Semiconductor chip test socket

Abstract

The present invention relates to a semiconductor chip test socket, and more particularly, to a semiconductor chip test socket which is combined to a predetermined inspection circuit board and performs a test of a semiconductor chip, and in which an IC chip storing predetermined intrinsic information and an algorithm counting the number of uses of the semiconductor chip test socket is embedded. For the semiconductor test socket, the number of uses thereof can be correctly counted by the IC chip, the mounting and separation of the IC chip can be easily performed, and the IC chip can be protected from external impact or the like.

Description

Technical Field

[0001] This invention relates to a semiconductor chip test socket, and more specifically, to a semiconductor chip test socket that is integrated onto a predetermined inspection circuit board to perform semiconductor chip testing, and embeds an IC chip that stores predetermined inherent information and an algorithm for counting the number of times the semiconductor chip test socket is used. With respect to the semiconductor test socket, the number of times its use can be accurately counted by the IC chip, the installation and removal of the IC chip is easy, and the IC chip can be protected from external impacts, etc. Background Technology

[0002] After a semiconductor device has undergone the manufacturing process, an inspection is performed to determine its electrical performance.

[0003] During this inspection, semiconductor chips are used to test the sockets. A semiconductor chip conforming to the specifications of each socket is installed in the test socket, and the semiconductor chip is then tested.

[0004] Semiconductor chip test sockets have multiple connection terminals that are electrically connected to the electrical terminals of a semiconductor chip, as well as predetermined fixing means (e.g., levers) for securing the semiconductor chip. These connection terminals and fixing means are subject to wear due to friction and heat generated during testing. Therefore, semiconductor chip test sockets can only be used within a specified service life and number of uses.

[0005] However, traditional semiconductor chip test sockets lack the means to accurately display their specifications, service life, and number of uses. Therefore, accidents occur during semiconductor chip testing due to test sockets with specifications unsuitable for testing semiconductor chips being used with inspection circuit boards, or various accidents or defects occur because the test sockets are used for testing beyond their service life.

[0006] In particular, if testing of semiconductor chips continues using semiconductor chip test sockets where unidentified defects have occurred, the quality of the semiconductor chips may not be guaranteed. In this case, defects or accidents may occur in products using the semiconductor chips.

[0007] To address this, test sockets for semiconductor chips embedded with various data were developed, but they still have shortcomings.

[0008] Existing technical documents

[0009] Patent documents

[0010] Patent Application Publication No. 10-2011-0085710 Summary of the Invention

[0011] This invention is designed to solve the above-mentioned problems. The purpose of this invention is to provide a semiconductor chip test socket, which is combined with a predetermined inspection circuit board to perform semiconductor chip testing and embeds an IC chip. The IC chip stores predetermined inherent information and an algorithm for counting the number of times the semiconductor chip test socket is used. The number of times the semiconductor chip test socket is used is accurately counted by the IC chip, which simplifies the installation and removal of the IC chip and protects the IC chip from external impacts, etc.

[0012] In a semiconductor chip test socket according to an embodiment of the present invention, a semiconductor chip test socket is coupled to a predetermined inspection circuit board and performs semiconductor chip testing, and an IC chip is embedded therein, wherein the IC chip stores predetermined inherent information and an algorithm for counting the number of times the semiconductor chip test socket is used, wherein the semiconductor chip test socket includes: a socket body having a mounting portion on which the IC chip is mounted; a side body coupled to the semiconductor chip test socket and covering the mounting portion; a fixing member mounted in the mounting portion and fixing the IC chip; and a spring pin mounted in the socket body, one end of which is connected to the IC chip, and the other end of which protrudes outward from the socket body to connect the IC chip and an external inspection circuit board, wherein when the semiconductor chip test socket is coupled to the inspection circuit board, the spring pin is connected to the inspection circuit board, and the IC chip and the inspection circuit board are electrically connected, and the inherent information embedded in the IC chip and the number of times the semiconductor chip test socket is used are transmitted to the inspection circuit board.

[0013] According to one embodiment of the present invention, the mounting portion is configured as a through hole extending vertically, and the fixing member is mounted in the mounting portion from the top, supported in the mounting portion, and fixed in place.

