Substrate lifting device and substrate processing device

Abstract

A substrate lifting device and a substrate processing device that reduce deformation caused by heat are provided. The substrate lifting device includes a plurality of pins that contact a substrate; an upper plate that supports the plurality of pins and has a plurality of upper connection portions formed on a lower surface thereof; a lower plate that has a plurality of lower connection portions formed on an upper surface thereof and connected to the plurality of upper connection portions, and is disposed at a lower portion of the upper plate; and a driving portion that drives the plurality of pins to move up and down, wherein the lower plate supports a plurality of bushings on the upper surface thereof and a plurality of shafts that pass through the plurality of bushings.

Description

Technical Field

[0001] This invention relates to a substrate lifting device and a substrate processing device. Background Technology

[0002] Typically, in the process of manufacturing semiconductor devices, the semiconductor substrate undergoes multiple stages of processes, including material layer deposition, etching of the deposited material layers, cleaning, and drying. These processes are carried out in the process chamber, which serves as a semiconductor manufacturing apparatus.

[0003] A process chamber is a reaction vessel with a sealed reaction area inside, and a chuck is provided to hold the semiconductor substrate placed inside. Depending on the method of clamping the substrate, the chuck can be divided into vacuum chucks (using vacuum) or electrostatic chucks (using electrostatic force), with electrostatic chucks being the most commonly used recently.

[0004] The substrate is transported into or from the process chamber to the outside via a substrate transport device. The substrate transport is performed with the substrate raised and spaced apart from the electrostatic chuck. For this purpose, the electrostatic chuck is provided with a substrate lifting device for raising or lowering the substrate. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a substrate lifting device that reduces heat-induced deformation.

[0006] Another technical problem to be solved by the present invention is to provide a substrate processing apparatus using a substrate lifting device that reduces heat-induced deformation.

[0007] The technical problems of this invention are not limited to those described above. Those skilled in the art can clearly understand other technical problems not mentioned in the following description.

[0008] An aspect of the substrate lifting device of the present invention for solving the above-mentioned technical problems includes: a plurality of pins in contact with a substrate; an upper plate for supporting the plurality of pins, and having a plurality of upper connecting portions formed on the lower surface of the upper plate; a lower plate having a plurality of lower connecting portions formed on the upper surface of the lower plate and connected to the plurality of upper connecting portions, and the lower plate being disposed below the upper plate; and a driving unit for driving the plurality of pins to move up and down, wherein the lower plate supports a plurality of bushings on its upper surface and a plurality of shafts passing through the plurality of bushings.

[0009] The coefficient of thermal expansion of the upper plate is lower than that of the lower plate.

[0010] The upper plate includes an upper magnet on the lower surface, and the lower plate includes a lower magnet on the upper surface aligned with the upper magnet.

[0011] The plurality of upper connecting parts and the plurality of lower connecting parts are kinematically coupled.

[0012] The plurality of upper connecting portions have a shape that protrudes toward the lower plate, and at least one of the plurality of lower connecting portions includes a groove into which the upper connecting portion is inserted, and the groove extends in a direction connecting the center of the lower plate and the extension line of the lower connecting portion.

[0013] There are three of each of the plurality of upper connecting parts, the plurality of lower connecting parts, and the plurality of pins.

[0014] Holes for circuit passage are formed in the central portion of the upper plate and the central portion of the lower plate.

[0015] Another aspect of the substrate lifting device of the present invention for solving the above-mentioned technical problems includes: an upper plate including a plurality of upper connecting portions disposed on its lower surface; a plurality of pins disposed on the upper surface of the upper plate; and a lower plate disposed on the lower part of the upper plate, wherein the lower plate includes: a plurality of lower connecting portions disposed on the upper surface of the lower plate and connected to the plurality of upper connecting portions; a plurality of bushings disposed on the upper surface of the lower plate and arranged around the plurality of pins with reference to the center of the lower plate; and a plurality of shafts passing through the plurality of bushings, wherein the plurality of upper connecting portions include protrusions protruding toward the plurality of lower connecting portions, and the plurality of lower connecting portions include grooves for guiding the movement direction of the protrusions of the plurality of upper connecting portions.

