Head chip, liquid ejection head, liquid ejection recording apparatus, and method for manufacturing head chip

Abstract

A head chip, a liquid jetting head, a liquid jetting recording device, and a method for manufacturing a head chip are provided, which can ensure a permissible amount of positional deviation between the nozzle orifice and the connecting hole while ensuring the bonding area between the actuator plate and the intermediate plate. In one embodiment of the head chip, an actuator plate, a nozzle plate disposed facing the actuator plate, and an intermediate plate disposed between the actuator plate and the nozzle plate are included. The connecting hole has a groove portion having a lower opening facing the nozzle orifice and a through portion having an upper opening facing the ejection channel. The X-direction dimension of the upper opening portion is larger than the X-direction dimension of the channel opening portion that opens onto the channel opening surface in the ejection channel, and the X-direction dimension of the upper opening portion is smaller than the X-direction dimension of the channel opening portion that opens into the channel opening surface in the ejection channel.

Description

Technical Field

[0001] This disclosure relates to a head chip, a liquid jetting head, a liquid jetting recording device, and a method for manufacturing the head chip. Background Technology

[0002] The head chip mounted in an inkjet printer has an actuator board with multiple channels and a nozzle board attached to the actuator board. Multiple nozzle holes, each communicating with one of the multiple channels, are formed on the nozzle board.

[0003] In the head chip, ink is ejected through the nozzle orifice by changing the volume of the channel.

[0004] In recent years, with the miniaturization or narrowing of channels, the allowable deviation between the actuator plate (channel) and the nozzle plate (nozzle orifice) has decreased. If, for example, the engagement position of the nozzle plate relative to the actuator plate deviates along the channel alignment direction, there is a possibility of decreased ejection characteristics or ink leakage.

[0005] Patent Document 1 discloses a configuration in which an intermediate plate is disposed between an actuator plate and a nozzle plate. A connecting hole is formed in the intermediate plate, communicating with both the channel and the nozzle orifice. The connecting hole is larger than the channel and nozzle orifice in the channel's arrangement direction. Based on this configuration, it is believed that by connecting the channel and nozzle orifice through the connecting hole, the allowable range of positional deviation between the channel and nozzle orifice can be increased compared to the case where the channel and nozzle orifice are directly connected.

[0006] Prior art literature Patent documents Patent document 1: Japanese Patent Application Publication No. 2019-42979. Summary of the Invention

[0007] The problem that the invention aims to solve In the case of using an intermediate plate, consider the method of joining the intermediate plate to the actuator plate after forming a connecting hole in the intermediate plate (method 1) and the method of forming a connecting hole after joining the intermediate plate to the actuator plate (method 2).

[0008] When using the first method, high precision is required for the alignment of the connecting holes and channels when bonding the intermediate plate to the actuator plate. If the connecting holes are enlarged to reduce the required positional precision, it becomes difficult to ensure the bonding area between the intermediate plate and the actuator plate. The decrease in bonding area becomes a major cause of intermediate plate peeling or ink leakage.

[0009] When using the second method, the portion of the intermediate plate that overlaps with the channel needs to be made larger than the channel. Therefore, when making the intermediate plate a through hole, there is a possibility that the machining extends to the mating surface of the actuator plate with the intermediate plate. If the mating surface is machined, it becomes a major cause of intermediate plate peeling or ink leakage.

[0010] This disclosure provides a head chip, a liquid jet head, a liquid jet recording device, and a method for manufacturing the head chip, which can ensure a permissible amount of positional deviation between the nozzle orifice and the connecting hole while ensuring the joint area between the actuator board and the intermediate board.

[0011] Solution for solving the problem To address the aforementioned issues, this disclosure adopts the following form.

[0012] (1) One aspect of the present disclosure includes: an actuator plate having a plurality of jet channels extending along the first direction arranged along a second direction intersecting the first direction; a jet hole plate having a plurality of jet holes for ejecting liquid, disposed facing the channel opening surface of the jet channel opening in the actuator plate; and an intermediate plate having a connecting hole for communicating between the jet channels and the jet holes, disposed between the actuator plate and the jet hole plate, the connecting hole having: a groove having a first opening opening toward the jet hole and recessed toward the direction away from the jet hole plate; and a through portion having a second opening opening toward the jet channel and communicating with the groove in a region including at least the groove to penetrate the intermediate plate, wherein the size of the second direction in the first opening is larger than the size of the second direction in the second opening, and the size of the second direction in the second opening is less than the size of the second direction in the channel opening of the jet channel opening on the channel opening surface.

[0013] According to this configuration, the dimension in the second direction of the second opening is less than or equal to the dimension in the second direction of the channel opening, thus easily ensuring the contact area between the intermediate plate and the actuator plate. As a result, the contact strength between the intermediate plate and the actuator plate can be ensured, suppressing peeling of the intermediate plate or leakage of liquid between the intermediate plate and the actuator plate.

[0014] Furthermore, even when the through section is formed as a post-processing step after the intermediate plate and actuator plate are joined, it is possible to prevent damage from affecting the actuator plate during the processing of the through section.

[0015] Furthermore, the dimension in the second direction of the first opening is larger than the dimension in the second direction of the second opening. Therefore, compared to the case where the injection hole and the injection channel are directly connected, it is easier to align the groove and the injection hole during the joining of the intermediate plate and the injection hole plate. That is, the dimension in the second direction of the groove can accommodate the positional deviation between the groove and the injection hole. As a result, it is possible to achieve miniaturization or narrowing of the injection channel while ensuring the positioning accuracy between the injection hole and the injection channel.

[0016] As a result, it is possible to improve the durability of the head chip while ensuring the bonding area between the actuator board and the intermediate board, and to ensure the allowable deviation of the position of the injection hole and the connecting hole, thereby achieving miniaturization or narrowing of the injection channel.

[0017] (2) In the head chip involved in the above-mentioned (1) configuration, it is preferable that if the direction intersecting the above-mentioned second direction when viewed from the thickness direction of the above-mentioned intermediate plate is taken as the third direction, the size of the above-mentioned third direction in the above-mentioned through portion is smaller than the size of the above-mentioned third direction in the above-mentioned channel opening portion.

[0018] According to this configuration, the dimension in the third direction of the through portion is shorter than the dimension in the third direction of the channel opening portion. Therefore, even if the through portion is formed as a post-processing step after the intermediate plate and the actuator plate are joined, it is possible to suppress damage from the through portion processing that could affect the channel opening surface of the actuator plate.

[0019] Furthermore, the formation area of ​​the through-hole can be reduced, thus shortening the processing time of the through-hole. As a result, the manufacturing efficiency of the head chip can be improved.

[0020] (3) In the head chip involved in the above-mentioned (1) or (2) configuration, it is preferable that the aforementioned channel opening surface faces the thickness direction of the aforementioned actuator plate, and the aforementioned through portion protrudes to both sides of the aforementioned first direction relative to the aforementioned groove portion.

[0021] According to this design, the dimension in the first direction of the groove is smaller than that of the through section, thus shortening the machining time of the groove. As a result, manufacturing efficiency can be improved.

[0022] Furthermore, the dimension in the first direction of the through section is wider than that of the groove section, so that when the liquid flows in the first direction within the jet channel, the through section can function as an ink flow path together with the jet channel. As a result, it is easy to ensure the cross-sectional area of ​​the ink flow path and reduce pressure loss.

[0023] (4) In the head chip involved in the above-mentioned (1) or (2) configuration, it is preferable that the aforementioned channel opening surface faces the thickness direction of the aforementioned actuator plate, and the aforementioned through portion protrudes to one side of the aforementioned first direction relative to the aforementioned groove portion.

[0024] According to this design, the dimension in the first direction of the groove is smaller than that of the through section, thus shortening the machining time of the groove. As a result, manufacturing efficiency can be improved.

