Temperature regulating device for a wafer

Abstract

A temperature adjustment device (1A) of a wafer includes a temperature adjustment sheet (2A) and a top plate (3). The temperature adjustment sheet (2A) includes a plurality of temperature adjustment portions (21). The plurality of temperature adjustment portions (21) are partitioned from each other by partition regions (22) in the same plane. The plurality of temperature adjustment portions (21) are capable of being independently temperature-adjusted. The top plate (3) includes a plate main body (31) laminated to the temperature adjustment sheet (2A). A surface of the plate main body (31) opposite to the temperature adjustment sheet (2A) is a placement surface (31f) of a semiconductor wafer. The top plate (3) includes a heat insulating portion (32). The heat insulating portion (32) is disposed in the plate main body (31) at a position corresponding to the partition region (22) as viewed from a laminating direction (Ds) of the temperature adjustment sheet (2A) and the top plate (3). A thermal conductivity of the heat insulating portion (32) is smaller than that of the plate main body (31).

Description

Technical Field

[0001] This invention relates to a temperature control device for wafers.

[0002] This application claims priority to Japanese Patent Application No. 2020-153856, filed on September 14, 2020, the contents of which are incorporated herein by reference. Background Technology

[0003] Patent Document 1 describes a circular cooling plate for cooling wafers. This circular cooling plate includes a thermal assembly consisting of multiple Peltier elements arranged between a pair of heat-conducting plates. Furthermore, in Patent Document 1, various studies were conducted on the shape of the pair of heat-conducting plates and the arrangement of the multiple Peltier elements, thereby achieving a more compact arrangement of the thermal assembly, increasing cooling capacity, and reducing temperature distribution.

[0004] Prior art literature

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2002-185051 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] In a wafer temperature control device for temperature control of a wafer, as described in Patent Document 1, it is desirable to use a smooth surface without bumps or depressions to support the back side of the wafer from below in order to suppress the influence on the back side of the wafer.

[0009] Furthermore, in the aforementioned temperature control device for wafers, it is desirable to avoid reducing the temperature distribution of the wafer and instead establish multiple regions within the wafer surface, with each region's temperature being adjusted independently. However, even when adjacent regions have different temperatures, there are still cases where the desired temperature cannot be achieved near the boundary of adjacent regions due to heat conduction within the smooth surface supporting the wafer.

[0010] The present invention was made in view of the following problem, and its object is to provide a temperature control device for a wafer capable of effectively adjusting the temperature of each of multiple regions.

[0011] Solution for solving the problem

[0012] One aspect of the present invention provides a wafer temperature control device comprising a temperature control plate and a top plate. The temperature control plate has multiple temperature control sections. These multiple temperature control sections are separated from each other within the same plane by segmentation regions. Each of the multiple temperature control sections can independently perform temperature control. The top plate has a plate body stacked on the temperature control plate. The side of the plate body opposite to the temperature control plate serves as a mounting surface for the semiconductor wafer. The top plate has a heat insulation section. Viewed from the stacking direction of the temperature control plate and the top plate, the heat insulation section is disposed within the plate body at a position corresponding to the segmentation regions. The heat insulation section has a lower thermal conductivity than the plate body.

[0013] Invention Effects

[0014] According to the present invention, the temperature of each of the multiple segmented regions can be well adjusted. Attached Figure Description

[0015] Figure 1 This is a longitudinal sectional view showing the outline structure of a temperature regulation device for a wafer according to an embodiment of the present invention.

[0016] Figure 2 It is along Figure 1 A sectional view along line II.

[0017] Figure 3 It is along Figure 1 A sectional view along line II-II.

[0018] Figure 4 This is a top view of the top plate of the aforementioned temperature regulating device.

[0019] Figure 5 This is a longitudinal sectional view showing the outline structure of a temperature control device for a wafer, representing a modified embodiment of the present invention. Detailed Implementation

[0020] The following is for reference Figures 1 to 4 The embodiments of the present invention will be described in detail.

[0021] <Wafer Temperature Control Device>

[0022] The temperature control device for the wafer in this embodiment (hereinafter referred to as the temperature control device) is provided, for example, in a semiconductor manufacturing apparatus. This temperature control device supports a semiconductor wafer subjected to predetermined processes such as plasma processing and etching within the semiconductor manufacturing apparatus from below. The temperature control device adjusts the semiconductor wafer to a temperature suitable for the predetermined process.

