Sensor shift flex arrangement for improved signal routing

Abstract

The present disclosure relates to "Sensor Shift Flexure Arrangements for Improved Signal Routing." Various embodiments include sensor shift flexure arrangements for improved signal routing. For example, a camera with sensor shift actuation can include a flexure for suspending an image sensor on a fixed structure of the camera and for allowing motion of the image sensor enabled by one or more actuators of the camera. In some embodiments, the flexure can be configured to convey electrical signals between the image sensor and a flexible circuit. According to some embodiments, the flexure can include a layer stack including an electrical ground portion having an additional conductive layer proximate to a base layer, which can reduce the overall resistivity of a ground current return path. In some embodiments, the flexure can additionally or alternatively include an impedance adjustment feature configured to adjust an impedance of an electrical signal pad for connecting the flexure with another component of the camera.

Description

Technical Field

[0001] This disclosure relates in its entirety to sensor displacement flexure arrangements for improving signal routing. Background Technology

[0002] The emergence of small, mobile multi-purpose devices such as smartphones and tablets or tablets has led to a demand for high-resolution, small-form-factor cameras integrated into these devices. Some small-form-factor cameras incorporate optical image stabilization (OIS) mechanisms that sense and react to external stimuli / disturbances by adjusting the position of optical lenses on the X and / or Y axes, attempting to compensate for unwanted lens movement. Some small-form-factor cameras incorporate autofocus (AF) mechanisms that adjust the focal length of the object so that the object plane in front of the camera is focused onto the image plane captured by the image sensor. In some of these autofocus mechanisms, the optical lens moves as a single rigid body along the camera's optical axis to refocus the camera. Attached Figure Description

[0003] Figure 1 A schematic block diagram of an exemplary camera system, which may include a sensor displacement flexure arrangement for improving signal routing, is shown according to some embodiments.

[0004] Figure 2 A top view of an exemplary sensor displacement flexure arrangement, which may include sensor displacement flexure arrangements for improving signal routing, is shown according to some embodiments.

[0005] Figures 3A to 3B A schematic block diagram of a portion of an exemplary camera, which may include a sensor displacement flexure arrangement for improving signal routing, is shown according to some embodiments. Figure 3A A portion of an exemplary camera is shown, including a flexural portion bonded to a flexible circuit. Figure 3B A portion of an exemplary camera, including a flexure-circuit hybrid structure, is shown.

[0006] Figure 4 A schematic diagram of an exemplary sensor displacement flexure arrangement for improving signal routing is shown according to some embodiments.

[0007] Figures 5A to 5B A schematic diagram of an exemplary sensor displacement flexure arrangement is shown. Figure 5A An exemplary sensor displacement flexure arrangement is shown, comprising a layer stack with a ground path, the ground path including a base layer without an adjacent conductive layer. Figure 5B Another exemplary sensor displacement flexure arrangement is shown according to some embodiments, including a layer stack with a ground path comprising a base layer and an additional conductive layer (e.g., adjacent to the base layer).

[0008] Figures 6A to 6D A schematic diagram of an exemplary layer stack that may be included in a sensor displacement flexure arrangement is shown. Figure 6A An example of a layer stack excluding impedance adjustment features is shown. Figures 6B to 6D Other examples of layer stacks including impedance adjustment features according to some implementation schemes are shown.

[0009] Figure 7 A schematic cross-sectional side view of a portion of an exemplary camera, which may include one or more actuators and a sensor displacement flexure arrangement for improving signal routing, is shown according to some embodiments.

[0010] Figure 8 A schematic representation of an exemplary device, which may include a camera having a sensor displacement flexure arrangement for improved signal routing, is shown according to some embodiments.

[0011] Figure 9 A schematic block diagram of an exemplary computer system, which may include a camera having a sensor displacement flexure arrangement for improved signal routing, is shown according to some embodiments.

[0012] This specification includes references to "one embodiment" or "implementation". The use of the phrase "in one embodiment" or "in an embodiment" does not necessarily refer to the same embodiment. Specific features, structures, or characteristics may be combined in any suitable manner consistent with this disclosure.

[0013] The term "comprising" is open-ended. As used in the appended claims, it does not exclude additional structures or steps. Consider the following cited claim: "An apparatus comprising one or more processor units..." Such claims do not exclude the inclusion of additional components (e.g., network interface units, graphics circuitry, etc.).

[0014] "Configured as" refers to various units, circuits, or other components that can be described or stated as being "configured as" to perform one or more tasks. In such a context, "configured as" is used to imply a structure (e.g., a circuit) that includes a unit / circuit / component that performs one or more tasks during operation. Thus, a unit / circuit / component is allegedly configured to perform the task even when the specified unit / circuit / component is currently inoperable (e.g., not switched on). Units / circuits / components used with the language "configured as" include hardware—e.g., circuits, memory storing program instructions that can be executed to perform the operation, etc. Referring to a unit / circuit / component as being "configured as" to perform one or more tasks is explicitly intended to not invoke 35 USC §112(f) for that unit / circuit / component. Furthermore, "configured as" can include general structures (e.g., general-purpose circuits) manipulated by software and / or firmware (e.g., FPGAs or general-purpose processors executing software) in a manner capable of performing one or more tasks to be solved. "Configured to" may also include adjusting the manufacturing process (e.g., a semiconductor manufacturing facility) to manufacture equipment (e.g., an integrated circuit) suitable for performing one or more tasks.

[0015] "First," "second," etc. As used herein, these terms serve as labels for the nouns preceding them and do not imply any type of ordering (e.g., spatial, temporal, logical, etc.). For example, a buffer circuit may be described herein as performing write operations on a "first" value and a "second" value. The terms "first" and "second" do not necessarily imply that the first value must be written before the second value.

[0016] "Based on." As used herein, this term describes one or more factors that influence the determination. This term does not exclude additional factors influencing the determination. That is, the determination may be based solely on these factors or at least partially on them. Consider the phrase "A is determined based on B." In this case, B is the factor influencing the determination of A, and such phrases do not exclude the possibility that the determination of A may also be based on C. In other instances, A may be determined solely on B.

[0017] It will also be understood that while the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are merely used to distinguish one element from another. For example, without departing from the intended scope, a first contact may be referred to as a second contact, and similarly, a second contact may be referred to as a first contact. Both the first contact and the second contact are contacts, but they are not the same contact.

[0018] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the specification and appended claims, the singular forms “a,” “an,” and “the” are intended to also cover the plural forms unless the context otherwise expressly indicates otherwise. It will also be understood that the term “and / or” as used herein refers to and covers any and all possible combinations of one or more of the items listed in connection with the description. It will also be understood that the terms “comprising” and / or “including” as used in this specification specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0019] As used herein, depending on the context, the term "if" can be interpreted as meaning "when..." or "in response to determination" or "in response to detection". Similarly, depending on the context, the phrase "if it is determined..." or "if [the stated condition or event] is detected" can be interpreted as meaning "when it is determined..." or "in response to determination..." or "when [the stated condition or event] is detected" or "in response to detection". Detailed Implementation

[0020] This application claims the benefit of U.S. Provisional Application Serial No. 63 / 234,155, entitled “Sensor Shift Flexure Arrangements for Improved Signal Routing”, filed August 17, 2021, the entire contents of which are incorporated herein by reference.

[0021] Various embodiments include sensor-shifting flexure arrangements for improving signal routing, for example, in a camera with sensor-shifting actuation. For example, a camera system may include a lens group, an image sensor package, a flexure (which may include one or more aspects of the sensor-shifting flexure arrangements disclosed herein), and / or flexible circuitry. Furthermore, the camera system may include one or more actuators (e.g., voice coil motor (VCM) actuators). In some embodiments, the actuators may be used to move the image sensor package relative to the lens group to provide autofocus (AF) and / or optical image stabilization (OIS) functionality. In various embodiments, the flexure may be used to suspend the image sensor package (e.g., from the camera system's infrastructure) and allow movement of the image sensor package enabled by the actuators. In some embodiments, the flexure may be coupled to both the image sensor package and the flexible circuitry. The flexure may be configured to transmit electrical signals between the image sensor package and the flexible circuitry. Furthermore, the flexible circuitry may be configured to transmit electrical signals between the flexure and one or more external components outside the camera module.