[0025] Furthermore, the dimension in the first direction of the through section is wider than that of the groove section, so that when the liquid flows in the first direction within the jet channel, the through section can function as an ink flow path together with the jet channel. As a result, it is easy to ensure the cross-sectional area of ​​the ink flow path and reduce pressure loss.

[0026] In particular, by making the groove protrude in the direction where the pressure tends to be higher on both sides of the groove in the first direction, the processing time of the through section can be shortened as much as possible while reducing the pressure loss on one side in the first direction.

[0027] (5) In the head chip involved in any of the above-mentioned (1) to (4) forms, it is preferable that the dimension from the first opening to the bottom surface of the groove in the thickness direction of the intermediate plate is larger than the dimension from the bottom surface of the groove to the second opening.

[0028] According to this design, the depth of the groove can be ensured, and therefore, when the intermediate plate and the injection orifice plate are joined, the space in the groove located on the outer side in the second direction relative to the through section can be used as an adhesive receiving section. Therefore, it is possible to suppress the flow of adhesive into the through section and prevent the adhesive from affecting the spraying performance.

[0029] (6) In any of the forms described in (1) to (5) above, it is preferable that a bulge portion protruding from the bottom surface is formed in the portion of the bottom surface of the aforementioned groove near the aforementioned through portion in the aforementioned second direction.

[0030] According to this configuration, when the intermediate plate and the injection orifice plate are joined, the space in the groove located further outward in the second direction than the bulge can be used as an adhesive receiving portion. In this case, the flow of adhesive into the through portion can be restricted by the bulge, thereby preventing the adhesive from affecting the spraying performance.

[0031] (7) The liquid injection head of one embodiment of the present disclosure has the head chip of any one of the embodiments (1) to (6) above.

[0032] Based on this embodiment, having the head chip described above, a high-quality and highly reliable liquid jet head can be provided.

[0033] (8) One embodiment of the liquid jet recording apparatus disclosed herein includes the liquid jet head of the embodiment described in (10) above.

[0034] Based on this design, a high-quality and highly reliable liquid jet recording device can be provided.

[0035] (9) A head chip manufacturing method according to one aspect of the present disclosure includes the following: an actuator plate having a plurality of jet channels extending along the first direction arranged along a second direction intersecting the first direction; a jet hole plate having a plurality of jet holes for ejecting liquid, disposed facing the channel opening faces of the jet channel openings in the actuator plate; and an intermediate plate having a connecting hole for communicating between the jet channels and the jet holes, disposed between the actuator plate and the jet hole plate. The head chip manufacturing method includes: a connecting hole forming step, which forms the connecting hole in the intermediate plate; and a jet hole plate stacking step, which stacks the jet hole plate relative to the intermediate plate; the connecting hole forming step includes: a groove forming step, which forms a groove having an opening facing the jet hole. The first opening is recessed toward the direction away from the aforementioned injection orifice plate, and a groove is formed in the aforementioned intermediate plate; and a through-section forming process, which passes through the aforementioned intermediate plate through a second opening having an opening toward the aforementioned injection channel and in a region including at least the aforementioned groove, and forms a through-section in the aforementioned intermediate plate. In the aforementioned groove forming process, the size of the aforementioned second direction in the aforementioned first opening is set to be larger than the size of the aforementioned second direction in the aforementioned second opening. In the aforementioned through-section forming process, the size of the aforementioned second direction in the aforementioned second opening is set to be less than the size of the aforementioned second direction of the channel opening portion that opens on the aforementioned channel opening surface in the aforementioned injection channel. The aforementioned injection orifice plate stacking process stacks the aforementioned injection orifice plate relative to the aforementioned intermediate plate in such a way that the aforementioned first opening communicates with the aforementioned injection orifice.

[0036] (10) In the head chip manufacturing method of the above-described (9) configuration, it is preferable to include an intermediate plate stacking process in which the intermediate plate is stacked on the channel opening surface of the actuator plate, and the groove forming process is performed before the intermediate plate stacking process.

[0037] According to this design, by pre-forming grooves in the intermediate plate, the processing time from the time the intermediate plate is stacked until the head chip is completed can be shortened.

[0038] (11) In the head chip manufacturing method of the above-described (9) configuration, it is preferable to include an intermediate plate stacking process in which the intermediate plate is stacked on the channel opening surface of the actuator plate, and the groove forming process and the through-section forming process are performed after the intermediate plate stacking process.

[0039] According to this configuration, a groove and a through section are formed in the state where the actuator plate is stacked with an intermediate plate, thereby improving the positional accuracy of the injection channel and the connecting hole.

[0040] The effects of the invention According to one embodiment of this disclosure, while ensuring the bonding area between the actuator board and the intermediate board to improve the durability of the head chip, it is possible to ensure the allowable amount of positional deviation between the injection hole and the connecting hole, thereby achieving miniaturization or narrowing of the injection channel. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of the inkjet printer according to the first embodiment.

[0042] Figure 2 This is a schematic diagram of the inkjet head and ink circulation mechanism according to the first embodiment.

[0043] Figure 3 This is a perspective view of the head chip viewed from the -Z side with the nozzle plate according to the first embodiment removed.

[0044] Figure 4 This is an exploded perspective view of the head chip according to the first embodiment.

[0045] Figure 5 This is a bottom view of the actuator plate according to the first embodiment.

[0046] Figure 6 It is equivalent to Figure 5 A cross-sectional view of the VI-VI line.

[0047] Figure 7 It is equivalent to Figure 5 A cross-sectional view of line VII-VII.

[0048] Figure 8 It is along Figure 4 A cross-sectional view of line VIII-VIII.

[0049] Figure 9 This is an enlarged bottom view of the head chip with the nozzle plate according to the first embodiment removed.

[0050] Figure 10 This is a flowchart illustrating the manufacturing method of the head chip according to the first embodiment.

[0051] Figure 11 This is a process diagram illustrating the manufacturing method of the head chip according to the first embodiment, and is related to... Figure 8 The corresponding cross-sectional view.

[0052] Figure 12 This is a process diagram illustrating the manufacturing method of the head chip according to the first embodiment, and is related to... Figure 8 The corresponding cross-sectional view.

[0053] Figure 13 This is a process diagram illustrating the manufacturing method of the head chip according to the first embodiment, and is related to... Figure 8 The corresponding cross-sectional view.

[0054] Figure 14 This is a process diagram illustrating the manufacturing method of the head chip according to the first embodiment, and is related to... Figure 8 The corresponding cross-sectional view.

[0055] Figure 15 This is a flowchart illustrating a method for manufacturing a head chip according to a variation of the first embodiment.

[0056] Figure 16 In the head chip involved in the second embodiment, and Figure 9 The corresponding bottom view.

[0057] Figure 17 In the head chip involved in the third embodiment, and Figure 9 The corresponding bottom view.

[0058] Figure 18 In the head chip involved in the fourth embodiment, and Figure 9 The corresponding bottom view.

[0059] Figure 19 In the head chip involved in the fifth embodiment, and Figure 8 The corresponding cross-sectional view.

[0060] Figure 20 This is a cross-sectional view showing the head chip according to the sixth embodiment.

[0061] Figure 21 This is a cross-sectional view showing the head chip according to the sixth embodiment. Detailed Implementation

[0062] Hereinafter, embodiments relating to this disclosure will be described with reference to the accompanying drawings. In the embodiments or variations described below, the same reference numerals are sometimes used for corresponding configurations and descriptions are omitted. Furthermore, in the following description, expressions such as "parallel," "orthogonal," "center," and "coaxial," indicating relative or absolute configurations, not only represent a strictly such configuration, but also indicate a state of relative displacement by an angle or distance with tolerance or to the extent that the same function can be obtained. In the following embodiments, an inkjet printer (hereinafter simply referred to as a printer) that uses ink (liquid) to record on a recording medium will be illustrated as an example. Furthermore, in the accompanying drawings used in the following description, the scale of each component has been appropriately altered to allow for identification of the size of each component.

[0063] [Printer 1] Figure 1 This is a schematic diagram of printer 1.