[0023] Figure 1 This is a longitudinal sectional view showing the outline structure of a temperature regulation device for a wafer according to an embodiment of the present invention.

[0024] like Figure 1 As shown, in this embodiment, the temperature regulating device 1A is supported on the chamber 5 of the semiconductor manufacturing apparatus. The temperature regulating device 1A divides the chamber 5 into an upper space 6A, which is the interior of the chamber 5, and a lower space 6B, which is the exterior of the chamber 5. The upper space 6A is positioned above the temperature regulating device 1A in the vertical direction Dv. The lower space 6B is positioned below the temperature regulating device 1A in the vertical direction Dv. In this embodiment, for example, the upper space 6A is evacuated to a vacuum level suitable for a specified process.

[0025] The temperature regulating device 1A includes a temperature regulating plate 2A, a top plate 3, and a cooling plate 8. These temperature regulating plates 2A, top plate 3, and cooling plate 8 are stacked in the vertical direction Dv.

[0026] Figure 2 It is along Figure 1 A sectional view along line II.

[0027] like Figure 2 As shown, in this embodiment, from the vertical direction Dv (and) Figure 2 The outline of the temperature regulating plate 2A, when viewed from a direction orthogonal to the paper, is, for example, circular. The temperature regulating plate 2A has a plurality of temperature regulating sections 21. In this embodiment, the plurality of temperature regulating sections 21 are separated from each other in a manner that sandwiches the segmented region 22 in the same plane (horizontal plane) orthogonal to the stacking direction Ds (vertical direction Dv) of the temperature regulating plate 2A and the top plate 3. In this embodiment, the plurality of temperature regulating sections 21 include, for example, an inner peripheral temperature regulating section 21A, intermediate temperature regulating sections 21B and 21C, and outer peripheral temperature regulating sections 21D to 21G.

[0028] Viewed from above in the vertical direction Dv, the inner circumferential temperature regulating part 21A is disposed at the center of the circle of the temperature regulating plate 2A. In this embodiment, the inner circumferential temperature regulating part 21A is circular when viewed from above in the vertical direction Dv.

[0029] Intermediate temperature regulating portions 21B and 21C are disposed on the outer side of the radial direction Dr of the temperature regulating plate 2A relative to the inner peripheral temperature regulating portion 21A, and are arranged to surround the temperature regulating plate 2A. Specifically, in this embodiment, the intermediate temperature regulating portions 21B and 21C are each formed in a semi-circular arc shape. Furthermore, these semi-circular intermediate temperature regulating portions 21B and 21C are arranged in a generally circular shape along the circumferential direction Dc.

[0030] The inner circumferential temperature regulating section 21A and the intermediate temperature regulating sections 21B and 21C are separated from each other radially along Dr by a continuous annular first segmented region 22P on the circumferential direction Dc of the temperature regulating plate 2A. Furthermore, the intermediate temperature regulating sections 21B and 21C are arranged at intervals on the circumferential direction Dc by second segmented regions 22Q. Each second segmented region 22Q extends radially along Dr, connecting the first segmented region 22P to the third segmented region 22R, which will be described later.

[0031] The outer peripheral temperature regulating portions 21D to 21G are disposed on the outer side of the radial direction Dr relative to the intermediate temperature regulating portions 21B and 21C, and are arranged to surround the intermediate temperature regulating portions 21B and 21C. Specifically, in this embodiment, the outer peripheral temperature regulating portions 21D to 21G are each formed in an arc shape. Furthermore, these arc-shaped outer peripheral temperature regulating portions 21D to 21G are arranged along the circumferential direction Dc to form a generally circular shape. These outer peripheral temperature regulating portions 21D to 21G are disposed at the outermost periphery of the temperature regulating plate 2A.

[0032] The intermediate temperature regulating sections 21B and 21C and the outer peripheral temperature regulating sections 21D to 21G are separated from each other radially in the direction of Dr by a continuous annular third segmented region 22R on the circumferential direction of Dc. Furthermore, adjacent outer peripheral temperature regulating sections 21D to 21G on the circumferential direction of Dc are separated from each other by four fourth segmented regions 22S arranged at intervals on the circumferential direction of Dc. Each fourth segmented region 22S extends outward from the third segmented region 22R radially in the direction of Dr.

