exchanger segments. Specifically, the method may include bending the heat exchanger segments and / or connecting multiple heat exchanger segments, particularly bending at least a portion of the heat exchanger segments, or particularly connecting at least a multiple portion of the heat exchanger segments.

[0067] Specifically, the method may include closing a heat spreader element (of one or more heat spreader elements), particularly after bending or joining heat spreader segments. Closing the heat spreader element may leave a single opening for filling the heat spreader with a liquid, particularly a coolant. Therefore, the method may also include filling a heat spreader assembly, particularly one or more heat spreader elements, with a liquid, particularly a coolant. Specifically, the method may include filling the heat spreader element after bending / joining the heat spreader segments, and particularly after closing the heat spreader element (particularly by welding). After filling the heat spreader element, the heat spreader element may be sealed. Therefore, in another embodiment, the method may include sealing the heat spreader element.

[0068] In another aspect, the present invention provides a heat spreader assembly that can be obtained by means of the method of the present invention.

[0069] In another aspect, the present invention provides an apparatus including the heat spreader assembly of the present invention.

[0070] In embodiments, the assembly may further include electronic components. These electronic components may be thermally coupled, particularly directly and physically coupled (i.e., in physical contact) to the vapor chamber assembly. Specifically, the vapor chamber assembly, particularly vapor chamber elements, may be arranged to couple with the electronic components to cool them; that is, the vapor chamber assembly, particularly the vapor chamber elements, may be configured to exchange heat with the electronic components. In embodiments, one or more vapor chamber elements may be disposed on one side of the substrate, and the electronic components may be disposed on the other side of the substrate (in thermal contact with it).

[0071] In particular, the term "thermal contact" can indicate that one element can exchange energy with another element through a thermal process. In embodiments, thermal contact can be achieved between two elements when they are arranged at a distance equal to or less than about 10 μm relative to each other, but larger distances, such as up to 100 μm, are also possible. The shorter the distance, the better the thermal contact. In particular, a distance of 10 μm or less, such as 5 μm or less, is desirable. This distance can be the distance between two corresponding surfaces of the respective elements. This distance can be an average distance. For example, two elements may be physically in contact at one or more locations, such as multiple locations, while at one or more other locations, particularly multiple other locations, the elements are not physically in contact. For example, this might be the case when one or both elements have rough surfaces. Therefore, in embodiments, the average distance between two elements can be 10 μm or less (but larger average distances are also possible, such as up to 100 μm). In embodiments, the two surfaces of the two elements can be held at a distance using one or more distance maintainers.

[0072] In this document, the term "thermal contact" may specifically refer to an arrangement of elements that can provide a thermal conductivity of at least about 10 W / mK, such as at least 20 W / mK, such as at least 50 W / mK. In embodiments, the term "thermal contact" may specifically refer to an arrangement of elements that can provide a thermal conductivity of at least about 150 W / mK, such as at least 170 W / mK, particularly at least 200 W / mK. In embodiments, the term "thermal contact" may specifically refer to an arrangement of elements that can provide a thermal conductivity of at least about 250 W / mK, such as at least 300 W / mK, particularly at least 400 W / mK.

[0073] In this embodiment, the device may include a housing. Specifically, the housing may include a heat spreader assembly, and in particular, electronic components.

[0074] In another embodiment, the interior of the housing may have rounded corners, particularly where the rounded corners are configured to accommodate the curved sections of the vapor chamber assembly. Specifically, the curved sections of the vapor chamber assembly may be arranged to physically contact the rounded corners at the contact interface, particularly where the curved sections and the rounded corners have (substantially) the same radius at the contact interface. Thus, the vapor chamber assembly and the housing can also effectively exchange heat at the corners of the housing. Otherwise, air may be trapped between the housing and the vapor chamber assembly, which could inhibit effective heat exchange at the corners. Furthermore, the rounded corners can provide increased stability to the device because the vapor chamber assembly is spatially constrained in such an embodiment.

