Display attaching system and attaching method

Abstract

The application discloses a display adhering system and adhering method, the display comprises a back plate and glass, the adhering system comprises a belt line, an adhering line body, a transfer module and a controller, the belt line is used for conveying the back plate; the adhering line body comprises a front elevator, a first buffer station table, a first adhering station table, a second adhering station table, a second buffer station table, a pressure maintaining station table, a rear elevator and a return plate line which are sequentially connected; the transfer module comprises a first transfer assembly used for transferring the back plate on the belt line to the front elevator, a second transfer assembly used for adhering the glass to the back plate on the first adhering station table to form a first adhering assembly, a third transfer assembly used for adhering the glass to the back plate on the second adhering station table to form a second adhering assembly and a fourth transfer assembly used for transferring the first adhering assembly and the second adhering assembly on the rear elevator to the belt line; and the controller is used for controlling the actions of the belt line, the adhering line body and the transfer module.

Description

Technical Field

[0001] This invention relates to the field of display assembly technology, and in particular to a display bonding system and bonding method. Background Technology

[0002] Previously, monitors were manufactured using conveyor belts. The back panel moved forward at a constant speed on the conveyor belt, and the workers at each station completed the corresponding processes on the moving conveyor belt. With the upgrading of products, more and more monitors have adopted borderless or narrow bezel designs. At this time, the glass and the back panel need to be bonded together with adhesive strips.

[0003] However, manual bonding is difficult to guarantee in terms of precision, and its efficiency is too low to meet production needs. Summary of the Invention

[0004] The purpose of this invention is to provide a bonding system and bonding method for a display, in order to solve the technical problems that the glass and back panel of existing displays are bonded manually, which makes it difficult to ensure the bonding accuracy and the efficiency of manual bonding is too low to meet the needs of production.

[0005] This invention provides a bonding system for a display, the display including a back panel and glass bonded to the back panel, the bonding system comprising:

[0006] Belt conveyor for transporting the back panel;

[0007] The bonding line includes a front lift, a first buffer station, a first bonding station, a second bonding station, a second buffer station, a pressure holding station, a rear lift, and a return line, which are connected in sequence from end to end.

[0008] The transfer module includes a first transfer assembly for transferring a backplate on the conveyor belt to the front elevator, a second transfer assembly for bonding glass to the backplate on the first bonding station to form a first bonding assembly, a third transfer assembly for bonding glass to the backplate on the second bonding station to form a second bonding assembly, and a fourth transfer assembly for transferring either the first bonding assembly or the second bonding assembly on the rear elevator to the conveyor belt.

[0009] The controller is used to control the movement of the belt conveyor, bonding line, and transfer module.

[0010] Furthermore, the bonding system also includes a feeding line for conveying glass, the feeding line being disposed adjacent to the first bonding station and the second bonding station.

[0011] Furthermore, the bonding system also includes a camera module, which includes a first monitoring camera for monitoring the position of the backplate on the conveyor belt, a second monitoring camera for monitoring the position of the glass on the feeding line, a third monitoring camera for monitoring the position of the backplate on the first bonding station, and a fourth monitoring camera for monitoring the position of the backplate on the second bonding station. The first, second, third, and fourth monitoring cameras are all electrically connected to the controller.

[0012] Furthermore, the bonding system also includes a plurality of tooling plates for fixing the back plate, each of the tooling plates being spaced apart on the bonding line. The first bonding station and the second bonding station both include a table surface for moving the tooling plate and a lifting mechanism connected to the table surface. The lifting mechanism can lift the tooling plate to separate the tooling plate from the table surface.

[0013] Furthermore, the first transfer assembly, the second transfer assembly, the third transfer assembly, and the fourth transfer assembly each include a robotic arm, a UVW platform connected to one end of the robotic arm, and a suction cup connected to the other end of the robotic arm. The robotic arm and the UVW platform are both electrically connected to the controller.

[0014] The present invention also provides a bonding method for a display, employing the bonding system described above, the bonding method comprising the following steps:

[0015] Step S1: Backplate loading; The first transfer component picks up the backplate from the belt conveyor and transfers it to the tooling plate of the front elevator;

[0016] Step S2: Glass loading; The second and third transfer components can selectively pick up the glass and transfer it to the side of the first or second bonding station.

[0017] Step S3, bonding; The tooling plate with the back plate installed on the front elevator will be sequentially conveyed to the first buffer station and the first bonding station. The first bonding station can discharge material to the second bonding station. The glass on the second transfer component and the third transfer component can be bonded to the back plate on the first bonding station and the second bonding station respectively. The second bonding station can release the flowing first bonding component. The first bonding component and the second bonding component are sequentially conveyed to the second buffer station and the pressure holding station along with the tooling plate and then enter the rear elevator.

