Light source module

Abstract

A light source module includes a circuit substrate, a plurality of light emitting elements, a cover layer, and a plurality of first scattering particles. The plurality of light emitting elements are disposed on the circuit substrate. The cover layer covers the plurality of light emitting elements, and an upper surface of the cover layer has a plurality of recesses that overlap the circuit substrate between the plurality of light emitting elements in a normal projection of the circuit substrate. The plurality of first scattering particles are located within the plurality of recesses.

Description

Technical Field

[0001] This invention relates to a light source module. Background Technology

[0002] As the size of LEDs decreases, the number of LEDs used in a light source module also increases. To reduce costs, current practices involve increasing the spacing between LEDs to reduce the number of LEDs used. However, this increased spacing creates a significant brightness difference between the areas directly above and not directly above the LEDs, resulting in poor light emission uniformity of the light source module. Summary of the Invention

[0003] This invention provides a light source module with improved light emission uniformity.

[0004] An embodiment of the present invention provides a light source module, comprising: a circuit board; a plurality of light-emitting elements disposed on the circuit board; a cover layer covering the plurality of light-emitting elements, wherein the upper surface of the cover layer has a plurality of recesses, wherein the orthographic projection of the plurality of recesses onto the circuit board between the plurality of light-emitting elements overlaps the circuit board; and a first scattering particle located within the plurality of recesses.

[0005] In one embodiment of the present invention, the particle size distribution of the plurality of first scattering particles is proportional to the distance between the orthographic projection of the plurality of first scattering particles onto the circuit substrate and the orthographic projection of the light-emitting element onto the circuit substrate.

[0006] In one embodiment of the present invention, the distribution density of the plurality of first scattering particles is proportional to the distance between the orthographic projection of the plurality of first scattering particles onto the circuit substrate and the orthographic projection of the light-emitting element onto the circuit substrate.

[0007] In one embodiment of the present invention, the above-mentioned recessed portion on the orthogonal projection of the circuit board overlaps with the orthogonal projection of the light-emitting element on the circuit board.

[0008] In one embodiment of the present invention, at least two of the above-mentioned recesses overlap the circuit substrate between adjacent light-emitting elements in the orthographic projection of the circuit substrate.

[0009] In one embodiment of the present invention, the depths of the at least two recesses are respectively proportional to the distance between the at least two recesses and the orthogonal projection of the light-emitting element onto the circuit board.

[0010] In one embodiment of the present invention, the light source module further includes reflective particles located within the recess.

[0011] In one embodiment of the present invention, the light transmittance of the plurality of first scattering particles is greater than the light transmittance of the reflecting particles.

[0012] In one embodiment of the present invention, the distribution density of the reflected particles is inversely proportional to the distance between the orthographic projection of the reflected particles onto the circuit board and the orthographic projection of the light-emitting element onto the circuit board.

[0013] In one embodiment of the present invention, the above-mentioned plurality of recesses also have a plurality of recessed holes.

[0014] In one embodiment of the present invention, the plurality of first scattering particles are located within the plurality of recesses.

[0015] In one embodiment of the present invention, the light source module further includes reflective particles located within a plurality of recesses.

[0016] In one embodiment of the present invention, the depth of the recess is 10% to 100% of the height of the cover layer.

[0017] In one embodiment of the present invention, the maximum width of the recess is 10% to 140% of the spacing between the plurality of light-emitting elements.

[0018] In one embodiment of the present invention, the light source module further includes auxiliary particles located on a circuit board between multiple light-emitting elements.

[0019] In one embodiment of the present invention, the aforementioned cover layer further has a plurality of protrusions located between a plurality of recesses, and the orthographic projections of the plurality of protrusions onto the circuit board overlap the orthographic projections of the plurality of light-emitting elements onto the circuit board.

[0020] In one embodiment of the present invention, the light source module further includes reflective particles located on the protrusion.

[0021] In one embodiment of the present invention, the first recess and the second recess among the above-mentioned plurality of recesses have different cross-sectional shapes.

[0022] In one embodiment of the present invention, the above-mentioned plurality of recesses have an arc-shaped, U-shaped, V-shaped, trapezoidal, rectangular or stepped cross-sectional shape.

[0023] In one embodiment of the present invention, the above-mentioned plurality of recesses have a ring-shaped or mesh-like top view shape.

[0024] To make the above features and advantages of the present invention more apparent and understandable, specific embodiments are described below, and detailed descriptions are provided in conjunction with the accompanying drawings. Attached Figure Description

[0025] Figure 1A This is a partial top view of a light source module 10 according to an embodiment of the present invention.

[0026] Figure 1B It is along Figure 1A A schematic diagram of the cross section line A-A'.

[0027] Figure 2A This is a partial top view of a light source module 20 according to an embodiment of the present invention.

[0028] Figure 2B It is along Figure 2A A schematic diagram of the cross section drawn by section line B-B'.

[0029] Figure 3A This is a partial top view of a light source module 30 according to an embodiment of the present invention.

[0030] Figure 3B It is along Figure 3A A schematic diagram of the cross section line C-C'.

[0031] Figure 4A This is a partial top view of a light source module 40 according to an embodiment of the present invention.

[0032] Figure 4B It is along Figure 4A A schematic diagram of the cross section line D-D'.

