Display panel and its manufacturing method, display device

Abstract

This application relates to a display panel, its manufacturing method, and a display device. The display panel includes at least two display units, each display unit comprising a splicing area and a non-splicing area. The splicing areas of the at least two display units are spliced ​​together to form a splicing auxiliary area. Each display unit also includes signal lines, and the splicing area is provided with signal pads electrically connected to the signal lines. A bridging wire is disposed in the splicing auxiliary area and electrically connected to the signal pads in two adjacent splicing areas, thereby connecting the signal lines of the two display units. This application can solve the problem of high cost of display panels.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] In recent years, in order to realize large-size display panels, the concept and application of splicing multiple small-size display panels have gradually emerged. However, the signal lines of each small-size display panel in the spliced ​​large-size display panel are independent of each other, and each small-size display panel needs to be driven independently. This requires configuring a drive circuit for each small-size display panel, resulting in high costs. Summary of the Invention

[0003] This application provides a display panel, a method for manufacturing the same, and a display device, which can solve the problem of high cost of display panels.

[0004] In a first aspect, according to an embodiment of this application, a display panel is provided, including at least two display units. Each display unit includes a splicing area and a non-splicing area. The splicing areas of the at least two display units are spliced ​​together to form a splicing auxiliary area. Each display unit also includes signal lines. The splicing area is provided with signal pads electrically connected to the signal lines. A bridging wire is provided in the splicing auxiliary area and electrically connected to the signal pads in two adjacent splicing areas to connect the signal lines of the two display units.

[0005] In one possible implementation of the first aspect, the display panel includes:

[0006] Substrate;

[0007] The driving device layer is located on one side of the substrate, and the signal pads are located on the side surface of the driving device layer facing away from the substrate.

[0008] Multiple conductive blocks are located on the side of the driving device layer facing away from the substrate. The conductive blocks include a first conductive block and a second conductive block. The first conductive block is provided in both the splicing area and the non-splicing area, and the second conductive block is located in the splicing area.

[0009] Multiple micro LEDs are electrically connected to the first conductive block, and the bridging wire is electrically connected to the signal pad through the second conductive block.

[0010] In one possible implementation of the first aspect, a plurality of first conductive blocks are arranged in an array in intersecting first and second directions, and second conductive blocks are located between adjacent first conductive blocks in the second direction.

[0011] In one possible implementation of the first aspect, the signal line is disposed within the driving device layer, the second conductive block is located on the side of the signal pad facing away from the substrate, and the bridging line is located on the side of the second conductive block facing away from the substrate.

[0012] In one possible implementation of the first aspect, the bridging wire is electrically connected to the signal pads within the same splicing area via a plurality of second conductive blocks.

[0013] In one possible implementation of the first aspect, the display panel further includes:

[0014] The first light-shielding layer is disposed on the side of the driving device layer facing away from the substrate and fills the spaces between adjacent conductive blocks;

[0015] The second light-shielding layer is disposed on the side of the first light-shielding layer facing away from the substrate, and fills between adjacent micro-light-emitting diodes, and covers the bridging lines.

[0016] Secondly, embodiments of this application provide a method for manufacturing a display panel, comprising:

[0017] At least two display unit substrates are provided. Each display unit substrate includes a splicing area and a non-splicing area. Each display unit substrate includes signal lines. The non-splicing area includes multiple micro light-emitting diodes. The splicing area does not have micro light-emitting diodes. The splicing area is provided with signal pads that are electrically connected to the signal lines.

[0018] At least one auxiliary splicing unit is provided, which includes bridging wires and multiple micro light-emitting diodes;

[0019] At least two display unit substrates are spliced ​​together, so that the splicing areas of the at least two display unit substrates are adjacent, and the two adjacent splicing areas constitute a splicing auxiliary area to obtain the display panel substrate;

[0020] At least one auxiliary splicing unit is spliced ​​to the display panel substrate, and the bridging wire is electrically connected to the signal pads of the splicing auxiliary area to obtain the display panel.

[0021] In one possible implementation of the first aspect, the method further includes, prior to providing at least two display unit substrates:

[0022] Prepare at least two display unit substrates;

[0023] The steps for preparing the display unit substrate include:

[0024] A driving device layer is formed on one side of the substrate, and the driving device layer includes signal lines;

[0025] Signal pads electrically connected to signal lines are formed on the surface of the splicing area and the side of the driving device layer facing away from the substrate;

[0026] A conductive block is formed on the side of the driving device layer facing away from the substrate. The conductive block includes a first conductive block and a second conductive block. The second conductive block is electrically connected to the signal pad.

[0027] Multiple micro LEDs are placed in the non-splicing area, and the micro LEDs are electrically connected to the first conductive block.

[0028] In one possible implementation of the first aspect, before arranging multiple micro-light-emitting diodes in the non-splicing area, the method further includes:

[0029] A first light-shielding layer is formed on the side of the driving device layer facing away from the substrate, and the first light-shielding layer fills the space between adjacent conductive blocks.

[0030] In one possible implementation of the first aspect, after arranging multiple micro-light-emitting diodes in the non-splicing area, the method further includes:

[0031] A first sub-shielding layer is formed in the non-splicing area and on the side of the first light-shielding layer facing away from the substrate, and the first sub-shielding layer fills the space between adjacent micro-light-emitting diodes.

[0032] In one possible implementation of the first aspect, the surface of the first conductive block facing away from the substrate and the surface of the second conductive block facing away from the substrate are in the same plane.