[0022] In various embodiments, the flexure may include a layer stack arranged to improve signal routing relative to other camera systems with different arrangements. As an example, the flexure may include an electrically grounded portion having an additional conductive layer adjacent to the base layer, which reduces the total resistivity of the ground and improves performance without affecting the mechanical stiffness requirements for sensor-shift optical image stabilization (OIS). As another example, the flexure may additionally or alternatively include an impedance adjustment feature configured to increase the impedance of electrical signal pads to a target impedance closer to the impedance of the signal traces, relative to the impedance of the electrical signal pads if the flexure did not include the impedance adjustment feature. In various embodiments, a portion of the electrically grounded portion may define the impedance adjustment feature. In some embodiments, the impedance adjustment feature may include (i) a gap or (ii) a cavity at least partially filled with an insulating material (e.g., epoxy resin).

[0023] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings. Numerous specific details are set forth in the following detailed description in order to provide a thorough understanding of this disclosure. However, it will be apparent to those skilled in the art that some embodiments may be implemented without these specific details. In other instances, well-known methods, processes, components, circuits, and networks have not been described in detail so as not to unnecessarily obscure various aspects of the embodiments.

[0024] Figure 1A schematic block diagram of an exemplary camera system 100, which may include a sensor displacement flexure arrangement for improved signal routing, is shown according to some embodiments. According to various embodiments, the camera system 100 may include a lens group 102, an image sensor package 104, a flexure 106 (which may include a sensor displacement flexure arrangement), and / or flexible circuitry 108. Furthermore, the camera system 100 may include one or more actuators (e.g., voice coil motor (VCM) actuators, as referenced herein). Figure 7 (As discussed). Lens group 102 may include one or more lens elements defining optical axis 110. Additionally or alternatively, camera system 100 may have an image sensor (e.g., in image sensor package 104) within image sensor package 104. Figure 7 The image sensor 704 is orthogonal to the optical axis of the image plane defined by the image sensor 704. The image sensor can receive light that has passed through the lens group 102 and / or one or more other lens elements of the camera system 100. In addition, the image sensor can be configured to convert the captured light into an image signal.

[0025] In various embodiments, the actuator may be configured to move the image sensor package 104 (also referred to herein as “sensor shift actuation”) and / or the lens group 104. For example, the actuator may be used to move the image sensor package 104 relative to the lens group 102 to provide autofocus (AF) and / or optical image stabilization (OIS) functionality. For example, the actuator may be used to shift the image sensor package 104 in at least one direction parallel to the optical axis (e.g., in the Z-axis direction) to provide AF functionality in some embodiments. Additionally or alternatively, the actuator may be used to shift the image sensor package 104 in a direction orthogonal to the optical axis 110 (e.g., in the x-axis and / or Y-axis directions) to provide OIS functionality in some embodiments. Additionally or alternatively, the actuator may be used to move the lens group 102 relative to the image sensor package 104 to provide AF and / or OIS functionality.

[0026] For reference Figure 2 As discussed further in Figure 3, the flexure 106 can be used to suspend the image sensor package 104 (e.g., from the infrastructure of the camera system 100) and allow movement of the image sensor package 104 enabled by an actuator. In some embodiments, the flexure 106 may be coupled to the image sensor package 104 and the flexible circuitry 108, for example, as... Figure 1 As shown in the reference. Figures 3A to 3B The flexure 106 discussed herein may be configured to transmit electrical signals between the image sensor package 104 and the flexible circuit 108. Furthermore, the flexible circuit 108 may be configured to transmit electrical signals between the flexure 106 and one or more external components 112 outside the camera module.

[0027] In various embodiments, the flexure 106 may include a layer stack arranged to improve signal routing relative to other camera systems with different arrangements. As an example, the flexure 106 may include an electrically grounded portion having an additional conductive layer adjacent to the base layer, which reduces the total resistivity of the ground and improves performance without affecting the mechanical stiffness requirements for sensor-shift optical image stabilization (OIS), as referenced herein. Figures 4 to 5B Similarly, as another example, the flexure 106 may additionally or alternatively include an impedance adjustment feature configured to increase the impedance of the electrical signal pad to a target impedance that is closer to the impedance of the signal pad than the impedance of the signal trace would be if the flexure did not include the impedance adjustment feature. In various embodiments, a portion of the electrical ground portion may define the impedance adjustment feature. In some embodiments, the impedance adjustment feature may include (i) a gap or (ii) a cavity that is at least partially filled with an insulating material (e.g., epoxy resin), such as referenced herein. Figures 6A to 6B The discussion is similar.

[0028] Figure 2 A top view of an exemplary sensor shift flexure 106, which may include a sensor shift flexure arrangement for improved signal routing, is shown according to some embodiments. In various embodiments, the flexure 106 may include an inner frame 202, an outer frame 204, and / or one or more flexible arms 206. The inner frame 202 may be fixedly coupled to an image sensor (e.g., via an image sensor package 104). In some embodiments, the image sensor package 104 may include a substrate to which the image sensor is fixedly attached (e.g., ...). Figures 3A to 3B Substrate 310 in Figure 7 The substrate 712 (e.g., in the middle) is fixedly attached to the inner frame 202. The outer frame 204 may at least partially surround the inner frame 202. The outer frame 204 may be attached to the camera's mounting structure (e.g., Figure 7 The fixed structure 724) is fixedly coupled. The flexible arm 206 can be connected to the inner frame 202 and the outer frame 204, for example, as... Figure 2 As indicated in the diagram. According to various embodiments, the flexure 106 may include electrical traces on at least a portion of the flexure arm 206. The electrical traces may be configured to transmit electrical signals between the inner frame 202 and the outer frame 204, and vice versa. In various embodiments, electrical traces of different patterns may be routed from the inner frame 202 to the outer frame 204, and / or from the outer frame 204 to flexible circuitry (e.g., [missing information]). Figure 3A (Flexible circuit 304 in the example). In various embodiments, the traces may be insulated (e.g., via a dielectric layer and / or a cover layer).

[0029] According to some embodiments, the flexure 106 may include one or more electrical signal pad areas, such as, but not limited to, electrical signal pad area 208 on the inner frame 202 (e.g., including electrical signal pad 210) and / or electrical signal pad area 212 on the outer frame 204 (e.g., including electrical signal pad 214). In various embodiments, electrical traces 216 may be routed on the inner frame 202, the flexure arm 206, and / or the outer frame 204. According to various embodiments, electrical traces may be routed from electrical signal pads on the inner frame 202 to electrical signal pads on the outer frame 204 via the flexure arm 206. In some embodiments, the electrical signal traces may follow a routing path corresponding to the path of the flexure arm 206 as they extend from the inner frame 202 to the outer frame 204. In some embodiments, the electrical signal traces may be routed above and / or below the flexure arm 206. Additionally or alternatively, in some embodiments, the electrical signal traces may be at least partially embedded within the flexure arm 206.

[0030] Figures 3A to 3B A schematic block diagram of a portion of an exemplary camera, which may include a sensor displacement flexure arrangement for improving signal routing, is shown according to some embodiments. Figure 3A A portion of an exemplary camera 300a is shown, including, for example, a flexural portion 302 attached to a flexible circuit 304 via an electrical signal pad 306. Figure 3B A portion of an exemplary camera 300b, including a flexure-circuit hybrid structure 308, is shown. In various embodiments, anisotropic conductive film (ACF) bonding can be used to attach components together; however, it should be understood that one or more other attachment processes (e.g., surface mount technology (SMT) attachment processes, hot rod bonding processes, etc.) may be additionally or alternatively used to attach components in various embodiments.

