Method, device, medical transport case and storage medium for temperature control

Abstract

The application relates to the technical field of intelligent household appliances, and discloses a temperature control method applied to a medical transfer box, the medical transfer box comprising a box body internally provided with a containing cavity, a power module, a temperature sensor, a first semiconductor refrigeration sheet and a second semiconductor refrigeration sheet; the method comprises the following steps: obtaining an actual temperature in the containing cavity; calculating a temperature difference between the actual temperature and a target temperature; and adjusting the power supply voltage of the first semiconductor refrigeration sheet and the second semiconductor refrigeration sheet according to the temperature difference, so that the power supply voltage of the semiconductor refrigeration sheet gradually decreases. The first semiconductor refrigeration sheet and the second semiconductor refrigeration sheet release greater cold energy, accelerate the cooling process and shorten the total cooling time. Meanwhile, the power supply voltage gradually decreases during the cooling process, so that the temperature in the containing cavity stably decreases. The stability of the cooling process can be improved, and the cooling process can be shortened. The application further discloses a temperature control device, a medical transfer box and a storage medium.

Description

Technical Field

[0001] This application relates to the field of refrigeration equipment technology, such as a method, apparatus, medical transport box, and storage medium for temperature control. Background Technology

[0002] To ensure that goods remain within a suitable temperature range during transport, temperature-controlled transport boxes are often used. To reduce weight and facilitate movement and use, existing transport boxes mostly employ thermoelectric coolers (TEUs) for temperature control. This involves placing TEUs inside the transport box to regulate the temperature of its internal cavity. Particularly in the medical field, medical transport boxes are needed for the short-term storage or transport of medical supplies such as vaccines, blood, cells, and drugs. These medical supplies have strict temperature requirements, necessitating that the temperature inside the transport box remain consistent with the required temperature. Current medical transport boxes achieve cooling by controlling the operation of the TEUs. However, TEUs only have two states: fully releasing cooling energy and not releasing cooling energy. This results in significant fluctuations in the amount of cooling energy released, leading to an unstable cooling process.

[0003] To improve the stability of the cooling process, a temperature control method for a semiconductor refrigeration refrigerator is disclosed in related technologies, including: obtaining the temperature difference between the average temperature of the refrigerator and a preset target temperature; determining a power supply voltage according to a preset PID adjustment rule, and supplying power to the semiconductor refrigeration chip of the refrigerator; wherein, the PID adjustment rule is set as follows: when the temperature difference is greater than or equal to a preset temperature difference threshold, the power supply voltage is made equal to the maximum cooling capacity voltage that enables the semiconductor refrigeration chip to generate maximum cooling capacity; when the temperature difference decreases to the temperature difference threshold, the power supply voltage decreases from the maximum cooling capacity voltage.

[0004] In the process of implementing the embodiments of this disclosure, at least the following problems were found in the related art:

[0005] The related technology gradually reduces the supply voltage of the thermoelectric cooler during the cooling process. While this helps improve the stability of the cooling process, the gradual decrease in the amount of cold air released leads to a prolonged cooling process. Prolonged cooling is detrimental to the storage of medical supplies and may even damage them.

[0006] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0007] To provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended as a general commentary, nor is it intended to identify key / important components or describe the scope of protection of these embodiments, but rather as a prelude to the detailed description that follows.

[0008] This disclosure provides a method, apparatus, medical transport box, and storage medium for temperature control, which can not only improve the stability of the cooling process but also shorten the cooling process.

[0009] In some embodiments, the method is applied to a medical transport box, the medical transport box comprising: a box body with an internal receiving cavity; a power module configured to provide voltage; and a temperature sensor configured to detect the actual temperature in the receiving cavity; the medical transport box further comprising: a first thermoelectric cooler connected to the power module and configured to controllably cool the receiving cavity; and a second thermoelectric cooler connected to the power module and configured to controllably cool the receiving cavity; the method comprising: obtaining the actual temperature in the receiving cavity; calculating the temperature difference between the actual temperature and a target temperature; and adjusting the supply voltage of the first thermoelectric cooler and the second thermoelectric cooler according to the temperature difference, so that the supply voltage of the first thermoelectric cooler and the second thermoelectric cooler gradually decreases.

[0010] Optionally, adjusting the supply voltage of the first and second thermoelectric coolers based on the temperature difference includes: when the temperature difference is less than or equal to a first temperature difference threshold, determining that the supply voltage of both the first and second thermoelectric coolers is a set voltage; when the temperature difference is greater than the first temperature difference threshold, determining the first supply voltage of the first thermoelectric cooler and the second supply voltage of the second thermoelectric cooler corresponding to the temperature difference according to a preset mapping relationship; wherein the set voltage is less than the first and second supply voltages.

[0011] Optionally, the determining a first power supply voltage of the first semiconductor refrigeration sheet and a second power supply voltage of the second semiconductor refrigeration sheet corresponding to the temperature difference according to a preset mapping relationship comprises: when T2>ΔT>T1, determining that the first power supply voltage of the first semiconductor refrigeration sheet is a first voltage V11, and the second power supply voltage of the second semiconductor refrigeration sheet is a second voltage V21; when T3>ΔT≥T2, determining that the first power supply voltage of the first semiconductor refrigeration sheet is a third voltage V12, and the second power supply voltage of the second semiconductor refrigeration sheet is a fourth voltage V22; when ΔT≥T3, determining that the first power supply voltage of the first semiconductor refrigeration sheet is a fifth voltage V13, and the second power supply voltage of the second semiconductor refrigeration sheet is a sixth voltage V23; where ΔT is the temperature difference, T1 is the first temperature difference threshold; T2 is the second temperature difference threshold; T3 is the third temperature difference threshold, and T1<T2<T3; V11≤V12≤V13 and V11<V13; V21≤V22≤V23 and V21<V23; V11=V21, V13=V23.