[0033] In one possible implementation of the first aspect, the method further includes, prior to providing at least one auxiliary splicing unit:

[0034] Prepare at least one auxiliary splicing unit;

[0035] The steps for preparing auxiliary splicing units include:

[0036] A sacrificial layer is formed on one side of the temporary substrate;

[0037] Multiple micro-light-emitting diodes are disposed on the side of the sacrificial layer facing away from the temporary substrate;

[0038] A bridging line is formed on the side of the sacrificial layer facing away from the temporary substrate.

[0039] In one possible implementation of the first aspect, before forming a bridging wire on the side of the sacrificial layer facing away from the temporary substrate, the method further includes:

[0040] A second sub-shielding layer is formed on the side of the sacrificial layer facing away from the temporary substrate, and the second sub-shielding layer fills the space between adjacent micro-light-emitting diodes;

[0041] A bridging line is formed on the side of the sacrificial layer facing away from the temporary substrate, including:

[0042] A bridging line is formed on the side of the second sub-shielding layer facing away from the temporary substrate.

[0043] In one possible implementation of the first aspect, after forming a bridging line on the side of the second sub-shielding layer facing away from the temporary substrate, the method further includes:

[0044] A third sub-shielding layer is formed on the side of the second sub-shielding layer facing away from the temporary substrate. The third sub-shielding layer exposes the electrodes of the micro-light-emitting diode and the bridging wires.

[0045] In one possible implementation of the first aspect, the surface of the third sub-shielding layer facing away from the temporary substrate, the surface of the electrode of the micro-light-emitting diode facing away from the temporary substrate, and the surface of the bridging wire facing away from the temporary substrate are on the same plane.

[0046] In one possible implementation of the first aspect, the total thickness of the second sub-shielding layer and the third sub-shielding layer is equal to the thickness of the first sub-shielding layer.

[0047] In one possible implementation of the first aspect, the sacrificial layer is adhesive.

[0048] In one possible implementation of the first aspect, the material of the sacrificial layer includes photopolymer or pyropolymer.

[0049] In one possible implementation of the first aspect, at least one auxiliary splicing unit is spliced ​​with a display panel, and a bridging wire is electrically connected to the signal pads of the two spliced ​​areas to obtain a display panel, comprising:

[0050] At least one micro LED of the auxiliary splicing unit is electrically connected to the first conductive block of the splicing auxiliary area, and the bridging wire is electrically connected to the second conductive block;

[0051] Remove the temporary substrate and sacrificial layer to obtain the display panel.

[0052] Thirdly, embodiments of this application also provide a display device, including a display panel as described in the first aspect embodiment.

[0053] According to the display panel and its manufacturing method provided in the embodiments of this application, by setting signal pads that are electrically connected to the display units in the splicing area of ​​the display units, and setting bridging lines that cross the signal pads in adjacent splicing areas in the splicing auxiliary area, the electrical connection of the signal lines of adjacent display units is realized, that is, the electrical connection of adjacent display units is realized, so that at least two display units can share a driving circuit, thereby solving the problem of high cost. Attached Figure Description

[0054] The features, advantages, and technical effects of exemplary embodiments of this application will now be described with reference to the accompanying drawings.

[0055] Figure 1 A top view schematic diagram of a display panel according to an embodiment of this application is shown;

[0056] Figure 2 Show Figure 1 Schematic cross-sectional view along the AA direction;

[0057] Figure 3 Show Figure 1 Cross-sectional view along the BB direction;

[0058] Figure 4 Show Figure 1 Cross-sectional view along the CC direction;

[0059] Figure 5 Show Figure 1 Cross-sectional view along the DD direction;

[0060] Figure 6 This is a schematic flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0061] Figure 7 This invention provides a top view of a display panel substrate according to an embodiment of the present application.

[0062] Figure 8 Show Figure 7 Cross-sectional view along the EE direction;

[0063] Figure 9 This is a top view schematic diagram of an auxiliary splicing unit provided in one embodiment of this application;

[0064] Figure 10 Show Figure 9 Cross-sectional view along the FF direction;

[0065] Figure 11 This invention provides a top view of a display panel substrate according to an embodiment of the present application.

[0066] Figure 12 This diagram illustrates the structure of an auxiliary splicing unit splicing with a display panel substrate according to an embodiment of this application.

[0067] Figure 13 A flowchart illustrating a method for manufacturing a display panel according to another embodiment of this application is shown.

[0068] Figure 14 This is a schematic flowchart illustrating the fabrication process of a display unit substrate according to an embodiment of this application;

[0069] Figures 15 to 19 This document illustrates a schematic diagram of the fabrication process of a display unit substrate according to an embodiment of the present application, showing the corresponding structural steps.

[0070] Figure 20 This is a schematic flowchart illustrating a method for manufacturing a display panel according to yet another embodiment of this application;

[0071] Figure 21 This is a schematic flowchart illustrating the fabrication process of an auxiliary splicing unit provided in one embodiment of this application;

[0072] Figure 22 This diagram illustrates the fabrication process of an auxiliary splicing unit provided in another embodiment of this application.

[0073] Figures 23 to 27 This document illustrates the structural schematic diagrams corresponding to each step in the fabrication process of the auxiliary splicing unit provided in one embodiment of this application.

[0074] Figure 28 This diagram illustrates the structure of an auxiliary splicing unit splicing with a display panel substrate according to another embodiment of this application.