[0064] Figure 1 The printer (liquid jet recording device) 1 shown in the figure has a pair of conveying mechanisms 2 and 3, an ink tank 4, an inkjet head (liquid jet head) 5, an ink circulation mechanism 6, and a scanning mechanism 7.

[0065] In the following description, an orthogonal coordinate system of X, Y, and Z is used as needed. In this case, the X direction is aligned with the transport direction (sub-scanning direction) of the recording medium P (e.g., paper, etc.). The Y direction is aligned with the scanning direction (main scanning direction) of the scanning mechanism 7. The Z direction shows the height direction (gravity direction) orthogonal to the X and Y directions. In the following description, the side with the arrow in the X, Y, and Z directions is described as the positive (+) side, and the side opposite to the arrow is described as the negative (-) side. In this specification, the +Z side corresponds to the upper part of the gravity direction, and the -Z side corresponds to the lower part of the gravity direction.

[0066] The conveying mechanisms 2 and 3 convey the recording medium P towards the +X side. The conveying mechanisms 2 and 3 each include, for example, a pair of rollers 11 and 12 extending along the Y direction.

[0067] The ink tank 4 contains four colors of ink, such as yellow, magenta, cyan, and black. Each inkjet head 5 is configured to eject one of the four colors of ink, yellow, magenta, cyan, and black, depending on the ink tank 4 it is connected to.

[0068] Figure 2 This is a schematic diagram of the inkjet head 5 and the ink circulation mechanism 6.

[0069] like Figure 1 , Figure 2 As shown, the ink circulation mechanism 6 circulates ink between the ink tank 4 and the inkjet head 5. Specifically, the ink circulation mechanism 6 includes a circulation path 23 with an ink supply pipe 21 and an ink discharge pipe 22, a pressure pump 24 connected to the ink supply pipe 21, and a suction pump 25 connected to the ink discharge pipe 22.

[0070] The pressure pump 24 pressurizes the ink supply tube 21 and delivers ink to the inkjet head 5 through the ink supply tube 21. As a result, the ink supply tube 21 is under positive pressure relative to the inkjet head 5.

[0071] The suction pump 25 depressurizes the ink discharge tube 22, drawing ink from the inkjet head 5 through it. This creates a negative pressure on the ink discharge tube 22 side relative to the inkjet head 5. The ink can then circulate between the inkjet head 5 and the ink tank 4 via the circulation path 23, driven by the pressure pump 24 and the suction pump 25.

[0072] like Figure 1 As shown, the scanning mechanism 7 causes the inkjet head 5 to reciprocate scanning along the Y direction. The scanning mechanism 7 includes a guide rail 28 extending along the Y direction and a carriage 29 movably supported by the guide rail 28.

[0073] <Inkjet Head 5> The inkjet head 5 is mounted on the carriage 29. In the illustrated example, multiple inkjet heads 5 are mounted side-by-side on a carriage 29 along the Y direction. The inkjet head 5 includes a head chip 50 (see reference). Figure 3 The ink supply section (not shown) connects the ink circulation mechanism 6 to the head chip 50, and the control section (not shown) applies the driving voltage to the head chip 50.

[0074] <Head Chip 50> Figure 3 This is a perspective view of the head chip 50 viewed from the -Z side with the nozzle plate 51 disassembled. Figure 4 This is an exploded 3D view of chip 50.

[0075] Figure 3 , Figure 4 The head chip 50 shown is a so-called circulating side-ejection type head chip 50, in which ink circulates between itself and the ink tank 4, and ink is ejected from the center of the ejection channel 75 in the extension direction (Y direction), as described later. The head chip 50 includes a nozzle plate 51 (see reference). Figure 4 The head chip 50 consists of a nozzle plate 51, an intermediate plate 52, an actuator plate 53, and a cover plate 54 stacked in this order along the Z direction. In the following description, the direction from the nozzle plate 51 toward the cover plate 54 (+Z side) in the Z direction is sometimes referred to as the upper side, and the direction from the cover plate 54 toward the nozzle plate 51 (-Z side) is referred to as the lower side.

[0076] The actuator plate 53 is formed of a piezoelectric material such as PZT (lead zirconate titanate). The actuator plate 53 is a so-called herringbone substrate formed by stacking two piezoelectric plates with different polarization directions in the Z direction, for example. However, the actuator plate 53 can also be a so-called monopolar substrate with a polarization direction in the same direction throughout the entire region in the Z direction.

[0077] Figure 5 This is a bottom view of actuator plate 53.

[0078] like Figure 4 , Figure 5 As shown, a plurality of (e.g., 2 columns) of channel columns 61, 62 are formed on the actuator plate 53. In this embodiment, the channel columns 61, 62 are a first channel column 61 and a second channel column 62. Each channel column 61, 62 extends along the X direction and is arranged at intervals along the Y direction.

[0079] The following explanation uses the first channel column 61 as an example to illustrate the composition of channel columns 61 and 62.

[0080] The first channel row 61 has ink-filled ejection channels (jet channels) 75 and ink-free non-ejection channels (non-jet channels) 76. In a top view from the Z direction, each channel 75, 76 extends linearly along the Y direction (first direction, third direction), and is alternately arranged side-by-side, spaced apart along the X direction (second direction). The portion of the actuator plate 53 located between the ejection channels 75 and the non-ejection channels 76 constitutes a drive wall 70 (see reference) that separates the ejection channels 75 and the non-ejection channels 76 in the X direction. Figure 4 Furthermore, in this embodiment, a configuration in which the channel extension direction is consistent with the Y direction is described, but the channel extension direction may also intersect the Y direction.

[0081] Figure 6 It is equivalent to Figure 5 A cross-sectional view of the VI-VI line.

[0082] like Figure 6 As shown, in a side view taken from the X direction, the ejection channel 75 is formed in a downwardly convex arc shape. The ejection channel 75 is formed, for example, by having a circular slicing machine enter from above (+Z side) the actuator plate 53. Specifically, the ejection channel 75 has a first upper cut portion 75a located at the +Y side end, a second upper cut portion 75b located at the -Y side end, and an ejection-side through portion 75c located between each upper cut portion 75a, 75b.

[0083] Each of the upper cut portions 75a and 75b, when viewed from the X direction, is an arc with the same radius of curvature. Regarding each of the upper cut portions 75a and 75b, as they move away from the discharge-side through portion 75c in the Y direction, their depth in the Z direction gradually decreases.

[0084] The ejection-side through-part 75c extends through the actuator plate 53 in the Z direction from the center of the Y direction in the ejection channel 75. Therefore, the ejection channel 75 has an upper opening on the upper surface of the actuator plate 53 that opens the entire ejection channel 75 (upper cuts 75a, 75b and ejection-side through-part 75c), and a lower opening (channel opening) on ​​the lower surface (channel opening surface) of the actuator plate 53 that only opens the ejection-side through-part 75c.

[0085] Figure 7 It is equivalent to Figure 5 A cross-sectional view of line VII-VII.

[0086] like Figure 7As shown, the non-discharge channel 76 sandwiches the drive wall 70 and is adjacent to the discharge channel 75 in the X direction. The non-discharge channel 76 is formed, for example, by having a circular slicing machine enter from above the actuator plate 53. The non-discharge channel 76 has a non-discharge side through portion 76a and an upper cutting portion 76b.

[0087] The non-ejection side through-section 76a extends through the actuator plate 53 in the Z direction. That is, the groove depth in the Z direction is the same for the non-ejection side through-section 76a. The non-ejection side through-section 76a constitutes the portion of the non-ejection channel 76 except for the +Y side end. The non-ejection side through-section 76a opens to the outside of the head chip 50 through an end face opening formed on the end face of the actuator plate 53 facing the -Y side.

[0088] The upper cut portion 76b forms the +Y side end of the non-ejection channel 76. Viewed from the X direction, the upper cut portion 76b is an arc with a uniform radius of curvature. Regarding the upper cut portion 76b, as it exits from the non-ejection side passage 76a in the Y direction, its depth in the Z direction gradually decreases.