[0031] like Figures 3A to 3B As indicated, cameras 300a and 300b may include a substrate 310, which is bonded to the flexure 302, for example, via electrical signal pads 412. Figure 3A (in) or bonded to the flexural portion - circuit hybrid structure 308 (in Figure 3B (middle). The substrate 310 can be bonded to an image sensor (e.g., Figure 7 Image sensor 704 in the image sensor. In some embodiments, the image sensor and / or substrate 310 may be included in the image sensor. Figure 1 The image sensor is packaged in 104. Instead of bonding the flexible portion to the flexible circuit (such as...) Figure 3A In the middle), the flexible portion-circuit hybrid structure 308 can be a single component integrating the structure and / or function of the flexible portion and the flexible circuit, thereby eliminating the need for electrical signal pads. Figure 3A ).

[0032] In camera 300a, flexible circuitry 304 can be bonded to one or more external components 314, for example, via electrical signal pads 316. In camera 300b, the flexible-circuit hybrid structure 308 can be bonded to the external component 314, for example, via electrical signal pads 316. Figures 3A to 3B In the diagram, components (and / or portions of components) within the dashed rectangle 318 may be located within the corresponding camera module, while components (and / or portions of components) outside the dashed rectangle 318 may be considered to be outside the camera module. Adhesive to flexible circuit 304 ( Figure 3A ) or flexural-circuit hybrid structure 308 ( Figure 3B The external component 314 is shown outside the dashed rectangle 318 to indicate that the external component 314 is outside the corresponding camera module.

[0033] It can be at least partially via the flexure portion 302 ( Figure 3A ) or flexural-circuit hybrid structure 308 ( Figure 3B The electrical signal is routed between the image sensor and the external component 314. For example, the electrical signal may travel along a path including the image sensor, electrical signal pads (not shown) for interconnecting the image sensor with the substrate 310, the substrate 310, electrical signal pads 312, and the flexure 302. Figure 3A ) or flexural-circuit hybrid structure 308 ( Figure 3B ), electrical signal pad 306 ( Figure 3A ), Flexible Circuit 304 ( Figure 3A The path between the electrical signal pads 316 and the external component 314 is routed from the image sensor to the external component 314 in this order, and / or vice versa. Additionally or alternatively, the camera 300a may include a through-hole 320 for routing electrical signals from one side (e.g., the bottom side) of the flexible circuit 304 to the opposite side (e.g., the top side) of the flexible circuit 304.

[0034] Figure 4 A schematic diagram of an exemplary sensor displacement flexure arrangement 400 for improving signal routing is shown according to some embodiments. In various embodiments, aspects of the sensor displacement flexure arrangement 400 may include in the sensor displacement flexure (e.g., Figure 1 and Figure 2 Flexural part 106 in Figure 3A The flexural portion 302 and / or Figure 3B In one or more portions of the flexure-circuit hybrid structure 308, etc. It is also considered that aspects of the sensor displacement flexure arrangement 400 can be used in combination with aspects of one or more other embodiments of the sensor displacement flexure arrangement described herein. As a non-limiting example, aspects of the sensor displacement flexure arrangement 400 can be combined with aspects of the sensor displacement flexure arrangement described herein. Figure 6B The aspects of the sensor displacement flexure arrangement described are used in combination.

[0035] In various embodiments, the sensor displacement deflection arrangement 400 may include layers of material stacked in a direction orthogonal to the image plane of the image sensor, for example, as indicated in the schematic diagram of layers 402-408. According to various embodiments, the layer stack may include a base layer 402, a conductive layer 404 (also referred to herein as a “first conductive layer”), one or more intermediate layers 406, and / or another conductive layer 408 (also referred to herein as a “second conductive layer”). In some embodiments, the second conductive layer may form one or more electrical traces for transmitting electrical signals and / or power. Furthermore, the base layer 402 and the first conductive layer 404 may together form an electrical ground portion for a ground current return path, for example, to carry return current from the image sensor and / or the AF / OIS driver. For example, the sensor displacement flexure arrangement 400 may include a through-hole 410 extending in a direction orthogonal to the image plane (as indicated by arrow 412) to transmit current from the second conductive layer 408 to an electrically grounded portion (e.g., to the first conductive layer 404 and / or the base layer 402, as indicated by arrows 414 and 416). In some non-limiting examples, the through-hole 410 (and / or one or more other through-holes) may be located within the inner frame of the flexure (e.g., Figure 2 The internal frame 202) and / or the external frame (e.g., Figure 2 The external frame 204 is located therein. As a non-limiting example, the through hole 410 may be located at... Figure 2 The electrical signal pad area 208 is indicated in the diagram. As another non-limiting example, via 410 may be located in... Figure 2 The electrical signal pad area 212 is indicated in the middle.

[0036] If you will refer to this article Figure 5B As discussed in further detail, the first conductive layer 404 may comprise a material having relatively high electrical conductivity. This contrasts with the situation where only the base layer 402 is used in the return path of the electrically grounded current without the first conductive layer 404 (e.g., as...). Figure 5A As indicated herein (excluding the first conductive layer), the first conductive layer 404 can be used to reduce the ground current resistance of the flexure. In some embodiments, the intermediate layer 406 may include one or more layers positioned between the first conductive layer 404 and the second conductive layer 408 in a direction orthogonal to the image plane. As referenced herein Figure 5B As discussed further, the intermediate layer may include one or more adhesive layers (e.g., adhesive layer 522) and / or one or more dielectric layers (e.g., dielectric layer 524).

[0037] Figures 5A to 5B A schematic diagram of an exemplary sensor displacement flexure arrangement is shown. Figure 5AAn exemplary sensor displacement flexure arrangement 500a is shown, comprising a layer stack with a ground path, the ground path including a base layer without an adjacent conductive layer. Figure 5B Another sensor displacement flexure arrangement 500b, comprising a layer stack with a ground path, is shown according to some embodiments, the ground path including a base layer and an additional conductive layer (e.g., adjacent to the base layer).

[0038] In various implementation schemes, the sensor displacement flexure is arranged at 500°. Figure 5A ) may be included in the interaction with an image sensor (e.g., Figure 1 The image sensor package 104 includes an image sensor, Figure 7 The material layers are stacked in a direction orthogonal to the image plane of an image sensor 704 (e.g., in the image sensor 704). For example, as shown in the schematic diagram of layers 502-510. According to various embodiments, the layer stack may include a base layer 502, one or more intermediate layers (e.g., including an adhesion layer 504 and / or a dielectric layer 506), a seed layer 508, and a conductive layer 510.

[0039] In some embodiments, the conductive layer 510 may form one or more electrical traces for transmitting electrical signals and / or power. Additionally, the base layer 502 may include an electrically grounded portion for a ground current return path. For example, the sensor displacement flexure arrangement 500a may include a through-hole 512 extending in a direction orthogonal to the image plane (as indicated by arrow 514) to transmit current from the conductive layer 510 to the electrically grounded portion (e.g., to the base layer 502, as indicated by arrow 516). In some non-limiting examples, the through-hole 512 (and / or one or more other through-holes) may be located within the inner frame of the flexure (e.g., Figure 2 The internal frame 202) and / or the external frame (e.g., Figure 2 At the external frame (204) in the middle.

[0040] In various implementation schemes, the sensor displacement flexure is arranged at 500°. Figure 5B The stack may include material layers stacked in a direction orthogonal to the image plane, for example, as indicated by the schematic diagram of layers 518-528. According to various embodiments, the layer stack may include a base layer 518, a first conductive layer 520, one or more intermediate layers (e.g., including an adhesion layer 522 and / or a dielectric layer 524), a seed layer 526, and a second conductive layer 528.

