An ultra-long linear array splicing structure electrical lead-out structure

Abstract

This invention proposes an ultra-long linear array splicing electrical lead-out structure, comprising: at least one spliced ​​PCB rigid-flex board, the PCB rigid-flex board including multiple rigid boards and flexible conductive strips; one end of the first PCB rigid board is designed with lead pads, which are bonded to the pads of a monolithic detector hybrid chip, and the other end is connected to the first and third flexible conductive strips; one side of the second PCB rigid board is connected to the first flexible conductive strip, and the other side is connected to the second flexible conductive strip; the third PCB rigid board is plugged into the lead-out interface, and the other side is connected to the fourth flexible conductive strip, which is connected to the second and third flexible conductive strips respectively. This invention can realize ultra-long linear array splicing and adds a signal secondary processing structure to realize secondary processing and shaping of the signal within the package structure, which is beneficial to improving the signal level at the output end of the package structure, and this structure can meet the requirements of miniaturization and integration.

Description

Technical Field

[0001] This invention relates to the field of advanced manufacturing technology, and in particular to an electrical lead-out structure for an ultra-long linear array splicing structure. Background Technology

[0002] In advanced manufacturing fields, such as infrared detection, infrared detectors, due to their unique ability to detect infrared signals, offer superior performance compared to visible light in low-light environments such as nighttime and space exploration, enabling applications in night vision, astronomical observation, and many other fields. As infrared detection technology matures, its applications are evolving towards larger fields of view, ultra-long fields of view, and higher resolutions.

[0003] Ultra-long linear array detectors, typically used for ultra-long field-of-view detection, are generally manufactured using a combination of multiple infrared detector hybrid chips due to manufacturing limitations. The electrical leads of a single infrared detector hybrid chip can employ various structures, such as ceramic frames or PCB boards. The choice of electrical lead structure must be tailored to the electrical application requirements and the overall packaging structure. The electrical lead signals of the infrared detector hybrid chip are analog signals processed by the readout circuitry, which can undergo secondary processing during application. Based on these structural requirements, common single-layer frames are insufficient to meet the need for secondary signal processing. Therefore, an electrical lead structure suitable for secondary signal processing and capable of multi-chip splicing needs must be designed. This structure should ensure the normal operation of the detector hybrid chip while minimizing power consumption and improving the integration of external electrical interfaces and signal secondary processing capabilities. Summary of the Invention

[0004] The technical problem this invention aims to solve is how to design an electrical lead-out structure for multi-chip splicing requirements, such a structure that, while ensuring the normal operation of the detector hybrid chip, can minimize power consumption and improve the integration level of the external electrical interface and signal secondary processing capabilities. In view of this, this invention provides an ultra-long linear array splicing electrical lead-out structure.

[0005] The technical solution adopted in this invention is that the electrical lead-out structure of the ultra-long linear array splicing structure includes:

[0006] At least one rigid-flex PCB board assembled from spliced ​​components, the rigid-flex PCB board comprising: a first rigid PCB board, a second rigid PCB board, a third rigid PCB board, a first flexible guide strip, a second flexible guide strip, a third flexible guide strip, and a fourth flexible guide strip.

[0007] The first PCB rigid board has lead pads at one end, which are bonded to the pads of the monolithic detector hybrid chip, and the other end is connected to the first flexible conductive strip and the third flexible conductive strip.

[0008] One side of the second PCB rigid board is connected to the first flexible guide strip, and the other side is connected to the second flexible guide strip;

[0009] The third PCB rigid board is inserted into the lead-out interface, and the other side is connected to the fourth flexible guide strip. The fourth flexible guide strip is connected to the second flexible guide strip and the third flexible guide strip respectively.

[0010] In one embodiment, the first PCB rigid board adopts a multi-layer rigid board structure, including analog power supply, analog ground, digital power supply, digital ground, IO power supply, IO ground, and processing signals including analog signals and digital signals.

[0011] In one embodiment, the second PCB rigid board adopts a multi-layer rigid board structure, including analog power supply, analog ground, digital power supply, digital ground, and processing signals including analog signals and secondary processing signals.

[0012] In one embodiment, the third PCB rigid board is designed with a single-layer rigid board structure and is equipped with a 51-pin standard connector.

[0013] By adopting the above technical solution, the present invention has at least the following advantages:

[0014] The electrical lead-out structure of the ultra-long line array splicing structure described in this invention adopts a method of repeatedly installing multiple PCB (Printed Circuit Board) rigid-flex boards to achieve ultra-long line array splicing. The single infrared detector hybrid chip can be adjusted and disassembled individually, which solves the problem that conventional frames cannot meet the requirements of ultra-long line array splicing due to processing size limitations. Moreover, the PCB rigid-flex board structure design is flexible in processing and highly feasible.