[0012] Optionally, after the determining the first power supply voltage of the first semiconductor refrigeration sheet and the second power supply voltage of the second semiconductor refrigeration sheet corresponding to the temperature difference according to the preset mapping relationship, the method further comprises: determining output states of the first power supply voltage and the second power supply voltage according to the temperature difference; where the output states include continuously outputting the voltage, and outputting the voltage at a set duty ratio.

[0013] Optionally, the determining the output states of the first power supply voltage and the second power supply voltage according to the temperature difference comprises: when T2>ΔT>T1, determining that both the first power supply voltage and the second power supply voltage are output at a set duty ratio; when T4>ΔT≥T2, determining that one of the first power supply voltage and the second power supply voltage is output at a set duty ratio, and the other is continuously output; when ΔT≥T4, determining that both the first power supply voltage and the second power supply voltage are continuously output; where T4 is a fourth temperature difference threshold, and T4>T3.

[0014] Optionally, after the adjusting the power supply voltages of the first semiconductor refrigeration sheet and the second semiconductor refrigeration sheet according to the temperature difference, the method further comprises: acquiring the current and / or voltage in the semiconductor refrigeration sheets in a conducting state; when the current exceeds a preset current range, or the voltage exceeds a preset voltage range, sending out a first alarm signal.

[0015] Optionally, the medical transport box further includes a fan configured to dissipate heat from the hot ends of the first and second thermoelectric coolers; after adjusting the power supply voltage of the first and second thermoelectric coolers according to the temperature difference, the method further includes: obtaining the fan speed; and issuing a second alarm signal if the fan speed is lower than a speed threshold.

[0016] In some embodiments, the apparatus includes a processor and a memory storing program instructions, the processor being configured to execute the above-described method for temperature control when the program instructions are executed.

[0017] In some embodiments, the medical transport box includes: a box body with an internal receiving cavity; a power module configured to provide voltage; a temperature sensor configured to detect the actual temperature in the receiving cavity; the medical transport box further includes: a first thermoelectric cooler connected to the power module and configured to controllably cool the receiving cavity; a second thermoelectric cooler connected to the power module and configured to controllably cool the receiving cavity; and the aforementioned device for temperature control.

[0018] Optionally, the power module includes: a power supply configured to output power voltage to the first thermoelectric cooler and the second thermoelectric cooler respectively; and a voltage conversion module connected to the power supply configured to convert the power voltage into a converted voltage and output the converted voltage to the first thermoelectric cooler and the second thermoelectric cooler respectively.

[0019] Optionally, the medical transport box further includes: a first switching device configured to connect one end to a power supply and the other end to the first thermoelectric cooler; a second switching device configured to connect one end to a power supply and the other end to the second thermoelectric cooler; a third switching device configured to connect one end to a voltage conversion module and the other end to the first thermoelectric cooler; and a fourth switching device configured to connect one end to the voltage conversion module and the other end to the second thermoelectric cooler.

[0020] Optionally, the temperature sensor includes: a first temperature sensor disposed at the top of the receiving cavity and configured to detect a first temperature at the top of the receiving cavity; and a second temperature sensor disposed at the bottom of the receiving cavity and configured to detect a second temperature at the bottom of the receiving cavity.

[0021] In some embodiments, the storage medium stores program instructions that, when executed, perform the temperature control method described above.

[0022] The method, apparatus, medical transport box, and storage medium for temperature control provided in this disclosure can achieve the following technical effects:

[0023] A first and second thermoelectric cooler are installed in the medical transport box. During the cooling process, the actual temperature inside the transport box's cavity is monitored in real time, and the supply voltages of the first and second thermoelectric coolers are adjusted accordingly, gradually decreasing their power supply voltages. This allows the first and second thermoelectric coolers to release more cooling energy in the initial stage of cooling, accelerating the process and shortening its overall duration. Simultaneously, the gradual decrease in supply voltage during cooling ensures a stable temperature drop within the cavity. Therefore, this method improves the stability of the cooling process and shortens its duration.

[0024] The above general description and the description below are exemplary and illustrative only and are not intended to limit this application. Attached Figure Description

[0025] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations and drawings do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are shown as similar elements. The drawings are not to be scaled. And wherein:

[0026] Figure 1 This is a circuit diagram of a medical transport box provided in an embodiment of this disclosure;

[0027] Figure 2 This is a circuit diagram of another medical transport box provided in an embodiment of this disclosure;

[0028] Figure 3 This is a circuit diagram of another medical transport box provided in an embodiment of this disclosure;

[0029] Figure 4-1 This is a schematic diagram of the first temperature detection circuit provided in an embodiment of this disclosure;

[0030] Figure 4-2 This is a schematic diagram of the second temperature detection circuit provided in an embodiment of this disclosure;

[0031] Figure 5-1 This is a schematic diagram of the drive control circuit of the first semiconductor refrigeration chip provided in an embodiment of this disclosure;

[0032] Figure 5-2 This is a schematic diagram of the drive control circuit of the second semiconductor refrigeration chip provided in an embodiment of this disclosure;

[0033] Figure 6-1 This is a schematic diagram of the first operating state detection circuit provided in an embodiment of this disclosure;

[0034] Figure 6-2This is a schematic diagram of the second operating state detection circuit provided in an embodiment of this disclosure;

[0035] Figure 7 This is a schematic diagram of a method for temperature control provided in an embodiment of this disclosure;

[0036] Figure 8 This is a schematic diagram of another method for temperature control provided in an embodiment of this disclosure;

[0037] Figure 9 This is a schematic diagram of a temperature control device provided in an embodiment of this disclosure;

[0038] Figure 10 This is a schematic diagram of the structure of a medical transport box provided in an embodiment of this disclosure. Detailed Implementation

[0039] To provide a more detailed understanding of the features and technical content of the embodiments of this disclosure, the implementation of the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for illustrative purposes only and are not intended to limit the embodiments of this disclosure. In the following technical description, for ease of explanation, several details are used to provide a full understanding of the disclosed embodiments. However, one or more embodiments may still be implemented without these details. In other cases, well-known structures and devices may be simplified in their depiction to simplify the drawings.

