Electronic device

Abstract

This invention provides an electronic device capable of improving the durability of solder used to bond a connector and a substrate. One embodiment of the electronic device includes a housing, a substrate, a connector, a metal component, a screw, a first solder, and a second solder. The substrate has a first surface and a metallic region disposed on the first surface, and has a first hole opening in the region and a second hole opening on the first surface. The connector has a third hole. The metal component has a second surface facing the region and a mating portion inserted into the second hole, and has a fourth hole opening on the second surface and communicating with the first hole and the third hole. The screw passes through the third hole and the fourth hole to mount the connector and the metal component to the housing. The first solder bonds the region to the second surface. The second solder bonds the inner surface of the second hole to the mating portion.

Description

[0001] Related applications

[0002] This application claims priority to Japanese Patent Application No. 2021-154720 (filed on September 22, 2021). This application includes all contents of the basic application by reference to that basic application. Technical Field

[0003] Embodiments of the present invention relate to electronic devices. Background Technology

[0004] Electronic devices such as hard disk drives (HDDs) or solid-state drives (SSDs) connect to external devices such as personal computers via connectors based on standards such as Serial ATA (SATA). These connectors are mounted on a base plate located outside the housing of the electronic device. Summary of the Invention

[0005] Connectors and substrates are mounted to each other, for example, using solder. However, this solder is susceptible to stress concentration due to various factors. Stress concentration can reduce the durability of the solder.

[0006] One example of the problem that this invention aims to solve is to provide an electronic device that can improve the durability of solder used to bond connectors and substrates.

[0007] An electronic device according to one embodiment includes a housing, a substrate, a connector, a metal component, a screw, a first solder, and a second solder. The housing houses a component. The substrate has a first surface and a metallic region disposed on the first surface, a first hole opening in the region, and a second hole opening on the first surface. It is mounted outside the housing and electrically connected to the component. The connector is configured to have a third hole, is mounted outside the housing on the substrate, and connects to an external device. The metal component has a second surface facing the region and a mating portion inserted into the second hole, a fourth hole opening on the second surface and communicating with the first and third holes, and is mounted to the connector. The screw passes through the third and fourth holes to mount the connector and the metal component to the housing. The first solder bonds the region and the second surface together. The second solder bonds the metallic inner surface of the second hole and the mating portion together. Attached Figure Description

[0008] Figure 1 This is an exemplary perspective view showing one implementation of a hard disk drive (HDD).

[0009] Figure 2This is an exemplary perspective view showing the HDD decomposed according to the above-described embodiments.

[0010] Figure 3 This is an illustrative perspective view showing a portion of the HDD described in the above embodiments.

[0011] Figure 4 This is an illustrative perspective view showing the housing, PCB, and connector module of the above-described embodiment.

[0012] Figure 5 This is an illustrative top view showing the connector module of the above embodiment.

[0013] Figure 6 It is along Figure 5 The F6-F6 line represents a cross-sectional view of a portion of the HDD in the above embodiment.

[0014] [Label Explanation]

[0015] 1…External device, 10…Hard disk drive (HDD), 11…Housing, 12…Disk, 15…Head, 19…FPC, 51…Printed circuit board (PCB), 51a…Inner surface, 51c…Metal area, 65…Through hole, 65a…Edge, 66…Through hole, 66a…Inner surface, 71…Interface connector (I / F connector), 72…Mounting plate, 73…Screw, 82…Terminal, 84b…Lower surface, 87…Through hole, 88…Matching hole, 91…Board portion, 91b…Lower surface, 91c, 91d, 91e, 91f…Side, 92…Reinforcing protrusion, 93…Matching protrusion, 95…Through hole, 101…Threaded shaft, 102…Screw head, 111, 112…Solder. Detailed Implementation

[0016] The following is for reference Figures 1 to 6 This specification describes one embodiment. Furthermore, in this specification, multiple representations are sometimes used to describe the constituent elements of an embodiment and their descriptions. The constituent elements and their descriptions are examples and are not limited to the representations in this specification. Constituent elements may also be designated by names different from those used in this specification. Additionally, constituent elements may be described using representations different from those used in this specification.

[0017] Figure 1 This is an exemplary perspective view showing a hard disk drive (HDD) 10 according to one embodiment. The HDD 10 is, for example, mounted on an external device 1. The HDD 10 is an example of an electronic device and can also be referred to as a storage device or disk device. Furthermore, the electronic device is not limited to the HDD 10, but may also be a solid-state drive (SSD) or other devices.

[0018] External device 1 is, for example, a computer such as a personal computer, supercomputer, server, television image receiving device, or game console, or a device such as an external HDD (external hard drive). External device 1 can also be called a host device.

[0019] As shown in the accompanying figures, for convenience, the X-axis, Y-axis, and Z-axis are defined in this specification. The X-axis, Y-axis, and Z-axis are orthogonal to each other. The X-axis is set along the width of the HDD10. The Y-axis is set along the length of the HDD10. The Z-axis is set along the thickness of the HDD10.

[0020] Furthermore, in this specification, the X, Y, and Z directions are defined. The X direction is the direction along the X-axis, including the +X direction indicated by the arrow on the X-axis and the -X direction, which is the opposite direction of the arrow on the X-axis. The Y direction is the direction along the Y-axis, including the +Y direction indicated by the arrow on the Y-axis and the -Y direction, which is the opposite direction of the arrow on the Y-axis. The Z direction is the direction along the Z-axis, including the +Z direction indicated by the arrow on the Z-axis and the -Z direction, which is the opposite direction of the arrow on the Z-axis.