[0018] Step S4, unloading: The fourth transfer component picks up the first bonding component or the second bonding component on the rear elevator and transfers it to the belt conveyor.

[0019] Furthermore, in step S1, the specific steps for loading the back plate are as follows:

[0020] Step S11: When a backplate is detected on the belt conveyor, the first monitoring camera takes a picture and positions it, the controller adjusts the angle of the first transfer component, and the controller drives the first transfer component to pick up the backplate on the belt conveyor and move it to the side of the front elevator.

[0021] Step S12: When it is detected that the front elevator clamp is holding an empty tooling plate, the first transfer component places the back plate it has picked up onto the tooling plate.

[0022] Step S13: The first transfer component returns to its initial position and begins picking up the next backplate.

[0023] Furthermore, in step S2, the specific steps for loading the glass are as follows:

[0024] Step S21: The glass with the film still on is manually placed on the feeding line, and the glass with the film still on flows into the picking position of the feeding line;

[0025] Step S22: The second monitoring camera takes a picture of the glass position and positions it. The controller adjusts the angle of the second transfer component. The controller drives the second transfer component to pick up the glass and transfer it to the side of the first bonding station. Alternatively, the controller drives the third transfer component to pick up the glass and transfer it to the side of the second bonding station.

[0026] Step S23: Manually peel off the film from the glass that has been collected.

[0027] Furthermore, in step S3, the specific steps for bonding between the first cache station and the second cache station are as follows:

[0028] Step S31: When it is detected that the first bonding station and the second bonding station do not have a backplate, the controller will send an instruction to the first buffer station, and the tooling plate with the backplate installed on the first buffer station will enter the first bonding station or the second bonding station.

[0029] Step S32: When the tooling plate with the back plate installed enters the first bonding station, the lifting mechanism of the first bonding station will lift the tooling plate, the third monitoring camera will take pictures and position the back plate, the controller will adjust the angle of the second transfer component to bond the glass and the back plate to assemble the first bonding component, the lifting mechanism of the first bonding station will descend and release the tooling plate with the first bonding component installed, and when the lifting mechanism of the first bonding station is lifted, the tooling plate with the back plate installed can enter the second bonding station through the table surface of the first bonding station;

[0030] Step S33: When the tooling plate with the back plate installed enters the second bonding station, the lifting mechanism of the second bonding station will lift the tooling plate, the fourth monitoring camera will take pictures and position the back plate, the controller will adjust the angle of the third transfer component to bond the glass and the back plate to assemble the second bonding component, the lifting mechanism in the second bonding station will descend and release the tooling plate with the second bonding component installed, when the lifting mechanism of the second bonding station lifts up, the tooling plate with the first bonding component installed on the first bonding station can enter the second buffer station through the second bonding station;

[0031] Step S34: The second and third transfer components return to their initial positions to begin the suction of the next glass.

[0032] Further, in step S4, after the fourth transfer component picks up the first bonding component or the second bonding component on the rear hoist and places it onto the belt conveyor, the tooling plate enters the return plate line, and the fourth transfer component returns to its initial position.

[0033] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0034] This invention assembles an automated bonding system from a conveyor belt, bonding line, transfer module, and controller into an existing process flow. Without changing the original conveyor belt mode, it moves the entire display bonding process off-line. At the same time, it cleverly utilizes the assembly line operation mode to achieve automated display bonding. While improving process quality, it ensures the system's operating efficiency, cycle time, and reproducibility, effectively improving the quality and production efficiency of display products. Attached Figure Description

[0035] Figure 1 This is a partial structural schematic diagram of the bonding system provided in an embodiment of the present invention;

[0036] Figure 2 A flowchart of the bonding method provided in an embodiment of the present invention;

[0037] Figure 3 A flowchart for backplate loading provided in an embodiment of the present invention;

[0038] Figure 4 A flowchart for glass loading provided in an embodiment of the present invention;

[0039] Figure 5 A flowchart of the bonding method between the first cache station and the second cache station provided in an embodiment of the present invention.

[0040] In the picture:

[0041] 10. Belt conveyor; 20. Laminating line; 21. Front elevator; 22. First buffer station; 23. First bonding station; 24. Second bonding station; 25. Second buffer station; 26. Pressure holding station; 27. Rear elevator; 28. Return board line; 30. Transfer module; 31. First transfer assembly; 32. Second transfer assembly; 33. Third transfer assembly; 34. Fourth transfer assembly; 40. Feeding line; 50. Camera module; 51. First monitoring camera; 52. Second monitoring camera; 53. Third monitoring camera; 54. Fourth monitoring camera. Detailed Implementation

[0042] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0043] Please see Figure 1 This invention discloses a bonding system for a display, which is used to bond a display. Of course, it can also be used for other glass panels in high-precision bonding products. The display includes a back panel and glass bonded to the back panel.