[0016] The upper plate includes an upper magnet on the lower surface, and the lower plate includes a lower magnet on its upper surface aligned with the upper magnet, and an attractive force acts between the upper magnet and the lower magnet.

[0017] The substrate lifting device further includes a drive unit for driving the plurality of pins to move up and down.

[0018] The coefficient of thermal expansion of the upper plate is lower than that of the lower plate.

[0019] Each of the plurality of upper connecting parts, the plurality of lower connecting parts, and the plurality of pins is symmetrical about the center of the lower plate.

[0020] The groove extends in a first direction along an extension line connecting the center of the lower plate and the plurality of lower connecting portions, and has a width in a second direction perpendicular to the first direction; the protrusion is guided in the first direction and fixed in the second direction.

[0021] The substrate processing apparatus of the present invention for solving another technical problem mentioned above includes, on one hand: a process chamber having an internal space; a substrate support portion disposed in the internal space and used to support a substrate; and a substrate lifting portion for moving the substrate up and down, wherein the substrate lifting portion includes: a plurality of pins passing through the substrate support portion and contacting the substrate; an upper plate for supporting the plurality of pins and having a plurality of upper connecting portions formed on the lower surface of the upper plate; a lower plate having a plurality of lower connecting portions formed on the upper surface of the lower plate and connected to the plurality of upper connecting portions, and the lower plate being disposed below the upper plate; and a driving portion for driving the plurality of pins to move up and down, wherein the lower plate supports a plurality of bushings on its upper surface and a plurality of shafts passing through the plurality of bushings.

[0022] The plurality of upper connecting portions have a shape that protrudes downward toward the lower plate, and at least one of the plurality of lower connecting portions includes a groove in which the plurality of upper connecting portions are inserted.

[0023] The groove extends along a first direction connecting the center of the lower plate and the plurality of lower connecting portions on the lower connecting portion, and the upper connecting portion is guided in the first direction and fixed in a second direction different from the first direction when connected to the lower connecting portion.

[0024] The substrate lifting part further includes a bellows that contacts the outer wall of the process chamber, and the plurality of pins pass through the bellows.

[0025] The upper plate includes an upper magnet on the lower surface, and the lower plate includes a lower magnet on the upper surface aligned with the upper magnet.

[0026] The plurality of upper connecting portions and the plurality of lower connecting portions overlap with the plurality of pins.

[0027] The coefficient of thermal expansion of the upper plate is lower than that of the lower plate.

[0028] Specific details of other embodiments are included in the detailed description and accompanying drawings. Attached Figure Description

[0029] Figure 1 This is a schematic diagram illustrating a substrate lifting device according to an embodiment of the present invention.

[0030] Figure 2This is a diagram illustrating a substrate lifting device according to an embodiment of the present invention.

[0031] Figure 3 This is a diagram showing the upper plate of a substrate lifting device according to an embodiment of the present invention.

[0032] Figure 4 This is a diagram showing the lower plate of a substrate lifting device according to an embodiment of the present invention.

[0033] Figure 5 and Figure 6 This is a diagram illustrating the upper connecting portion and the lower connecting portion according to an embodiment of the present invention.

[0034] Figure 7 and Figure 8 This is a diagram illustrating the upper connecting portion and the lower connecting portion according to another embodiment of the present invention.

[0035] Figure 9 This is a diagram illustrating the coefficients of thermal expansion of the upper and lower plates according to an embodiment of the present invention.

[0036] Figure 10 and Figure 11 This is a diagram illustrating the operation of a substrate lifting device according to an embodiment of the present invention.

[0037] Figure 12 and Figure 13 This is a diagram illustrating the operation of a substrate processing apparatus according to an embodiment of the present invention. Detailed Implementation

[0038] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The advantages and features of the present invention, as well as methods for achieving these advantages and features, will be explained below with reference to the accompanying drawings. Figure 1 The invention becomes clear from the detailed description of the embodiments. However, the invention is not limited to the embodiments disclosed below, but can be implemented in many different forms. These embodiments are provided only to make the disclosure of the invention complete and to fully inform those skilled in the art of the scope of the invention, which is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same constituent elements.

