Power module of sandwich construction

Abstract

The power module of the sandwich structure of the present application comprises a stacked inductor group, a PCB board and a power device chip. The inductor group comprises a magnetic core and a winding. The two ends of the winding are bent to extend on the plane of the PCB board and are welded to the PCB board. Meanwhile, the surface of the magnetic core is covered with a metal sheet for connecting to the high-power pins of the power device chip through the PCB board. Compared with the prior art, the power module of the present application can reduce the area on the PCB board, thereby improving the load current / power density. Moreover, the power module of the present application transmits the output current through the pins (windings) of the inductor, which can reduce the wiring of the output current loop on the PCB board, avoid the high impedance of the wiring of the PCB board, and thereby improve the circuit efficiency. Furthermore, the structure of the power device chip on top and the inductor group on bottom can greatly benefit from the top cooling system commonly used in GPU, CPU and ASIC systems.

Description

Technical Field

[0001] This invention relates to electronic components, and more specifically, to power module structures. Background Technology

[0002] Typically, power converters are used to convert input power into output power with appropriate voltage and current to supply a load. Multiphase power converters consist of multiple parallel, staggered power stages, thus offering advantages such as low output voltage ripple, fast transient response, and low rated ripple current requirements for the input capacitor. Due to these advantages, multiphase power converters are widely used in applications requiring high output current and low voltage, such as servers and microprocessors.

[0003] The rapid development of modern GPUs (Graphics Processing Units) and CPUs (Central Processing Units) has placed increasingly higher demands on the current-carrying capacity of multiphase power converters. At the same time, these processors are becoming smaller and smaller, meaning that the size of the multiphase power converter needs to be reduced accordingly. The increasing current and decreasing size further complicate the heat dissipation of multiphase power converters. In other words, a power converter with high current density, high efficiency, and excellent heat dissipation capabilities is needed. Summary of the Invention

[0004] The purpose of this invention is to provide a power module with a sandwich structure, wherein the power module integrates the inductor, power switch and driver of the power circuit system into a smaller module.

[0005] An inductor assembly for use in a power module according to an embodiment of the present invention includes: a magnetic core having a symmetrical structure when viewed from the top, and having two channels running through the magnetic core from top to bottom and distributed on both sides of the central axis of the top view of the magnetic core, and two windings passing through the two channels of the magnetic core respectively, wherein each winding has a first end and a second end, and at least one of the first end and the second end is bent and extends in a plane perpendicular to the length of the winding.

[0006] According to an embodiment of the present invention, a power module includes the aforementioned inductor group, and further includes: a PCB top plate located above the inductor group; and two power device chips located above the PCB top plate, wherein each of the two power device chips has at least one pin electrically connected to a corresponding winding through the PCB top plate.

[0007] In one embodiment, the power module further includes a PCB base plate located below the inductor group; and a connector connecting the PCB top plate and the PCB base plate, wherein the connector has a plurality of metal pillars soldered to corresponding pads on the PCB top plate and the PCB base plate, respectively.

[0008] The power module with a sandwich structure of the present invention has the following advantages: (1) Compared with the power module with a flat structure in the prior art, it can reduce the area on the PCB board, thereby increasing the load current / power density; (2) By transmitting the output current through the inductor's lead (winding), the output current loop on the PCB board can be reduced, avoiding the high impedance of the PCB board traces, thereby improving circuit efficiency; and (3) The power device chip on top and the inductor group on the bottom structure of the power module of the present invention can greatly benefit from the top cooling system commonly used in GPU, CPU and ASIC systems. Attached Figure Description

[0009] To better understand this invention, it will be described in detail with reference to the following figures:

[0010] Figure 1 A schematic diagram of the circuit structure of an existing multiphase power converter 10 is shown;

[0011] Figure 2 A schematic diagram of a power module 20 with a mezzanine structure integrating a dual-phase power converter according to an embodiment of the present invention is shown.

[0012] Figure 3 An exploded three-dimensional view of an inductor assembly 30 according to an embodiment of the present invention is shown;

[0013] Figure 4 An exploded three-dimensional view of an inductor assembly 40 according to an embodiment of the present invention is shown;

[0014] Figure 5 An exploded three-dimensional view of an inductor assembly 50 according to an embodiment of the present invention is shown;

[0015] Figure 6 A schematic diagram of the structure of a magnetic core 60 according to an embodiment of the present invention is shown;

[0016] Figure 7 A schematic diagram of the structure of a magnetic core 70 according to an embodiment of the present invention is shown;

[0017] Figure 8 An exploded three-dimensional view of an inductor assembly 80 according to an embodiment of the present invention is shown;

[0018] Figure 9 An exploded three-dimensional view of an inductor assembly 90 according to an embodiment of the present invention is shown;

[0019] Figure 10 An exploded three-dimensional view of an inductor group 100 according to an embodiment of the present invention is shown. Detailed Implementation

[0020] In the following description, specific details, such as the specific circuit structures and parameters of these circuit elements in the embodiments, are provided to provide a better understanding of the embodiments of the present invention. Those skilled in the art will understand that embodiments of the present invention can be implemented even in the absence of certain details or other combinations of methods, elements, materials, etc. Furthermore, the term "coupled" as used herein means a direct connection or an indirect connection via other circuit elements.