[0044] The bonding system includes a belt conveyor 10, a bonding line 20, a transfer module 30, a controller, and multiple tooling plates for fixing the back plate. The belt conveyor 10 is used to transport the back plate. The bonding line 20 includes a front lift 21, a first buffer station 22, a first bonding station 23, a second bonding station 24, a second buffer station 25, a pressure holding station 26, a rear lift 27, and a return plate line 28, which are connected in sequence from end to end. The tooling plates are spaced apart on the bonding line 20.

[0045] In this embodiment, the front elevator 21, the first buffer station 22, the first bonding station 23, the second bonding station 24, the second buffer station 25, the pressure holding station 26, the rear elevator 27, and the return plate line 28 are equivalent to splicing multiple worktables together to form an assembly line type bonding line 20. Each worktable can be equipped with rollers and self-locking devices as needed. The start and stop of the rollers on each worktable are driven by the internal motor of each worktable. The tooling plate can move along the rollers on the bonding line 20. After the tooling plate reaches a certain worktable of the bonding line 20, it can be locked in a designated position by the self-locking device of that worktable as needed. In this embodiment, the front elevator 21 and the rear elevator 27 have the same structure as elevators on the market, except that they have self-locking devices and several power-driven rollers.

[0046] The bonding system also includes a loading line 40 for conveying glass, which is located adjacent to the first bonding station 23 and the second bonding station 24. The transfer module 30 includes a first transfer assembly 31, a second transfer assembly 32, a third transfer assembly 33, and a fourth transfer assembly 34. The first transfer assembly 31 is located between the belt conveyor 10 and the front elevator 21. The first transfer assembly 31 is used to transfer the backplate from the belt conveyor 10 to the tooling plate on the front elevator 21, and then transport it to the first bonding station 23 or the second bonding station 24 via rollers on the bonding line 20. The second transfer assembly 32 is located between the first bonding station 23 and the loading line 40, and is used to bond the glass to the backplate on the first bonding station 23 to form a first bonding assembly. The third transfer assembly 34... The transfer assembly 33 is located between the second bonding station 24 and the feeding line 40. It is used to bond the glass to the back plate on the second bonding station 24 to form the second bonding assembly, thus completing the overall glass bonding process. The fourth transfer assembly 34 is located between the rear elevator 27 and the belt conveyor 10. The fourth transfer assembly 34 is used to transfer the first bonding assembly or the second bonding assembly on the rear elevator 27 to the belt conveyor 10 for subsequent operations. The feeding line 40, the belt conveyor 10, the bonding line 20, and the transfer module 30 are all electrically connected to the controller. The controller is used to control the movement of the belt conveyor 10, the bonding line 20, and the transfer module 30. The first bonding assembly and the second bonding assembly can be some components of the display, or they can be the assembled display.

[0047] The bonding system also includes a camera module 50, which includes a first monitoring camera 51 for monitoring the position of the backplate on the conveyor belt 10, a second monitoring camera 52 for monitoring the position of the glass on the feeding line 40, a third monitoring camera 53 for monitoring the position of the backplate on the first bonding station 23, and a fourth monitoring camera 54 for monitoring the position of the backplate on the second bonding station 24. The final bonding state of the first bonding component on the first bonding station 23 can also be monitored by the third monitoring camera 53, and the final bonding state of the second bonding component on the second bonding station 24 can also be monitored by the fourth monitoring camera 54. The first monitoring camera 51, the second monitoring camera 52, the third monitoring camera 53, and the fourth monitoring camera 54 are all electrically connected to the controller. Each monitoring camera transmits the monitored information to the controller so as to adjust the angle of the corresponding transfer component.

[0048] In this embodiment, the bonding line 20 can realize the circulation of the tooling plate, and the feeding line 40 is used to transport the glass to the picking and photographing position after manual glass loading to wait for the second transfer component 32 or the third transfer component 33 to pick it up; the first buffer station 22 is used to ensure the working cycle of the front elevator 21; the first bonding station 23 and the second bonding station 24 are bonding stations, and the structures of the first bonding station 23 and the second bonding station 24 are the same. The first bonding station 23 and the second bonding station 24 both include a positioning module, a table for moving the tooling plate, and a lifting mechanism connected to the table. The positioning module in the first bonding station 23 is used to position the third monitoring camera 53 to assist the second transfer component 32, and the lifting mechanism in the first bonding station 23 is used to lift the tooling plate to separate the tooling plate from the table formed by the rollers on it, so as to ensure that the second transfer component 32 can be fed while the first bonding station 23 is working. The bonding station 24 has a positioning module for positioning the fourth monitoring camera 54 to assist the third transfer component 33. The lifting mechanism in the second bonding station 24 is used to lift the tooling plate to separate the tooling plate from the table surface formed by the rollers on it. When the second bonding station 24 is working, it can ensure that the first bonding component product completed by the first bonding station 23 flows out, improving the system's working efficiency. The second buffer station 25 mainly ensures the bonding cycle time. The pressure holding station 26 completes pressure holding through its pressure holding head. In this embodiment, the lifting mechanism can be a combination of the internal cylinder and the annular frame of the bonding station. After the tooling plate is driven by the rollers, it stops moving when it reaches the designated position and is exactly above the annular frame. The annular frame will not interfere with the rotation of the rollers. When the annular frame is driven to rise by the internal cylinder, it can lift the tooling plate. Of course, the lifting mechanism can also be other lifting structures.