[0039] When an element or layer is referred to as "on" or "above" another element or layer, it includes not only that it is directly above another element or layer, but also that other layers or elements are in between. Conversely, when an element is referred to as "directly" on or directly above another element, it indicates that there are no other elements or layers in between.

[0040] To readily describe the relationship between one element or component and another, as shown in the figure, spatial relative terms such as "below," "below," "lower," "above," and "upper" can be used. It should be understood that, in addition to the orientation shown in the figure, spatial relative terms also include terms indicating the different orientations of the elements during use or operation. For example, when the element shown in the figure is flipped, an element described as "below" or "below" of another element may be located "above" of that element. Therefore, the exemplary term "below" can include both "below" and "above" orientations. An element may also be oriented in another direction, thus the spatial relative terms can be interpreted according to orientation.

[0041] Although the terms "first," "second," etc., are used to describe various elements, constituent elements, and / or parts, these elements, constituent elements, and / or parts are obviously not limited by these terms. These terms are only used to distinguish one element, constituent element, and / or part from another element, constituent element, and / or part. Therefore, the first element, first constituent element, or first part mentioned below can obviously also be a second element, second constituent element, or second part within the technical concept of the present invention.

[0042] The terminology used in this specification is for illustrative purposes and is not intended to limit the invention. In this specification, the singular form includes the plural form unless specifically stated otherwise. The terms "comprises" and / or "comprising" as used in this specification do not exclude the presence or addition of one or more other constituent elements, steps, operations, and / or components in addition to those mentioned.

[0043] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) are to be used in the sense that can be commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, terms defined in commonly used dictionaries are not to be ideally or excessively interpreted unless explicitly defined otherwise.

[0044] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing the invention with reference to the drawings, identical or corresponding constituent elements are given the same reference numerals, regardless of the reference numerals, and repeated descriptions thereof are omitted.

[0045] Figure 1 This is a schematic diagram illustrating a substrate lifting device according to an embodiment of the present invention. Figure 2 This is a diagram illustrating a substrate lifting device according to an embodiment of the present invention. Figure 3This is a diagram showing the upper plate of a substrate lifting device according to an embodiment of the present invention. Figure 4 This is a diagram showing the lower plate of a substrate lifting device according to an embodiment of the present invention.

[0046] Reference Figures 1 to 4 The substrate lifting device 10 includes an upper plate 100, a lower plate 200, a lifting pin 300, and a drive unit 400.

[0047] The upper plate 100 can support the lifting pin 300. The upper plate 100 can contact the lower end of the lifting pin 300.

[0048] The upper plate 100 may include an upper central hole 130. The upper central hole 130 may be provided for accommodating circuitry for driving the board lifting device 10, etc. The upper plate 100 may have a symmetrical structure based on the upper central hole 130.

[0049] The upper plate 100 includes an upper connecting portion 110 and an upper magnet 120 on its lower surface. The upper plate 100 and the lower plate 200 can be spaced apart by the upper connecting portion 110 and the lower connecting portion 210. The area of ​​the upper plate 100 can be smaller than the area of ​​the lower plate 200. The upper plate 100 can overlap with the lower plate 200. Specifically, the upper central hole 130 of the upper plate 100 and the lower central hole 230 of the lower plate 200 can overlap.

[0050] The upper connecting portion 110 can be provided on the lower surface of the upper plate 100. Multiple upper connecting portions 110 can be arranged. For example, three upper connecting portions 110 can be arranged on the lower surface of the upper plate 100. Figure 3 The diagram shows an upper plate 100 including three upper connecting portions 110, but the embodiment is not limited to this. As another example, the upper plate 100 may include only one upper connecting portion 110 on its lower surface. As yet another example, the upper plate 100 may include more than three upper connecting portions 110. For ease of explanation, the following description uses the case where three upper connecting portions 110 are arranged on the upper plate 100 as an example.

[0051] The upper connecting portion 110 may include a shape aligned with the lower connecting portion 210. Specifically, the upper connecting portion 110 may include a shape that matches the lower connecting portion 210. The upper connecting portion 110 may be kinematically coupled with the lower connecting portion 210.

