A power module
Patent Information
- Application Number
- CN202310025072.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-01-09
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2043-01-09
AI Technical Summary
[0005]本发明的目的在于提供一种功率模组,以解决现有智能功率模组在与散热器和电控板进行安装时,容易受到挤压产生崩边或开裂的问题
[0020]与现有技术比较,本发明中的功率模组通过在散热器的安装面设置向内凹陷的安装槽,然后将功率模块贴设固定于安装槽内,再在安装面贴设覆盖功率模块的隔板,最后通过螺丝依次穿过散热器上的第一螺丝孔、隔板上的第二螺丝孔以及电控板上的第三螺丝孔,再旋紧螺母即可完成安装,这种功率模组的结构在旋紧螺母时,电控板只会挤压散热器,并不会挤压到功率模块,从而避免了功率模块的外壳受到挤压而产生崩边或开裂的现象,保证了功率模块的完整性。
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Figure CN115967257B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of circuit technology, and more particularly to a power module. Background Technology
[0002] Intelligent power modules (MIPMs) are power drive products that combine power electronics and integrated circuit technology. They integrate power switching devices and drive circuits, and also incorporate fault detection circuits for overvoltage, overcurrent, and overheating. These detection signals can be sent to a CPU or DSP for final processing. Intelligent power modules mainly consist of high-speed, low-power transistors, optimized gate-level drive circuits, and fast protection circuits. Even in the event of a load failure or improper use, they remain undamaged and are now widely used in industrial control and home appliances.
[0003] When a smart power module is operating, its internal power devices, such as IGBTs and FRDs, generate significant heat. Therefore, a heat dissipation structure is needed to achieve rapid heat dissipation. Traditional heat dissipation structures involve installing an external control board and then mounting a heat sink on the back of the smart power module to accelerate heat exchange with the external environment.
[0004] When installing the heat sink, screws and nuts are needed to fix it to the control board along with the smart power module. Therefore, screw holes need to be reserved between the heat sink, the smart power module and the control board. However, since the control board is made of PCB material, it will undergo slight deformation and squeeze the edge of the screw hole of the smart power module during the tightening of the nuts. The shell of the smart power module is injection molded from resin material, which is hard and brittle and is prone to chipping or cracking after being squeezed. Summary of the Invention
[0005] The purpose of this invention is to provide a power module to solve the problem that existing smart power modules are easily subjected to pressure and chipping or cracking when installed with heat sinks and control boards.
[0006] To address the above problems, the present invention provides a power module comprising:
[0007] A radiator, one side of which is a mounting surface, the mounting surface is provided with an inwardly recessed mounting groove, and a plurality of mutually spaced first screw holes are provided through the edge of the mounting surface.
[0008] A power module, wherein the power module is fixedly mounted in the mounting slot;
[0009] A partition is attached to the mounting surface and covers the side of the power module away from the mounting groove. A second screw hole is provided through the partition at the position corresponding to each of the first screw holes.
[0010] An electronic control board is attached to the side of the partition away from the mounting surface, and a third screw hole is provided through the electronic control board at each position corresponding to the second screw hole;
[0011] Multiple screws, each of which passes sequentially through the corresponding first screw hole, second screw hole, and third screw hole;
[0012] Multiple nuts, each of which is fitted onto one end of a screw near the third screw hole.
[0013] Preferably, the first screw hole includes two screw holes arranged opposite to each other.
[0014] Preferably, the power module has two fourth screw holes at opposite edges; the mounting groove has a columnar protrusion extending outward to each of the fourth screw holes, and the columnar protrusion extends into the corresponding fourth screw hole.
[0015] Preferably, the fourth screw hole extends to the edge of the power module and is semi-cylindrical.
[0016] Preferably, the power module is fixed in the mounting groove by applying thermally conductive silicone grease.
[0017] Preferably, the radiator is made of copper or aluminum.
[0018] Preferably, the heat sink has multiple heat dissipation fins spaced apart on the side away from the mounting surface.
[0019] Preferably, the electronic control board has solder holes for each pin position of the power module, and each pin of the power module is soldered to the corresponding solder hole.
