Imaging device and electronic equipment

Abstract

An imaging device and electronic equipment are disclosed. An imaging device includes: an imaging device in which a plurality of photoelectric conversion elements are arranged in an array; a wiring assembly in which the imaging device is mounted and provided with a power supply wiring; a connection wiring connecting the power supply wiring and the imaging device to each other; at least two power supplies connected to the power supply wiring; and at least one power supply connected to the power supply wiring, the power supplies supplying power to the imaging device via the power supply wiring and the connection wiring, the two power supplies having lower impedance than the one power supply at a horizontal synchronization frequency of the imaging device, and at least one of the connection wirings being connected to a wiring path of the power supply wiring connecting the two power supplies.

Description

Technical Field

[0001] This invention relates to imaging devices and electronic equipment. Background Technology

[0002] Image capture devices such as digital camcorders and digital still cameras include imaging devices with image sensors. In recent years, the ISO (International Organization for Standardization) sensitivity of image sensors has improved. As a result, even when shooting in low-light conditions, such as night scenes, clearer images can be produced. Furthermore, higher continuous imaging speeds allow for imaging of fast-moving subjects.

[0003] However, with the increase in ISO sensitivity in image sensors, the sensitivity to weak magnetic field noise around the image sensor, which was not a problem in the past, also increases. As a result, the image sensor is affected by magnetic field noise, and the problem of image interference becomes apparent. In addition, the current consumption increases due to high-speed operation. Therefore, magnetic fields radiate from the power wiring pattern of the imaging device, and there is a problem of noise being generated in a portion of the captured image due to the influence of the magnetic field.

[0004] Japanese Patent Application Publication No. 2017-103517 discloses a technique for reducing the influence of at least one of the magnetic and electric fields generated by the current supplied from the power source to the electronic component on the electronic unit or its exterior.

[0005] The technology in Japanese Patent Application Publication No. 2017-103517 does not adequately consider reducing image noise.

[0006] The object of this invention is to provide an advantageous technique for reducing image noise in imaging devices and electronic equipment. Summary of the Invention

[0007] According to one aspect of the present invention, an imaging apparatus is provided, comprising: an imaging device in which a plurality of photoelectric conversion elements are arranged in an array; a wiring assembly in which the imaging device is mounted and a power supply wiring is provided; a plurality of connecting wirings connecting the power supply wiring to the imaging device; at least two power supply sources connected to the power supply wiring; and at least one power supply source connected to the power supply wiring, wherein the two power supply sources and the at least one power supply source supply power to the imaging device via the power supply wiring and the plurality of connecting wirings, wherein, at the horizontal synchronization frequency of the imaging device, the two power supply sources have a lower impedance than the at least one power supply source, and wherein at least one of the plurality of connecting wirings is connected to a wiring path in the power supply wiring that connects the two power supply sources.

[0008] Other features of the invention will become clear from the following description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0009] Figure 1 This is an explanatory diagram illustrating an image capture device as an example of an electronic device according to a first embodiment.

[0010] Figure 2 This is an explanatory diagram illustrating an imaging apparatus according to a first embodiment.

[0011] Figure 3 This is an explanatory diagram illustrating the circuit blocks of the imaging apparatus according to the first embodiment.

[0012] Figure 4A This is an explanatory diagram illustrating the arrangement of the first power supply source according to the first embodiment.

[0013] Figure 4B This is an explanatory diagram illustrating the arrangement of the first power supply source according to the first embodiment.

[0014] Figure 4C This is an explanatory diagram illustrating the arrangement of the first power supply source according to the first embodiment.

[0015] Figure 5A This is an explanatory diagram illustrating the arrangement of the first power supply source according to the comparative example.

[0016] Figure 5B This is an explanatory diagram illustrating the arrangement of the first power supply source according to the comparative example.

[0017] Figure 5C This is an explanatory diagram illustrating the arrangement of the first power supply source according to the comparative example.

[0018] Figure 6 This is an explanatory diagram comparing the amount of current flowing through the power supply wiring in the first embodiment and the comparative example.

[0019] Figure 7A This is an explanatory diagram illustrating the arrangement of the first power supply source according to the second embodiment.

[0020] Figure 7B This is an explanatory diagram illustrating the arrangement of the first power supply source according to the second embodiment.

[0021] Figure 8A This is an explanatory diagram illustrating the arrangement of the first power supply source according to the third embodiment.

[0022] Figure 8B This is an explanatory diagram illustrating the arrangement of the first power supply source according to the third embodiment.

[0023] Figure 9A This is an explanatory diagram illustrating the arrangement of the first power supply source according to the fourth embodiment.

[0024] Figure 9B This is an explanatory diagram illustrating the arrangement of the first power supply source according to the fourth embodiment.

[0025] Figure 10 This is an explanatory diagram illustrating the resistance ratio and current magnitude of the first power supply source according to the fourth embodiment.

[0026] Figure 11A This is an explanatory diagram illustrating the arrangement of the first power supply source according to the fifth embodiment.

[0027] Figure 11B This is an explanatory diagram illustrating the arrangement of the first power supply source according to the fifth embodiment.

[0028] Figure 12A This is an explanatory diagram illustrating the arrangement of the first power supply source according to the sixth embodiment.