[0021] Figure 2 This is an exemplary perspective view showing the HDD10 of this embodiment decomposed. For example... Figure 2 As shown, HDD10 has a housing 11, multiple disks 12, a spindle motor 13, clamping springs 14, multiple heads 15, an actuator assembly 16, a voice coil motor (VCM) 17, a ramp loading mechanism 18, and a flexible printed circuit board (FPC) 19. Disks 12 are an example of storage media. Heads 15, actuator assembly 16, and FPC 19 are examples of components.

[0022] The shell 11 has a base 21, an inner cover 22, and an outer cover 23. The base 21 is a bottomed container with a bottom wall 25 and side walls 26. The bottom wall 25 is an example of a wall. The bottom wall 25 is formed as a generally rectangular (quadrilateral) plate extending along the XY plane. The side walls 26 project from the outer edge of the bottom wall 25 in the +Z direction. The bottom wall 25 and the side walls 26 are integrally formed, for example, from a metallic material such as aluminum alloy.

[0023] The inner cover 22 and the outer cover 23 are made of metal materials such as aluminum alloy. The inner cover 22 is mounted to the end of the side wall 26 in the +Z direction by screws, for example. The outer cover 23 covers the inner cover 22 and is fixed to the end of the side wall 26 in the +Z direction by welding, for example.

[0024] The housing 11 houses the disk 12, spindle motor 13, clamping spring 14, magnetic head 15, actuator assembly 16, voice coil motor 17, ramp loading mechanism 18, and FPC 19. The components housed in the housing 11 are covered by the bottom wall 25 and side walls 26 of the base 21, as well as the inner cover 22.

[0025] Disk 12 is, for example, a disk having magnetic recording layers disposed on at least one of its upper and lower surfaces. The diameter of disk 12 is, for example, 3.5 inches, but is not limited to this example.

[0026] The spindle motor 13 supports and rotates a plurality of disks 12 that are spaced apart and overlapped. Clamping springs 14 hold the plurality of disks 12 in the hub of the spindle motor 13.

[0027] The read / write head 15 records and reproduces information on the recording layer of the disk 12. In other words, the read / write head 15 reads and writes information to the disk 12. The disk 12 stores the information written by the read / write head 15. The read / write head 15 is supported on the actuator assembly 16.

[0028] The actuator assembly 16 is rotatably supported on a support shaft 33 configured in a position detached from the disk 12. The VCM 17 rotates the actuator assembly 16 and positions it in the desired location. If the read / write head 15 is moved to the outermost periphery of the disk 12 by the rotation of the actuator assembly 16 using the VCM 17, the ramp loading mechanism 18 holds the read / write head 15 in an unloaded position detached from the disk 12.

[0029] Actuator assembly 16 includes actuator module 35, multiple arms 36, and multiple head suspension assemblies (suspensions) 37. Suspension 37 may also be referred to as head universal joint assembly (HGA).

[0030] The actuator module 35 is rotatably supported on the support shaft 33, for example, via bearings. Multiple arms 36 protrude from the actuator module 35 in a direction substantially orthogonal to the support shaft 33. Alternatively, the actuator assembly 16 may be segmented, with multiple arms 36 protruding from multiple actuator modules 35 respectively.

[0031] Multiple arms 36 are arranged at intervals along the direction in which the support shaft 33 extends. Each arm 36 is formed into a plate shape that can enter the gap between adjacent disks 12. The multiple arms 36 extend substantially parallel to each other.

[0032] The actuator module 35 and the multiple arms 36 are formed integrally from aluminum, for example. Furthermore, the materials of the actuator module 35 and the arms 36 are not limited to this example.

[0033] The voice coil of VCM17 is disposed on a protrusion extending from actuator module 35. VCM17 has a pair of yokes, a voice coil disposed between the yokes, and a magnet disposed on the yokes.

[0034] The suspension 37 is mounted on the top portion of the corresponding arm 36 and protrudes from the arm 36. Thus, the plurality of suspensions 37 are arranged at intervals in the direction in which the support shaft 33 extends.

[0035] Each of the multiple suspensions 37 has a base plate 41, a load beam 42, and a flexible member 43. Furthermore, a magnetic head 15 is mounted on each suspension 37.

[0036] The base plate 41 and the load beam 42 are made of stainless steel, for example. However, the materials of the base plate 41 and the load beam 42 are not limited to this example. The base plate 41 is formed as a plate and is mounted on the top end of the arm 36. The load beam 42 is formed as a plate that is thinner than the base plate 41. The load beam 42 is mounted on the top end of the base plate 41 and protrudes from the base plate 41.

[0037] The flexible element 43 is formed in the form of an elongated strip. Furthermore, the shape of the flexible element 43 is not limited to this example. The flexible element 43 is a laminate having a metal plate (backing layer) such as stainless steel, an insulating layer formed on the metal plate, a conductive layer formed on the insulating layer and constituting multiple wirings (wiring patterns), and a protective layer (insulating layer) covering the conductive layer.

[0038] At one end of the flexible member 43, a universal joint (elastic support) is provided, located on the load beam 42 and capable of displacement. The magnetic head 15 is mounted on this universal joint. The other end of the flexible member 43 is connected to the FPC 19. Thus, the FPC 19 is electrically connected to the magnetic head 15 via the wiring of the flexible member 43.