[0021] The embodiments described below will illustrate the devices and operating methods of various embodiments of the present invention using specific implementation devices and application backgrounds as examples, so that those skilled in the art can better understand the present invention. However, those skilled in the art should understand that these descriptions are merely exemplary and are not intended to limit the scope of the present invention.

[0022] Figure 1 A schematic diagram of the circuit structure of a conventional multiphase power converter 10 is shown. Figure 1 As shown, the multiphase power converter 10 includes a controller 101, N power devices 103, and N inductors L1, where N is an integer and N>1. Figure 1 As shown, each power stage 102, also referred to as each phase 102, includes a power device 103 and an inductor L1. Each power device 103 includes power switches M1 and M2, and a driver DR1 for driving the power switches M1 and M2. The controller 101 provides N-phase control signals 105-1 to 105-N to control N power devices 103 respectively, so as to control the N-phase 102 to operate in staggered phases. That is, the N inductors L1 sequentially draw energy from the input terminal and sequentially provide energy to the load 104. It should be understood that in Figure 1 In this example, connecting the outputs of each phase of the multiphase power converter 10 together to provide energy to the load is just one application. In other applications, the multiphase power converter 10 can also operate as multiple single-phase power converters, meaning that each phase can be connected to an independent load and provide different output voltages to meet the needs of different loads.

[0023] Figure 1 The power stage 102 with BUCK topology shown is merely an example. Those skilled in the art will understand that power stages with other topologies are also applicable to the multiphase power converters of this embodiment.

[0024] In the following embodiments of the invention, the inductor L1 can be implemented using a coupled inductor or N single inductors.

[0025] When N=2, the multiphase power converter 10 is used as a two-phase power converter, or two independent power converters.

[0026] Figure 2 A schematic diagram of a power module 20 with a mezzanine structure integrating a dual-phase power converter, according to an embodiment of the present invention, is shown. Figure 1 In the above, when N=2, the power stage 102 can be implemented using the power supply module 20. The sandwich-structured power module 20 includes: a PCB (Printed Circuit Board) base plate 201 located at the bottom of the power module 20; an inductor group 206 located on the PCB base plate 201, including two inductors, each inductor having a first end and a second end; a PCB top plate 202 located on the inductor group 206; a connector 204 having multiple metal pillars 205, each metal pillar 205 being soldered to corresponding pads on the PCB top plate 202 and the PCB base plate 201 respectively; and two power device chips 203 located on top of the PCB top plate 202, each power device chip 203 having one or more pins connected to the second end of the inductor in the inductor group 206 via the PCB top plate 202; wherein each inductor has a winding 207, the two ends of which are bent to a plane perpendicular to the length direction of the winding 207 and extend on the PCB top plate 202 and the PCB base plate 201.

[0027] exist Figure 2 In the power module 20, discrete components 208 are further located on the top plate 202 of the PCB. Discrete components 208 is a general term that includes discrete resistors, discrete capacitors, etc. involved in the power converter 10, such as the input capacitor used to provide pulse current at the input terminal of the power converter 10, and the filter capacitors and resistors used to power the power switch driver and internal logic circuits.

[0028] In one embodiment, the metal pillar 205 comprises a copper pillar for soldering the PCB base plate 201 to the PCB top plate 202. Those skilled in the art will understand that any metal pillar suitable for electrically connecting two PCBs can be used in this invention.

[0029] The power module 20 is typically located on the processor's motherboard and provides power to the devices on the motherboard. A PCB base plate 201 is soldered onto the motherboard, and some pins of the power module 20 are soldered to the motherboard via the PCB base plate 201. In some embodiments, the PCB base plate 201 may be omitted. The power module 20 can be directly soldered to the motherboard via connector 204 and inductor assembly 206.

[0030] In this invention, the power device chip is stacked on top of the inductor array, such as... Figure 2 As shown, this saves space on the PCB board for the power converter 10. Each power device chip 203 integrates, as shown in the diagram. Figure 1 The power device 103 shown includes, for example, the following. Figure 1 The power switches M1 and M2 shown, and the driver DR1 used to drive the power switches M1 and M2, and Figure 1 The circuitry connected to the auxiliary winding is not shown in the diagram. The pins of the power device chip 203 are soldered to pads on the top PCB panel 202. These pads are then electrically connected to pads on the bottom PCB panel 201 via the inductor assembly 206 and connector 204. Thus, the bottom PCB panel 201 provides electrical connection to the power device chip 203. The power module 20 also includes a metal sheet 209 for conducting large current signals, such as a reference ground. The metal sheet 209 covers a portion of the core of the inductor assembly 206 and is soldered to both the top PCB panel 202 and the bottom PCB panel 201. The position of the metal sheet 209 depends on the position of the ground pin of the power device chip 203. Figure 2 In this embodiment, the metal sheet 209 mainly wraps around the side of the inductor group 206, with its two ends bent to form a soldering area on the upper and lower surfaces of the inductor group 206 that is close to the corresponding pads on the PCB board. Thus, on the horizontal plane, i.e. the plane of the PCB board, a large area of ​​metal sheet 209 is used to replace PCB traces to carry large current, thereby reducing circuit loss and improving circuit efficiency.