[0029] Figure 12B This is an explanatory diagram illustrating the arrangement of the first power supply source according to the sixth embodiment. Detailed Implementation

[0030] Embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0031] First Embodiment

[0032] Figure 1 This is an explanatory diagram illustrating an electronic device 100 according to a first embodiment. The electronic device 100 is a digital camera, such as an electronic still camera or a digital portable video camera, and... Figure 1In the example, electronic device 100 is a digital single-lens camera. Electronic device 100 includes a main body 101 and an interchangeable lens 102, which is a lens device that can be attached to and detached from the main body 101. Electronic device 100 can be an information terminal with a camera, such as a smartphone or personal computer.

[0033] The main body 101 includes an image processing substrate 103 on which image processing semiconductors are mounted, and an imaging device 104 capable of imaging visible light incident from an interchangeable lens 102. The main body 101 includes an image stabilization unit 112 and a display 113.

[0034] Image processing board 103 is connected to imaging device 104 via connector 105 and flexible cable 106. Flexible cable 106 supplies power from image processing board 103 to imaging device 104 and transmits signals such as image data output from imaging device 104 to image processing board 103. Image processing board 103 serves as a processing device for processing signals such as image data output from imaging device 104. Image stabilization unit 112 is a driving device for moving imaging device 104 and moving imaging device 104 during imaging to reduce or prevent image quality degradation due to camera shake. Display 113 is a display device for displaying images based on image data processed by imaging device 104. Battery (not shown) is arranged inside main body 101, and power is supplied from battery to image processing board 103, imaging device 104, replaceable lens 102, image stabilization unit 112, and display 113.

[0035] Figure 2 This is a perspective view of the imaging device 104 according to the first embodiment. The imaging device 104 includes a printed wiring board 107, an imaging device 108 having a photoelectric conversion element, connecting wiring 109, a frame 110, and a protective glass 111.

[0036] Printed wiring board 107 is connected to imaging device 108, which has photoelectric conversion elements, via multiple connecting wires 109. Printed wiring board 107 is a wiring assembly that supplies power and control signals to imaging device 108 and transmits digital data from imaging device 108 after photoelectric conversion. The connecting wires 109 are not particularly limited, but are typically bonding wires made of gold, aluminum, etc. The connecting wires 109 may be solder bumps. Wiring assemblies such as ceramic packages can be used instead of printed wiring board 107. The number of connecting wires 109 is not particularly limited, but may be, for example, 12 or more.

[0037] Imaging device 108 is mounted on printed wiring board 107. Imaging device 108 can be mounted in a package. Imaging device 108 includes a pixel chip 108a having photodiodes, etc., which will be described later, and a circuit chip 108b having a preamplifier and comparator, which will be described later, and has a stacked structure in which the pixel chip 108a and the circuit chip are electrically connected to each other. For example, imaging device 108 is a stacked image sensor including a first semiconductor layer having a plurality of photoelectric conversion elements, a second semiconductor layer stacked above the first semiconductor layer and having integrated circuits, and a wiring layer located between the first semiconductor layer and the second semiconductor layer. Note that in this embodiment, imaging device 108 is not limited to this, and can be an imaging device in which the pixel chip 108a and the circuit chip 108b are formed on the same semiconductor.

[0038] The imaging device 108 is sealed by a frame 110 molded from resin or the like and bonded to the printed wiring board 107 by adhesives or the like, and a protective glass 111 bonded to the frame 110 on the side opposite to the printed wiring board 107 by adhesives or the like.

[0039] Imaging device 108 is, for example, a CMOS (Complementary Metal-Oxide-Semiconductor) image sensor or a CCD (Charge-Coupled Device) image sensor. The area of ​​the imaging region of imaging device 108 is not particularly limited, but is, for example, 200 mm². 2 Or larger (one-third or larger of the miniature size), 300mm 2 Or larger (APS-C or larger) and 800mm 2 Or larger (full size or larger).

[0040] Figure 3 This is a circuit block diagram illustrating the configuration of an imaging device 108 according to a first embodiment. The imaging device 108 has a structure in which a plurality of pixels 300 are arranged in a grid shape. Note that the plurality of pixels 300 can be arranged in an array. Each pixel 300 includes a photodiode 301, exemplified as a photodetector performing photoelectric conversion, a floating diffuse (FD) capacitor element 302 for accumulating charge, and a transistor 303 for controlling charge transport. An analog power supply 304 and an analog ground 305 are connected to each pixel 300 from a printed wiring board 107 via connection wiring 109. These connection wirings 109 serve as paths for current supply and return related to imaging operations.

[0041] Imaging device 108 includes multiple drivers 306, row selection lines 307, readout lines 308, multiple readout circuits 309, and digital circuitry 310. The multiple drivers 306 select pixels 300 via row selection lines 307 for extracting photoelectrically converted charge. Each of the multiple readout circuits 309 includes a preamplifier that amplifies the signal photoelectrically converted by the pixels 300 and read out via readout lines 308, and a comparator that converts the signal into a digital signal. Digital circuitry 310 digitally processes the read signal and transmits the image signal from digital signal output 311 to image processing substrate 103. Note that differential signaling is typically used to transmit the image signal. Digital power supply 312 and digital ground 313 are connected to digital circuitry 310 from printed circuit board 107 via connection wiring 109. These connection wirings 109 serve as paths for current supply and return related to digital signal processing.

[0042] Figures 4A to 4C This is a schematic diagram illustrating a power supply source that supplies power to the power wiring 400 in the imaging apparatus 104 and the imaging device 108 according to the first embodiment. Figure 4A The perspective view is shown. Figure 4B The top view is illustrated, and Figure 4C The diagram illustrates along Figure 4A A cross-sectional view of line a-a' in the diagram.