[0075] In the accompanying drawings, the same parts use the same reference numerals. The drawings are not drawn to scale. Detailed Implementation

[0076] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and to exemplarily illustrate the principles of this application, and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0077] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0078] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0079] In the embodiments of this application, the term "electrical connection" can refer to a direct electrical connection between two components, or it can refer to an electrical connection between two components via one or more other components.

[0080] Various modifications and variations can be made to this application without departing from its spirit or scope, which will be apparent to those skilled in the art. Therefore, this application is intended to cover modifications and variations falling within the scope of the corresponding claims (the claimed technical solutions) and their equivalents. It should be noted that the embodiments provided in this application can be combined with each other without contradiction.

[0081] The features and exemplary embodiments of various aspects of this application will now be described in detail. Furthermore, unless otherwise specified, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.

[0082] Before describing the technical solutions provided in the embodiments of this application, in order to facilitate understanding of the embodiments of this application, this application first specifically explains the problems existing in the prior art:

[0083] For example, multiple small-sized display panels can be spliced ​​together to create a large-sized display panel. For ease of distinction, the small-sized display panels will be referred to as display units below. However, currently, the signal lines between the display units cannot be electrically connected, which means that each display unit needs to be equipped with a driving circuit. For example, each display unit needs to be equipped with a data driver chip (Source IC), a power chip (Power IC), a timing controller (Tcon), etc., which consumes a lot of circuit materials and results in high costs.

[0084] Therefore, based on the aforementioned technical problems, this application provides a new display panel and its manufacturing method, as well as a display device, which can electrically connect the signal lines of at least two display units, allowing at least two display units to share a driving circuit, thereby solving the problem of high cost.

[0085] To better understand this application, the display panel, its manufacturing method, and display device according to the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0086] like Figures 1 to 3 As shown, the display panel 100 may include at least two adjacent display units 10. Figure 1 Only two display units 10 are shown in the illustration. It is understood that the number of display units 10 included in the display panel 100 may be greater than two, such as four, ten, or one hundred. This application does not limit this. For example, multiple display units 10 in the display panel 100 may be arranged in an array.

[0087] To better distinguish Figure 1 The two adjacent display units 10 shown are hereinafter referred to as the first display unit 10a and the other as the second display unit 10b.

[0088] Each display unit 10 of the display panel 100 includes a splicing area 11 and a non-splicing area 12. The splicing area 11 of the first display unit 10a and the splicing area 11 of the second display unit 10b are adjacent to each other, and the two adjacent splicing areas 11 constitute a splicing auxiliary area 110.

[0089] Each display unit 10 of the display panel 100 includes a signal line 13. It is understood that the signal line 13 extends into the splicing area 11 and non-splicing area 12 of the display unit 10. This application does not limit the type of signal line; for example, the signal line 13 can be a scan line, a data line, a first power line (VDD, e.g., a positive power signal line), a second power line (VSS, e.g., a negative power signal line), etc.

[0090] Each display unit 10 has a splicing area 11 equipped with a signal pad 21, which is electrically connected to the signal line 13 within the display unit 10. A splicing auxiliary area 110 is equipped with a bridging wire 22, which is electrically connected to the signal pad 21 in two adjacent splicing areas 11. In other words, the bridging wire 22 spans two splicing areas, connecting the signal lines 13 of two adjacent display units 10, thus achieving electrical connection between the two adjacent display units 10. It is understood that the bridging wire 22 connects the same type of signal lines 13 in two adjacent display units 10. For example, the bridging wire 22 can electrically connect the scan lines of the first display unit 10a and the scan lines of the second display unit 10b. For another example, the bridging wire 22 can also electrically connect the data lines of the first display unit 10a and the data lines of the second display unit 10b. For yet another example, the bridging wire 22 can also electrically connect the first power line of the first display unit 10a and the first power line of the second display unit 10b. For yet another example, the bridging wire 22 can also electrically connect the second power line of the first display unit 10a and the second power line of the second display unit 10b.

[0091] For example, when the bridging wire 22 electrically connects the scan lines of the first display unit 10a and the scan lines of the second display unit 10b, the first display unit 10a and the second display unit 10b can share a scan drive circuit; when the bridging wire 22 electrically connects the data lines of the first display unit 10a and the data lines of the second display unit 10b, the first display unit 10a and the second display unit 10b can share a data driver chip (Source IC); when the bridging wire 22 electrically connects the first power line of the first display unit 10a and the first power line of the second display unit 10b, and / or when the bridging wire 22 electrically connects the second power line of the first display unit 10a and the second power line of the second display unit 10b, the first display unit 10a and the second display unit 10b can share a power chip (Power IC); when the first display unit 10a and the second display unit 10b share a scan drive circuit and a data driver chip, they can also share a timing controller (Tcon). Furthermore, when the bridging cable 22 electrically connects the first power line of the first display unit 10a to the first power line of the second display unit 10b, both ends of the first power line of either display unit can be electrically connected to the power chip, thereby enabling dual-end driving of the first power line. This improves display uniformity by mitigating the voltage drop (IR Drop) caused by the first power line. Similarly, when the bridging cable 22 electrically connects the second power line of the first display unit 10a to the second power line of the second display unit 10b, both ends of the second power line of either display unit can be electrically connected to the power chip, thereby enabling dual-end driving of the second power line. This also improves display uniformity by mitigating the voltage drop (IR Drop) caused by the second power line.