[0031] Figure 3 An exploded three-dimensional view of an inductor assembly 30 according to an embodiment of the present invention is shown. The inductor assembly 30 can be used as... Figure 2 Inductor group 206 in the power module. For example... Figure 3 As shown, the inductor assembly 30 includes: a magnetic core, including a first magnetic core portion 301 and a second magnetic core portion 302, wherein the first magnetic core portion 301 and the second magnetic core portion 302 are combined together to form two channels 303-1 and 303-2 at their joint surface; and windings 304-1 and 304-2, which pass through channels 303-1 and 303-2 respectively.

[0032] exist Figure 3 In the embodiment, when the inductor group 30 is applied Figure 2 When the power module 20 is shown, channels 303-1 and 303-2 are parallel to the PCB base plate 201 and the PCB top plate 202, that is, channels 303-1 and 303-2 have a direction along such as Figure 2 The radial direction of axis “A” shown.

[0033] exist Figure 3 In this embodiment, the winding 304-1 has a first end 304-3 that is bent 90 degrees and extends across the surface of the magnetic core, covering a portion of the surface. This extended portion also corresponds to an extension on the surface of the PCB top plate 202. In some embodiments, the PCB bottom plate 201 may be omitted. The power module 20 can be directly soldered to the motherboard via connector 204 and inductor group 206.

[0034] In this invention, the power device chip is stacked on top of the inductor array, such as... Figure 2 As shown, this saves space on the PCB board for the power converter 10. Each power device chip 203 integrates, as shown in the diagram. Figure 1 The power device 103 shown includes, for example, the following. Figure 1 The power switches M1 and M2 shown, and the driver DR1 used to drive the power switches M1 and M2, and Figure 1 The circuitry connected to the auxiliary winding is not shown in the diagram. The pins of the power device chip 203 are soldered to pads on the top PCB panel 202. These pads are then electrically connected to pads on the bottom PCB panel 201 via the inductor assembly 206 and connector 204. Thus, the bottom PCB panel 201 provides electrical connection to the power device chip 203. The power module 20 also includes a metal sheet 209 for conducting large current signals, such as a reference ground. The metal sheet 209 covers a portion of the core of the inductor assembly 206 and is soldered to both the top PCB panel 202 and the bottom PCB panel 201. The position of the metal sheet 209 depends on the position of the ground pin of the power device chip 203. Figure 2 In this embodiment, the metal sheet 209 mainly wraps around the side of the inductor group 206, with its two ends bent to form a soldering area on the upper and lower surfaces of the inductor group 206 that is close to the corresponding pads on the PCB board. Thus, on the horizontal plane, i.e. the plane of the PCB board, a large area of ​​metal sheet 209 is used to replace PCB traces to carry large current, thereby reducing circuit loss and improving circuit efficiency.

[0035] Figure 3 An exploded three-dimensional view of an inductor assembly 30 according to an embodiment of the present invention is shown. The inductor assembly 30 can be used as... Figure 2 Inductor group 206 in the power module. For example... Figure 3 As shown, the inductor assembly 30 includes: a magnetic core, including a first magnetic core portion 301 and a second magnetic core portion 302, wherein the first magnetic core portion 301 and the second magnetic core portion 302 are combined together to form two channels 303-1 and 303-2 at their joint surface; and windings 304-1 and 304-2, which pass through channels 303-1 and 303-2 respectively.

[0036] exist Figure 3 In the embodiment, when the inductor group 30 is applied Figure 2 When the power module 20 is shown, channels 303-1 and 303-2 are parallel to the PCB base plate 201 and the PCB top plate 202, that is, channels 303-1 and 303-2 have a direction along such as Figure 2 The radial direction of axis “A” shown.