[0043] like Figures 4A to 4C As illustrated in the diagram, the imaging device 104 includes a power supply wiring 400, a ground wiring 401, first power sources 402a and 402b, a second power source 403, and multiple connecting wirings 109a to 109x serving as connecting wirings 109. Note that in... Figure 4B And will be described later Figure 5B , Figure 7A , Figure 8A , Figure 9A , Figure 11A and Figure 12A In this context, for clarity, the positional relationships between components in a direction perpendicular to the surface of the printed wiring board 107 are appropriately ignored. It should also be noted that... Figure 4C And will be described later Figure 5C In this process, for clarity, the position of the component in the direction parallel to the surface of the printed wiring board 107 is appropriately changed.

[0044] Power wiring 400 is formed from a conductor such as copper on a printed wiring board 107. Power wiring 400 is formed, for example, at the outer peripheral edge of the printed wiring board 107. Specifically, power wiring 400 is formed in a non-closed-loop shape having a shape along each of the four sides of the quadrilateral imaging device 108. Multiple connection wirings 109a to 109x connect the power wiring 400 to the imaging device 108.

[0045] Power cabling 400 serves as a path for supplying power to imaging device 108 via multiple connection cablings 109a to 109x. The multiple connection cablings 109a to 109x connecting power cabling 400 and imaging device 108 are arranged at predetermined intervals along power cabling 400, which has, for example, a non-closed-loop shape. Note that power cabling 400 may consist of only one layer of printed wiring board 107, or it may... Figure 4C The diagram shows a structure consisting of multiple layers connected by through-holes.

[0046] From the viewpoint of reducing the impact of the imaging device 108 on imaging, it is preferable that the power supply wiring 400 is formed so as not to overlap with 90% or more of the imaging area of ​​the imaging device 108.

[0047] Ground wiring 401 is formed of a conductor such as copper on printed wiring board 107. Ground wiring 401 serves as a return path for the current supplied from power wiring 400 to imaging device 108, and is connected to imaging device 108 via multiple connection wirings 109a to 109x in the same manner as power wiring 400.

[0048] Multiple first power sources 402a and 402b supply power to the imaging device 108 via power wiring 400 and multiple connection wirings 109a to 109x. The first power sources 402a and 402b include, for example, a power IC (integrated circuit) mounted on a printed wiring board 107, a power IC mounted on an image processing substrate 103 via connector 105, capacitors, etc. The capacitors serving as the first power sources 402a and 402b are, for example, capacitors having the same standard capacitance value. Note that the capacitance value is expressed as a standard number ± permissible deviation, and the standard capacitance value is that standard number. The capacitance values ​​of the capacitors serving as the first power sources 402a and 402b only need to be the same in terms of the standard number, and can be different within the permissible deviation. If the standard capacitance values ​​of two capacitors are the same, it can be said that the capacitance values ​​of the two capacitors are substantially the same. The power IC is, for example, a linear regulator or a switching regulator, such as an LDO (low dropout) regulator or a DC / DC converter. The first power supply sources 402a and 402b can be, for example, a combination of an integrated circuit and a capacitor, where one can be an integrated circuit and the other can be a capacitor. One of the first power supply sources 402a and 402b can be a voltage regulator. Note that the number of first power supply sources is not limited to two; for example, for twelve or more connection wires 109, there can be six or more.

[0049] A second power supply source 403 is similarly arranged on at least one of the printed wiring board 107 and the image processing substrate 103 to supply power to the imaging device 108 via power wiring 400 and multiple connection wirings 109a to 109x. The second power supply source 403 is, for example, a ceramic capacitor with relatively small capacitance.

[0050] It should be noted that, although Figure 4B The illustration shows two first power sources 402a and 402b and six second power sources 403 mounted on a printed wiring board 107, but the invention is not limited thereto. At least two first power sources and at least one second power source may be mounted on the printed wiring board 107.

[0051] The difference between the first power supply sources 402a and 402b and the second power supply source 403 is their impedance. The frequency of the current flowing through the power supply wiring 400 is substantially synchronized with the operating frequency of the imaging device 108, and is typically the horizontal sync frequency (approximately 20 kHz to 200 kHz). The frequency of the current flowing through the power supply wiring 400 varies depending on the imaging mode. The current component in this frequency band contributes to image noise. Multiple second power supply sources 403 are disposed on the printed wiring board 107 to supply power to the imaging device 108, typically on the order of MHz or larger, and are arranged near the imaging device 108, i.e., near the connection wiring 109. Since the impedance of the second power supply sources 403 is higher than that of the first power supply sources 402a and 402b in the band of the horizontal sync frequency discussed herein, the second power supply sources 403 cannot be a substantial power supply source in this band. On the other hand, the first power supply sources 402a and 402b are selected to have a lower impedance than the second power supply sources 403 in the horizontal sync frequency band. Therefore, in the horizontal synchronization frequency band, only a plurality of the first power supply sources 402a and 402b can supply power to the imaging device 108. Specifically, the first power supply sources 402a and 402b can have an impedance of less than 10 [Ω] at the aforementioned horizontal synchronization frequency. Note that the impedance of the first power supply sources 402a and 402b at the horizontal synchronization frequency can be less than 5 [Ω] or less than 1 [Ω], or more than 1 [mΩ] or more than 5 [mΩ]. It is also noted that the impedance of each of the plurality of first power supply sources 402a and 402b is preferably 5 times or less.

[0052] Each of the first power supply sources 402a and 402b and the second power supply source 403 is composed not only of resistive components but also of at least one of capacitive and inductive components. Therefore, the impedances of the first power supply sources 402a and 402b and the second power supply source 403 are frequency-dependent.