[0039] Figure 3 This is an exemplary perspective view showing an exploded representation of a portion of the HDD10 of this embodiment. For example... Figure 3 As shown, HDD10 also includes a printed circuit board (PCB) 51, a relay connector 52, and a connector module 53. PCB 51 is an example of a substrate.

[0040] PCB 51 is located outside the housing 11. PCB 51 is, for example, a rigid substrate such as a glass epoxy board substrate, or a multilayer substrate, laminated substrate, etc. PCB 51 unfolds along the XY plane and is mounted to the bottom wall 25, for example, by a plurality of screws 55. Alternatively, PCB 51 can also be mounted to the bottom wall 25 by other methods such as using hook-and-loop fasteners.

[0041] The relay connector 52 and connector module 53 are located outside the housing 11 and mounted on the PCB 51. In addition, various memories such as RAM, ROM and cache, controllers, servo controllers, coils, capacitors and other electronic components can also be further mounted on the PCB 51.

[0042] The relay connector 52 is connected to the FPC 19, for example, through a hole penetrating the bottom wall 25. Thus, the PCB 51 is electrically connected to the FPC 19 via the relay connector 52. Furthermore, the PCB 51 is electrically connected to the magnetic head 15 via the relay connector 52, the FPC 19, and the flexible member 43.

[0043] Figure 4 This is an exemplary perspective view showing the housing 11, PCB 51, and connector module 53 of this embodiment. Figure 5 This is an exemplary top view showing the connector module 53 of this embodiment. Figure 6 It is along Figure 5 The F6-F6 line represents a cross-sectional view of a portion of the HDD10 in this embodiment. Hereinafter, refer to... Figures 3 to 6 This section provides a detailed explanation of the HDD10.

[0044] like Figure 3 As shown, a notch 61 is provided in the base 21. The notch 61 is provided at the corner of the bottom wall 25 and the side wall 26 and opens at the end 21a of the base 21 in the +Y direction.

[0045] The base 21 has two support surfaces 62. Support surface 62 is part of the bottom surface of the notch 61 in the +Z direction. Support surface 62 is also part of the outer surface of the base 21 and faces the outside of the housing 11. For example, support surface 62 is formed generally flat along the XY plane and faces the -Z direction. Furthermore, support surface 62 is not limited to this example. The two support surfaces 62 are separated from each other in the X direction.

[0046] Two threaded holes 63 are provided in the base 21. Each threaded hole 63 opens in one of the two support surfaces 62. The threaded hole 63 has a generally circular cross-section and extends from the support surface 62 in a generally +Z direction. A female thread is provided on the inner surface of the threaded hole 63.

[0047] like Figure 6 As shown, PCB 51 has an inner surface 51a and an outer surface 51b. The inner surface 51a is an example of the first surface. The inner surface 51a is formed to be generally flat along the XY plane and faces the +Z direction. The inner surface 51a faces the bottom wall 25 and the support surface 62. The outer surface 51b is located on the opposite side of the inner surface 51a.

[0048] A metal region 51c is provided on the inner surface 51a. The metal region 51c is an example of a region. The metal region 51c is a part of the inner surface 51a that is not covered by solder resist and exposes the metal layer of PCB 51. That is to say, the metal region 51c is made of metal.

[0049] Two through holes 65 and eight through holes 66 are provided on PCB 51. Furthermore, the number of through holes 65 and through holes 66 is not limited to this example. Through holes 65 are an example of the first type of hole. Through holes 66 are an example of the second type of hole and a connecting hole.

[0050] Through-hole 65 and through-hole 66 penetrate the PCB 51 in the generally Z direction and open on the inner surface 51a and the outer surface 51b. In this embodiment, through-hole 65 and through-hole 66 open in the metal region 51c in the inner surface 51a. Alternatively, through-hole 66 may open in a portion of the inner surface 51a that is different from the metal region 51c.

[0051] like Figure 5 As shown by the double-dotted line, the through hole 65 has a generally circular cross-section and is arranged concentrically (coaxially) with the threaded hole 63. In other words, the through hole 65 is positioned approximately at the same location as the threaded hole 63 when viewed from the Z direction. Furthermore, the cross-section of the through hole 65 is orthogonal to the Z direction in which the through hole 65 extends. The diameter of the through hole 65 is longer than the outer diameter of the threaded hole 63.

[0052] like Figure 5 As shown by the double-dotted line, the plurality of through holes 66 each have a generally rectangular cross-section extending in the generally Y direction. Alternatively, the through holes 66 may have other cross-sectional shapes, such as circles. The plurality of through holes 66 are separated from each other. In this embodiment, four through holes 66 are arranged around a through hole 65. The through holes 66 are also separated from the through hole 65.

[0053] like Figure 6 As shown, PCB 51 also has an inner surface 66a of a through-hole 66. The inner surface 66a is formed by plating metal. In other words, the inner surface 66a is made of metal. The plating forming the inner surface 66a is electrically connected, for example, to the ground pattern of PCB 51.

[0054] Figure 4 The connector module 53 shown has an interface connector (I / F connector) 71, two mounting plates 72 and two screws 73. Figure 4 One of the two mounting plates 72 and one of the two screws 73 are shown. I / F connector 71 is an example of a connector. Mounting plate 72 is an example of a metal component.