[0037] exist Figure 3In this embodiment, the winding 304-1 has a first end 304-3 that is bent at 90 degrees and extends along the surface of the magnetic core, covering a portion of the surface. This extended portion also extends along the surface of the PCB top plate 202 and is soldered to the PCB top plate 202. It also has a second end 304-5 that is bent at 90 degrees and extends along the surface of the magnetic core, covering a portion of the surface. This extended portion also extends along the surface of the PCB bottom plate 201 and is soldered to the PCB bottom plate 201. In other words, the first end 304-3 and the second end 304-5 of the winding 304-1 extend along a plane perpendicular to the magnetic core channels 303-1 and 303-2, and the sides of their extended surfaces also extend along the surfaces of the PCB top plate 202 and the PCB bottom plate 201. Similarly, the winding 304-2 has a first end 304-4 that is bent at 90 degrees and extends on the surface of the magnetic core, covering a portion of the surface. This extended portion also extends on the surface of the PCB top plate 202 and is soldered to the PCB top plate 202. It also has a second end 304-6 that is bent at 90 degrees and extends on the surface of the magnetic core, covering a portion of the surface. This extended portion also extends on the surface of the PCB bottom plate 201 and is soldered to the PCB bottom plate 201. In other words, the first end 304-4 and the second end 304-6 of the winding 304-2 extend along a plane perpendicular to the magnetic core channels 303-1 and 303-2, and the sides of their extended surfaces also extend on the surfaces of the PCB top plate 202 and the PCB bottom plate 201.

[0038] exist Figure 3 In this embodiment, the shapes of the first magnetic core portion 301 and the second magnetic core portion 302 are not symmetrical. The first magnetic core portion 301 has a planar shape, and the second magnetic core portion 302 has two channels. Channels 303-1 and 303-2 are respectively formed by the two channels of the second magnetic core portion 302 and one surface 301-1 of the first magnetic core portion 301. Figure 3 As shown.

[0039] exist Figure 3 In this embodiment, metal sheets 305-1 and 305-2 are L-shaped. Both ends of the metal sheets 305-1 and 305-2 are soldered to the PCB top plate 202 and the PCB bottom plate 201, respectively. One end of the metal sheets 305-1 and 305-2 soldered to the PCB top plate 202 is bent at 90 degrees and extends on the surface of the magnetic core, which is equivalent to extending on the surface of the PCB top plate 202. It is electrically connected to the ground pin of the power device chip 203 through the pads of the PCB top plate 202, thereby reducing the traces and their impedance on the PCB top plate 202.

[0040] Figure 4 An exploded three-dimensional view of an inductor assembly 40 according to an embodiment of the present invention is shown. The inductor assembly 40 can be used as... Figure 2Inductor group 206 in the power module. For example... Figure 4 As shown, the inductor assembly 40 includes: a magnetic core, including a first magnetic core portion 401 and a second magnetic core portion 402, wherein the first magnetic core portion 401 and the second magnetic core portion 402 are combined together to form two channels 403-1 and 403-2 at their joint surface; and windings 404-1 and 404-2, which pass through channels 403-1 and 403-2 respectively.

[0041] exist Figure 4 In the embodiment, when the inductor group 40 is applied Figure 2 When the power module 20 is shown, channels 403-1 and 403-2 are perpendicular to the PCB base plate 201 and the PCB top plate 202, that is, channels 403-1 and 403-2 have a length along the PCB base plate 201 and the PCB top plate 202. Figure 2 The radial direction of axis "B" shown.

[0042] exist Figure 4 In this embodiment, the winding 404-1 has a first end 404-3 that is bent at 90 degrees and extends along the surface of the magnetic core, covering a portion of the surface. This extended portion also extends along the surface of the PCB top plate 202 and is soldered to the PCB top plate 202. It also has a second end 404-5 that is bent at 90 degrees and extends along the surface of the magnetic core, covering a portion of the surface. This extended portion also extends along the surface of the PCB bottom plate 201 and is soldered to the PCB bottom plate 201. In other words, the first end 404-3 and the second end 404-5 of the winding 404-1 extend along a plane perpendicular to the magnetic core channels 403-1 and 403-2, and their extension surfaces also extend along the surfaces of the PCB top plate 202 and the PCB bottom plate 201. Similarly, the winding 404-2 has a first end 404-4 bent at 90 degrees extending on the surface of the magnetic core and covering part of the surface. This extended portion also extends on the surface of the PCB top plate 202 and is soldered to the PCB top plate 202. It also has a second end 404-6 bent at 90 degrees extending on the surface of the magnetic core and covering part of the surface. This extended portion also extends on the surface of the PCB bottom plate 201 and is soldered to the PCB bottom plate 201. In other words, the first end 404-4 and the second end 404-6 of the winding 404-2 extend along a plane perpendicular to the magnetic core channels 403-1 and 403-2, and their extension surfaces also extend on the surfaces of the PCB top plate 202 and the PCB bottom plate 201.

[0043] In some embodiments, the second end 404-5 of winding 404-1 and the second end 404-6 of winding 404-2 may not be bent. Whether the second end of the winding is bent, the direction of the bend, and the shape of the extension surface depend on the position of the corresponding pad on the PCB base plate 201, or if there is no PCB base plate 202, it depends on the position of the corresponding pad on the motherboard where the power module 20 is located.

[0044] exist Figure 4 In this embodiment, the shapes of the first magnetic core portion 401 and the second magnetic core portion 402 are not symmetrical. The first magnetic core portion 401 has a planar shape, and the second magnetic core portion 402 has two channels. The channels 403-1 and 403-2 are respectively formed by the two channels of the second magnetic core portion 402 and one surface 401-1 of the first magnetic core portion 401.