[0089] like Figure 6 , Figure 7 As shown, the dimension in the Y direction of the non-discharge channel 76 (non-discharge side through-section 76a) is larger than that of the discharge channel 75. Specifically, the +Y side end of the non-discharge side through-section 76a is configured as a first protrusion 77 located further to the +Y side than the discharge channel 75 (discharge side through-section 75c). The -Y side end of the non-discharge side through-section 76a is configured as a second protrusion 78 located further to the -Y side than the discharge channel 75 (discharge side through-section 75c).

[0090] like Figure 5 As shown, the second channel column 62, like the first channel column 61, is configured with ejection channels (jet channels) 75 and non-ejection channels (non-jet channels) 76 alternately arranged side-by-side along the X direction. Specifically, the ejection channels 75 and non-ejection channels 76 of the second channel column 62 are arranged with a spacing offset from the spacing of the ejection channels 75 and non-ejection channels 76 of the first channel column 61 by half a spacing. Therefore, in the inkjet head 5 of this embodiment, the ejection channels 75 of the first channel column 61 and the second channel column 62, as well as the non-ejection channels 76 of the first channel column 61 and the second channel column 62, are arranged in an alternating (chrysanthemum-like) (different from each other) configuration. That is, between adjacent channel columns 61 and 62, the ejection channels 75 and non-ejection channels 76 face each other in the Y direction. However, the spacing between the ejection channels 75 and non-ejection channels 76 between each channel column 61 and 62 can be appropriately varied. For example, between each channel column 61, 62, the output channels 75 can be configured to face each other and the non-output channels 76 can be configured to face each other in the Y direction.

[0091] In each channel row 61, 62, the discharge channel 75 is formed symmetrically with respect to the XZ plane. In each channel row 61, 62, the non-discharge channel 76 is formed symmetrically with respect to the XZ plane. In each channel row 61, 62, the upper tangent portion 76b of each channel row at least partially overlaps when viewed from the X direction. However, the upper tangent portions 76b of each channel row 61, 62 may not overlap when viewed from the X direction.

[0092] The portion of the actuator plate 53 located on the -Y side (the side opposite to the second channel column 62) of the ejection channel 75 (ejection side through portion 75c) relative to the first channel column 61 constitutes the first tail portion 81.

[0093] The portion of the actuator plate 53 located on the +Y side (opposite to the first channel column 61) of the ejection channel 75 relative to the second channel column 62 constitutes the second tail section 86.

[0094] Figure 8 It is along Figure 4 A cross-sectional view of line VIII-VIII.

[0095] like Figure 8 As shown, common electrodes 95 are formed on the inner surfaces of the drive wall 70 of the actuator plate 53 facing each ejection channel 75 (the faces of the ejection channels 75 facing each other in the X direction). The length of the common electrode 95 in the Y direction is equal to that of the ejection-side through-section 75c (equal to the opening length of the ejection channel 75 in the lower surface of the actuator plate 53). The common electrode 95 is formed throughout the entire area in the Z direction on the inner surface of the ejection-side through-section 75c.

[0096] like Figure 5 As shown, a plurality of common terminals 96 are formed on the lower surface of the actuator plate 53. The common terminals 96 are strips extending parallel to each other along the Y direction. Each common terminal 96 is connected to a pair of common electrodes 95 at the opening edge of the corresponding ejection channel 75. Each common terminal 96 terminates on the lower surface of the corresponding tails 81, 86.

[0097] like Figure 8 As shown, individual electrodes 97 are formed on the inner surfaces of the drive wall 70 of the actuator plate 53 facing each non-ejection channel 76 (the faces of the non-ejection channels 76 facing each other in the X direction). The length of each individual electrode 97 in the Y direction is equal to that of the non-ejection side through-section 76a. The individual electrodes 97 are formed throughout the entire area in the Z direction on the inner surface of the non-ejection side through-section 76a.

[0098] like Figure 5As shown, on the lower surface of the tail portions 81 and 86, in a portion located further outward than the common terminal 96, individual terminals 98 are formed. Individual terminals 98 are strip-shaped extending in the X direction. The individual terminals 98 connect the individual electrodes 97, which are sandwiched between the ejection channels 75 and facing each other in the X direction, to each other at the opening edge of the non-ejection channels 76 facing each other in the X direction. Furthermore, in the tail portions 81 and 86, a dividing groove 99 is formed in the portion located between the common terminal 96 and the individual terminals 98. The dividing groove 99 extends in the X direction in the tail portions 81 and 86. The dividing groove 99 separates the common terminal 96 from the individual terminals 98.

[0099] like Figure 8 As shown, a first protective film 110 is formed on the inner surface of the dispensing channel 75. The first protective film 110 is formed entirely over the inner surface of the dispensing channel 75. The first protective film 110 covers the common electrode 95. The first protective film 110 inhibits, for example, contact between the common electrode 95 and the ink. Furthermore, the first protective film 110 only needs to cover at least the common electrode 95 on the inner surface of the dispensing channel 75.

[0100] A second protective film 111 is formed on the inner surface of the non-ejection channel 76. The second protective film 111 is formed entirely over the inner surface of the non-ejection channel 76. The second protective film 111 covers the individual electrode 97. The second protective film 111 inhibits, for example, contact between the individual electrode 97 and the ink. Furthermore, the second protective film 111 only needs to cover at least the individual electrode 97 on the inner surface of the non-ejection channel 76.

[0101] Protective films 110 and 111, as insulating materials, include organic insulating materials such as paraxylene-based resins (e.g., Parylene (registered trademark)). Protective films 110 and 111 may also be composed of tantalum oxide (Ta2O5), silicon nitride (SiN), silicon carbide (SiC), silicon oxide (SiO2), or diamond-like carbon, or may include at least one of these.

[0102] like Figure 6 As shown, a first flexible printed circuit board 100 is press-fitted onto the lower surface of the first tail portion 81. The first flexible printed circuit board 100 is connected to a common terminal 96 and an individual terminal 98 corresponding to the first channel column 61 on the lower surface of the first tail portion 81. The first flexible printed circuit board 100 extends upward through the outside of the actuator plate 53.

[0103] A second flexible printed circuit board 101 is press-fitted onto the lower surface of the second tail portion 86. The second flexible printed circuit board 101 is connected to a common terminal 96 and an individual terminal 98 corresponding to the second channel column 62 on the lower surface of the second tail portion 86. The second flexible printed circuit board 101 extends upward through the outside of the actuator plate 53.

[0104] <Cover plate 54> like Figure 3 , Figure 4 As shown, the cover plate 54 is engaged with the upper surface of the actuator plate 53 in a manner that closes each of the channel rows 61, 62. In the cover plate 54, an inlet common ink chamber 120 and an outlet common ink chamber 121 are formed at positions corresponding to each of the channel rows 61, 62.

[0105] The inlet common ink chamber 120 is formed at a position that overlaps with the +Y side end of the first channel column 61, for example, when viewed from above. The inlet common ink chamber 120 extends in the X direction, for example, across the length of the first channel column 61, and has an opening on the upper surface of the cover plate 54.

[0106] The exit common ink chamber 121 is formed at a position that overlaps with the -Y side end of the first channel column 61, for example, when viewed from above. The exit common ink chamber 121 extends in the X direction with a length spanning the first channel column 61 and has an opening on the upper surface of the cover plate 54.

[0107] In the entrance common ink chamber 120, an entrance slit 125 is formed at a position that overlaps with the ejection channel 75 (first upper cut 75a) of the first channel column 61 when viewed from above. The entrance slit 125 connects each ejection channel 75 to the interior of the entrance common ink chamber 120.

[0108] In the exit common ink chamber 121, an exit slit 126 is formed at a position overlapping with the ejection channel 75 (second upper cut portion 75b) of the first channel column 61 when viewed from above. The exit slit 126 connects each ejection channel 75 to the exit common ink chamber 121. Therefore, the inlet slit 125 and the outlet slit 126 are connected to each ejection channel 75, but not to the non-ejection channels 76.