[0033] Figure 5A This is a partial top view of a light source module 50 according to an embodiment of the present invention.

[0034] Figure 5B It is along Figure 5A A schematic diagram of the cross section drawn by section line E-E'.

[0035] Figure 6A This is a partial top view of a light source module 60 according to an embodiment of the present invention.

[0036] Figure 6B It is along Figure 6A A schematic diagram of the cross section drawn by the section line F-F'.

[0037] Figure 7A This is a partial top view of a light source module 70 according to an embodiment of the present invention.

[0038] Figure 7B It is along Figure 7A A schematic diagram of the cross section line G-G'.

[0039] Figure 8A This is a partial top view of a light source module 80 according to an embodiment of the present invention.

[0040] Figure 8B It is along Figure 8A A schematic diagram of the cross section line H-H'.

[0041] Figure 9 This is a partial cross-sectional schematic diagram of a light source module 90 according to an embodiment of the present invention.

[0042] Figure 10 This is a partial cross-sectional schematic diagram of a light source module 100A according to an embodiment of the present invention.

[0043] Figure 11 This is a partial cross-sectional schematic diagram of a light source module 100B according to an embodiment of the present invention.

[0044] Figure 12 This is a partial top view of a light source module 100C according to an embodiment of the present invention.

[0045] Figure 13 This is a partial top view of a light source module 100D according to an embodiment of the present invention.

[0046] Figure 14 This is a partial top view of a light source module 100E according to an embodiment of the present invention.

[0047] Figure 15 This is a partial top view of a light source module 100F according to an embodiment of the present invention.

[0048] Explanation of reference numerals in the attached figures:

[0049] 10~90, 100A~100F: Light source module

[0050] 110: Circuit board

[0051] 120, 121, 122: Light-emitting elements

[0052] 130: Overlay

[0053] 140: First scattering particle

[0054] 141, 142: Scattering particles

[0055] 150: Reflecting particles

[0056] 160: Auxiliary Particles

[0057] 170: Reflecting particles

[0058] A-A'~H-H': Section lines

[0059] CT: Center

[0060] D1, D2: Particle size

[0061] Dm, Dn: Maximum depth

[0062] EG: Edge

[0063] F1: Upper surface

[0064] H1: Depth

[0065] H2: Height

[0066] H3: Maximum Depth

[0067] LR: Beam

[0068] PT: convex part

[0069] R1: first recess

[0070] R2: Second recess

[0071] R3: The third recess

[0072] R4: The fourth concave part

[0073] R5: The fifth recess

[0074] R6: Sixth concave part

[0075] R7: The seventh concave part

[0076] R8: The eighth concave part

[0077] RH: concave hole

[0078] RS: concave part

[0079] S1~S10: Spacing

[0080] W1: Spacing

[0081] W2, W3: Width Detailed Implementation

[0082] In the accompanying drawings, the thicknesses of layers, films, panels, regions, etc., are enlarged for clarity. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it may be directly on or connected to the other element, or intermediate elements may also be present. Conversely, when an element is referred to as being "directly on" or "directly connected" to another element, no intermediate elements are present. As used herein, "connection" can refer to a physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" may mean that other elements exist between the two elements.

[0083] It should be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or part from another. Therefore, the first “element,” “component,” “region,” “layer,” or “part” discussed below may be referred to as a second element, component, region, layer, or part without departing from the teachings of this document.

[0084] The terminology used herein is for the purpose of describing particular embodiments only and is not restrictive. As used herein, unless the content clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to include the plural forms, including “at least one” or denoteing “and / or.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. It should also be understood that, when used in this specification, the terms “comprising” and / or “including” specify the presence of the stated features, areas, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, areas, integrals, steps, operations, elements, components, and / or combinations thereof.

[0085] Furthermore, relative terms such as “down” or “bottom” and “up” or “top” may be used herein to describe the relationship between one element and another, as illustrated in the figures. It should be understood that relative terms are intended to include different orientations of the device beyond those shown in the figures. For example, if a device in one figure is flipped, an element described as being “down” to other elements will be oriented “up” to other elements. Thus, the exemplary term “down” can include both “down” and “up” orientations, depending on the specific orientation of the figure. Similarly, if a device in one figure is flipped, an element described as being “down” or “below” to other elements will be oriented “above” to other elements. Thus, the exemplary terms “down” or “below” can include both “up” and “down” orientations.

[0086] Given the specific number of measurements discussed and the associated errors (i.e., limitations of the measurement system), the terms "about," "approximately," or "substantially" as used herein include the value and the average value within an acceptable range of deviations from the specific value as determined by one of ordinary skill in the art. For example, "about" may mean within one or more standard deviations of the value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the terms "about," "approximately," or "substantially" as used herein may be chosen based on the optical, etched, or other properties to select a more acceptable range of deviations or standard deviations, rather than applying a single standard deviation to all properties.

[0087] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology and this invention, and will not be interpreted as having idealized or overly formal meanings unless expressly defined herein.

[0088] This document describes exemplary embodiments with reference to cross-sectional views, which are schematic diagrams of idealized embodiments. Therefore, variations in shape as a result of, for example, manufacturing techniques and / or tolerances, are expected in the illustrations. Consequently, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but rather include, for example, shape deviations caused by manufacturing processes. For example, regions shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, the acute angles shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to show the precise shapes of the regions, nor are they intended to limit the scope of the claims.

