Tilting device
The flipping device, consisting of a support frame, carrier, distance measuring device, and drive device, uses a distance sensor and the tangent theorem to calculate the flipping angle, solving the problem of inaccurate silicon wafer flipping angle in existing technologies and improving the accuracy and automation of silicon wafer processing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-08-24
- Publication Date
- 2026-04-03
AI Technical Summary
Existing silicon wafer flipping devices have difficulty in precisely controlling the flipping angle, which affects the accuracy of silicon wafer processing. High-precision robotic arms are expensive, while low-precision robotic arms have difficulty in controlling the flipping angle.
The flipping device consists of a support frame, a carrier, a distance measuring device, and a driving device. It uses a distance sensor to measure the distance between the carrier and the base plate, calculates the flipping angle using the tangent theorem, and combines a limiting structure and a pushing structure to ensure that the silicon wafer is placed in a predetermined posture.
It enables precise control of the silicon wafer flipping angle, improves the accuracy and automation of silicon wafer processing, and reduces equipment costs.
Smart Images
Figure CN115939018B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of silicon wafer processing, and more specifically, to a flipping device. Background Technology
[0002] Currently, silicon wafer processing requires flipping the wafer to a predetermined angle to ensure the accuracy of subsequent processing. Existing technologies for flipping silicon wafers include high-precision robotic arms and ordinary robotic arms. High-precision robotic arms are complex to achieve precise positioning and are costly. Low-precision robotic arms are slightly cheaper than high-precision robotic arms, but the accuracy of the flipping angle is difficult to control, which can easily affect the processing results of the silicon wafers. Summary of the Invention
[0003] The main objective of this invention is to provide a flipping device to solve the problem that the flipping angle of flipping devices in related technologies cannot be precisely controlled.
[0004] To achieve the above objectives, according to one aspect of the present invention, a flipping device is provided, comprising: a support frame including a base plate and a first upright plate disposed on the base plate; a carrier pivotally disposed on the first upright plate, the central axis of the pivot axis of the carrier being disposed in a horizontal direction, the carrier having a loading position parallel to the base plate and a flipping position having an angle with the base plate; and a distance measuring device disposed on the base plate and located below the carrier, wherein there is a distance between the projection of the pivot axis of the carrier on the base plate and the distance measuring device.
[0005] Furthermore, the distance measuring device includes a distance sensor.
[0006] Furthermore, the distance sensor includes a first distance sensor and a second distance sensor spaced apart.
[0007] Furthermore, the line connecting the first distance sensor and the second distance sensor is perpendicular to the pivot axis.
[0008] Furthermore, the tilting device also includes a drive unit, wherein the carrier is pivotally mounted on the first upright plate via the drive unit, and the drive unit drives the carrier to switch between the loading position and the tilting position.
[0009] Furthermore, the vehicle includes a vehicle body and a pivot shaft disposed on the vehicle body, and the drive device includes a drive motor, a first gear disposed on the drive shaft of the drive motor, and a second gear connected to the pivot shaft. The first gear meshes with the second gear, and the pivot shaft is connected to the center of the second gear.
[0010] Furthermore, the carrier body includes a bearing plate, a first limiting structure and a second limiting structure disposed opposite to each other on the bearing plate, and a third limiting structure disposed between the first limiting structure and the second limiting structure. The bearing plate, the first limiting structure, the second limiting structure and the third limiting structure form a placement space for the part to be flipped.
[0011] Furthermore, the support frame also includes a second upright plate disposed opposite to the first upright plate, and the flipping device also includes a pushing structure disposed on the second upright plate. The pushing structure is opposite to the second limiting structure. The second limiting structure has a clearance hole for avoiding the pushing structure. The pushing structure has a pushing position for pushing the part to be flipped and a retraction position for avoiding the carrier.
[0012] Furthermore, the jacking structure includes a first cylinder and a second cylinder spaced apart along the extension direction of the first limiting structure.
[0013] Furthermore, the first and second limiting structures are limiting ribs, and the third limiting structure is a limiting rib or multiple limiting protrusions.