[0014] According to one embodiment of the present invention, the fixing component includes: a bottom panel; and a side panel located on one side of the bottom panel and extending upward therefrom, wherein the bottom panel includes a through contact mounting hole, the bottom panel supports the bottom surface of the IC chip, and the side panel supports the side surface of the IC chip, and the spring pin can be accommodated in the contact mounting hole and fixed in place.

[0015] According to one embodiment of the present invention, the contact mounting hole has a support surface that supports at least a portion of the spring pin.

[0016] According to one embodiment of the present invention, the bottom panel has a downwardly protruding fixing protrusion on its underside, and when the fixing component is installed in the mounting part, the fixing protrusion is exposed on the lower part of the socket body.

[0017] According to one embodiment of the present invention, the contact mounting hole penetrates the fixing protrusion in the vertical direction. Attached Figure Description

[0018] Figures 1 to 5 The structure of a semiconductor chip test socket according to an embodiment of the present invention is shown.

[0019] Figures 6 to 8 The structure of a semiconductor chip test socket according to another embodiment of the present invention is shown.

[0020] Figure 9 The illustration shows a semiconductor chip test socket being mounted on an inspection circuit board according to an embodiment of the present invention. Detailed Implementation

[0021] In the following description, preferred embodiments of the invention will be described with reference to the accompanying drawings.

[0022] Figures 1 to 5 The structure of a semiconductor chip test socket according to an embodiment of the present invention is shown. Furthermore, Figures 6 to 8 The structure of a semiconductor chip test socket according to another embodiment of the present invention is shown.

[0023] Specifically, Figure 1 The overall shape of a semiconductor chip test socket according to an embodiment of the present invention is shown. Figures 2 to 4 An exploded view of a semiconductor chip test socket according to an embodiment of the present invention is shown. Figure 5 The shape of a semiconductor chip test socket according to an embodiment of the present invention is shown from below. Figures 6 to 8 An exploded view of a semiconductor chip test socket according to another embodiment of the present invention is shown.

[0024] According to an embodiment of the present invention, a semiconductor chip test socket (10) includes a socket body (100), side bodies (200) attached to the upper two sides of the socket body (100), a fixing component (300) capable of fixing an IC chip 20, and a spring pin (400).

[0025] The socket body (100) may be a block with a relatively long left and right length.

[0026] A mounting portion (110) is formed on the socket body (100). The mounting portion (110) is an upwardly open and downwardly recessed groove, and a semiconductor chip can be mounted on the mounting portion (110). The mounting portion (110) has a plurality of connection terminals that can be connected to the electrical terminals of the semiconductor chip. The connection terminals can be, for example, predetermined contact members (not shown).

[0027] Side portions (120) may be provided on the upper surfaces of both sides of the socket body (100), wherein the side body (200) described later may be mounted and fixed to the side portions (120). The side portions (120) may have predetermined fixing means for fixing the side body (200). Such fixing means may be, for example, a protrusion or a screw, but are not limited thereto.

[0028] A mounting portion (130) is formed on the socket body (100). The mounting portion (130) is configured as a predetermined slot in which the IC chip (20) can be mounted. The mounting portion (130) is open upward and may have a predetermined depth. Therefore, the IC chip (20) and the fixing member (300) can be inserted into the interior of the mounting portion (130).

[0029] Meanwhile, the mounting portion (130) can be configured as a through hole extending vertically. In this case, the lower part of the mounting portion (130) can have a narrower cross-sectional area than the upper part. For example, as... Figure 4 As shown, the mounting portion (130) has an upper space portion (132) and a lower space portion (134), and the upper space portion (132) may have a larger cross-sectional area than the lower space portion (134). Therefore, the intermediate portion between the upper space portion (132) and the lower space portion (134) of the mounting portion (130) may have a support surface (136). When the fixing member (300) described later is installed in the mounting portion (130), the support surface (136) may support the lower part of the fixing member (300). Therefore, when the fixing member (300) described later is installed in the mounting portion (130), a portion of the fixing member (300) may be supported on the support surface (136) of the mounting portion (130) and fixed in place.

[0030] According to one embodiment, such as Figure 2 As shown, the mounting portion (130) may be formed on a portion of the side portion (120) of the socket body (100). According to an embodiment, the mounting portion (130) may be formed on one side portion (120) of the socket body (100).