[0049] The first transfer assembly 31, the second transfer assembly 32, the third transfer assembly 33, and the fourth transfer assembly 34 each include a robotic arm, a UVW platform connected to one end of the robotic arm, and a suction cup connected to the other end of the robotic arm. The robotic arm and the UVW platform are electrically connected to the controller. By receiving the offset correction amount from the camera module 50, the position and angle of the suction cup are adjusted. The high-precision positioning of the UVW platform achieves high-precision bonding between the back panel and the glass. In this embodiment, the UVW platform is a common three-dimensional moving platform on the market. Driven by its internal motor, it can drive the robotic arm to move along the X-axis, Y-axis, and Z-axis. The robotic arm can rotate the suction cup horizontally to adjust the angle of the suction cup.

[0050] In this embodiment, the backplate is automatically transferred from the conveyor belt 10 to the bonding line 20. After the operation is completed, the completed first or second bonding component is returned to the conveyor belt 10 to continue the subsequent work. In order to ensure the overall system's operating cycle and bonding accuracy, a dual bonding station is used for synchronous operation. The bonding is performed through the UVW platform at the end of the robot arm, which not only solves the problem of insufficient positioning accuracy of the transfer module 30, but also allows for bonding in one step without the need for multiple photos, thus improving the bonding speed. At the same time, the assembly line operation mode, with the transfer module 30 loading and unloading, not only saves manpower but also ensures smooth system operation.

[0051] In this embodiment, the controller includes an airborne PLC and an airborne motion control unit. The airborne PLC is used for writing the overall process, controlling the production line, and realizing data interaction between the transfer module 30 and the camera module 50 through the communication interface. The airborne motion control unit obtains the positioning parameters of the camera module 50, calculates the amount of movement of each corner of the transfer module 30, and controls the UVW platform and the robot arm to realize the fitting and correction function.

[0052] Please refer to further information. Figure 1 and Figure 2 As shown, this invention also discloses a bonding method for a display, employing the bonding system described above to solve the problem of high-speed, high-precision bonding of displays on the conveyor belt 10. After the bonding system is started, each station initializes. The front elevator 21 can determine whether there is a tooling plate on its station and whether there is a back plate on the conveyor belt 10. The rear elevator 27 can determine whether there is a bonding component on its station. Then, they all move to the corresponding positions to wait. The transfer module 30 will move to the origin position to wait. The lifting mechanisms inside the first bonding station 23 and the second bonding station 24 will be positioned to the lowering position. The pressure holding head of the pressure holding station 26 will move to the waiting position to wait.

[0053] In this embodiment, the bonding method includes the following steps:

[0054] Step S1: Backplate loading; The first transfer component 31 picks up the backplate on the belt conveyor 10 and transfers it to the tooling plate of the front elevator 21.

[0055] Step S2: Glass loading; The second transfer assembly 32 and the third transfer assembly 33 can selectively pick up the glass and transfer it to the side of the first bonding station 23 or the second bonding station 24, and wait for it to be loaded.

[0056] Step S3, bonding; The tooling plate with the back plate installed on the front elevator 21 will be sequentially conveyed to the first buffer station 22 and the first bonding station 23. The first bonding station 23 can release material to the second bonding station 24. The glass on the second transfer component 32 and the third transfer component 33 can be bonded to the back plate on the first bonding station 23 and the second bonding station 24 respectively. The second bonding station 24 can release the flowing first bonding component. The assembled first bonding component and the second bonding component are sequentially conveyed to the second buffer station 25 and the pressure holding station 26 along with the tooling plate and then enter the rear elevator 27 to complete the entire bonding process.

[0057] Step S4, unloading: The fourth transfer component 34 picks up the first bonding component or the second bonding component on the rear elevator 27 and transfers it to the belt conveyor 10. The remaining tooling plate enters the return plate line 28.

[0058] Please refer to further information. Figure 1 and Figure 3 As shown, in this embodiment, the specific steps for loading the back plate in step S1 are as follows:

[0059] Step S11: When the bonding system starts, when the sensor on the belt 10 detects a backplate on the belt 10, the first monitoring camera 51 takes a picture to obtain the backplate position correction data and transmits it to the controller. After receiving the backplate correction data, the controller adjusts the angle of the first transfer component 31 and drives the first transfer component 31 to pick up the backplate on the belt 10 and move it to the side of the front elevator 21, waiting for the allowable discharge signal.