[0033] Multiple temperature regulating sections 21 (inner peripheral temperature regulating section 21A, intermediate temperature regulating sections 21B, 21C, and outer peripheral temperature regulating sections 21D to 21G) are respectively composed of, for example, Peltier elements, or formed from sheets 23 incorporating Peltier elements. That is, the temperature regulating sheet 2A comprises multiple sheets 23 having a predetermined shape. The temperature regulating sheet 2A forms the aforementioned first segmented region 22P, second segmented region 22Q, third segmented region 22R, and fourth segmented region 22S by arranging the multiple sheets 23 at intervals.

[0034] Each of the multiple temperature regulating units 21 (sheet 23) can have its temperature regulated by an external controller (not shown). The controller (not shown) controls, for example, the energization of the Peltier elements of each temperature regulating unit 21 (sheet 23), and can independently regulate the temperature of the multiple temperature regulating units 21.

[0035] like Figure 1As shown, the cooling plate 8 is stacked on the lower side of the temperature regulating plate 2A in the vertical direction Dv. That is, in this embodiment, the cooling plate 8 is disposed on the side opposite to the top plate 3 in the stacking direction Ds. The cooling plate 8 is formed, for example, of a metal such as copper or aluminum, resin, or ceramic. The cooling plate 8 is disposed in close contact with the lower surface of the temperature regulating plate 2A. The cooling plate 8 absorbs the heat released from the temperature regulating plate 2A to the lower side in the vertical direction Dv.

[0036] The top plate 3 is stacked on the upper side of the temperature regulating plate 2A in the vertical direction Dv. That is, in this embodiment, the top plate 3 is disposed on the side opposite to the cooling plate 8 in the stacking direction Ds. In other words, the lower surface of the top plate 3 is in contact with the upper surface of the temperature regulating plate 2A. The top plate 3 has a plate body 31 and a heat insulation part 32.

[0037] Figure 3 It is along Figure 1 A sectional view along line II-II.

[0038] like Figure 3 As shown, in this embodiment, from the vertical direction Dv (and) Figure 3 The outline of the plate body 31, viewed from an angle orthogonal to the paper, is, for example, circular. The plate body 31 is formed to cover the entire temperature regulating plate 2A from above (see reference). Figure 2 The substrate 31 is formed of materials such as aluminum alloy or ceramic. The side of the substrate 31 opposite to the temperature regulating plate 2A becomes the mounting surface 31f of the semiconductor wafer. The mounting surface 31f is a smooth surface that intersects (orthogonalizes) the stacking direction Ds and does not have grooves, recesses, etc.

[0039] like Figure 1 , Figure 3 As shown, the heat insulation portion 32 is formed inside the main body 31. Viewed from the stacking direction Ds (vertical direction Dv) of the temperature regulating plate 2A and the top plate 3, the heat insulation portion 32 is positioned at a location corresponding to the segmented area 22 (in other words, at a position overlapping in the vertical direction Dv). In this embodiment, the heat insulation portion 32 includes a space 33, a heat insulation body 34, a fluid supply portion 36, and a fluid discharge portion 37.

[0040] Space 33 is formed inside the main body 31. That is, space 33 is not exposed (opening) on ​​the mounting surface 31f of the main body 31 or on the opposing surface 31g opposite to the temperature regulating plate 2A. Space 33 is formed at predetermined intervals relative to the mounting surface 31f and the opposing surface 31g of the main body 31 in the lamination direction Ds. This space 33 is continuously formed inside the main body 31 along a horizontal plane orthogonal to the lamination direction Ds. Viewed from the lamination direction Ds (vertical direction Dv), in this embodiment, space 33 is formed at a position inside the main body 31 that overlaps with the segmented region 22. Space 33 has a first space 33P, a second space 33Q, a third space 33R, and a fourth space 33S.

[0041] The first space 33P is circular when viewed from the stacking direction Ds, and is formed at the position where it overlaps with the first segmentation region 22P.

[0042] The second space 33Q extends radially along Dr. The second space 33Q is disposed at two locations spaced apart in the circumferential direction Dc. In this embodiment, the second spaces 33Q are disposed on their respective extensions along the radial direction Dr. Viewed from the stacking direction Ds, the second space 33Q is formed at a position overlapping with the second segmented region 22Q. The second space 33Q connects the first space 33P and the third space 33R, described later.

[0043] The third space 33R appears as a ring when viewed from the stacking direction Ds, and is formed at the position where it overlaps with the third segmentation region 22R.