[0075] Similarly, in another embodiment, the interior of the housing may have sharp corners, particularly where these corners are configured to accommodate the bends of the vapor chamber assembly. Specifically, the vapor chamber assembly and the sharp corners may have (substantially) the same shape at the contact interface. Thus, the vapor chamber assembly and the housing can also effectively exchange heat at the corners of the housing. Otherwise, air might be trapped between the housing and the vapor chamber assembly, which could inhibit effective heat exchange at the corners. Furthermore, the sharp corners can provide increased stability to the device because, in such an embodiment, the vapor chamber assembly is spatially constrained.

[0076] In another embodiment, the device may include multiple heat spreader assemblies.

[0077] In a specific embodiment, the device may include a light generating device. The light generating device includes one or more light sources. In particular, in an embodiment, the one or more light sources include solid-state light sources. For example, the one or more light sources may include LEDs. The one or more light sources are configured to generate light source light, such as LED light in the embodiment. The light generating device is particularly configured to generate device light, which particularly includes, or is particularly composed of, the light from one or more light sources. In an embodiment, the device light may be white light. The device light may be white light in one or more operating modes of the light generating device if the spectral power distribution of the device light is controllable. The term white light is known to those skilled in the art. It specifically relates to light with a correlated color temperature (CCT) between approximately 2000 and 20000 K, particularly 2700-2000 K, for general illumination, particularly in the range of approximately 2700 K to 6500 K, and for backlighting purposes, particularly in the range of approximately 7000 K to 20000 K, and particularly within approximately 15 SDCM (standard deviation of color matching) of the blackbody track (BBL), particularly within approximately 10 SDCM of the BBL, and even more particularly within approximately 5 SDCM of the BBL. Specifically, the light generating device may include an LED light generating device. For example, the LED light generating device may be physically coupled to a vapor chamber assembly, particularly to a vapor chamber element. In specific embodiments, the light source includes a solid-state LED light source (such as an LED or a laser diode). The term "light source" may also refer to multiple light sources, such as 2-20 (solid-state) LED light sources. Therefore, the term LED may also refer to multiple LEDs.

[0078] In another specific embodiment, the device may include a driver unit comprising a driver that is thermally coupled to the curved vapor chamber element. For example, the driver may be physically coupled to the vapor chamber element.

[0079] Light generating devices may be part of or used in the following: office lighting systems, home application systems, shop lighting systems, residential lighting systems, accent lighting systems, spotlighting systems, theater lighting systems, fiber optic application systems, projection systems, self-emissive display systems, pixelated display systems, segmented display systems, warning sign systems, medical lighting application systems, indicator sign systems, decorative lighting systems, portable systems, automotive applications, greenhouse lighting systems, horticultural lighting, or LCD backlighting. Attached Figure Description

[0080] Embodiments of the invention will now be described by way of example only with reference to the illustrative drawings, wherein corresponding reference numerals denote corresponding parts, and wherein:

[0081] Figure 1A-Figure 1BAn embodiment of a heat spreader assembly and an embodiment of a heat spreader segment are schematically depicted.

[0082] Figures 2A-2C Further embodiments of the heat spreader assembly and heat spreader segment are schematically depicted.

[0083] Figure 3 Another embodiment of the heat spreader assembly and another embodiment of the heat spreader segment are schematically depicted.

[0084] Figure 4 Another embodiment of the heat spreader assembly is schematically depicted.

[0085] Figures 5A-5C An embodiment of a device including a heat spreader assembly is schematically depicted.

[0086] Figure 6 An embodiment of a lighting device and lamp including the device of the present invention is illustrated schematically.