[0053] The mechanism for generating image noise will now be described. When the imaging device 108 begins imaging operation, a current with a period corresponding to the horizontal synchronization frequency flows through each of the connecting wires 109a to 109x to supply power to the imaging device 108. At this time, the sum of the currents flowing through the connecting wires 109a to 109x flows through the power supply wire 400. When the current flows through the power supply wire 400, a radiated magnetic field according to the right-hand screw law is generated around the power supply wire 400, and when this radiated magnetic field passes through the closed circuit formed by the wires in the imaging device 108 (such as the readout line 308, the row selection line 307, etc.), an induced electromotive force is generated. This induced electromotive force is superimposed on the desired signal voltage that has been photoelectrically converted, and the readout circuit 309 detects this signal to generate image noise. The image noise generated at this time increases with the increase of the generated magnetic field strength. Therefore, in Figures 4A to 4C It is known that image noise increases locally near power supply wiring 400.

[0054] Next, a comparison will be made with the first embodiment illustrated in the figure. Figures 4A to 4C Compared with the illustrated comparative example Figures 5A to 5C The image noise reduction effect in the first embodiment is described based on the mechanism described above for generating image noise. In the first embodiment, there are twenty-four connecting wires 109a to 109x and two first power supply sources 402a and 402b.

[0055] First, the comparative examples illustrated in the diagram will be explained. Figures 5A to 5C Note that, with Figures 4A to 4C Components identical to those in the figures are indicated by the same reference numerals. Furthermore, for the sake of simplicity, it is assumed that the amount of current supplied to the imaging device 108 from each of the multiple connecting wires 109a to 109x is equal to Io [A]. Additionally, it is assumed that the impedances of the first power supply sources 402a and 402b are equal at the horizontal synchronization frequency.

[0056] exist Figures 5A to 5CIn this configuration, first power supply sources 402a and 402b are installed at substantially the same location at the ends of power supply wiring 400. In this case, all current supplied to connecting wirings 109a to 109x flows to the first power supply sources 402a and 402b. For example, the current Io [A] to be supplied to connecting wiring 109x flows in the power supply wiring 400 between connecting wiring 109w and connecting wiring 109x. Next, 2Io [A], the sum of the currents supplied to connecting wirings 109w and connecting wiring 109x, flows between connecting wiring 109v and connecting wiring 109w. When this is repeated, a current of 24Io [A] corresponding to the 24 lines from connecting wiring 109a to connecting wiring 109x flows in the power supply wiring 400 between the first power supply sources 402a and 402b and connecting wiring 109a. Therefore, a magnetic field corresponding to this current quantity is generated, and image noise corresponding to the magnetic field strength is generated.

[0057] Next, the first embodiment will be described. Figures 4A to 4C The first embodiment Figures 4A to 4C Compared with the comparative example Figures 5A to 5C The difference lies in, Figures 4A to 4C In this embodiment, a connecting wire 109a is arranged between the first power supply source 402a and the first power supply source 402b. That is, in this embodiment, a connecting wire 109a is connected to the wiring path in the power supply wiring 400 that connects the first power supply source 402a and the first power supply source 402b. Therefore, by dispersing the current flowing through the power supply wiring 400, the magnetic field generated by the load current can be reduced. Note that at least one connecting wire 109a can be connected to the wiring path in the power supply wiring 400 that connects the first power supply source 402a and the first power supply source 402b. In the following description, when Z is arranged between X and Y, this means that Z is arranged in the path from X to Y (or from Y to X), and in this case, the path is not limited to a linear path connecting X and Y, but can be a wiring path (electrical path) connecting X and Y.

[0058] exist Figures 4A to 4C Since the first power supply sources 402a and 402b have the same impedance, the current supplied to each of the connecting wires 109a to 109x is each supplied from 0.5 Io [A]. The sum of these currents flows through the power supply wire 400, and this current is determined by the superposition principle in the circuit as follows.

[0059] In the power supply wiring 400 between the first power supply source 402a and the connecting wiring 109a, a current of 24 × 0.5 Io [A] = 12 Io [A] flows.

[0060] Next, consider the current flowing between the first power supply source 402b and the connecting wiring 109a. Between them, a current of 23 × 0.5Io[A] = 11.5Io[A] flows from the first power supply source 402a to the connecting wirings 109b to 109x. On the other hand, a current of 1 × 0.5Io = 0.5Io[A] flows between them, opposite to the 11.5Io[A] supplied from the first power supply source 402a, from the first power supply source 402b to the connecting wiring 109a. Therefore, the current flowing between the first power supply source 402b and the connecting wiring 109a becomes (11.5 - 0.5)Io[A] = 11Io[A].

[0061] Next, in the same manner as before, consider the current flowing between the first power supply source 402b and the connecting wiring 109b. Between them, a current of 23 × 0.5Io[A] = 11.5Io[A] flows from the first power supply source 402a to the connecting wirings 109b to 109x. On the other hand, a current of 23 × 0.5Io = 11.5Io[A] flows from the first power supply source 402b to the connecting wirings 109a to 109x. Since these currents are in the same direction, the current flowing between the first power supply source 402b and the connecting wiring 109b is (11.5 + 11.5)Io[A] = 23Io[A].

[0062] Subsequently, the current flowing between each of the connecting wires is calculated in the same manner as the current flowing between the first power supply source 402b and the connecting wire 109b.