[0089] Figure 1A This is a partial top view of a light source module 10 according to an embodiment of the present invention. Figure 1B It is along Figure 1A A schematic diagram of the cross-section along section line A-A'. Please also refer to... Figure 1A and Figure 1B The light source module 10 includes: a circuit board 110; a plurality of light-emitting elements 120 disposed on the circuit board 110; a cover layer 130 covering the plurality of light-emitting elements 120, and the upper surface F1 of the cover layer 130 has a plurality of recesses RS, wherein the orthographic projection of the recesses RS onto the circuit board 110 between the plurality of light-emitting elements 120; and a first scattering particle 140 located within the plurality of recesses RS.

[0090] In a light source module 10 of an embodiment of the present invention, the light output distribution of the light source module 10 is adjusted by the recess RS and the first scattering particles 140 in the recess RS, which can improve the light emission uniformity of the light source module 10.

[0091] The following, in conjunction with Figures 1A to 1B The implementation of the various components of the light source module 10 will be described further, but the present invention is not limited thereto. Furthermore, the light source module 10 can be a direct-lit light source module or a side-lit light source module.

[0092] In this embodiment, the circuit board 110 can be a transparent substrate or a non-transparent substrate, and its material can be a polymer substrate, an alloy substrate, or other suitable materials, but the present invention is not limited thereto. In some embodiments, the circuit board 110 may include the components or lines required by the light source module 10, such as microcontroller chips, switching elements, power lines, detection signal lines, grounding lines, etc.

[0093] The light-emitting element 120 can be electrically connected to the circuit board 110. For example, the light-emitting element 120 can receive signals from a microcontroller chip on the circuit board 110 to turn on or off. The light-emitting element 120 can be a light-emitting diode (LED), such as a mini-LED, micro-LED, or other types of LED, but the invention is not limited thereto. In some embodiments, the light-emitting element 120 can be arranged in an array on the circuit board 110, but the invention is not limited thereto. In some embodiments, the light-emitting element 120 can be arranged on the circuit board 110 in other regular or irregular arrangements.

[0094] The cover layer 130 can be formed on the light-emitting elements 120 and the circuit board 110, and the cover layer 130 can completely cover the multiple light-emitting elements 120 and the surface of the circuit board 110 between the multiple light-emitting elements 120 that is not covered by the light-emitting elements 120. The material of the cover layer 130 may include resin, such as silicone resin, epoxy resin, acrylic, polycarbonate (PC), etc., but the present invention is not limited thereto.

[0095] In this embodiment, the recess RS can be a groove formed by recessing from the upper surface F1 of the cover layer 130, and the orthographic projection of the recess RS onto the circuit board 110 can be outside the orthographic projection of the light-emitting element 120 onto the circuit board 110. In some embodiments, the depth H1 of the recess RS can be 10% to 100% of the height H2 of the cover layer 130, for example, 20%, 50%, or 90%, but the present invention is not limited thereto. Since the distance between the recess RS formed after recessing from the upper surface F1 and the circuit board 110 is smaller than the distance between the upper surface F1 and the circuit board 110, the light emission of the light source module 10 from the recess RS can be increased.

[0096] In this embodiment, the recess RS has an arc-shaped cross-sectional shape, but the invention is not limited thereto. In some embodiments, the recess RS may have other suitable cross-sectional shapes, such as U-shaped, V-shaped, trapezoidal, rectangular, or stepped. In some embodiments, adjacent recess RS are not connected to each other. In some embodiments, adjacent recess RS may be connected to each other.

[0097] Relative to the concave contour of the recessed portion RS, multiple protrusions PT can exist between the recessed portions RS, and the orthographic projections of the protrusions PT onto the circuit board 110 can respectively overlap the orthographic projections of the light-emitting element 120 onto the circuit board 110. In this embodiment, the surface of the protrusion PT is the upper surface F1 of the cover layer 130, the protrusion PT has a generally flat surface, and the protrusion PT has an elliptical top view shape, but the present invention is not limited thereto. In some embodiments, the protrusion PT may have other suitable top view shapes, such as circular, polygonal, or star-shaped. In some embodiments, the surface of the protrusion PT may not be flat, and the protrusion PT may also have other suitable cross-sectional shapes.

[0098] In this embodiment, the first scattering particles 140 can have a uniform particle size, and the first scattering particles 140 can be uniformly disposed within multiple recesses RS. The material of the first scattering particles 140 can include organic polymer light-transmitting materials or inorganic light-transmitting materials, such as polyvinyl chloride (PVC), polycarbonate (PC), polyethylene (PE), silicon dioxide (SiO2), or titanium dioxide (TiO2), but is not limited thereto. The first scattering particles 140 can change the light emission path of the light-emitting element 120, thereby improving the light emission uniformity of the light source module 10.

[0099] The following uses Figures 2A to 15 Further embodiments of the present invention will be described, and the following will be used... Figures 1A to 1B The component designations and related content of the embodiments are as follows, wherein the same designations are used to represent the same or similar components, and descriptions of identical technical content are omitted. For explanations of the omitted parts, please refer to... Figures 1A to 1B The embodiments described below will not be repeated.