[0087] The diagram is not necessarily to scale. Detailed Implementation

[0088] Figure 1A An embodiment of a heat spreader assembly 1000 is schematically depicted (lower half of the figure). Specifically, the heat spreader assembly 1000 includes two segments 1200 and one or more heat spreader elements 100. For visualization purposes, the two segments 1200 are separated by a hyphen. Specifically, in the depicted embodiment, the heat spreader assembly includes a single heat spreader element 100. Each segment 1200 may include at least a portion of one or more heat spreader elements 100. Here, both segments 1200 each include approximately half of the heat spreader element 1000. Each heat spreader element 100 may include a heat spreader 200 at least partially defined by two parallel plate portions 211, 221. In the depicted embodiment, the two segments 1200 define a bend 1100, wherein the bend 1100 has a bend angle α. b , where 0°≤α b <180°, especially where 5°≤α b ≤135°.

[0089] Therefore, in the depicted embodiment, the two sections 1200 together define at least a portion of one (single) of one or more vapor chamber elements 100. Thus, the vapor chamber element may be a shared vapor chamber element 101, that is, the two sections 1200 together define at least a portion of a shared vapor chamber element 101 among one or more vapor chamber elements 100.

[0090] The heat spreader element 100 may include a heat spreader 200 defined at least partially by two parallel plates 210, 220. Specifically, in embodiments, the heat spreader element 100 may include a first plate 210 and a second plate 220, particularly with the heat spreader 200 located between them. The first plate 210 and the second plate 220 may be arranged, in particular, in parallel. Therefore, in embodiments, the heat spreader may be defined by at least the first plate 210 and the second plate 220, the average distance between which is equal to a first height H1, i.e., the first plate 210 and the second plate 220 may define a first height H1.

[0091] Bending angle α b It can be specifically defined as the angle between the segment planes of two segments, where each segment plane is substantially parallel to the corresponding segment. Specifically, the bending angle α b It can be defined as the angle between the first plate portions 211 and 212 corresponding to the two segments 1200, or the angle between the second plate portions 221 and 222 corresponding to the two segments 1200. Generally, the angle between the first plate portions 211 and 212 can be the same angle as the angle between the second plate portions 221 and 222.

[0092] Therefore, in the embodiment, each of the two segments may include a first (or second) plate portion, wherein the bending angle α b It is the angle between the two first (or second) plate sections.

[0093] In the depicted embodiment, both segments 1200 include a heat spreader element portion 150, wherein the heat spreader element portion 150 gradually decreases in size toward the bend 1100.

[0094] Specifically, the heat spreader 200 is at least partially defined by two plates 210, 220, wherein the first plate 210 of the two plates 210, 220 is composed of a single piece including two first plate portions 211, 212, and wherein the second plate 220 of the two plates 210, 220 includes two second plate portions 221, 222 adjacent at the bend 1100. Furthermore, in the depicted embodiment, each of the first plate portions 211, 212 is configured parallel to one of the second plate portions 221, 222, that is, the first plate portion 211 is configured parallel to the second plate portion 221, and the first plate portion 212 is configured parallel to the second plate portion 222.

[0095] Figure 1A An embodiment of the heat spreader segment 1500 is also schematically depicted. Specifically, the heat spreader segment 1500 may include at least a portion of the heat spreader element 100. The heat spreader segment 150 may have an average segment thickness d perpendicular to the extension axis A. sIn an embodiment, the temperature distribution plate segment 1500 may further include a thickness d. T The thinning region is 1550, where d T ≤0.5*d s .

[0096] Specifically, in the depicted embodiment, the heat spreader segment 1500 includes a groove 10, particularly a V-shaped groove 11.

[0097] Therefore, in the depicted embodiment, the thickness d of the thinned region T Essentially, it can be the thickness d1 of the first plate 210. In another embodiment, the thickness d of the thinned region... T It can be less than the thickness d1, for example, 0.5*d1, or it can be greater than the thickness d1. For example, the groove 10 can extend all the way to the core 105 closest to the first plate 210, such as... Figure 1B As schematically depicted, the core 105 is particularly continuous. In such embodiments, the core 105 may particularly comprise a mesh core.