[0092] According to the display panel provided in the embodiments of this application, by setting signal pads that are electrically connected to the display units in the splicing area of ​​the display units, and setting bridging wires that cross the signal pads in adjacent splicing areas in the splicing auxiliary area, the electrical connection of the signal lines of adjacent display units is realized, that is, the electrical connection of adjacent display units is realized, so that at least two display units can share a driving circuit, thereby solving the problem of high cost.

[0093] For example, each display unit 10 has a micro-LED (Micro-Light Emitting Diode) in its splicing area 11 and non-splicing area 12, as well as a pixel driving circuit for driving the micro-LED to emit light. Signal line 13 can be electrically connected to the pixel driving circuit. In this document, "micro" LED and other "micro" devices refer to the size of the LED and the device. In some embodiments, the term "micro" refers to a device size on the scale of 1 micrometer to 100 micrometers. However, it is understood that the embodiments of this application are not limited to this, and certain aspects of the embodiments can be applied to larger or smaller sizes.

[0094] In some alternative embodiments, please continue to refer to Figure 2 or Figure 3 The display panel 100 may include a substrate 01, a driving device layer 02, multiple conductive blocks 23, and multiple micro-light-emitting diodes 03. The driving device layer 02 is located on one side of the substrate 01, and the signal pads 21 are located on the surface of the driving device layer 02 facing away from the substrate 01. Multiple conductive blocks 23 are located on the side of the driving device layer 23 facing away from the substrate 01. The conductive blocks 23 may include first conductive blocks 231 and second conductive blocks 232. First conductive blocks 231 are provided in both the splicing area 11 and the non-splicing area 12, and second conductive blocks 232 are located in the splicing area 11. The micro-light-emitting diodes 03 are electrically connected to the first conductive blocks 231, and the bridging wires 22 are electrically connected to the signal pads 21 through the second conductive blocks 232. It is understood that since both the splicing area 11 and the non-splicing area 12 are provided with first conductive blocks 231, and the first conductive blocks 231 are connected to the micro-light-emitting diodes 03, both the splicing area 11 and the non-splicing area 12 are display areas. The conductive block 23 can also be called the bonding metal layer. The electrode of the micro light-emitting diode 03 is bonded to the first conductive block 231, and the bridging line 22 is bonded to the second conductive block 232.

[0095] In this embodiment, by setting different conductive blocks to connect the micro light-emitting diode and the bridging wire respectively, signal crosstalk can be effectively avoided; in addition, the first conductive block and the second conductive block can be made of the same material, so that the first conductive block and the second conductive block can be formed simultaneously in the same process step, reducing process complexity.

[0096] In some alternative embodiments, in conjunction with reference to Figure 1 and Figure 2 Multiple first conductive blocks 231 can be arranged in an array along intersecting first and second directions Y, with second conductive blocks 232 located between adjacent first conductive blocks 231 along the second direction Y. For example, if the first direction X is a row direction and the second direction Y is a column direction, it can be understood that the first conductive blocks 231 and second conductive blocks 232 are staggered, which reduces the possibility of short circuits between the first conductive blocks 231 and second conductive blocks 232.

[0097] For example, the side of the driving device layer 02 facing away from the substrate 01 may have a recess, and the signal pad 21 may be disposed in the recess. The surface of the signal pad 21 facing away from the substrate 01 may be flush with the surface of the area outside the recess of the driving device layer 02 facing away from the substrate 01, so as to facilitate the fabrication of the first conductive block 231 and the second conductive block 232.

[0098] For example, the orthographic projection of the first conductive block 231 on the substrate 01 is spaced apart from the orthographic projection of the second conductive block 232 on the substrate 01, thereby better avoiding signal crosstalk between the first conductive block 231 and the second conductive block 232.

[0099] In addition, the orthographic projection of the signal pad 21 on the substrate 01 and the orthographic projection of the micro light-emitting diode 03 on the substrate 01 can be spaced apart, and the orthographic projection of the bridging line 22 on the substrate 01 and the orthographic projection of the micro light-emitting diode 03 on the substrate 01 can also be spaced apart.

[0100] For example, the first conductive block 231 may include a first sub-conductive block 2311 and a second sub-conductive block 2312. One of the two electrodes of the micro-light-emitting diode 03 is electrically connected to the first sub-conductive block 2311, and the other electrode is electrically connected to the second sub-conductive block 2312. The micro-light-emitting diode 03 may be a flip-chip structure.

[0101] For example, substrate 01 can be a glass substrate or a flexible substrate. For instance, substrate 01 includes polyimide (PI).

[0102] For example, each display unit 10 may include micro light-emitting diodes 03 of various colors. For instance, each display unit 10 may include a micro light-emitting diode 03R that emits red light, a micro light-emitting diode 03G that emits green light, and a micro light-emitting diode 03B that emits blue light.

[0103] The pixel driving circuit (not shown in the figure) that drives the micro light-emitting diode can be set in the driving device layer 02.