[0063] Figure 6 It is for reference. Figures 4A to 4C The first embodiment and Figures 5A to 5C The comparative examples describe a graph showing the magnitude of the current flowing through various parts of the power supply wiring 400. This is achieved by extracting only... Figures 4A to 4C and Figures 5A to 5C The subscripts of the connecting wirings 109a to 109x are used to illustrate the letters on the horizontal axis. The value on the vertical axis is obtained by dividing the current value by Io. It can be seen from this that the current flowing at a maximum value of 24Io[A] in the comparative example is reduced to 23Io[A] in the first embodiment. Therefore, the amount of image noise generated by the magnetic field caused by the current can be reduced.

[0064] Therefore, according to this embodiment, in the imaging device 104, image noise caused by the radiated magnetic field generated from the pattern of the power supply wiring 400 can be reduced.

[0065] Second Embodiment

[0066] Figure 7AThis is a top view illustrating a power supply source that supplies power to the power wiring 400 of the imaging apparatus and the imaging device 108 according to the second embodiment. Figure 7A The illustration shows a first power supply source 402a disposed between connecting wires 109f and 109g, and a first power supply source 402b disposed between connecting wires 109r and 109s. In this case, the same discussion as in the first embodiment will be conducted.

[0067] Consider the power wiring 400 between the first power supply source 402a and the connecting wiring 109f. The current supplied from the first power supply source 402a is 6 × 0.5Io = 3Io [A], which is half the current in the six lines from connecting wiring 109a to connecting wiring 109f. Next, the current supplied from the first power supply source 402b similarly becomes 6 × 0.5Io = 3 [A], which is half the current in the six lines from connecting wiring 109a to connecting wiring 109f. As a result, the sum of these currents, 6Io [A], flows through the power wiring 400 between the first power supply source 402a and the connecting wiring 109f.

[0068] Through the same discussion, the current 6Io[A] flows through the power supply wiring 400 between the first power supply source 402b and the connecting wiring 109s.

[0069] Next, consider the power wiring 400 between the first power supply source 402a and the connecting wiring 109g. First, between them, 9Io[A] flows through the first power supply source 402a as half the current of the eighteen lines from connecting wiring 109g to connecting wiring 109x. Next, between them, 3Io[A] flows through the first power supply source 402b as half the current of the six lines from connecting wiring 109a to connecting wiring 109f. Since these currents have opposite directions, a current of (9-3)Io = 6Io[A] flows in the power wiring 400 between the first power supply source 402a and the connecting wiring 109g. Similarly, a current of 6Io[A] also flows in the power wiring 400 between the first power supply source 402b and the connecting wiring 109r.

[0070] Figure 7B It is for reference. Figure 7A The second embodiment and Figures 5A to 5C The comparative examples in the diagram illustrate the magnitude of the current flowing through various parts of the power supply wiring 400. Figure 7B The letters on the horizontal axis and the values ​​on the vertical axis are related to Figure 6The letters and values ​​are the same. It can be seen from this that in the second embodiment, the current flowing through the power supply wiring 400 is at most 6 Io [A], while in the comparative example, the current flowing through the power supply wiring 400 is at most 24 Io [A]. This indicates that the current reduction effect is significantly higher in the second embodiment. In this case, it is desirable to provide half of the total number of connection wirings between the first power supply source 402a and the first power supply source 402b.

[0071] Third Embodiment

[0072] Figure 8A This is a top view illustrating a power supply source that supplies power to the power wiring 400 of the imaging apparatus and the imaging device 108 according to a third embodiment. Figure 8A The diagram illustrates three primary sources of electricity supply. Figure 8A In this embodiment, a first power supply source 402a is arranged between connecting wires 109d and 109e, a first power supply source 402b is arranged between connecting wires 109l and 109m, and a first power supply source 402c is arranged between connecting wires 109t and 109u. Note that in this embodiment, it is assumed that the impedances of the first power supply sources 402a, 402b, and 402c are equal. Therefore, each of the first power supply sources 402a supplies one-third of the current Io flowing through each of the connecting wires 109.

[0073] First, consider the power supply wiring 400 between the first power supply source 402a and the connecting wiring 109d. The current supplied from the first power supply source 402a between them becomes a current 4 × 1 / 3 Io = 4 / 3 Io [A], which is 1 / 3 of the current in the four wires from connecting wiring 109a to connecting wiring 109d. Similarly, the current supplied from each of the first power supply sources 402b and 402c is also equal to 4 / 3 Io [A]. As a result, the current (4 / 3 + 4 / 3 + 4 / 3)Io = 4Io [A], which is the sum of these currents, flows through the power supply wiring 400 between the first power supply source 402a and the connecting wiring 109d.

[0074] Next, consider the power wiring 400 between the first power supply source 402a and the connecting wiring 109e. First, the current supplied from the first power supply source 402a between them is 20 / 3 Io [A], which is 1 / 3 of the current from the 20 lines of connecting wiring 109e to connecting wiring 109x. The current supplied from the first power supply source 402b between them is 4 / 3 Io [A] in the opposite direction to the current supplied from the first power supply source 402a, which is 1 / 3 of the current from the four lines of connecting wiring 109a to connecting wiring 109d. Furthermore, the current supplied from the first power supply source 402c is also 4 / 3 Io [A] in the opposite direction to the current supplied from the first power supply source 402a, which is 1 / 3 of the current from the four lines of connecting wiring 109a to connecting wiring 109d. Therefore, the current of (20 / 3-4 / 3-4 / 3)Io=4Io[A] flows through the power supply wiring 400 between the first power supply source 402a and the connecting wiring 109e.