[0098] Figure 1A The heat spreader assembly 1000 can be made of, in particular, a heat spreader assembly 1000. Figure 1A The temperature distribution plate segment 1500 is provided by bending the temperature distribution plate segment 1500 to close the groove 1500.

[0099] Figure 2A Another embodiment of a heat spreader assembly 1000 is schematically depicted. In the depicted embodiment, the heat spreader assembly 1000 includes a substrate 400. Furthermore, the heat spreader assembly 1000 includes a plurality of heat spreader elements 100 arranged along the substrate length L on the substrate 400, wherein two adjacent heat spreader elements 100 are separated by a bend 1100.

[0100] In this embodiment, two adjacent heat spreader elements 100 may be separated by a curved region 410 of the substrate 400. The curved region 410 may have a curved length l along the substrate length L. b Especially l b Selected from the range of 0.1mm–40mm. Bending length l b This can be especially true of the (shortest) distance between two adjacent heat spreader elements 100 separated by the bend 1100 (before the bend).

[0101] Figure 2AAn embodiment of the heat spreader segment 1500 is also schematically depicted. In the depicted embodiment, the heat spreader segment 1500 includes a plurality of heat spreader elements 100 arranged sequentially on a substrate 400 along an extension axis A. Thus, the plurality of heat spreader elements 100 are arranged in series on the substrate 400 parallel to the extension axis A. Specifically, two adjacent heat spreader elements 100 may be separated by a curved region 410 of the substrate 400, wherein the curved region 410 has a curved length l along the extension axis A. b , where l b Selected from the range of 0.1mm–40mm, and in particular, the curved region 410 includes the thinning region 1550.

[0102] therefore, Figure 2A The heat spreader assembly 1000 can be made of Figure 2A The heat spreader segment 1500 is provided by bending the heat spreader segment 1500 at the bending region 410.

[0103] Figure 2B Another embodiment of the heat spreader segment 1500 is schematically depicted. In the depicted embodiment, the substrate 400 has a thickness d. p Especially the average thickness d p , or especially the median thickness d p The curved region 410 includes a thickness d T The thinning region is 1550, where d p Selected from the range of 0.05mm-2mm, where 0.1≤d T / d p ≤0.9. Therefore, the substrate 400, especially the curved region 410, may include a groove 10 defining the thinning region 1550.

[0104] Furthermore, in the depicted embodiment, the heat spreader element 100 includes a flange 160 for attaching the heat spreader element 100 to the substrate 400. Specifically, each heat spreader element 100 may include a flange 160 at either end of the heat spreader element 100 relative to the substrate length L. Specifically, the flange 160 may be soldered to the substrate 400. Therefore, in such an embodiment, the bending region 410 may be particularly arranged between the flanges 160 of adjacent heat spreader elements 100.

[0105] Figure 2C Another embodiment of the heat spreader assembly 1000 is schematically depicted. In the depicted embodiment, the heat spreader elements 100 are arranged on different sides of the substrate 400. Therefore, in this embodiment, the heat spreader elements 100 may be arranged on opposite sides of the substrate 400.

[0106] In another embodiment, the heat spreader elements 100 may all be arranged on the same side of the substrate 400.

[0107] Figure 3 Another embodiment of the heat spreader assembly 1000 is schematically depicted. In the depicted embodiment, each of at least two segments 1200 includes a heat spreader element portion 150, wherein the heat spreader element portion 150 gradually decreases towards the bend 1100, and wherein the heat spreader element portion 150 defines at least a portion of one or more heat spreader elements 100. In the depicted embodiment, α b ≥45°. Specifically, α b The angle is approximately 90°. Furthermore, in the depicted embodiment, the heat spreader 200 is at least partially defined by two plates 210, 220, wherein the first plate 210 of the two plates 210, 220 includes two first plate portions 211, 212 adjacent at the bend 1100, and wherein the second plate 220 of the two plates 210, 220 includes two second plate portions 221, 222 adjacent at the bend 1100. Furthermore, in the depicted embodiment, each of the first plate portions 211, 212 is configured parallel to one of the second plate portions 221, 222; that is, the first plate portion 211 is configured parallel to the second plate portion 221, and the first plate portion 212 is configured parallel to the second plate portion 222.