[0040] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this disclosure described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0041] Unless otherwise stated, the term "multiple" means two or more.

[0042] In this embodiment of the disclosure, the character " / " indicates that the objects before and after it are in an "or" relationship. For example, A / B means: A or B.

[0043] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0044] The term "correspondence" can refer to an association or binding relationship. The correspondence between A and B means that there is an association or binding relationship between A and B.

[0045] Combination Figure 1As shown, this embodiment of the present disclosure provides a medical transport box, including a box body, a power module 10, a first semiconductor refrigeration chip 21, a second semiconductor refrigeration chip 22, a temperature sensor 30, and a processor 40.

[0046] The enclosure contains a receiving cavity. A power module 10 is configured to provide voltage. A first thermoelectric cooler 21, connected to the power module 10, is configured to controllably cool the receiving cavity. A second thermoelectric cooler 22, also connected to the power module 10, is configured to controllably cool the receiving cavity. A temperature sensor 40 is located inside the receiving cavity and is configured to detect the actual temperature within it. The power module 10, the first thermoelectric cooler 21, the second thermoelectric cooler 22, and the temperature sensor 30 are all connected to and controlled by a processor 40.

[0047] It should be noted that the aforementioned first and second thermoelectric coolers do not imply a limitation of two thermoelectric coolers in the medical transport box; rather, they can be understood as multiple coolers divided into two groups. However, considering practical applications, while increasing the number of thermoelectric coolers improves the heating rate, it also necessitates increased heat dissipation space, leading to a larger size and weight of the medical transport box, which could negatively impact its usability. Therefore, two thermoelectric coolers can be considered the optimal configuration that balances temperature control, size, and weight.

[0048] Combination Figure 2 As shown, further explanation is given regarding the specific structural design of the medical transport box.

[0049] The power supply module 10 includes a power supply 11 and a voltage conversion module 12. The power supply 11 is connected to the first thermoelectric cooler 21 and the second thermoelectric cooler 22, respectively, and is configured to output power voltage to the first thermoelectric cooler 21 and the second thermoelectric cooler 22. The voltage conversion module 12 is connected to the power supply 11, the first thermoelectric cooler 21, and the second thermoelectric cooler 22, and is configured to convert the power voltage into a converted voltage, and output the converted voltage to the first thermoelectric cooler 21 and the second thermoelectric cooler 22, respectively. For example, when the power supply voltage is 12V, the voltage conversion module can convert the power supply voltage to obtain a 5V converted voltage. Thus, only one power supply is needed to output different voltage values ​​to the first and second thermoelectric coolers. Furthermore, the output voltage value of the voltage conversion module can be adjusted according to actual needs, meeting different voltage requirements and providing greater application flexibility.

[0050] Optionally, the medical transport box also includes a switching device. By controlling the switching device to open or close, all connection lines between the power supply 11, the voltage conversion module 12, and the first and second thermoelectric coolers 21 and 22 can be independently controlled.

[0051] Optionally, the switching devices include a first switching device 51, a second switching device 52, a third switching device 53, and a fourth switching device 54. The first switching device 51 is connected at one end to the power supply 11 and at the other end to the first thermoelectric cooler 21. The second switching device 52 is connected at one end to the power supply 11 and at the other end to the second thermoelectric cooler 22. The third switching device 53 is connected at one end to the voltage conversion module 12 and at the other end to the first thermoelectric cooler 21. The fourth switching device 54 is connected at one end to the voltage conversion module 12 and at the other end to the second thermoelectric cooler 22. This allows for independent control of each connection line. Specifically, when the first switching device is active, the connection between the power supply and the first thermoelectric cooler is established, and the power supply outputs a power voltage to the first thermoelectric cooler. When the second switching device is active, the connection between the power supply and the second thermoelectric cooler is established, and the power supply outputs a power voltage to the second thermoelectric cooler. When the third switching device is active, the connection between the voltage conversion module and the first thermoelectric cooler is established, and the voltage conversion module outputs a converted voltage to the first thermoelectric cooler. In the case of the fourth switching device path, the connection path between the voltage conversion module and the second thermoelectric cooler is such that the voltage conversion module outputs the converted voltage to the second thermoelectric cooler.

[0052] Combination Figure 3 As shown, the specific setup of the medical transport box is further illustrated.

[0053] Optionally, the switching devices include MOS (Metal Oxide Semiconductor Field Effect Transistor). Corresponding to the four switching devices, the MOS transistors include: a first MOS transistor 511, a second MOS transistor 521, a third MOS transistor 531, and a fourth MOS transistor 541.

[0054] Optionally, the medical transport box also includes a reverse protection diode disposed between the switching device and the first thermoelectric cooler 21 and the second thermoelectric cooler 22. Specifically, the reverse protection diode includes a first reverse protection diode 512, a second reverse protection diode 522, a third reverse protection diode 532, and a fourth reverse protection diode 542. The first reverse protection diode 512 is connected between the first MOSFET 511 and the first thermoelectric cooler 21. The second reverse protection diode 522 is connected between the second MOSFET 521 and the second thermoelectric cooler 22. The third reverse protection diode 532 is connected between the third MOSFET 531 and the first thermoelectric cooler 21. The fourth reverse protection diode 542 is connected between the fourth MOSFET 541 and the second thermoelectric cooler 22. This prevents reverse current from flowing back through each branch, thus preventing damage to the components.