[0060] Step S12: After the bonding system is started, the rollers and self-locking device on the front elevator 21 will be raised. The rollers can be used to place the tooling plate, and the self-locking device on the front elevator 21 can be used to fix the tooling plate. If the sensor on the front elevator 21 detects that the front elevator 21 is holding an empty tooling plate, it sends a signal to the first transfer component 31. After receiving the allowable release signal, the first transfer component 31 places the back plate it has picked up onto the tooling plate and sends a release completion signal to the controller. If there is no tooling plate on the elevator 27 after the bonding system is started, the rollers and self-locking device will descend together and retrieve the tooling plate from the return line 28 before being raised again. If there is both a tooling plate and a back plate on the front elevator 21 after the bonding system is started, the tooling plate on the front elevator 21 needs to be raised. After the plate is released, the rollers and self-locking device on the front elevator 21 descend together to retrieve the tooling plate again.

[0061] Step S13: After the material is unloaded, the first transfer component 31 returns to its initial position and begins picking up the next backplate.

[0062] Please refer to further information. Figure 1 and Figure 4 As shown, in this embodiment, the specific steps for glass loading in step S2 are as follows:

[0063] Step S21: After the bonding system is started, the operator places the glass with the film still on the feeding line 40, steps on the foot pedal, and the glass with the film still on the film flows into the picking position of the feeding line 40, waiting for the second monitoring camera 52 to take a picture.

[0064] Step S22: The second monitoring camera 52 takes a picture of the glass position for positioning. After the picture is taken, the controller makes a judgment based on the status of the second transfer component 32 and the third transfer component 33. The second transfer component 32 and the third transfer component 33 selectively pick up the glass without peeling off the film. For example, the controller adjusts the angle of the second transfer component 32 and drives the second transfer component 32 to pick up the glass and transfer it to the side of the first bonding station 23 accordingly, or the controller drives the third transfer component 33 to pick up the glass and transfer it to the side of the second bonding station 24 accordingly.

[0065] Step S23: Manually peel off the film from the glass sample and wait for the bonding signal.

[0066] In this embodiment, after the unremoved glass flows into the material handling position of the feeding line 40, the second monitoring camera 52 takes pictures of the glass feature positions, calculates the correction coordinate values, and sends the correction coordinates to the controller for UVW platform positioning. After the UVW platform is positioned, it sends a bonding signal to the second transfer component 32 or the third transfer component 33. After the second transfer component 32 or the third transfer component 33 completes bonding, the UVW platform resets, and at the same time, the corresponding lifting mechanisms on the first bonding station 23 and the second bonding station 24 descend to prepare for release. After the release is completed, the bonding of the next backplate is started, and at the same time, the second transfer component 32 and the third transfer component 33 reset to the initial position to start the glass handling process.

[0067] Please refer to further information. Figure 1 and Figure 5 As shown, in this embodiment, the specific steps for bonding between the first cache station 22 and the second cache station 25 in step S3 are as follows:

[0068] Step S31: After the system starts, the first bonding station 23 and the second bonding station 24 position the third monitoring camera 53 and the fourth monitoring camera 54 to the preset positions according to the machine model. At the same time, the lifting mechanisms in the first bonding station 23 and the second bonding station 24 are lowered into position to wait for feeding. When the sensors on the first bonding station 23 and the second bonding station 24 detect that there is no backplate in either the first bonding station 23 or the second bonding station 24, the controller will send a command to the first buffer station 22. The tooling plate with the backplate installed on the first buffer station 22 will enter the first bonding station 23 or the second bonding station 24. The first buffer station 22 can then release the plate into the second bonding station 24.

[0069] Step S32: When the tooling plate with the back plate is installed enters the first bonding station 23, the lifting mechanism of the first bonding station 23 will lift the tooling plate. The third monitoring camera 53 will take a picture of the back plate for positioning. After the picture is successfully taken, the second transfer component 32 is sent with a command to enter the bonding position. The controller adjusts the angle of the second transfer component 32 to bond the glass and the back plate to assemble the first bonding component. The lifting mechanism of the first bonding station 23 descends and releases the tooling plate with the first bonding component installed. When the lifting mechanism of the first bonding station 23 is lifted, the tooling plate with the back plate can enter the second bonding station 24 through the table of the first bonding station 23. The tooling plate will not move on the lifting mechanism of the first bonding station 23. Of course, the tooling plate can also be fixed by the locking parts on the first bonding station 23.