[0052] The upper connecting portion 110 may include a downwardly projecting shape. The upper connecting portion 110 may include a downwardly projecting protrusion. For example, the upper connecting portion 110 may include a hemispherical structure. Figure 3The diagram shows the upper connecting portion 110 having a hemispherical shape, but the embodiment is not limited to this. For example, the upper connecting portion 110 may include a downwardly projecting hexahedral shape. As another example, the upper connecting portion 110 may also include a separate protrusion inserted into the inner wall of the lower connecting portion 210 to secure the connection.

[0053] The upper connecting portion 110 may overlap with the lifting pin 300 across the upper plate 100. However, the embodiment is not limited to this. For example, the upper connecting portion 110 may be closer to the upper central hole 130 than the lifting pin 300. That is, when viewed from above, the upper connecting portion 110 may be located inside the upper plate 100 relative to the lifting pin 300.

[0054] exist Figure 3 The diagram shows that all the upper connecting portions 110 have the same shape, but the embodiment is not limited to this. For example, the multiple upper connecting portions 110 can each have different shapes. The first upper connecting portion 111 can have a hemispherical shape, the second upper connecting portion 112 can have a hexahedral shape, and the third upper connecting portion 113 can have other undefined shapes.

[0055] The upper magnet 120 can be disposed on the lower surface of the upper plate 100. Multiple upper magnets 120 can be arranged. For example, three upper magnets 120 can be arranged on the lower surface of the upper plate 100. Figure 3 The diagram shows an upper plate 100 including three upper magnets 120, but the embodiment is not limited to this. As another example, the upper plate 100 may include only one upper magnet 120 on its lower surface. As yet another example, the upper plate 100 may include more than three upper magnets 120. For ease of explanation, the following description uses the case of three upper magnets 120 arranged on the upper plate 100 as an example.

[0056] The upper magnet 120 can be aligned with the lower magnet 220. Specifically, the upper magnet 120 can completely overlap with the lower magnet 220 before the substrate lifting device 10 expands due to heat.

[0057] When the upper plate 100 is viewed from above, the upper magnet 120 can be located inside the upper connecting portion 110 and the lifting pin 300. That is, the upper magnet 120 can be closer to the upper central hole 130 than the upper connecting portion 110 and the lifting pin 300.

[0058] The lower plate 200 can support the bushing 250. The lower plate 200 can contact the lower end of the bushing 250. The bushing 250 can be penetrated by the shaft 240. The bushing 250 can surround the shaft 240. The shaft 240 can pass through the lower plate 200 and the bushing 250. The shaft 240 can be fixed or can move up and down. The shaft 240 can function as a shaft for allowing the bushing 250 to move up and down. That is, the bushing 250 can move up and down with respect to the shaft 240. As the bushing 250 moves up and down with respect to the shaft 240, the lower plate 200 can move up and down.

[0059] The lower plate 200 may include a lower central hole 230. The lower central hole 230 may be provided for accommodating circuitry for driving the substrate lifting device 10, etc. The lower plate 200 may include a symmetrical structure based on the lower central hole 230.

[0060] The lower plate 200 includes a lower connecting portion 210 and a lower magnet 220 on its upper surface.

[0061] The lower connecting portion 210 can be provided on the upper surface of the lower plate 200. Multiple lower connecting portions 210 can be arranged. For example, three lower connecting portions 210 can be arranged on the upper surface of the lower plate 200. Figure 4 The diagram shows a lower plate 200 including three lower connecting portions 210, but the embodiment is not limited to this. As another example, the lower plate 200 may include only one lower connecting portion 210 on its upper surface. As yet another example, the lower plate 200 may include more than three lower connecting portions 210. For ease of explanation, the following description uses the case where three lower connecting portions 210 are arranged on the lower plate 200 as an example.

[0062] The lower connecting portion 210 can be aligned with the upper connecting portion 110. The lower connecting portion 210 can correspond one-to-one with the upper connecting portion 110. The lower connecting portion 210 can include a structure having a shape that matches the upper connecting portion 110. The lower connecting portion 210 can be kinematically coupled to the upper connecting portion 110.

[0063] The lower connecting portion 210 may have a downwardly recessed shape. Specifically, the lower connecting portion 210 may include a groove capable of receiving the upper connecting portion 110. The groove of the lower connecting portion 210 may include a width and an extension direction that restrict the movement direction of the upper connecting portion 110. Referring to this, see below... Figures 5 to 8 Please provide a detailed explanation.