[0055] The I / F connector 71 is a connector based on an interface standard such as Serial ATA (SATA). Alternatively, the I / F connector 71 can also be based on Serial Attached SCSI (SAS), NVM Express (NVMe), or other interface standards.

[0056] like Figure 3As shown, the I / F connector 71 has a base 81, terminals 82, multiple pins 83, and two mounting portions 84. The base 81 is formed in a generally cuboid shape extending in a generally X direction. The base 81 is made of an insulator such as synthetic resin. However, the base 81 is not limited to this example.

[0057] A socket 86 is provided on the base 81. The socket 86 is a recess with an opening at the end 81a of the base 81 in the +Y direction. A terminal 82 is provided on the socket 86. The terminal 82 is a terminal for communication and power supply according to the SATA standard. However, the terminal 82 is not limited to this example.

[0058] Terminal 82 is formed as a generally rectangular plate (cubic parallelepiped) extending in a generally X direction. Terminal 82 extends from the base 81 in the +Y direction inside the socket 86. The +Y direction is an example of a first direction.

[0059] I / F connector 71 is connected to I / F connector 1a of external device 1. For example, by mating I / F connectors 1a and 71, terminal 82 of I / F connector 71 is connected to I / F connector 1a.

[0060] Pin 83 protrudes, for example, from end 81b of base 81 in the -Y direction. Pin 83 is electrically connected to the electrode of terminal 82. Pin 83 is electrically connected, for example, to an electrode such as a pad or through-hole provided on the inner surface 51a of PCB 51 via solder. Thus, I / F connector 71 is mounted on PCB 51 outside housing 11.

[0061] Two mounting portions 84 are provided at both ends of the base 81 in the X direction. The mounting portions 84 are generally rectangular parallelepipeds. Alternatively, the mounting portions 84 may be formed in other shapes. Figure 6 As shown, the mounting portion 84 is located between the inner surface 51a of the PCB 51 and the support surface 62 of the substrate 21. Therefore, the through hole 87, the upper surface 84a, and the lower surface 84b are also located between the inner surface 51a and the support surface 62.

[0062] The mounting portion 84 has an upper surface 84a and a lower surface 84b. Furthermore, in this embodiment, "upper" and "lower" are represented by... Figures 1 to 3 The orientation of HDD10 in the image is used as a reference for convenient display, rather than restricting the orientation, position, usage style, or other conditions.

[0063] The upper surface 84a is formed to be generally flat along the XY plane and faces the +Z direction. The upper surface 84a faces the corresponding support surface 62 of the substrate 21. The lower surface 84b is located on the opposite side of the upper surface 84a. The lower surface 84b is formed to be generally flat along the XY plane and faces the -Z direction. The lower surface 84b faces the inner surface 51a of the PCB 51.

[0064] Two mounting portions 84 are respectively provided with a through hole 87 and two fitting holes 88. The through hole 87 is an example of a third hole. The fitting holes 88 are an example of a fifth hole. Figure 5 As shown, the through hole 87 has a generally circular cross-section and is arranged approximately concentrically (coaxially) with the threaded hole 63 and the through hole 65. In other words, the through hole 87 is positioned approximately at the same location as the threaded hole 63 and the through hole 65 when viewed from the Z direction. The diameter of the through hole 87 is the same as or longer than the outer diameter of the threaded hole 63. Furthermore, the diameter of the through hole 87 is shorter than the diameter of the through hole 65.

[0065] The two fitting holes 88 each have a generally rectangular cross-section extending in the generally Y direction. Alternatively, the fitting holes 88 may have other cross-sectional shapes. The two fitting holes 88 are separated from each other in the X direction. A through hole 87 is located between the two fitting holes 88. In the Y direction, the fitting holes 88 are located between the two through holes 66.

[0066] like Figure 6 As shown, the upper surface 84a of the mounting part 84 abuts against the corresponding support surface 62. Thus, the through hole 87 of the mounting part 84 communicates with the threaded hole 63 of the base 21. Furthermore, a gap or other object may exist between the upper surface 84a and the support surface 62.

[0067] Mounting plate 72 is made of, for example, a stamped metal sheet. Figure 5 As shown, the two mounting plates 72 each have a plate portion 91, four reinforcing protrusions 92, and four mating protrusions 93. Furthermore, the mounting plate 72 is not limited to this example. The plate portion 91 is an example of a wall. The reinforcing protrusions 92 are an example of a joint and a second protrusion. The mating protrusions 93 are an example of a first protrusion.

[0068] The plate portion 91 is formed into a generally quadrilateral plate (cubic parallelepiped) that unfolds along the XY plane. The plate portion 91 has... Figure 6 The upper surface 91a and the lower surface 91b shown, and Figure 5 The four sides 91c, 91d, 91e, and 91f are shown. The lower surface 91b is an example of the second side. Side 91c is an example of the edge and the first edge. Side 91d is an example of the edge and the second edge. Side 91e is an example of the edge and the third edge. Side 91f is an example of the edge and the fourth edge.

[0069] like Figure 6As shown, the upper surface 91a is formed to be generally flat along the XY plane and faces the +Z direction. The upper surface 91a faces the lower surface 84b of the corresponding mounting portion 84. The lower surface 91b is located on the opposite side of the upper surface 91a. The lower surface 91b is formed to be generally flat along the XY plane and faces the -Z direction. The lower surface 91b faces the inner surface 51a of the PCB 51. At least a portion of the lower surface 91b faces the metal region 51c in the inner surface 51a.