[0100] Figure 2A This is a partial top view of a light source module 20 according to an embodiment of the present invention. Figure 2B It is along Figure 2A A schematic diagram of the cross-section along section line B-B'. Please also refer to... Figure 2A and Figure 2B The light source module 20 includes: a circuit board 110, multiple light-emitting elements 120, a cover layer 130, and a first scattering particle 140. The cover layer 130 has multiple recesses RS, and the first scattering particle 140 is located in the multiple recesses RS.

[0101] With Figures 1A to 1B Compared to the light source module 10 shown, Figure 2A and Figure 2B The main difference of the light source module 20 shown is that the particle size distribution of the first scattering particle 140 of the light source module 20 is proportional to the distance between the orthographic projection of the first scattering particle 140 onto the circuit board 110 and the orthographic projection of the light-emitting element 120 onto the circuit board 110.

[0102] For example, in this embodiment, the first scattering particle 140 may include scattering particle 141 and scattering particle 142. The particle size D1 of scattering particle 141 is smaller than the particle size D2 of scattering particle 142, and the distance S1 between the orthographic projection of scattering particle 141 onto the circuit substrate 110 and the orthographic projection of light-emitting element 120 onto the circuit substrate 110 is smaller than the distance S2 between the orthographic projection of scattering particle 142 onto the circuit substrate 110 and the orthographic projection of light-emitting element 120 onto the circuit substrate 110. That is, scattering particle 142, which has a larger horizontal distance from light-emitting element 120, can have a larger particle size. Since the larger particle size of scattering particle 142 has an enhanced light emission effect, the light emission amount of light source module 20 at a greater horizontal distance from light-emitting element 120 can be further increased.

[0103] Figure 3A This is a partial top view of a light source module 30 according to an embodiment of the present invention. Figure 3B It is along Figure 3A A schematic diagram of the cross-section along section line C-C'. Please also refer to... Figure 3A and Figure 3B The light source module 30 includes: a circuit board 110, multiple light-emitting elements 120, a cover layer 130, and a first scattering particle 140. The cover layer 130 has multiple recesses RS, and the first scattering particle 140 is located in the multiple recesses RS.

[0104] With Figures 1A to 1B Compared to the light source module 10 shown, Figure 3A and Figure 3B The main difference of the light source module 30 shown is that the light source module 30 also includes reflective particles 150, and the reflective particles 150 are located in the recess RS.

[0105] In this embodiment, the light transmittance of the first scattering particle 140 can be from 10% to 100%, and the reflectance of the reflecting particle 150 can be from 10% to 100%. In some embodiments, the light transmittance of the first scattering particle 140 can be greater than the light transmittance of the reflecting particle 150. For example, the light transmittance of the first scattering particle 140 can be greater than or equal to 50%, and the light transmittance of the reflecting particle 150 can be less than 50%. The material of the reflecting particle 150 can include organic polymer light-transmitting materials and / or opaque metals. Organic polymer light-transmitting materials include, for example, polyvinyl chloride (PVC), polycarbonate (PC), or polyethylene (PE), and opaque metals include, for example, aluminum or silver, but are not limited thereto. The reflecting particle 150 can change the light emission path of the light-emitting element 120, thereby locally reducing the amount of light emitted by the light-emitting element 120.

[0106] In some embodiments, the distribution density (or sparseness) of the reflective particles 150 can be inversely proportional to the distance between the orthographic projection of the reflective particles 150 onto the circuit substrate 110 and the orthographic projection of the light-emitting element 120 onto the circuit substrate 110. In other words, the reflective particles 150 can have a larger distribution density at a horizontal distance closer to the light-emitting element 120, and a smaller distribution density at a horizontal distance farther from the light-emitting element 120. For example, in some embodiments, the reflective particles 150 can be distributed only around the protrusion PT, and no reflective particles 150 can be provided at a horizontal distance farther from the light-emitting element 120. In this way, the reflective particles 150 help reduce the amount of light emitted in the region above the light-emitting element 120.

[0107] In some embodiments, the distribution density of the first scattering particles 140 may be proportional to the distance between the orthographic projection of the first scattering particles 140 onto the circuit substrate 110 and the orthographic projection of the light-emitting element 120 onto the circuit substrate 110. In other words, the first scattering particles 140 may have a smaller distribution density at a horizontal distance closer to the light-emitting element 120, and a larger distribution density at a horizontal distance farther from the light-emitting element 120. For example, in some embodiments, the first scattering particles 140 may be distributed only in the area above the non-light-emitting element 120, and the area above the light-emitting element 120 (e.g., the protrusion PT and its surrounding area) may not have the first scattering particles 140. In this way, the first scattering particles 140 help increase the light output of the area above the non-light-emitting element 120.

[0108] In some embodiments, the maximum depth H3 of the recess RS can be approximately equal to or equal to the height H2 of the cover layer 130, so that the recess RS has an approximately U-shaped cross-sectional shape, and the reflective particles 150 can be distributed on the upper half of the sidewall of the recess RS, and the first scattering particles 140 can be distributed on the lower half of the sidewall of the recess RS. In this way, the light emission of the light source module 30 in the area directly above the light-emitting element 120 can be reduced by the reflective particles 150, and the light emission of the light source module 30 in the area not directly above the light-emitting element 120 can be increased by the first scattering particles 140, thereby improving the light emission uniformity of the light source module 30.