[0064] The lower connecting portion 210 can be positioned closer to the lower central hole 230 than the shaft 240 and the bushing 250. That is, when the lower plate 200 is viewed from above, the lower connecting portion 210 can be located inside the shaft 240 and the bushing 250.

[0065] The lower magnet 220 can be disposed on the upper surface of the lower plate 200. Multiple lower magnets 220 can be arranged. For example, three lower magnets 220 can be arranged on the upper surface of the lower plate 200. Figure 4 The diagram shows a lower plate 200 comprising three lower magnets 220, but the embodiment is not limited to this. As another example, the lower plate 200 may include only one lower magnet 220 on its upper surface. As yet another example, the lower plate 200 may include more than three lower magnets 220. For ease of explanation, the following description uses the case of three lower magnets 220 arranged on the lower plate 200 as an example.

[0066] The lower magnet 220 can be aligned with the upper magnet 120. An attractive force can act between the lower magnet 220 and the upper magnet 120, thereby ensuring stable alignment of the upper plate 100 and the lower plate 200. Specifically, the attractive force acting between the lower magnet 220 and the upper magnet 120 can prevent the upper plate 100 and the lower plate 200 from twisting due to the incomplete contact between the upper connecting portion 110 and the lower connecting portion 210.

[0067] The lifting pin 300 may include a portion that directly contacts the substrate. The lifting pin 300 can directly contact the substrate and move the substrate up and down.

[0068] The lifting pin 300 can be disposed on the upper surface of the upper plate 100. That is, the lifting pin 300 can be supported by the upper plate 100. Multiple lifting pins 300 can be arranged on the upper surface of the upper plate 100.

[0069] Multiple lifting pins 300 can be arranged on the edge of the upper plate 100. The multiple lifting pins 300 can be arranged symmetrically with respect to the upper central hole 130 of the upper plate 100. That is, the multiple lifting pins 300 can be arranged at points spaced equidistant from the upper central hole 130.

[0070] The lifting pin 300 can be located on the line connecting the upper central hole 130 and the shaft 240 and bushing 250 arranged on the upper surface of the lower plate 200. That is, the lifting pin 300, shaft 240 and bushing 250 can be located on the same line as the upper central hole 130.

[0071] The lifting pin 300 can be surrounded by the housing portion 320. The lifting pin 300 can be connected to the bellows 310 and the housing portion 320. The lifting pin 300 can pass through the bellows 310. The bellows 310 can have a disc shape. The bellows 310 can securely connect the lifting pin 300 to the cavity when the lifting pin 300 passes through the cavity and contacts the substrate. The lower end of the housing portion 320 contacts the upper plate 100. The housing portion 320 can surround the lifting pin 300. The lifting pin 300 can pass through the bellows 310 from the inside of the housing portion 320 and extend in a direction perpendicular to the upper plate 100.

[0072] The drive unit 400 can drive the substrate lifting device 10. Specifically, the drive unit 400 can drive the lifting pin 300 to lift the substrate. The drive unit 400 can drive the bushing 250 to lift about the axis 240.

[0073] Figure 5 and Figure 6 This is a diagram illustrating the upper connecting portion and the lower connecting portion according to an embodiment of the present invention.

[0074] Reference Figure 5 and Figure 6 The first upper connecting portion 111, the second upper connecting portion 112, and the third upper connecting portion 113 may each have a first diameter D1, a second diameter D2, and a third diameter D3, respectively. The cross-sectional areas of the first upper connecting portion 111, the second upper connecting portion 112, and the third upper connecting portion 113 may each be smaller than the cross-sectional areas of the first lower connecting portion 211, the second lower connecting portion 212, and the third lower connecting portion 213, respectively.

[0075] The first upper connecting part 111, the second upper connecting part 112, and the third upper connecting part 113 can be connected to the first lower connecting part 211, the second lower connecting part 212, and the third lower connecting part 213, respectively. The first upper connecting part 111, the second upper connecting part 112, and the third upper connecting part 113 can be inserted into the first slot G1 of the first lower connecting part 211, the second slot G2 of the second lower connecting part 212, and the third slot G3 of the third lower connecting part 213, respectively.

