Printed circuit board warpage analysis method and device, computer device and storage medium

Abstract

The application discloses a printed circuit board warping analysis method and device, computer equipment and a storage medium. The method comprises the following steps: obtaining basic information of a failure printed circuit board with warping phenomenon; wherein the basic information comprises at least one of a circuit distribution diagram of the failure printed circuit board, a stage and a warping type of the failure printed circuit board with warping phenomenon, and an application environment of the failure printed circuit board; then, based on the basic information, existing warping reasons are supplemented to obtain global warping reasons; and finally, based on the global warping reasons, a root cause of the warping phenomenon of the failure printed circuit board is determined. According to the above scheme, the root cause of the warping of the printed circuit board can be effectively found out by analyzing the warping of the failure printed circuit board according to the comprehensive global warping reasons, and then the warping can be effectively prevented.

Description

Technical Field

[0001] This application relates to the field of printed circuit board technology, and in particular to a method, apparatus, computer equipment, and storage medium for analyzing printed circuit board warpage. Background Technology

[0002] As surface mount components on printed circuit boards (PCBs) become increasingly dense, the flatness of the PCB surface itself has a significant impact on component mounting and even the overall board assembly.

[0003] When printed circuit board (PCB) warpage is excessive, it not only creates assembly difficulties but also, due to uneven component mounting, can easily lead to component breakage and other reliability risks when subjected to external forces. Therefore, effectively identifying the root cause of PCB warpage is crucial for its prevention. Summary of the Invention

[0004] Therefore, it is necessary to provide a printed circuit board warpage analysis method, apparatus, computer equipment, and storage medium to address the above-mentioned technical problems. This method can perform comprehensive warpage analysis on printed circuit boards and effectively identify the root cause of printed circuit board warpage.

[0005] Firstly, this application provides a method for analyzing the warpage of printed circuit boards. The method includes:

[0006] Obtain basic information about the failed printed circuit board exhibiting warping; the basic information includes the circuit layout of the failed printed circuit board, the stage and type of warping of the failed printed circuit board, and at least one of the application environments of the failed printed circuit board.

[0007] Based on the basic information, the existing causes of warping are supplemented to obtain the global causes of warping;

[0008] Based on the overall warping cause, the root cause of the warping phenomenon in the failed printed circuit board was determined.

[0009] In one embodiment, the root cause of the warping phenomenon in the failed printed circuit board is determined based on the global warping cause, including:

[0010] Determine the cutting location based on the type of warpage;

[0011] Based on the cutting location, the failed printed circuit board is cut to obtain the board surface to be analyzed;

[0012] Based on the causes of global warping, the board surface to be analyzed is determined to identify the root cause of warping in the failed printed circuit board. Among these causes, global warping can be attributed to at least one of the following: uneven conductor arrangement, uneven insulation thickness, incomplete resin curing, and abnormal fiberglass arrangement.

[0013] In one embodiment, the board surface to be analyzed is analyzed based on the global warping cause to determine the root cause of the warping phenomenon in the failed printed circuit board, including:

[0014] A metallographic microscope was used to determine whether the thickness of the insulating medium on the surface of the board to be analyzed was uniform.

[0015] If not, then the uneven thickness of the insulating medium is the root cause of the warping phenomenon in the failed printed circuit board.

[0016] In one embodiment, the board surface to be analyzed is analyzed based on the global warping cause to determine the root cause of the warping phenomenon in the failed printed circuit board, including:

[0017] Determine whether the fiberglass layers in each layer of the board to be analyzed are skewed.

[0018] If so, then the abnormal fiberglass arrangement is determined to be the cause of the warping phenomenon in the failed printed circuit board. The heating and reverse pressure method is used to verify whether the abnormal fiberglass arrangement is the root cause of the warping phenomenon in the failed printed circuit board.

[0019] In one embodiment, the board surface to be analyzed is analyzed based on the global warping cause to determine the root cause of the warping phenomenon in the failed printed circuit board, including:

[0020] The glass transition temperature difference between a first target temperature and a second target temperature is determined using thermal analysis; wherein the first target temperature is higher than the second target temperature.

[0021] If the glass transition temperature difference determines that incomplete resin curing is the cause of warping in the failed printed circuit board, then simulated hot pressing and simulated reflow methods are used to verify whether incomplete resin curing is the root cause of warping in the failed printed circuit board.

[0022] In one embodiment, the method further includes:

[0023] The first coplanarity of the failed printed circuit board and the second coplanarity of the effective printed circuit board were measured using a three-dimensional measuring machine.

[0024] Based on the first and second coplanarity, the warping type of the failed printed circuit board is determined.

[0025] Secondly, this application also provides a printed circuit board warpage analysis device. The device includes:

[0026] The acquisition module is used to acquire basic information about the failed printed circuit board that exhibits warping. The basic information includes the circuit layout of the failed printed circuit board, the stage and type of warping of the failed printed circuit board, and at least one of the application environments of the failed printed circuit board.