[0014] Using the technical solution of this invention, a carrier is rotatably mounted on a support frame. The carrier has a pivot axis that rotates around the support frame. A silicon wafer is placed horizontally on the carrier, and the rotation of the carrier causes the silicon wafer to rotate. A distance measuring device is provided on the base plate. The distance measuring device can measure the vertical distance L1 between the base plate and the carrier (the displayed value of the distance measuring device plus the actual height of the measuring electronic component of the distance measuring device). The vertical distance L2 between the pivot axis of the carrier and the base plate can be obtained by measurement. Therefore, the difference L4 between L1 and L2 can be obtained. The vertical distance L3 between the distance measuring device and the pivot axis of the carrier can be obtained by measurement. Given L4 and L3, the actual tilt angle α of the carrier can be obtained according to the tangent theorem. When the difference between the actual tilt angle and the tilt angle of the carrier is too large, the tilt angle of the carrier can be adjusted so that the tilt angle of the carrier meets the predetermined requirements. Attached Figure Description
[0015] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:
[0016] Figure 1 A three-dimensional structural schematic diagram of an embodiment of the flipping device according to the present invention is shown at one angle;
[0017] Figure 2 It shows Figure 1 A three-dimensional structural diagram of the flipping device from another angle;
[0018] Figure 3 It shows Figure 2 A top view of the flipping device; and
[0019] Figure 4 It shows Figure 1 A schematic diagram illustrating the principle of a distance measuring device for measuring the tilting angle of a vehicle.
[0020] The above figures include the following reference numerals:
[0021] 10. Support frame; 11. Base plate; 12. First upright plate; 13. Second upright plate; 20. Carrier; 21. Carrier body; 211. Bearing plate; 212. First limiting structure; 213. Second limiting structure; 2131. Clearance hole; 214. Third limiting structure; 22. Pivot shaft; 30. Distance measuring device; 31. First distance sensor; 32. Second distance sensor; 40. Drive device; 41. Drive motor; 42. First gear; 43. Second gear; 50. Pushing structure; 51. First cylinder; 52. Second cylinder. Detailed Implementation
[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0023] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0024] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.
[0025] like Figure 1 , Figure 2 and Figure 4 As shown, the flipping device of this application includes: a support frame 10, a carrier 20, and a distance measuring device 30. The support frame 10 includes a base plate 11 and a first upright plate 12 disposed on the base plate 11; the carrier 20 is pivotally disposed on the first upright plate 12, the central axis of the pivot axis 22 of the carrier 20 is disposed in the horizontal direction, the carrier 20 has a loading position parallel to the base plate 11 and a flipping position with an angle between it and the base plate 11; the distance measuring device 30 is disposed on the base plate 11 and located below the carrier 20, and there is a distance between the projection of the pivot axis 22 of the carrier 20 on the base plate 11 and the distance measuring device 30.
[0026] Using the technical solution of this embodiment, the carrier 20 is rotatably mounted on the support frame 10. The carrier 20 has a pivot axis that rotates around the support frame 10. The silicon wafer is placed horizontally on the carrier 20, and the rotation of the carrier 20 causes the silicon wafer to rotate. A distance measuring device 30 is provided on the base plate 11. The distance measuring device can measure the vertical distance L1 between the base plate 11 and the carrier 20 (the displayed value of the distance measuring device plus the actual height of the measuring electronic component of the distance measuring device). The vertical distance L2 between the pivot axis of the carrier 20 and the base plate 11 can be obtained by measurement. Therefore, the difference L4 between L1 and L2 can be obtained. The vertical distance L3 between the distance measuring device 30 and the pivot axis of the carrier 20 can be obtained by measurement. Given L4 and L3, the actual tilt angle α of the carrier 20 can be obtained according to the tangent theorem. When the difference between the actual tilt angle of the carrier 20 and the tilt angle of the carrier 20 is too large, the tilt angle of the carrier 20 can be adjusted to meet the predetermined requirements.
[0027] It should be noted that in actual operation, a pre-flipping step of the vehicle 20 can be added. First, the vehicle 20 is flipped to a near predetermined angle, and then the vertical distance L1 between the base plate 11 and the vehicle 20 is measured by the distance measuring device 30. Then, the actual flipping angle of the vehicle 20 is calculated, and the difference between the actual flipping angle and the predetermined angle is obtained. Then, the vehicle 20 is flipped to the predetermined angle to improve the accuracy of the flipping angle of the vehicle 20.