[0031] The side body (200) is a component fixed to the socket body (100).

[0032] The shape of the side body (200) is not limited. According to one embodiment, the side body (200) can be a predetermined block-shaped component. Two side bodies (200) can be disposed on a semiconductor chip test socket (10) to be fixed on the sides (120) of the socket body (100), respectively.

[0033] According to an embodiment, a guide groove (210) may be formed on a side body (200). The guide groove (210) may be a predetermined groove extending in a vertical direction. The guide groove (210) may be formed on the surfaces of two side bodies (200) facing each other. The guide groove (210) may guide a semiconductor chip, thereby mounting the semiconductor chip in a socket body (100). Furthermore, it may also secure the semiconductor chip mounted in the socket body (100) in place.

[0034] The combined shape of the side body (200) and the socket body (100) is not limited. As an example, such as Figure 2 As shown, the side body (200) may have a predetermined protruding surface (220), and a predetermined recessed surface (122) may be formed on the socket body (100). Therefore, the engagement position between the socket body (100) and the side body (200) is appropriately set, and a stable engagement can be achieved.

[0035] For example, according to another embodiment of the invention, such as Figure 6 As shown, the side body (200) may also have a cover-like shape that only covers the side (120) of the socket body (100).

[0036] When the side body (200) is attached to the socket body (100), the mounting portion (130) can be covered by the side body (200). Furthermore, the fixing component (300) and the IC chip (20) inserted into the mounting portion (130) can be covered by the side body (200).

[0037] With this structure, there is no need for a separate cover component to cover the IC chip (20), and the IC chip (20) can be fixed and protected while being inserted into the semiconductor chip test socket (10).

[0038] The fixing component (300) is a component capable of supporting the IC chip (20) and fixing it in the mounting portion (130). When the fixing component (300) is installed in the mounting portion (130), at least a portion thereof can be supported in the mounting portion (130) and fixed in place. For example, as described above, the mounting portion (130) is configured as a through hole, wherein a support surface (136) is formed at at least one position therein, so the fixing component (300) can be supported on the support surface (136) in the mounting portion (130) and fixed in place. Therefore, as Figure 4As shown, a portion of the lower part of the fixing member (300) can be supported on the support surface (136) of the mounting part (130) and fixed in place, and a portion of the lower part of the fixing member (300) can be exposed below the socket body (100). Therefore, the IC chip (20) and the fixing member (300) can be easily fixed to the socket body (100), while the IC chip (20) and the fixing member (300) can be easily separated from the socket body (100).

[0039] The fixing component (300) may include a bottom panel (310) supporting the bottom surface of the IC chip (20) and a side panel (320) supporting the sides of the IC chip (20). Therefore, according to an embodiment, the fixing component (300) may have an "L" shape when viewed from the side. However, the embodiments disclosed herein are not limited to this.

[0040] Meanwhile, although not shown, the fixing component (300) may have a predetermined fixing means for fixing the IC chip (20). Such fixing means may be, for example, a predetermined protrusion or groove into which the IC chip can be assembled.

[0041] The bottom panel (310) may include a contact mounting hole (330). The contact mounting hole (330) may be a predetermined hole extending through the bottom panel (310) in the vertical direction. The spring pin (400), described later, may be fixedly positioned in the contact mounting hole (330). The contact mounting hole (330) may have a structure capable of receiving and fixing the spring pin (400). For example, the contact mounting hole (330) may be configured as a vertically extending hole and may have a configuration capable of supporting at least a portion of the spring pin (400). For example, the contact mounting hole (330) may have an inwardly protruding support protrusion, or may have a support means such as a support surface (332) formed on the upper periphery of the contact mounting hole (330). Furthermore, the spring pin (400) may also include a support portion that protrudes relatively more laterally from the side.

[0042] According to an embodiment, the bottom panel (310) may have a predetermined fixing protrusion (312). The fixing protrusion (312) is located at the lower part of the bottom panel (310) and can protrude downward. When the fixing member (300) is installed in the mounting portion (130), the fixing protrusion (312) is fixed on at least a portion of the mounting portion (130), thereby fixing the position of the fixing member (300). For example, the fixing protrusion (312) may be located in the lower space portion (134) of the mounting portion (130).