[0055] Optionally, the temperature sensor 30 includes a first temperature sensor 31 and a second temperature sensor 32, both connected to the processor 40. The first temperature sensor 31 is located at the top of the receiving cavity and is configured to detect a first temperature at the top of the receiving cavity. The second temperature sensor 32 is located at the bottom of the receiving cavity and is configured to detect a second temperature at the bottom of the receiving cavity. This effectively avoids the problem of uneven temperature distribution inside the receiving cavity when detecting its temperature, thus obtaining a more accurate actual temperature.

[0056] Optionally, the specific temperature detection circuit can be found in [reference]. Figure 4-1 , Figure 4-2 Configure the settings. First temperature detection circuit (e.g.) Figure 4-1 (As shown) includes the first temperature sensor mentioned above, namely RT1NTC in the figure. The second temperature detection circuit (as shown) Figure 4-2 (As shown) This includes the second temperature sensor mentioned above, namely RT2NTC in the figure. The voltage divider circuit obtains the analog voltage signals detected by the two temperature sensors. The two analog voltage signals are converted into digital signals by the processor's built-in A / D conversion circuit, resulting in two sets of digital signals. The average value is obtained by performing extreme value removal and averaging filtering on the 20 temperature digital signals in each set. This average value is used as the detected actual temperature, thus obtaining a more accurate temperature value.

[0057] Optionally, the temperature sensor is a negative temperature coefficient temperature sensor.

[0058] Optionally, the drive control circuit for the first semiconductor cooling chip can refer to Figure 5-1 For configuration, the drive control circuit for the second semiconductor refrigeration chip can be referenced. Figure 5-2 Configure the settings. TEC1 is the first thermoelectric cooler, and TEC2 is the second thermoelectric cooler.

[0059] Optionally, the medical transport box also includes a switch buffer circuit 60, which is connected to the power supply 11. This helps to improve the switching operating conditions of the various components in the circuit.

[0060] Optionally, the medical transport box also includes a voltage regulator 70, one end of which is connected to the power supply 11 and the other end to the processor 40. The voltage regulator stabilizes the current output from the power supply before it is input to the processor, making the current entering the processor more stable and thus avoiding unnecessary damage to the processor.

[0061] Optionally, the medical transport box also includes a fan to dissipate heat from the hot ends of the first thermoelectric cooler 21 and the second thermoelectric cooler 22. Specifically, the fan is configured with a first fan 81 and a second fan 82. The first fan 81 is configured to dissipate heat from the hot end of the first thermoelectric cooler 21, and the second fan 82 is configured to dissipate heat from the hot end of the second thermoelectric cooler 22. This allows for timely heat dissipation from the hot ends of the thermoelectric coolers, preventing heat buildup that could affect the cooling effect or even damage the components.

[0062] The first fan 81 and the second fan 82 are respectively connected to the processor 40, controlled by the processor 40, and provide speed feedback. A switching device, specifically a fifth MOSFET 552, is connected between the processor 40 and the first fan 81. A switching device, specifically a sixth MOSFET 562, is also connected between the processor and the second fan. Thus, the switching states of the first and second fans can be controlled by controlling the on / off states of the fifth and sixth MOSFETs.

[0063] Optionally, the medical transport box also includes an operating status detection circuit configured to monitor the operating status of the first and second thermoelectric coolers, wherein the operating status is current and / or voltage. This allows for real-time monitoring of the operating status during the operation of the thermoelectric coolers, enabling timely detection and handling of any operational abnormalities. The first operating status detection circuit for monitoring the operating status of the first thermoelectric cooler can be referenced from [reference needed]. Figure 6-1 The second operating status detection circuit, which monitors the operating status of the second semiconductor refrigeration chip, can be configured as follows: Figure 6-2 Configure the settings.

[0064] Combination Figure 7 As shown, this disclosure provides a method for temperature control, including:

[0065] S701, the processor obtains the actual temperature in the containment cavity.

[0066] The S702 processor calculates the temperature difference between the actual temperature and the target temperature.

[0067] The temperature difference here is the difference between the actual temperature and the target temperature.

[0068] S703, the processor adjusts the supply voltage of the first and second thermoelectric coolers according to the temperature difference, so that the supply voltage of the first and second thermoelectric coolers gradually decreases.

[0069] The temperature control method provided in this disclosure involves placing a first and a second thermoelectric cooler in a medical transport box. During the cooling process, the actual temperature inside the transport box's cavity is monitored in real time, and the supply voltages of the first and second thermoelectric coolers are adjusted accordingly, gradually decreasing. This allows the first and second thermoelectric coolers to release greater cooling capacity in the initial stage of the cooling process, accelerating the cooling process and shortening its total duration. Simultaneously, the gradual decrease in supply voltage during cooling ensures a stable temperature drop within the cavity. Therefore, this method improves the stability of the cooling process and shortens its duration.

[0070] Optionally, when a first temperature sensor and a second temperature sensor are provided within the receiving cavity, the processor obtains the actual temperature within the receiving cavity by: obtaining a first temperature value detected by the first temperature sensor and a second temperature value detected by the second temperature sensor, and calculating the average temperature of the first and second temperature values. This average temperature is then used as the current actual temperature within the receiving cavity. This method allows for a more accurate determination of the actual temperature.

[0071] Optionally, the target temperature can be obtained by installing input devices such as buttons on the medical transport box, allowing the user to directly input the target temperature. This enables quick and accurate acquisition of the appropriate target temperature for the current item.

[0072] Optionally, the target temperature can be obtained by having the user input the types of items to be placed inside the medical transport box via an input device, and then determining the target temperature based on a pre-stored mapping relationship between item types and target temperatures. Furthermore, an information acquisition device can scan and identify items already placed or about to be placed in the medical transport box to determine the corresponding target temperature. This simplifies user operation while accurately obtaining the appropriate target temperature.

