一种MicroLED巨量转移方法
By designing an opaque transfer frame and a light-transmitting support layer, combined with light-transmitting holes and buckle plate limiting, the safety and accuracy issues in the mass transfer process of MicroLEDs are solved, achieving high yield MicroLED transfer, simplifying the manufacturing process and improving processing efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 黄招凤
- Filing Date
- 2022-12-07
- Publication Date
- 2026-07-17
AI Technical Summary
In existing MicroLED mass transfer technology, the safety and accuracy of the transfer process are difficult to guarantee, especially when the receiving substrate is uneven. The distance between the MicroLED and the receiving substrate is uneven, and the laser irradiation position is prone to deviation, which affects the yield.
An opaque transfer frame and a transparent support layer are used, which are prepared according to the shape of the receiving substrate. A light-transmitting hole is opened on the transfer frame. The MicroLED is fixed by an adhesive layer and transferred by a laser through the light-transmitting hole. Combined with a buckle plate for limiting, the alignment of the MicroLED with the receiving substrate and the accuracy of laser irradiation are ensured.
This improves the safety and accuracy of MicroLED transfer, ensuring that all MicroLEDs are uniformly transferred to the receiving substrate, increasing yield, simplifying the fabrication process, and improving processing efficiency.
Smart Images
Figure CN115939288B_ABST