[0104] As an example, such as Figure 4As shown, the driving device layer 02 may include a semiconductor layer B, a first metal layer M1, a second metal layer M2, a third metal layer M3, and a fourth metal layer M4 stacked together. The semiconductor layer B is disposed on one side of the substrate 01. A gate insulating layer GI may be disposed between the first metal layer M1 and the semiconductor layer B. A capacitor insulating layer IMD may be disposed between the second metal layer M2 and the first metal layer M1. A first interlayer dielectric layer ILD1 may be disposed between the third metal layer M3 and the second metal layer M2. A second interlayer dielectric layer ILD2 may be disposed between the fourth metal layer M4 and the third metal layer M3. Additionally, the driving device layer 02 may also include a protective layer PVX, which covers the fourth metal layer M4 to prevent metal exposure in the driving device layer 02. The pixel driving circuit may include transistors and capacitors. The semiconductor portion (also called the active layer) of the transistor may be disposed on the semiconductor layer B. The gate of the transistor may be disposed on the first metal layer M1. Source and drain junction metals may be disposed on the third metal layer M3 and connected to the semiconductor portion of the transistor via vias. The two plates of the capacitor can be respectively disposed on the first metal layer M1 and the second metal layer M2. Of course, the film structure of the driving device layer 02 can be configured in other ways, and is not limited to these methods. Figure 4 The specific structure shown.

[0105] In some alternative embodiments, such as Figure 2 As shown, signal line 13 can be disposed within the driving device layer 02, the second conductive block 232 is located on the side of signal pad 21 facing away from substrate 01, and bridging line 22 is located on the side of second conductive block 232 facing away from substrate 01. Signal pad 21 can be electrically connected to signal line 13 through vias. In this embodiment, by disposing of signal line 13 within the driving device layer 02, exposed signal lines can be avoided, thereby reducing the possibility of signal lines being scratched.

[0106] Taking signal line 13, which includes scan line, data line, first power line (VDD), and second power line (VSS), as an example, the scan line can be set on the first metal layer M1, the data line can be set on the third metal layer M3, the first power line (VDD) can be set on the third metal layer M3, and the second power line (VSS) can be set on the fourth metal layer M4.

[0107] For example, the material of the bridging wire 22 can be the same as the electrode material of the micro LED.

[0108] In some alternative embodiments, such as Figure 5As shown, the bridging line 22 can be electrically connected to the signal pad 21 within the same splicing area 11 via multiple second conductive blocks 232. For example, the extension direction of the signal pad 21 can be the same as the extension direction of the bridging line 22, and the orthographic projection of the bridging line 22 on the substrate 01 can overlap with the orthographic projection of the signal pad 21 on the substrate 01. Multiple second conductive blocks 232 can be configured to connect the same signal pad 21 to the same bridging line 22, so that even if one of the second conductive blocks 232 is damaged, the electrical connection between the signal pad 21 and the bridging line 22 can still be achieved, meaning the electrical connection between two adjacent display units can still be achieved.

[0109] In some alternative embodiments, please continue to refer to Figure 2 or Figure 3 The display panel 100 may further include a first light-shielding layer 31 and a second light-shielding layer 32. The first light-shielding layer 31 is disposed on the side of the driving device layer 02 facing away from the substrate 01 and fills the spaces between adjacent conductive blocks 23. The first light-shielding layer 31 can be understood as an insulating layer, providing insulation between adjacent conductive blocks 23. The second light-shielding layer 32 is disposed on the side of the first light-shielding layer 31 facing away from the substrate 01 and fills the spaces between adjacent micro-light-emitting diodes 03, covering the bridging line 22. The second light-shielding layer 32 prevents light crosstalk and protects the bridging line 22. The second light-shielding layer 32 may include at least one organic material and an inorganic material. The inorganic material may include silicon oxide, silicon nitride, etc.

[0110] This application also provides a method for manufacturing a display panel, such as... Figure 6 As shown, the method for preparing a display panel provided in this application includes steps S10 to S40.

[0111] Step S10: Provide at least two display unit substrates. (Refer to reference...) Figure 7 and Figure 8 The display unit substrate 101 includes a splicing area 11 and a non-splicing area 12. The display unit substrate 101 includes a signal line 13. The non-splicing area 12 includes multiple micro light-emitting diodes 03. The splicing area 11 does not have micro light-emitting diodes. The splicing area 11 is provided with a signal pad 21 that is electrically connected to the signal line 13.

[0112] S20 provides at least one auxiliary splicing unit. (Refer to reference) Figure 9 and Figure 10 The auxiliary splicing unit 1101 includes a bridging wire 22 and multiple micro light-emitting diodes 03.

[0113] S30, which splices together at least two display unit substrates, see reference. Figure 11 This makes the splicing areas 11 of at least two display unit substrates 101 adjacent to each other, and the two adjacent splicing areas 11 form a splicing auxiliary area 110, thus obtaining the display panel substrate 1001.

[0114] S40, at least one auxiliary splicing unit 1101 is spliced ​​with the display panel substrate 1001, such as Figure 12 As shown, the bridging wire 22 is electrically connected to the signal pad 21 of the splicing auxiliary area 110, resulting in the following: Figures 1 to 3 The display panel shown is an example. Figure 12 The display panel substrate in the middle can be understood as Figure 11 Cross-sectional view along the HH direction.

[0115] The display panel manufacturing method provided in this application involves two splicing processes: first, splicing at least two display unit substrates; and second, splicing at least one auxiliary splicing unit to the display panel substrate. According to the method provided in this application, by setting signal pads electrically connected to the display units in the splicing area and bridging lines connecting the signal pads in adjacent splicing areas in the auxiliary splicing area, electrical connection of signal lines between adjacent display units is achieved. This allows at least two display units to share a single driving circuit, thus solving the problem of high cost.

[0116] In some alternative embodiments, prior to step S10, such as Figure 13 As shown, the display panel manufacturing method provided in this application embodiment may further include step S11.