[0075] exist Figure 8B The diagram illustrates the current distribution obtained by repeating the same discussion. Figure 8B It is for reference. Figure 8A The third embodiment and Figures 5A to 5C The comparative examples in the diagram illustrate the magnitude of the current flowing through various parts of the power supply wiring 400. Figure 8B The letters on the horizontal axis and the values ​​on the vertical axis are related to Figure 6 The letters and values ​​are the same. It can be seen that in the third embodiment, the current flowing through the power supply wiring 400 is at most 4 Io [A], while in the comparative example, the current flowing through the power supply wiring 400 is at most 24 Io [A]. This indicates that the current reduction effect is significantly higher in the third embodiment. In this case, when there are twenty-four connection wirings 109 and three first power supply sources 402, it is desirable to have 24 / 3 = 8 connection wirings between each of the first power supply sources 402.

[0076] Here, consider the case where the number of connecting wires 109 is M and the number of first power sources 402 is N, and the natural number obtained by rounding the value of M / (2N) to the nearest decimal place is represented as X. Note that each of M and N is a natural number of 2 or greater. Assuming that the ends of the power supply wires 400 can be defined, X or (X+1) connecting wires 109 can be arranged between each arbitrary end and the nearest first power source 402. Furthermore, it is desirable to arrange 2×X or (2×X+1) connecting wires 109 between each first power source 402. For example, there is a case of forty connecting wires 109 and six first power sources 402. In this case, the natural number X obtained by rounding 40 / (2×6) to the nearest decimal place is 3. Therefore, the first power sources 402 are arranged at positions separated from one end of the power supply wires 400 by three or four connecting wires 109. Additionally, another first power supply 402 is similarly positioned at a location separated from the other end by three or four connecting wires 109. The remaining four first power supplies 402 are positioned at locations where six or seven connecting wires 109 separate them from each other. This arrangement allows for efficient current distribution.

[0077] Fourth embodiment

[0078] Figure 9A This is a top view illustrating a power supply source supplying power to the power wiring 400 of the imaging apparatus and the imaging device 108 according to a fourth embodiment. In the fourth embodiment, a case is described where the first power supply source 1002a and the first power supply source 1002b have different impedances. In the following description, the case where the impedance of the first power supply source 1002b is twice that of the first power supply source 1002a is used as an example. In this case, since their impedance ratio is 1:2, the first power supply source 1002a supplies 2 / 3 Io[A] of the current Io[A] supplied to each connection wiring 109, and the first power supply source 1002b supplies 1 / 3 Io[A] of the current Io[A] supplied to each connection wiring 109.

[0079] Under this assumption, the current Io[A] supplied from the first power supply source 1002a and the first power supply source 1002b flows through the power supply wiring 400 between the connecting wiring 109a and the connecting wiring 109b. Next, 2Io[A], which is the sum of the currents supplied to the connecting wiring 109a and the connecting wiring 109b, flows through the power supply wiring 400 between the connecting wiring 109b and the connecting wiring 109c. In the same manner, 8Io[A], which is the sum of the currents from the connecting wiring 109a to the connecting wiring 109h, flows through the power supply wiring 400 between the first power supply source 1002a and the connecting wiring 109h. In addition, in the same manner, 8Io[A], which is the sum of the currents from the connecting wiring 109x to the connecting wiring 109q, flows through the power supply wiring 400 between the first power supply source 1002b and the connecting wiring 109q.

[0080] Next, consider the current flowing through the power supply wiring 400 between the first power supply source 1002a and the connecting wiring 109i. In this case, for the current of the sixteen lines from connecting wiring 109i to connecting wiring 109x, the first power supply source 1002a supplies 2 / 3 Io[A] as the impedance ratio. That is, the amount of current supplied from the first power supply source 1002a to the left of point A is 16 × 2 / 3 Io[A]. On the other hand, considering the eight lines from connecting wiring 109a to connecting wiring 109h, the current carried by the first power supply source 1002b is 8 × 1 / 3 Io[A] as the impedance ratio. It should be noted at this point that the directions of the various currents are opposite to those of the current supplied by the first power supply source 1002a and the current supplied by the first power supply source 1002b. Therefore, (16 × 2 / 3 - 8 × 1 / 3) Io[A] = 8 Io[A], which is the difference in current obtained so far, flows to the left of point A.

[0081] exist Figure 9B The diagram shows the results of performing the same calculation for each point. Figure 9B It is for reference. Figure 9A The fourth embodiment and Figures 5A to 5C The comparative examples in the diagram illustrate the magnitude of the current flowing through various parts of the power supply wiring 400. Figure 9B The letters on the horizontal axis and the values ​​on the vertical axis are related to Figure 6 The letters and values ​​are the same. It can be seen from this that the current flowing in the power wiring 400 is reduced from 24 Io [A] in the comparative example to at most 8 Io [A] in the fourth embodiment, which shows that the current flowing in the power wiring 400 can be reduced.

[0082] Figure 10This is a graph showing the current flowing through the power supply wiring 400 at each impedance ratio when the impedance ratio between the first power supply source 1002a and the first power supply source 1002b changes. It can be seen that when the impedance ratio is as high as approximately five times, a current dispersion effect can be achieved.

[0083] Fifth Embodiment

[0084] Figure 11A This is a top view illustrating a power supply source that supplies power to the power wiring 400 of the imaging apparatus and the imaging device 108 according to a fifth embodiment. Figure 11A In this embodiment, the first power supply source 402a is arranged between connecting wire 109a and connecting wire 109b, and the first power supply source 402b is arranged between connecting wire 109w and connecting wire 109x. Furthermore, in this case, the same discussion as in the previous embodiment will be conducted.