[0028] like Figure 1 As shown, in this embodiment, the distance measuring device 30 includes a distance sensor. In the above structure, the distance sensor has low cost and is easy to install.
[0029] Specifically, when measuring the actual tilting angle of the vehicle 20, the vertical distance L2 between the pivot axis of the vehicle 20 and the base plate 11 can be measured, and the vertical distance L1 between the base plate 11 and the vehicle 20 can be measured using a distance sensor. Alternatively, preferably, the distance sensor includes a first distance sensor 31 and a second distance sensor 32 arranged at intervals. The first vertical distance from the first distance sensor 31 to the vehicle 20 is measured using the first distance sensor 31, and the second vertical distance from the second distance sensor 32 to the vehicle 20 is measured using the second distance sensor 32. The actual tilting angle of the vehicle 20 can also be determined using the difference between the first and second vertical distances and the vertical distance between the first and second distance sensors 31 and 32, according to the tangent theorem.
[0030] like Figure 1 As shown, in this embodiment, the line connecting the first distance sensor 31 and the second distance sensor 32 is perpendicular to the pivot axis 22. This structure facilitates the measurement of the vertical distance between the first distance sensor 31 and the second distance sensor 32, thereby facilitating the measurement of the actual tilt angle of the vehicle 20.
[0031] Of course, the carrier 20 can also be configured as a frame structure, so that the detection signals emitted by the first distance sensor 31 and the second distance sensor 32 directly contact the silicon wafer, thereby directly obtaining the actual flip angle of the silicon wafer.
[0032] like Figures 1 to 3 As shown, in this embodiment, the tilting device further includes a drive device 40. The carrier 20 is pivotally mounted on the first upright plate 12 via the drive device 40, and the drive device 40 drives the carrier 20 to switch between the loading position and the tilting position. In the above structure, the drive device 40 can drive the carrier 20 to tilt, thereby improving the automation level of the tilting device.
[0033] Specifically, such as Figures 1 to 3As shown, in this embodiment, the carrier 20 includes a carrier body 21 and a pivot shaft 22 mounted on the carrier body 21. The drive device 40 includes a drive motor 41, a first gear 42 mounted on the drive shaft of the drive motor 41, and a second gear 43 connected to the pivot shaft 22. The first gear 42 meshes with the second gear 43, and the pivot shaft 22 is connected to the center of the second gear 43. In the above structure, the rotation of the drive motor 41 drives the first gear 42 to rotate. The first gear 42 meshes with the second gear 43, and the rotation of the first gear 42 drives the second gear 43 to rotate. The pivot shaft 22 of the carrier 20 is connected to the center of the second gear 43, and the rotation of the second gear 43 drives the carrier 20 to rotate. This driving method uses the drive motor 41 as a power source to drive multiple gears to transmit power. Compared with directly driving the pivot shaft 22 through the drive motor 41, the power transmission stability of the above driving method is better. The placement of the drive motor 41 and the carrier 20 is also more flexible.
[0034] like Figure 3 As shown, in this embodiment, the carrier body 21 includes a support plate 211, a first limiting structure 212 and a second limiting structure 213 disposed opposite to each other on the support plate 211, and a third limiting structure 214 disposed between the first limiting structure 212 and the second limiting structure 213. The support plate 211, the first limiting structure 212, the second limiting structure 213, and the third limiting structure 214 form a placement space for the component to be flipped. In the above structure, the silicon wafer can be placed in the placement space, and its placement position is limited by the first limiting structure 212, the second limiting structure 213, and the third limiting structure 214, which facilitates the placement of the silicon wafer in a predetermined posture, thereby improving the accuracy of subsequent processing of the silicon wafer.
[0035] like Figures 1 to 3 As shown, in this embodiment, the support frame 10 further includes a second upright plate 13 disposed opposite to the first upright plate 12. The flipping device further includes a pushing structure 50 disposed on the second upright plate 13. The pushing structure 50 is opposite to the second limiting structure 213. The second limiting structure 213 has a clearance hole 2131 for avoiding the pushing structure 50. The pushing structure 50 has a pushing position for pushing the part to be flipped and a retraction position for avoiding the carrier 20. In the above structure, when the carrier 20 is in the loading position, the silicon wafer can be placed on the carrier 20. The pushing structure 50 can pass through the clearance hole 2131 and move from the retraction position to the pushing position, pushing the silicon wafer to a position that abuts against the first limiting structure 212, so that the silicon wafer is accurately positioned on the carrier 20 in a predetermined posture, which is beneficial to improving the processing accuracy of the silicon wafer in the later stage.