[0045] exist Figure 4 In this embodiment, metal sheets 405-1 and 405-2 are C-shaped. Both ends of metal sheets 405-1 and 405-2 are soldered to the top plate 202 and the bottom plate 201 of the PCB, respectively. One end of metal sheets 405-1 and 405-2 soldered to the bottom plate 201 is bent at a 90-degree angle and extends on the surface of the magnetic core, effectively extending on the surface of the bottom plate 201. This extended surface is soldered to the corresponding pads on the bottom plate 201, thereby reducing the traces and their impedance on the bottom plate 201. Similarly, one end of metal sheets 405-1 and 405-2 soldered to the top plate 202 is bent at a 90-degree angle and extends on the surface of the magnetic core, effectively extending on the surface of the top plate 202. These extended surfaces are electrically connected to the ground pin of the power device chip 203 via the pads on the top plate 202, thereby reducing the traces and their impedance on the top plate 202.

[0046] Figure 5 An exploded three-dimensional view of an inductor assembly 50 according to an embodiment of the present invention is shown. The inductor assembly 50 can be used as... Figure 2 Inductor group 206 in the power module. For example... Figure 5 As shown, the inductor assembly 50 includes: a magnetic core, including a first magnetic core portion 501 and a second magnetic core portion 502, wherein the first magnetic core portion 501 and the second magnetic core portion 502 are combined together to form two channels 503-1 and 503-2 at their joint surface; and windings 504-1 and 504-2, which pass through channels 503-1 and 503-2 respectively.

[0047] exist Figure 5 In the embodiment, when the inductor group 50 is applied Figure 2 When the power module 20 is shown, channels 503-1 and 503-2 are perpendicular to the PCB base plate 201 and the PCB top plate 202, that is, channels 503-1 and 503-2 have a length along the PCB base plate 201 and the PCB top plate 202. Figure 2 The radial direction of axis "B" shown.

[0048] exist Figure 5In this embodiment, the metal sheet 505 is C-shaped. Both ends of the metal sheet 505 are soldered to the PCB top plate 202 and the PCB bottom plate 201, respectively. One end of the metal sheet 505 soldered to the PCB bottom plate 201 is bent at a 90-degree angle and extends on the surface of the magnetic core, effectively extending on the surface of the PCB bottom plate 201. This extended surface is soldered to the corresponding pads on the PCB bottom plate 201, thereby reducing the traces and their impedance on the PCB bottom plate 201. Similarly, one end of the metal sheet 505 soldered to the PCB top plate 202 is bent at a 90-degree angle and extends on the surface of the magnetic core, effectively extending on the surface of the PCB top plate 202, and is electrically connected to the ground pin of the power device chip 203 through the pads on the PCB top plate 202, thereby reducing the traces and their impedance on the PCB top plate 202. Figure 5 In this embodiment, the portion of the metal sheet 505 that wraps around the side of the magnetic core is extended as much as possible to increase the area and reduce its own impedance.

[0049] and Figure 4 Compared to the inductor group 40 shown, Figure 5 The inductor group 50 has a single metal plate 505 for electrically connecting the ground pin of the power device chip 203 to the PCB substrate 201. Figure 4 compared to, Figure 5 With one less metal sheet, the metal sheet 505 and windings 504-1 and 504-2 can have a larger area that can be extended on the upper and lower surfaces of the magnetic core, thus giving the power device chip 203 more flexibility in the distribution of ground pins.

[0050] Figure 5 In the middle, the first magnetic core portion 501 and the second magnetic core portion 502 of the magnetic core are... Figure 4 The magnetic core structures are similar, and for the sake of brevity, they will not be described in detail here.

[0051] Figure 6 A schematic diagram of the structure of a magnetic core 60 according to an embodiment of the present invention is shown. Figure 6 In this configuration, the magnetic core 60 includes a first magnetic core portion 601 and a second magnetic core portion 602 with symmetrical and consistent shapes, wherein each magnetic core portion has two channels. When the magnetic core 60 is used... Figures 3-5 In the embodiment of the inductor assembly, the channels of the two magnetic core portions overlap to form two channels through which the winding passes.

[0052] Figure 7 A schematic diagram of the structure of a magnetic core 70 according to an embodiment of the present invention is shown. Figure 7In this structure, the magnetic core 70 includes a first magnetic core portion 701, a second magnetic core portion 702, and third magnetic core portions 703-1 to 703-3. The first magnetic core portion 701, the second magnetic core portion 702, and the third magnetic core portions 703-1 and 703-2 form a first channel 704-1. The first magnetic core portion 701, the second magnetic core portion 702, and the third magnetic core portions 703-2 and 703-3 form a second channel 704-2. Figure 7 As can be seen, more core channels can be constructed when there are more third core sections. The first core section 701, the second core section 702, and the third core sections 703-1 to 703-3 can be made of different materials, thereby providing a more flexible and adjustable inductance-current curve.

