Head chip, liquid jetting head, liquid jetting recording device, and method for manufacturing head chip

Abstract

A head chip is provided to suppress the degradation of print quality. The head chip includes an intermediate plate (52), which has multiple rows of connecting holes (136, 137) arranged side by side in the X direction for each channel column, each connecting hole (130) communicating individually with the ejection channel (75) of the actuator plate (53). Adjacent connecting holes (130) in the X direction are arranged offset from each other in the Y direction. In the intermediate plate (52), a non-through groove (150) blocked by a nozzle plate and a through hole (160) communicating with the non-through groove (150) and communicating with the outside of the head chip through the non-ejection channel (76) are formed. A portion of the non-through groove (150) is located in the region between the connecting holes (138, 139). The minimum distance (G1) in the X direction between the opening edge (130a) of the connecting hole 130 in the inter-hole region (138, 139) and the non-through groove (150) is larger than the minimum distance (G2) in the X direction between the opening edge (130a) of the connecting hole (130) and the non-ejection channel (76).

Description

Technical Field

[0001] This disclosure relates to a head chip, a liquid jetting head, a liquid jetting recording device, and a method for manufacturing the head chip. Background Technology

[0002] The inkjet head of an inkjet printer ejects ink to the recording medium via a head chip mounted on the inkjet head. The head chip includes: an actuator plate that alternately forms ejection channels and non-ejection channels; and a nozzle plate that is coupled to the actuator plate and has nozzle orifices formed at positions corresponding to the ejection channels to eject ink contained in the ejection channels.

[0003] In recent years, advancements in channel fineness have reduced the permissible range of positional deviation between the actuator plate and the nozzle plate. Specifically, if the nozzle plate deviates from the actuator plate along the width of the channel, a portion of the opening on the channel side of the nozzle orifice may be blocked by the walls between the channels. If this portion of the opening is blocked, ink supply to the nozzle orifice is impeded. Consequently, there is a possibility of deterioration in ink ejection characteristics.

[0004] Patent Document 1 discloses a configuration in which an intermediate plate having a through hole communicating with both the ejection channel and the nozzle orifice is disposed between an actuator plate and a nozzle plate, and the through hole is formed to be larger than the ejection channel and the nozzle orifice in the width direction of the ejection channel. According to this configuration, within the range where the nozzle orifice is not blocked by the intermediate plate, the positions of the actuator plate and the nozzle plate are allowed to deviate, thereby preventing the supply of ink to the nozzle orifice from being obstructed.

[0005] Prior art literature Patent documents Patent document 1: Japanese Patent Application Publication No. 2019-42979. Summary of the Invention

[0006] The problem that the invention aims to solve However, if there is a poor connection at the joint between the intermediate plate and the nozzle plate, the ejection channels may become interconnected through the poorly connected area. If the ejection channels are interconnected, pressure may propagate through the poorly connected area during ink ejection, causing a deviation in the ink ejection direction. This could potentially lead to a decrease in print quality. However, when the nozzle plate is made of an opaque material such as metal, it is difficult to optically detect poor connections between the nozzle plate and the intermediate plate.

[0007] Therefore, this disclosure provides a head chip, a liquid jet head, a liquid jet recording device, and a method for manufacturing the head chip to suppress the decline in printing quality caused by poor bonding between the jet orifice plate and the intermediate plate.

[0008] Solution for solving the problem To address the aforementioned issues, this disclosure adopts the following form.

[0009] (1) One embodiment of the present disclosure relates to a liquid-jetting head chip, comprising: an actuator plate having jet channels and non-jetting channels extending in a first direction, arranged alternately in a second direction intersecting the first direction in a manner that overlaps with each other in the first direction; an intermediate plate overlapping the actuator plate, and having a plurality of rows of connecting holes arranged in a row along the second direction for each channel row; and a jet hole plate overlapping the intermediate plate on the side opposite to the actuator plate, and having jet holes that communicate individually with the connecting holes and jet liquid contained in the jet channels, wherein the plurality of rows of connecting holes include the connecting holes adjacent to each other in the second direction. The connecting holes are arranged offset from each other along the first direction. In the intermediate plate, a non-through groove is formed, which opens on the side of the jet hole plate and is blocked by the jet hole plate; and a through hole communicates with the non-through groove and communicates with the outside of the head chip through the non-jet channel. When the area between the opening edges of a pair of adjacent connecting holes in a given group of connecting holes in the side of the jet hole plate in the intermediate plate is defined as the inter-connecting hole area, a portion of the non-through groove is located in the inter-connecting hole area. The minimum distance between the opening edge of the connecting hole in the inter-connecting hole area and the second direction of the non-through groove is greater than the minimum distance between the opening edge of the connecting hole and the second direction of the non-jet channel.

[0010] According to this configuration, the poorly joined portion of the intermediate plate and the injection orifice plate is connected to the connecting hole and the non-through groove of the intermediate plate, thereby connecting the connecting hole and the non-through groove via the poorly joined portion. Thus, the injection channel and the connecting hole of the intermediate plate are connected. The connecting hole connects to the outside of the head chip through the non-injection channel, therefore, by detecting leakage when the injection orifice is blocked and the injection channel is vacuumed, the connecting hole and the non-through groove can function as a leakage detection flow path connecting the poorly joined portion to the non-injection channel, thereby detecting the presence of the poorly joined portion. In particular, the non-through groove is located in the region between the connecting holes, thus enabling efficient and excellent detection of poorly joined portions in the region between the connecting holes. Furthermore, the non-through groove does not open towards the actuator plate side, thus increasing the degree of freedom in the shape of the leakage detection flow path compared to a configuration where only the connecting hole forms the leakage detection flow path.

[0011] Then, adjacent connecting holes in the second direction are offset from each other in the first direction. Therefore, when considering a pair of adjacent connecting holes in the second direction, unlike their configuration where they are arranged side by side in the second direction, even if the minimum distance between the opening edge of one connecting hole and the non-through groove is made larger than the minimum distance between the non-jet channel, it is possible to prevent the non-through groove from approaching the other connecting hole. As a result, the width in the second direction at the joint between the intermediate plate and the jet orifice plate can be increased, thus enabling a more reliable fit between the intermediate plate and the jet orifice plate.

[0012] By using the above methods, the reduction in the amount of adhesive between the intermediate plate and the jetting plate caused by the setting of non-through grooves can be suppressed, and the poor bonding between the intermediate plate and the jetting plate can be detected simultaneously, thus suppressing the decline in printing quality caused by poor bonding.

[0013] (2) In the head chip of the above (1) form, the aforementioned non-through groove may extend throughout the entire length of the aforementioned first direction in the region between the aforementioned connecting holes.

[0014] According to this design, a non-through groove is provided on the shortest path connecting a pair of connecting holes in the region between the connecting holes. This allows for the detection of poor fit that could cause unintended connection between the injection channels at locations where hydraulic pressure is easily applied.

[0015] (3) In the head chip of the above (1) or (2) form, the aforementioned non-through groove may extend from one of the aforementioned inter-hole regions to the other of the aforementioned inter-hole regions corresponding to each of the pair of aforementioned inter-hole groups adjacent in the aforementioned first direction.