[0036] Specifically, such as Figures 1 to 3As shown, in this embodiment, the pushing structure 50 includes a first cylinder 51 and a second cylinder 52 spaced apart along the extension direction of the first limiting structure 212. The above structure is simple and can achieve a good pushing effect.
[0037] like Figure 3 As shown, in this embodiment, the first limiting structure 212 and the second limiting structure 213 are limiting ribs, and the third limiting structure 214 is a limiting rib or multiple limiting protrusions. These structures facilitate limiting the silicon wafer from multiple directions, thereby ensuring that the silicon wafer is accurately positioned on the carrier 20 in a predetermined posture. Furthermore, the larger contact area between the limiting ribs and the silicon wafer further enhances the limiting effect of the first limiting structure 212 and the second limiting structure 213 on the silicon wafer. Of course, in other embodiments not shown in the figures, the first limiting structure 212 and the second limiting structure 213 may also be multiple limiting protrusions.
[0038] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.
[0039] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.
[0040] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.
[0041] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.
Claims
1. A flipping device, characterized in that, include: The support frame (10) includes a base plate (11) and a first upright plate (12) disposed on the base plate (11). The carrier (20) is pivotally mounted on the first upright plate (12). The central axis of the pivot axis (22) of the carrier (20) is set in the horizontal direction. The carrier (20) has a loading position parallel to the bottom plate (11) and a flipping position with an angle between it and the bottom plate (11). A distance measuring device (30) is disposed on the base plate (11) and located below the vehicle (20), and there is a distance between the projection of the pivot axis (22) of the vehicle (20) on the base plate (11) and the distance measuring device (30); The flipping device further includes: A drive device (40) is provided, wherein the carrier (20) is pivotally mounted on the first upright plate (12) via the drive device (40), and the drive device (40) drives the carrier (20) to switch between the loading position and the flipping position; The vehicle (20) includes a vehicle body (21) and a pivot shaft (22) disposed on the vehicle body (21). The drive device (40) includes a drive motor (41), a first gear (42) disposed on the drive shaft of the drive motor (41), and a second gear (43) connected to the pivot shaft (22). The first gear (42) meshes with the second gear (43), and the pivot shaft (22) is connected to the center of the second gear (43). The carrier body (21) includes a support plate (211), a first limiting structure (212) and a second limiting structure (213) disposed opposite to each other on the support plate (211), and a third limiting structure (214) disposed between the first limiting structure (212) and the second limiting structure (213). The support plate (211), the first limiting structure (212), the second limiting structure (213) and the third limiting structure (214) form a placement space for the part to be flipped. The support frame (10) further includes a second upright plate (13) disposed opposite to the first upright plate (12). The flipping device further includes a push structure (50) disposed on the second upright plate (13). The push structure (50) is opposite to the second limiting structure (213). The second limiting structure (213) has a clearance hole (2131) for avoiding the push structure (50). The push structure (50) has a push position for pushing the part to be flipped and a recovery position for avoiding the carrier (20).
2. The flipping device according to claim 1, characterized in that, The distance measuring device (30) includes a distance sensor.
3. The flipping device according to claim 2, characterized in that, The distance sensor includes a first distance sensor (31) and a second distance sensor (32) arranged at intervals.
4. The flipping device according to claim 3, characterized in that, The line connecting the first distance sensor (31) and the second distance sensor (32) is perpendicular to the pivot axis (22).
5. The flipping device according to claim 1, characterized in that, The push structure (50) includes a first cylinder (51) and a second cylinder (52) spaced apart along the extension direction of the first limiting structure (212).
6. The flipping device according to claim 1, characterized in that, The first limiting structure (212) and the second limiting structure (213) are limiting ribs, and the third limiting structure (214) is a limiting rib or multiple limiting protrusions.
Citation Information
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