[0015] Furthermore, the monolithic structure of this invention adopts a PCB rigid-flex board design, which is convenient for installation and not easy to break at low temperatures. This ensures the mechanical strength, environmental reliability, and ease of installation and operation of the structure in low-temperature environments. In addition, a secondary signal processing structure is added to realize secondary processing and shaping of signals within the package structure, which is beneficial to improving the signal level at the output end of the package structure. Moreover, this structure can meet the requirements of miniaturization and integration, and is beneficial for subsequent multi-chip splicing. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a rigid-flex PCB structure according to an embodiment of the present invention;

[0017] Figure 2 This is a schematic diagram of the first rigid PCB board structure according to an embodiment of the present invention;

[0018] Figure 3 This is a schematic diagram of the second rigid PCB board structure according to an embodiment of the present invention;

[0019] Figure 4 This is a schematic diagram of the third rigid PCB board structure according to an embodiment of the present invention.

[0020] Figure 5 This is a schematic diagram of the electrical lead-out structure of the ultra-long line array splicing structure according to an embodiment of the present invention.

[0021] Figure Labels

[0022] 100-PCB rigid-flex board;

[0023] 111 - First rigid PCB board, 112 - Second rigid PCB board, 113 - Third rigid PCB board;

[0024] 121 - First flexible conduction band, 122 - Second flexible conduction band, 123 - Third flexible conduction band, 124 - Fourth flexible conduction band. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided with reference to the accompanying drawings and embodiments.

[0026] In the accompanying drawings, the thickness, size, and shape of the objects have been slightly exaggerated for ease of illustration. The drawings are for illustrative purposes only and are not drawn to scale.

[0027] It should also be understood that the terms "comprising," "including," "having," "containing," and / or "comprising," when used in this specification, indicate the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof. Furthermore, when a statement such as "at least one of..." appears after a list of listed features, it modifies the entire listed feature, not individual elements in the list. Additionally, when describing embodiments of this application, the word "may" is used to indicate "one or more embodiments of this application." And, the term "exemplary" is intended to refer to an example or illustration. "First sample data" may also be referred to as "second sample data," and "second sample data" may also be referred to as "first sample data."

[0028] As used herein, the terms “basically,” “approximately,” and similar terms are used as terms of approximation rather than terms of degree, and are intended to describe inherent biases in measured or calculated values ​​that will be recognized by those skilled in the art.

[0029] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. It should also be understood that terms (e.g., those defined in common dictionaries) shall be interpreted as having the meaning consistent with their meaning in the context of the relevant art and shall not be interpreted in an idealized or overly formal sense unless expressly so specified herein.

[0030] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0031] In the first embodiment of the present invention, an electrical lead-out structure for an ultra-long linear array splicing structure is provided, such as... Figure 1 As shown, it includes:

[0032] At least one PCB rigid-flex board 100 is spliced ​​together. The PCB rigid-flex board 100 includes: a first PCB rigid board 111, a second PCB rigid board 112, a third PCB rigid board 113, a first flexible guide strip 121, a second flexible guide strip 122, a third flexible guide strip 123, and a fourth flexible guide strip 124.

[0033] Among them, one end of the first PCB rigid board 111 is designed with lead pads, which are bonded to the pads of the monolithic detector hybrid chip, and the other end is connected to the first flexible conductive strip 121 and the third flexible conductive strip 123.

[0034] The second PCB rigid board 112 is connected to the first flexible guide strip 121 on one side and to the second flexible guide strip 122 on the other side.

[0035] The third PCB rigid board 113 is plugged into the lead-out interface, and the other side is connected to the fourth flexible guide strip 124. The fourth flexible guide strip 124 is connected to the second flexible guide strip 122 and the third flexible guide strip 123 respectively.

[0036] refer to Figure 2 In this embodiment, the first PCB rigid board 111 ( Figure 2The PCB A) design employs a multi-layer rigid board structure with a total of 9 layers, including analog power, analog ground, digital power, digital ground, I / O power, I / O ground, and signal processing layers including analog and digital signals. The design adheres to analog-digital isolation, using ground lines as shielding layers, and adding shielding to important signal lines to ensure power integrity and signal integrity. One end of the first PCB rigid board 111 is designed with lead pads, which are bonded to the pads of the monolithic detector hybrid chip via gold wire bonding, enabling the electrical leads of the monolithic hybrid chip to the first PCB rigid board 111. The first PCB rigid board 111 rearranges, partitions, and merges the signals. The other end of the first rigid PCB board 111 is designed with flexible guide strips 121 and 123 connected to it. Signals processed by the first rigid PCB board 111, of which signals that do not require secondary signal processing are led out from the third flexible guide strip 123 and then through the fourth flexible guide strip 124 to the third rigid PCB board 113, and signals that require secondary signal processing are led out from the first flexible guide strip 121 to the second rigid PCB board 112.