[0016] According to this design, a non-through groove is provided on the shortest path connecting a pair of adjacent connecting holes in the second direction. This allows for the detection of poor engagement that could lead to accidental connection between the injection channels at locations where hydraulic pressure is easily applied.

[0017] (4) In any of the head chip forms described in (1) to (3) above, the aforementioned non-through groove may extend in a straight line along the entire length.

[0018] Based on this design, no bends are formed, thus enabling the formation of non-through grooves uniformly along the entire length, and preventing accidental penetrations during the formation of non-through grooves.

[0019] (5) In any of the above-mentioned (1) to (3) forms of the head chip, the aforementioned non-through groove may extend in a straight line along the aforementioned first direction in the region between the aforementioned connecting holes.

[0020] According to this configuration, compared to the case where the non-through groove extends in a direction inclined relative to the first direction in the region between the connecting holes, the minimum interval between the non-through groove and the pair of connecting holes sandwiching the region between the connecting holes can be increased. Therefore, the width in the second direction at the joint between the intermediate plate and the injection orifice plate can be increased.

[0021] (6) The liquid injection head of one embodiment of the present disclosure has the head chip of any one of the embodiments (1) to (5) above.

[0022] Based on this embodiment, having the head chip involved in any of the above embodiments, a liquid jet head with excellent printing quality can be provided.

[0023] (7) One embodiment of the liquid jet recording apparatus disclosed herein includes the liquid jet head of the embodiment described in (6) above.

[0024] According to this embodiment, having the liquid jet head described above, a liquid jet recording device with excellent printing quality can be provided.

[0025] (8) Regarding a method for manufacturing a head chip according to one aspect of this disclosure, the method comprises: an actuator plate having a row of channels, including jet channels and non-jet channels, that are alternately arranged in a second direction intersecting the first direction, such that they overlap each other in the first direction; an intermediate plate that overlaps with the actuator plate and has a group of multiple rows of connecting holes arranged in a row along the second direction for each row of channels, each communicating with a connecting hole individually connected to the jet channel; and a jet hole plate that overlaps with the intermediate plate on the side opposite to the actuator plate and has jet holes that communicate individually with the connecting holes and jet liquid contained in the jet channels, wherein adjacent connecting holes in the multiple rows of connecting holes in the second direction are offset from each other in the first direction. The head chip manufacturing method comprises: a non-through groove forming step, wherein a non-through groove is formed on the aforementioned intermediate plate with an opening on the side of the aforementioned jet orifice plate and closed by the aforementioned jet orifice plate; and a through hole forming step, wherein a through hole is formed on the aforementioned intermediate plate that communicates with the aforementioned non-through groove and communicates with the outside of the aforementioned head chip through the aforementioned non-jet channel. When defining the area between the opening edges of a pair of adjacent aforementioned connecting holes in a predetermined group of connecting holes in the aforementioned intermediate plate as the connecting hole region, in the aforementioned non-through groove forming step, a portion of the aforementioned non-through groove is formed in the aforementioned connecting hole region, and the minimum distance between the opening edge of the aforementioned connecting hole in the aforementioned connecting hole region and the aforementioned second direction of the aforementioned non-through groove is set to be larger than the minimum distance between the opening edge of the aforementioned connecting hole and the aforementioned second direction of the aforementioned non-jet channel.

[0026] (9) In the manufacturing method of the head chip in the form of (8) above, it may also include an intermediate plate bonding process of bonding the intermediate plate to the actuator plate, and the through hole forming process is performed after the intermediate plate bonding process.

[0027] According to this design, regardless of the alignment accuracy of the actuator board and the intermediate board, a through-hole can be formed at the desired position relative to the non-jet channel during the through-hole forming process. Therefore, in a head chip equipped with an intermediate board having a through-hole communicating with the non-jet channel, improved manufacturing yield can be achieved. The positional accuracy between the non-jet channel and the through-hole can be improved.

[0028] (10) In the manufacturing method of the head chip in the form of (8) or (9) above, it may also include an intermediate plate bonding step of bonding the intermediate plate to the actuator plate. The intermediate plate joining process is performed after the aforementioned non-through groove forming process.

[0029] According to this design, the process of forming non-through grooves on the intermediate board can be performed in parallel with a process that precedes the intermediate board bonding process in the head chip manufacturing. Therefore, the manufacturing period of the head chip can be shortened.

[0030] The effects of the invention According to one aspect of this disclosure, it is possible to suppress the decline in printing quality. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the printer configuration according to the implementation method.

[0032] Figure 2 This is a schematic diagram of the inkjet head and ink circulation mechanism in the embodiment.

[0033] Figure 3 This is a perspective view of the head chip according to the first embodiment.

[0034] Figure 4 This is an exploded perspective view of the head chip of the first embodiment.

[0035] Figure 5 This is a bottom view of the actuator plate according to the first embodiment.

[0036] Figure 6 It is equivalent to Figure 5 A cross-sectional view of the chip at the head of the VI-VI line.

[0037] Figure 7 It is equivalent to Figure 5 Cross-sectional view of the chip at the head of line VII-VII.

[0038] Figure 8 It is along Figure 4 A cross-sectional view of line VIII-VIII.

[0039] Figure 9 This is a bottom view of the intermediate plate and actuator plate of the first embodiment.

[0040] Figure 10 It is Figure 9 A portion of the image is shown in enlarged form.

[0041] Figure 11 This is a diagram illustrating the manufacturing method of the head chip according to the first embodiment.

[0042] Figure 12 This is a diagram illustrating the manufacturing method of the head chip according to the first embodiment.

[0043] Figure 13 This is a diagram illustrating the manufacturing method of the head chip according to the first embodiment.

[0044] Figure 14 This is a bottom view of the intermediate plate and actuator plate of the second embodiment.

[0045] Figure 15 It is Figure 14 A portion of the image is shown in enlarged form. Detailed Implementation

[0046] Hereinafter, embodiments relating to this disclosure will be described with reference to the accompanying drawings. Furthermore, in the following description, components having the same or similar functions will be given the same reference numerals. Also, repeated descriptions of these components will sometimes be omitted.

[0047] [Implementation Method] <Printer> The printer 1, which is common in all embodiments, will be described.

[0048] Figure 1 This is a schematic diagram of the printer configuration according to the implementation method.

[0049] like Figure 1 As shown in the figure, the printer (liquid jet recording device) 1 of this embodiment includes a pair of conveying mechanisms 2 and 3, an ink tank 4, an inkjet head (liquid jet head) 5, an ink circulation mechanism 6, and a scanning mechanism 7.

[0050] In the following description, an orthogonal coordinate system of X, Y, and Z will be used as needed. In this case, the X direction (second direction) is aligned with the transport direction (sub-scanning direction) of the recording medium P (e.g., paper). The Y direction (first direction) is aligned with the scanning direction (main scanning direction) of the scanning mechanism 7. The Z direction represents the height direction (vertical direction) orthogonal to the X and Y directions. In the following description, the side with the arrow in the X, Y, and Z directions will be described as the positive (+) side, and the side opposite to the arrow will be described as the negative (-) side. In this embodiment, the +Z side corresponds to the upper vertical direction, and the -Z side corresponds to the lower vertical direction.