[0109] <Intermediate Plate 52> The intermediate plate 52 is bonded to the lower surface of the actuator plate 53 in a manner that closes each of the channel rows 61, 62. The intermediate plate 52, like the actuator plate 53, is formed of a piezoelectric material such as PZT. The intermediate plate 52 is thinner in the Z direction than the actuator plate 53. The intermediate plate 52 is smaller in the Y direction than the actuator plate 53. Therefore, the two ends (tails 81, 86) in the Y direction of the actuator plate 53 are exposed on both sides of the intermediate plate 52 in the Y direction. The portions exposed from the intermediate plate 52 at the two ends in the Y direction of the actuator plate 53 function as the bonding areas between the first flexible printed circuit board 100 and the second flexible printed circuit board 101. Furthermore, the intermediate plate 52 may also be formed of a material other than a piezoelectric material (e.g., a non-conductive material such as polyimide or alumina).

[0110] <Nozzle Plate 51> like Figure 4 As shown, the nozzle plate 51 is fixed to the lower surface of the intermediate plate 52 by bonding or the like. The nozzle plate 51 has the same width in the Y direction as the intermediate plate 52. In this embodiment, the nozzle plate 51 is formed from a resin material such as polyimide with a thickness of approximately 50 μm. However, besides resin materials, the nozzle plate 51 can also be a single-layer or multi-layer structure based on a metal material (SUS or Ni-Pd, etc.), glass, silicon, etc.

[0111] On the nozzle plate 51, two rows of nozzles extending in the X direction are formed at intervals along the Y direction (first nozzle row 141 and second nozzle row 142).

[0112] Each nozzle array 141, 142 has a plurality of nozzle holes (first nozzle hole 145 and second nozzle hole 146) extending through the nozzle plate 51 in the Z direction. The nozzle holes 145, 146 are spaced apart in the X direction. The nozzle holes 145, 146 are formed, for example, in a tapering shape where the inner diameter gradually decreases from bottom to top. In the illustrated example, the maximum inner diameter (inner diameter of the upper opening) of each nozzle hole 145, 146 is set to be greater than or equal to the dimension in the X direction of the discharge channel 75.

[0113] Figure 9 This is an enlarged bottom view of the head chip 50 with the nozzle plate 51 removed.

[0114] Here, as Figure 8 , Figure 9As shown, a connecting hole 150 is formed in the intermediate plate 52 at a position coinciding with the nozzle holes 145 and 146 when viewed from above. The connecting hole 150 connects the corresponding dispensing channels 75 and nozzle holes 145 and 146 to each other. Therefore, each non-dispensing channel 76 is not connected to the nozzle holes 145 and 146, but is covered from below by the intermediate plate 52. Furthermore, each connecting hole 150 has the same configuration. Therefore, in the following description, the details of the connecting hole 150 will be explained using one connecting hole 150 as an example.

[0115] The connecting hole 150 is formed in a stepped shape when viewed from the Y direction, gradually widening in the X direction from top to bottom. Specifically, the connecting hole 150 includes a groove 151 and a through portion 152.

[0116] The groove 151 is recessed from the lower surface of the intermediate plate 52 and extends along the Y direction. The groove 151 has a lower opening (first opening) 151a that opens onto the lower surface of the intermediate plate 52. The lower opening 151a communicates with the nozzle holes 145 and 146 through the upper openings of the nozzle holes 145 and 146. The Y-direction dimension of the groove 151 is set to be the same as the Y-direction dimension of the discharge-side through-section 75c. However, the Y-direction dimension of the groove 151 may be larger or smaller than the Y-direction dimension of the discharge-side through-section 75c.

[0117] The dimension in the X direction of the groove 151 is larger than the maximum inner diameter of the nozzle orifices 145 and 146 and the dimension in the X direction of the discharge channel 75, respectively. In this embodiment, the dimension in the X direction of the groove 151 is preferably more than 1.5 times the maximum inner diameter of the nozzle orifices 145 and 146, and is less than or equal to the spacing between the discharge channel 75 and the non-discharge channel 76.

[0118] The Z-direction dimension in the groove 151 is set to be more than half the Z-direction dimension in the intermediate plate 52. That is, the Z-direction dimension from the lower surface of the intermediate plate 52 to the bottom surface of the groove 151 is larger than the Z-direction dimension from the bottom surface of the groove 151 to the upper surface of the intermediate plate 52 (the upper opening 152a of the through portion 152). Therefore, the bottom surface of the groove 151 is located above the center of the Z-direction in the intermediate plate 52. However, the Z-direction dimension in the groove 151 can be appropriately changed.

[0119] The through portion 152 extends along the Z direction in the region of the intermediate plate 52 including the groove 151. The through portion 152 communicates with the groove 151, thereby penetrating the intermediate plate 52. The through portion 152 has an upper opening (upper opening) 152a that opens onto the upper surface of the intermediate plate 52. The upper opening 152a communicates with the inside of the discharge channel 75 (discharge-side through portion 75c) through a lower opening.

[0120] In this embodiment, the entire through portion 152 coincides with the groove portion 151 when viewed from above. Specifically, the Y-direction dimension of the through portion 152 is the same as the Y-direction dimension of the groove portion 151.

[0121] The dimension in the X direction of the through section 152 is set to be less than or equal to the dimension in the X direction of the discharge channel 75. In this embodiment, the dimension in the X direction of the through section 152 is preferably 75% to 100% of the dimension in the X direction of the discharge channel 75, and more preferably 90% to 100%.

[0122] The dimension in the X direction of the through portion 152 is smaller than the dimension in the X direction of the groove portion 151. In this embodiment, the through portion 152 communicates with the groove portion 151 at its central portion in the X direction. Therefore, the groove portion 151 extends to both sides in the X direction relative to the through portion 152. The portions of the inner space of the groove portion 151 located on both sides in the X direction relative to the through portion 152 (the space between the bottom surface of the groove portion 151 and the upper surface of the nozzle plate 51) constitute the adhesive receiving portion 153. When the nozzle plate 51 is joined to the intermediate plate 52, the adhesive receiving portion 153 contains the remaining adhesive. As a result, it is possible to prevent the adhesive from flowing into the portion of the connecting hole 150 that coincides with the discharge-side through portion 75c and nozzle holes 145, 146 when viewed from above.

[0123] [Printer 1's Action Method] Next, the following will describe the case where a printer 1 configured as described above is used to record text or graphics on the recording medium P.

[0124] Furthermore, as the initial state, in Figure 1 The four ink tanks 4 shown are fully filled with ink of their respective colors. Furthermore, the ink in the ink tanks 4 is supplied to the inkjet head 5 via the ink circulation mechanism 6.

[0125] In this initial state, if printer 1 is activated, the recording medium P is clamped by rollers 11 and 12 of conveying mechanisms 2 and 3 and simultaneously conveyed to the +X side. Meanwhile, carriage 29 moves along the Y direction, causing the inkjet head 5 mounted on carriage 29 to reciprocate along the Y direction.

[0126] During the reciprocating movement of the inkjet head 5, ink is appropriately ejected from each inkjet head 5 to the recording medium P. This enables the recording of text or images on the recording medium P.

[0127] Hereinafter, the activities of each inkjet head 5 will be described in detail.

[0128] In a circulating side-ejection type inkjet head 5 as in this embodiment, firstly, by making... Figure 2 The pressurizing pump 24 and suction pump 25 shown operate to allow ink to flow within the circulation path 23. In this case, ink flowing through the ink supply pipe 21 is supplied to each ejection channel 75 via the inlet common ink chamber 120 and the inlet slit 125. The ink supplied to each ejection channel 75 flows along the Y direction within each ejection channel 75. Afterward, the ink is discharged through the outlet slit 126 to the outlet common ink chamber 121, and then returns to the ink tank 4 via the ink discharge pipe 22. This allows the ink to circulate between the inkjet head 5 and the ink tank 4.