[0108] In the depicted embodiment, the heat spreader element 100 is defined by three segments 1200 of the heat spreader assembly 1000.

[0109] In one embodiment, two parallel plates 210, 220 define a heat spreader height H1, wherein the heat spreader 200 includes a bridging element 230 that bridges at least a portion of the heat spreader height H1. In the depicted embodiment, the bridging element 230 may, in particular, have a spherical shape.

[0110] Figure 3 Two embodiments of the heat spreader segment 1500 are also schematically depicted. In the depicted embodiments, the thinning region 1550 is arranged relative to the extension axis A at a first end 110 of the heat spreader segment 500, wherein the heat spreader segment 1500 gradually decreases in size toward the first end 110. The gradual decrease can provide a triangular shape, particularly at the end of the heat spreader segment 1500. Specifically, the heat spreader segment 500 can gradually decrease in size with a cone angle αt, wherein the cone angle αt is particularly the angle of the apex of the triangular shape at the first end 110. In the embodiments, the cone angle αt can be selected from the range of 5° to 85°, particularly from the range of 15° to 75°, such as from the range of 30° to 60°. In the depicted embodiments, the cone angle αt can be about 45°.

[0111] Specifically, in the embodiment depicted on the left, the heat spreader segment 1500 includes two thinning regions 1550, wherein the first thinning region 1500 is arranged relative to the extension axis at a first end 110 of the heat spreader segment 1500, and wherein the second thinning region 1500 is arranged relative to the extension axis at a second end 120 of the heat spreader segment 1500.

[0112] therefore, Figure 3 The heat spreader assembly 1000 can be made of Figure 3 The heat spreader segment 1500 (used twice in the depicted embodiment) is obtained by connecting heat spreader segments 1500. Specifically, the heat spreader segments 500 can be welded together. Figure 3 The heat spreader assembly 1000 provides a heat spreader element 100, wherein two segments 1200 define a bent portion 1100, wherein the bent portion 1100 has a bending angle α. b , where 0°≤α b <180°, especially where 5°≤α b ≤135°. However, the bend 1100 is provided by assembling the heat spreader element portion 150 rather than by bending the heat spreader element (partial). Therefore, in the depicted embodiment, the bend 1100 can be considered to have a bending radius of 0 (see below).

[0113] In the depicted embodiments, the first plate 210 and the second plate 220 may each have a first thickness (d1) and a second thickness (d2) independently selected from the range of 50-5000 μm, such as 100-2000 μm, or for example, 300-20000 μm. The thicknesses of the first plate 210 and the second plate 220, as well as the space between the plates 210 and 220, especially the heat spreader 200, may also substantially define the thickness of the heat spreader element 100. Therefore, in the embodiments, the heat spreader element 100 may have an element thickness d. e , where d e =d1+d2+H l Specifically, the component thickness *de* can be related to the segment thickness *d*. s Basically the same (see below).

[0114] Figure 4 Another embodiment of the heat spreader assembly 1000 is schematically depicted. In the depicted embodiment, the rectangular center segments 1200, 1201 may provide (corresponding) bends for the four other segments 1200. Similarly, the four other segments 1200 may also provide bends for one or more other segments 1200.

[0115] Similarly, the vapor chamber assembly 1000 can be functionally coupled to other components, such as other cooling components, especially at the edges of the vapor chamber assembly 100.

[0116] Figures 5A-5C An embodiment of a device 500 including a heat spreader assembly 1000 is schematically depicted. Specifically, Figures 5A-5C An apparatus 500 is depicted including a (curved) heat spreader assembly 100, wherein the apparatus 500 also includes electronic components 510 thermally coupled (especially physically directly coupled) to the heat spreader assembly 1000.