[0051] The conveying mechanisms 2 and 3 convey the recording medium P towards the +X side. The conveying mechanisms 2 and 3 each include, for example, a pair of rollers 11 and 12 extending along the Y direction.

[0052] The ink reservoirs 4 contain four colors of ink, such as yellow, magenta, cyan, and black. Each inkjet head 5 is configured to eject one of the four colors of ink—yellow, magenta, cyan, and black—depending on the ink reservoir 4 it is connected to. Furthermore, the ink contained in the ink reservoirs 4 can be either conductive or non-conductive.

[0053] Figure 2 This is a schematic diagram of the inkjet head and ink circulation mechanism in the embodiment.

[0054] like Figure 1 and Figure 2 As shown, the ink circulation mechanism 6 circulates ink between the ink tank 4 and the inkjet head 5. Specifically, the ink circulation mechanism 6 includes: a circulation path 23 having an ink supply pipe 21 and an ink discharge pipe 22; a pressure pump 24 connected to the ink supply pipe 21; and a suction pump 25 connected to the ink discharge pipe 22.

[0055] The pressure pump 24 pressurizes the ink supply tube 21 and delivers ink to the inkjet head 5 through the ink supply tube 21. As a result, the ink supply tube 21 is under positive pressure relative to the inkjet head 5.

[0056] The suction pump 25 depressurizes the ink discharge tube 22, drawing ink from the inkjet head 5 through it. This creates a negative pressure on the ink discharge tube 22 side relative to the inkjet head 5. The ink can then circulate between the inkjet head 5 and the ink tank 4 via the circulation path 23, driven by the pressure pump 24 and the suction pump 25.

[0057] The scanning mechanism 7 causes the inkjet head 5 to reciprocate scanning along the Y direction. The scanning mechanism 7 includes a guide rail 28 extending along the Y direction and a carriage 29 movably supported by the guide rail 28.

[0058] like Figure 1 As shown, the inkjet head 5 is mounted on the carriage 29. In the illustrated example, multiple inkjet heads 5 are mounted side-by-side on a carriage 29 along the Y direction. The inkjet head 5 includes a head chip 50 (see reference). Figure 3 The ink supply section (not shown) connects the ink circulation mechanism 6 and the head chip 50, and the control section (not shown) applies the driving voltage to the head chip 50.

[0059] [First Implementation] <Head Chip> The head chip 50 of the first embodiment will be described.

[0060] Figure 3 This is a perspective view of the head chip of the first embodiment viewed from the -Z side with the nozzle plate and intermediate plate removed. Figure 4 This is an exploded perspective view of the head chip of the first embodiment.

[0061] Figure 3 and Figure 4 The head chip 50 shown is a so-called circulating side-ejection type head chip: ink is circulated between the ink tank 4 and ink is ejected from the center of the ejection channel 75 in the extension direction (Y direction), as described later. The head chip 50 includes a nozzle plate (ejection orifice plate) 51 (see reference). Figure 4 ), intermediate plate 52 (refer to) Figure 4 The head chip 50 consists of a nozzle plate 51, an intermediate plate 52, an actuator plate 53, and a cover plate 54 stacked in this order along the Z direction. In the following description, the direction from the nozzle plate 51 toward the cover plate 54 (+Z side) in the Z direction is sometimes referred to as the back side, and the direction from the cover plate 54 toward the nozzle plate 51 (-Z side) is referred to as the front side.

[0062] The actuator plate 53 is formed of a piezoelectric material such as PZT (lead zirconate titanate). The actuator plate 53 is a so-called herringbone substrate formed by stacking two piezoelectric plates, for example, with different polarization directions in the Z direction. However, the actuator plate 53 can also be a so-called monopolar substrate with a single polarization direction throughout the entire region in the Z direction. A channel array 61 is formed on the actuator plate 53. The channel array 61 extends along the X direction.

[0063] Figure 5 This is a bottom view of the actuator plate according to the first embodiment.

[0064] like Figure 5As shown, channel 61 has ink-filled ejection channels (jet channels) 75 and ink-free non-ejection channels (non-jet channels) 76. In a top view from the Z direction, each channel 75, 76 extends linearly along the Y direction. Channels 75, 76 are arranged alternately, overlapping each other along the Y direction and spaced apart along the X direction. The portion of actuator plate 53 located between the ejection channels 75 and the non-ejection channels 76 constitutes a drive wall 70 (see reference 56) that separates the ejection channels 75 and the non-ejection channels 76 in the X direction. Figure 4 Furthermore, in this embodiment, a configuration in which the channel extension direction is consistent with the Y direction is described, but the channel extension direction may also intersect the Y direction.

[0065] Figure 6 It is equivalent to Figure 5 A cross-sectional view of the chip at the head of the VI-VI line.

[0066] like Figure 6 As shown, in a side view taken from the X direction, the ejection channel 75 is formed in a curved shape that bulges toward the surface side. The ejection channel 75 is formed, for example, by having a disc-shaped dicer enter from the back side (+Z side) of the actuator plate 53. Specifically, the ejection channel 75 has upper cut portions 75a at both ends in the Y direction and ejection-side through portions 75b located between each upper cut portion 75a.

[0067] Viewed from the X direction, the upper cut portion 75a is an arc with a radius of curvature consistent with that of a slicing machine. As it leaves the ejection-side through portion 75b in the Y direction, the upper cut portion 75a bends toward the back side and extends simultaneously.

[0068] The ejection side through section 75b extends through the actuator plate 53 in the Z direction.

[0069] Figure 7 It is equivalent to Figure 5 Cross-sectional view of the chip at the head of line VII-VII.

[0070] like Figure 7 As shown, the non-ejection channel 76 sandwiches the drive wall 70 and is adjacent to the ejection channel 75 in the X direction. The non-ejection channel 76 is formed, for example, by having a circular plate-shaped slicing machine enter from the back side (+Z side) of the actuator plate 53. The non-ejection channel 76 has a non-ejection side through portion 76a and an upper cutting portion 76b.

[0071] The non-discharge side through-section 76a extends through the actuator plate 53 in the Z direction. That is, the groove depth of the non-discharge side through-section 76a is uniformly formed in the Z direction. The non-discharge side through-section 76a constitutes the portion of the non-discharge channel 76 except for the +Y side end.

[0072] The upper cut portion 76b forms the +Y side end of the non-ejection channel 76. Viewed from the X direction, the upper cut portion 76b is an arc shape with a radius of curvature consistent with, for example, the radius of curvature of a scriber. The upper cut portion 76b bends and extends toward the back side as it exits the non-ejection side through portion 76a in the Y direction. The non-ejection side through portion 76a of the non-ejection channel 76 penetrates the actuator plate 53 along both the Y and Z directions, opening on the side of the actuator plate 53 facing the -Y side. Thus, the non-ejection channel 76 communicates with the outside of the head chip 50.

[0073] Figure 8 It is along Figure 4 A cross-sectional view of line VIII-VIII.

[0074] like Figure 8 As shown, common electrodes 95 are formed on the inner surface of the discharge channel 75 extending in the Y direction (the inner surface of the drive wall 70 facing each discharge channel 75). The common electrodes 95 are formed throughout the entire area in the Z direction on the inner surface of the discharge channel 75. The length of the common electrodes 95 in the Y direction is equal to the length of the discharge-side through-section 75b of the discharge channel 75 (equal to the opening length of the discharge channel 75 at the surface of the actuator plate 53).