[0044] The fourth space 33S extends outward from the third space 33R in a radial direction Dr. The fourth space 33S is disposed at four points spaced apart in the circumferential direction Dc. Viewed from the stacking direction Ds, the fourth space 33S is formed at a position overlapping with the fourth segmented region 22S.

[0045] A heat insulation element 34 is disposed in the space 33. In this embodiment, a liquid or gaseous fluid can be used as the heat insulation element 34. The heat insulation element 34, which is composed of a fluid, is supplied from outside the temperature regulating device 1A, flows in a manner that fills the space 33, and is then discharged to the outside of the temperature regulating device 1A. As the heat insulation element 34, a material with a lower thermal conductivity than the plate body 31 can be used, such as air, nitrogen, inert gas, water, fluorinated refrigerants, and other liquids.

[0046] Figure 4 This is a top view of the top plate of the aforementioned temperature regulating device.

[0047] From the stacking direction Ds (and) Figure 4 Observed from the direction orthogonal to the paper, the top plate 3 is divided by the aforementioned heat insulation part 32 into Figure 1 , Figure 4The diagram shows multiple regions S. Viewed from the stacking direction Ds, these multiple regions S and... Figure 2 The multiple temperature regulating units 21 shown (inner peripheral temperature regulating unit 21A, intermediate temperature regulating units 21B, 21C, and outer peripheral temperature regulating units 21D to 21G) are respectively corresponding (in other words, they overlap in the vertical direction Dv). That is, as multiple regions S, there are an inner peripheral region S1 corresponding to the inner peripheral temperature regulating unit 21A, intermediate regions S2 and S3 corresponding to the intermediate temperature regulating units 21B and 21C, and outer peripheral regions S4 to S7 corresponding to the outer peripheral temperature regulating units 21D to 21G.

[0048] The fluid supply section 36 supplies fluid, which serves as the heat insulation element 34, from outside the temperature regulating device 1A into the space 33. The fluid discharge section 37 discharges the fluid, which serves as the heat insulation element 34, from inside the space 33 into the outside of the temperature regulating device 1A. One end of the fluid supply section 36 and one end of the fluid discharge section 37 are respectively connected to the space 33. The other ends of the fluid supply section 36 and the other ends of the fluid discharge section 37 open towards the outside of the temperature regulating device 1A.

[0049] In this embodiment, the fluid supply section 36 and the fluid discharge section 37 extend downward from the space 33 formed in the plate body 31 in the stacking direction Ds (vertical direction Dv). In this embodiment, the fluid supply section 36 and the fluid discharge section 37 are arranged to communicate with the fourth space 33S. The fluid supply section 36 and the fluid discharge section 37 pass through the temperature regulating plate 2A and the cooling plate 8 along the stacking direction Ds, and have openings on the lower surface of the cooling plate 8.

[0050] A supply pipe (not shown) is connected to the fluid supply section 36 to supply fluid into the insulation 34 from the outside using a pump (not shown). Additionally, a discharge pipe (not shown) is connected to the fluid discharge section 37 to discharge the insulation 34 to the outside.

[0051] It should be noted that the insulation 34 supplied from the fluid supply unit 36 ​​into the space 33 can also be configured to allow for appropriate adjustment of its temperature, pressure, flow rate, etc. In this case, a heat exchanger, pump, or the like can be provided externally to regulate the temperature of the insulation 34.

[0052] <Effects>

[0053] The temperature regulating device 1A described above has multiple temperature regulating units 21 capable of independently regulating the temperature of each region. Therefore, the semiconductor wafer placed on the mounting surface 31f of the plate body 31 of the top plate 3 can be conditioned at a different desired temperature for each of the multiple regions S. Furthermore, the top plate 3 has heat insulation units 32 positioned corresponding to the partition regions 22 of the temperature regulating plate 2A. Therefore, the top plate 3 can suppress the movement of heat transferred from one temperature regulating unit 21 of the temperature regulating plate 2A to one region S and then to another region S from which heat is transferred. Thus, the temperature of each of the multiple regions S can be well regulated.

[0054] Furthermore, in the temperature regulating device 1A described above, the heat insulation section 32 has a space 33. As a result, heat conduction between adjacent regions S in the plurality of regions S corresponding to the plurality of temperature regulating sections 21 in the stacking direction Ds can be suppressed inside the top plate 3.

[0055] Furthermore, in the temperature regulating device 1A described above, a heat insulation element 34 with a lower thermal conductivity than the main plate 31 exists within the space 33. This further suppresses heat conduction between adjacent regions S of the top plate 3.

