Display assembly, display device comprising same and method of manufacturing the same

Abstract

A display assembly, a display device including the same, and a manufacturing method thereof are disclosed. The display assembly includes a first contact pad, a first conductive pattern, an insulating layer, a second conductive pattern, and a light emitting element. The first contact pad has a first upper surface and a first sidewall. The first conductive pattern covers the first upper surface and the first sidewall of the first contact pad, and has a second upper surface and an upper sidewall. The insulating layer covers the first conductive pattern and has an opening overlapping the second upper surface and the upper sidewall of the first conductive pattern. The second conductive pattern is located in the opening and covers the second upper surface and the upper sidewall of the first conductive pattern. The light emitting element is electrically connected to the second conductive pattern.

Description

Technical Field

[0001] This invention relates to a display component, a display device comprising the same, and a method for manufacturing the same. Background Technology

[0002] Miniature light-emitting diodes (μLEDs) are suitable for constructing the pixel structure of μLED display devices due to their low power consumption, high brightness, high resolution, and high color saturation. Current manufacturing techniques first package one or more μLED bare chips into LED components, and then transfer them to a carrier board with a pixel driving structure. This not only allows for testing of the LED components to determine their quality, but also results in a higher transfer yield for LED components compared to μLED bare chips.

[0003] Currently, before transferring LED components to the pixel carrier, a nickel / gold layer needs to be plated on the bottom copper layer of the LED component to facilitate bonding to the pads on the pixel carrier. However, since there is only planar adhesion between the bottom copper layer and the metal layers inside the LED component, the internal stress acting on the bottom copper layer during the formation of the nickel / gold layer can cause the bottom copper layer to peel off from the LED component, resulting in poor manufacturing yield. Summary of the Invention

[0004] The present invention provides a display component with improved yield.

[0005] The present invention provides a display device with improved yield.

[0006] This invention provides a method for manufacturing a display component, which has an improved manufacturing yield.

[0007] One embodiment of the present invention provides a display assembly, comprising: a first pad having a first upper surface and a first sidewall; a first conductive pattern covering the first upper surface and the first sidewall of the first pad, and the first conductive pattern having a second upper surface and an upper sidewall; an insulating layer covering the first conductive pattern and having an opening, wherein the opening overlaps the second upper surface and a portion of the upper sidewall of the first conductive pattern; a second conductive pattern located in the opening and covering the second upper surface and a portion of the upper sidewall of the first conductive pattern; and a light-emitting element electrically connected to the second conductive pattern.

[0008] In one embodiment of the present invention, the angle between the first upper surface of the first pad and the first sidewall is greater than 90°.

[0009] In one embodiment of the present invention, the first conductive pattern completely covers the first upper surface and the first sidewall of the first pad.

[0010] In one embodiment of the present invention, the angle between the second upper surface of the first conductive pattern and the upper sidewall is greater than 90°.

[0011] In one embodiment of the present invention, the angle between the second sidewall of the opening and the bottom surface of the opening is greater than 90°.

[0012] In one embodiment of the present invention, the second upper surface of the first conductive pattern completely overlaps the bottom surface of the second conductive pattern.

[0013] In one embodiment of the present invention, the display component described above includes a plurality of light-emitting elements, and the plurality of light-emitting elements emit the same color light or different colors of light.

[0014] In one embodiment of the present invention, the display component further includes a light-shielding layer surrounding a plurality of light-emitting elements.

[0015] In one embodiment of the present invention, the display component further includes an encapsulation layer covering a plurality of light-emitting elements.

[0016] In one embodiment of the present invention, the display component further includes a color conversion layer located between the light-emitting element and the encapsulation layer.

[0017] One embodiment of the present invention provides a display device, comprising: a back plate having a plurality of second pads disposed on its surface; and a plurality of the above-described display components, each electrically connected to the plurality of second pads.

[0018] In one embodiment of the present invention, the plurality of first pads of the plurality of display components are electrically connected to the plurality of second pads respectively.

[0019] One embodiment of the present invention provides a method for manufacturing a display component, comprising: forming an insulating pattern on a carrier plate; forming a first conductive pattern on the insulating pattern; forming an insulating layer having an opening on the first conductive pattern and the carrier plate, wherein the opening exposes a second upper surface and an upper sidewall of the first conductive pattern; forming a second conductive pattern in the opening, wherein the second conductive pattern covers the second upper surface and a portion of the upper sidewall of the first conductive pattern; removing the carrier plate and the insulating pattern to expose a lower surface and a lower sidewall of the first conductive pattern; and forming a first pad on the lower surface and a lower sidewall of the first conductive pattern.

[0020] In one embodiment of the present invention, the angle between the upper surface of the insulating pattern and the sidewall of the insulating pattern is greater than 90°.

[0021] In one embodiment of the present invention, the process of "forming a first conductive pattern on an insulating pattern" further includes: forming a release layer on the insulating pattern and a carrier plate; and forming a metal layer on the release layer.