[0129] Then, if via carriage 29 (refer to) Figure 1 The reciprocating movement of the inkjet head 5 is initiated by the movement of the inkjet head 5, and a driving voltage is applied to electrodes 95 and 97 via flexible printed circuit boards 100 and 101. At this time, the individual electrode 97 is used as the driving potential Vdd, and the common electrode 95 is used as the reference potential GND, and the driving voltage is applied between each electrode 95 and 97. As a result, the two driving walls 70 that demarcate the ejection channel 75 undergo thickness slip deformation, and the two driving walls 70 deform in a manner that protrudes towards the non-ejection channel 76 side. That is, by applying voltage between each electrode 95 and 97, the driving wall 70 bends in a V-shape with the middle portion in the Z direction as its center. This increases the volume of the ejection channel 75. Then, due to the increased volume of the ejection channel 75, the ink stored in the inlet common ink chamber 120 is guided into the ejection channel 75 through the inlet slit 125. The ink guided into the interior of the ejection channel 75 becomes a pressure wave and propagates within the ejection channel 75. When the pressure wave reaches the nozzle orifices 145 and 146, the voltage applied between the electrodes 95 and 97 becomes zero. As a result, the drive wall 70 returns to its original position, and the temporarily enlarged volume of the ejection channel 75 returns to its original volume. This action increases the pressure inside the ejection channel 75, pressurizing the ink. Consequently, droplets of ink are ejected to the outside through the connecting hole 150 and the nozzle orifices 145 and 146, thus enabling the recording of text or images on the recording medium P as described above.

[0130] <Manufacturing Method of Head Chip 50> Next, the manufacturing method of the aforementioned head chip 50 will be described. Figure 10 This is a flowchart illustrating the manufacturing method of the header chip 50. Figures 11-14This is a process diagram illustrating the manufacturing method of the head chip 50, and is related to... Figure 8 The corresponding cross-sectional view. In the following description, for convenience, the case of chip-level manufacturing head chip 50 will be used as an example.

[0131] like Figure 10 As shown, the manufacturing method of the head chip 50 includes an intermediate board bonding process (intermediate board stacking process), a through-hole forming process, a protective film forming process, and a nozzle board bonding process (jet hole board stacking process). Furthermore, prior to the intermediate board bonding process, each board 51-54 has undergone the necessary processing.

[0132] like Figure 11 As shown, in the intermediate plate joining process, the intermediate plate 52 is joined to the laminate 200 on which the actuator plate 53 and the cover plate 54 are stacked. Specifically, the intermediate plate 52 is joined to the lower surface of the actuator plate 53 via an adhesive or the like. During the intermediate plate joining process, the connecting hole 150 has not yet been formed in the intermediate plate 52.

[0133] In the connecting hole forming process, a connecting hole 150 is formed in the intermediate plate 52. Specifically, the connecting hole forming process involves laser processing of the portion of the lower surface of the intermediate plate 52 that overlaps with the ejection channel 75 when viewed from above, to make the intermediate plate 52 through. In the connecting hole forming process, after the groove forming process of forming the groove 151 is performed first, the through portion forming process of forming the through portion 152 is performed. Figure 12 As shown, in the groove forming process, a scanning laser is used to form the groove 151 in the forming area, thus forming a groove 151 that extends from the lower surface of the intermediate plate 52 toward the recess. Figure 13 As shown, in the through-hole forming process, the intermediate plate 52 is penetrated by scanning the bottom surface of the groove 151 with a laser from below. Thus, the groove 151 communicates with the ejection channel 75 via the through-hole 152. The laser irradiation width in the X direction during the through-hole forming process is set to be less than or equal to the dimension in the X direction of the ejection channel 75. As in this embodiment, the groove 151 and the through-hole 152 are formed with the intermediate plate 52 stacked on the actuator plate 53, thereby improving the positional accuracy of the ejection channel 75 and the connecting hole 150. Furthermore, in addition to laser processing, the connecting hole forming process can also be performed using etching or the like.

[0134] like Figure 14As shown, in the protective film formation process, a first protective film 110 is formed in the discharge channel 75, and a protective film 111 is formed on the inner surface of the non-discharge channel 76. The protective films 110 and 111 are formed using a method such as chemical vapor deposition (CVD) to deposit a p-xylene-based resin material. Specifically, with the laminate set in a chamber (not shown), a raw material gas, which will form the protective films 110 and 111, is introduced. At this time, the raw material gas is introduced into the discharge channel 75 through slits 125 and 126 or through a connecting hole 150. The raw material gas introduced into the discharge channel 75 adheres to the inner surface of the discharge channel 75, thereby depositing as the first protective film 110 on the inner surface of the discharge channel 75.

[0135] The raw material gas is introduced into the non-emission channel 76 through the non-emission side through-section 76a. The raw material gas introduced into the non-emission channel 76 adheres to the inner surface of the non-emission channel 76, thereby accumulating as a second protective film 111.

[0136] In the nozzle plate joining process, the nozzle plate 51 and the intermediate plate 52 are bonded together by means of nozzle holes 145 and 146 being connected to the discharge channel 75 through the connecting hole 150.

[0137] Through the above, head chip 50 is manufactured.

[0138] Furthermore, the head chip 50 can also be manufactured at the wafer level. In the case of wafer-level manufacturing, firstly, actuator wafers connected by multiple actuator boards 53, cover wafers connected by multiple cover plates 54, and intermediate wafers connected by multiple intermediate plates 52 are bonded to form a wafer bonding assembly. Subsequently, after forming protective films 110 and 111 relative to the wafer bonding assembly, the wafer bonding assembly is cut to form multiple head chips 50.

[0139] Thus, in this embodiment, the X-direction dimension of the lower opening 151a of the groove 151 is larger than the X-direction dimension of the upper opening 152a of the through portion 152, and the X-direction dimension of the upper opening 152a is less than or equal to the X-direction dimension of the discharge channel 75 (discharge-side through portion 75c).

[0140] According to this configuration, the X-direction dimension of the upper opening 152a is less than the X-direction dimension of the discharge-side through-hole 75c, thus easily ensuring the contact area between the intermediate plate 52 and the actuator plate 53. As a result, the contact strength between the intermediate plate 52 and the actuator plate 53 can be ensured, suppressing peeling of the intermediate plate 52 or leakage of ink between the intermediate plate 52 and the actuator plate 53.

[0141] Furthermore, even when the through portion 152 is formed as a post-processing step after the intermediate plate 52 and actuator plate 53 are joined, it is possible to prevent damage from affecting the actuator plate 53 during the processing of the through portion 152.

[0142] Furthermore, the X-direction dimension in the lower opening 151a is larger than that in the upper opening 152a. Therefore, compared to the case where the nozzle holes 145, 146 are directly connected to the discharge channel 75, it is easier to align the groove 151 with the nozzle holes 145, 146 during the joining of the intermediate plate 52 and the nozzle plate 51. That is, the positional deviation between the groove 151 and the nozzle holes 145, 146 can be accommodated within the X-direction dimension of the groove 151. As a result, it is possible to achieve miniaturization or narrowing of the discharge channel 75 while ensuring the positioning accuracy between the nozzle holes 145, 146 and the discharge channel 75.

[0143] As a result, while ensuring the durability of the head chip 50 by ensuring the joint area between the actuator plate 53 and the intermediate plate 52, the allowable deviation of the position of the nozzle holes 145, 146 from the connecting hole 150 is ensured, thereby achieving miniaturization or narrowing of the discharge channel 75.

[0144] In this embodiment, the dimension from the lower opening 151a to the bottom surface of the groove 151 in the thickness direction (Z direction) of the intermediate plate 52 is larger than the dimension from the bottom surface of the groove 151 to the upper opening 152a.