[0053] In some embodiments of the present invention, the various core portions of the magnetic core may be made of the same material but have different shapes, or they may be made of different materials, such as ferrite, iron powder, or other suitable materials, in order to achieve the desired inductance-current characteristic curve, for example, having a large inductance value at small currents and a small inductance value at large currents. Having a large inductance value at small currents can make the system more efficient, while having a small inductance value at large currents can make the system's transient response better.

[0054] For the purpose of concisely explaining the principles of this invention, Figures 3-5 The embodiments shown only depict magnetic cores with dual channels that can pass through dual windings. Those skilled in the art will understand that, depending on the application requirements, the magnetic core can have any number of channels passing through any number of windings; single-channel or multi-channel configurations are both consistent with the spirit of this invention.

[0055] In some embodiments, air gaps may exist between different core portions of the magnetic core to form coupled inductors. In other embodiments, there are no air gaps between the core portions, thereby forming multiple single inductors.

[0056] In this invention, to make the surface of the inductor module flat, the windings and metal sheets covering the magnetic core surface are embedded in the magnetic core surface, such as... Figure 3-5 As shown.

[0057] Figure 8 An exploded three-dimensional view of an inductor 80 according to an embodiment of the present invention is shown. The inductor 80 can be used as... Figure 2 Inductor 206 in the power module. For example... Figure 8As shown, the inductor 80 includes: a magnetic core, including a first magnetic core portion 801, a second magnetic core portion 802, and a third magnetic core portion 803, wherein channels 801-1 and 801-2 are formed between the opposing surfaces of the first magnetic core portion 801 and the second magnetic core portion 802, and between the opposing surfaces of the first magnetic core portion 801 and the third magnetic core portion 803, respectively; and windings 804-1 and 804-2 pass through channels 801-1 and 801-2, respectively.

[0058] exist Figure 8 In the embodiment, when inductor 80 is applied Figure 2 When the power module 20 is shown, channels 801-1 and 801-2 are perpendicular to the PCB base plate 201 and the PCB top plate 202, that is, channels 801-1 and 801-2 have a direction along such as Figure 2 The radial direction of axis "B" shown.

[0059] exist Figure 8 In this embodiment, winding 804-1 has a first end 804-3 and a second end 804-5. The first end 804-3 is bent at 90 degrees, extending along and covering part of the upper surface of the magnetic core, while the second end 804-5 is flush with the lower surface of the magnetic core. That is, the first end 804-3 extends on a plane perpendicular to channels 801-1 and 801-2, and this extended surface is soldered to the top plate of the PCB 202. The second end 804-5 is not extended and is directly soldered to the bottom plate of the PCB 201. Similarly, winding 804-2 has a first end 804-4 and a second end 804-6. The first end 804-4 is bent at 90 degrees, extending along and covering part of the upper surface of the magnetic core, while the second end 804-6 is flush with the lower surface of the magnetic core. In other words, the first end 804-4 extends on a surface perpendicular to channels 801-1 and 801-2, and this extended surface is soldered to the top plate of the PCB 202. The second end 804-6 does not extend and is directly soldered to the bottom plate of the PCB 201.

[0060] In some embodiments, the second end 804-5 of winding 804-1 and the second end 804-6 of winding 804-2 can also be bent at 90 degrees and extended on the lower surface of the magnetic core, just like the first end 804-3 of winding 804-1 and the first end 804-4 of winding 804-2. Whether the second end of the winding is bent and extended, and the direction and extent of the extension, depend on the position of the corresponding pad on the PCB base plate of the power module. If there is no PCB base plate, it depends on the position of the corresponding pad on the motherboard on which the power module is located.

[0061] exist Figure 8In this embodiment, the magnetic core includes a first magnetic core portion 801, a second magnetic core portion 802, and a third magnetic core portion 803. Viewed from top to bottom, the first magnetic core portion 801 is H-shaped, with two channels located on two opposite sides of the first magnetic core portion 801. The second magnetic core portion 802 and the third magnetic core portion 803 are elongated strips, each embedded in one of the two channels, but not completely fitted together, leaving some channel space to form channels 801-1 and 801-2. In other embodiments, the first magnetic core portion 801 may also have other symmetrical structures with channels distributed on two opposite sides.

[0062] To make the inductance-current characteristic curves more flexible and adjustable, the first magnetic core portion 801, the second magnetic core portion 802, and the third magnetic core portion 803 can be made of different materials. For example, the first magnetic core portion 801 can be ferrite, while the second magnetic core portion 802 and the third magnetic core portion 803 can be iron powder. It should be understood that those skilled in the art can select different core materials according to the inductance-current characteristic curves required for the application.