[0117] Step S11: Prepare at least two display unit substrates.

[0118] For example, such as Figure 14 As shown, the steps for preparing the display unit substrate may specifically include steps S111 to S114.

[0119] Step S111, refer to Figure 15 A driving device layer 02 is formed on one side of the substrate 01, and the driving device layer 02 includes signal lines 13.

[0120] Step S112, refer to Figure 16 A signal pad 21 electrically connected to the signal line 13 is formed on the surface of the splicing area 11 and the side of the driving device layer 02 facing away from the substrate 01.

[0121] Step S113, refer to Figure 17A conductive block 23 is formed on the side of the driving device layer 02 facing away from the substrate 01. The conductive block 23 includes a first conductive block 231 and a second conductive block 232. The second conductive block 232 is electrically connected to the signal pad 21. It is understood that the second conductive block 232 is formed in the splicing area 11, and the first conductive block 231 is to be electrically connected to the micro-LED 03. Therefore, the first conductive block 231 is formed in both the splicing area 11 and the non-splicing area 12. The accompanying drawings of this application only illustrate the first conductive block 231 in the non-splicing area 12, which is not intended to limit this application.

[0122] Step S114: Multiple micro LEDs are set in the non-splicing area, and the micro LEDs are electrically connected to the first conductive block.

[0123] Optional, please continue to refer to Figure 14 Before step S114, the preparation process of the display unit substrate provided in this application embodiment may also include step S1141.

[0124] Step S1141, refer to Figure 18 A first light-shielding layer 31 can be formed on the side of the driving device layer 02 facing away from the substrate 01. The first light-shielding layer 31 fills the space between adjacent conductive blocks 23 and can insulate the adjacent conductive blocks 23 from each other.

[0125] Optionally, the surfaces of the first conductive block 231 and the second conductive block 232 facing away from the substrate 01 are on the same plane. The surface of the first light-shielding layer 31 facing away from the substrate 01 can be flush with the surface of the conductive block 23 facing away from the substrate 01, facilitating subsequent bonding of the conductive block 23 to the micro-LED and bridging wires. Optionally, the thicknesses of the first conductive block 231, the second conductive block 232, and the first light-shielding layer 31 are the same.

[0126] Optionally, a certain gap can be reserved between the conductive block 23 and the first light-shielding layer 31. During the subsequent bonding process of the micro light-emitting diode and the bridging wire to the conductive block 23, a certain pressure will be applied, which will cause the conductive block 23 to expand. If there is no gap between the conductive block 23 and the first light-shielding layer 31, the expansion of the conductive block 23 will squeeze the first light-shielding layer 31, causing the first light-shielding layer 31 to peel off from the driving device layer 02, resulting in light leakage due to reflection through the metal traces of the driving device layer 02. By reserving a certain gap between the conductive block 23 and the first light-shielding layer 31, light leakage can be improved or avoided.

[0127] In step S114, refer to Figure 19 Multiple micro LEDs 03 are set in the non-splicing area 12, so that the micro LEDs 03 are electrically connected to the first conductive block 231.

[0128] Optional, please continue to refer to Figure 14 After step S114, the preparation process of the display unit substrate provided in this application embodiment may further include step S1142.

[0129] Step S1142, refer to the above. Figure 8 A first sub-shielding layer 321 can be formed in the non-splicing area 12 and on the side of the first light-shielding layer 31 facing away from the substrate 01. The first sub-shielding layer 321 fills the spaces between adjacent micro-light-emitting diodes 03. The first sub-shielding layer 321 can prevent light crosstalk. For example, the first sub-shielding layer 321 may include at least one organic material and an inorganic material. The inorganic material may include silicon oxide, silicon nitride, etc.

[0130] In some alternative embodiments, prior to step S20, such as Figure 20 As shown, the display panel manufacturing method provided in this application embodiment may further include step S21.

[0131] Step S21: Prepare at least one auxiliary splicing unit.

[0132] For example, such as Figure 21 As shown, the steps for preparing the auxiliary splicing unit may specifically include steps S211 to S213.

[0133] Step S211, refer to Figure 23 A sacrificial layer 05 can be formed on one side of the temporary substrate 04. Exemplarily, the temporary substrate 04 has a certain load-bearing capacity. For example, the temporary substrate 04 can be a glass substrate. The sacrificial layer 05 may be adhesive to facilitate bonding the temporary substrate 04 to the subsequently fabricated micro-light-emitting diode. Optionally, the material of the sacrificial layer 05 may include photodegradable adhesive or thermally degradable adhesive; for example, the material of the sacrificial layer 05 may include PI, facilitating the subsequent removal of the temporary substrate 04 by light irradiation or thermal dissolution.

[0134] Step S212, refer to Figure 24 Multiple micro-light-emitting diodes 03 are disposed on the side of the sacrificial layer 05 facing away from the temporary substrate 04.

[0135] Step S213: A bridging line is formed on the side of the sacrificial layer facing away from the temporary substrate.

[0136] Optional, such as Figure 22 As shown, before step S213, the preparation process of the auxiliary splicing unit may also include step S2131.

[0137] Step S2131, refer to Figure 25A second sub-shielding layer 322 is formed on the side of the sacrificial layer 05 facing away from the temporary substrate 04, and the second sub-shielding layer 322 fills between adjacent micro-light-emitting diodes 03. For example, the electrodes of the micro-light-emitting diodes 03 can all be disposed facing away from the temporary substrate 04, thereby facilitating the bonding of the micro-light-emitting diodes 03 on the auxiliary splicing unit to the first conductive block on the display panel substrate.