[0145] According to this configuration, the depth of the groove 151 can be ensured, so when the intermediate plate 52 and the nozzle plate 51 are joined, the space in the groove 151 located on the outer side in the X direction relative to the through portion 152 can be used as an adhesive receiving portion 153. Therefore, it is possible to prevent adhesive from flowing into the through portion 152 and to prevent the adhesive from affecting the dispensing performance.

[0146] The inkjet head 5 and printer 1 involved in this embodiment are equipped with the head chip 50 described above, thus enabling the provision of a high-quality and highly reliable liquid jet head.

[0147] In the first embodiment described above, a method for forming a groove and a through portion after the intermediate plate joining process was described as a connecting hole forming process, but the method is not limited to this configuration. In the connecting hole forming process, as... Figure 15As shown, at least one through-section forming process is required after the intermediate plate bonding process, and the groove forming process can also be performed before the intermediate plate bonding process. That is, the groove 151 can be formed in advance before bonding the intermediate plate 52, and the intermediate plate 52 with the groove 151 formed can be bonded to the actuator plate 53. By forming the groove 151 in the intermediate plate 52 in advance, the processing time from the stacking of the intermediate plate 52 until the completion of the head chip 50 can be shortened.

[0148] (Second Implementation) like Figure 16 As shown, in the head chip 50 according to the second embodiment, the top view of the connecting hole 150 is square. Specifically, in the connecting hole 150, the Y-direction dimensions of the groove 151 and the through portion 152 are equal, smaller than the Y-direction dimension of the discharge-side through portion 75c, and larger than the maximum inner diameter of the nozzle holes 145 and 146. Furthermore, the X-direction and Z-direction dimensions of the groove 151 and the through portion 152 can be the same as those in the first embodiment.

[0149] According to this embodiment, the Y-direction dimension of the through portion 152 is shorter than the Y-direction (third direction) dimension of the discharge side through portion 75c. Therefore, even if the through portion 152 is formed as a post-processing step after the intermediate plate 52 and the actuator plate 53 are joined, it is possible to suppress damage from the processing of the through portion 152 to the lower surface of the actuator plate 53.

[0150] Furthermore, by making the dimensions of the groove portion 151 and the through portion 152 in the Y direction (first direction and third direction) smaller than the Y direction dimension of the through portion 75c on the discharge side, the processing time of the through hole 150 in the through hole forming process can be shortened. As a result, manufacturing efficiency can be improved.

[0151] (Third Implementation) like Figure 17 As shown in the diagram, in the head chip 50 according to the third embodiment, the top view shape of the connecting hole 150 is X-shaped. Specifically, the Y-direction dimension in the groove 151 is smaller than the Y-direction dimension in the discharge side through portion 75c, but larger than the maximum inner diameter of the nozzle holes 145 and 146.

[0152] The through portion 152 extends through the intermediate plate 52 in the Y direction, across the area of ​​the intermediate plate 52 that coincides with the groove portion 151 when viewed from above. That is, the through portion 152 extends through the intermediate plate 52 via the groove portion 151 at the area coinciding with the groove portion 151, and extends through the intermediate plate 52 on both sides of the groove portion 151 in the Y direction (first direction). The portion of the through portion 152 that protrudes in the Y direction relative to the groove portion 151 constitutes a protrusion 152c. In this embodiment, the Y-direction dimension of the through portion 152 is the same as the Y-direction dimension of the discharge-side through portion 75c.

[0153] In this embodiment, the dimension in the Y direction of the groove 151 is smaller than that of the through portion 152, thereby shortening the processing time of the groove 151. As a result, manufacturing efficiency can be improved.

[0154] Furthermore, the Y-direction dimension of the through section 152 is wider than that of the groove section 151, so that when the liquid flows in the Y-direction within the discharge channel 75, the through section 152 and the discharge channel 75 can function together as an ink flow path. As a result, it is easy to ensure the cross-sectional area of ​​the ink flow path and reduce pressure loss.

[0155] (Fourth implementation) like Figure 18 As shown, in the head chip 50 according to the fourth embodiment, the through portion 152 protrudes to one side in the Y direction (first direction) relative to the groove portion 151. The portion of the through portion 152 that protrudes in the Y direction relative to the groove portion 151 constitutes the protrusion 152c. The orientation of the protrusion 152c in the Y direction is preferably aligned with the high-pressure side based on the nozzle holes 145, 146 in the discharge channel 75.

[0156] In this embodiment, in addition to achieving the same effect as in the third embodiment described above, the through portion 152 (protrusion 152c) protrudes in the direction where pressure tends to be higher on both sides of the groove portion 151 in the Y direction. Therefore, the processing time of the through portion 152 can be shortened as much as possible while reducing pressure loss on one side in the Y direction.

[0157] (Fifth Embodiment) like Figure 19As shown in the diagram, in the head chip 50 according to the fifth embodiment, a bulge 155 is formed on the bottom surface of the groove 151. The bulge 155 is formed in the portion of the bottom surface of the groove 151 near the through portion 152 (inner side in the X direction). The bulge 155 is triangular in cross-sectional view. Specifically, the amount of the bulge 155 bulging out from the bottom surface of the groove 151 gradually increases as it bulges inward in the X direction. The bulge 155 functions as a flow barrier to prevent the adhesive contained in the adhesive receiving portion 153 from flowing into the through portion 152. Furthermore, the cross-sectional shape of the bulge 155 is not limited to a triangular shape, and can be appropriately modified to a rectangular or semi-circular shape.

[0158] In this embodiment, when the intermediate plate 52 and the nozzle plate 51 are joined, the space in the groove 151 located further outward in the X direction than the bulge 155 can be used as an adhesive receiving portion 153. In this case, the flow of adhesive into the through portion 152 can be restricted by the bulge 155, thereby preventing the adhesive from affecting the dispensing performance.

[0159] (Sixth Embodiment) In the above embodiment, the head chip 50 of the side-firing type is described as having a configuration in which the vertical direction of the actuator plate 53 is consistent with the thickness direction of the actuator plate 53 and the ejection channel 75 opens in the central part (ejection side through part 75c) in the channel extension direction along the thickness direction of the actuator plate 53, but is not limited to this configuration.

[0160] like Figure 20 , Figure 21 As shown, the head chip 300 can also be a so-called edge-ejection type, in which ink is ejected from the end of the ejection channel 301 in the extension direction. In the following description, the +Y side is sometimes referred to as the surface side, the -Y side as the back side, the +Z side as the top, and the -Z side as the bottom.

[0161] In the head chip 300, an output channel 301 and a non-output channel 302 are formed in the actuator plate 310. In the actuator plate 310, the channels 301 and 302 are alternately formed along the X direction (second direction).

[0162] In the actuator plate 310, the ejection channel 301 extends along the Z direction (first direction). The ejection channel 301 has a channel opening that opens on the lower end face (channel opening face) of the actuator plate 310. The non-ejection channel 302 extends through the actuator plate 310 along the Z direction.

[0163] The cover plate 320 is attached to the surface of the actuator plate 310 in such a way that it closes the surface-side openings of each channel 301, 302. A common ink chamber 321 is formed in the cover plate 320 at a position coinciding with the upper end of the ejection channel 301 when viewed from the Y direction. The common ink chamber 321 extends along the X direction, for example, across the length of each channel 301, 302, and has an opening on the surface of the cover plate 320.

[0164] In the common ink chamber 321, a slit 322 is formed at a position coinciding with the ejection channel 301 when viewed from the Y direction. The slit 322 connects the upper end of each ejection channel 301 to the interior of the common ink chamber 321. The slit 322 is connected to each ejection channel 301, but not to any non-ejection channel 302.

[0165] The intermediate plate 330 is fixed to the lower end face of the actuator plate 310 by bonding or the like. A connecting hole 331 is formed in the intermediate plate 330 at a position coinciding with the discharge channel 301 when viewed from the Z direction. For example, similar to the first embodiment described above, the connecting hole 331 has a groove 332 and a through portion 333, extending through the intermediate plate 330 in the Z direction. The X-direction dimension of the lower opening 332a in the groove 332 is larger than the X-direction dimension of the upper opening 333a in the through portion 333. The X-direction dimension of the upper opening 333a in the through portion 333 is smaller than the X-direction dimension of the channel opening in the discharge channel 301 that opens onto the lower surface of the actuator plate 310. Furthermore, the Y-direction dimension (third direction) of the through portion 333 can be larger or smaller than the Y-direction dimension of the channel opening.