[0043] like Figure 5As shown, when the retaining member (300) is installed in the mounting portion (130), the retaining protrusion (312) can be exposed at the lower part of the socket body (100). Therefore, the state in which the spring pin (400) is fixedly positioned on the retaining member (300) can be easily confirmed, and simple separation can be achieved when the IC chip (20) and the retaining member (300) are separated from the socket body (100). For example, when the retaining member (300) is assembled into the mounting portion (130), it may not be easy to remove the retaining member (300) from the mounting portion (130). However, in the present invention, due to the same structure as in the embodiment, when an external force is applied upward to the downwardly exposed retaining protrusion (312), the retaining member (300) can be easily detached from the mounting portion (130).

[0044] At the same time, such as Figure 7 and Figure 8 As shown, it is also possible to have an embodiment in which the bottom panel (310) does not have a separate fixing protrusion (312). In this case, the bottom panel (310) may be located in the lower space (134) of the mounting portion (130).

[0045] The spring pin (400) is a predetermined connection terminal that can connect the IC chip (20) and the inspection circuit board (not shown), and is also a component that can conduct electrical signals, but its specific configuration is not limited.

[0046] The spring pin (400) is inserted into the contact mounting hole (330) in the bottom panel (310) of the fixing component (300) and can be fixed in place in the contact mounting hole (330).

[0047] The upper end of the spring pin (400) is connected to the IC chip (20) installed in the mounting portion (130), and as... Figure 5 As shown, the lower end of the spring pin (400) can be exposed at the lower part of the socket body (100). The lower end of the spring pin (400) exposed at the lower part of the socket body (100) can be connected to a test circuit board (not shown) at the lower part of the socket body (100).

[0048] Due to the configuration described above, when the spring pin (400) is installed in the socket body (100), it is not necessary to directly insert the spring pin (400) into the socket body (100). That is, according to the embodiment, it can be assembled in the following manner: after first inserting the spring pin (400) into the contact mounting hole (330) of the fixing member (300), the fixing member (300) of the spring pin (400) is inserted into the mounting portion (130) of the socket body (100). Of course, it can also be assembled in the form of a combination in which the IC chip (20), the fixing member (300) and the spring pin (400) are all assembled together and inserted into the mounting portion (130).

[0049] Therefore, simple installation can be achieved when the IC chip (20), fixing component (300), and spring pin (400) are installed in the socket body (100), wherein the IC chip (20), fixing component (300), and spring pin (400) are components with relatively small dimensions. That is, the overall assemblability of the semiconductor chip test socket (10) can be improved. In addition, manufacturing costs and operating expenses can be reduced by preventing the loss of components constituting the semiconductor chip test socket (10).

[0050] The IC chip (20) has embedded predetermined intrinsic information and can store an algorithm for counting the number of times the semiconductor chip test socket (10) is used. Here, the intrinsic information may be, for example, a predetermined number assigned by a predetermined specification. The intrinsic information and the algorithm can be input into the IC chip (20) through a separate device.

[0051] When an IC chip (20) with embedded inherent information is installed, the predetermined inherent information is assigned to the semiconductor chip test socket (10). Furthermore, the number of times the semiconductor chip test socket (10) is used can be counted by the IC chip (20). At this time, the number of times the semiconductor chip test socket (10) is used can be counted, for example, based on the number of times the IC chip (20) is connected to the test circuit board (V) described later, and the test circuit board (V) and the IC chip (20) exchange signals with each other, but is not limited to this.

[0052] Figure 9 The diagram shows a semiconductor chip test socket (10) according to an embodiment of the present invention mounted on an inspection circuit board (V).

[0053] The test circuit board (V) is a predetermined board (PCB) on which semiconductor chip test sockets (10) are mounted to exchange signals. The test circuit board V may have a system embedded in it for displaying inherent information about the IC chip (20) embedded in the semiconductor chip test socket (10) and the number of times the semiconductor chip test socket (10) has been used. Of course, in addition to having the system embedded in the test circuit board (V), the test circuit board (V) can also send and receive information by connecting to an external device.