[0022] In one embodiment of the present invention, the above-mentioned "removal of carrier plate and insulating pattern" includes: separating the release layer and the metal layer; and removing the metal layer.

[0023] In one embodiment of the present invention, the step of "forming a second conductive pattern in the opening" further includes: performing a surface treatment on the second conductive pattern to form a surface treatment film on the second conductive pattern.

[0024] In one embodiment of the present invention, the surface treatment film described above includes nickel / gold, palladium / gold, pad solder, or electroless nickel-palladium immersion gold.

[0025] In one embodiment of the present invention, the process of "removing the carrier plate and insulating pattern" is further included before: setting a light-emitting element on the insulating layer, and the light-emitting element is electrically connected to the second conductive pattern.

[0026] In one embodiment of the present invention, before or after the above-mentioned "setting the light-emitting element on the insulating layer" the method further includes: forming a light-shielding layer on the insulating layer, wherein the orthogonal projection of the light-shielding layer on the insulating layer is outside the orthogonal projection of the light-emitting element on the insulating layer.

[0027] To make the above features and advantages of the present invention more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings. Attached Figure Description

[0028] Figures 1A to 1J This is a cross-sectional schematic diagram of the steps of a method for manufacturing a display component 100 according to an embodiment of the present invention;

[0029] Figure 2A This is a top view of a display component 100 according to an embodiment of the present invention;

[0030] Figure 2B yes Figure 2A A bottom view of the display component 100;

[0031] Figure 3 This is a cross-sectional schematic diagram of the manufacturing process of a display device 10 according to an embodiment of the present invention.

[0032] Symbol Explanation

[0033] 10: Display device

[0034] 12: Back panel

[0035] 14: Connecting pad

[0036] 100: Display Component

[0037] 102: Carrier board

[0038] 104: Insulation Pattern

[0039] 104B: Lower surface

[0040] 104S: Sidewall

[0041] 104T: Upper surface

[0042] 106: Release layer

[0043] 108: Metal layer

[0044] 110, 110A, 110B, 110C, 110D: Conductive patterns

[0045] 110BH, 110BL: Lower surface

[0046] 110BS: Lower sidewall

[0047] 110TH, 110TL: Upper surface

[0048] 110TS: Upper sidewall

[0049] 112: Insulation layer

[0050] 112B: Lower surface

[0051] 112T: Upper surface

[0052] 114, 115, 118O, 126O: Opening

[0053] 114B: Bottom surface

[0054] 114S: Sidewall

[0055] 116, 116A, 116B, 116C, 116D: Conductive patterns

[0056] 116L: Bottom

[0057] 117: Groove

[0058] 118: Light-shielding layer

[0059] 119: Surface treatment film

[0060] 119T: Upper surface

[0061] 120, 120A, 120B, 120C: Light-emitting elements

[0062] 121: First electrode

[0063] 122: Second electrode

[0064] 123: Light-emitting body

[0065] 126: Isolation Structure

[0066] 128: Color Conversion Layer

[0067] 130: Encapsulation layer

[0068] 132, 132A, 132B, 132C, 132D: Sealing pads

[0069] 132S: Sidewall

[0070] 132T: Upper surface

[0071] A-A': Section line

[0072] D1, D2: Vertical spacing

[0073] W1: Size

[0074] W2: Size

[0075] θ1, θ2, θ3, θ4: included angles Detailed Implementation

[0076] In the accompanying drawings, the thicknesses of layers, films, panels, regions, etc., are enlarged for clarity. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it may be directly on or connected to the other element, or intermediate elements may also be present. Conversely, when an element is referred to as being "directly on" or "directly connected" to another element, no intermediate elements are present. As used herein, "connection" can refer to a physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" may refer to the presence of other elements between two elements.

[0077] It should be understood that although the terms "first," "second," "third," etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or part from another. Therefore, the first "element," "component," "region," "layer," or "part" discussed below may be referred to as a second element, component, region, layer, or part without departing from the teachings of this document.

[0078] The terminology used herein is for the purpose of describing particular embodiments only and is not restrictive. As used herein, unless the content clearly indicates otherwise, the singular forms "a," "an," and "the" are intended to include the plural forms, including "at least one" or indicating "and / or." As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. It should also be understood that, when used in this specification, the terms "comprising" and / or "including" specify the presence of the stated features, areas, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, areas, integrals, steps, operations, elements, components, and / or combinations thereof.

[0079] Furthermore, relative terms such as "down" or "bottom" and "up" or "top" may be used herein to describe the relationship between one element and another, as illustrated in the figures. It should be understood that relative terms are intended to include different orientations of the device beyond those shown in the figures. For example, if a device in one figure is flipped, an element described as being "down" of another element will be oriented "up" of that element. Thus, the exemplary term "down" can include both "down" and "up" orientations, depending on the specific orientation of the figure. Similarly, if a device in one figure is flipped, an element described as being "down" or "below" of another element will be oriented "above" that element. Thus, the exemplary terms "down" or "below" can include both "up" and "down" orientations.