[0041] In some embodiments, the second conductive layer 528 may form one or more electrical traces for transmitting electrical signals and / or power. Furthermore, the base layer 518 and the first conductive layer may include electrically grounded portions for ground current return paths. For example, the sensor displacement flexure arrangement 500b may include a via 530 extending in a direction orthogonal to the image plane (as indicated by arrow 532) to transmit current from the second conductive layer 528 to the electrically grounded portion (e.g., to the first conductive layer 520 and / or the base layer 518, as indicated by arrows 534 and 536). In some non-limiting examples, the via 530 (and / or one or more other vias) may be located within the inner frame of the flexure (e.g., Figure 2 The internal frame 202) and / or the external frame (e.g., Figure 2 At the external frame (204) in the middle.

[0042] As discussed earlier, the sensor displacement flexure is arranged at 500a ( Figure 5A This does not include arrangements similar to sensor displacement flexures (500b). Figure 5B An additional conductive layer is added to the first conductive layer 520. By adding a highly conductive and relatively thin ground plane (such as the first conductive layer 520) to the electrically grounded portion, which includes a base layer (which may be designed to be sufficiently rigid for suspending the image sensor on a fixed structure and may include a metallic alloy with relatively low conductivity), the total resistivity of the electrically grounded portion and / or the ground current return path can be reduced. This can improve the signal routing performance of the deflection without affecting the mechanical stiffness requirements of the sensor displacement deflection. For example, in some examples, the reduced ground DC resistivity (DCR) may result in a lower voltage drop across the camera module's power rails. Furthermore, in some examples, the improved ground impedance and AC return path can reduce variations in the image quality performance of the camera module. Additionally, the lower voltage drop can improve camera module thermal performance, which in some examples can lead to a relatively higher streaming time.

[0043] According to some embodiments, base layer 502 and / or base layer 518 may be configured to provide sufficient rigidity so that the sensor displacement flexure can suspend the image sensor package on the camera's fixed structure. Furthermore, at least a portion of base layer 502 and / or base layer 518 (e.g., a portion of the base layer used to form the flexure arm) may be configured to have sufficient compliance to allow the image sensor to move in a direction enabled by the actuator.

[0044] In some non-limiting embodiments, base layer 502 and / or base layer 518 may comprise a nickel-cobalt (NiCo) alloy and / or a copper-titanium (CuTi) alloy (e.g., having an electrical conductivity of 10%-40% of the International Annealed Copper Standard (IACS)). In some embodiments, base layer 502 and / or base layer 518 may comprise electrically formed NiCo for regions of the flexural portion 302 to increase rigidity in those regions. Furthermore, base layer 502 and / or base layer 518 may have a thickness ranging from 30 μm to 150 μm in a direction orthogonal to the image plane.

[0045] According to various embodiments, the conductive layer 520 may be positioned adjacent to the base layer 518. In some embodiments, the first conductive layer 520 may include copper. For example, the first conductive layer 520 may include electroplated copper. Furthermore, in some embodiments, the first conductive layer 520 may have a thickness ranging from 2 μm to 30 μm in a direction orthogonal to the image plane.

[0046] In some implementation schemes, Figure 5A The adhesion layer 504 can be positioned adjacent to the base layer 502 in a direction orthogonal to the image plane (e.g., between the base layer 502 and the dielectric layer 506). Figure 5B The adhesion layer 522 may be positioned adjacent to the first conductive layer 520 (e.g., between the first conductive layer 520 and the dielectric layer 524). According to some embodiments, the adhesion layer 504 and / or the adhesion layer 522 may include chromium (e.g., physical vapor deposition (PVD) chromium). Furthermore, in some embodiments, the adhesion layer 504 and / or the adhesion layer 522 may have a thickness ranging from 50 nm to 200 nm in a direction orthogonal to the image plane.

[0047] In some implementation schemes, Figure 5A The dielectric layer 506 can be positioned between the adhesive layer 504 and the seed layer 508 (e.g., adjacent to the adhesive layer 504 and the seed layer 508) in a direction orthogonal to the image plane. Figure 5B The dielectric layer 524 can be positioned between the adhesion layer 522 and the seed layer 526 (e.g., adjacent to the adhesion layer 522 and the seed layer 526) in a direction orthogonal to the image plane. According to some embodiments, the dielectric layer 506 and / or the dielectric layer 524 may comprise polyimide (e.g., photosensitive polyimide) and / or a deposited film (e.g., a dry insulating deposited film), etc. Furthermore, in some embodiments, the dielectric layer 506 and / or the dielectric layer 524 may have a thickness ranging from 8 μm to 14 μm in a direction orthogonal to the image plane.

[0048] In some implementation schemes, Figure 5AThe seed layer 508 can be positioned between the dielectric layer 506 and the conductive layer 510 (e.g., adjacent to the dielectric layer 506 and the conductive layer 510) in a direction orthogonal to the image plane. Figure 5B The seed layer 526 can be positioned between the dielectric layer 524 and the second conductive layer 528 (e.g., adjacent to the dielectric layer 524 and the second conductive layer 528) in a direction orthogonal to the image plane. According to some embodiments, the seed layer 508 and / or the seed layer 526 may include chromium (e.g., physical vapor deposition (PVD) chromium). Furthermore, in some embodiments, the seed layer 508 and / or the seed layer 526 may have a thickness ranging from 50 nm to 200 nm in a direction orthogonal to the image plane.

[0049] In some implementation schemes, Figure 5A The conductive layer 510 can be positioned adjacent to the seed layer 508 in a direction orthogonal to the image plane. Figure 5B The second conductive layer 528 may be positioned adjacent to the seed layer 526 in a direction orthogonal to the image plane. According to some embodiments, the conductive layer 510 and / or conductive layer 528 may include copper. For example, the conductive layer 510 and / or conductive layer 528 may include electroplated copper. Furthermore, in some embodiments, the conductive layer 510 and / or conductive layer 528 may have a thickness ranging from 2 μm to 30 μm in a direction orthogonal to the image plane.

[0050] Figures 6A to 6D A schematic diagram of an exemplary sensor displacement flexure arrangement is shown. Figure 6A An exemplary sensor displacement flexure arrangement 600a is shown, which includes a stack of layers without impedance adjustment features. Figures 6B to 6D Other exemplary sensor displacement flexure arrangements 600b-600d, including a layer stack containing impedance adjustment features, are shown according to some embodiments. As discussed herein, one or more impedance adjustment features can be used to adjust (e.g., increase) the impedance of electrical signal pads used to interconnect the flexure with other components, for example, to better match the pad impedance to channel impedance requirements, which can enable various signal routing improvements. Figures 6B to 6D Non-limiting examples are provided of how the size of an electrically coupled region (e.g., the region between an electrical signal pad and a reference plane) can be reduced by employing an impedance adjustment feature (e.g., a region in which a portion of a conductive layer and / or base layer is removed). The coupling region affects the impedance at the signal pad. By appropriately determining the size of the impedance adjustment feature, the coupling region and thus the signal pad impedance can be tuned. For example, it might be desirable to tune the signal pad impedance to match the impedance of the signal interconnects (traces) connected to the signal pad.

[0051] In various embodiments, each of the sensor displacement flexure arrangements 600a-600d may be included in relation to an image sensor (e.g., Figure 1 The image sensor package 104 includes an image sensor, Figure 7 The material layers are stacked in a direction orthogonal to the image plane of an image sensor 704, etc. According to various embodiments, the layer stack may include a base layer 602, a first conductive layer 604, an adhesion layer 606, a dielectric layer 608, a seed layer 610, and / or a second conductive layer 612. These layers may have the same characteristics as those referenced herein. Figures 4 to 5B The layers in the described stack have the same or similar properties. Although the first conductive layer 604 is included... Figures 6A to 6B In (e.g., in) Figure 4 and Figure 5B (as shown in the stack), but it should be understood that in various embodiments, the first conductive layer may not be included (as in...). Figure 5A In the stack shown, the adhesive layer 504 is adjacent to the base layer 502.