[0085] First, consider the power wiring 400 between the first power supply source 402a and the connecting wiring 109a. The current supplied from the first power supply sources 402a and 402b is the current Io[A] supplied to the connecting wiring 109a. Similarly, by the same discussion, the current Io[A] flows through the power wiring 400 between the first power supply source 402b and the connecting wiring 109a.

[0086] Next, consider the power wiring 400 between the first power supply source 402a and the connecting wiring 109b. First, 11.5Io[A], representing half the current of the twenty-three lines from the connecting wiring 109b to the connecting wiring 109x, flows through the first power supply source 402a. Next, 0.5Io[A], representing half the current of one line of the connecting wiring 109a, flows through the first power supply source 402b. Since these currents are in opposite directions, the current (11.5-0.5)Io = 11Io[A] flows through the power wiring 400 between the first power supply source 402a and the connecting wiring 109b. Similarly, the current 11Io[A] flows through the power wiring 400 between the first power supply source 402b and the connecting wiring 109w.

[0087] When the same calculations are performed across each of the connection wirings 109, the magnitude of the current flowing through the power wiring 400 in each of the fifth embodiment and the comparative example becomes as follows: Figure 11B The diagram is shown in the image. Figure 11B It is for reference. Figure 11A The fifth embodiment and Figures 5A to 5C The comparative examples in the diagram illustrate the magnitude of the current flowing through various parts of the power supply wiring 400. Figure 11B The letters on the horizontal axis and the values ​​on the vertical axis are related to Figure 6The letters and values ​​are the same. It can be seen from this that in the fifth embodiment, the current flowing through the power supply wiring 400 is at most 11 Io [A], while in the comparative example, the current flowing through the power supply wiring 400 is at most 24 Io [A], which shows that the effect of dispersing the current is achieved.

[0088] Sixth Embodiment

[0089] Figure 12A This is a top view illustrating a power supply source that supplies power to the power wiring 400 of the imaging apparatus and the imaging device 108 according to a sixth embodiment. Figure 12A In this embodiment, a first power supply source 402a is arranged between connecting cable 109k and connecting cable 109l, and a first power supply source 402b is arranged between connecting cable 109m and connecting cable 109n. Furthermore, in this case, the same discussion as in the previous embodiment will be conducted.

[0090] First, the current Io[A] required for connecting wiring 109a flows through the power wiring 400 between connecting wirings 109a and 109b as the current supplied from the first power supply sources 402a and 402b. By the same logic, current Io[A] also flows through the power wiring 400 between connecting wirings 109w and 109x. Between connecting wirings 109b and 109c, the currents in connecting wirings 109a and 109b are added together, and a current of 2Io[A] flows. Similarly, 2Io[A] flows between connecting wirings 109v and 109w. When this is repeated, a current of 11Io[A] flows through the power wiring 400 between the first power supply source 402a and connecting wiring 109k in eleven wires from connecting wiring 109a to connecting wiring 109k. Similarly, the current 11Io[A] from the eleven lines of the connecting wiring 109n to the connecting wiring 109x also flows through the power wiring 400 between the first power supply source 402b and the connecting wiring 109n.

[0091] Next, consider the power supply wiring 400 between the first power supply source 402a and the connecting wiring 109l. First, a current of 6.5Io[A] flows from the first power supply source 402a, which is half of the current 13Io[A] supplied from the connecting wiring 109l to the connecting wiring 109x. On the other hand, a current of 5.5Io[A] flows from the first power supply source 402b, which is half of the current supplied from the connecting wiring 109a to the eleven lines of the connecting wiring 109k. Since these currents have opposite directions, a current (6.5-5.5)Io = 1Io[A] flows through the power supply wiring 400 between the first power supply source 402a and the connecting wiring 109l. Similarly, a current 1Io[A] also flows through the power supply wiring 400 between the first power supply source 402b and the connecting wiring 109m.

[0092] When the same calculations are performed across each of the connection wirings 109, the magnitude of the current flowing through the power wiring 400 in each of the sixth embodiment and the comparative example becomes as follows: Figure 12B The diagram is shown in the image. Figure 12B It is for reference. Figure 12A The sixth embodiment and Figures 5A to 5C The comparative examples in the diagram illustrate the magnitude of the current flowing through various parts of the power supply wiring 400. Figure 12B The letters on the horizontal axis and the values ​​on the vertical axis are related to Figure 6 The letters and values ​​are the same. It can be seen from this that in the sixth embodiment, the current flowing through the power supply wiring 400 is at most 11 Io [A], while in the comparative example, the current flowing through the power supply wiring 400 is at most 24 Io [A], which shows that the effect of dispersing the current is achieved.

[0093] The embodiments described herein can be appropriately modified so as not to depart from the technical concept. For example, multiple embodiments can be combined. Additionally, one or more items of at least one embodiment can be deleted or replaced. Furthermore, one or more items can be added to at least one embodiment. The disclosure of this specification includes not only what is expressly described herein, but also all items that can be identified from this specification and the accompanying drawings. For example, any combination of each of the described items is also part of the disclosure of this specification. For example, if there is a description of "A equals or is greater than B" and a description of "C equals or is less than D", then the embodiment "A equals or is greater than B and C equals or is less than D" is a disclosure of this specification. In this specification, "A equals or is greater than B" (A is any element and B is any index) means "A equals B or A is greater than B". "C equals or is less than D" (C is any element and D is any index) means "C equals D or C is less than D (below D)". Furthermore, the disclosure in this specification includes complementarity for each of the various concepts described in this specification. That is, if this specification describes "E is F" (E and F are arbitrary matters), then this specification discloses the case where "E is not F", even if the description of the case where "E is not F" is omitted. This is because when describing "E is F", the case where "E is not F" is assumed to be considered.