[0075] Individual electrodes 97 are formed on the inner surface 76c (the inner surface of the drive wall 70 facing each non-ejection channel 76) extending in the Y direction of the non-ejection channel 76. Individual electrodes 97 are formed throughout the entire region in the Z direction on the inner surface of the non-ejection channel 76.

[0076] like Figure 5 As shown, a plurality of common terminals 96 are formed on the surface of the actuator plate 53. The common terminals 96 are strips extending parallel to each other along the Y direction. Each common terminal 96 is connected to a pair of common electrodes 95 at the opening edge of the corresponding ejection channel 75.

[0077] On the surface of the actuator plate 53, in a portion located further in the -Y direction than the common terminal 96, a separate terminal 98 is formed. The separate terminal 98 is a strip extending in the X direction. The separate terminal 98 connects the separate electrodes 97, which are opposite each other in the X direction and sandwiched between the ejection channels 75, to each other at the opening edge of the non-ejection channels 76. Furthermore, a dividing groove 99 is formed in the portion located between the common terminal 96 and the separate terminal 98. The dividing groove 99 extends in the X direction and separates the common terminal 96 from the separate terminal 98.

[0078] like Figure 6As shown, a flexible printed circuit board 100 is press-fitted onto the surface of the actuator board 53. The flexible printed circuit board 100 is connected to a common terminal 96 and individual terminals 98 corresponding to the channel array 61. The flexible printed circuit board 100 extends from the -Y side to the +Z side of the actuator board 53.

[0079] like Figure 3 and Figure 4 As shown, the cover plate 54 is bonded to the back of the actuator plate 53 in a manner that closes the channel array 61. An inlet common ink chamber 120 and an outlet common ink chamber 121 are formed on the cover plate 54 at positions corresponding to the channel array 61.

[0080] The inlet common ink chamber 120 is formed at a position in the channel column 61 that overlaps with the +Y side end of the ejection channel 75 when viewed from above. The inlet common ink chamber 120 extends along the X direction across the length of the channel column 61 and has an opening on the back of the cover plate 54.

[0081] The outlet common ink chamber 121 is formed at a position in the channel column 61 that overlaps with the -Y side end of the ejection channel 75 when viewed from above. The outlet common ink chamber 121 extends along the X direction with a length spanning the channel column 61 and has an opening on the back of the cover plate 54.

[0082] In the entrance common ink chamber 120, an entrance slit 125 is formed at a position corresponding to the ejection channel 75 of the channel column 61. The entrance slit 125 connects the +Y side end of each ejection channel 75 to the inside of the entrance common ink chamber 120.

[0083] In the exit common ink chamber 121, an exit slit 126 is formed at a position corresponding to the ejection channel 75 of the channel column 61. The exit slit 126 connects the -Y side end of each ejection channel 75 to the interior of the exit common ink chamber 121. Therefore, the inlet slit 125 and the outlet slit 126 are connected to each ejection channel 75, but not to the non-ejection channel 76.

[0084] Intermediate plate 52 is joined to the surface of actuator plate 53 in a manner that closes the channel array 61. Intermediate plate 52, like actuator plate 53, is formed of a piezoelectric material such as PZT. For example, intermediate plate 52 is thinner in the Z direction than actuator plate 53. Intermediate plate 52 is shorter in the Y direction than actuator plate 53. Therefore, the Y-direction end of actuator plate 53 is exposed relative to intermediate plate 52 in the Y direction. The portion exposed from intermediate plate 52 at the Y-direction end of actuator plate 53 functions as a pressing area of ​​flexible printed circuit board 100. Furthermore, intermediate plate 52 may also be formed of a material other than piezoelectric material (e.g., a non-conductive material such as polyimide or alumina).

[0085] Figure 9 This is a bottom view of the intermediate plate and actuator plate of the first embodiment.

[0086] like Figure 9 As shown in the diagram, in the intermediate plate 52, corresponding to the channel row 61, there are connecting holes 130, non-through slots 150 and through holes 160.

[0087] When viewed from above, the connecting hole 130 overlaps with the discharge side through-section 75b of each discharge channel 75. On the surface side of the actuator plate 53, the connecting hole 130 is individually connected to the discharge side through-section 75b of the corresponding discharge channel 75.

[0088] The connecting hole 130 includes a groove 133 and a through portion 134. The groove 133 is recessed from the surface of the intermediate plate 52 and extends along the Y direction. The through portion 134 penetrates the intermediate plate 52 and communicates with the groove 133. In this embodiment, the dimension in the X direction of the through portion 134 is smaller than the dimension in the X direction of the groove 133. When viewed from above, the through portion 134 overlaps with the center of the groove 133 in the X direction and protrudes further to both sides in the Y direction than the groove 133.

[0089] The connecting hole 130 has two rows of connecting hole groups 136 and 137 arranged side by side along the X direction. The connecting hole group located on the +Y direction side of the two rows of connecting hole groups 136 and 137 is defined as the first connecting hole group 136, and the connecting hole 130 included in the first connecting hole group 136 is called the first connecting hole 131. The connecting hole group located on the -Y direction side of the two rows of connecting hole groups 136 and 137 is defined as the second connecting hole group 137, and the connecting hole 130 included in the second connecting hole group 137 is called the second connecting hole 132. A pair of adjacent connecting holes 130 in the X direction among the connecting holes 130 included in the two rows of connecting hole groups 136 and 137 are arranged offset from each other in the Y direction. Thus, the connecting holes 130 included in the two rows of connecting hole groups 136 and 137 are arranged in an alternating (chrysanthemum-like) configuration. Furthermore, regardless of their positional relationship in the Y direction, a pair of adjacent connecting holes 130 in the X direction are always connecting holes 130 that are close to each other in the X direction. That is, in the configuration of the connecting holes 130 arranged in an alternating manner in this embodiment, a pair of adjacent connecting holes 130 in the X direction are the first connecting hole 131 and the second connecting hole 132, and they are also adjacent in the Y direction.

[0090] Here, on the surface of the intermediate plate 52, interconnecting hole regions 138 and 139 are defined. Interconnecting hole regions 138 and 139 are the regions between the opening edges 130a of each adjacent pair of interconnecting holes 130 in each of the interconnecting hole groups 136 and 137. That is, interconnecting hole regions 138 and 139 are the first interconnecting hole region 138 between the opening edges 130a of each adjacent pair of first interconnecting holes 131 and the second interconnecting hole region 139 between the opening edges 130a of each adjacent pair of second interconnecting holes 132.