[0054] When the semiconductor chip test socket (10) is attached to the inspection circuit board (V), the IC chip (20) and the inspection circuit board (V) are electrically connected via the spring pin (400). For this purpose, a predetermined connection slot (not shown) can be provided on the inspection circuit board (V) where the lower end of the spring pin (400) can be inserted and electrically connected.

[0055] The semiconductor chip package (S) is mounted in the semiconductor chip test socket (10). Therefore, the semiconductor chip package (S) and the inspection circuit board (V) are connected via the semiconductor chip test socket (10), and inspection of the semiconductor chip package (S) can be performed.

[0056] The inherent information embedded in the IC chip (20) and the usage count data of the semiconductor chip test socket (10) can be transmitted to the system of the inspection circuit board (V).

[0057] The effects of the present invention will be described below.

[0058] In the semiconductor chip test socket according to the present invention, an IC chip (20) is embedded in the semiconductor chip test socket (10), and inherent information is assigned to the semiconductor chip test socket (10) by the IC chip (20), and the number of times the semiconductor chip test socket (10) is used can be counted.

[0059] Therefore, accurately counting the number of times the semiconductor chip test socket (10) is used can prevent defects in the semiconductor chip test socket (10) and the semiconductor chip packaged product in advance. In particular, when the semiconductor chip test socket (10) is moved and used on another inspection circuit board (V), the cumulative number of times the semiconductor chip test socket (10) is used can be counted. Therefore, accurately counting the remaining service life of the semiconductor chip test socket (10) can prevent defects in the semiconductor chip test socket (10) and the semiconductor chip packaged product.

[0060] Furthermore, according to the embodiment, since a fixing member (300) capable of supporting the IC chip (20) and fixing it in the mounting portion (130) is provided, the assemblability during the installation process of the IC chip (20) and the spring pin (400) can be improved. Moreover, since the IC chip (20) is supported by the fixing member (300), the IC chip (20) can be fixedly positioned in the mounting portion (130) of the socket body (100). That is, even if an unintentional external force is applied to the semiconductor chip test socket (10), the IC chip (20) can be prevented from leaving its position.

[0061] Preferred embodiments have been shown and described above, but the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various modifications and implementations without departing from the spirit of the invention as claimed in the claims, and these modifications and implementations should not be understood separately from the technical concept or idea of ​​the present invention.

Claims

1. A semiconductor chip test socket, which is coupled to a predetermined inspection circuit board and performs semiconductor chip testing, and embeds an IC chip, wherein the IC chip stores predetermined inherent information and an algorithm for counting the number of times the semiconductor chip test socket is used, wherein... The semiconductor chip test socket includes: The socket body has a mounting portion in which the IC chip is mounted; A side body, which is attached to the semiconductor chip test socket and covers the mounting portion; A fixing component is installed in the mounting portion, and the IC chip is fixed therein; and A spring pin is installed in the socket body, with one end connected to the IC chip and the other end protruding outward from the socket body to connect the IC chip to an external test circuit board. When the semiconductor chip test socket is attached to the inspection circuit board, the spring pin is connected to the inspection circuit board, and the IC chip is electrically connected to the inspection circuit board. Furthermore, the inherent information stored in the IC chip and the number of times the semiconductor chip test socket has been used are transmitted to the inspection circuit board. The mounting portion is configured as a through hole running vertically. The fixing component is installed from above in the mounting portion, and is supported and fixed in place within the mounting portion. The fixing component includes: bottom panel; and A side panel, which is located on one side of the bottom panel and extends upward therefrom, The bottom panel includes through-holes for contact mounting. The bottom panel supports the bottom surface of the IC chip, and the side panel supports the sides of the IC chip. The spring pin can be accommodated in the contact mounting hole and fixed in place.

2. The semiconductor chip test socket according to claim 1, wherein, The contact mounting hole has a support surface that supports at least a portion of the spring pin.

3. The semiconductor chip test socket according to claim 1, wherein, The bottom panel has a downwardly protruding fixing protrusion on its underside. When the fixing component is installed in the mounting part, the fixing protrusion is exposed at the lower part of the socket body.

4. The semiconductor chip test socket according to claim 3, wherein, The contact mounting hole extends through the fixing protrusion in the vertical direction.

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