[0027] The supplementary module is used to supplement existing warping causes based on basic information to obtain global warping causes;

[0028] The determination module is used to identify the root cause of warping in failed printed circuit boards based on the global warping cause.

[0029] Thirdly, this application also provides a computer device. The computer device includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to perform the following steps:

[0030] Obtain basic information about the failed printed circuit board exhibiting warping; the basic information includes the circuit layout of the failed printed circuit board, the stage and type of warping of the failed printed circuit board, and at least one of the application environments of the failed printed circuit board.

[0031] Based on the basic information, the existing causes of warping are supplemented to obtain the global causes of warping;

[0032] Based on the overall warping cause, the root cause of the warping phenomenon in the failed printed circuit board was determined.

[0033] Fourthly, this application also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program thereon, which, when executed by a processor, performs the following steps:

[0034] Obtain basic information about the failed printed circuit board exhibiting warping; the basic information includes the circuit layout of the failed printed circuit board, the stage and type of warping of the failed printed circuit board, and at least one of the application environments of the failed printed circuit board.

[0035] Based on the basic information, the existing causes of warping are supplemented to obtain the global causes of warping;

[0036] Based on the overall warping cause, the root cause of the warping phenomenon in the failed printed circuit board was determined.

[0037] Fifthly, this application also provides a computer program product. The computer program product includes a computer program that, when executed by a processor, performs the following steps:

[0038] Obtain basic information about the failed printed circuit board exhibiting warping; the basic information includes the circuit layout of the failed printed circuit board, the stage and type of warping of the failed printed circuit board, and at least one of the application environments of the failed printed circuit board.

[0039] Based on the basic information, the existing causes of warping are supplemented to obtain the global causes of warping;

[0040] Based on the overall warping cause, the root cause of the warping phenomenon in the failed printed circuit board was determined.

[0041] The aforementioned printed circuit board (PCB) warpage analysis method, apparatus, computer equipment, and storage medium acquire basic information about the failed PCB exhibiting warpage. Based on this basic information, existing warpage causes are supplemented to obtain a more comprehensive global warpage cause. Then, based on the global warpage cause, the root cause of the warpage in the failed PCB can be accurately determined. This approach, by analyzing the warpage of the failed PCB based on a comprehensive global warpage cause, can effectively identify the root cause of PCB warpage, thereby facilitating effective warpage prevention. Attached Figure Description

[0042] Figure 1 This is a flowchart illustrating a printed circuit board warpage analysis method in one embodiment;

[0043] Figure 2 This is a flowchart illustrating the process of determining the root cause in one embodiment;

[0044] Figure 3 This is a flowchart illustrating the process of determining the type of warpage in one embodiment;

[0045] Figure 4 This is a flowchart illustrating a printed circuit board warpage analysis method in another embodiment;

[0046] Figure 5 This is a structural block diagram of a printed circuit board warpage analysis device in one embodiment;

[0047] Figure 6 A structural block diagram of a printed circuit board warpage analysis device in another embodiment;

[0048] Figure 7 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0050] The printed circuit board warpage analysis method provided in this application can be applied to analyze the causes of printed circuit board warpage. This embodiment illustrates the method by applying it to a server. It is understood that this method can also be applied to a terminal, or to a system including both a terminal and a server, and implemented through interaction between the terminal and the server.

[0051] In one embodiment, such as Figure 1 As shown, a method for analyzing printed circuit board warpage is provided. Taking the application of this method to a server as an example, the method includes the following steps:

[0052] S101, Obtain basic information about the failed printed circuit board that exhibits warping.

[0053] A failed printed circuit board (PCB) is defined as a PCB exhibiting warping. Basic information includes the circuit layout of the failed PCB, the stage and type of warping, and at least one of the following: the application environment of the failed PCB. The stage of warping may include lamination and soldering processes; the type of warping may include bowing and twisting; and the application environment may include marine environments or high-temperature, high-pressure environments.

[0054] Specifically, the basic information of the failed printed circuit boards exhibiting warping is collected in advance and stored in the database; thus, the basic information of the failed printed circuit boards exhibiting warping can be obtained from the database.

[0055] S102, based on the basic information, supplement the existing warping causes to obtain the global warping causes.

[0056] Among these, "existing causes of warping" refers to causes that are known in advance; for example, causes of warping in printed circuit boards (PCBs) that workers know based on their own experience in manufacturing PCBs. For instance, abnormal fiberglass arrangement within the substrate can cause PCB warping. In other words, abnormal fiberglass arrangement is an existing cause of warping.

[0057] Global warpage causes are all possible causes that lead to warpage in printed circuit boards; global warpage causes include existing warpage causes and warpage causes obtained based on basic information.