[0109] Figure 4A This is a partial top view of a light source module 40 according to an embodiment of the present invention. Figure 4B It is along Figure 4A A schematic diagram of the cross-section along section line D-D'. Please also refer to... Figure 4A and Figure 4BThe light source module 40 includes: a circuit board 110, multiple light-emitting elements 120, a cover layer 130, and a first scattering particle 140. The cover layer 130 has multiple recesses RS, and the first scattering particle 140 is located in the multiple recesses RS.

[0110] With Figures 3A to 3B Compared to the light source module 30 shown, Figure 4A and Figure 4B The main difference of the light source module 40 shown is that the recess RS of the light source module 40 has a trapezoidal cross-sectional shape that is wider at the top and narrower at the bottom; and the recess RS overlaps the orthographic projection of the light-emitting element 120 on the circuit board 110.

[0111] For example, in this embodiment, the light-emitting elements 120 may have a spacing W1, the upper bottom of the recess RS may have a width W2, and the lower bottom of the recess RS may have a width W3, where width W3 < spacing W1 < width W2. Thus, a portion of the sidewall of the recess RS may be located directly above the light-emitting elements 120. In some embodiments, the maximum width W2 of the recess RS may be 10% to 140% of the spacing between the light-emitting elements 120.

[0112] In some embodiments, the reflective particles 150 may be located on the upper half of the sidewall of the recess RS, and the scattering particles 140 may be located on the lower half of the sidewall of the recess RS and the bottom surface of the recess RS. In this way, the reflective particles 150 can be located directly above the light-emitting element 120, thereby reducing the light emission in the area directly above the light-emitting element 120, and the scattering particles 140 can increase the light emission in areas not directly above the light-emitting element 120, thereby improving the overall light emission uniformity of the light source module 40. In some embodiments, the depth of the recess RS is less than the height of the cover layer 130, such that the cover layer 130 is also present between the scattering particles 140 located on the bottom surface of the recess RS and the circuit board 110.

[0113] Figure 5A This is a partial top view of a light source module 50 according to an embodiment of the present invention. Figure 5B It is along Figure 5A A schematic diagram of the cross-section along section line E-E'. Please also refer to... Figure 5A and Figure 5B The light source module 50 includes: a circuit board 110, multiple light-emitting elements 120, a cover layer 130, a first scattering particle 140 and a reflective particle 150. The cover layer 130 has multiple recesses RS, and the first scattering particle 140 and the reflective particle 150 are located in the multiple recesses RS.

[0114] With Figures 3A to 3B Compared to the light source module 30 shown, Figure 5A and Figure 5BThe main difference in the light source module 50 shown is that the cover layer 130 of the light source module 50 has recesses RS with various cross-sectional shapes. For example, in this embodiment, the recesses RS may include a first recess R1, a second recess R2, and a third recess R3, and the cross-sectional shapes of the first recess R1 and the second recess R2 are different. For example, the first recess R1 may have an arc-shaped cross-sectional shape, and the second recess R2 and the third recess R3 may have a V-shaped cross-sectional shape.

[0115] In some embodiments, the second recess R2 has a maximum depth at its center CT and a minimum depth at its edge EG. In the direction along the center CT to the edge EG, as the distance between the recess RS and the light-emitting element 120 decreases, the depth of the recess RS also decreases. In other words, the depth at each point in the recess RS can be proportional to the distance between each point in the recess RS and the light-emitting element 120.

[0116] In some embodiments, the maximum depth Dm of the second recess R2 is greater than the maximum depth Dn of the third recess R3, enabling the second recess R2 to provide more compensated light output than the third recess R3. Therefore, the second recess R2 can be disposed in the peripheral region of the light source module 50, and the third recess R3 can be disposed in the central region of the light source module 50, so that the brightness of the peripheral region and the central region of the light source module 50 is similar or the same. In other words, the depth of each recess RS can be proportional to the distance between each recess RS and the center of the light source module 50.

[0117] Figure 6A This is a partial top view of a light source module 60 according to an embodiment of the present invention. Figure 6B It is along Figure 6A A schematic diagram of the cross-section along section line F-F'. Please also refer to... Figure 6A and Figure 6B The light source module 60 includes: a circuit board 110, multiple light-emitting elements 120, a cover layer 130, a first scattering particle 140 and a reflective particle 150. The cover layer 130 has multiple recesses RS, and the first scattering particle 140 and the reflective particle 150 are located in the multiple recesses RS.

[0118] With Figures 3A to 3B Compared to the light source module 30 shown, Figure 6A and Figure 6B The main difference of the light source module 60 shown is that the recess RS of the cover layer 130 of the light source module 60 also has multiple recessed holes RH, and the recessed holes RH can be formed by recessing from the upper surface of the cover layer 130 within the recess RS. Therefore, generally speaking, the radius of curvature of the recessed holes RH will be smaller than the radius of curvature of the recess RS.

[0119] In some embodiments, the first scattering particle 140 may be located within the recessed aperture RH, and therefore the particle size of the first scattering particle 140 may be smaller than the aperture of the recessed aperture RH. In some embodiments, the reflecting particle 150 may be located within the recessed aperture RH, and therefore the particle size of the reflecting particle 150 may be smaller than the aperture of the recessed aperture RH. In some embodiments, the distance S3 between the orthographic projection of the reflecting particle 150 within the recessed aperture RH onto the circuit substrate 110 and the orthographic projection of the light-emitting element 120 onto the circuit substrate 110 may be smaller than the distance S4 between the orthographic projection of the first scattering particle 140 within the recessed aperture RH onto the circuit substrate 110 and the orthographic projection of the light-emitting element 120 onto the circuit substrate 110.

