Method of manufacturing an electronic device

Abstract

The present invention provides a method for manufacturing an electronic device, comprising providing a first substrate, the first substrate including a circuit layer and an electronic component disposed on the circuit layer. The manufacturing method further comprises providing a second substrate, bonding the first substrate and the second substrate to form an electronic module, dicing the electronic module, forming a circuit on a first surface exposed after dicing and a second surface of the electronic module, the first surface being adjacent to the second surface, the circuit being electrically connected to the circuit layer, and disposing a driving element on the second surface of the electronic module, the driving element being electrically connected to the circuit.

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