[0056] Furthermore, in the temperature regulating device 1A described above, fluid serving as the heat insulation element 34 is supplied from the outside to the space 33 via the fluid supply section 36, and the fluid serving as the heat insulation element 34 flowing in the space 33 is discharged from the fluid discharge section 37. This suppresses temperature changes in the heat insulation element 34 caused by the heat from the multiple temperature regulating sections 21. Therefore, heat transfer between the multiple regions S of the top plate 3 can be suppressed more effectively.

[0057] Furthermore, in the temperature regulating device 1A described above, the fluid supply section 36 and the fluid discharge section 37 extend along the stacking direction Ds and penetrate the temperature regulating plate 2A. Therefore, the fluid, which serves as the heat insulation body 34, can enter and exit the space 33 from the side opposite to the mounting surface 31f of the semiconductor wafer. In addition, the fluid allows the heat exchanged between the region S facing the space 33 to move along the stacking direction Ds.

[0058] Furthermore, in the temperature control device 1A described above, the mounting surface 31f is formed as a smooth surface. Therefore, the impact on the back side of the wafer can be reduced, and foreign objects will not enter the grooves as would happen if grooves were formed on the mounting surface 31f. Thus, the mounting surface 31f can be easily cleaned and maintained.

[0059] Furthermore, in the temperature regulating device 1A described above, the temperature regulating plate 2A has a plurality of sheets 23 that each form a temperature regulating section 21. Therefore, if the adjacent sheets 23 are arranged with intervals between each other, the segmented area 22 can be easily formed.

[0060] (Modifications of the above embodiments)

[0061] Figure 5 This is a longitudinal sectional view showing the outline structure of a temperature control device for a wafer, representing a modified embodiment of the present invention.

[0062] In the above embodiment, the temperature regulating plate 2A is configured using a Peltier element, but it is not limited to this.

[0063] For example, such as Figure 5 As shown, the temperature regulating plate 2B, which serves as the temperature regulating device 1B, can also be an electric heater 28. The electric heater 28 has multiple sheets 29. Each sheet 29 is connected to... Figure 2 Similarly, the temperature regulating sheet 2A of the above embodiment shown has multiple temperature regulating sections 21 that can be independently regulated. The sheets 29 are arranged at intervals, so that the multiple temperature regulating sections 21 are separated from each other on the same surface by dividing regions 22.

[0064] When an electric heater 28 is provided, a purge plate 50 can be arranged at a distance below the electric heater 28 in the vertical direction Dv. This creates a purge space 51 between the electric heater 28 and the purge plate 50. When the electric heater 28 cools down, air is blown into this purge space 51 from the outside, enabling efficient cooling of the electric heater 28.

[0065] Alternatively, when the purge plate 50 is provided, the fluid supply section 36 and the fluid discharge section 37 can also be made into tubes, which are provided through the temperature regulating plate 2B to the purge space 51 and the purge plate 50.

[0066] (Other variations)

[0067] In the above embodiments and their variations, the plurality of temperature regulating portions 21 constituting temperature regulating plates 2A and 2B are divided into inner peripheral temperature regulating portions 21A, intermediate temperature regulating portions 21B and 21C, and outer peripheral temperature regulating portions 21D to 21G, but are not limited thereto. The number and division pattern of the plurality of temperature regulating portions 21 constituting temperature regulating plate 2A can be appropriately changed.

[0068] Furthermore, the case where a first segmented region 22P, a second segmented region 22Q, a third segmented region 22R, and a fourth segmented region 22S are provided in the temperature regulating plate 2A has been described. However, these first segmented regions 22P, second segmented regions 22Q, third segmented regions 22R, and fourth segmented regions 22S can also be omitted, so that the first segmented regions 22P, second segmented regions 22Q, third segmented regions 22R, and fourth segmented regions 22S that are adjacent in the circumferential direction Dc and in the radial direction Dr are respectively adjacent.

[0069] Alternatively, the space 33 may not be exposed (opened) on the mounting surface 31f and the opposing surface 31g of the main body 31, but this is not a limitation. For example, the space 33 may be opened on the opposing surface 31g and communicate with the segmented area 22 of the temperature regulating plate 2A. In this case, the heat insulation 34 may be supplied or filled not only into the space 33, but also into the segmented area 22.