[0070] like Figure 5 As shown, the four sides 91c, 91d, 91e, and 91f are the edges of the cuboid plate portion 91. The four sides 91c, 91d, 91e, and 91f are located between the edge of the upper surface 91a and the edge of the lower surface 91b.

[0071] Sides 91c and 91d extend in the Y direction (both +Y and -Y directions). Alternatively, sides 91c and 91d can extend in different directions and can be convex or concave. Side 91c faces the +X direction. Side 91d is located on the opposite side of side 91c and faces the -X direction.

[0072] Sides 91e and 91f extend in the X direction. Alternatively, sides 91e and 91f can extend in different directions and may be provided with concave and convex features. Side 91e extends between the end of side 91c in the +Y direction and the end of side 91d in the +Y direction, and faces towards the +Y direction. Side 91f is located on the opposite side of side 91e. Side 91f extends between the end of side 91c in the -Y direction and the end of side 91d in the -Y direction, and faces towards the -Y direction. The -Y direction is an example of a second direction. As described above, the four sides 91c, 91d, 91e, and 91f each face a direction intersecting the -Z direction towards which the lower surface 91b faces.

[0073] A through hole 95 is provided in the plate portion 91. The through hole 95 is an example of a fourth hole. The through hole 95 penetrates the plate portion 91 in the approximately Z direction and opens on the upper surface 91a and the lower surface 91b.

[0074] The through hole 95 has a generally circular cross-section and is arranged approximately concentrically (coaxially) with the threaded hole 63 and the through holes 65 and 87. In other words, the through hole 95 is positioned approximately at the same location as the threaded hole 63 and the through holes 65 and 87 when viewed from the Z direction. The diameter of the through hole 95 is the same as or longer than the outer diameter of the threaded hole 63. In addition, the diameter of the through hole 95 is shorter than the diameter of the through hole 65.

[0075] like Figure 6As shown, the board portion 91 is disposed on the lower surface 84b of the corresponding mounting portion 84. Therefore, the upper surface 91a of the board portion 91 abuts against the lower surface 84b of the mounting portion 84. Furthermore, a gap or other object may exist between the upper surface 91a and the lower surface 84b. Additionally, the board portion 91 is located between the inner surface 51a of the PCB 51 and the support surface 62 of the substrate 21. Therefore, the through hole 95, the upper surface 91a, and the lower surface 91b are also located between the inner surface 51a and the support surface 62.

[0076] The through hole 95 of the board portion 91 is connected to the through hole 87 of the mounting portion 84. Therefore, the through hole 87 is connected to the threaded hole 63 and the through hole 95. Moreover, the through hole 95 of the board portion 91 is connected to the through hole 65 of the PCB 51 via a gap.

[0077] like Figure 5 As shown, the reinforcing protrusions 92 protrude from two sides 91c and 91d. For example, two reinforcing protrusions 92 protrude from side 91c while the other two reinforcing protrusions 92 protrude from side 91d. On the other hand, the reinforcing protrusions 92 do not protrude from sides 91e and 91f. Furthermore, the reinforcing protrusions 92 are not limited to this example.

[0078] Two reinforcing protrusions 92 protruding from side 91c are separated from each other in the Y direction. Additionally, two reinforcing protrusions 92 protruding from side 91d are also separated from each other in the Y direction. Therefore, the multiple reinforcing protrusions 92 are separated from each other.

[0079] Two of the four reinforcing protrusions 92 are located near the side 91e. Therefore, these two reinforcing protrusions 92 are closer to the side 91e than the centers of the sides 91c and 91d. Additionally, the other two of the four reinforcing protrusions 92 are located near the side 91f. Therefore, these two reinforcing protrusions 92 are closer to the side 91f than the centers of the sides 91c and 91d.

[0080] The reinforcing protrusion 92 is formed, for example, by bending a portion of the metal plate forming the plate portion 91. Figure 6 As shown, the plurality of reinforcing protrusions 92 each have a connecting portion 92a connected to the sides 91c and 91d and a protruding portion 92b extending from the connecting portion 92a in the -Z direction. The protruding portion 92b is formed into a generally rectangular plate (cubic parallelepiped) that unfolds along the YZ plane.

[0081] The protrusion 92b of the reinforcing protrusion 92 is inserted into the corresponding through hole 66. In this embodiment, the protrusion 92b does not protrude from the outer surface 51b of the PCB 51. In other words, in the Z direction, the end of the reinforcing protrusion 92 in the -Z direction is closer to the board portion 91 than the outer surface 51b of the PCB 51. This prevents the reinforcing protrusion 92 from increasing the thickness of the HDD 10 in the Z direction. Alternatively, the protrusion 92b may protrude from the outer surface 51b of the PCB 51.

[0082] like Figure 5 As shown, in a cross-section orthogonal to the Z direction extending from the through hole 66, the protrusion 92b has a generally rectangular cross-section extending in the Y direction. The cross-section of the protrusion 92b is smaller than the cross-section of the through hole 66.

[0083] The interlocking protrusions 93 protrude from two sides 91c and 91d. For example, two interlocking protrusions 93 protrude from side 91c while the other two interlocking protrusions 93 protrude from side 91d. On the other hand, the interlocking protrusions 93 do not protrude from sides 91e and 91f. Furthermore, the interlocking protrusions 93 are not limited to this example.