[0080] Given the specific number of measurements discussed and the associated errors (i.e., limitations of the measurement system), the terms "about," "approximately," or "substantially" as used herein include the value and the average value within an acceptable range of deviations from the specific value as determined by one of ordinary skill in the art. For example, "about" may mean within one or more standard deviations of the value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the terms "about," "approximately," or "substantially" as used herein may be chosen based on optical, etched, or other properties to select a more acceptable range of deviations or standard deviations, rather than applying a single standard deviation to all properties.

[0081] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology and this invention, and will not be interpreted as having idealized or overly formal meanings unless expressly defined herein.

[0082] This document describes exemplary embodiments with reference to cross-sectional views, which are schematic diagrams of idealized embodiments. Therefore, variations in shape as a result of, for example, manufacturing techniques and / or tolerances, are expected in the illustrations. Consequently, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but rather include, for example, shape deviations caused by manufacturing processes. For example, regions shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, the acute angles shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to show the precise shapes of the regions, nor are they intended to limit the scope of the claims.

[0083] Figures 1A to 1J This is a cross-sectional schematic diagram showing the steps of a method for manufacturing a display component 100 according to an embodiment of the present invention. Hereinafter, with reference to the accompanying drawings, embodiments of each step of the method for manufacturing the display component 100 will be described, but the present invention is not limited thereto.

[0084] Please refer to Figure 1A First, a carrier plate 102 is provided, which is, for example, a temporary carrier used to support the film layer formed in subsequent manufacturing processes. The carrier plate 102 can be made of glass or other suitable materials.

[0085] Next, a plurality of insulating patterns 104 are formed on the carrier plate 102. In some embodiments, an insulating layer can be formed first using a coating process, and then the insulating layer can be patterned using a photolithography process to form a plurality of insulating patterns 104. In some embodiments, the insulating pattern 104 has a trapezoidal cross-sectional shape. For example, the insulating pattern 104 has a regular trapezoidal cross-sectional shape, and the size W1 of the lower surface 104B of the insulating pattern 104 is larger than the size W2 of the upper surface 104T of the insulating pattern 104. In some embodiments, the angle θ1 between the upper surface 104T of the insulating pattern 104 and the sidewall 104S of the insulating pattern 104 is greater than 90°. For example, the angle θ1 is approximately 100° or 115°. The material of the insulating pattern 104 may include polyimide, but the present invention is not limited thereto. In some embodiments, the plurality of insulating patterns 104 are regularly arranged in an array on the carrier plate 102.

[0086] Please refer to Figure 1BA release layer 106 is formed on the insulating pattern 104 and the carrier plate 102, and the insulating pattern 104 and the carrier plate 102 can be separated from the film layer (e.g., metal layer 108) formed in subsequent manufacturing processes through the release layer 106. The release layer 106 is formed on the insulating pattern 104 and the carrier plate 102, for example, by coating. The material of the release layer 106 may include polyimide resin, diethylformamide, N-methylpyrrolidone, metal, or oxides of the above metals. In some embodiments, the above metals are titanium (Ti), copper (Cu), aluminum (Al), silver (Ag), iron (Fe), nickel (Ni), molybdenum (Mo), tungsten (W), etc., but the present invention is not limited thereto.

[0087] Please refer to Figure 1C A metal layer 108 is formed on the release layer 106. In some embodiments, a physical vapor deposition (e.g., sputtering) process can be used to form the metal layer 108. The material of the metal layer 108 may include a metal with good electrical conductivity, such as aluminum, molybdenum, titanium, gold, tin, or alloys thereof, or combinations thereof, but the present invention is not limited thereto.

[0088] Next, a plurality of conductive patterns 110 are formed on the metal layer 108, and the orthographic projections of the plurality of conductive patterns 110 on the carrier plate 102 respectively overlap the orthographic projections of the plurality of insulating patterns 104 on the carrier plate 102. In some embodiments, the orthographic projections of the insulating patterns 104 on the carrier plate 102 completely fall within the orthographic projections of the corresponding overlapping conductive patterns 110 on the carrier plate 102. In some embodiments, physical vapor deposition (e.g., sputtering), photolithography, and etching processes are used to form the plurality of conductive patterns 110. The material of the conductive patterns 110 may include metals or alloys with good conductivity, such as aluminum, molybdenum, titanium, copper, nickel, gold, tin, silver, and other metals, alloys thereof, or combinations thereof. In some embodiments, the conductive patterns 110 have a single-layer structure. In some embodiments, the conductive patterns 110 have a multilayer structure, such as a titanium / aluminum, aluminum / molybdenum, or titanium / aluminum / titanium stack.