[0020] Compared with existing technologies, the power module in this invention has an inwardly recessed mounting groove on the mounting surface of the heat sink. The power module is then fixed in the mounting groove, and a partition covering the power module is attached to the mounting surface. Finally, screws are passed through the first screw hole on the heat sink, the second screw hole on the partition, and the third screw hole on the control board in sequence, and the nut is tightened to complete the installation. With this power module structure, when the nut is tightened, the control board only squeezes the heat sink and does not squeeze the power module, thereby avoiding the phenomenon of chipping or cracking of the power module shell due to compression, and ensuring the integrity of the power module. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is an exploded view of the overall structure of a power module provided in an embodiment of the present invention;
[0023] Figure 2 This is an exploded view of the screw and nut structure in a power module provided by an embodiment of the present invention;
[0024] Figure 3 This is an exploded view of the electronic control board in a power module provided in an embodiment of the present invention;
[0025] Figure 4 This is an exploded view of the structure of a partition in a power module provided in an embodiment of the present invention;
[0026] Figure 5 This is an exploded view of the structure of a partition plate when no power module is installed in a power module, according to an embodiment of the present invention.
[0027] Figure 6 This is a schematic diagram of the structure of a power module in a power module according to an embodiment of the present invention;
[0028] Figure 7 A front view of the overall structure of a power module provided in an embodiment of the present invention;
[0029] Figure 8 This is a side view of the overall structure of a power module provided in an embodiment of the present invention.
[0030] 100. Power module; 1. Heat sink; 11. Mounting surface; 12. Mounting slot; 13. First screw hole; 14. Columnar protrusion; 15. Heat sink fins; 2. Power module; 21. Fourth screw hole; 22. Pin; 3. Partition; 31. Second screw hole; 4. Control board; 41. Third screw hole; 42. Soldering hole; 5. Screw; 6. Nut. Detailed Implementation
[0031] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0032] This invention provides a power module 100, combined with Figures 1 to 8 As shown, it includes a heat sink 1, a power module 2, a partition 3, an electronic control board 4, multiple screws 5, and multiple nuts 6.
[0033] Specifically, one side of the heat sink 1 is a mounting surface 11, which has an inwardly recessed mounting groove 12. Multiple spaced first screw holes 13 are provided through the edge of the mounting surface 11. The power module 2 is fixed in the mounting groove 12. The partition 3 is attached to the mounting surface 11 and covers the side of the power module 2 away from the mounting groove 12. A second screw hole 31 is provided through the partition 3 at the position of each first screw hole 13. The control board 4 is attached to the side of the partition 3 away from the mounting surface 11. A third screw hole 41 is provided through the control board 4 at the position of each second screw hole 31.
[0034] Specifically, each screw 5 passes through the corresponding first screw hole 13, second screw hole 31 and third screw hole 41 in sequence; each nut 6 is fitted onto the end of a screw 5 near the third screw hole 41.
[0035] Among them, the power module 2 is the core component of DC frequency conversion technology. It mainly includes a main body, a shell formed by injection molding of epoxy resin material on the outside of the main body and achieving sealing, and multiple pins 22 that are electrically connected to the main body and extend outward through the shell. The shell is used to protect the internal structure, and the pins 22 are used to achieve electrical connection with the external control board 4.
[0036] The function of the partition 3 is to help fix the heat sink 1 and to prevent the control board 4 from squeezing the power module 2 when the nut 6 is tightened.
[0037] In this embodiment, the first screw hole 13 includes two holes arranged opposite to each other. This arrangement not only avoids the process being complicated by having too many screw holes, but also enables the stable installation of the heat sink 1, power module 2, and electronic control board 4.
[0038] In this embodiment, the radiator 1 is made of copper or aluminum using CNC equipment; multiple heat dissipation fins 15 are spaced apart on the side of the radiator 1 away from the mounting surface 11. It utilizes the good thermal conductivity of copper or aluminum to accelerate the spread of internal heat, and increases the surface area of the radiator 1 through the sheet-like heat dissipation fins 15 to accelerate the heat exchange between the radiator 1 and the surrounding environment.
[0039] In this embodiment, the power module 2 has two fourth screw holes 21 positioned opposite each other at its edge; the mounting groove 12 has a columnar protrusion 14 extending outwards to each of the fourth screw holes 21, with the columnar protrusion 14 extending into the corresponding fourth screw hole 21. This arrangement allows the power module 2 to be more stably mounted and fixed within the mounting groove 12.
[0040] In this embodiment, the mounting surface 11 and the bottom of the mounting groove 12 are both smooth planes. Before the power module 2 is installed, a layer of thermally conductive silicone grease (not shown) is applied to the bottom of the mounting groove 12 to avoid an air layer between the power module 2 and the mounting groove 12 that would affect the heat dissipation effect.