[0073] Optionally, the processor adjusts the supply voltage of the first and second thermoelectric coolers based on the temperature difference, including: when the temperature difference is less than or equal to a first temperature difference threshold, the processor determines that the supply voltage of both the first and second thermoelectric coolers is a set voltage. When the temperature difference is greater than the first temperature difference threshold, the processor determines the first supply voltage of the first thermoelectric cooler and the second supply voltage of the second thermoelectric cooler corresponding to the temperature difference according to a preset mapping relationship. The set voltage is less than both the first and second supply voltages. Thus, when the actual temperature inside the cavity is close to the target temperature, the set voltage is automatically reduced, causing a decrease in the amount of cooling released by the thermoelectric coolers, thereby allowing the temperature to approach the target temperature more slowly.

[0074] Optionally, the first temperature difference threshold can be set to 0℃, with a corresponding setting voltage of 0V. In this way, when the temperature difference is 0, it indicates that the actual temperature inside the containment cavity has reached the target temperature. At this point, the cooling system automatically stops, preventing the temperature from decreasing further and thus meeting the temperature requirements of the item.

[0075] Optionally, when the set voltage is 0V, the processor determines that the power supply voltage of both the first and second thermoelectric coolers is the set voltage, which includes: the processor controlling the first and second thermoelectric coolers to disconnect from the circuit.

[0076] In other embodiments, the first temperature difference threshold can also be set to be greater than and close to 0°C. For example, it can be set to 0.2°C or 0.5°C. In this case, the set voltage can be set to 0V or close to 0V. At this time, the actual temperature is very close to the target temperature, and controlling the semiconductor cooling chip to no longer release cold energy or to release only a very small amount of cold energy helps to stabilize the temperature inside the containment cavity at the target temperature, thereby meeting the temperature requirements of the items inside the containment cavity.

[0077] Optionally, the processor determining the first power supply voltage of the first semiconductor refrigeration sheet and the second power supply voltage of the second semiconductor refrigeration sheet corresponding to the temperature difference according to a preset mapping relationship comprises: in the case of T2>ΔT>T1, the processor determines that the first power supply voltage of the first semiconductor refrigeration sheet is a first voltage V11, and the second power supply voltage of the second semiconductor refrigeration sheet is a second voltage V21. In the case of T3>ΔT≥T2, the processor determines that the first power supply voltage of the first semiconductor refrigeration sheet is a third voltage V12, and the second power supply voltage of the second semiconductor refrigeration sheet is a fourth voltage V22. In the case of ΔT≥T3, the processor determines that the first power supply voltage of the first semiconductor refrigeration sheet is a fifth voltage V13, and the second power supply voltage of the second semiconductor refrigeration sheet is a sixth voltage V23. Wherein, ΔT is the temperature difference, T1 is a first temperature difference threshold; T2 is a second temperature difference threshold; T3 is a third temperature difference threshold, and T1<T2<T3; V11≤V12≤V13 and V11<V13; V21≤V22≤V23 and V21<V23; V11=V21, V13=V23.

[0078] Here, based on Figure 3 the structure of the medical transport box shown in, the process of determining the first power supply voltage and the second power supply voltage is exemplarily described. It is set that the power supply voltage output by the power supply is 12V, and the power conversion module outputs a converted voltage of 5V after converting the power supply voltage. That is, the power module can output a 12V voltage and a 5V voltage. It is set that T1 is 0°C, T2 is 3°C, and T3 is 6°C. The actual temperature in the accommodation cavity is detected, and the difference between the actual temperature and the target temperature is calculated to obtain the temperature difference. When the temperature difference is less than 3°C and greater than or equal to 0°C, it is determined that the power supply voltage of the first semiconductor refrigeration sheet is 5V, and the power supply voltage of the second semiconductor refrigeration sheet is 5V. When the temperature difference is less than 6°C and greater than or equal to 3°C, it is determined that the power supply voltage of the first semiconductor refrigeration sheet is 12V, and the power supply voltage of the second semiconductor refrigeration sheet is 5V; or, it is determined that the power supply voltage of the first semiconductor refrigeration sheet is 5V, and the power supply voltage of the second semiconductor refrigeration sheet is 12V. When the temperature difference is greater than or equal to 6°C, the processor determines that the power supply voltage of the first semiconductor refrigeration sheet is 12V, and the power supply voltage of the second semiconductor refrigeration sheet is 12V.

[0079] Optionally, after the processor determines the first power supply voltage of the first semiconductor refrigeration sheet and the second power supply voltage of the second semiconductor refrigeration sheet corresponding to the temperature difference according to the preset mapping relationship, the method further comprises: the processor determining the output states of the first power supply voltage and the second power supply voltage according to the temperature difference. The output states include continuously outputting the voltage, and outputting the voltage at a set duty ratio. In this way, more precise adjustment can be performed on the power supply voltages of the first semiconductor refrigeration sheet and the second semiconductor refrigeration sheet.

[0080] Specifically, the output voltage is controlled by PWM (Pulse Width Modulation) to set the duty cycle.

[0081] Optionally, the duty cycle can be set to a fixed value, such as 30%, 50%, 80%, etc., that is, the circuit is on for 30%, 50%, or 80% of the total time.

[0082] Optionally, the duty cycle can be set based on the current temperature difference.

[0083] Optionally, the processor determines the duty cycle based on the temperature difference by determining that the duty cycle is positively correlated with the temperature difference. That is, the smaller the temperature difference, the smaller the duty cycle. Thus, a smaller temperature difference results in a shorter circuit connection time, lower cooling efficiency of the thermoelectric cooler, and a slower temperature decrease, which helps improve the accuracy of the temperature regulation process.