[0089] In some embodiments, due to the trapezoidal outline of the insulating pattern 104, the conductive pattern 110 has an upper surface 110TH, an upper sidewall 110TS, a lower surface 110BH, and a lower sidewall 110BS, and the angle θ2 between the upper surface 110TH and the upper sidewall 110TS of the conductive pattern 110 is greater than 90°. For example, the angle θ2 is approximately 100° or 115°, but the invention is not limited thereto. In some embodiments, the conductive pattern 110 may further extend outward to a region that does not overlap with the insulating pattern 104, and the conductive pattern 110 may also have an upper surface 110TL and a lower surface 110BL, wherein the distance between the upper surface 110TL and the carrier plate 102 is less than the distance between the upper surface 110TH and the carrier plate 102, and the distance between the lower surface 110BL and the carrier plate 102 is less than the distance between the lower surface 110BH and the carrier plate 102.

[0090] Please refer to Figure 1D An insulating layer 112 with multiple openings 114 is formed on multiple conductive patterns 110 and a metal layer 108, and the multiple openings 114 expose the upper surface 110TH and upper sidewall 110TS of the multiple conductive patterns 110, respectively. For example, the opening 114 exposes the entire upper surface 110TH and a portion of the upper sidewall 110TS of the conductive pattern 110. In some embodiments, the opening 114 exposes the entire upper surface 110TH and the upper half of the upper sidewall 110TS of the conductive pattern 110. In some embodiments, the opening 114 exposes the entire upper surface 110TH and the entire upper sidewall 110TS of the conductive pattern 110. In some embodiments, the opening 114 also exposes a portion of the upper surface 110TL of the conductive pattern 110. In some embodiments, the angle θ3 between the sidewall 114S of the opening 114 and the bottom surface 114B is greater than 90°. For example, the angle θ3 is approximately 110° or 120°, but the invention is not limited thereto.

[0091] The insulating layer 112 can be made of polyimide (PI), polycarbonate (PC), polyester (PET), cyclic olefin copolymer (COC), metallocene-based cyclic olefin copolymer (mCOC), or other suitable materials, but the invention is not limited thereto. Furthermore, the insulating layer 112 can also have a single-layer or multi-layer structure. A multi-layer structure can be, for example, a stack of any two or more layers of the aforementioned materials, which can be combined and varied as needed. The insulating layer 112 is formed, for example, on the conductive pattern 110 and the metal layer 108 by coating, and the opening 114 can be formed using photolithography and etching processes, but the invention is not limited thereto.

[0092] Please refer to Figure 1E Multiple conductive patterns 116 are formed on the insulating layer 112 and in the opening 114 of the insulating layer 112. Specifically, the conductive patterns 116 may include conductive patterns 116A, 116B, and 116C, wherein each of the conductive patterns 116A, 116B, and 116C may include a portion formed on the upper surface 112T of the insulating layer 112 and another portion formed in the opening 114 of the insulating layer 112 (see reference). Figure 2A However, the present invention is not limited thereto. In some embodiments, the portion of the conductive pattern 116C formed in the opening 114 covers (e.g., physically contacts) the upper surface 110TH and a portion of the upper sidewall 110TS of the conductive pattern 110 to electrically connect the conductive pattern 110. In other words, the upper surface 110TH of the conductive pattern 110 can completely overlap the bottom surface 116L of the conductive pattern 116C. In some embodiments, the portion of the conductive pattern 116C located in the opening 114 may have a groove 117. In some embodiments, the conductive pattern 116 can be formed using physical vapor deposition (e.g., sputtering), photolithography, and etching processes. The material of the conductive pattern 116 may include a metal or alloy with good conductivity, such as aluminum, molybdenum, titanium, copper, nickel, gold, tin, silver, and other metals, alloys thereof, or combinations thereof. In some embodiments, the conductive pattern 110 has a multilayer structure, such as a titanium / copper, titanium / aluminum / titanium, or copper / nickel / gold stack.

[0093] Please refer to Figure 1F A light-shielding layer 118 is formed on the insulating layer 112. The light-shielding layer 118 is formed on the insulating layer 112, for example, by a coating and developing process, but the invention is not limited thereto. The light-shielding layer 118 may surround multiple conductive patterns 116 without overlapping them, and the number of conductive patterns 116 surrounded by the light-shielding layer 118 can be determined as needed. The light-shielding layer 118 can shield the metal traces on the insulating layer 112 from reflection of ambient light, thereby reducing dark-state brightness and improving contrast. In some embodiments, the light-shielding layer 118 has multiple openings 118O, and the orthographic projection of the openings 118O onto the insulating layer 112 can overlap the orthographic projection of the surrounding conductive patterns 116 onto the insulating layer 112, so as not to affect the setting of the light-emitting element 120. The material of the light-shielding layer 118 may include black resin or light-shielding metals (e.g., chromium), materials with low reflectivity and light transmittance.