[0052] Furthermore, the sensor displacement flexure arrangement 600a-600d may include one or more electrical signal pads 614 (e.g., high-speed signal pads and / or electroless nickel immersion gold (ENIG) pads, etc.). In some embodiments, one or more portions of the sensor displacement flexure arrangement 600a-600d may include a cover layer 616 (e.g., polyimide, Flex-finer material, etc.), such as one positioned between signal pads 614a and 614b in a direction parallel to the image plane. In some embodiments, the cover layer 616 may cover the conductive layer 612 in certain portions of the flexure, for example, such that the covered portion of the conductive layer 612 is sandwiched between the cover layer 616 and one or more other layers (e.g., seed layer 610).

[0053] like Figure 6B As indicated, in some embodiments, the base layer 602 and the conductive layer 604 (or in some examples only the base layer 602) may include an electrically grounded portion 618 (which may include a reference plane), for example, as referenced herein. Figures 4 to 5B The adhesive layer 606 and / or dielectric layer 608 may form the intermediate portion 620, for example, as referenced herein. Figures 4 to 5B Similarly, the seed layer 610, conductive layer 612, and / or electrical signal pads 614 may constitute a signal trace interconnect portion 622, which can be used to interconnect signal traces on the flexure with one or more other components, such as those referenced herein. Figures 1 to 3B The subject of discussion.

[0054] In some implementations, the signal trace interconnect portion 622 may be located within the inner frame of the flexure (e.g., Figure 2 The internal frame 202) and / or the external frame (e.g., Figure 2The signal trace interconnect portion 622 may be located at the outer frame 204. As a non-limiting example, the signal trace interconnect portion 622 may be located at... Figure 2 The electrical signal pad area 208 is indicated in the diagram. For example, electrical signal pad 614 may include an electrical signal pad for connecting the inner frame of the flexure to the image sensor substrate (and / or another component of the image sensor package), such as... Figure 3A The electrical signal pads 312 are made relative to the connection of the flexure 302 to the substrate 310. As another non-limiting example, the signal trace interconnect portion 622 may be located in... Figure 2 The electrical signal pad area 212 is indicated in the diagram. For example, electrical signal pad 614 may include electrical signal pads for connecting the outer frame of the flexure to flexible circuitry (and / or one or more other components), such as... Figure 3A The electrical signal pad 306 in the circuit is used to connect the flexure 302 to the flexible circuit 304.

[0055] In various embodiments, the electrical signal pad 614 can be constrained to a relatively large width and / or length through processes used to attach the flexure to other components. Non-limiting examples of attachment processes may include ACF bonding processes, SMT bonding processes, and / or hot-stick bonding processes, etc. The large size of the electrical signal pad 614 can result in a relatively low impedance, which can lead to poor channel performance of electrical signals (e.g., high-speed signals) when there is an impedance mismatch between the electrical signal pad 614 and the corresponding signal channel (e.g., the electrical signal trace formed by the conductive layer 612).

[0056] like Figure 6A As indicated, the signal trace interconnection portion 622 of the sensor displacement flexure arrangement 600a may have a relatively large number of couplings 624 via the intermediate portion 620 to the electrically grounded portion / reference plane 618. By comparison, as Figure 6BAs indicated, the signal trace interconnect portion 622 of the sensor displacement flexure arrangement 600b may have a relatively small amount of coupling 626 via the intermediate portion 620 to the electrically grounded portion / reference plane 618. This small amount of coupling 626 in the sensor displacement flexure arrangement 600b can be achieved by including one or more impedance adjustment features (e.g., impedance adjustment feature 628) in the electrically grounded portion / reference plane 618. For example, the impedance adjustment feature 628 may be designed to reduce the amount of coupling and thereby increase the impedance of the electrical signal pad 614a to better match the target channel impedance, thereby achieving improved time-domain reflectometry (TDR). For example, better matching the pad impedance to the channel impedance can help reduce channel return loss. Reducing channel return loss improves signal integrity. Improved signal integrity enables higher channel bandwidth. Furthermore, improved signal integrity can help reduce system power consumption, for example, by reducing signal / power transmitter wobbling and / or optimizing signal / power receiver equalization requirements.

[0057] In various embodiments, the impedance adjustment feature 628 may include (i) a gap (e.g., an empty space) and / or (ii) a cavity that is at least partially filled with an insulating material (e.g., epoxy resin). In various embodiments, the impedance adjustment feature 628 may be positioned along an axis intersecting with a signal trace interconnect portion 622, the impedance of which is adjusted using the impedance adjustment feature 628. For example, the impedance adjustment feature 628 may be located within the space below a given electrical signal pad 614. Although Figure 6B The presence of a single impedance adjustment feature 628 is indicated, but it should be understood that multiple discrete impedance adjustment features 628 may be included below the electrical signal pad 614.

[0058] In some implementations, the impedance adjustment feature 628 may be offset from the center of the electrical signal pad 614, for example, as Figure 6B As indicated. In some embodiments, the impedance adjustment feature 628 may be centered relative to the electrical signal pad 614. The characteristics of the impedance adjustment feature 628 may be determined at least in part based on a predetermined target impedance (for the electrical signal pad 614), such as, but not limited to, size (e.g., depth and / or width), position, orientation, shape, material, fill amount, etc. The impedance adjustment feature 628 is designed to achieve the predetermined target impedance, for example, to match signal channel impedance requirements, and / or to adjust the impedance of the electrical signal pad to within a threshold impedance value close to the signal channel impedance.

[0059] In some embodiments, the impedance adjustment feature 628 may include a slot formed using one or more subtractive manufacturing processes (e.g., etching and / or photolithography). The slot may have a depth extending through at least a portion of the electrically grounded portion / reference plane 618 in a direction orthogonal to the image plane. That is, at least a portion of the electrically grounded portion / reference plane 618 may define the impedance adjustment feature 628. In some embodiments, the depth of the slot may extend through a portion of the first conductive layer 604 or through the entire depth of the first conductive layer 604 without extending into the base layer 602. In some embodiments, the depth of the slot may extend through both the first conductive layer 604 and a portion of the base layer 602. In some embodiments, the depth of the slot may extend through the first conductive layer 604 and through the entire depth of the base layer 604. In some embodiments, for example, in the absence of the first conductive layer 604 (such as...), Figure 5A (In the middle), the depth of the slot can extend through a portion of the base layer 518 or through the entire depth of the base layer 518.

[0060] According to some embodiments, the slot may have a width extending along a portion of the width of the electrical signal pad 614 or along the entire width of the electrical signal pad 614 in a direction parallel to the image plane. In various embodiments, the slot may have an outermost periphery in a direction parallel to the image plane that is less than or equal to the outermost periphery of the electrical signal pad 614. Furthermore, the outermost periphery of the slot may be constrained to a position within the outermost periphery of the electrical signal pad 614, for example, if both outermost peripheries are projected onto the image plane.

[0061] As previously mentioned Figure 6A As mentioned, the signal trace interconnection portion 622 of the sensor displacement flexure arrangement 600a may have a relatively large number of couplings 624 via the intermediate portion 620 to the electrically grounded portion / reference plane 618. By comparison, such as Figure 6C As indicated, the signal trace interconnect portion 622 of the sensor displacement flexure arrangement 600c may have a relatively small amount of coupling 630 via the intermediate portion 620 to the electrically grounded portion / reference plane 618. The small amount of coupling 630 in the sensor displacement flexure arrangement 600c can be achieved by including one or more impedance adjustment features (e.g., impedance adjustment feature 632) in the electrically grounded portion / reference plane 618.

[0062] In some implementation schemes, Figure 6CThe impedance adjustment feature 632 can be a hole formed using an additive manufacturing process, for example, by electroplating a conductive layer 604 (excluding part or all of the space beneath the signal trace interconnect portion 622). In other words, the unplated space of the conductive layer 604 can be a hole / impedance adjustment feature 632. In some non-limiting examples, the impedance adjustment feature 632 can be a hole in the conductive layer 604, between the base layer 602 and the adhesive layer 606, and beneath the signal trace interconnect portion 622.