[0084] Optionally, the processor determines the output state of the first and second supply voltages based on the temperature difference, including: when T2 > ΔT > T1, the processor determines that both the first and second supply voltages are output with a set duty cycle. When T4 > ΔT ≥ T2, the processor determines that one of the first and second supply voltages is output with a set duty cycle, while the other is continuously output. When ΔT ≥ T4, the processor determines that both the first and second supply voltages are continuously output. Here, T4 is the fourth temperature difference threshold, and T4 > T3. Thus, when the difference between the actual and target temperatures is large, continuous voltage output allows the thermoelectric cooler to operate at higher power, releasing more cooling energy and accelerating the cooling process. Conversely, when the temperature difference between the actual and target temperatures is small, outputting voltage with a set duty cycle allows the thermoelectric cooler to operate at lower power, releasing less cooling energy and more stably approaching the target temperature.

[0085] Here, based on Figure 3The structure of the medical transport box shown further explains the determination of the output state. The power supply output voltage is set to 12V. After the power conversion module converts the power supply voltage, it outputs a converted voltage of 5V. That is, the power module can output 12V and 5V voltages. T1 is set to 0℃, T2 to 3℃, and T4 to 10℃. The actual temperature inside the containment cavity is detected, and the difference between the actual temperature and the target temperature is calculated to obtain the temperature difference value. When the temperature difference is greater than 0℃ and less than 3℃, the processor determines that both the first and second power supply voltages are output with a set duty cycle. When the temperature difference is greater than or equal to 3℃ and less than 10℃, the processor determines that one of the first power supply voltages is continuously output, and the other is output with a set duty cycle. When the temperature difference is greater than or equal to 10℃, the processor determines that both the first and second power supply voltages are continuously output. Optionally, after the processor adjusts the power supply voltages of the first and second thermoelectric coolers according to the temperature difference, the process further includes: the processor obtaining the current and / or voltage in the thermoelectric cooler in the conductive state. If the current exceeds the preset current range, or the voltage exceeds the preset voltage range, the processor issues a first alarm signal. This monitoring of the thermoelectric cooler's operation prevents overcurrent, overvoltage, and undervoltage situations that could damage the thermoelectric cooler.

[0086] Optionally, the first alarm signal may include issuing a prompt to inform the user of the current situation, and / or controlling the thermoelectric cooler to disconnect from the circuit. This allows for timely prevention of further malfunctions.

[0087] Optionally, when the medical transport box includes a fan, after the processor adjusts the supply voltage of the first and second thermoelectric coolers based on the temperature difference, it also includes: the processor obtaining the fan speed. If the fan speed is lower than a speed threshold, the processor issues a second alarm signal. Thus, during the operation of the thermoelectric coolers, the fan's operating status is determined based on fan speed feedback. This effectively identifies fan stalling, preventing it from affecting heat dissipation from the hot surface of the thermoelectric cooler and causing overheating and damage. It also prevents uneven cooling caused by fan stoppage, ensuring the temperature requirements of the items inside the temperature control device are met.

[0088] Optionally, the second alarm prompt includes issuing a notification to inform the user of the current situation, and / or controlling the thermoelectric cooler to disconnect the circuit. This prevents the medical transport box from continuing to operate under malfunctioning conditions.

[0089] Combination Figure 8 As shown, this disclosure provides another method for temperature control, including:

[0090] S801, the processor obtains the actual temperature T in the containment cavity.

[0091] S802, the processor calculates the temperature difference ΔT = T - Ts between the actual temperature T and the target temperature Ts.

[0092] S803, when ΔT≥T4, the processor determines that the first power supply voltage of the first thermoelectric cooler is the fifth voltage V13, and the second power supply voltage of the second thermoelectric cooler is the sixth voltage V23, and both the first power supply voltage and the second power supply voltage are continuously output.

[0093] This stage is the rapid cooling stage. The difference between the actual temperature and the target temperature is relatively large. Using this power supply mode can achieve rapid cooling and shorten the overall cooling process time.

[0094] S804, when T4>ΔT≥T3, the processor determines that the first power supply voltage of the first thermoelectric cooler is the fifth voltage V13, and the second power supply voltage of the second thermoelectric cooler is the sixth voltage V23. One of the first power supply voltage and the second power supply voltage is output with a set duty cycle, and the other is output continuously.

[0095] This stage is after rapid cooling. At this time, the power supply voltage is controlled by setting the duty cycle. On the one hand, this can maintain the thermal inertia of the thermoelectric cooler, and on the other hand, it can appropriately reduce the cooling capacity and slow down the cooling rate.

[0096] S805, when T3>ΔT≥T2, the processor determines that the first power supply voltage of the first thermoelectric cooler is the third voltage V12, and the second power supply voltage of the second thermoelectric cooler is the fourth voltage V22. One of the first power supply voltage and the second power supply voltage is output with a set duty cycle, and the other is output continuously.

[0097] At this stage, the actual temperature is already quite close to the target temperature, so it is necessary to further slow down the cooling rate to improve the stability of the cooling process.

[0098] S806, when T2>ΔT>T1, the processor determines that the first power supply voltage of the first thermoelectric cooler is the first voltage V11 and the second power supply voltage of the second thermoelectric cooler is the second voltage V21, and both the first power supply voltage and the second power supply voltage are output with a set duty cycle.

[0099] This stage occurs when the actual temperature is about to reach the target temperature. At this point, the output voltage is set with a duty cycle to achieve a smooth voltage transition, thereby slowing down the release of cooling capacity and thus slowing down the rate of temperature drop, allowing the temperature to slowly approach the target temperature.

[0100] S807, when ΔT≤T1, the processor determines that the power supply voltage of both the first and second thermoelectric coolers is the set voltage.