[0094] Please refer to Figure 1GIn some embodiments, the conductive pattern 116 may be surface-finished first, and then a plurality of light-emitting elements 120 may be disposed on the insulating layer 112. In some embodiments, the surface finishing process may form a surface treatment film 119 on the conductive pattern 116. In some embodiments, the surface treatment film 119 is filled into the grooves 117 of the conductive pattern 116C, and the surface treatment film 119 has a flat upper surface 119T. The surface treatment film 119 may include conductive films such as nickel / gold, palladium / gold, solder on pad (SOP), or electroless nickel-palladium immersion gold (ENIPIG), but the present invention is not limited thereto.

[0095] Multiple light-emitting elements 120 can be disposed on the insulating layer 112 and electrically connected to different conductive patterns 116. In some embodiments, the light-emitting elements 120 can be disposed on a surface treatment film 119 and electrically connected to the conductive patterns 116 through the surface treatment film 119. In some embodiments, multiple light-emitting elements 120 can be disposed on multiple conductive patterns 116 first, and then a light-shielding layer 118 can be formed on the insulating layer 112, and the orthographic projection of the light-shielding layer 118 onto the insulating layer 112 can be outside the orthographic projection of the multiple light-emitting elements 120 onto the insulating layer 112.

[0096] The light-emitting element 120 may include a first electrode 121, a second electrode 122, and a light-emitting body 123. In some embodiments, the first electrode 121 and the second electrode 122 may be electrically connected to conductive patterns 116A and 116B, respectively. In some embodiments, a surface treatment film 119 and other conductive materials or conductive adhesives may also be included between the first electrode 121 and the conductive pattern 116A, and between the second electrode 122 and the conductive pattern 116B.

[0097] The light-emitting element 120 can be fabricated on a growth substrate and then transferred onto the insulating layer 112 via a mass transfer process. The first electrode 121 can act as or be electrically connected to the anode of the light-emitting element 120, and the second electrode 122 can act as or be electrically connected to the cathode of the light-emitting element 120. The light-emitting body 123 can, for example, include a stack of doped and undoped semiconductor materials. The materials of the first electrode 121 and the second electrode 122 can, for example, include alloys, nitrides of metal materials, oxides of metal materials, oxynitrides of metal materials, or other suitable materials, or a stack of metal materials and other conductive materials, or other low-resistivity materials. In this embodiment, the first electrode 121 and the second electrode 122 of the light-emitting element 120 are disposed on the same side of the light-emitting body 123. For example, the light-emitting element 120 can be a horizontal micro-light-emitting diode, but is not limited thereto. In some embodiments, the light-emitting element 120 can be a vertical micro-light-emitting diode.

[0098] Please refer to Figure 1H In some embodiments, an isolation structure 126 may be formed around the light-emitting element 120. The isolation structure 126 may have multiple openings 126O, and the orthographic projection of each opening 126O onto the carrier plate 102 may overlap the orthographic projection of the light-emitting element 120 onto the carrier plate 102. The isolation structure 126 may be formed on the carrier plate 102, for example, by a coating process and a developing process. The material of the isolation structure 126 may be, for example, a white photoresist, used to isolate color conversion materials used for different color conversions, while also preventing lateral light mixing of the light-emitting element 120 and refractioning the lateral light of the light-emitting element 120 to a positive viewing angle to increase the light emission pattern. In some embodiments, the isolation structure 126 may partially overlap the conductive pattern 116. In some embodiments, the isolation structure 126 may not overlap the conductive pattern 116 at all; for example, the isolation structure 126 may be disposed between conductive patterns 116B and 116C.

[0099] In some embodiments, a color conversion material may be filled into the opening 126O of the isolation structure 126 and onto the light-emitting element 120 to form a color conversion layer 128 on the light-emitting element 120. The color conversion layer 128 may include phosphor or a similar wavelength conversion material to, for example, convert the blue light emitted by the light-emitting element 120 into red or green light to achieve a full-color display effect. In some embodiments, the color conversion layer 128 may be formed only on a portion of the light-emitting elements 120, instead of forming the color conversion layer 128 on all of the light-emitting elements 120.

[0100] Next, an encapsulation layer 130 can be formed by coating. The encapsulation layer 130 can cover the conductive pattern 116, the light-shielding layer 118, the surface treatment film 119, the light-emitting element 120, the isolation structure 126, and the color conversion layer 128 to provide protection for the light-emitting element 120 and its surrounding components. The material of the encapsulation layer 130 may include polymer materials, such as epoxy resins, but the present invention is not limited thereto.

[0101] Next, please refer to Figures 1H to 1I The carrier plate 102, insulating pattern 104, release layer 106, and metal layer 108 can be removed. For example, the release layer 106 can be separated from the metal layer 108 first to remove the carrier plate 102, insulating pattern 104, and release layer 106 and expose the metal layer 108; then, the metal layer 108 is removed to expose the lower surface 110BH, lower sidewall 110BS, and lower surface 110BL of the conductive pattern 110. In some embodiments, the separation of the release layer 106 from the metal layer 108 is performed by heat treatment. In some embodiments, the separation of the release layer 106 from the metal layer 108 can be performed by laser. The removal of the metal layer 108 can be performed using a dry etching process or anisotropic etching process, but the invention is not limited thereto.