[0070] Step S33: When the tooling plate with the back plate is installed enters the second bonding station 24, the lifting mechanism of the second bonding station 24 will lift the tooling plate, the fourth monitoring camera 54 will take pictures and position the back plate, the controller will adjust the angle of the third transfer component 33 to bond the glass and the back plate to assemble the second bonding component, the lifting mechanism in the second bonding station 24 will descend and release the tooling plate with the second bonding component installed. When the lifting mechanism of the second bonding station 24 is lifted, the tooling plate with the first bonding component installed on the first bonding station 23 can enter the second buffer station 25 through the table surface of the second bonding station 24. The tooling plate will not move on the lifting mechanism of the second bonding station 24. Of course, the tooling plate can also be fixed by the locking parts on the second bonding station 24.

[0071] Step S34: The second transfer assembly 32 and the third transfer assembly 33 return to their initial positions to begin the suction of the next glass.

[0072] In step S3 above, when both the first bonding station 23 and the second bonding station 24 are on standby, the lifting mechanism of the first bonding station 23 does not need to rise, and the first bonding station 23 can release the tooling plate with the back plate installed. The second bonding station 24 contacts the tooling plate with the back plate installed before the first bonding station 23.

[0073] In this embodiment, in step S3, the pressure holding station 26 is also equipped with a lifting mechanism for lifting the tooling plate. However, when it lifts the tooling plate, other tooling plates are not allowed to enter the rear elevator 27 through the pressure holding station 26. The pressure holding steps of the pressure holding station 26 are as follows:

[0074] Step S35: After the bonding system is started, the lifting mechanism in the pressure holding station 26 descends, and at the same time, the pressure holding head in the pressure holding station 26 is positioned in the waiting position.

[0075] Step S36: After the first bonding component or the second bonding component is bonded and flows into the second buffer station along with the tooling plate, it enters the pressure holding station 26 after receiving the signal that the board can enter.

[0076] Step S37: The lifting mechanism of the pressure holding station 26 lifts the tooling plate with the first bonding component or the second bonding component, and at the same time the pressure holding head moves to the pressure holding preparation position. At this time, subsequent tooling plates cannot pass through the pressure holding station 26.

[0077] Step S38: The pressure holding head switches to torque mode to start pressure holding. When the pressure sensor reaches the set pressure, the pressure holding stops and the pressure is maintained for the set time.

[0078] Step S39: After the set time is reached, the lifting mechanism and pressure holding head of the pressure holding station 26 are reset to their initial positions;

[0079] Step S40: Release the fixture plate containing the first bonding component or the second bonding component after the pressure holding is completed, and wait for the next fixture plate to flow in.

[0080] In this embodiment, the material feeding step in step S4 is as follows:

[0081] Step S41: After the bonding system is started, the fourth transfer component 34 moves to the initial position to wait for the material pick-up signal. At the same time, the rollers and self-locking device of the rear elevator 27 will be lifted. If there is a tooling plate when the rear elevator 27 starts, but there is no first bonding component or second bonding component, the rollers and self-locking device will directly descend to the initial position, release the tooling plate to the return plate line 28, and return to the upper position. If there is a tooling plate and a first bonding component or second bonding component when the rear elevator 27 starts, the material pick-up signal will be sent directly to the fourth transfer component 34.

[0082] Step S42: After the tooling plate containing the first bonding component or the second bonding component has completed the pressure holding process and flows into the elevator 27, it is sent to the fourth transfer component 34 for material removal.

[0083] Step S43: The fourth transfer component 34 picks up the first bonding component or the second bonding component on the rear elevator 27 and puts it onto the belt line 10. After the material is picked up, the roller and self-locking device of the rear elevator 27 move to the lower position, and the empty tooling plate is given to the return plate line 28.

[0084] Step S44: The fourth transfer component 34 returns to its initial position for reset.

[0085] In this embodiment, in order to ensure bonding efficiency, after the tooling board flows to the first buffer station 22, the status of the bonding station is judged. When the first bonding station 23 has an empty board signal, the board is directly placed to the first bonding station 23. When the first bonding station 23 has a board and the second bonding station 24 does not have a board, the tooling board of the first bonding station 23 will be placed to the second bonding station 24 during the lifting process.

[0086] After the glass feeding process starts, the glass is manually placed. First, the glass is waited for to flow into the photographing position. The glass is positioned by the second monitoring camera 52. If a photograph fails, the system counts the number of attempts. After multiple unsuccessful attempts, the system will alarm and wait for manual intervention. After manual intervention, the system will re-enter the photographing process. Once a photograph is successfully taken, material handling and allocation begin. The system is designed to prioritize material handling for the third transfer component 33. If the third transfer component 33 does not handle material handling, the system will handle material handling for the second transfer component 32. The processes for the first bonding station 23 and the second bonding station 24 are basically the same; the first bonding station 23 will be used as an example here.