[0117] Figure 5A An embodiment of device 500 is schematically depicted, wherein device 500 includes a plurality of heat spreader assemblies 1000, particularly two heat spreader assemblies 1000. Specifically, each of the depicted heat spreader assemblies includes n bends 1100, where n = 2. In the depicted embodiment, the bends 1100 have a bending radius r. b Bending, where the bending radius r b ≤2mm. Specifically, the bending radius r b This corresponds to the radius of the circle that matches the circular cross-section defined by the curved section (after the bend). For illustrative purposes, Figure 5A The matching circle is depicted in the image. Therefore, the heat spreader assembly 1000, especially the two segments 1200, can define a curved portion 1100, wherein the curved portion 1100 has a bending radius r. b , especially r b ≤2mm. Specifically, in the depicted embodiment, the bending angle α b It can be approximately 90°.

[0118] Figure 5B An embodiment of a device 500 comprising two individual heat spreader assemblies 1000 is schematically depicted, wherein each heat spreader assembly 1000 includes n bends 1100, where n = 2.

[0119] In the depicted embodiment, device 500 includes a housing 520. The housing may include a vapor chamber assembly 1000 and electronic components 510. Specifically, in the depicted embodiment, the housing 520 has a rounded corner 521 (or: "having a rounded interior corner 521") inside, wherein the curved portion 1100 of the vapor chamber assembly 1000 is arranged to physically contact the rounded corner 521 at a contact interface. In the depicted embodiment, the curved portion and the rounded corner have (substantially) the same radius of curvature at the contact interface, i.e., there is (substantially) no empty space between the housing 520 and the vapor chamber assembly 1000 at the rounded corner 521. Specifically, the rounded corner 521 is configured to accommodate the curved portion 1100 of the vapor chamber assembly 1000 (particularly the vapor chamber assembly 1000 including a substrate 400).

[0120] Similarly, in another embodiment, the interior of the housing may have sharp corners, particularly where the sharp corners are configured to accommodate the bends of the vapor chamber assembly 1000. Specifically, the vapor chamber assembly 1000 and the sharp corners may have (substantially) the same shape at the contact interface. Thus, the vapor chamber assembly 1000 and the housing can also effectively exchange heat at the corners of the housing. Otherwise, air may be trapped between the housing and the vapor chamber assembly 1000, which may inhibit effective heat exchange at the corners. Furthermore, the sharp corners can provide increased stability to the device 500 because, in such an embodiment, the vapor chamber assembly is spatially constrained. Specifically, the sharp corners may be configured to accommodate the bends 1100 of the vapor chamber assembly 1000 (particularly where two segments 1200 together define at least a portion of one or more vapor chamber elements 100).

[0121] Figure 5C An embodiment of device 500 is also schematically depicted, wherein device 500 includes a plurality of heat spreader assemblies 1000, particularly two heat spreader assemblies 1000. Specifically, in this embodiment, the heat spreader assemblies 1000 may be specifically arranged in the areas where the heat-generating elements of device 500 are located.

[0122] Figure 6 An embodiment of a lighting device 2 including a light generating device 550 comprising the aforementioned device 500 is schematically depicted. Reference numeral 300 denotes a control system 300, particularly a control system including a user interface. The control system 300 may be functionally coupled to the light generating device 550. Figure 6 An embodiment of a lamp 1 including a light generating device 500 is also schematically depicted.

[0123] In an embodiment, device 500 may include light generating device 550.

[0124] In another embodiment, device 500 may include a driver unit 530, which includes a driver 531, wherein the driver 531 is thermally coupled to the heat spreader assembly 1000, and particularly to one or more heat spreader elements 100.

[0125] The term "multiple" refers to two or more. Furthermore, the terms "multiple" and "many" are used interchangeably.