[0102] Next, please refer to Figure 1J A chemical plating process is performed on the lower surface 110BH, lower sidewall 110BS, and lower surface 110BL of multiple conductive patterns 110 to form pads 132 on the lower surface 110BH, lower sidewall 110BS, and lower surface 110BL. In some embodiments, the conductive patterns 110 completely cover the upper surface 132T and sidewall 132S of the pads 132. In some embodiments, the angle θ4 between the upper surface 132T and the sidewall 132S of the pads 132 is greater than 90°. For example, the angle θ4 is approximately 100° or 115°. In some embodiments, the pads 132 may also extend to the lower surface 112B of the insulating layer 112. The material of the pads 132 may include metals or alloys with good conductivity, such as aluminum, molybdenum, titanium, copper, nickel, gold, tin, silver, and other metals, alloys thereof, or combinations thereof. In some embodiments, the conductive patterns 110 have a multilayer structure. In some embodiments, the pad 132 includes a nickel layer and / or a gold layer formed by a chemical electroplating process.

[0103] In some embodiments, further cutting can be performed along a cutting line on the insulating layer 112 to form a plurality of display components 100. In some embodiments, the cutting can be performed using a laser beam. In other embodiments, the cutting can also be performed along a predetermined cutting line using, for example, a cutting tool or other suitable tool.

[0104] The following uses Figures 2A to 3Further embodiments of the present invention will be described, and the following will be used... Figures 1A to 1J The component designations and related content of the embodiments are as follows, wherein the same designations are used to represent the same or similar components, and descriptions of identical technical content are omitted. For explanations of the omitted parts, please refer to... Figures 1A to 1J The embodiments described below will not be repeated.

[0105] Figure 2A This is a top view of a display component 100 according to an embodiment of the present invention. Figure 2B yes Figure 2A A bottom view of the display component 100. Figure 1J It can be along Figure 2A A schematic cross-sectional view along section line A-A'. To make the accompanying drawing more concise, Figure 2A The surface treatment film 119, the isolation structure 126, the color conversion layer 128, and the encapsulation layer 130 are omitted.

[0106] Please refer to the following at the same time Figure 2A , Figure 2B as well as Figure 1J The display component 100 may include a pad 132, a conductive pattern 110, an insulating layer 112, a conductive pattern 116, and a light-emitting element 120. In some embodiments, the orthographic projection of the conductive pattern 116 onto the insulating layer 112 overlaps with the orthographic projection of the conductive pattern 110 onto the insulating layer 112, and the orthographic projection of the conductive pattern 110 onto the insulating layer 112 overlaps with the orthographic projection of the pad 132 onto the insulating layer 112. In some embodiments, the orthographic projection of the conductive pattern 110 onto the insulating layer 112 completely overlaps with the orthographic projection of the pad 132 onto the insulating layer 112, and the orthographic projection of the conductive pattern 110 onto the insulating layer 112 completely overlaps with the orthographic projection of the conductive pattern 116 onto the insulating layer 112.

[0107] In some embodiments, the opening 114 of the insulating layer 112 is located on the upper surface 112T of the insulating layer 112, and the opening 114 may not penetrate the insulating layer 112. In some embodiments, the insulating layer 112 further has an opening 115 located on the lower surface 112B of the insulating layer 112, and the opening 115 overlaps the opening 114, such that the opening 114, together with the opening 115, can penetrate the insulating layer 112. In some embodiments, the conductive pattern 110 is located in the opening 115, and the opening 114 may overlap the upper surface 110TH and part of the upper sidewall 110TS of the conductive pattern 110, and the conductive pattern 110 protrudes from the bottom surface 114B of the opening 114, such that the upper surface 110TH of the conductive pattern 110 is located in the opening 114. In other words, the vertical distance between the upper surface 110TH of the conductive pattern 110 and the lower surface 112B of the insulating layer 112 may be greater than the vertical distance between the bottom surface 114B and the lower surface 112B of the opening 114. The insulating layer 112 may cover the upper surface 110TL of the conductive pattern 110 and part of the upper sidewall 110TS.

[0108] Conductive pattern 116C is located in opening 114, and conductive pattern 116C covers the upper surface 110TH and part of the upper sidewall 110TS of conductive pattern 110, so that the upper surface 110TH of conductive pattern 110 is completely embedded in conductive pattern 116C. In this way, the upper sidewall 110TS of conductive pattern 110 can also form a lateral fit with conductive pattern 116C, thereby providing lateral adhesion to enhance the adhesion between conductive pattern 116C and conductive pattern 110.

[0109] In some embodiments, the vertical distance D1 between the upper surface 110TH of the conductive pattern 110 and the lower surface 112B of the insulating layer 112 is greater than the vertical distance D2 between the bottom surface 116L of the conductive pattern 116C and the lower surface 112B. In some embodiments, the conductive pattern 110 at least covers the upper surface 132T and sidewalls 132S of the pad 132. In some embodiments, the conductive pattern 110 completely covers the upper surface 132T and sidewalls 132S of the pad 132. In some embodiments, the pad 132 further extends to the lower surface 112B of the insulating layer 112.