[0058] Optionally, uneven conductor arrangement on a printed circuit board (PCB) can lead to a large copper area on one side, creating significant stress and causing the PCB to warp. During lamination, uneven insulation thickness or incomplete resin curing can also cause stress imbalance and warping. Furthermore, during PCB soldering, excessively high solder temperatures or prolonged operation times during wave soldering or dip soldering can also cause warping. Therefore, based on the circuit diagram of the failed PCB and the stages at which warping occurred in the basic information, it can be determined that uneven conductor arrangement, uneven insulation thickness, and incomplete resin curing are also possible causes of warping in failed PCBs.

[0059] Specifically, based on the basic information, it can be determined that uneven conductor arrangement, uneven insulation thickness, and incomplete resin curing may also be causes of warping in the failed printed circuit board. By adding uneven conductor arrangement, uneven insulation thickness, and incomplete resin curing to the existing causes of warping, the global causes of warping are obtained. At this point, the global causes of warping include uneven conductor arrangement, uneven insulation thickness, process heating, incomplete resin curing, and abnormal glass fiber arrangement.

[0060] S103, Based on the global warping cause, determine the root cause of the warping phenomenon in the failed printed circuit board.

[0061] Specifically, the causes of global warping, as well as the relevant characteristics of the failed printed circuit board, can be input into a pre-trained model, which will then output the root cause of the warping phenomenon in the failed printed circuit board.

[0062] The aforementioned printed circuit board (PCB) warpage analysis method obtains basic information about the failed PCB exhibiting warpage. Based on this basic information, existing warpage causes are supplemented to obtain a more comprehensive global warpage cause. Then, based on the global warpage cause, the root cause of the warpage in the failed PCB can be accurately determined. This approach, by analyzing the warpage of the failed PCB based on the global warpage cause, effectively identifies the root cause of PCB warpage, thus facilitating effective warpage prevention.

[0063] In one embodiment, based on the above embodiment, a more detailed explanation is provided regarding S103, which determines the root cause of the warping phenomenon in the failed printed circuit board based on the global warping cause. For example... Figure 2 As shown, the specific process includes:

[0064] S201, Determine the cutting location based on the type of warping.

[0065] Warpage types include bowing and twisting. Warpage occurring at the edge of the printed circuit board is called bowing, while warpage occurring diagonally is called twisting. The cut-off point indicates the location where warpage occurs on the printed circuit board.

[0066] Specifically, if the warpage type is bowing, the determined cutting position is the edge of the failed printed circuit board where warping occurs; if the warpage type is twisting, the determined cutting position is the diagonal position of the failed printed circuit board where warping occurs.

[0067] S202, according to the cutting position, the failed printed circuit board is cut to obtain the board surface to be analyzed.

[0068] The board surface to be analyzed is the warped board surface cut from a failed printed circuit board.

[0069] Specifically, based on the cutting location, the microscope is controlled to cut the failed printed circuit board to obtain the board surface to be analyzed.

[0070] S203, based on the cause of global warping, analyze the board surface to be analyzed to determine the root cause of the warping phenomenon in the failed printed circuit board.

[0071] The causes of global warping include at least one of the following: uneven conductor arrangement, uneven insulation thickness, incomplete resin curing, and abnormal fiberglass arrangement.

[0072] One possible approach is to extract features from the board surface to be analyzed, and input the extracted features and global warping causes into a pre-trained model, from which the model outputs the root cause of the warping phenomenon in the failed printed circuit board.

[0073] Another possible approach is to analyze each warp cause in the global warp causes to determine whether the warp cause is the root cause of the warping phenomenon in the failed printed circuit board.

[0074] Optionally, if the cause of global warping includes uneven insulation thickness, a metallographic microscope can be used to determine whether the insulation thickness of the board surface to be analyzed is uniform. If not, then the uneven insulation thickness is determined to be the root cause of the warping phenomenon in the failed printed circuit board.

[0075] Specifically, the thickness difference of the insulating dielectric layer on the left and right sides of the board to be analyzed is measured under a metallographic microscope. If the thickness difference of the insulating dielectric layer on the left and right sides of the board to be analyzed is obvious under the metallographic microscope, it indicates that the thickness of the insulating dielectric layer is uneven. Therefore, the uneven thickness of the insulating dielectric layer is determined to be the root cause of the warping phenomenon in the failed printed circuit board.

[0076] When the cause of global warping includes uneven conductor arrangement, the conductor arrangement diagram of the board to be analyzed can be used to address this cause. If the conductor arrangement diagram of the board to be analyzed is uneven, then the uneven conductor arrangement is determined to be the root cause of the warping phenomenon in the failed printed circuit board.

[0077] When abnormal fiberglass arrangement is one of the causes of global warping, it can be determined whether the fiberglass in each layer of the board being analyzed is skewed. If so, the abnormal fiberglass arrangement is determined to be the cause of warping in the failed printed circuit board. The heating and reverse pressing method is used to verify whether the abnormal fiberglass arrangement is the root cause of warping in the failed printed circuit board.