[0084] Two interlocking protrusions 93 protruding from side 91c are separated from each other in the Y direction and located between two of the plurality of reinforcing protrusions 92 that protrude from side 91c. Additionally, two interlocking protrusions 93 protruding from side 91d are also separated from each other in the Y direction and located between two of the plurality of reinforcing protrusions 92 that protrude from side 91d. Therefore, the plurality of reinforcing protrusions 92 and the plurality of interlocking protrusions 93 are separated from each other.

[0085] The fitting protrusion 93 is formed, for example, by bending a portion of the metal plate forming the plate portion 91. Multiple fitting protrusions 93 extend from the sides 91c and 91d in the -Z direction. The fitting protrusion 93 is formed as a generally rectangular plate (cubic parallelepiped) unfolding along the YZ plane. In a cross-section orthogonal to the Z direction, the fitting protrusion 93 has a generally rectangular cross-section extending in the Y direction.

[0086] like Figure 6 As shown by the dashed line, the mating protrusion 93 is inserted into the corresponding mating hole 88 of the mounting portion 84. The mating protrusion 93 is inserted into the mating hole 88, thereby mounting the mounting plate 72 onto the I / F connector 71.

[0087] For example, the mating protrusion 93 abuts against the inner surface 88a of the mating hole 88. When the mounting plate 72 is separated from the I / F connector 71, the distance between the inner surfaces 88a of the two mating holes 88 is slightly longer than the distance between the mating protrusion 93 protruding from the side 91c and the mating protrusion 93 protruding from the side 91d. Therefore, the mating protrusion 93 is pressed into the mating hole 88.

[0088] Multiple mating protrusions 93 hold the mounting portion 84 between the mating protrusion 93 protruding from side 91c and the mating protrusion 93 protruding from side 91d. Thus, the mounting plate 72 is fixed to the I / F connector 71. Alternatively, the mounting plate 72 can also be mounted to the I / F connector 71 by other methods such as insert molding.

[0089] The two screws 73 each have a threaded shaft 101 and a screw head 102. The threaded shaft 101 is formed as a generally cylindrical shape extending in a generally Z direction and has a male thread on the outside. The screw head 102 is located at the end of the threaded shaft 101 in the -Z direction.

[0090] The screw head 102 is formed, for example, as a cylinder extending generally in the Z direction or a generally hemispherical shape protruding in the -Z direction. The diameter of the screw head 102 is longer than the outer diameter of the threaded shaft 101. Moreover, the diameter of the screw head 102 is longer than the diameter of the through holes 87 and 95.

[0091] The threaded shaft 101 is inserted into the threaded hole 63 of the base 21 through the through hole 95 of the plate portion 91 and the through hole 87 of the mounting portion 84. In other words, the threaded shaft 101 is connected to the housing 11 through the through holes 87 and 95.

[0092] The screw head 102 is at least partially received in the through hole 65 of the PCB 51. The diameter of the screw head 102 is shorter than the diameter of the through hole 65. Therefore, the screw head 102 is separated from the edge 65a of the through hole 65.

[0093] The screw head 102 abuts against the lower surface 91b of the plate portion 91. Thus, the screw 73, through the through holes 87 and 95 of the I / F connector 71 and mounting plate 72, mounts the I / F connector 71 and mounting plate 72 to the housing 11. Furthermore, a gap, solder, or other objects may exist between the screw head 102 and the lower surface 91b.

[0094] Mounting plate 72 is soldered to PCB 51. HDD 10 also has solders 111 and 112. Solder 111 is an example of a first solder. Solder 112 is an example of a second solder. Solders 111 and 112 are, for example, lead-free solders, but may also be other solders.

[0095] Solder 111 is attached to the metal region 51c of PCB 51 and to the lower surface 91b of board portion 91. Thus, solder 111 is located between the opposing metal region 51c and the lower surface 91b, causing the metal region 51c and the lower surface 91b to bond together.

[0096] The solder 111 has a filler 111a that spreads gently between the edge 65a of the through hole 65 and the lower surface 91b of the board portion 91. The filler 111a spreads gradually from the metal region 51c of the PCB 51 toward the lower surface 91b of the board portion 91.

[0097] On the lower surface 91b of the plate portion 91, the diameter of the filler 111a is longer than the diameter of the screw head 102. Therefore, the screw head 102 separates from the solder 111. Alternatively, the solder 111 can also adhere to the screw head 102.

[0098] Solder 112 is supplied to the interior of the through-hole 66 and adheres to the inner surface 66a of the through-hole 66 and the protrusion 92b of the reinforcing protrusion 92. Thus, solder 112 is positioned between the inner surface 66a and the protrusion 92b of the through-hole 66, causing the inner surface 66a of the through-hole 66 and the reinforcing protrusion 92 to bond together. Alternatively, solder 112 can be integral with solder 111.

[0099] As described above, PCB 51 is mounted to housing 11 by screws 55. Additionally, I / F connector 71, together with mounting plate 72, is mounted to housing 11 by screws 73.

[0100] The pins 83 of the I / F connector 71 are soldered to the electrodes of the PCB 51. On the other hand, the mounting plate 72, which is mounted on the I / F connector 71, is bonded to the PCB 51 by solder 111, 112. Thus, the solder-based connection between the pins 83 of the I / F connector 71 and the electrodes of the PCB 51 is strengthened.