[0091] The non-through slot 150 opens only on the surface of the intermediate plate 52. A portion of the non-through slot 150 is located between a pair of adjacent connecting holes 130 in the X direction. The non-through slot 150 overlaps with the non-ejection channel 76 when viewed from above. A portion of the non-through slot 150 is located in the inter-connecting hole regions 138 and 139. The non-through slot 150 extends from between a pair of adjacent connecting holes 130 in the X direction to each of the first inter-connecting hole region 138 and the second inter-connecting hole region 139. The non-through slot 150 extends continuously from the first inter-connecting hole region 138 to the second inter-connecting hole region 139. The non-through slot 150 extends its full length in the Y direction in each of the inter-connecting hole regions 138 and 139. The non-through slot 150 protrudes further in the +Y direction than the first inter-connecting hole region 138 and further in the -Y direction than the second inter-connecting hole region 139. The non-through groove 150 extends in a straight line with a certain width along its entire length. When viewed from above, the non-through groove 150 extends at an angle relative to the Y direction.

[0092] Figure 10 It is Figure 9 A portion of the image is shown in enlarged form.

[0093] like Figure 10As shown, each non-through groove 150 is formed in such a way that it satisfies the following conditions relative to the surrounding connecting holes 130. Considering any one non-through groove 150, in the inter-connecting hole regions 138, 139, the minimum X-direction distance G1 between the non-through groove 150 and the opening edge 130a of the connecting hole 130 is larger than the minimum X-direction distance G2 between the opening edge 130a of the connecting hole 130 and the non-discharge channel 76. Specifically, in the first inter-connecting hole region 138, the minimum X-direction distance G11 between the non-through groove 150 and the opening edge 130a of the first connecting hole 131 is larger than the minimum X-direction distance G21 between the opening edge 130a of the first connecting hole 131 and the non-discharge channel 76. Furthermore, in the region 139 between the second connecting holes, the minimum distance G12 in the X direction between the non-through groove 150 and the opening edge 130a of the second connecting hole 132 is larger than the minimum distance G22 in the X direction between the opening edge 130a of the second connecting hole 132 and the non-ejection channel 76. Moreover, in this embodiment, the minimum distance in the X direction is the distance between two structures at the position in the Y direction where the distance in the X direction between two structures of the object is smallest.

[0094] like Figure 9 As shown, the through-hole 160 penetrates the intermediate plate 52 along the Z direction. The through-hole 160 does not overlap with the connecting hole regions 138 and 139 when viewed from above. The through-hole 160 opens within the non-through groove 150 and communicates with it. When viewed from above, the through-hole 160 coincides with the non-ejection side through-section 76a of each non-ejection channel 76. The through-hole 160 communicates with the non-ejection side through-section 76a of the corresponding non-ejection channel 76 on the surface side of the actuator plate 53. Thus, the through-hole 160 communicates with the outside of the head chip 50 through the non-ejection channel 76. Furthermore, in the illustrated example, the through-hole 160 is formed in a circular shape when viewed from above, but the shape of the through-hole 160 is not particularly limited; it may also be formed, for example, in a rectangular or oblong shape when viewed from above.

[0095] like Figure 4 As shown, the nozzle plate 51 is bonded to the surface of the intermediate plate 52. The nozzle plate 51 has the same width in the Y direction as the intermediate plate 52. In this embodiment, the nozzle plate 51 is formed of a metallic material such as stainless steel (stainless steel or Ni-Pd, etc.). However, in addition to metallic materials, the nozzle plate 51 may also be based on a resin material such as polyimide, or a single-layer or laminated structure of glass, silicon, etc.

[0096] On the nozzle plate 51, two rows of nozzles extending in the X direction are formed at intervals along the Y direction (nozzle row A 141 and nozzle row B 142). Nozzle row A 141 corresponds to the first connecting hole group 136. Nozzle row B 142 corresponds to the second connecting hole group 137. Each nozzle row 141, 142 has a plurality of nozzle holes 145, 146 (spray holes) penetrating the nozzle plate 51 in the Z direction. The plurality of nozzle holes 145, 146 are the nozzle A hole 145 included in nozzle row A 141 and the nozzle B hole 146 included in nozzle row B 142. Each nozzle hole 145, 146 is arranged at intervals along the X direction. Each nozzle hole 145, 146 is formed in a tapering shape, for example, with the inner diameter gradually decreasing from the back side to the front side.

[0097] like Figure 6 and Figure 7 As shown, nozzle A hole 145 is individually connected to the discharge channel 75 via the first connecting hole 131. Nozzle B hole 146 is individually connected to the discharge channel 75 via the second connecting hole 132. The connecting holes 130 are arranged in an alternating manner, and therefore the nozzle holes 145 and 146 are also arranged in an alternating manner. The nozzle plate 51 does not have a hole communicating with the non-through groove 150 of the intermediate plate 52, but instead completely blocks the non-through groove 150 from the surface.

[0098] <Manufacturing Method of Head Chip> The manufacturing method of the head chip 50 according to this embodiment will be described. The manufacturing method of the head chip according to this embodiment includes a first bonding process (intermediate board bonding process), a first inspection process, a non-through groove forming process, a through hole forming process, a second bonding process, and a second inspection process.

[0099] Figures 11 to 13 This diagram illustrates the manufacturing method of the head chip according to the first embodiment, and is equivalent to... Figure 8 Cross-sectional view.

[0100] like Figure 11 As shown, in the first joining step, the intermediate plate 52 is joined relative to the actuator plate 53 by aligning it in the Z direction. For example, the actuator plate 53 and the intermediate plate 52 are joined by an adhesive. In the first joining step, neither the connecting hole 130 nor the through hole 160 is formed on the intermediate plate 52 joined to the actuator plate 53. Furthermore, in Figures 11 to 13 In the figures, the illustrations of the common electrode 95 formed on the inner surface of the discharge channel 75 and the individual electrode 97 formed on the inner surface 76c of the non-discharge channel 76 are omitted.

[0101] Next, in the first inspection step, a poor fit is detected at the joint between the actuator plate 53 and the intermediate plate 52. The poor fit to be detected is a leakage path connecting the discharge channel 75 and the non-discharge channel 76. In the first inspection step, each discharge channel 75 is vacuumed to determine if there is a leak. If a leakage path connecting the discharge channel 75 and the non-discharge channel 76 exists, gas flows from the non-discharge channel 76, which opens on the side of the actuator plate 53, into the discharge channel 75 through the leakage path, thus detecting a poor fit.

[0102] Next, as Figure 12 As shown, in the non-through groove forming process, non-through grooves 150 are formed on the intermediate plate 52. For example, in the non-through groove forming process, a laser is used to form the non-through grooves 150 on the intermediate plate 52. In this case, it is ideal to continuously scan the laser, forming each non-through groove 150 as a whole rather than partially.

[0103] Next, as Figure 13 As shown, in the through-hole forming process, connecting holes 130 and through holes 160 are formed on the intermediate plate 52. For example, in the through-hole forming process, a laser is used to form connecting holes 130 and through holes 160 on the intermediate plate 52. Furthermore, the order in which connecting holes 130 and through holes 160 are formed is not particularly limited. Alternatively, the through-hole forming process can be performed before the non-through-groove forming process. Alternatively, the through-hole forming process can be performed simultaneously with the non-through-groove forming process. In this case, the non-through-groove 150 and through holes 160 can also be formed by a series of laser scans. However, it is ideal to perform the through-hole forming process after the first joining process, which can improve the positional accuracy of the ejection channel 75 and the connecting hole 130, and the positional accuracy of the non-ejection channel 76 and the through hole 160.