[0078] Specifically, the weft skew of each layer of fiberglass cloth is measured under a microscope and compared with the standard requirement value (i.e., the weft skew of printed circuit boards specified in standard IPC-4412). If the weft skew exceeds the standard requirement value, the abnormal fiberglass arrangement is determined to be the cause of the warping phenomenon in the failed printed circuit board. Furthermore, by heating and re-pressing the surface of the board to be analyzed, if the surface of the board to be analyzed still warps again, the abnormal fiberglass arrangement is determined to be the root cause of the warping phenomenon in the failed printed circuit board.

[0079] When incomplete resin curing is one of the causes of global warping, thermal analysis can be used to determine the glass transition temperature difference between the first and second target temperatures of the board surface under analysis. If the glass transition temperature difference indicates that incomplete resin curing is the cause of warping in the failed printed circuit board, then simulated hot pressing and simulated reflow methods can be used to verify whether incomplete resin curing is the root cause of warping in the failed printed circuit board.

[0080] The first target temperature is higher than the second target temperature. The first target temperature and the second target temperature are respectively a high temperature and a low temperature during the heating process of the plate to be analyzed; the values ​​of the first target temperature and the second target temperature are determined by the material used for the plate to be analyzed.

[0081] Specifically, thermal analysis is used to measure the difference in glass transition temperature between the first target temperature and the second target temperature of the board surface under analysis. If the difference in glass transition temperature between the first target temperature and the second target temperature is greater than 3°C, then incomplete resin curing is determined to be the cause of warping in the failed printed circuit board. Furthermore, simulated hot pressing and simulated reflow methods are used to analyze the board surface under analysis. If the warping of the board surface under analysis is significantly improved, then incomplete resin curing is the root cause of warping in the failed printed circuit board.

[0082] It should be noted that the global warping causes in this application include four types: uneven conductor arrangement, uneven insulation thickness, incomplete resin curing, and abnormal fiberglass arrangement. For each of these four causes, the board surface to be analyzed to determine the root cause of the warping phenomenon in the failed printed circuit board. Optionally, the root cause of the warping phenomenon in the failed printed circuit board may include one or more of the following: uneven conductor arrangement, uneven insulation thickness, incomplete resin curing, and abnormal fiberglass arrangement.

[0083] This embodiment provides an optional method for determining the root cause of warping in a failed printed circuit board.

[0084] In one embodiment, such as Figure 3 As shown, the specific process for determining the type of warpage in a failed printed circuit board includes:

[0085] S301 uses a three-dimensional measuring machine to measure the first coplanarity of the failed printed circuit board and the second coplanarity of the effective printed circuit board.

[0086] S302, based on the first coplanarity and the second coplanarity, determine the warping type of the failed printed circuit board exhibiting warping.

[0087] In this context, "three-dimensional" refers to a coordinate measuring machine (CMM). Coplanarity is the difference between the surface unevenness and the absolute level of a printed circuit board (PCB). The first coplanarity refers to the coplanarity of a failed PCB. A valid PCB is one that has not experienced warping. The second coplanarity is the coplanarity of a valid PCB.

[0088] Specifically, a three-dimensional coordinate measuring machine is used to measure the first coplanarity of the failed printed circuit board and the second coplanarity of the valid printed circuit board. Furthermore, a coplanarity simulation diagram of the failed printed circuit board can be drawn based on the difference between the first and second coplanarities. If the coplanarity simulation diagram shows the edge of the failed printed circuit board...

[0089] A large coplanarity difference indicates that the warping type of the failed printed circuit board is bowing; 5. If the coplanarity simulation diagram shows a large coplanarity difference across the diagonals of the failed printed circuit board, then the failure can be identified as bowing.

[0090] The type of warping that occurs on printed circuit boards is twisting.

[0091] In this embodiment, an optional method is provided to determine the type of warpage in a failed printed circuit board.

[0092] 0. In one embodiment, this application also provides an optional example of a printed circuit board warpage analysis method. Combined with Figure 4As shown, the specific process includes:

[0093] S401, obtain basic information about the failed printed circuit board that exhibits warping.

[0094] The basic information includes the circuit distribution diagram of the failed printed circuit board, the stage and type of warping of the failed printed circuit board, and at least one of the application environments of the failed printed circuit board; 5 Optionally, the first coplanarity of the failed printed circuit board and the second coplanarity of the effective printed circuit board can be measured using a three-dimensional coordinate measuring machine; based on the first and second coplanarities, the warping type of the failed printed circuit board is determined.

[0095] S402, based on the basic information, supplement the existing warping causes to obtain the global warping causes.

[0096] S403, determine the cutting location based on the type of warpage.

[0097] 0S404, based on the cutting position, the failed printed circuit board is cut to obtain the board surface to be analyzed.

[0098] S405, based on the global warping cause, analyze the board surface to be analyzed to determine the root cause of the warping phenomenon in the failed printed circuit board.

[0099] The causes of global warping include at least one of the following: uneven conductor arrangement, uneven insulation thickness, incomplete resin curing, and abnormal fiberglass arrangement.