[0087] After the bonding process is initiated, the lifting mechanism of the third monitoring camera 53 and the first bonding station 23 will be positioned at the initial position. Then, it will determine whether there is a tooling board on the station. If there is no tooling board, it will send an empty board signal and wait for the first buffer station to put the board in. If there is a tooling board, it will initiate the logic judgment before the bonding process starts, which includes three cases: when the tooling board is empty, it will be released directly, and a completion signal will be set to the second bonding station 24; when the tooling board has a backplate but the second bonding station 24 has a board request signal, the board will be released to the second bonding station 24 first, and a processing signal will be set; when the tooling board has a backplate and the second bonding station 24 does not have a board request signal, the bonding action will be initiated.

[0088] During bonding, the lifting mechanism of the first bonding station 23 first lifts the fixture plate to the back plate photo-taking position for taking a picture. If the photo-taking fails, a count will be made. If multiple photo-taking failures occur, an alarm will be triggered, and manual intervention will be required. Manual intervention can choose to release the fixture plate directly or retake the photo. When the back plate is successfully photographed, the light source plate will extend and send a signal to the second transfer component 32 to take a picture of the glass. Then, the second transfer component 32 will enter the photo-taking position and start taking pictures of the glass. The principle is the same as taking pictures of the back plate. If the glass fails to take pictures for a set number of times, the system will alarm and enter manual intervention. After manual intervention, the system can choose to retake the photo or release the glass. When the glass is released, the system will resend the signal to the second transfer component 32 to take pictures of the glass, and wait for the second transfer component 32 to enter again. If the glass is successfully photographed, the system will send the correction parameters to the UVW platform of the second transfer component 32 for positioning, and at the same time retract the light source plate. Then, the system will send a bonding command to the second transfer component 32. Finally, the second transfer component 32 will reset after completing the bonding, and the lifting mechanism of the first bonding station 23 will descend and send a completion signal to release the glass.

[0089] After the bonded product flows into the pressure holding station 26, the pressure holding head will switch to torque mode. When the pressure sensor under the lifting mechanism of the pressure holding station 26 reaches the set pressure, the pressure holding head will stop pressing down and hold the pressure for 5 seconds. After the set time is reached, the pressure holding head will lift up and the lifting mechanism of the pressure holding station 26 will reset. Then the pressure holding head will return to its origin and the tooling plate will be released.

[0090] The beneficial effects of this invention are:

[0091] 1. The bonding system is automated, which improves the stability and accuracy of bonding compared to manual bonding, ensuring product quality. In addition, the bonding line adopts a multi-station combination and pressure holding working mode within 20, which improves production efficiency.

[0092] 2. Without changing the original conveyor belt mode 10, the entire process of display bonding was moved off-line. At the same time, the assembly line operation mode was cleverly utilized to ensure the system's operating efficiency, cycle time and replicability while improving process quality.

[0093] This embodiment primarily addresses the drawbacks of manual display bonding on traditional conveyor belt 10 and the problems associated with achieving automated bonding. It fully integrates the display bonding process, migrating the entire bonding process outside the conveyor belt 10. Furthermore, it incorporates the operational modes of automated roller conveyors and return plate elevators to design an automated workstation. Through loading and unloading of the transfer module 30, simultaneous bonding of dual transfer components, lifting operations, and automatic pressure holding operations, it not only achieves highly efficient automated bonding of the display, but also, combined with camera module 50 alignment correction, UVW platform assisted positioning, and pressure holding detection, achieves high-precision bonding and pressure holding of the display. Automated bonding not only replaces manual labor but also improves product quality and production efficiency.

[0094] The above embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. A method for bonding a display, employing a bonding system for bonding the display, the display comprising a back panel and glass bonded to the back panel, characterized in that, The bonding system includes: Belt conveyor for transporting the back panel; The bonding line includes a front lift, a first buffer station, a first bonding station, a second bonding station, a second buffer station, a pressure holding station, a rear lift, and a return line, which are connected in sequence from end to end. The transfer module includes a first transfer assembly for transferring a backplate on the conveyor belt to the front elevator, a second transfer assembly for bonding glass to the backplate on the first bonding station to form a first bonding assembly, a third transfer assembly for bonding glass to the backplate on the second bonding station to form a second bonding assembly, and a fourth transfer assembly for transferring either the first bonding assembly or the second bonding assembly on the rear elevator to the conveyor belt. The controller is used to control the movement of the belt conveyor, bonding line, and transfer module; The bonding system also includes multiple tooling plates for fixing the back plate, and each tooling plate is spaced apart on the bonding line. The bonding method includes the following steps: Step S1: Backplate loading; The first transfer component picks up the backplate from the belt conveyor and onto the tooling plate of the front elevator; Step S2: Glass loading; The second and third transfer components can selectively pick up the glass and transfer it to the side of the first or second bonding station. Step S3, bonding; The tooling plate with the back plate installed on the front elevator will be sequentially conveyed to the first buffer station and the first bonding station. The first bonding station can discharge material to the second bonding station. The glass on the second transfer component and the third transfer component can be bonded to the back plate on the first bonding station and the second bonding station respectively. The second bonding station can release the flowing first bonding component. The first bonding component and the second bonding component are sequentially conveyed to the second buffer station and the pressure holding station along with the tooling plate and then enter the rear elevator. Step S4, unloading: The fourth transfer component picks up the first bonding component or the second bonding component on the rear elevator and transfers it to the belt conveyor.