[0104] Next, in the second joining process, the nozzle plate 51, which has nozzle holes 145 and 146, is joined relative to the intermediate plate 52 on the side opposite to the actuator plate 53. For example, the intermediate plate 52 and the nozzle plate 51 are joined by an adhesive. By joining the nozzle plate 51 to the intermediate plate 52, the nozzle holes 145 and 146 are connected to the connecting hole 130, and the non-through groove 150 is completely closed by the nozzle plate 51.

[0105] Next, in the second inspection step, poor fit is detected at the joint between the intermediate plate 52 and the nozzle plate 51. The poor fit to be detected is a leakage path that connects the connecting hole 130 and the non-through groove 150. In the second inspection step, with the nozzle holes 145 and 146 blocked, each discharge channel 75 is vacuumed to determine whether there is a leak. The nozzle holes 145 and 146 are blocked by aligning a fixture (not shown) with the nozzle plate 51 on the side opposite to the intermediate plate 52. If a leakage path exists that connects the connecting hole 130 and the non-through groove 150, gas flows from the non-discharge channel 76, which opens on the side of the actuator plate 53, through the through hole 160, the non-through groove 150, the leakage path, and the connecting hole 130 into the discharge channel 75, thus enabling the detection of poor fit.

[0106] Then, the flexible printed circuit board 100 is pressed onto the object that has passed the second inspection process to complete the head chip 50.

[0107] Furthermore, in this embodiment, an intermediate plate 52 in which the connecting hole 130 is not formed in the first joining process is used, but this is not a limitation. That is, an intermediate plate 52 in which the connecting hole 130 is formed in the first joining process can also be used. In this case, in the first inspection process, by using a fixture to block the connecting hole 130 in the same way as in the second inspection process, a leakage path connecting the discharge channel 75 and the non-discharge channel 76 can be detected.

[0108] As described above, the head chip 50 of this embodiment includes: an intermediate plate 52 having a connecting hole 130 communicating with the ejection channel 75 and a non-through groove 150 communicating with the non-ejection channel 76 through a through hole 160; and a nozzle plate 51 that overlaps with the intermediate plate 52 in a state that closes the non-through groove 150, and has nozzle holes 145 and 146 communicating with the connecting hole 130 and ejecting ink contained in the ejection channel 75.

[0109] According to this configuration, the poorly joined portion of the intermediate plate 52 and the nozzle plate 51 is connected to the through hole 130 and the non-through groove 150 of the intermediate plate 52, thereby connecting the through hole 130 and the non-through groove 150 via the poorly joined portion. Thus, the discharge channel 75 and the nozzle holes 145 and 146 of the intermediate plate 52 are connected. The through hole 160 is connected to the outside of the head chip 50 via the non-discharge channel 76. Therefore, by detecting leakage when the nozzle holes 145 and 146 are blocked and the discharge channel 75 is vacuum-pumped, the through hole 160 and the non-through groove 150 can function as a leakage detection flow path connecting the poorly joined portion to the non-discharge channel 76, thereby detecting the presence of the poorly joined portion.

[0110] In particular, the non-through groove 150 is located in the inter-hole regions 138 and 139 on the surface of the intermediate plate 52, thus enabling efficient detection of poor joints in the inter-hole regions 138 and 139. Furthermore, since the non-through groove 150 does not open towards the actuator plate 53, the shape of the leakage detection flow path can be increased compared to a configuration where only through holes form the leakage detection flow path.

[0111] Then, in this embodiment, in the regions 138 and 139 between each connecting hole, the minimum distance G1 in the X direction between the non-through groove 150 and the opening edge 130a of the connecting hole 130 is set to be larger than the minimum distance G2 in the X direction between the opening edge 130a of the connecting hole 130 and the non-discharge channel 76. Since adjacent connecting holes 130 in the X direction are offset from each other in the Y direction, when considering a pair of adjacent connecting holes 130 in the X direction (first connecting hole 131 and second connecting hole 132), unlike their configuration where they are arranged side-by-side in the X direction, even if the minimum distance G1 between the opening edge 130a of one connecting hole 130 (e.g., first connecting hole 131) and the non-through groove 150 is made larger than the minimum distance G2 between the non-discharge channel 76, it is possible to suppress the non-through groove 150 from approaching another connecting hole (e.g., second connecting hole 132). This allows for an increase in the X-direction width of the joint between the intermediate plate 52 and the nozzle plate 51. Specifically, it ensures sufficient adhesion between the intermediate plate 52 and the nozzle plate 51 between the non-through groove 150 and the through hole 130. Consequently, the intermediate plate 52 and the nozzle plate 51 can be bonded together more reliably.

[0112] By doing so, the reduction in the amount of adhesive between the intermediate plate 52 and the nozzle plate 51 caused by the setting of the non-through groove 150 is suppressed, and the poor bonding between the intermediate plate 52 and the nozzle plate 51 is detected at the same time, thus suppressing the decline in printing quality caused by poor bonding.

[0113] Furthermore, the non-through groove 150 extends along the entire length of the Y direction in the first connecting hole region 138. According to this configuration, the non-through groove 150 is provided on the shortest path connecting the pair of first connecting holes 131 sandwiching the first connecting hole region 138. The non-through groove 150 also extends along the entire length of the Y direction in the second connecting hole region 139. Therefore, at locations where hydraulic pressure can be easily applied, poor engagement that could cause accidental connection between the ejection channels 75 can be detected.

[0114] Furthermore, the non-through groove 150 extends from the region between the first connecting holes 138 to the region between the second connecting holes 139. According to this configuration, the non-through groove 150 is provided on the shortest path connecting a pair of adjacent connecting holes 130 in the Y direction (the first connecting hole 131 and the second connecting hole 132). Therefore, in areas where hydraulic pressure can be easily applied, poor engagement that could cause accidental connection between the ejection channels 75 can be detected.

[0115] In the case where a non-through groove is formed using a laser, assuming that a bend exists in the non-through groove when viewed from above, the laser irradiation density locally increases at the bend, potentially leading to accidental penetration or debris generation. In this embodiment, the non-through groove 150 extends in a straight line along its entire length, thus preventing bends from forming when viewed from above and enabling the non-through groove 150 to be formed uniformly along its entire length. Therefore, it is possible to suppress the decrease in reliability caused by accidental penetration during the formation of the non-through groove 150.

[0116] Furthermore, in the first embodiment, the through-hole forming process is performed after the intermediate plate bonding process. Therefore, regardless of the alignment accuracy of the actuator plate 53 and the intermediate plate 52, the through-hole 160 can be formed at the desired position relative to the non-ejection channel 76 during the through-hole forming process. Thus, in the head chip 50 equipped with an intermediate plate 52 having a through-hole 160 communicating with the non-ejection channel 76, an improved yield during manufacturing can be achieved.

[0117] Furthermore, in the first embodiment, the first bonding step is performed before the non-through-groove formation step, but it can also be performed after the non-through-groove formation step. Therefore, the step of forming the non-through-groove 150 on the intermediate plate 52 can be performed in parallel with the step preceding the first bonding step in the head chip manufacturing process. Thus, the head chip manufacturing period can be shortened.

[0118] [Second Implementation] Next, refer to Figure 14 The second embodiment will now be described.