[0100] 5. Optionally, a metallographic microscope can be used to determine whether the thickness of the insulating medium on the surface of the board to be analyzed is uniform; if

[0101] If not, then the uneven thickness of the insulating medium is determined to be the root cause of warping in the failed printed circuit board.

[0102] Determine whether the fiberglass layers on the board to be analyzed are skewed; if so, the abnormal fiberglass arrangement is determined to be the cause of the warping phenomenon in the failed printed circuit board. Use the heating and reverse pressure method to verify whether the abnormal fiberglass arrangement is the root cause of the warping phenomenon in the failed printed circuit board.

[0103] The glass transition temperature difference between a first target temperature and a second target temperature is determined using thermal analysis. The first target temperature is higher than the second target temperature. If, based on the glass transition temperature difference, incomplete resin curing is determined to be the cause of warping in the failed printed circuit board, simulated hot pressing and simulated reflow are used to verify whether incomplete resin curing is the root cause of warping in the failed printed circuit board.

[0104] The specific processes of S401-S405 described above can be found in the description of the above method embodiments. Their implementation principles and technical effects are similar, and will not be repeated here.

[0105] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0106] Based on the same inventive concept, this application also provides a printed circuit board warpage analysis device for implementing the printed circuit board warpage analysis method described above. The solution provided by this device is similar to the solution described in the above method; therefore, the specific limitations of one or more printed circuit board warpage analysis device embodiments provided below can be found in the limitations of the printed circuit board warpage analysis method described above, and will not be repeated here.

[0107] In one embodiment, such as Figure 5 As shown, a printed circuit board warpage analysis device 1 is provided, comprising: an acquisition module 10, a supplementation module 20, and a determination module 30, wherein:

[0108] The acquisition module 10 is used to acquire basic information of the failed printed circuit board that exhibits warping; wherein, the basic information includes the circuit distribution diagram of the failed printed circuit board, the stage and type of warping of the failed printed circuit board, and at least one of the application environments of the failed printed circuit board.

[0109] Supplementary module 20 is used to supplement existing warping causes based on basic information to obtain global warping causes;

[0110] Module 30 is used to determine the root cause of warping in the failed printed circuit board based on the global warping cause.

[0111] In one embodiment, such as Figure 6 As shown, above Figure 5 The determination module 30 in the middle may specifically include:

[0112] The first determining unit 31 is used to determine the cutting position according to the warping type;

[0113] The second determining unit 32 is used to cut the failed printed circuit board according to the cutting position to obtain the board surface to be analyzed.

[0114] The third determining unit 33 is used to analyze the board surface to be analyzed based on the global warping cause, and to determine the root cause of the warping phenomenon in the failed printed circuit board; wherein, the global warping cause includes at least one of the following: uneven conductor arrangement, uneven insulation dielectric thickness, incomplete resin curing, and abnormal glass fiber arrangement.

[0115] In one embodiment, the third determining unit 33 is specifically used for:

[0116] Metallurgical microscopes were used to determine whether the thickness of the insulating medium on the board surface to be analyzed was uniform; if not, the uneven thickness of the insulating medium was determined to be the root cause of the warping phenomenon in the failed printed circuit board.

[0117] In one embodiment, the third determining unit 33 is further configured to:

[0118] Determine whether the fiberglass layers on the board to be analyzed are skewed; if so, the abnormal fiberglass arrangement is determined to be the cause of the warping phenomenon in the failed printed circuit board. Use the heating and reverse pressure method to verify whether the abnormal fiberglass arrangement is the root cause of the warping phenomenon in the failed printed circuit board.

[0119] In one embodiment, the third determining unit 33 is further configured to:

[0120] The glass transition temperature difference between the first target temperature and the second target temperature of the board surface under analysis is determined by thermal analysis. The first target temperature is higher than the second target temperature. If the glass transition temperature difference indicates that incomplete resin curing is the cause of warping in the failed printed circuit board, then simulated hot pressing and simulated reflow are used to verify whether incomplete resin curing is the root cause of warping in the failed printed circuit board.

[0121] In one embodiment, the printed circuit board warpage analysis device 1 is further used for:

[0122] The first coplanarity of the failed printed circuit board and the second coplanarity of the effective printed circuit board are measured using a three-dimensional measuring machine. Based on the first and second coplanarities, the warping type of the failed printed circuit board is determined.

[0123] Each module in the aforementioned printed circuit board warpage analysis device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in a computer device, or stored in the memory of a computer device as software, so that the processor can call and execute the corresponding operations of each module.

[0124] In one embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as follows: Figure 7 As shown, the computer device includes a processor, memory, and a network interface connected via a system bus. The processor provides computational and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores an operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The database stores printed circuit board (PCB) warpage analysis data. The network interface communicates with external terminals via a network connection. When executed by the processor, the computer program implements a PCB warpage analysis method.