[0063] exist Figure 8 In this embodiment, metal sheets 805-1, 805-2, and 806 are C-shaped when viewed from the side. The metal sheets 805-1, 805-2, and 806 are used for soldering the PCB top plate 202 and the PCB bottom plate 201. Figure 8 As shown, the two ends of the metal sheets 805-1, 805-2, and 806 are all bent at 90 degrees and extended along the PCB top plate 202 and PCB bottom plate 201. The extended surfaces are soldered to the corresponding pads of the PCB top plate 202 and PCB bottom plate 201, thereby saving internal traces on the PCB and minimizing the high impedance caused by internal traces. In one embodiment, the metal sheets 805-1 and 805-2 are used to electrically connect the ground pin of the power device chip 203 to the PCB bottom plate 201 or the motherboard through the PCB top plate 202. The metal sheet 806 is used to connect the power pin of the power device chip 203 (… Figure 1 The pins corresponding to the port shown for receiving the input voltage Vin are electrically connected to the PCB base plate 201 or the main board via the PCB top plate 202.

[0064] Figure 9 An exploded three-dimensional view of an inductor 90 according to an embodiment of the present invention is shown. The inductor 90 can be used as... Figure 2 Inductor 206 in the power module. For example... Figure 9As shown, the inductor 90 includes: a magnetic core 901 with a symmetrical structure when viewed from the top, two channels 901-1 and 901-2 passing through the magnetic core 901 from top to bottom and symmetrically distributed on both sides of the central axis "D" of the top view; and windings 902-1 and 902-2, which pass through channels 901-1 and 901-2 respectively.

[0065] exist Figure 9 In the embodiment, when inductor 90 is applied Figure 2 When the power module 20 is shown, channels 901-1 and 901-2 are perpendicular to the PCB base plate 201 and the PCB top plate 202, that is, channels 901-1 and 901-2 have a direction along the PCB base plate 201 and the PCB top plate 202. Figure 2 The radial direction of axis "B" shown.

[0066] exist Figure 9 In this embodiment, winding 902-1 has a first end 902-3 and a second end 902-5. The first end 902-3 is bent at a 90-degree angle, extending towards the upper surface of the magnetic core and covering a portion of the upper surface of the magnetic core, while the second end 902-5 is flush with the lower surface of the magnetic core. That is, the first end 902-3 extends on a plane perpendicular to channels 901-1 and 901-2, and this extended surface is soldered to the top plate of the PCB 202. The second end 902-5 does not extend and is directly soldered to the bottom plate of the PCB 201. Similarly, winding 902-2 has a first end 902-4 and a second end 902-6. The first end 902-4 is bent at a 90-degree angle, extending towards the upper surface of the magnetic core and covering a portion of the upper surface of the magnetic core, while the second end 902-6 is flush with the lower surface of the magnetic core. In other words, the first end 902-4 extends on a surface perpendicular to channels 901-1 and 901-2, and this extended surface is soldered to the top plate of the PCB 202. The second end 902-6 does not extend and is directly soldered to the bottom plate of the PCB 201.

[0067] In some embodiments, the second end 902-5 of winding 902-1 and the second end 902-6 of winding 902-2 can also be bent at 90 degrees, extending on the lower surface of the magnetic core, just like the first ends 902-3 of winding 902-1 and 902-4 of winding 902-2. Whether the second end of the winding is bent and extended, and the direction and extent of the extension, depend on the position of the corresponding pad on the PCB base plate of the power module. If there is no PCB base plate, it depends on the position of the corresponding pad on the motherboard on which the power module is located.

[0068] exist Figure 9 In this embodiment, metal sheets 903-1, 903-2, and 904 are C-shaped when viewed from the side. The metal sheets 903-1, 903-2, and 904 are used for soldering the PCB top plate 202 and the PCB bottom plate 201. Figure 9As shown, the two ends of the metal sheets 903-1, 903-2, and 904 are all bent at 90 degrees and extended along the PCB top plate 202 and PCB bottom plate 201. The extended surfaces are soldered to the corresponding pads of the PCB top plate 202 and PCB bottom plate 201, thereby saving internal traces on the PCB and minimizing the high impedance caused by internal traces. In one embodiment, the metal sheets 903-1 and 903-2 are used to electrically connect the ground pin of the power device chip 203 to the PCB bottom plate 201 or the motherboard through the PCB top plate 202. The metal sheet 904 is used to connect the power pin of the power device chip 203 (… Figure 1 The pin shown is used to receive the input voltage Vin. It is electrically connected to the PCB base plate 201 or the main board via the PCB top plate 202.

[0069] Figure 10 An exploded three-dimensional view of an inductor 100 according to an embodiment of the present invention is shown. The inductor 100 can be used as... Figure 2 Inductor 206 in the power module. For example... Figure 10 As shown, the inductor 100 includes: a magnetic core 1001 with a symmetrical structure when viewed from the top; two channels 1001-1 and 1001-2 passing through the magnetic core 1001 from top to bottom and symmetrically distributed on both sides of the central axis "D" of the top view; two air gaps 1001-3 and 1001-4 are distributed on the outer arms 1001-5 and 1001-6 of the magnetic core along the channels 1001-1 and 1001-2, respectively; and windings 1002-1 and 1002-2 passing through the channels 1001-1 and 1001-2, respectively.