[0119] Figure 14 This is a bottom view of the intermediate plate and actuator plate of the second embodiment.

[0120] like Figure 14 As shown in the diagram, the intermediate plate 52 of this embodiment has a non-through groove 250 and a through hole 260 instead of the non-through groove 150 and through hole 160 of the first embodiment. Furthermore, the configuration is the same as that of the first embodiment, except as described below.

[0121] The non-through groove 250 has a transverse portion 251, 252 extending transversely through the inter-hole regions 138, 139 in the Y direction, and a connecting portion 254 connecting the transverse portion 251, 252 to the through hole 260 on the outside of the inter-hole regions 138, 139.

[0122] Transverse portions 251 and 252 extend along the Y direction at the center position of a pair of connecting holes 130 sandwiching the regions 138 and 139 between the connecting holes. Transverse portions 251 and 252 extend in a straight line with a certain width. Transverse portions 251 and 252 extend along the Y direction such that the distances at each position in the Y direction relative to each of the pair of connecting holes 130 located on both sides in the X direction are equal. One transverse portion 251 and one transverse portion 252 are formed in each region 138 and 139 between the connecting holes. Specifically, the transverse portions 251 and 252 are a first transverse portion 251 extending along the Y direction at the center position of a pair of first connecting holes 131 sandwiching the first connecting hole region 138, and a second transverse portion 252 extending along the Y direction at the center position of a pair of second connecting holes 132 sandwiching the second connecting hole region 139. The transverse portions 251 and 252 extend along the entire length of the Y direction in the regions 138 and 139 between the connecting holes, protruding to both sides in the Y direction.

[0123] The connecting portion 254 is formed only between adjacent connecting hole regions 138 and 139 along the Y direction. The connecting portion 254 connects the end of the first transverse portion 251 on the side of the second connecting hole region 139 to the end of the second transverse portion 252 on the side of the first connecting hole region 138. A portion of the connecting portion 254 overlaps with the non-discharge channel 76 when viewed from above. In this embodiment, the connecting portion 254 includes a middle portion 255 extending along the Y direction at a position overlapping with the non-discharge channel 76 when viewed from above, and a connecting portion 256 connecting the end of the middle portion 255 to the ends of the transverse portions 251 and 252. The middle portion 255 is formed only on the outer side of the connecting hole regions 138 and 139. The middle portion 255 extends linearly with a certain width. The connecting portion 256 connects to the middle portion 255 and the transverse portions 251 and 252 adjacent to the middle portion 255 in the X direction via a bend. The connecting portion 256 extends along the X direction on the outside of the regions 138 and 139 between the connecting holes. The connecting portion 256 extends in a straight line with a certain width.

[0124] Figure 15 It is Figure 14 A portion of the image is shown in enlarged form.

[0125] like Figure 15As shown, each non-through groove 250 is formed in such a way that it satisfies the following conditions relative to the surrounding connecting holes 130. Considering any one non-through groove 250, in the inter-connecting hole regions 138, 139, the minimum X-direction distance G1 between the non-through groove 250 and the opening edge 130a of the connecting hole 130 is larger than the minimum X-direction distance G2 between the opening edge 130a of the connecting hole 130 and the non-discharge channel 76. Specifically, in the first inter-connecting hole region 138, the minimum X-direction distance G11 between the non-through groove 250 and the opening edge 130a of the first connecting hole 131 is larger than the minimum X-direction distance G21 between the opening edge 130a of the first connecting hole 131 and the non-discharge channel 76. Furthermore, in the second connecting hole region 139, the minimum X-direction spacing G12 between the non-through groove 250 and the opening edge 130a of the second connecting hole 132 is larger than the minimum X-direction spacing G22 between the opening edge 130a of the second connecting hole 132 and the non-ejection channel 76.

[0126] like Figure 14 As shown, the through-hole 260 opens within the connecting portion 254 of the non-through groove 250 and communicates with the non-through groove 250. In this embodiment, the through-hole 260 opens within the middle portion 255 of the connecting portion 254. The through-hole 260 coincides with the non-ejection side through-hole 76a of each non-ejection channel 76 when viewed from above. The through-hole 260 communicates with the non-ejection side through-hole 76a of the corresponding non-ejection channel 76 on the surface side of the actuator plate 53. Thus, the through-hole 260 communicates with the outside of the head chip 50 through the non-ejection channel 76. Furthermore, in the illustrated example, the through-hole 260 is formed in a circular shape when viewed from above, but the shape of the through-hole 260 is not particularly limited, and it may also be formed, for example, in a rectangular or oblong shape when viewed from above.

[0127] Furthermore, the method for forming the non-through groove 250 in this embodiment is not particularly limited, but it can be formed simultaneously, for example, using a laser. In this case, the transverse portions 251 and 252 of the non-through groove 250 are scanned by a laser in a reciprocating manner along the Y direction, thereby enabling the simultaneous formation of each of the transverse portions 251 and 252 and the connecting portion 254 connected to the transverse portions 251 and 252.

[0128] Thus, in this embodiment, in the regions 138 and 139 between each connecting hole, the minimum distance G1 in the X direction between the non-through groove 250 and the opening edge 130a of the connecting hole 130 is set to be larger than the minimum distance G2 in the X direction between the opening edge 130a of the connecting hole 130 and the non-discharge channel 76. Therefore, similar to the first embodiment, the amount of adhesion between the intermediate plate 52 and the nozzle plate 51 between the non-through groove 250 and the connecting hole 130 can be ensured. Consequently, the intermediate plate 52 and the nozzle plate 51 can be adhered more reliably.

[0129] Furthermore, the non-through groove 250 extends linearly along the Y direction as transverse portions 251 and 252 at each of the inter-hole regions 138 and 139. According to this configuration, compared to the case where the non-through groove extends in an inclined direction relative to the Y direction in the inter-hole regions, the minimum distance G1 between the non-through groove 250 and the pair of inter-holes 130 sandwiching the inter-hole regions 138 and 139 can be increased. Therefore, the amount of adhesion between the intermediate plate 52 and the nozzle plate 51 can be ensured between the non-through groove 250 and the inter-holes 130.

[0130] Furthermore, in the second embodiment described above, one transverse portion 251, 252 is provided in each of the inter-connecting hole regions 138, 139, but this configuration is not limited to this. It can also be formed in such a way that two transverse portions are provided in each of the inter-connecting hole regions 138, 139, and their ends are connected to each other on the outside of the inter-connecting hole regions 138, 139.

[0131] Furthermore, in the second embodiment described above, the connecting portion 254 of the non-through groove 250 is formed in a shape with a bend, but this configuration is not limited. For example, the connecting portion of the non-through groove may also extend in a straight line in a manner that connects the ends of the transverse portions 251 and 252 to each other.

[0132] Furthermore, the scope of this disclosure is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of this disclosure.

[0133] For example, in the above embodiment, an inkjet printer 1 was described as an example of a liquid jet recording device, but it is not limited to a printer. For example, it could also be a fax machine or an on-demand printer.

[0134] In the above embodiments, a configuration in which the inkjet head moves relative to the recorded medium during printing (a so-called reciprocating print machine) has been described as an example, but it is not limited to this configuration. The configuration disclosed herein can also be used in a configuration in which the recorded medium moves relative to the inkjet head while the inkjet head is fixed (a so-called fixed-head print machine).

