晶圆对中检测装置、等离子体处理系统及方法
By using a carrier disk and electrode detection device, the problem of wafer neutrality shift during plasma processing was solved, enabling non-destructive testing and alignment, and improving production efficiency and accuracy.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ADVANCED MICRO FAB EQUIP INC CHINA
- Filing Date
- 2021-10-09
- Publication Date
- 2026-07-17
AI Technical Summary
In existing technologies, wafers are often misaligned with electrostatic chucks during plasma processing due to repeated handling, which affects the etching effect. Furthermore, manual inspection has large errors and contaminates the reaction chamber, reducing production efficiency.
Using a carrier disk and multiple electrodes, the alignment between the wafer and the electrostatic chuck is detected by capacitance value. Existing electrostatic electrodes are used to achieve detection and alignment without opening the cavity. The carrier disk position is adjusted in conjunction with the computing unit.
This technology enables precise detection and alignment of the wafer and electrostatic chuck without opening the reaction chamber, avoiding damage and contamination of the vacuum environment and reducing detection difficulty and time costs.
Smart Images
Figure CN115966499B_ABST