[0110] In some embodiments, the display assembly 100 includes a plurality of light-emitting elements 120, and the first electrode 121 and the second electrode 122 of the light-emitting elements 120 are electrically connected to different conductive patterns 116. For example, the display assembly 100 may include a plurality of light-emitting elements 120A, 120B, 120C, a plurality of conductive patterns 116A, 116B, 116C, 116D, a plurality of conductive patterns 110A, 110B, 110C, 110D, and a plurality of pads 132A, 132B, 132C, 132D. The conductive pattern 116A may be electrically connected to the first electrode 121 of the light-emitting elements 120A, 120B, 120C and the conductive pattern 110A, and the conductive pattern 110A may be electrically connected to the conductive pattern 116A and the pad 132A. Conductive pattern 116B can electrically connect the second electrode 122 of light-emitting element 120A to conductive pattern 110B, and conductive pattern 110B can electrically connect conductive pattern 116B to pad 132B. Conductive pattern 116C can electrically connect the second electrode 122 of light-emitting element 120B to conductive pattern 110C, and conductive pattern 110C can electrically connect conductive pattern 116C to pad 132C. Conductive pattern 116D can electrically connect the second electrode 122 of light-emitting element 120C to conductive pattern 110D, and conductive pattern 110D can electrically connect conductive pattern 116D to pad 132D.

[0111] In some embodiments, light-emitting elements 120A, 120B, and 120C can emit the same color of light. For example, light-emitting elements 120A, 120B, and 120C can all emit blue light, and different color conversion layers 128 can be disposed above light-emitting elements 120A and 120C. The different color conversion layers 128 can be located between light-emitting elements 120A and 120C and the encapsulation layer 130, respectively, and no color conversion layer may be disposed on light-emitting element 120B. In some embodiments, the color conversion layer 128 can be disposed in the isolation structure 126. In this way, the color conversion layer 128 above light-emitting element 120A can convert blue light into, for example, red light, and the color conversion layer 128 above light-emitting element 120C can convert blue light into, for example, green light, enabling the display component 100 to achieve a full-color display effect.

[0112] In some embodiments, at least two of the light-emitting elements 120A, 120B, and 120C can emit different colors of light. For example, light-emitting element 120A can emit red light, while light-emitting elements 120B and 120C can both emit blue light. Furthermore, light-emitting elements 120A and 120B may not have a color conversion layer, while a color conversion layer 128 may be provided above light-emitting element 120C to convert blue light into green light, thereby enabling the display component 100 to provide a full-color display effect.

[0113] In some embodiments, the display assembly 100 further includes a light-shielding layer 118 surrounding a plurality of light-emitting elements 120 and a plurality of conductive patterns 116. For example, the light-shielding layer 118 surrounds light-emitting elements 120A, 120B, 120C and conductive patterns 116A, 116B, 116C, 116D. In some embodiments, the display assembly 100 further includes an encapsulation layer 130, which may cover most of the components on the insulating layer 112, such as the conductive patterns 116, the light-emitting elements 120, the light-shielding layer 118, and the color conversion layer 128, to provide protection for the display assembly 100.

[0114] Figure 3 This is a cross-sectional schematic diagram showing the steps of a manufacturing method for a display device 10 according to an embodiment of the present invention. Please refer to... Figure 3 ,exist Figures 1A to 1J Following the steps, a backplate 12 with a plurality of pads 14 disposed on its surface can be provided. Then, a plurality of display components 100 are disposed on the plurality of pads 14 on the backplate 12, such that the pads 132 of each display component 100 can be electrically connected to the pads 14 on the backplate 12 respectively, thereby forming a display device 10. In some embodiments, the pads 132 and the pads 14 can also be electrically connected by conductive adhesive or other solder.

[0115] In some embodiments, the display device 10 may include a backplate 12 and a plurality of display components 100. A plurality of pads 14 may be disposed on the surface of the backplate 12, and the plurality of display components 100 may be electrically connected to the plurality of pads 14 of the backplate 12. For example, each display component 100 may include a plurality of pads 132, and the plurality of pads 132 may be electrically connected to the plurality of pads 14. In some embodiments, the pads 132 of the display component 100 may be physically connected to the pads 14 on the backplate 12. In some embodiments, the pads 132 and 14 may also include other conductive materials or conductive adhesives for electrical connection. In this way, the light-emitting element 120 of the display component 100 can be electrically connected to the pads 14 via conductive patterns 116, conductive patterns 110, and pads 132. In some embodiments, the backplate 12 also includes a plurality of switching elements (not shown), and each switching element is electrically connected to a corresponding pad 14 to control whether the pad 14 is on or off. For example, the switching element can control the timing of the signal received by pad 14 or the potential of pad 14.