[0063] The characteristics of the impedance adjustment feature 632 may be determined at least in part based on a predetermined target impedance (for electrical signal pad 614), such as, but not limited to, size (e.g., depth and / or width), location, orientation, shape, material, fill amount, etc. The impedance adjustment feature 632 is designed to achieve the predetermined target impedance, for example, to match signal channel impedance requirements, and / or to adjust the impedance of the electrical signal pad to within a threshold impedance value close to the signal channel impedance.

[0064] like Figure 6D As indicated, the signal trace interconnection portion 622 of the sensor displacement flexure arrangement 600d may have a relatively small amount of coupling 634 via the intermediate portion 620 to the electrically grounded portion / reference plane 618 (with... Figure 6A Compared to the relatively large number of couplings 624 in the sensor displacement flexure arrangement 600d, the smaller number of couplings 630 in the sensor displacement flexure arrangement 600d can be achieved by including one or more impedance adjustment features (e.g., impedance adjustment feature 636) in the electrically grounded portion / reference plane 618.

[0065] In some implementation schemes, Figure 6D The impedance adjustment feature 636 can be an open cavity formed using a subtractive manufacturing process (e.g., an etching process) that removes one or more portions of the base layer 602, conductive layer 604, and / or adhesive layer 606. As a non-limiting example, the open cavity / impedance adjustment feature 636 can be formed during an etching process that also removes other portions of the flexure, for example, to form a flexure arm (e.g., Figure 2 (Flexible arm 206 in the middle). In some non-limiting examples, the open hole / impedance adjustment feature 636 can be formed by etching through at least a portion of the base layer 602, conductive layer, and adhesive layer 606 beneath the signal trace interconnect portion 622, for example, as... Figure 6D As instructed.

[0066] The characteristics of the impedance adjustment feature 636 may be determined at least in part based on a predetermined target impedance (for electrical signal pad 614), such as, but not limited to, size (e.g., depth and / or width), location, orientation, shape, material, fill amount, etc. The impedance adjustment feature 636 is designed to achieve the predetermined target impedance, for example, to match signal channel impedance requirements, and / or to adjust the impedance of the electrical signal pad to within a threshold impedance value close to the signal channel impedance.

[0067] Figure 7 A schematic cross-sectional side view of a portion of an exemplary camera 700, which may include one or more actuators and a sensor displacement flexure arrangement for improving signal routing, is shown according to some embodiments. In some embodiments, the camera 700 may include a lens group 702, an image sensor 704, and a voice coil motor (VCM) actuator module 706. The lens group 702 may define an optical axis. The image sensor 704 may be configured to capture light passing through the lens group 702 and convert the captured light into an image signal. In some cases, the VCM actuator module 706 may be one of a plurality of VCM actuator modules of the camera 700. For example, the camera 700 may include four such VCM actuator modules 706, such as two pairs of VCM actuator modules 706 opposite to each other relative to the lens group 702. The VCM actuator module 706 may be configured to move the lens group 702 along the optical axis (e.g., in the z-axis direction to provide autofocus (AF) functionality) and / or tilt the lens group 702 relative to the optical axis. Furthermore, the VCM actuator module 706 can be configured to move the image sensor 704 in a direction orthogonal to the optical axis (e.g., in the x-axis and / or y-axis directions to provide optical image stabilization (OIS) functionality).

[0068] In various embodiments, the VCM actuator module 706 may include a magnet 708 (e.g., a fixed monopole magnet), a lens holder 710, a substrate 712, a top flexure (not shown), and a bottom flexure 714 (e.g., including one or more sensor displacement flexure arrangements disclosed herein). In various embodiments, the bottom flexure 714 may be coupled with... Figures 1 to 2 The flexural part 106 in the middle Figure 3A The flexural portion 302 and / or Figure 3B The flexural-circuit hybrid structure 308 is the same as or similar to that in the VCM actuator module 706. Furthermore, the VCM actuator module 706 may include an AF coil 716 and a bottom sensor positioning (SP) coil 718.

[0069] In some embodiments, the lens holder 710 may hold or otherwise support the AF coil 716 on the side adjacent to the magnet 708. The lens holder 710 may be coupled to the lens assembly 702 such that the lens assembly 702 is displaced together with the lens holder 710.

[0070] In various embodiments, substrate 712 may hold or otherwise support the bottom SP coil 718 near the bottom side of magnet 708. Substrate 712 may be coupled to image sensor 704 such that image sensor 704 is displaced together with substrate 712. In some embodiments, substrate 712 may also be coupled to or otherwise support an infrared cutoff filter (IRCF) 720 (and / or one or more other optical elements), for example, as... Figure 7 As instructed.

[0071] In some implementations, the VCM actuator module 706 may include a position sensor 722 (e.g., a Hall sensor) for position detection based on the movement of the SP coil 718 in a direction orthogonal to the optical axis. For example, the position sensor 722 may be located on the substrate 712 near the SP coil 718.

[0072] The flexure portion 714 can be configured to provide compliance with the movement of the substrate 712 in a direction orthogonal to the optical axis. Furthermore, the flexure portion 714 can be configured to suspend the substrate 712 and the image sensor 704 on one or more fixing structures 724 of the camera 700.

[0073] A top flexure (not shown) may be configured to mechanically and electrically connect the lens holder 710 to the shielding canister 726 and / or one or more other fixing structures (e.g., fixing structure 724). The top flexure may be configured to provide compliance with movement of the lens holder 710 along the optical axis and tilting of the lens holder 710 relative to the optical axis. The shielding canister 726 may at least partially enclose the interior of the camera 700. The shielding canister 726 may be a fixed component that is static relative to one or more moving parts (e.g., the lens holder 710 and the substrate 712).

[0074] In some implementations, the fixed magnet 708 may be fixed to a fixed structure (e.g., magnet retainer 728). In some examples, each of the AF coil 716 and SP coil 718 may be a racetrack-shaped coil.

[0075] The electromagnetic interaction between the AF coil 716 and the magnet 708 can generate a Lorentz force that causes the lens holder 710 to move along the optical axis and / or tilt relative to the optical axis. The electromagnetic interaction between the SP coil 718 and the magnet 708 can generate a Lorentz force that causes the substrate 712 to move in a direction orthogonal to the optical axis. The lens assembly 702 can be displaced together with the lens holder 710 (e.g., directly in front of and behind it). Furthermore, the image sensor 704 can be displaced together with the substrate 712 (e.g., directly in front of and behind it).

[0076] As referenced in this article Figures 1 to 6BThe discussed electrical contacts / connections allow electrical signals (e.g., image signals) to be transmitted from the image sensor 704 to a controller (not shown). For example, the image sensor 704 may be electrically contacted with the substrate 712 via one or more contacts, and thus the image signal can be transmitted from the image sensor 704 to the substrate 712. The image signal may be transmitted via the flexure 714 and flexible circuitry (e.g., Figure 1 Flexible circuit 108 in Figure 3A Flexible circuit 304, etc., is transferred from substrate 712 to one or more external components (e.g., Figures 3A to 3B (External component 314 in the middle). According to various examples, electrical contacts / connections may allow current to be transferred from the controller to the substrate 712 to drive the SP coil 718.

[0077] Figure 8 A schematic representation of an exemplary device 800, which may include one or more cameras, is shown. For example, device 800 may include a camera system having a sensor displacement flexure arrangement for improving signal routing, such as those referenced herein. Figures 1 to 7 The described camera system and sensor displacement flexure arrangement. In some embodiments, device 800 may be a mobile device and / or a multi-functional device. In various embodiments, device 800 may be any type of device, including but not limited to: personal computer systems, desktop computers, laptops, notebook computers, tablet computers, all-in-one computers, tablet computers or netbooks, mainframe computers, handheld computers, workstations, network computers, cameras, set-top boxes, mobile devices, augmented reality (AR) and / or virtual reality (VR) headsets, consumer devices, video game controllers, handheld video game devices, application servers, storage devices, televisions, video recording equipment, peripheral devices (such as switches, modems, routers), or any type of computing or electronic device in general.