[0037] refer to Figure 3 In this embodiment, the second PCB rigid board 112 ( Figure 3 The PCB B) design employs a multi-layer rigid board structure with nine layers. The design includes analog power, analog ground, digital power, digital ground, signal processing (including analog signals and secondary processed signals), and adheres to analog-digital isolation principles. Ground lines are used as shielding layers, and important signal lines are shielded. Components can be surface-mounted on the second rigid PCB 112. One side of the second rigid PCB 112 is connected to the first flexible conductor 121, and the other side is connected to the second flexible conductor 122. The second rigid PCB 112 has a cutout in the middle for accommodating the secondary signal processing circuit. Lead pads are designed on the cutout end near the first flexible conductor 121, and these pads are bonded to the secondary signal processing circuit pads via gold wire bonding, allowing the electrical output of the signal requiring secondary processing to the secondary processing circuit. Similarly, lead pads are designed on the cutout end near the second flexible conductor 122, and these pads are bonded to the secondary signal processing circuit pads via gold wire bonding, allowing the processed signal to be output to the second rigid PCB 112. The signal after secondary processing is then led out through the second rigid PCB board 112 to the second flexible guide strip 122. One side of the second flexible guide strip 122 is connected to the second rigid PCB board 112, and the other side is connected to the fourth flexible guide strip 124. The signal after secondary processing is then led out through the second flexible guide strip 122 and the fourth flexible guide strip 124 to the third rigid PCB board 113.

[0038] refer to Figure 4 In this embodiment, the third PCB rigid board 113 ( Figure 4The PCB C) design adopts a single-layer rigid board structure. The 51-pin through-hole on the third PCB rigid board 113 is used for soldering 51-pin standard connectors to interlock with the package housing's lead-out interface, enabling electrical connection between the 51-pin pin and the package housing's lead-out interface.

[0039] Further, refer to Figure 5 The above describes the complete electrical lead-out process for each single infrared detector hybrid chip, from the PCB rigid-flex board structure to the lead-out interface of the package shell. Multiple chips are spliced ​​together and the above scheme is repeatedly used to achieve electrical lead-out of ultra-long line array splicing structure.

[0040] The second embodiment of the present invention is an application example of the present invention, based on the above embodiments.

[0041] In this embodiment, the first rigid PCB board 111 of the PCB rigid-flex board is fixed together with the single infrared detector hybrid chip via a single-module splicing substrate A for single-chip electrical lead-out and subsequent splicing of multiple chips; the front side of the single-module splicing substrate A is bonded to the detector structure with adhesive; the lead pad ends of the first rigid PCB board 111 are aligned with the lead-out ends of the detector hybrid chip; the front side of the single-module splicing substrate is bonded to the back side of the first rigid PCB board 111 with adhesive, and the first rigid PCB board 111 is fixed to the single-module splicing substrate A by screws and adhesive; the lead pads of the first rigid PCB board 111 are connected to the chip pins by gold wire bonding to realize the electrical connection between the chip and the first rigid PCB board 111.

[0042] In this embodiment, the second rigid PCB board 112 portion of the PCB rigid-flex board and the signal secondary processing circuit are fixed together by a single-module splicing substrate B for electrical lead-out of a single infrared detector hybrid chip and subsequent splicing of multiple chips; the front side of the single-module splicing substrate B is bonded to the signal secondary processing circuit with adhesive; the lead pad ends of the second rigid PCB board 112 are aligned with the lead-out ends of the signal secondary processing circuit chip; the front side of the single-module splicing substrate is bonded to the back side of the second rigid PCB board 112 with adhesive, and the second rigid PCB board 112 is fixed to the single-module splicing substrate B by screws and adhesive; the lead pads of the second rigid PCB board 112 are connected to the pins of the signal secondary processing circuit chip by gold wire soldering, realizing the electrical connection between the signal secondary processing circuit chip and the second rigid PCB board 112.

[0043] In this embodiment, a 51-pin standard plug-in is soldered to the back of the third PCB rigid board 113. The 51-pin plug-in is then connected to the interface of the package structure shell, thus achieving electrical connection between the signal of a single infrared detector hybrid chip and the interface of the package structure shell.