[0120] Figure 7A This is a partial top view of a light source module 70 according to an embodiment of the present invention. Figure 7B It is along Figure 7A A schematic diagram of the cross-section along section line G-G'. Please also refer to... Figure 7A and Figure 7B The light source module 70 includes: a circuit board 110, multiple light-emitting elements 120, a cover layer 130, a first scattering particle 140 and a reflective particle 150. The cover layer 130 has multiple recesses RS, and the first scattering particle 140 and the reflective particle 150 are located in the multiple recesses RS.

[0121] With Figures 3A to 3B Compared to the light source module 30 shown, Figure 7A and Figure 7B The main difference of the light source module 70 shown is that at least two of the recesses RS in the cover layer 130 of the light source module 70 overlap the circuit board 110 between adjacent light-emitting elements 120 with the orthographic projection of the recesses RS.

[0122] For example, in this embodiment, the light-emitting element 120 may include adjacent light-emitting elements 121 and 122, and the recess RS may include a fourth recess R4, a fifth recess R5 and a sixth recess R6, and a portion of the fourth recess R4, a portion of the fifth recess R5 and a portion of the sixth recess R6 may be located between adjacent light-emitting elements 121 and 122.

[0123] In some embodiments, please refer to Figure 7AThe partial top view of the light source module 70 shows that both the fourth recess R4 and the sixth recess R6 have annular top-view shapes, and the fourth recess R4 can surround the light-emitting element 121, while the sixth recess R6 can surround the light-emitting element 122. Additionally, the fifth recess R5 can have a mesh-like top-view shape, and both the fourth recess R4 and the sixth recess R6 are located within the mesh of the fifth recess R5. In this embodiment, the top-view shape of the fifth recess R5 presents a square mesh, but the invention is not limited thereto. In some embodiments, the top-view shape of the fifth recess R5 can present a polygonal mesh.

[0124] In some embodiments, the distance S5 between the orthographic projection of the fourth recess R4 onto the circuit board 110 and the orthographic projection of the light-emitting element 121 onto the circuit board 110 is smaller than the distance S6 between the orthographic projection of the fifth recess R5 onto the circuit board 110 and the orthographic projection of the light-emitting element 121 onto the circuit board 110, and the distance S7 between the orthographic projection of the sixth recess R6 onto the circuit board 110 and the orthographic projection of the light-emitting element 122 onto the circuit board 110 is smaller than the distance S8 between the orthographic projection of the fifth recess R5 onto the circuit board 110 and the orthographic projection of the light-emitting element 122 onto the circuit board 110, and the depth of the fourth recess R4 is smaller than the depth of the fifth recess R5, and the depth of the sixth recess R6 is smaller than the depth of the fifth recess R5. In other words, as the horizontal distance between the recess and the light-emitting element 120 increases, the fifth recess R5 can have a larger depth. Therefore, the depths of the fourth recess R4, the fifth recess R5, and the sixth recess R6 can be proportional to their respective distances from the orthographic projections of the light-emitting element 120 onto the circuit board 110.

[0125] In some embodiments, the reflecting particles 150 may be disposed in the fourth recess R4 and the sixth recess R6, and the first scattering particles 140 may be disposed in the fifth recess R5, but the present invention is not limited thereto.

[0126] Figure 8A This is a partial top view of a light source module 80 according to an embodiment of the present invention. Figure 8B It is along Figure 8A A schematic diagram of the cross-section drawn along section line H-H'. Please also refer to... Figure 8A and Figure 8B The light source module 80 includes: a circuit board 110, multiple light-emitting elements 120, a cover layer 130, a first scattering particle 140 and a reflective particle 150. The cover layer 130 has multiple recesses RS, and the first scattering particle 140 and the reflective particle 150 are located in the multiple recesses RS.

[0127] With Figures 7A to 7B Compared to the light source module 70 shown, Figure 8A and Figure 8BThe main difference in the light source module 80 shown is that the recess RS of the cover layer 130 of the light source module 80 may include a seventh recess R7 and an eighth recess R8, and the orthographic projection of the seventh recess R7 onto the circuit board 110 may be located between the orthographic projection of the light-emitting element 120 onto the circuit board 110 and the orthographic projection of the eighth recess R8 onto the circuit board 110. In some embodiments, the seventh recess R7 or the eighth recess R8 may be composed of a plurality of grooves that are not interconnected with each other. In some embodiments, the recess RS may include an annular seventh recess R7 and an annular eighth recess R8, the seventh recess R7 may surround the light-emitting element 120, the eighth recess R8 may surround the seventh recess R7, and a portion of the seventh recess R7 and a portion of the eighth recess R8 may be located between adjacent light-emitting elements 120. In some embodiments, the seventh recess R7 and the eighth recess R8 may be closed annular grooves.