[0166] The nozzle plate 340 is fixed to the lower end face of the intermediate plate 330 by adhesive or the like. A nozzle hole 341 is formed in the nozzle plate 340. The nozzle hole 341 is connected to the discharge channel 301 through the connecting hole 331.

[0167] As in this embodiment, even when the configuration disclosed herein is used in the side-firing type head chip 300, the same effect as described in the embodiments above can be achieved.

[0168] (Other variations) Furthermore, the scope of this disclosure is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of this disclosure.

[0169] For example, in the above embodiments, inkjet printer 1 is illustrated as an example of a liquid jet recording device, but it is not limited to a printer. For example, it could also be a fax machine or an on-demand printer.

[0170] In the above embodiments, a configuration in which the inkjet head moves relative to the recorded medium during printing (a so-called reciprocating machine) has been described as an example, but it is not limited to this configuration. The configuration involved in this disclosure can also be used in a configuration in which the recorded medium moves relative to the inkjet head while the inkjet head is fixed (a so-called fixed-head machine).

[0171] In the above embodiments, the case where the recording medium P is paper has been described, but the configuration is not limited to this. The recording medium P is not limited to paper, but may also be a metal material, a resin material, or even food, etc.

[0172] In the above embodiments, the configuration of the liquid jet head mounted on the liquid jet recording device has been described, but the configuration is not limited to this. That is, the liquid jetted from the liquid jet head is not limited to the liquid hitting the recording medium, but may also be, for example, a medicine liquid prepared in a dispensing solution, or a food additive such as seasonings or spices added to food, or a fragrance sprayed into the air.

[0173] In the above embodiments, a configuration in which the Z direction is aligned with the direction of gravity has been described, but it is not limited to this configuration; the Z direction may also be aligned with the horizontal direction.

[0174] In the above embodiments, a configuration in which the ejection channels 75 and non-ejection channels 76 are arranged alternately has been described, but this is not a limitation. For example, this disclosure can also be applied to a head chip 50 in a so-called 3-cycle mode where ink is sequentially ejected from all channels.

[0175] In the above embodiments, a configuration in which the actuator plate 53, the intermediate plate 52, and the nozzle plate 51 are sequentially joined has been described, but the configuration is not limited to this. Other components may also be provided between the actuator plate 53 and the intermediate plate 52, or between the intermediate plate 52 and the nozzle plate 51. In this case, for the jet orifice plate stacking process or the intermediate plate stacking process involved in this disclosure, it is not limited to the case where the stacked object is directly joined to the stacked object (for example, in the case where the stacked object is a jet orifice plate, the stacked object is an intermediate plate). As long as there is a configuration in which the stacked object is stacked at least relative to the stacked object, the stacked object can be joined to other components while other components are joined to the stacked object. In addition, even when the stacked object is directly stacked to the stacked object, the stacked object and the stacked object can be stacked using methods other than joining.

[0176] Furthermore, without departing from the spirit of this disclosure, the constituent elements in the above embodiments can be appropriately replaced with well-known constituent elements, and the above variations can also be appropriately combined.

[0177] Symbol Explanation 1: Printer (Liquid Jet Recording Device) 5: Inkjet head (liquid jet head) 50: Head chip 51: Nozzle plate (jet orifice plate) 52: Intermediate plate 53: Actuator plate 75: Ejection Channel (Jet Channel) 150: Connecting hole 151: Groove 151a: Lower opening (first opening) 152: Through Section 152a: Upper opening (second opening) 155: Drum Extrusion Section 300: Head chip 301: Discharge Channel (Jet Channel) 310: Actuator plate 330: Intermediate plate 331: Connecting hole 332: Groove 332a: Lower opening (first opening) 333: Through Section 333a: Upper opening (second opening).

Claims

1. A head chip, comprising: An actuator plate having a plurality of injection channels extending along the first direction arranged along a second direction intersecting the first direction; The injection orifice plate has a plurality of injection holes for ejecting liquid and is disposed facing the channel opening face of the injection channel opening in the actuator plate; as well as An intermediate plate, having a connecting hole that connects the injection channel and the injection orifice respectively, is disposed between the actuator plate and the injection orifice plate. The connecting hole has: The groove portion has a first opening facing the injection orifice opening and is recessed in the direction of exiting the injection orifice plate; and The through portion has a second opening facing the opening of the injection channel, and penetrates the intermediate plate by communicating with the groove in at least a region including the groove. The dimension in the second direction of the first opening is larger than the dimension in the second direction of the second opening. The dimension of the second direction in the second opening is less than the dimension of the second direction of the channel opening in the injection channel that opens on the channel opening surface.

2. The head chip according to claim 1, wherein, If the direction intersecting the second direction when viewed from the thickness direction of the intermediate plate is taken as the third direction, then The dimension of the third direction in the through portion is smaller than the dimension of the third direction in the channel opening.

3. The head chip according to claim 1 or claim 2, wherein, The opening surface of the channel faces the thickness direction of the actuator plate. The through portion protrudes to both sides in the first direction relative to the groove portion.

4. The head chip according to claim 1 or claim 2, wherein, The opening surface of the channel faces the thickness direction of the actuator plate. The through portion protrudes to one side in the first direction relative to the groove portion.

5. The head chip according to claim 1 or claim 2, wherein, In the thickness direction of the intermediate plate, the dimension from the first opening to the bottom surface of the groove is larger than the dimension from the bottom surface of the groove to the second opening.

6. The head chip according to claim 1 or claim 2, wherein, A bulge extending from the bottom surface of the groove is formed in the portion near the through portion in the second direction.

7. A liquid injection head comprising a head chip according to any one of claims 1 to 6.

8. A liquid jet recording device comprising a liquid jet head according to claim 7.

9. A method for manufacturing a head chip, comprising the following: An actuator plate having a plurality of injection channels extending along the first direction arranged along a second direction intersecting the first direction; The injection orifice plate has a plurality of injection holes for ejecting liquid and is disposed facing the channel opening face of the injection channel opening in the actuator plate; as well as An intermediate plate, having a connecting hole that connects the injection channel and the injection orifice respectively, is disposed between the actuator plate and the injection orifice plate. The method for manufacturing the head chip includes: The process of forming a connecting hole involves forming the connecting hole in the intermediate plate; and The jetting orifice plate stacking process involves stacking the jetting orifice plate relative to the intermediate plate. The process of forming the connecting hole includes: The groove forming process involves forming a groove in the intermediate plate by means of a first opening having an opening toward the injection orifice and a recess in an orientation away from the injection orifice plate; and The through-hole forming process involves forming a through-hole in the intermediate plate by passing through a second opening that faces the injection channel and extends through a region including at least the groove. In the groove forming process, the dimension of the second direction in the first opening is set to be larger than the dimension of the second direction in the second opening. In the process of forming the through portion, the dimension in the second direction of the second opening is set to be less than or equal to the dimension in the second direction of the channel opening portion that opens on the channel opening surface in the injection channel. The jetting orifice plate stacking process stacks the jetting orifice plate relative to the intermediate plate in such a way that the first opening is connected to the jetting orifice.

10. The method for manufacturing a head chip according to claim 9, wherein, The system includes an intermediate plate stacking process that stacks the intermediate plate onto the channel opening surface of the actuator plate. The groove forming process is performed before the intermediate plate stacking process.

11. The method for manufacturing a head chip according to claim 9, wherein, The system includes an intermediate plate stacking process that stacks the intermediate plate onto the channel opening surface of the actuator plate. The groove forming process and the through-section forming process are performed after the intermediate plate stacking process.

Images