[0125] Those skilled in the art will understand that Figure 7 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0126] In one embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0127] Obtain basic information about the failed printed circuit board exhibiting warping; the basic information includes the circuit layout of the failed printed circuit board, the stage and type of warping of the failed printed circuit board, and at least one of the application environments of the failed printed circuit board.

[0128] Based on the basic information, the existing causes of warping are supplemented to obtain the global causes of warping;

[0129] Based on the overall warping cause, the root cause of the warping phenomenon in the failed printed circuit board was determined.

[0130] In one embodiment, when the processor executes the logic in the computer program that determines the root cause of the warping phenomenon in the failed printed circuit board based on the global warping cause, the following steps are specifically implemented:

[0131] Based on the type of warpage, determine the cutting location; based on the cutting location, cut the failed printed circuit board to obtain the board surface to be analyzed; based on the cause of global warpage, analyze the board surface to be analyzed to determine the root cause of the warpage phenomenon in the failed printed circuit board; among which, the cause of global warpage includes at least one of the following: uneven conductor arrangement, uneven insulation dielectric thickness, incomplete resin curing, and abnormal glass fiber arrangement.

[0132] In one embodiment, when the processor executes the logic in the computer program that analyzes the board surface to be analyzed based on the global warping cause and determines the root cause of the warping phenomenon in the failed printed circuit board, the following steps are specifically implemented:

[0133] Metallurgical microscopes were used to determine whether the thickness of the insulating medium on the board surface to be analyzed was uniform; if not, the uneven thickness of the insulating medium was determined to be the root cause of the warping phenomenon in the failed printed circuit board.

[0134] In one embodiment, when the processor executes the logic in the computer program that analyzes the board surface to be analyzed based on the global warping cause and determines the root cause of the warping phenomenon in the failed printed circuit board, the following steps are specifically implemented:

[0135] Determine whether the fiberglass layers on the board to be analyzed are skewed; if so, the abnormal fiberglass arrangement is determined to be the cause of the warping phenomenon in the failed printed circuit board. Use the heating and reverse pressure method to verify whether the abnormal fiberglass arrangement is the root cause of the warping phenomenon in the failed printed circuit board.

[0136] In one embodiment, when the processor executes the logic in the computer program that analyzes the board surface to be analyzed based on the global warping cause and determines the root cause of the warping phenomenon in the failed printed circuit board, the following steps are specifically implemented:

[0137] The glass transition temperature difference between the first target temperature and the second target temperature of the board surface under analysis is determined by thermal analysis. The first target temperature is higher than the second target temperature. If the glass transition temperature difference indicates that incomplete resin curing is the cause of warping in the failed printed circuit board, then simulated hot pressing and simulated reflow are used to verify whether incomplete resin curing is the root cause of warping in the failed printed circuit board.

[0138] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0139] The first coplanarity of the failed printed circuit board and the second coplanarity of the effective printed circuit board are measured using a three-dimensional measuring machine. Based on the first and second coplanarities, the warping type of the failed printed circuit board is determined.

[0140] The principles and specific processes of implementing the computer equipment provided above in each embodiment can be found in the description of the printed circuit board warpage analysis method in the foregoing embodiments, and will not be repeated here.

[0141] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, the computer program performing the following steps when executed by a processor:

[0142] Obtain basic information about the failed printed circuit board exhibiting warping; the basic information includes the circuit layout of the failed printed circuit board, the stage and type of warping of the failed printed circuit board, and at least one of the application environments of the failed printed circuit board.

[0143] Based on the basic information, the existing causes of warping are supplemented to obtain the global causes of warping;

[0144] Based on the overall warping cause, the root cause of the warping phenomenon in the failed printed circuit board was determined.

[0145] In one embodiment, when the logic in the computer program that determines the root cause of the warping phenomenon in the failed printed circuit board based on the global warping cause is executed by the processor, the following steps are specifically implemented:

[0146] Based on the type of warpage, determine the cutting location; based on the cutting location, cut the failed printed circuit board to obtain the board surface to be analyzed; based on the cause of global warpage, analyze the board surface to be analyzed to determine the root cause of the warpage phenomenon in the failed printed circuit board; among which, the cause of global warpage includes at least one of the following: uneven conductor arrangement, uneven insulation dielectric thickness, incomplete resin curing, and abnormal glass fiber arrangement.

[0147] In one embodiment, when the logic in the computer program that analyzes the board surface to be analyzed based on the global warping cause and determines the root cause of the warping phenomenon in the failed printed circuit board is executed by the processor, the following steps are specifically implemented:

[0148] Metallurgical microscopes were used to determine whether the thickness of the insulating medium on the board surface to be analyzed was uniform; if not, the uneven thickness of the insulating medium was determined to be the root cause of the warping phenomenon in the failed printed circuit board.

[0149] In one embodiment, when the logic in the computer program that analyzes the board surface to be analyzed based on the global warping cause and determines the root cause of the warping phenomenon in the failed printed circuit board is executed by the processor, the following steps are specifically implemented:

[0150] Determine whether the fiberglass layers on the board to be analyzed are skewed; if so, the abnormal fiberglass arrangement is determined to be the cause of the warping phenomenon in the failed printed circuit board. Use the heating and reverse pressure method to verify whether the abnormal fiberglass arrangement is the root cause of the warping phenomenon in the failed printed circuit board.