[0135] In the above embodiment, the configuration in which the Z direction is aligned with the vertical direction has been described, but it is not limited to this configuration; the Z direction may also be aligned with the horizontal direction.

[0136] In the above embodiments, a side-ejecting head chip has been described, but it is not limited thereto. This disclosure can also be applied to, for example, so-called edge-ejecting type head chips that eject ink from the end in the extension direction of the ejection channel.

[0137] In the above embodiment, the configuration in which the actuator plate 53, the intermediate plate 52, and the nozzle plate 51 are sequentially joined has been described, but the configuration is not limited to this. Other components may also be provided between the actuator plate 53 and the intermediate plate 52 or between the intermediate plate 52 and the nozzle plate 51.

[0138] In the above embodiments, the case where the recording medium P is paper has been described, but the configuration is not limited to this. The recording medium P is not limited to paper, but may also be a metal material, a resin material, or even food, etc.

[0139] In the above embodiments, the configuration of the liquid jet head mounted on the liquid jet recording device has been described, but the configuration is not limited to this. That is, the liquid jetted from the liquid jet head is not limited to the liquid hitting the recording medium, but may also be, for example, a medicine liquid prepared in a dispensing process, or a food additive such as seasonings or spices added to food, or a fragrance sprayed into the air.

[0140] In the above embodiment, there is one channel column, but multiple channel columns may also be provided. In this case, the configuration of the above embodiment can also be applied to each channel column. In addition, the connecting hole group and nozzle column may also be provided in three or more columns in each channel column.

[0141] In the above embodiment, the non-through grooves 150 and 250 extend continuously over the first connecting hole region 138 to the second connecting hole region 139, but are not limited to this configuration. The non-through grooves may also extend from between a pair of connecting hole regions toward only one connecting hole region.

[0142] In the above embodiments, the non-through grooves 150 and 250 extend with a certain width, but are not limited to this configuration. For example, the non-through grooves may also be widened at the location of the through hole opening.

[0143] In the above embodiment, the connecting hole 130 of the intermediate plate 52 has a groove 133 and a through portion 134, but the shape of the connecting hole is not limited to this. For example, the connecting hole may not have a groove, and the groove may have the same length as the through portion in the Y direction. In addition, the shape of the opening edge of the connecting hole on the surface of the nozzle plate may also be formed in, for example, a rectangular shape, a circular shape, an oblong shape, etc.

[0144] Furthermore, without departing from the spirit of the present invention, the constituent elements in the above embodiments can be appropriately replaced with well-known constituent elements, and the above embodiments can also be appropriately combined.

[0145] Symbol Explanation 1……Printer (Liquid Jet Recording Device) 5……Inkjet Head (Liquid Jet Head) 50……Head Chip 51……Nozzle Board (Jet Orifice Board) 52……Intermediate Board 53……Actuator Board 61……Channel Array 75……Ejection Channel (Jet Channel) 76……Non-Ejection Channel (Non-Jet Channel) 130……Connecting Hole 130a……Opening Edge 136, 137……Connecting Hole Group 138, 139……Inter-connecting Hole Area 145, 146……Nozzle Orifice (Jet Orifice) 150, 250……Non-through Groove 160, 260……Through Hole

Claims

1. A head chip, which is a liquid-jetting head chip, wherein, have: An actuator plate having injection channels and non-injection channels extending along a first direction, arranged alternately along a second direction in a manner that overlaps with each other along a second direction that intersects the first direction; An intermediate plate, which coincides with the actuator plate, and has a group of multiple rows of connecting holes arranged in a row along the second direction for each channel column, each communicating with the injection channel individually. as well as The injection plate overlaps with the intermediate plate on the side opposite to the actuator plate, and has injection holes that communicate separately with the communication hole and inject liquid contained in the injection channel. In the multi-row connecting hole group, adjacent connecting holes in the second direction are arranged in a manner that offsets them from each other along the first direction. The intermediate plate has the following components: The non-through groove has an opening on the side of the injection orifice plate, which is blocked by the injection orifice plate. and The through hole communicates with the non-through slot and, through the non-jet channel, communicates with the outside of the head chip. When the area between the opening edges of a pair of adjacent connecting holes in a given group of connecting holes on the surface of the injection orifice plate in the intermediate plate is defined as the inter-connecting hole area, A portion of the non-through groove is located in the region between the connecting holes. The minimum distance between the opening edge of the connecting hole and the second direction of the non-through groove in the region between the connecting holes is greater than the minimum distance between the opening edge of the connecting hole and the second direction of the non-jet channel.

2. The head chip according to claim 1, wherein, The non-through groove extends along the entire length of the first direction in the region between the connecting holes.

3. The head chip according to claim 1 or claim 2, wherein, The non-through groove extends from one of the inter-hole regions to the other corresponding to each of the pair of inter-hole groups adjacent in the first direction.

4. The head chip according to claim 1 or claim 2, wherein, The non-through groove extends in a straight line along its entire length.

5. The head chip according to claim 1 or claim 2, wherein, The non-through groove extends in a straight line along the first direction in the region between the connecting holes.

6. A liquid injection head comprising a head chip according to any one of claims 1 to 5.

7. A liquid jet recording device comprising a liquid jet head according to claim 6.

8. A method for manufacturing a head chip, comprising the following method: have: An actuator plate having injection channels and non-injection channels extending along a first direction, arranged alternately along a second direction in a manner that overlaps with each other along a second direction that intersects the first direction; An intermediate plate, which coincides with the actuator plate, and having, for each channel column, a group of multiple rows of connecting holes arranged in a row along the second direction, each communicating individually with the injection channel; and The injection plate overlaps with the intermediate plate on the side opposite to the actuator plate, and has injection holes that communicate separately with the communication hole and inject liquid contained in the injection channel. In the multi-row connecting hole group, adjacent connecting holes in the second direction are arranged in a manner that offsets them from each other along the first direction. in, The method for manufacturing the head chip includes: The non-through groove forming process involves forming a non-through groove on the intermediate plate with an opening on the side of the injection orifice plate and which is then closed by the injection orifice plate; and The through-hole forming process involves forming a through-hole in the intermediate plate that communicates with the non-through-hole and with the outside of the head chip through the non-jet channel. When the area between the opening edges of a pair of adjacent connecting holes in a given group of connecting holes on the surface of the injection orifice plate in the intermediate plate is defined as the inter-connecting hole area, In the non-through groove forming process, a portion of the non-through groove is formed in the region between the connecting holes, and the minimum distance between the opening edge of the connecting hole in the region between the connecting holes and the second direction of the non-through groove is set to be larger than the minimum distance between the opening edge of the connecting hole and the second direction of the non-jet channel.

9. The method for manufacturing a head chip according to claim 8, wherein, It also includes an intermediate plate joining process for joining the intermediate plate to the actuator plate. The through-hole forming process is performed after the intermediate plate joining process.

10. The method for manufacturing a head chip according to claim 8 or claim 9, wherein, The system includes an intermediate plate joining process for joining the intermediate plate to the actuator plate. The intermediate plate joining process is performed after the non-through groove forming process.

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