[0078] In some embodiments, device 800 may include a display system 802 (e.g., including a display and / or a touch-sensitive surface) and / or one or more cameras 804. In some non-limiting embodiments, the display system 802 and / or one or more forward-facing cameras 804a may be disposed on the front side of device 800, for example, as shown in the image. Figure 8 As indicated. Additionally or alternatively, one or more rear-facing cameras 804b may be located at the rear of the device 800. In some embodiments including multiple cameras 804, some or all of the cameras 804 may be identical or similar to each other. Additionally or alternatively, some or all of the cameras 804 may be different from each other. In various embodiments, the position and / or arrangement of the cameras 804 may vary. Figure 8 The cameras indicated in the document.

[0079] Among other things, device 800 may include memory 806 (e.g., including operating system 808 and / or application / program instructions 810), one or more processors and / or controllers 812 (e.g., including CPU, memory controller, display controller and / or camera controller, etc.) and / or one or more sensors 814 (e.g., orientation sensor, proximity sensor and / or position sensor, etc.). In some embodiments, device 800 may communicate with one or more other devices and / or services such as computing device 816, cloud service 818, etc., via one or more networks 820. For example, device 800 may include a network interface (e.g., Figure 9 The network interface 910 enables device 800 to transmit data to and receive data from network 820. Additionally or alternatively, device 800 may be able to communicate wirelessly with other devices using any of a variety of communication standards, protocols, and / or technologies.

[0080] Figure 9 A schematic block diagram of an exemplary computer system 900, which may include a camera having a sensor displacement flexure arrangement for improved signal routing, is shown, for example, as referenced herein. Figures 1 to 8 As described above. Furthermore, the computer system 900 can implement methods for controlling the operation of the camera and / or for performing image processing on images captured by the camera. In some embodiments, additionally or alternatively, the device 800 (referencing herein) Figure 8 The (described) may include some or all of the functional components described herein.

[0081] Computer system 900 may be configured to execute any or all of the above-described embodiments. In different embodiments, computer system 900 may be any type of device, including but not limited to: personal computer systems, desktop computers, laptops, notebook computers, tablet computers, all-in-one computers, tablet computers or netbooks, mainframe computers, handheld computers, workstations, network computers, cameras, set-top boxes, mobile devices, augmented reality (AR) and / or virtual reality (VR) headsets, consumer devices, video game controllers, handheld video game devices, application servers, storage devices, televisions, video recording equipment, peripherals (such as switches, modems, routers), or any type of computing or electronic device in general.

[0082] In the illustrated embodiment, computer system 900 includes one or more processors 902 coupled to system memory 904 via input / output (I / O) interface 906. Computer system 900 also includes one or more cameras 908 coupled to I / O interface 906. Computer system 900 also includes a network interface 910 coupled to I / O interface 906 and one or more input / output devices 912, such as cursor control device 914, keyboard 916, and display 918. In some cases, it is conceivable that the embodiment may be implemented using a single instance of computer system 900, while in other embodiments, multiple such systems or multiple nodes constituting computer system 900 may be configured to host different parts or instances of the embodiment. For example, in one embodiment, some elements may be implemented via one or more nodes of computer system 900 that are different from those implementing other elements.

[0083] In various implementations, computer system 900 may be a single-processor system including one processor 902, or a multiprocessor system including several processors 902 (e.g., two, four, eight, or another suitable number). Processor 902 may be any suitable processor capable of executing instructions. For example, in various implementations, processor 902 may be a general-purpose or embedded processor implementing any of a variety of instruction set architectures (ISAs) (such as x86, PowerPC, SPARC, or MIPS ISA or any other suitable ISA). In a multiprocessor system, each of processors 902 may, but is not required to, implement the same ISA.

[0084] System memory 904 may be configured to store program instructions 920 accessible by processor 902. In various embodiments, system memory 904 may be implemented using any suitable memory technology, such as static random access memory (SRAM), synchronous dynamic RAM (SDRAM), non-volatile / flash memory, or any other type of memory. Additionally, existing camera control data 922 in memory 904 may include any of the aforementioned information or data structures. In some embodiments, program instructions 920 and / or data 922 may be received, transmitted, or stored on a different type of computer-accessible medium or similar medium separate from system memory 904 or computer system 900. In various embodiments, some or all of the functions described herein may be implemented via such computer system 900.

[0085] In one embodiment, I / O interface 906 may be configured to coordinate I / O traffic between processor 902, system memory 904, and any peripheral devices (including network interface 910 or other peripheral device interfaces, such as input / output devices 912) within the device. In some embodiments, I / O interface 906 may perform any necessary protocol, timing, or other data conversions to convert data signals from one component (e.g., system memory 904) into a format suitable for use by another component (e.g., processor 902). In some embodiments, I / O interface 906 may include support for devices attached, for example, via various types of peripheral buses (e.g., variants of the Peripheral Component Interconnect (PCI) bus standard or the Universal Serial Bus (USB) standard). In some embodiments, the functionality of I / O interface 906 may be divided among two or more separate components, such as a north bridge and a south bridge. Furthermore, in some embodiments, some or all of the functionality of I / O interface 906 (such as an interface to system memory 904) may be directly incorporated into processor 902.

[0086] Network interface 910 can be configured to allow data exchange between computer system 900 and other devices (e.g., bearers or agent devices) attached to network 924, or between nodes of computer system 900. In various embodiments, network 924 may include one or more networks, including but not limited to local area networks (LANs) (e.g., Ethernet or enterprise networks), wide area networks (WANs) (e.g., the Internet), wireless data networks, some other electronic data network, or some combination thereof. In various embodiments, network interface 910 may support communication via wired or wireless general-purpose data networks (such as any suitable type of Ethernet network); communication via telecommunications / telephone networks (such as analog voice networks or digital fiber optic communication networks); communication via storage area networks (such as Fibre Channel SANs); or communication via any other suitable type of network and / or protocol.

[0087] In some implementations, input / output device 912 may include one or more display terminals, keyboards, keypads, touchpads, scanning devices, voice or optical recognition devices, or any other device suitable for inputting or accessing data by one or more computer systems 900. Multiple input / output devices 912 may be present in the computer system 900 or distributed across various nodes of the computer system 900. In some implementations, similar input / output devices may be separate from the computer system 900 and may interact with one or more nodes of the computer system 900 via wired or wireless connections (such as through network interface 910).

[0088] Those skilled in the art will understand that computer system 900 is merely illustrative and not intended to limit the scope of embodiments. Specifically, computer systems and devices may include any combination of hardware or software capable of performing the indicated functions, including computers, network devices, internet devices, PDAs, wireless telephones, pagers, etc. Computer system 900 may also be connected to other devices not shown, or conversely, may operate as a stand-alone system. Furthermore, the functionality provided by the illustrated components may, in some embodiments, be combined into fewer components or distributed across additional components. Similarly, in some embodiments, the functionality of some of the illustrated components may not be provided, and / or other additional functions may be available.

[0089] Those skilled in the art will also recognize that, although various items are shown as being stored in memory or on storage devices during use, these items, or portions thereof, may be transferred between memory and other storage devices for memory management and data integrity purposes. Alternatively, in other embodiments, some or all of these software components may be executed in memory on another device and communicate with the illustrated computer system via inter-computer communication. Some or all of the system components or data structures may also be stored (e.g., as instructions or structured data) on a computer-accessible medium or portable article of manufacture for reading by a suitable drive, various examples of which are described above. In some embodiments, instructions stored on a computer-accessible medium separate from computer system 900 may be transmitted to computer system 900 via a transmission medium or signal (such as electrical, electromagnetic, or digital signals transmitted via communication media such as networks and / or wireless links). Various embodiments may also include receiving, transmitting, or storing instructions and / or data implemented according to the above description on a computer-accessible medium. Generally, computer-accessible media can include non-transitory computer-readable storage media or memory media, such as magnetic or optical media, like discs or DVD / CD-ROMs, and volatile or non-volatile media, such as RAM (e.g., SDRAM, DDR, RDRAM, SRAM, etc.), ROM, etc. In some embodiments, computer-accessible media can include transmission media or signals, such as electrical, electromagnetic, or digital signals transmitted via communication media such as networks and / or wireless links.