[0101] For example, if I / F connector 71 is connected to I / F connector 1a of external device 1, vibration may sometimes be transmitted from external device 1 to I / F connector 71. By mounting I / F connector 71 to housing 11, vibration is transmitted from I / F connector 71 to housing 11. Therefore, vibration transmitted from I / F connector 71 to PCB 51 is reduced. In addition, the distance between the location where I / F connector 71 is mounted on housing 11 and external device 1, which is the source of vibration, is shortened. As a result, the amplitude of vibration of I / F connector 71 is reduced. By suppressing the vibration of I / F connector 71 and the vibration transmitted from I / F connector 71 to PCB 51, the performance degradation of HDD 10 due to this vibration can be suppressed.

[0102] Furthermore, stress may sometimes be generated in the solder 111 and 112 due to temperature changes. This stress generally poses a risk of creep damage to the solder. However, in this embodiment, not only does solder 111 bond the metal region 51c and the plate portion 91 together, but solder 112 also bonds the reinforcing protrusion 92 and the inner surface 66a of the through hole 66 together. Therefore, the stress generated in the solder 111 and 112 is dispersed, and the stress distribution at the solder 111 and 112 becomes gentler.

[0103] In the HDD 10 of this embodiment described above, the PCB 51 has an inner surface 51a and a metal region 51c provided on the inner surface 51a. A through hole 65 is provided in the metal region 51c and a through hole 66 is provided in the inner surface 51a. The PCB 51 is mounted on the outside of the housing 11 and electrically connected to the magnetic head 15 housed in the housing 11. The I / F connector 71 is configured to have a through hole 87, be mounted on the outside of the housing 11, and be connected to the external device 1. The mounting plate 72 has a lower surface 91b facing the metal region 51c and a reinforcing protrusion 92 inserted into the through hole 66. A through hole 95 is provided on the mounting plate 72, opening on the lower surface 91b and communicating with the through holes 65 and 87. The mounting plate 72 is mounted to the I / F connector 71. Screws 73 are used to mount the I / F connector 71 and the mounting plate 72 to the housing 11 through the through holes 87 and 95. Solder 111 bonds the metal region 51c of PCB 51 to the lower surface 91b of mounting plate 72. Solder 112 bonds the metal inner surface 66a of through-hole 66 of PCB 51 to the reinforcing protrusion 92 of mounting plate 72. Thus, the mounting plate 72, mounted on I / F connector 71, is bonded to PCB 51 not only by solder 111 bonding the metal region 51c to the lower surface 91b, but also by solder 112 bonding the inner surface 66a of through-hole 66 to the reinforcing protrusion 92. Therefore, HDD 10 of this embodiment can distribute the generated stress to solder 111 and solder 112, improving the durability of the solders (solder 111 and solder 112) bonding I / F connector 71 and PCB 51. For example, HDD 10 of this embodiment can suppress creep damage in solder 111 and 112.

[0104] The through-hole 87 of the I / F connector 71, the through-hole 95 of the mounting plate 72, and the lower surface 91b are located between the housing 11 and the PCB 51. The screw 73 has a threaded shaft 101 that engages with the housing 11 through the through-holes 87 and 95, and a screw head 102 that abuts against the lower surface 91b. That is, the mounting plate 72 acts as a washer to support the screw head 102 of the screw 73. Thus, the screw 73 can stably mount the I / F connector 71 and the mounting plate 72 to the housing 11.

[0105] The screw head 102 is at least partially received in the through hole 65 and separated from the edge 65a of the through hole 65. As a result, the HDD 10 of this embodiment can shorten the length of the screw head 102 protruding outward from the HDD 10, and can suppress the increase in the thickness of the HDD 10.

[0106] Solder 111 adheres to the metal region 51c and the lower surface 91b, forming a filler 111a that spreads out on the lower surface 91b. The filler 111a strengthens the bond between the metal region 51c and the lower surface 91b. However, if the screw head 102 mounts onto the filler 111a, there is a risk that the length of the screw head 102 protruding outward from the HDD 10 will increase. On the other hand, in this embodiment, the screw head 102 is separated from the solder 111. That is, the screw head 102 does not mount onto the solder 111. Therefore, the HDD 10 of this embodiment can shorten the length of the screw head 102 protruding outward from the HDD 10, and can suppress the increase in the thickness of the HDD 10.

[0107] A mating hole 88 is provided in the I / F connector 71. Multiple through holes 66 open on the inner surface 51a. The mounting plate 72 has a plate portion 91, side surfaces 91c, 91d, 91e, 91f of the plate portion 91, and mating protrusions 93. The plate portion 91 has a lower surface 91b. The side surfaces 91c, 91d, 91e, 91f of the plate portion 91 face a direction intersecting the direction of the lower surface 91b. The mating protrusions 93 protrude from the side surfaces 91c and 91d and insert into the mating hole 88, thereby mounting the mounting plate 72 onto the I / F connector 71. Multiple reinforcing protrusions 92 are separated from each other, protruding from the side surfaces 91c and 91d and inserting into the multiple through holes 66, and are bonded to the metallic inner surface 66a of the multiple through holes 66 by solder 112. The mating protrusion 93 is located between two of the multiple reinforcing protrusions 92. In this embodiment, the HDD10 is bonded to the PCB51 by multiple mutually separated reinforcing protrusions 92, thereby making the connection between the I / F connector 71 and the PCB51 more secure. Furthermore, the mounting plate 72 is mounted to the I / F connector 71 without screws or solder, but by inserting the fitting protrusions 93 into the fitting holes 88. Therefore, the HDD10 of this embodiment can suppress the increase in thickness of the HDD10 due to screws 73 and solder. Moreover, by positioning the fitting protrusions 93 between the two reinforcing protrusions 92, stress bias at the fitting protrusions 93 and the reinforcing protrusions 92 can be suppressed.