2. The bonding method for a display as described in claim 1, characterized in that, The bonding system also includes a feeding line for conveying glass, which is located adjacent to the first bonding station and the second bonding station.

3. The bonding method for a display as described in claim 2, characterized in that, The bonding system also includes a camera module, which includes a first monitoring camera for monitoring the position of the backplate on the conveyor belt, a second monitoring camera for monitoring the position of the glass on the feeding line, a third monitoring camera for monitoring the position of the backplate on the first bonding station, and a fourth monitoring camera for monitoring the position of the backplate on the second bonding station. The first, second, third, and fourth monitoring cameras are all electrically connected to the controller.

4. The bonding method for a display as described in claim 3, characterized in that, Both the first bonding station and the second bonding station include a table surface for moving the tooling plate and a lifting mechanism connected to the table surface. The lifting mechanism can lift the tooling plate to separate the tooling plate from the table surface.

5. The bonding method for a display as described in claim 1, characterized in that, The first transfer assembly, the second transfer assembly, the third transfer assembly, and the fourth transfer assembly each include a robotic arm, a UVW platform connected to one end of the robotic arm, and a suction cup connected to the other end of the robotic arm. The robotic arm and the UVW platform are both electrically connected to the controller.

6. The bonding method for a display as described in claim 4, characterized in that, In step S1, the specific steps for loading the back plate are as follows: Step S11: When a backplate is detected on the belt conveyor, the first monitoring camera takes a picture and positions it, the controller adjusts the angle of the first transfer component, and the controller drives the first transfer component to pick up the backplate on the belt conveyor and move it to the side of the front elevator. Step S12: When it is detected that the front elevator clamp is holding an empty tooling plate, the first transfer component places the back plate it has picked up onto the tooling plate. Step S13: The first transfer component returns to its initial position and begins picking up the next backplate.

7. The bonding method for a display as described in claim 4, characterized in that, In step S2, the specific steps for loading the glass are as follows: Step S21: The glass with the film still on is manually placed on the feeding line, and the glass with the film still on flows into the picking position of the feeding line; Step S22: The second monitoring camera takes a picture of the glass position and positions it. The controller adjusts the angle of the second transfer component. The controller drives the second transfer component to pick up the glass and transfer it to the side of the first bonding station. Alternatively, the controller drives the third transfer component to pick up the glass and transfer it to the side of the second bonding station. Step S23: Manually peel off the film from the glass that has been collected.

8. The bonding method for a display as described in claim 4, characterized in that, In step S3, the specific steps for bonding between the first cache station and the second cache station are as follows: Step S31: When it is detected that the first bonding station and the second bonding station do not have a backplate, the controller will send an instruction to the first buffer station, and the tooling plate with the backplate installed on the first buffer station will enter the first bonding station or the second bonding station. Step S32: When the tooling plate with the back plate installed enters the first bonding station, the lifting mechanism of the first bonding station will lift the tooling plate, the third monitoring camera will take pictures and position the back plate, the controller will adjust the angle of the second transfer component to bond the glass and the back plate to assemble the first bonding component, the lifting mechanism of the first bonding station will descend and release the tooling plate with the first bonding component installed, and when the lifting mechanism of the first bonding station is lifted, the tooling plate with the back plate installed can enter the second bonding station through the table surface of the first bonding station; Step S33: When the tooling plate with the back plate installed enters the second bonding station, the lifting mechanism of the second bonding station will lift the tooling plate, the fourth monitoring camera will take pictures and position the back plate, the controller will adjust the angle of the third transfer component to bond the glass and the back plate to assemble the second bonding component, the lifting mechanism in the second bonding station will descend and release the tooling plate with the second bonding component installed, when the lifting mechanism of the second bonding station lifts up, the tooling plate with the first bonding component installed on the first bonding station can enter the second buffer station through the second bonding station; Step S34: The second and third transfer components return to their initial positions to begin the suction of the next glass.

9. The bonding method for a display as described in claim 4, characterized in that, In step S4, after the fourth transfer component picks up the first bonding component or the second bonding component on the rear hoist and places it onto the belt conveyor, the tooling plate enters the return plate line, and the fourth transfer component returns to its initial position.

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