[0101] T1 is the first temperature threshold. The voltage can be set to 0V.

[0102] This stage occurs when the actual temperature reaches the target temperature. The first and second semiconductor cooling chips are then controlled to stop releasing cooling energy, thereby preventing the temperature inside the cavity from continuing to drop.

[0103] After executing any of steps S803 to S807, step S801 is executed again to detect the actual temperature in the receiving cavity. This is to perform the next round of temperature adjustment so that the temperature in the receiving cavity is stabilized at the target temperature.

[0104] The temperature control method provided in this disclosure involves placing a first and a second thermoelectric cooler in a medical transport box. During the cooling process, the actual temperature inside the transport box's cavity is monitored in real time, and the supply voltages of the first and second thermoelectric coolers are adjusted accordingly, gradually decreasing. This allows the first and second thermoelectric coolers to release greater cooling capacity in the initial stage of the cooling process, accelerating the cooling process and shortening its total duration. Simultaneously, the gradual decrease in supply voltage during cooling ensures a stable temperature drop within the cavity. Therefore, this method improves the stability of the cooling process and shortens its duration.

[0105] Here, based on Figure 3The structure of the medical transport box shown illustrates the process of determining the first and second power supply voltages. The power supply output voltage is set to 12V. After conversion by the power conversion module, a converted voltage of 5V is output. That is, the power module can output both 12V and 5V. T1 is set to 0℃, T2 to 3℃, T3 to 6℃, and T4 to 10℃. The actual temperature inside the containment cavity is detected, and the difference between the actual temperature and the target temperature is calculated to obtain the temperature difference value. When the temperature difference is less than or equal to 0℃, the processor determines that the power supply voltages for both the first and second thermoelectric coolers are 0℃. When the temperature difference is greater than 0℃ and less than 3℃, the processor controls the power module to output 5V to the first thermoelectric cooler at a set duty cycle. When the temperature difference is greater than or equal to 3℃ and less than 6℃, the processor controls the power module to output 12V to the first thermoelectric cooler at a set duty cycle and continuously outputs 5V to the second thermoelectric cooler. When the temperature difference is greater than or equal to 6°C and less than 10°C, the processor controls the power module to continuously output 12V voltage to the first thermoelectric cooler and output 12V voltage to the second thermoelectric cooler with a set duty cycle. When the temperature difference is greater than or equal to 10°C, the processor controls the power module to continuously output 12V voltage to both the first and second thermoelectric coolers.

[0106] Considering that the lifespan of a thermoelectric cooler is affected when it operates under PWM switching control, the control method provided in this disclosure minimizes the operating time of PWM switching control and reduces the adverse impact on the lifespan of the thermoelectric cooler.

[0107] Therefore, the setting method provided in this embodiment is a cooling control method with the fastest cooling speed, the smallest temperature fluctuation, and the shortest PWM switching control time.

[0108] Combination Figure 9 As shown, this disclosure provides a temperature control device 200, including a processor 90 and a memory 91. Optionally, the device may further include a communication interface 92 and a bus 93. The processor 90, communication interface 92, and memory 91 can communicate with each other via the bus 93. The communication interface 92 can be used for information transmission. The processor 90 can call logical instructions in the memory 91 to execute the temperature control method described in the above embodiment.

[0109] Furthermore, the logic instructions in the aforementioned memory 91 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium.

[0110] The memory 91, as a computer-readable storage medium, can be used to store software programs and computer-executable programs, such as program instructions / modules corresponding to the methods in the embodiments of this disclosure. The processor 90 executes functional applications and data processing by running the program instructions / modules stored in the memory 91, that is, implementing the temperature control method in the above embodiments.

[0111] The memory 91 may include a program storage area and a data storage area. The program storage area may store the operating system and application programs required for at least one function; the data storage area may store data created based on the use of the terminal device. Furthermore, the memory 91 may include high-speed random access memory and may also include non-volatile memory.

[0112] Combination Figure 10 As shown, this disclosure provides a medical transport box 100, including a medical transport box body and the aforementioned temperature control device 200. The temperature control device 200 is installed in the medical transport box body. The installation relationship described herein is not limited to placement inside the product, but also includes installation connections with other components of the product, including but not limited to physical connections, electrical connections, or signal transmission connections. Those skilled in the art will understand that the temperature control device 200 can be adapted to feasible product bodies to achieve other feasible embodiments.

[0113] This disclosure provides a computer-readable storage medium storing computer-executable instructions configured to perform the above-described method for temperature control.

[0114] The aforementioned computer-readable storage medium may be a transient computer-readable storage medium or a non-transitory computer-readable storage medium.

[0115] The technical solutions of this disclosure can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes one or more instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of this disclosure. The aforementioned storage medium can be a non-transitory storage medium, including: a USB flash drive, a portable hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, and other media capable of storing program code; it can also be a transient storage medium.

[0116] The foregoing description and accompanying drawings fully illustrate embodiments of this disclosure to enable those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, procedural, and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operation may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. Moreover, the terminology used in this application is for describing embodiments only and is not intended to limit the claims. As used in the description of embodiments and claims, the singular forms “a,” “an,” and “the” are intended to equally include the plural forms unless the context clearly indicates otherwise. Similarly, the term “and / or” as used in this application means including one or more of the associated listed items and all possible combinations thereof. Additionally, when used in this application, the term "comprise" and its variations "comprises" and / or "comprising" refer to the presence of stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. Without further limitations, an element defined by the phrase "comprises a..." does not exclude the presence of other identical elements in the process, method, or apparatus that includes the element. In this document, each embodiment may focus on the differences from other embodiments, and similar or identical parts between embodiments can be referred to mutually. For methods, products, etc., disclosed in the embodiments, if they correspond to the method section disclosed in the embodiments, the relevant parts can be referred to the description of the method section.