[0151] In one embodiment, when the logic in the computer program that analyzes the board surface to be analyzed based on the global warping cause and determines the root cause of the warping phenomenon in the failed printed circuit board is executed by the processor, the following steps are specifically implemented:

[0152] The glass transition temperature difference between the first target temperature and the second target temperature of the board surface under analysis is determined by thermal analysis. The first target temperature is higher than the second target temperature. If the glass transition temperature difference indicates that incomplete resin curing is the cause of warping in the failed printed circuit board, then simulated hot pressing and simulated reflow are used to verify whether incomplete resin curing is the root cause of warping in the failed printed circuit board.

[0153] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0154] The first coplanarity of the failed printed circuit board and the second coplanarity of the effective printed circuit board are measured using a three-dimensional measuring machine. Based on the first and second coplanarities, the warping type of the failed printed circuit board is determined.

[0155] The principles and specific processes of implementing the computer-readable storage medium provided above can be found in the description of the printed circuit board warpage analysis method in the foregoing embodiments, and will not be repeated here.

[0156] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, performs the following steps:

[0157] Obtain basic information about the failed printed circuit board exhibiting warping; the basic information includes the circuit layout of the failed printed circuit board, the stage and type of warping of the failed printed circuit board, and at least one of the application environments of the failed printed circuit board.

[0158] Based on the basic information, the existing causes of warping are supplemented to obtain the global causes of warping;

[0159] Based on the overall warping cause, the root cause of the warping phenomenon in the failed printed circuit board was determined.

[0160] In one embodiment, when the logic in the computer program that determines the root cause of the warping phenomenon in the failed printed circuit board based on the global warping cause is executed by the processor, the following steps are specifically implemented:

[0161] Based on the type of warpage, determine the cutting location; based on the cutting location, cut the failed printed circuit board to obtain the board surface to be analyzed; based on the cause of global warpage, analyze the board surface to be analyzed to determine the root cause of the warpage phenomenon in the failed printed circuit board; among which, the cause of global warpage includes at least one of the following: uneven conductor arrangement, uneven insulation dielectric thickness, incomplete resin curing, and abnormal glass fiber arrangement.

[0162] In one embodiment, when the logic in the computer program that analyzes the board surface to be analyzed based on the global warping cause and determines the root cause of the warping phenomenon in the failed printed circuit board is executed by the processor, the following steps are specifically implemented:

[0163] Metallurgical microscopes were used to determine whether the thickness of the insulating medium on the board surface to be analyzed was uniform; if not, the uneven thickness of the insulating medium was determined to be the root cause of the warping phenomenon in the failed printed circuit board.

[0164] In one embodiment, when the logic in the computer program that analyzes the board surface to be analyzed based on the global warping cause and determines the root cause of the warping phenomenon in the failed printed circuit board is executed by the processor, the following steps are specifically implemented:

[0165] Determine whether the fiberglass layers on the board to be analyzed are skewed; if so, the abnormal fiberglass arrangement is determined to be the cause of the warping phenomenon in the failed printed circuit board. Use the heating and reverse pressure method to verify whether the abnormal fiberglass arrangement is the root cause of the warping phenomenon in the failed printed circuit board.

[0166] In one embodiment, when the logic in the computer program that analyzes the board surface to be analyzed based on the global warping cause and determines the root cause of the warping phenomenon in the failed printed circuit board is executed by the processor, the following steps are specifically implemented:

[0167] The glass transition temperature difference between the first target temperature and the second target temperature of the board surface under analysis is determined by thermal analysis. The first target temperature is higher than the second target temperature. If the glass transition temperature difference indicates that incomplete resin curing is the cause of warping in the failed printed circuit board, then simulated hot pressing and simulated reflow are used to verify whether incomplete resin curing is the root cause of warping in the failed printed circuit board.

[0168] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0169] The first coplanarity of the failed printed circuit board and the second coplanarity of the effective printed circuit board are measured using a three-dimensional measuring machine. Based on the first and second coplanarities, the warping type of the failed printed circuit board is determined.

[0170] The principles and specific processes of the computer program products provided above in implementing each embodiment can be found in the description of the printed circuit board warpage analysis method in the foregoing embodiments, and will not be repeated here.

[0171] It should be noted that the basic information of the failed printed circuit boards involved in this application is all information that has been authorized or fully authorized by all parties.