[0070] Figure 10 Inductor 100 and Figure 9 The inductor in the second part is similar to the 90, so I won't go into details here. The main difference between the two is... Figure 10 The magnetic core 1001 in the middle has an air gap, therefore it is more powerful than... Figure 9 The magnetic core 901 in the middle has a higher magnetic reluctance.

[0071] In various embodiments of the present invention, the magnetic core, or its constituent parts, ultimately form a cubic structure. Those skilled in the art will understand that any magnetic core with a symmetrical top view can be used in the present invention, such as a cylinder, hexagonal prism, etc.

[0072] In some embodiments, Figure 8-10 The metal layer covering the outer surface of the inductor can have other shapes, such as L-shape, meaning that the first end of the metal layer is bent and extended and soldered to the top of the PCB, as shown in the example. Figure 3The metal layers 305-1 and 305-2 shown have no bend at the second end. In some embodiments, the L-shaped metal layer may also have a bent and extended second end that is soldered to the PCB base plate or motherboard, i.e., as shown... Figure 3 The metal layers 305-1 and 305-2 shown are inverted, with no bend at the first end.

[0073] In this invention, to make the outer surface of the inductor flat, the portion of the winding exposed on the outer surface of the inductor and the metal layer covering the outer surface of the inductor are embedded into the outer surface of the inductor, such as... Figure 3-5 As shown in 8-10.

[0074] Based on the above teachings, many modifications and variations of the present invention are obviously possible. Therefore, it should be understood that the present invention may not be practiced according to the specific description above, within the scope defined by the claims. It should also be understood that the above disclosure relates only to some preferred embodiments of the present invention, and modifications may be made to the present invention without departing from the spirit and scope defined by the claims. When only one preferred embodiment is disclosed, it is readily apparent to those skilled in the art that modifications can be made and implemented without departing from the spirit and scope defined by the claims.

Claims

1. A power supply module, comprising: Inductor group, including: The magnetic core, viewed from the top, has a symmetrical structure and two channels running from top to bottom through the core, distributed on both sides of the central axis of the top view of the core. Two windings pass through two channels of the magnetic core, each winding having a first end and a second end, and at least one of the first end and the second end extends in a plane perpendicular to the length of the winding after being bent. The top of the PCB is located above the inductor assembly. A first power device chip is located on the top plate of the PCB, wherein the first power device chip has a ground pin, a power pin, and at least one pin electrically connected to the first winding of the two windings through the top plate of the PCB. A second power device chip is located on the top of the PCB, wherein the second power device chip has a ground pin, a power pin, and at least one pin electrically connected to the second winding of the two windings through the top of the PCB. A first metal sheet is used for electrical connection to the ground pin of the first power device chip, wherein the first metal sheet wraps around a first side surface of the magnetic core, and the first side surface is perpendicular to the top plate of the PCB. A second metal sheet is used for electrical connection to the power supply pins of the first power device chip and the second power device chip, wherein the second metal sheet covers a second side surface of the magnetic core, the second side surface being perpendicular to the first side surface and the top plate of the PCB. A third metal sheet is used for electrical connection to the ground pin of the second power device chip, wherein the third metal sheet wraps around a third side surface of the magnetic core, the third side surface being parallel to the first side surface.

2. The power module as described in claim 1, wherein, The magnetic core includes a first magnetic core portion, a second magnetic core portion, and a third magnetic core portion. The first magnetic core portion has two channels distributed on opposite sides. The second magnetic core portion and the third magnetic core portion are respectively embedded in the two channels, leaving some channel space to form two channels. The two windings pass through the two channels respectively.

3. The power module as described in claim 1, wherein, The magnetic core includes: The first magnetic core section, viewed from the top, is "H" shaped and has two channels distributed on two opposite sides. The second magnetic core section; and The third magnetic core section; in which The second and third magnetic core portions are respectively embedded in the two channels, leaving some channel space to form two passages, wherein the two windings pass through the two passages respectively.

4. The power module as described in any one of claims 2 or 3, wherein, The second and third magnetic core portions are made of the same material, while the first magnetic core portion is made of a different material than the second and third magnetic core portions.

5. The power module as claimed in claim 1, wherein the magnetic core is a single, integral module.

6. The power module of claim 5, wherein the magnetic core includes two air gaps distributed along two channels and passing through the outer arm of the magnetic core next to the channels.

7. The power module as described in claim 1, wherein, The metal sheet is C-shaped when viewed from the side, with one end bent and extending on the upper surface of the magnetic core, and the other end bent and extending on the lower surface of the magnetic core.

8. The power module as described in claim 1, wherein, The metal sheet is L-shaped when viewed from the side, with one end bent and extending on the upper surface of the magnetic core.

9. The power module as described in claim 1, further comprising: The PCB base plate is located below the inductor assembly. as well as A connector for connecting the top PCB and the bottom PCB, wherein the connector has multiple metal posts that are soldered to corresponding pads on the top PCB and the bottom PCB, respectively.

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