[0094] According to the present invention, advantageous techniques for reducing image noise in imaging devices and electronic equipment can be provided.

[0095] While the invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the appended claims should be given the broadest interpretation to include all such modifications and equivalent structures and functions.

Claims

1. An imaging device, comprising: An imaging device in which multiple photoelectric conversion elements are arranged in an array; A wiring assembly in which an imaging device is installed and a power supply wiring is provided; Multiple connecting cables connect the power supply cables to the imaging device. At least two power supply sources are connected to the power supply cabling; as well as At least one power supply source, said at least one power supply source being connected to the power supply cabling, The two power supply sources and the one power supply source supply power to the imaging equipment via power cabling and the multiple connection cabling. The impedances of the two power supply sources and the one power supply source are frequency-dependent, and at the horizontal synchronization frequency of the imaging device, the two power supply sources have lower impedances than the one power supply source. Among them, at least one of the multiple connecting wires is connected to the wiring path in the power supply wiring that connects the two power supply sources.

2. An imaging device, comprising: An imaging device in which multiple photoelectric conversion elements are arranged in an array; A wiring assembly in which an imaging device is installed and a power supply wiring is provided; Multiple connecting cables connect the power supply cables to the imaging device. as well as At least two power supply sources are connected to the power supply cabling; The two power supply sources supply power to the imaging equipment via power cabling and the multiple connecting cables. The imaging device has a horizontal synchronization frequency ranging from 20 kHz to 200 kHz, the impedances of the two power supplies are frequency-dependent, and the two power supplies have an impedance of 5 Ω or less at frequencies from 20 kHz to 200 kHz. Among them, at least one of the multiple connecting wires is connected to the wiring path in the power supply wiring that connects the two power supply sources.

3. The imaging apparatus according to claim 1 or 2, wherein, The two power sources are capacitors with the same standard capacitance value.

4. The imaging apparatus according to claim 1 or 2, wherein, One of the two power sources is an integrated circuit, and the other of the two power sources is a capacitor.

5. The imaging apparatus according to claim 1 or 2, wherein, One of the two power supply sources is a voltage regulator.

6. The imaging apparatus according to claim 1 or 2, wherein, The horizontal synchronization frequency of the imaging equipment is 20 kHz to 200 kHz.

7. The imaging apparatus according to claim 1 or 2, wherein, The impedance ratio of the two power sources is within 5 times.

8. The imaging apparatus according to claim 1 or 2, wherein, When the number of multiple connecting wires is M and the number of multiple power sources, excluding the at least one power source but including the at least two power sources, is N, and the natural number obtained by rounding the value obtained by dividing M by 2N and discarding the decimal point is X, X or (X+1) connecting wires are provided between any end of the power wire and the power source among the N power sources that is closest to the arbitrary end of the power wire, and 2×X or (2×X+1) connecting wires are provided between each of the N power sources.

9. The imaging apparatus according to claim 1 or 2, wherein, The number of the multiple connecting wires is twelve or more, and the number of the two power supply sources connected to the power supply wires is six or more.

10. The imaging apparatus according to claim 1 or 2, wherein, The two power supply sources are installed on the wiring assembly.

11. The imaging apparatus according to claim 1 or 2, wherein, The multiple connecting wires are splicing wires.

12. The imaging apparatus according to claim 1 or 2, wherein, The two power supply sources include at least one of a capacitor assembly and an inductor assembly, and wherein the impedance of the two power supply sources is 1 [mΩ] or greater.

13. The imaging apparatus according to claim 1 or 2, wherein, A ground wire is provided in the wiring assembly, the ground wire is connected to the imaging device, and the ground wire serves as a return path for the current supplied from the power supply wire to the imaging device.

14. The imaging apparatus according to claim 1 or 2, wherein, The power supply cabling has a non-closed-loop shape along each of the four sides of the quadrilateral imaging device.

15. The imaging apparatus according to claim 1 or 2, wherein, The power supply cabling does not overlap with 90% or more of the imaging area of ​​the imaging device.

16. The imaging apparatus according to claim 1 or 2, wherein, The imaging device includes: a first semiconductor layer having the plurality of photoelectric conversion elements; a second semiconductor layer stacked above the first semiconductor layer and having an integrated circuit; and a wiring layer located between the first semiconductor layer and the second semiconductor layer.

17. The imaging apparatus according to claim 1 or 2, wherein, The imaging area of ​​the imaging device is 200 mm. 2 Or larger, 300 mm 2 Or larger, or 800 mm 2 Or larger.

18. The imaging apparatus according to claim 1 or 2, wherein, At least one of the two power supply sources has a portion that does not overlap with the imaging device.

19. The imaging apparatus according to claim 1 or 2, wherein, The imaging device has a quadrilateral shape, the quadrilateral shape including a first side and a second side, and a third side and a fourth side, both shorter than the first side and the second side. In this configuration, at least one of the two power supply sources is arranged closer to the first or second side than the third and fourth sides.

20. An electronic device, comprising: The imaging apparatus according to any one of claims 1 to 19; as well as A processing device that processes signals output from an imaging device.

21. An electronic device, comprising: The imaging apparatus according to any one of claims 1 to 19; as well as A display device that displays an image captured by an imaging device.

22. An electronic device, comprising: The imaging apparatus according to any one of claims 1 to 19; as well as A driving device that moves the imaging device.

Images