[0172] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments described above. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0173] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0174] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for analyzing warpage of printed circuit boards, characterized in that, The method includes: Obtain basic information about the failed printed circuit board exhibiting warping; wherein, the basic information includes at least one of the following: the circuit layout diagram of the failed printed circuit board, the stage and type of warping of the failed printed circuit board, and the application environment of the failed printed circuit board. Based on the aforementioned basic information, the existing causes of warping are supplemented to obtain the global causes of warping; wherein, the global causes of warping include at least one of the following: uneven conductor arrangement, uneven insulation dielectric thickness, incomplete resin curing, and abnormal fiberglass arrangement. Based on the warpage type, the cutting position is determined. If the warpage type is bowing, the cutting position is determined to be the edge of the failed printed circuit board. If the warpage type is twisting, the cutting position is determined to be the diagonal position of the failed printed circuit board. The failed printed circuit board is cut according to the cutting position to obtain the board surface to be analyzed; If the cause of global warping includes abnormal fiberglass arrangement, the weft skew of each layer of fiberglass cloth is measured under a microscope and compared with the standard requirement value. If the weft skew exceeds the standard requirement value, the abnormal fiberglass arrangement is determined to be the cause of warping in the failed printed circuit board. If the board surface to be analyzed still warps again after being heated and reverse-pressed, the abnormal fiberglass arrangement is determined to be the root cause of warping in the failed printed circuit board. And / or, if the cause of the global warpage includes incomplete resin curing, then the difference in glass transition temperature between the first target temperature and the second target temperature of the surface to be analyzed is determined by thermal analysis; when the difference is greater than 3... If the incomplete curing of the resin is determined to be the cause of the warping phenomenon in the failed printed circuit board, the board surface to be analyzed is analyzed by simulating hot pressing and simulating reflow. If the warping phenomenon of the board surface to be analyzed is significantly improved, then the incomplete curing of the resin is determined to be the root cause of the warping phenomenon in the failed printed circuit board. Wherein, the first target temperature is higher than the second target temperature.

2. The method according to claim 1, characterized in that, The step of analyzing the board surface to be analyzed based on the global warping cause to determine the root cause of the warping phenomenon in the failed printed circuit board includes: A metallographic microscope was used to determine whether the thickness of the insulating medium on the surface of the plate to be analyzed was uniform. If not, then the uneven thickness of the insulating medium is determined to be the root cause of the warping phenomenon in the failed printed circuit board.

3. The method according to claim 1, characterized in that, The step of analyzing the board surface to be analyzed based on the global warping cause to determine the root cause of the warping phenomenon in the failed printed circuit board includes: Determine whether each layer of glass fiber on the board to be analyzed is skewed; If so, the abnormal fiberglass arrangement is determined to be the cause of the warping phenomenon in the failed printed circuit board. The heating and reverse pressure method is used to verify whether the abnormal fiberglass arrangement is the root cause of the warping phenomenon in the failed printed circuit board.

4. The method according to claim 1, characterized in that, The method further includes: The first coplanarity of the failed printed circuit board and the second coplanarity of the effective printed circuit board were measured using a three-dimensional measuring machine. Based on the first coplanarity and the second coplanarity, the warping type of the failed printed circuit board is determined.

5. A printed circuit board warpage analysis device, characterized in that, The device includes: The acquisition module is used to acquire basic information of the failed printed circuit board that exhibits warping; wherein, the basic information includes at least one of the following: the circuit distribution diagram of the failed printed circuit board, the stage and type of warping of the failed printed circuit board, and the application environment of the failed printed circuit board. The supplementary module is used to supplement the existing warping causes based on the basic information to obtain the global warping causes; wherein, the global warping causes include at least one of the following: uneven conductor arrangement, uneven insulation dielectric thickness, incomplete resin curing, and abnormal glass fiber arrangement. The determination module is used to determine the cutting position based on the warpage type. If the warpage type is bowing, the cutting position is determined to be the edge of the failed printed circuit board; if the warpage type is twisting, the cutting position is determined to be the diagonal position of the failed printed circuit board. Based on the cutting position, the failed printed circuit board is cut to obtain the board surface to be analyzed. If the cause of the global warpage includes abnormal fiberglass arrangement, the weft skew of each layer of fiberglass cloth is measured under a microscope and compared with standard requirements. If the weft skew... If the value exceeds the standard requirement, the abnormal fiberglass arrangement is determined to be the cause of the warping phenomenon in the failed printed circuit board; if the surface of the board to be analyzed still warps again after being heated and reverse-pressed, the abnormal fiberglass arrangement is determined to be the root cause of the warping phenomenon in the failed printed circuit board; and / or, if the cause of the global warping includes incomplete resin curing, the glass transition temperature difference between the first target temperature and the second target temperature of the surface of the board to be analyzed is determined by thermal analysis; when the difference is greater than 3... If the incomplete curing of the resin is determined to be the cause of the warping phenomenon in the failed printed circuit board, the board surface to be analyzed is analyzed by simulating hot pressing and simulating reflow. If the warping phenomenon of the board surface to be analyzed is significantly improved, then the incomplete curing of the resin is determined to be the root cause of the warping phenomenon in the failed printed circuit board. Wherein, the first target temperature is higher than the second target temperature.

6. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 4.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 4.

8. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 4.

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