[0044] In this embodiment, in order to achieve ultra-long line array splicing, multiple single-chip infrared detectors can be integrated into a single chip. The above structure is used to complete the splicing of multiple chips and realize the electrical lead-out of the ultra-long line array splicing structure.

[0045] It is understood that this embodiment is also applicable to situations where ultra-long linear array chips can be individually replaced and adjusted and where secondary signal processing is required.

[0046] In summary, compared with the prior art, the present invention has at least the following advantages:

[0047] 1) This invention uses a method of repeatedly installing multiple rigid-flex PCBs to achieve ultra-long line array splicing. The single infrared detector hybrid chip can be adjusted and disassembled individually, which solves the problem that conventional frames cannot meet the requirements of ultra-long line array splicing due to processing size limitations. Moreover, the PCB rigid-flex board structure design is flexible in processing and highly feasible.

[0048] 2) The monolithic structure of this invention adopts a PCB rigid-flex board design, which is easy to install and not easy to break at low temperatures. This ensures the mechanical strength, environmental reliability, and installation operability of the structure in low-temperature environments. In addition, a secondary signal processing structure is added to realize the secondary processing and shaping of signals within the package structure, which is beneficial to improving the signal level at the output end of the package structure. Moreover, this structure can meet the requirements of miniaturization and integration, and is beneficial to the subsequent splicing of multiple chips.

[0049] Through the description of specific embodiments, a more in-depth and specific understanding should be gained of the technical means and effects adopted by the present invention to achieve the intended purpose. However, the accompanying drawings are only provided for reference and illustration and are not intended to limit the present invention.

Claims

1. An electrical lead-out structure for an ultra-long linear array splicing structure, characterized in that, include: At least one rigid-flex PCB board assembled from spliced ​​components, the rigid-flex PCB board comprising: a first rigid PCB board, a second rigid PCB board, a third rigid PCB board, a first flexible guide strip, a second flexible guide strip, a third flexible guide strip, and a fourth flexible guide strip. The first PCB rigid board has lead pads at one end, which are bonded to the pads of the monolithic detector hybrid chip, and the other end is connected to the first flexible conductive strip and the third flexible conductive strip. One side of the second PCB rigid board is connected to the first flexible guide strip, and the other side is connected to the second flexible guide strip; The third PCB rigid board is inserted into the lead-out interface, and the other side is connected to the fourth flexible guide strip. The fourth flexible guide strip is connected to the second flexible guide strip and the third flexible guide strip respectively. The first rigid PCB board portion is fixed together with the single infrared detector hybrid chip via a first single-module splicing substrate for single-chip electrical lead-out and subsequent multi-chip splicing; the front side of the single-module splicing substrate A is bonded to the detector structure with adhesive; the lead pad ends of the first rigid PCB board are aligned with the lead-out ends of the detector hybrid chip; the front side of the single-module splicing substrate is bonded to the back side of the first rigid PCB board with adhesive; the first rigid PCB board is fixed to the first single-module splicing substrate by screws and adhesive; the lead pads of the first rigid PCB board are connected to the chip pins by gold wire bonding to achieve electrical connection between the chip and the first rigid PCB board; The second rigid PCB board and the signal secondary processing circuit are fixed together by the second single-module splicing substrate for electrical lead-out of a single infrared detector hybrid chip and subsequent splicing of multiple chips. The front of the second single-module splicing substrate is bonded to the signal secondary processing circuit with adhesive. The lead pads of the second rigid PCB board are aligned with the lead-out pads of the signal secondary processing circuit chip. The front of the second single-module splicing substrate is bonded to the back of the second rigid PCB board with adhesive. The second rigid PCB board is fixed to the second single-module splicing substrate with screws and adhesive. The lead pads of the second rigid PCB board are connected to the pins of the signal secondary processing circuit chip by gold wire bonding, realizing the electrical connection between the signal secondary processing circuit chip and the second rigid PCB board. A 51-pin standard plug-in is soldered to the back of the third PCB rigid board. The 51-pin plug-in is then plugged into the lead-out interface of the package structure shell to achieve electrical connection between the signal of a single infrared detector hybrid chip and the lead-out interface of the package structure shell.

2. The electrical lead-out structure of the ultra-long linear array splicing structure according to claim 1, characterized in that, The first PCB rigid board adopts a multi-layer rigid board structure, including analog power supply, analog ground, digital power supply, digital ground, IO power supply, and IO ground, and processes signals including analog signals and digital signals.

3. The electrical lead-out structure of the ultra-long linear array splicing structure according to claim 1, characterized in that, The second PCB rigid board adopts a multi-layer rigid board structure, including analog power supply, analog ground, digital power supply, and digital ground. The processed signals include analog signals and secondary processed signals.

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