[0126] Those skilled in the art will understand the terms “substantially” or “basically” and similar terms used herein. The term “substantially” or “basically” may also include embodiments with terms such as “entire,” “complete,” or “all.” Therefore, in embodiments, the adjectives “substantially” or “basically” may also be omitted. Where applicable, the terms “substantially” or “basically” may also refer to 90% or higher, such as 95% or higher, especially 99% or higher, even more especially 99.5% or higher, encompassing 100%. Furthermore, the terms “about” and “approximately” may also refer to 90% or higher, such as 95% or higher, especially 99% or higher, even more especially 99.5% or higher, encompassing 100%. For numerical values, it should be understood that the terms “substantially,” “basically,” “about,” and “approximately” may also refer to a range of 90%–110% of the value they refer to, such as 95%–105%, especially 99%–101%.

[0127] The term "comprising" also includes embodiments of which "comprising" means "consisting of".

[0128] The term “and / or” specifically refers to one or more items mentioned before and after “and / or”. For example, the phrase “item 1 and / or item 2” and similar phrases may refer to one or more of item 1 and item 2. In one embodiment, the term “comprising” may mean “consisting of”, but in another embodiment it may also mean “containing at least the defined species and optional one or more other species”.

[0129] Furthermore, the terms first, second, third, etc., used in the specification and claims are used to distinguish similar elements and are not necessarily used to describe a sequential or chronological order of occurrence. It should be understood that such terms are interchangeable where appropriate, and the embodiments of the invention described herein can operate in sequences other than those described or illustrated herein.

[0130] During operation, these devices, apparatuses, or systems may be described herein. As will be apparent to those skilled in the art, the invention is not limited to the methods of operation, or the devices, apparatuses, or systems in operation.

[0131] The term "another embodiment" and similar terms may refer to an embodiment that includes features of the previously discussed embodiments, but may also refer to alternative embodiments.

[0132] It should be noted that the above embodiments are illustrative and not limiting of the invention, and those skilled in the art will be able to devise many alternative embodiments without departing from the scope of the appended claims.

[0133] In the claims, any reference symbols placed between parentheses shall not be construed as limiting the claims.

[0134] The use of the verb "including" and its inflections does not exclude the presence of elements or steps that are not stated in the claims. Unless the context explicitly requires otherwise, throughout the specification and claims, the words "including," "comprising," "containing," "containing," etc., should be interpreted in an inclusive rather than exclusive or exhaustive sense; that is, in the sense of "including but not limited to."

[0135] The article "a" or "one" preceding an element does not preclude the existence of multiple such elements.

[0136] This invention can be implemented by hardware comprising several different elements and by a suitably programmed computer. In an apparatus claim, device claim, or system claim that enumerates several devices, several of these devices may be embodied in the same hardware. The fact that certain measures are enumerated in mutually different dependent claims does not mean that a combination of these measures cannot be used advantageously.

[0137] The present invention also provides a control system that can control a device, apparatus, or system, or perform the methods or processes described herein. Furthermore, the present invention provides a computer program product that, when functionally coupled to a device, apparatus, or system, or a computer comprising such device, apparatus, or system, controls one or more controllable elements of the device, apparatus, or system.

[0138] The present invention also applies to devices, apparatuses, or systems that include one or more characterizing features described in the specification and / or shown in the accompanying drawings. The invention also relates to a method or process that includes one or more characterizing features described in the specification and / or shown in the accompanying drawings. Furthermore, if an embodiment of a method or method is described as being performed in a device, apparatus, or system, it will be understood that the device, apparatus, or system is suited to or configured for (performing) an embodiment of the method or method.

[0139] The various aspects discussed in this patent can be combined to provide additional advantages. Furthermore, those skilled in the art will understand that embodiments can be combined, and more than two embodiments can be combined. Additionally, certain features can form the basis for one or more partitioned applications.