[0108] The mounting plate 72 has sides 91c, 91d, 91e, and 91f. Side 91c extends in the +Y direction. Side 91d is located on the opposite side of side 91c. Side 91e extends between the end of side 91c in the +Y direction and the end of side 91d in the +Y direction. Side 91f extends between the end of side 91c in the -Y direction, opposite to the +Y direction, and the end of side 91d in the -Y direction. A plurality of reinforcing protrusions 92 protrude from sides 91c and 91d, but not from sides 91e and 91f. Therefore, the HDD 10 of this embodiment can suppress the bias of the plurality of reinforcing protrusions 92 and suppress the stress bias at the plurality of reinforcing protrusions 92. Moreover, it can suppress the increase in length of the mounting plate 72 in the Y direction.

[0109] The mating protrusion 93 protrudes from the side 91c and is located between two of the plurality of reinforcing protrusions 92 that protrude from the side 91c. Thus, the HDD 10 of this embodiment can suppress the increase in the length of the mounting plate 72 in the Y direction.

[0110] The I / F connector 71 has a terminal 82 configured to extend in the +Y direction and connect to the external device 1. Therefore, when the I / F connector 71 is attached to or detached from the external device 1, a force in the +Y or -Y direction is applied to the I / F connector 71. On the other hand, in a cross-section orthogonal to the direction of extension of the through-hole 66, a mating protrusion 93 and a plurality of reinforcing protrusions 92 extend in the +Y direction. Thus, the mating protrusion 93 and the reinforcing protrusions 92 can suppress deformation of the I / F connector 71 during attachment or detachment from the external device 1.

[0111] In the above description, suppression is defined, for example, as preventing the occurrence of a situation, action, or effect, or reducing the degree of a situation, action, or effect.

[0112] Several embodiments of the present invention have been described, but these embodiments are provided as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. The embodiments and their variations are included within the scope and spirit of the invention, and similarly, within the scope of the invention equivalents described in the claims.

Claims

1. An electronic device having: A housing that contains the components; A substrate having a first surface and a metal region disposed on the first surface, having a first hole opening in the region and a second hole opening on the first surface, being mounted on the outside of the housing and electrically connected to the component; A connector, wherein the connector is configured to have a third hole, be mounted on the substrate outside the housing, and be connected to an external device; A metal component having a second surface facing the region and a joint portion inserted into the second hole, and having a fourth hole that opens on the second surface and communicates with the first hole and the third hole, and is mounted on the connector; A screw, passing through the third and fourth holes, secures the connector and the metal component to the housing. A first solder, wherein the first solder bonds the region and the second surface together; as well as The second solder, which bonds the metal inner surface of the second hole to the joint portion.

2. The electronic device as claimed in claim 1, The third hole, the fourth hole, and the second surface are located between the housing and the substrate; The screw has a threaded shaft that passes through the third hole and the fourth hole and engages with the housing, and a screw head that abuts against the second surface.

3. The electronic device as described in claim 2, The screw head is at least partially received in the first hole and separated from the edge of the first hole.

4. The electronic device as described in claim 2 or 3, The screw head separates from the first solder.

5. The electronic device as described in any one of claims 1 to 3, The connector is provided with a fifth hole; The second hole has a plurality of connecting holes that open onto the first surface; The metal component has: a wall having the second surface, an edge of the wall facing a direction intersecting the direction in which the second surface faces, and a first protrusion protruding from the edge and inserted into the fifth hole, thereby mounting the metal component to the connector; The joint has a plurality of second protrusions that are separated from each other, protrude from the edge, are inserted into the plurality of joint holes, and are bonded to the inner metal surface of the plurality of joint holes by the second solder; The first protrusion is located between two of the plurality of second protrusions.

6. The electronic device as claimed in claim 5, The edge has a first edge extending in a first direction, a second edge located on the opposite side of the first edge, a third edge extending between the end of the first edge in the first direction and the end of the second edge in the first direction, and a fourth edge extending between the end of the second edge in the second direction and the end of the second edge in the second direction. The plurality of second protrusions protrude from the first edge and the second edge, but not from the third edge and the fourth edge.

7. The electronic device as claimed in claim 6, The first protrusion protrudes from the first edge and is located between two of the plurality of second protrusions that protrude from the first edge.

8. The electronic device as claimed in claim 6, The connector has terminals configured to extend in the first direction and connect to the external device; In a cross section orthogonal to the direction in which the second hole extends, the first protrusion and the plurality of second protrusions extend in the first direction, respectively.

9. The electronic device as claimed in any one of claims 1 to 3, It also has a storage medium housed in the housing and capable of storing information.

10. The electronic device as claimed in claim 9, The storage medium includes a disk; The component has a read / write head capable of reading and writing information to the disk.

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