[0128] In some embodiments, the reflecting particles 150 may be disposed within the seventh recess R7, and the first scattering particles 140 may be disposed within the eighth recess R8, but the invention is not limited thereto. In some embodiments, the first scattering particles 140 may be disposed within the seventh recess R7, and the reflecting particles 150 may be disposed within the eighth recess R8. In other embodiments, both the first scattering particles 140 and the reflecting particles 150 may be disposed within the seventh recess R7 and the eighth recess R8, but the number of first scattering particles 140 within the seventh recess R7 is less than the number of reflecting particles 150, and the number of first scattering particles 140 within the eighth recess R8 is greater than the number of reflecting particles 150.

[0129] Figure 9 This is a partial cross-sectional schematic diagram of a light source module 90 according to an embodiment of the present invention. The light source module 90 includes: a circuit board 110, a plurality of light-emitting elements 120, a cover layer 130, and a first scattering particle 140. The cover layer 130 has a plurality of recesses RS and a plurality of protrusions PT, and the first scattering particle 140 is located in the plurality of recesses RS.

[0130] With Figures 1A to 1B Compared to the light source module 10 shown, Figure 9 The main difference of the light source module 90 shown is that the recess RS of the cover layer 130 of the light source module 90 can have a rectangular cross-sectional shape, and the light source module 90 also includes auxiliary particles 160, which can be located on the circuit board 110 between the light-emitting elements 120. The material and properties of the auxiliary particles 160 can be similar to those of the reflective particles 150, and will not be described in detail here.

[0131] In some embodiments, the light source module 90 may further include a plurality of reflective particles 170, which may be located on the protrusion PT, such that a portion of the light beam LR emitted by the light-emitting element 120 can be reflected by the reflective particles 170 to the auxiliary particles 160, and then scattered by the auxiliary particles 160 and the first scattering particles 140 before being emitted from the concave portion RS. The material and properties of the reflective particles 170 may be similar to those of the reflective particles 150, and will not be described in detail here. In this way, the light emission amount of the protrusion PT can be slightly reduced, while the light emission amount of the concave portion RS can be slightly increased, thereby improving the light emission uniformity of the light source module 90.

[0132] Figure 10 This is a partial cross-sectional schematic diagram of a light source module 100A according to an embodiment of the present invention. The light source module 100A includes: a circuit board 110, a plurality of light-emitting elements 120, a cover layer 130, and first scattering particles 140. The cover layer 130 has a plurality of recesses RS, and the first scattering particles 140 are located within the plurality of recesses RS. Figure 9 Compared to the light source module 90 shown, Figure 10 The main difference of the light source module 100B shown is that the recess RS of the cover layer 130 of the light source module 100B also has multiple recessed holes RH. In some embodiments, the first scattering particle 140 may be located within the recessed hole RH. In some embodiments, the light source module 100A also includes a reflecting particle 150, which may be located within the recessed hole RH, and the distance between the orthographic projection of the reflecting particle 150 onto the circuit board 110 and the orthographic projection of the light-emitting element 120 onto the circuit board 110 is smaller than the distance between the orthographic projection of the first scattering particle 140 onto the circuit board 110 and the orthographic projection of the light-emitting element 120 onto the circuit board 110. For example, the distance S9 between the orthographic projection S9 of the recessed hole RH containing the reflecting particle 150 onto the circuit board 110 and the orthographic projection S10 of the light-emitting element 120 onto the circuit board 110 may be smaller than the distance S10 between the orthographic projection S10 of the recessed hole RH containing the first scattering particle 140 onto the circuit board 110 and the orthographic projection S10 of the light-emitting element 120 onto the circuit board 110.

[0133] Figure 11 This is a partial cross-sectional schematic diagram of a light source module 100B according to an embodiment of the present invention. The light source module 100B includes: a circuit board 110, a plurality of light-emitting elements 120, a cover layer 130, and first scattering particles 140. The cover layer 130 has a plurality of recesses RS, and the first scattering particles 140 are located within the plurality of recesses RS. Figures 1A to 1B Compared to the light source module 10 shown, Figure 11 The main difference of the light source module 100B shown is that the recess RS of the cover layer 130 of the light source module 100B has a stepped cross-sectional shape.

[0134] Figure 12 This is a partial top view of a light source module 100C according to an embodiment of the present invention. The light source module 100C includes: a circuit board 110, a plurality of light-emitting elements 120, a cover layer 130, and first scattering particles 140. The cover layer 130 has a plurality of recesses RS and a plurality of protrusions PT, and the first scattering particles 140 are located within the plurality of recesses RS. Figures 1A to 1B Compared to the light source module 10 shown, Figure 12 The main difference of the light source module 100C shown is that the protrusion PT of the cover layer 130 of the light source module 100C has a circular top view shape.

[0135] Figure 13 This is a partial top view of a light source module 100D according to an embodiment of the present invention. The light source module 100D includes: a circuit board 110, a plurality of light-emitting elements 120, a cover layer 130, and first scattering particles 140. The cover layer 130 has a plurality of recesses RS and a plurality of protrusions PT, and the first scattering particles 140 are located within the plurality of recesses RS. Figures 1A to 1B Compared to the light source module 10 shown, Figure 13 The main difference of the light source module 100D shown is that the protrusion PT of the cover layer 130 of the light source module 100D has a star-shaped top view.