[0117] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the embodiments of this disclosure. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0118] The methods and products (including but not limited to devices and equipment) disclosed in the embodiments herein can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of units may be merely a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. In addition, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be electrical, mechanical, or other forms. Units described as separate components may or may not be physically separate, and components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the units may be selected to implement this embodiment according to actual needs. Furthermore, the functional units in the embodiments of this disclosure may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0119] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to embodiments of the present disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code, which contains one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions marked in the blocks may occur in a different order than that shown in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different blocks may also occur in a different order than disclosed in the description, and sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. Each block in a block diagram and / or flowchart, and combinations of blocks in a block diagram and / or flowchart, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

Claims

1. A method for temperature control, applied to a medical transport box, the medical transport box comprising: a box body, with an accommodating cavity arranged inside; a power supply module, configured to provide voltage; a temperature sensor, configured to detect the actual temperature in the accommodating cavity; characterized in that, the medical transport box further comprises: a first semiconductor refrigeration sheet, connected to the power supply module, configured to controllably cool the accommodating cavity; a second semiconductor refrigeration sheet, connected to the power supply module, configured to controllably cool the accommodating cavity; wherein the power supply module comprises a voltage conversion module, configured to convert a power supply voltage into a converted voltage, and output independent converted voltages to the first semiconductor refrigeration sheet and the second semiconductor refrigeration sheet respectively; the method comprises: obtaining the actual temperature in the accommodating cavity; calculating the temperature difference between the actual temperature and a target temperature; adjusting the power supply voltages of the first semiconductor refrigeration sheet and the second semiconductor refrigeration sheet according to the temperature difference, so that the power supply voltages of the first semiconductor refrigeration sheet and the second semiconductor refrigeration sheet gradually decrease; wherein said adjusting the power supply voltages of the first semiconductor refrigeration sheet and the second semiconductor refrigeration sheet according to the temperature difference comprises: when the temperature difference is greater than a first temperature difference threshold, determining a first power supply voltage of the first semiconductor refrigeration sheet and a second power supply voltage of the second semiconductor refrigeration sheet corresponding to the temperature difference according to a preset mapping relationship; determining the output states of the first power supply voltage and the second power supply voltage according to the temperature difference; wherein the output states include continuous voltage output and voltage output at a set duty cycle; said determining the first power supply voltage of the first semiconductor refrigeration sheet and the second power supply voltage of the second semiconductor refrigeration sheet corresponding to the temperature difference according to the preset mapping relationship comprises: when T2>ΔT>T1, determining that the first power supply voltage of the first semiconductor refrigeration sheet is a first voltage V11, and the second power supply voltage of the second semiconductor refrigeration sheet is a second voltage V21; when T3>ΔT≥T2, determining that the first power supply voltage of the first semiconductor refrigeration sheet is a third voltage V12, and the second power supply voltage of the second semiconductor refrigeration sheet is a fourth voltage V22; when ΔT≥T3, determining that the first power supply voltage of the first semiconductor refrigeration sheet is a fifth voltage V13, and the second power supply voltage of the second semiconductor refrigeration sheet is a sixth voltage V23; wherein ΔT is the temperature difference, T1 is the first temperature difference threshold; T2 is a second temperature difference threshold; T3 is a third temperature difference threshold.

2. The method according to claim 1, characterized in that, said adjusting the power supply voltages of the first semiconductor refrigeration sheet and the second semiconductor refrigeration sheet according to the temperature difference comprises: when the temperature difference is less than or equal to the first temperature difference threshold, determining that the power supply voltages of both the first semiconductor refrigeration sheet and the second semiconductor refrigeration sheet are a set voltage; wherein the set voltage is less than the first power supply voltage and the second power supply voltage.

3. The method according to claim 2, characterized in that, T1<T2<T3; V11≤V12≤V13 and V11<V13; V21≤V2≤V23 and V21<V23; V11=V21, V13=V23.

4. The method according to any one of claims 1 to 3, characterized in that, after said adjusting the power supply voltages of the first semiconductor refrigeration sheet and the second semiconductor refrigeration sheet according to the temperature difference, the method further comprises: To obtain the current and / or voltage in a semiconductor refrigeration chip that is in a closed state; If the current exceeds a preset current range, or if the voltage exceeds a preset voltage range, a first alarm signal is issued.

5. The method according to any one of claims 1 to 3, characterized in that, The medical transport box further includes a fan configured to dissipate heat from the hot ends of the first and second thermoelectric coolers; after adjusting the supply voltage of the first and second thermoelectric coolers according to the temperature difference, the system further includes: Obtain the fan speed; If the fan speed is lower than the speed threshold, a second alarm signal is issued.

6. A device for temperature control, comprising a processor and a memory storing program instructions, characterized in that, The processor is configured to perform the method for temperature control as described in any one of claims 1 to 5 when executing the program instructions.

7. A medical transport box, comprising: The box has an internal cavity for receiving contents; The power module is configured to provide voltage; A temperature sensor is configured to detect the actual temperature within the containment cavity; The medical transport box is characterized in that it further includes: The first semiconductor cooling chip, connected to the power module, is configured to controllably cool the containment cavity; A second semiconductor cooling chip, connected to the power module, is configured to controllably cool the receiving cavity; and, The apparatus as described in claim 6.

8. The medical transport box according to claim 7, characterized in that, The power module includes: The power supply is configured to output power voltage to the first and second semiconductor refrigeration chips respectively. A voltage conversion module, connected to the power supply, is configured to convert the power supply voltage into a converted voltage and output the converted voltage to the first thermoelectric cooler and the second thermoelectric cooler, respectively.

9. A storage medium storing program instructions, characterized in that, When the program instructions are executed, they perform the method for temperature control as described in any one of claims 1 to 5.

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