[0138] Accordingly, step S213 forms a bridging line on the side of the sacrificial layer facing away from the temporary substrate, which may specifically include step S2130.

[0139] Step S2130, refer to Figure 26 A bridging line 22 is formed on the side of the second sub-shielding layer 322 facing away from the temporary substrate 04.

[0140] Optional, such as Figure 22 As shown, after step S2130, the preparation process of the auxiliary splicing unit may also include step S2132.

[0141] Step S2132, refer to Figure 27 A third sub-shielding layer 323 is formed on the side of the second sub-shielding layer 322 facing away from the temporary substrate 04. The third sub-shielding layer 323 exposes the electrodes of the micro light-emitting diode 03 and the bridging wire 22.

[0142] To clearly illustrate that the auxiliary splicing unit includes micro LED 03, Figure 27 It can be understood as Figure 9 Cross-sectional view along the GG direction.

[0143] Optionally, the surface of the third sub-shielding layer 323 facing away from the temporary substrate 04, the surface of the electrode of the micro-light-emitting diode 03 facing away from the temporary substrate 04, and the surface of the bridging wire 22 facing away from the temporary substrate 04 are on the same plane, which facilitates the subsequent bonding of the electrode of the micro-light-emitting diode 03 and the bridging wire 22 to each conductive block 23.

[0144] Optionally, the total thickness of the second sub-shielding layer 322 and the third sub-shielding layer 323 is equal to the thickness of the first sub-shielding layer 321. The materials of the second sub-shielding layer 322, the third sub-shielding layer 323, and the first sub-shielding layer 321 can be the same.

[0145] In some alternative embodiments, reference is made to Figure 28 Step 40 may specifically include: electrically connecting the micro-light-emitting diodes 03 of at least one auxiliary splicing unit to the first conductive block 231 of the splicing auxiliary area 110, and electrically connecting the bridging wire 22 to the second conductive block 232; removing the temporary substrate 04 and the sacrificial layer 05 to obtain the display panel. For example, Figure 28 The display panel substrate in the middle can be understood as Figure 11 Cross-sectional view along the HH direction.

[0146] For example, if the material of the sacrificial layer 05 may include photodegradable adhesive or thermal degradable adhesive, the temporary substrate 04 and the sacrificial layer 05 can be removed by light irradiation or thermal dissolution.

[0147] This application also provides a display device, which includes the display panel of any of the above embodiments. Therefore, the display device possesses the technical effects of the display panel of any of the above embodiments, which will not be described in detail here. For example, the display device can be a television, computer, or cinema screen.

[0148] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized by, include: At least two display units, each display unit includes a splicing area and a non-splicing area, the splicing areas of the at least two display units are spliced ​​together to form a splicing auxiliary area, and each display unit also includes a signal line, the splicing area being provided with a signal pad electrically connected to the signal line; A bridging cable is provided in the splicing auxiliary area and electrically connected to the signal pad so that the signal lines of the two display units are connected. The display panel also includes: Substrate; A driving device layer is located on one side of the substrate, and the signal pads are located on the side surface of the driving device layer facing away from the substrate; Multiple conductive blocks are located on the side of the driving device layer facing away from the substrate. The conductive blocks include a first conductive block and a second conductive block. The first conductive block is provided in both the splicing area and the non-splicing area. The second conductive block is located in the splicing area. The first conductive block and the second conductive block in the same display unit are formed in the same process step. Multiple micro-light-emitting diodes (LEDs) are provided. The LEDs are electrically connected to the first conductive block, and the bridging wire is electrically connected to the signal pad through the second conductive block. The LEDs and the bridging wire are located on the same surface. The LEDs in the non-slicing area are formed on the display unit substrate. The display unit substrate has a groove in the splicing area. The LEDs in the splicing area of ​​two adjacent display units and the bridging wire are formed in an auxiliary splicing unit. The auxiliary splicing unit fills the groove of the display unit substrate. The LEDs in the non-slicing area and the auxiliary splicing area are located on the same surface.

2. The display panel of claim 1, wherein, Multiple first conductive blocks are arranged in an array in intersecting first and second directions, and the second conductive blocks are located between adjacent first conductive blocks in the second direction.

3. The display panel of claim 2, wherein, The signal line is disposed within the driving device layer, the second conductive block is located on the side of the signal pad facing away from the substrate, and the bridging line is located on the side of the second conductive block facing away from the substrate.

4. The display panel according to claim 2, characterized in that, The bridging wire is electrically connected to the signal pads within the same splicing area via multiple second conductive blocks.

5. The display panel according to claim 2, characterized in that, The display panel also includes: A first light-shielding layer is disposed on the side of the driving device layer facing away from the substrate and fills the spaces between adjacent conductive blocks; The second light-shielding layer is disposed on the side of the first light-shielding layer facing away from the substrate, and fills the space between adjacent micro-light-emitting diodes and covers the bridging line.