[0136] Figure 14 This is a partial top view of a light source module 100E according to an embodiment of the present invention. The light source module 100E includes: a circuit board 110, a plurality of light-emitting elements 120, a cover layer 130, and first scattering particles 140. The cover layer 130 has a plurality of recesses RS and a plurality of protrusions PT, and the first scattering particles 140 are located within the plurality of recesses RS. Figures 1A to 1B Compared to the light source module 10 shown, Figure 14 The main difference of the light source module 100E shown is that the protrusion PT of the cover layer 130 of the light source module 100E has a polygonal top view shape, for example, the protrusion PT can have a rectangular top view shape.

[0137] Figure 15 This is a partial top view of a light source module 100F according to an embodiment of the present invention. The light source module 100F includes: a circuit board 110, a plurality of light-emitting elements 120, a cover layer 130, and first scattering particles 140. The cover layer 130 has a plurality of recesses RS and a plurality of protrusions PT, and the first scattering particles 140 are located within the plurality of recesses RS. Figures 1A to 1B Compared to the light source module 10 shown, Figure 15 The main difference of the light source module 100F shown is that the protrusion PT of the cover layer 130 of the light source module 100F has a regular polygonal top view shape, for example, the protrusion PT can have an equilateral triangle top view shape.

[0138] In summary, the light source module of the present invention can adjust the light emission distribution by providing a recess in the cover layer and arranging first scattering particles within the recess. Furthermore, the light source module of the present invention can locally fine-tune the light emission distribution of the light source module by appropriately changing the particle size distribution and / or distribution density of the first scattering particles, or by appropriately changing the shape, depth, and / or number of the recess, or by arranging reflective particles within the recess and / or on the protrusion, or by arranging auxiliary particles within the cover layer, thereby enabling the light source module to have ideal light emission uniformity.

[0139] Although the present invention has been disclosed above with reference to embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some changes and modifications without departing from the concept and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the claims.

Claims

1. A light source module, comprising: Circuit board; Multiple light-emitting elements are disposed on the circuit board; A cover layer covers the plurality of light-emitting elements, and the upper surface of the cover layer has a plurality of recesses, the plurality of recesses including a first recess and a second recess, wherein the orthographic projection of the first recess onto the circuit substrate is located between the orthographic projection of the light-emitting element onto the circuit substrate and the orthographic projection of the second recess onto the circuit substrate, wherein the orthographic projections of the plurality of recesses onto the circuit substrate overlap the circuit substrate between the plurality of light-emitting elements. as well as Multiple first scattering particles are located within the multiple recesses. The light source module also includes reflective particles, which are located within the recess. The number of reflective particles in the first recess near the light-emitting element is greater than the number of first scattering particles, and the number of first scattering particles in the second recess is greater than the number of reflective particles.

2. The light source module as claimed in claim 1, wherein the particle size distribution of the plurality of first scattering particles is proportional to the distance between the orthographic projection of the plurality of first scattering particles onto the circuit substrate and the orthographic projection of the light-emitting element onto the circuit substrate.

3. The light source module as claimed in claim 1, wherein the distribution density of the plurality of first scattering particles is proportional to the distance between the orthographic projection of the plurality of first scattering particles onto the circuit substrate and the orthographic projection of the light-emitting element onto the circuit substrate.

4. The light source module as claimed in claim 1, wherein the orthographic projection of the recess onto the circuit board overlaps the orthographic projection of the light-emitting element onto the circuit board.

5. The light source module of claim 1, wherein the first recess and the second recess overlap the circuit substrate between adjacent light-emitting elements in their orthogonal projections onto the circuit substrate.

6. The light source module of claim 5, wherein the depths of the first recess and the second recess are respectively proportional to the distance between the first recess and the second recess and the orthographic projection of the light-emitting element onto the circuit board.

7. The light source module as claimed in claim 1, wherein the light transmittance of the plurality of first scattering particles is greater than the light transmittance of the reflecting particles.

8. The light source module of claim 1, wherein the distribution density of the reflected particles is inversely proportional to the distance between the orthographic projection of the reflected particles onto the circuit substrate and the orthographic projection of the light-emitting element onto the circuit substrate.

9. The light source module as claimed in claim 1, wherein the plurality of recesses further have a plurality of recessed holes.

10. The light source module of claim 9, wherein the plurality of first scattering particles are located within the plurality of recesses.

11. The light source module of claim 9, wherein the reflective particles are located within the plurality of recesses.

12. The light source module of claim 1, wherein the depth of the recess is 10% to 100% of the height of the cover layer.

13. The light source module of claim 1, wherein the maximum width of the recess is 10% to 140% of the spacing between the plurality of light-emitting elements.

14. The light source module of claim 1 further includes auxiliary particles located on the circuit board between the plurality of light-emitting elements.

15. The light source module of claim 1, wherein the cover layer further has a plurality of protrusions located between the plurality of recesses, and the orthographic projections of the plurality of protrusions onto the circuit substrate respectively overlap the orthographic projections of the plurality of light-emitting elements onto the circuit substrate.

16. The light source module of claim 15, wherein the reflective particles are located on the protrusion.

17. The light source module of claim 1, wherein the cross-sectional shape of the first recess and the second recess are different.

18. The light source module of claim 1, wherein the plurality of recesses have an arc-shaped, U-shaped, V-shaped, trapezoidal, rectangular or stepped cross-sectional shape.

19. The light source module of claim 1, wherein the plurality of recesses have a top view shape of annular or mesh.

Images