Claims

1. A heat spreader assembly (1000), comprising: Two segments (1200) and one or more heat spreader elements (100), wherein each segment (1200) includes at least a portion of the one or more heat spreader elements (100), wherein each heat spreader element (100) includes a heat spreader (200) at least partially defined by two parallel plate portions (211, 221), wherein the two segments (1200) define a bend (1100), wherein the bend (1100) has a bend angle α. b , where α b <180°; - wherein the two segments (1200) together define at least a portion of one of the one or more heat spreader elements (100); and - Each of the two segments (1200) includes a heat spreader element portion (150), wherein the heat spreader element portion (150) gradually decreases in size toward the bend (1100), and wherein the heat spreader element portion (150) defines at least a portion of one of the one or more heat spreader elements (100), and wherein α b ≥45°.

2. The heat spreader assembly according to claim 1, wherein 45° ≤ α b ≤ 135°.

3. The heat spreader assembly (1000) according to any one of the preceding claims, wherein the heat spreader (200) is at least partially defined by two plates (210, 220), wherein the first plate (210) of the two plates (210, 220) is composed of a single piece comprising two first plate portions (211, 212), and wherein the second plate (220) of the two plates (210, 220) comprises two second plate portions (221, 222) adjacent to each other at the bend (1100), wherein each of the first plate portions (211, 212) is configured to be parallel to one of the second plate portions (221, 222).

4. The heat spreader assembly (1000) according to any one of claims 1-2, wherein the two parallel plates (210, 220) define a heat spreader height (H1), wherein the heat spreader (200) includes a bridging element (230) bridging at least a portion of the heat spreader height (H1).

5. The heat spreader assembly (1000) according to any one of claims 1-2, wherein the bending radius (r) of the bent portion (1100) is... b ≤ 2 mm.

6. A heat spreader segment (1500), wherein the heat spreader segment (1500) comprises at least a portion of a heat spreader element (100), wherein the heat spreader segment (1500) has an average segment thickness d perpendicular to an extension axis (A). s The heat spreader segment (1500) includes a thickness d T The thinning region (1550), where d T ≤ 0.3 d s ,in: The heat spreader segment is configured to have a curved portion with a bending angle α. b , where 45°≤α b <180°, and the thinned region provides the curved portion; The thinning region (1550) is disposed at a first end (110) of the heat spreader segment (1500) about the extension axis (A), wherein the heat spreader segment (1500) gradually decreases in size toward the first end (110), wherein the heat spreader segment (1500) is configured to provide a heat spreader assembly by connecting with another heat spreader segment at the first end; or The heat spreader segment (1500) includes a groove (10) that defines the thinning region, wherein the heat spreader segment (1500) is configured to provide a heat spreader assembly by bending the heat spreader segment to close the groove.

7. A heat spreader assembly (1000) comprising one or more heat spreader segments (1500) according to claim 6.

8. The heat spreader assembly of claim 7, wherein the heat spreader assembly comprises two segments and one or more heat spreader elements, wherein each segment comprises at least a portion of the one or more heat spreader elements, wherein each heat spreader element comprises a heat spreader at least partially defined by two parallel plate portions.

9. The heat spreader assembly (1000) according to any one of claims 6 to 7, wherein the bending radius (r) of the bent portion (1100) is... b ≤ 2 mm.

10. A device (500) comprising a heat spreader assembly (1000) according to any one of claims 1 and 7, wherein the device (500) further comprises an electronic component (510) thermally coupled to the heat spreader assembly (1000).

11. The device (500) of claim 10, wherein the device (500) includes a housing (520) having a rounded corner (521) inside, wherein a curved portion (1100) of the heat spreader assembly (1000) is arranged to physically contact the rounded corner at a contact interface, wherein the curved portion (1100) and the rounded corner (521) have the same radius at the contact interface.

12. The device (500) according to claim 10, wherein the device (500) includes a light generating device (550).

13. The device (500) according to claim 10, wherein the device (500) includes a driver unit (530), the driver unit (530) includes a driver (531), wherein the driver (531) is thermally coupled to the heat spreader assembly (1000).

14. A lighting device (2) comprising the device (500) according to any one of claims 10 to 13.

15. The lighting device (2) according to claim 14, wherein the lighting device (2) comprises a lamp (1).

Images