6. A method for manufacturing a display panel, characterized in that, include: At least two display unit substrates are provided. Each display unit substrate includes a splicing area and a non-splicing area. Each display unit substrate includes signal lines. The non-splicing area includes multiple micro light-emitting diodes. The splicing area does not have micro light-emitting diodes. The splicing area is provided with signal pads that are electrically connected to the signal lines. The display unit substrate has grooves in the splicing area. At least one auxiliary splicing unit is provided, the auxiliary splicing unit including bridging wires and multiple micro light-emitting diodes; At least two of the display unit substrates are spliced ​​together, such that the splicing areas of the at least two display unit substrates are adjacent, and the two adjacent splicing areas constitute a splicing auxiliary area to obtain a display panel substrate; At least one of the auxiliary splicing units is spliced ​​to the display panel substrate, and the auxiliary splicing unit fills the groove of the display unit substrate, so that the bridging wire is electrically connected to the signal pad of the splicing auxiliary area to obtain the display panel; The display panel formed includes: Substrate; A driving device layer is located on one side of the substrate, and the signal pads are located on the side surface of the driving device layer facing away from the substrate; Multiple conductive blocks are located on the side of the driving device layer facing away from the substrate. The conductive blocks include a first conductive block and a second conductive block. The first conductive block is provided in both the splicing area and the non-splicing area. The second conductive block is located in the splicing area, and the second conductive block of the two display units is formed in the same process step. In the display panel formed by multiple micro-light-emitting diodes, the micro-light-emitting diodes are electrically connected to the first conductive block, and the bridging wire is electrically connected to the signal pad through the second conductive block. The micro-light-emitting diodes and the bridging wire are located on the same surface, and the micro-light-emitting diodes in the non-slicing area and the splicing auxiliary area are located on the same surface.

7. The method for manufacturing a display panel according to claim 6, characterized in that, Prior to providing at least two display unit substrates, the method further includes: Prepare at least two of the aforementioned display unit substrates; The steps for preparing the display unit substrate include: A driving device layer is formed on one side of the substrate, the driving device layer including the signal line; In the splicing area and on the side surface of the driving device layer facing away from the substrate, a signal pad electrically connected to the signal line is formed; A conductive block is formed on the side of the driving device layer facing away from the substrate. The conductive block includes a first conductive block and a second conductive block, and the second conductive block is electrically connected to the signal pad. Multiple micro LEDs are arranged in the non-splicing area, and the micro LEDs are electrically connected to the first conductive block.

8. The method for manufacturing a display panel according to claim 7, characterized in that, Before setting multiple micro-light-emitting diodes in the non-splicing area, the method further includes: A first light-shielding layer is formed on the side of the driving device layer facing away from the substrate, and the first light-shielding layer fills the space between adjacent conductive blocks.

9. The method for manufacturing a display panel according to claim 8, characterized in that, After setting multiple micro-light-emitting diodes in the non-splicing area, the method further includes: A first sub-shielding layer is formed in the non-splicing area on the side of the first light-shielding layer facing away from the substrate, and the first sub-shielding layer fills the space between adjacent micro-light-emitting diodes.

10. The method for manufacturing a display panel according to claim 7, characterized in that, The surfaces of the first conductive block facing away from the substrate and the second conductive block facing away from the substrate are on the same plane.

11. The method for manufacturing a display panel according to claim 9, characterized in that, Prior to providing at least one auxiliary splicing unit, the method further includes: Prepare at least one of the auxiliary splicing units; The steps for preparing the auxiliary splicing unit include: A sacrificial layer is formed on one side of the temporary substrate; Multiple micro-light-emitting diodes are disposed on the side of the sacrificial layer facing away from the temporary substrate; The bridging line is formed on the side of the sacrificial layer opposite to the temporary substrate.

12. The method for manufacturing a display panel according to claim 11, characterized in that, Before forming the bridging wire on the side of the sacrificial layer opposite to the temporary substrate, the method further includes: A second sub-shielding layer is formed on the side of the sacrificial layer facing away from the temporary substrate, and the second sub-shielding layer fills the space between adjacent micro-light-emitting diodes; The process of forming the bridging wire on the side of the sacrificial layer opposite to the temporary substrate includes: The bridging line is formed on the side of the second sub-shielding layer facing away from the temporary substrate.

13. The method for manufacturing a display panel according to claim 12, characterized in that, After forming the bridging line on the side of the second sub-shielding layer facing away from the temporary substrate, the method further includes: A third sub-shielding layer is formed on the side of the second sub-shielding layer facing away from the temporary substrate, the third sub-shielding layer exposing the electrodes of the micro-light-emitting diode and the bridging wire.

14. The method for manufacturing a display panel according to claim 13, characterized in that, The surface of the third sub-shielding layer facing away from the temporary substrate, the surface of the electrode of the micro-light-emitting diode facing away from the temporary substrate, and the surface of the bridging wire facing away from the temporary substrate are on the same plane.

15. The method for manufacturing a display panel according to claim 14, characterized in that, The total thickness of the second sub-shielding layer and the third sub-shielding layer is equal to the thickness of the first sub-shielding layer.

16. The method for manufacturing a display panel according to claim 11, characterized in that, The sacrificial layer is viscous.

17. The method for manufacturing a display panel according to claim 11, characterized in that, The material of the sacrificial layer includes photolytic adhesive or pyrolytic adhesive.

18. The method for manufacturing a display panel according to claim 11, characterized in that, The step of splicing at least one of the auxiliary splicing units with the display panel, and electrically connecting the bridging wire with the signal pads of the splicing auxiliary area to obtain the display panel, includes: At least one of the micro-light-emitting diodes of the auxiliary splicing unit is electrically connected to the first conductive block of the splicing auxiliary area, and the bridging wire is electrically connected to the second conductive block. The temporary substrate and the sacrificial layer are removed to obtain the display panel.

19. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 5.

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