[0090] In various implementations, the methods described herein can be implemented in software, hardware, or a combination thereof. Furthermore, the order of the blocks of the method can be changed, and various elements can be added, reordered, combined, omitted, modified, etc. Various modifications and changes will be apparent to those skilled in the art who benefit from this disclosure. The various implementations described herein are intended to be illustrative and not restrictive. Many variations, modifications, additions, and improvements are possible. Thus, multiple examples may be provided for a component described herein as a single example. The boundaries between various components, operations, and data repositories are somewhat arbitrary, and specific operations are shown in the context of a particular exemplary configuration. Other allocations of functionality are contemplated, which may fall within the scope of the appended claims. Finally, the structures and functions of discrete components presented in exemplary configurations can be implemented as combined structures or components. These and other variations, modifications, additions, and improvements may fall within the scope of the implementations as defined in the following claims.

Claims

1. A camera, the camera comprising: Lens group; Image sensor; An actuator for moving the image sensor relative to the lens group; as well as A flexural portion that suspends the image sensor on the camera's fixed structure and allows movement of the image sensor enabled by the actuator, the flexural portion comprising: Multiple layers, stacked in a direction orthogonal to the image plane defined by the image sensor, the multiple layers comprising: The electrical grounding part includes: A base layer, the base layer comprising a metal alloy; and A conductive layer adjacent to the base layer, wherein the conductive layer provides a ground plane that reduces the ground current resistance of the flexure relative to the ground current resistance of the base layer without the conductive layer.

2. The camera according to claim 1, wherein: The conductive layer is a first conductive layer; as well as The plurality of layers also includes: Second conductive layer; A dielectric layer, positioned between the first conductive layer and the second conductive layer in a direction orthogonal to the image plane; and A via, configured to transmit current from the second conductive layer to the first conductive layer, wherein the via extends through the dielectric layer in a direction orthogonal to the image plane.

3. The camera of claim 1, wherein the conductive layer is a copper layer with a thickness ranging from about 2 micrometers to about 30 micrometers.

4. The camera according to claim 1, wherein the plurality of layers further comprises: The signal trace interconnect portion includes: Electrical signal pads, the electrical signal pads being used to attach the flexure to one or more other components; and The intermediate portion includes: A dielectric layer, positioned in a direction orthogonal to the image plane between the conductive layer of the electrically grounded portion and the signal trace interconnect portion; and A portion of the electrical grounding portion defines an impedance adjustment feature, the impedance adjustment feature including (i) a gap or (ii) a cavity, the gap or cavity being at least partially filled with an insulating material, and wherein the impedance adjustment feature is positioned along an axis intersecting the interconnecting portion of the signal trace.

5. The camera according to claim 4, wherein: The conductive layer is a first conductive layer; The intermediate portion includes: An adhesive layer, the adhesive layer being adjacent to the first conductive layer; and A dielectric layer adjacent to the adhesion layer; The signal trace interconnection portion further includes: A second conductive layer defines an electrical signal trace; The electrical signal pads are positioned adjacent to the electrical signal traces; and The impedance adjustment feature is configured to increase the impedance of the electrical signal pad to a target impedance that is closer to the impedance of the electrical signal pad than the impedance of the electrical signal trace if the flexure did not include the impedance adjustment feature.

6. The camera according to claim 5, wherein the impedance adjustment feature is an empty gap.

7. The camera according to claim 5, wherein the impedance adjustment feature is an epoxy resin-filled cavity.

8. An apparatus, the apparatus comprising: One or more processors; A memory that stores program instructions that can be executed by the one or more processors to control the operation of the camera; as well as The camera, the camera includes: Lens group; Image sensor; An actuator for moving the image sensor relative to the lens group; and A flexural portion that suspends the image sensor on the camera's fixed structure and allows movement of the image sensor enabled by the actuator, the flexural portion comprising: Multiple layers, stacked in a direction orthogonal to the image plane defined by the image sensor, the multiple layers comprising: The electrical grounding part includes: A base layer, the base layer comprising a metal alloy; and A conductive layer adjacent to the base layer, wherein the conductive layer provides a ground plane that reduces the ground current resistance of the flexure relative to the ground current resistance of the base layer without the conductive layer.

9. The device according to claim 8, wherein: The conductive layer is a first conductive layer; as well as The plurality of layers also includes: Second conductive layer; At least one dielectric layer, the at least one dielectric layer being positioned between the first conductive layer and the second conductive layer in a direction orthogonal to the image plane; and A via, configured to transmit current from the second conductive layer to the first conductive layer, wherein the via extends through the at least one dielectric layer in a direction orthogonal to the image plane.

10. The device according to claim 8, wherein the flexural portion comprises: An internal frame, which is fixedly coupled to the image sensor; An external frame, which is fixedly coupled to the camera's mounting structure; One or more flexible arms, the one or more flexible arms being connected to the inner frame and to the outer frame; as well as Electrical traces on at least a portion of the one or more flexible arms, wherein the electrical traces are configured to transmit electrical signals between the inner frame and the outer frame.

11. The device of claim 10, wherein at least one of the inner frame, the outer frame, or the one or more flexible arms comprises the plurality of layers stacked in the direction orthogonal to the image plane.

12. The device of claim 10, wherein the actuator comprises a voice coil motor (VCM) actuator, the VCM actuator comprising: magnet; as well as A coil is located near the magnet, such that the coil can interact electromagnetically with the magnet to generate a Lorentz force that moves the image sensor.

13. The device of claim 10, wherein the actuator is configured to move the image sensor in at least one of the following directions: The direction orthogonal to the image plane; or The direction parallel to the image plane.

14. The device according to claim 8, wherein: The base layer has a thickness ranging from 30 micrometers to 150 micrometers; and The conductive layer is a copper layer with a thickness ranging from 2 micrometers to 30 micrometers.

15. A camera, said camera comprising: Lens group; Image sensor; An actuator for moving the image sensor relative to the lens group; as well as A flexural portion that suspends the image sensor on the camera's fixed structure and allows movement of the image sensor enabled by the actuator, the flexural portion comprising: Multiple layers, stacked in a first direction, the multiple layers comprising: An electrical grounding portion, wherein the electrical grounding portion includes a first conductive layer; The signal trace interconnect portion includes: Electrical signal pads, the electrical signal pads being used to attach the flexure to one or more other components; and A second conductive layer defines an electrical signal trace; The electrical signal pads are positioned adjacent to the electrical signal traces; and The intermediate portion includes: A dielectric layer, positioned in a direction orthogonal to the image plane between the electrical ground portion and the signal trace interconnect portion; A portion of the electrical grounding portion defines an impedance adjustment feature, the impedance adjustment feature including (i) a gap or (ii) a cavity, the gap or cavity being at least partially filled with an insulating material, and wherein the impedance adjustment feature is positioned along an axis intersecting the interconnecting portion of the signal trace.

16. The camera according to claim 15, wherein: The intermediate portion also includes: An adhesive layer, the adhesive layer being adjacent to the first conductive layer and the dielectric layer; and The impedance adjustment feature is configured to increase the impedance of the electrical signal pad to a target impedance that is closer to the impedance of the electrical signal trace than the impedance of the electrical signal pad if the flexure did not include the impedance adjustment feature.

17. The camera of claim 15, wherein the impedance adjustment feature is an empty gap.

18. The camera of claim 15, wherein the impedance adjustment feature is an epoxy-filled cavity.

19. The camera of claim 15, wherein the first conductive layer comprises: A base layer comprising a metal alloy.

20. The camera of claim 15, wherein the electrical grounding portion further comprises: A base layer comprising a metal alloy; The first conductive layer is adjacent to the base layer, and the conductive layer provides a ground plane that reduces the ground current resistance of the flexure relative to the ground current resistance of the base layer without the conductive layer.

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