[0116] In summary, the display component of the present invention enhances the overall adhesion between the conductive pattern 116 and the conductive pattern 110 by embedding the conductive pattern 110 into the conductive pattern 116, thereby generating a lateral adhesion force between the conductive pattern 116 and the conductive pattern 110. This improves the yield of the display component and, consequently, the yield of the display device. Furthermore, the manufacturing method of the display component of the present invention, by embedding the conductive pattern 110 into the conductive pattern 116, can improve the manufacturing yield of the display component.

[0117] Although the present invention has been disclosed in conjunction with the above embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A display component, comprising: The first pad has a first upper surface and a first sidewall; A first conductive pattern covers the first upper surface and the first sidewall of the first pad, and the first conductive pattern has a second upper surface and an upper sidewall. An insulating layer covers the first conductive pattern and has an opening, wherein the opening overlaps the second upper surface and the upper sidewall of the first conductive pattern; A second conductive pattern is located in the opening; as well as The light-emitting element is electrically connected to the second conductive pattern. Wherein, the first conductive pattern protrudes from the bottom surface of the opening, such that the second upper surface of the first conductive pattern is located in the opening, and the second conductive pattern covers the second upper surface of the first conductive pattern and part of the upper sidewall, such that the second upper surface of the first conductive pattern is completely embedded in the second conductive pattern.

2. The display assembly of claim 1, wherein the angle between the first upper surface of the first pad and the first sidewall is greater than 90°.

3. The display assembly of claim 1, wherein the first conductive pattern completely covers the first upper surface and the first sidewall of the first pad.

4. The display assembly of claim 1, wherein the angle between the second upper surface of the first conductive pattern and the upper sidewall is greater than 90°.

5. The display assembly of claim 1, wherein the angle between the second sidewall of the opening and the bottom surface of the opening is greater than 90°.

6. The display assembly of claim 1, wherein the second upper surface of the first conductive pattern completely overlaps the bottom surface of the second conductive pattern.

7. The display component of claim 1, wherein the display component comprises a plurality of light-emitting elements, and the plurality of light-emitting elements emit the same color light or different colors light.

8. The display assembly of claim 7, further comprising a light-shielding layer surrounding the plurality of light-emitting elements.

9. The display component of claim 7 further includes an encapsulation layer covering the plurality of light-emitting elements.

10. The display assembly of claim 9, further comprising a color conversion layer located between the light-emitting element and the encapsulation layer.

11. A display device, comprising: The back panel has multiple second pads on its surface; as well as Multiple display components as described in claim 1 are electrically connected to the multiple second pads, respectively.

12. The display device of claim 11, wherein a plurality of the first pads of the plurality of display components are electrically connected to the plurality of second pads.

13. A method for manufacturing a display component, comprising: An insulating pattern is formed on the carrier board; A first conductive pattern is formed on the insulating pattern; An insulating layer with an opening is formed on the first conductive pattern and the carrier plate, and the opening exposes the second upper surface and upper sidewall of the first conductive pattern; A second conductive pattern is formed in the opening, and the second conductive pattern covers the second upper surface of the first conductive pattern and part of the upper sidewall; Remove the carrier plate and the insulating pattern to expose the lower surface and lower sidewall of the first conductive pattern; as well as A first pad is formed on the lower surface and the lower sidewall of the first conductive pattern. The process of forming the first conductive pattern over the insulating pattern further includes: A release layer is formed on the insulating pattern and the carrier plate; and A metal layer is formed on the release layer; The removal of the carrier plate and the insulating pattern includes: Separate the release layer from the metal layer; and Remove the metal layer. The process includes, prior to removing the carrier plate and the insulating pattern, the following: A light-emitting element is disposed on the insulating layer, and the light-emitting element is electrically connected to the second conductive pattern.

14. The method of manufacturing a display component as claimed in claim 13, wherein the angle between the upper surface of the insulating pattern and the sidewall of the insulating pattern is greater than 90°.

15. The method of manufacturing a display component as claimed in claim 13, wherein after forming the second conductive pattern in the opening, the method further comprises: The second conductive pattern is surface treated to form a surface treatment film on the second conductive pattern.

16. The method of manufacturing a display component as claimed in claim 15, wherein the surface treatment film comprises nickel / gold, palladium / gold, pad solder, or electroless nickel-palladium immersion gold.

17. The method of manufacturing a display component as claimed in claim 13, wherein, The first conductive pattern protrudes from the bottom surface of the opening, such that the second upper surface of the first conductive pattern is located in the opening, and the second upper surface of the first conductive pattern is completely embedded in the second conductive pattern.

18. The method of manufacturing a display component as claimed in claim 13, wherein the method further comprises, before or after setting the light-emitting element over the insulating layer: A light-shielding layer is formed on the insulating layer, and the orthogonal projection of the light-shielding layer on the insulating layer is outside the orthogonal projection of the light-emitting element on the insulating layer.

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