[0070] Furthermore, the above embodiment illustrates the case of providing only one space 33, but is not limited to this. For example, space 33 may also be divided into multiple spaces.

[0071] Furthermore, in the above embodiment, an example is shown where one fluid supply unit 36 ​​and one fluid discharge unit 37 are provided for each space 33, but this is not a limitation. For example, multiple fluid supply units 36 and multiple fluid discharge units 37 may be provided for each space 33.

[0072] In addition, the case of setting a single space 33 on the main body 31 has been described, but multiple spaces 33 that are not interconnected can also be set on the main body 31, and the insulation 34 can be supplied and discharged to each space 33.

[0073] Furthermore, as the heat insulation section 32, a heat insulation body 34 composed of a fluid is supplied from outside the temperature regulating device 1A, but this is not a limitation. For example, the heat insulation body 34 composed of a fluid can simply be filled (in other words, sealed) into the space 33. Alternatively, as the heat insulation section 32, a solid heat insulation material with heat insulation properties, such as carbon fiber, can be used to fill the space 33. Alternatively, a gas with a pressure lower than the atmospheric pressure after evacuating the space 33 by means of a vacuum pump can be used as the heat insulation section 32. Alternatively, for example, the space 33 can be connected to the upper space 6A. Thus, the space 33 can be made into a vacuum state, just like the upper space 6A, to form the heat insulation section 32.

[0074] Industrial availability

[0075] According to the present invention, the temperature of each of the multiple segmented regions can be well adjusted.

[0076] Explanation of reference numerals in the attached figures:

[0077] 1A, 1B… Temperature control device for wafers; 2A, 2B… Temperature control plates; 3… Top plate; 5… Chamber; 6A… Upper space; 6B… Lower space; 8… Cooling plate; 21… Temperature control section; 21A… Inner peripheral temperature control section; 21B, 21C… Intermediate temperature control section; 21D, 21E, 21F, 21G… Outer peripheral temperature control section; 22… Segmentation area; 22P… First segmentation area; 22Q… Second segmentation area; 22R… Third segmentation area; 22S… Fourth segmentation area; 23… Sheet; 28… Electric heater ;29…Sheet; 31…Board body; 31f…Supporting surface; 31g…Opposing surface; 32…Insulation part; 33…Space; 33P…First space; 33Q…Second space; 33R…Third space; 33S…Fourth space; 34…Insulation body; 36…Fluid supply part; 37…Fluid discharge part; 50…Purge plate; 51…Purge space; Dc…Circumferential direction; Dr…Radial direction; Ds…Layering direction; Dv…Up and down direction; S…Region; S1…Inner peripheral region; S2, S3…Intermediate region; S4, S5, S6, S7…Outer peripheral region.

Claims

1. A temperature control device for a wafer, wherein, The temperature control device for the wafer includes: A temperature regulating sheet having multiple sheets forming multiple temperature regulating parts, the multiple temperature regulating parts being separated from each other in the same plane by a dividing region, and each being capable of independently regulating temperature. A top plate has a plate body stacked on top of the temperature regulating sheet, the side of the plate body opposite to the temperature regulating sheet serving as a mounting surface for a semiconductor wafer, the mounting surface being formed as a smooth surface intersecting the stacking direction. The top plate has a heat insulation portion, which, viewed from the stacking direction of the temperature regulating plate and the top plate, is disposed in the main body of the plate at a position corresponding to the segmented area of ​​the temperature regulating plate and has a lower thermal conductivity than the main body of the plate. The heat insulation portion also has a space formed within the main body of the plate. The segmented region includes a first segmented region extending circumferentially and a second segmented region extending radially. The heat insulation portion includes a first heat insulation portion disposed at a position corresponding to the first segmented region and a second heat insulation portion disposed at a position corresponding to the second segmented region.

2. The temperature control device for a wafer according to claim 1, wherein, The insulation section also includes an insulation material that supplies or fills the space and has a lower thermal conductivity than the main body of the plate.

3. The temperature control device for a wafer according to claim 2, wherein, The insulation material is a fluid. The temperature control device for the wafer also includes: A fluid supply unit that supplies fluid from the outside into the space; and A fluid discharge section that discharges the fluid from inside the space to the outside.

4. The temperature regulating device for a wafer according to claim 3, wherein, The fluid supply section and the fluid discharge section are arranged to extend from the plate body along the stacking direction and pass through the temperature regulating plate.

Images