[0041] In this embodiment, the fourth screw hole 21 extends to the edge of the power module 2 and is semi-cylindrical.
[0042] In this embodiment, the power module 2 is fixed in the mounting groove 12 by applying thermally conductive silicone grease. After installation, any thermally conductive silicone grease squeezed out from the gaps needs to be cleaned off.
[0043] In this embodiment, the partition 3 is attached to the mounting surface 11 and covers the side of the power module 2 away from the mounting slot 12. This design allows the power module 2 to fit tightly against the heat sink 1 after installation, thereby improving the heat dissipation effect.
[0044] In this embodiment, the control board 4 is provided with soldering holes 42 at the positions of each pin 22 of the power module 2, and each pin 22 of the power module 2 is soldered to the corresponding soldering hole 42. During soldering, solder paste is first applied to the soldering point between the pin 22 and the control board 4, and then the solder paste is heated to melt with a hot air gun so that the pin 22 is soldered to the control board 4. When assembling a small number of power modules 2, a soldering iron and solder wire can also be used for soldering.
[0045] In this embodiment, when installing the power module 100, first fix the power module 2 to the mounting surface 11 of the heat sink 1 with thermal grease, then align the second screw hole 31 of the partition 3 with the first screw hole 13 of the heat sink 1 and press it tight, then align the third screw hole 41 of the control board 4 with the second screw hole 31 of the partition 3 and press it tight, then align the pin 22 of the power module 2 with the soldering hole 42 on the control board 4, and finally install the screw 5 and nut 6 and solder the pin 22 to complete the installation.
[0046] Compared with the prior art, the power module 100 in this embodiment has an inwardly recessed mounting groove 12 on the mounting surface 11 of the heat sink 1. The power module 2 is then attached and fixed in the mounting groove 12. A partition 3 covering the power module 2 is then attached to the mounting surface 11. Finally, screws 5 are passed through the first screw hole 13 on the heat sink 1, the second screw hole 31 on the partition 3, and the third screw hole 41 on the control board 4 in sequence, and the nut is tightened to complete the installation. With this structure of the power module 100, when the nut is tightened, the control board 4 will only squeeze the heat sink 1 and will not squeeze the power module 2, thereby avoiding the phenomenon of chipping or cracking of the outer shell of the power module 2 due to compression, and ensuring the integrity of the power module 2. At the same time, it saves the assembly time of the power module 2 and the heat sink 1, thereby improving production efficiency.
[0047] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.
Claims
1. A power module, characterized in that, The power module includes: A radiator, one side of which is a mounting surface, the mounting surface is provided with an inwardly recessed mounting groove, and a plurality of mutually spaced first screw holes are provided through the edge of the mounting surface. A power module, wherein the power module is fixedly mounted in the mounting slot; A partition is attached to the mounting surface and covers the side of the power module away from the mounting groove. A second screw hole is provided through the partition at the position corresponding to each of the first screw holes. An electronic control board is attached to the side of the partition away from the mounting surface, and a third screw hole is provided through the electronic control board at each position corresponding to the second screw hole; Multiple screws, each of which passes sequentially through the corresponding first screw hole, second screw hole, and third screw hole; Multiple nuts, each of which is fitted onto one end of a screw near the third screw hole.
2. The power module as described in claim 1, characterized in that, The first screw hole comprises two holes arranged opposite to each other.
3. The power module as described in claim 1, characterized in that, The power module has two fourth screw holes at opposite edges; the mounting groove has a columnar protrusion extending outward to each of the fourth screw holes, and the columnar protrusion extends into the corresponding fourth screw hole.
4. The power module as described in claim 3, characterized in that, The fourth screw hole extends to the edge of the power module and is semi-cylindrical.
5. The power module as described in claim 1, characterized in that, The power module is fixed in the mounting slot by applying thermally conductive silicone grease.
6. The power module as described in claim 1, characterized in that, The radiator is made of copper or aluminum.
7. The power module as described in claim 1, characterized in that, The radiator has multiple heat dissipation fins spaced apart on the side away from the mounting surface.
8. The power module as described in claim 1, characterized in that, The control board has solder holes for each pin of the power module, and each pin of the power module is soldered to the corresponding solder hole.
Citation Information
Patent Citations
Inverter unit
JP2009106073A
Power conversion device
US20050259403A1