[0076] The first lower connecting portion 211, the second lower connecting portion 212, and the third lower connecting portion 213 may each include a first groove G1, a second groove G2, and a third groove G3. The first groove G1, the second groove G2, and the third groove G3 refer to grooves that are recessed from the upper surface to the lower surface of the lower plate 200.

[0077] The first groove G1, the second groove G2, and the third groove G3 each have a first width W1, a second width W2, and a third width W3, respectively. The first width W1, the second width W2, and the third width W3 can be the same as the first diameter D1 of the first upper connecting portion 111, the second diameter D2 of the second upper connecting portion 112, and the third diameter D3 of the third upper connecting portion 113, respectively. That is, the first upper connecting portion 111, the second upper connecting portion 112, and the third upper connecting portion 213, which are respectively connected to the first lower connecting portion 211, the second lower connecting portion 212, and the third lower connecting portion 213, can be fixed in the direction of the first width W1 of the first groove G1, the direction of the second width W2 of the second groove G2, and the direction of the third width W3 of the third groove G3, respectively.

[0078] The first groove G1, the second groove G2, and the third groove G3 can extend by a first length L1, a second length L2, and a third length L3 in the first direction Y, the second direction X, and the third direction Z, respectively. Here, the first direction Y can refer to the direction of the straight line connecting the center point of the first shaft 241 and the center point of the first bushing 251 from the center point of the lower central hole 230. The second direction X can refer to the direction of the straight line connecting the center point of the second shaft 242 and the center point of the second bushing 252 from the center point of the lower central hole 230. The third direction Z can refer to the direction of the straight line connecting the center point of the third shaft 243 and the center point of the third bushing 253 from the center point of the lower central hole 230.

[0079] The first groove G1, the second groove G2, and the third groove G3, extending in the first direction Y, the second direction X, and the third direction Z respectively, have first lengths L1, second lengths L2, and third lengths L3 that are greater than the first diameter D1 of the first upper connecting portion 111 inserted into the first groove G1, the second diameter D2 of the second upper connecting portion 112 inserted into the second groove G2, and the third diameter D3 of the third upper connecting portion 113 inserted into the third groove G3. Therefore, when the first upper connecting portion 111, the second upper connecting portion 112, and the third upper connecting portion 113 are respectively inserted into the first lower connecting portion 211, the second lower connecting portion 212, and the third lower connecting portion 213, the first upper connecting portion 111, the second upper connecting portion 112, and the third upper connecting portion 113 can move in the first direction Y, the second direction X, and the third direction Z respectively, extending from the first groove G1 of the first lower connecting portion 211, the second groove G2 of the second lower connecting portion 212, and the third groove G3 of the third lower connecting portion 213.

[0080] That is, the first upper connecting portion 111, the second upper connecting portion 112, and the third upper connecting portion 113 can be connected to the first lower connecting portion 211, the second lower connecting portion 212, and the third lower connecting portion 213, respectively, and are guided by the first groove G1, the second groove G2, and the third groove G3. When the first upper connecting portion 111 is connected to the first lower connecting portion 211, the first upper connecting portion 111 can be guided in the first direction Y extending from the first groove G1. When the second upper connecting portion 112 is connected to the second lower connecting portion 212, the second upper connecting portion 112 can be guided in the second direction X extending from the second groove G2. When the third upper connecting portion 113 is connected to the third lower connecting portion 213, the third upper connecting portion 113 can be guided in the third direction Z extending from the third groove G3.

[0081] When the first upper connecting portion 111 is connected to the first lower connecting portion 211, the first upper connecting portion 111 is fixed in the width direction of the first groove G1 of the first lower connecting portion 211, but can move in the first direction Y extending from the first groove G1 of the first lower connecting portion 211. When the second upper connecting portion 112 is connected to the second lower connecting portion 212, the second upper connecting portion 112 is fixed in the width direction of the second groove G2 of the second lower connecting portion 212, but can move in the second direction X extending from the second groove G2 of the second lower connecting portion 212. Similarly, when the third upper connecting portion 113 is connected to the third lower connecting portion 213, the third upper connecting portion 113 is fixed in the width direction of the third groove G3 of the third lower connecting portion 213, but can move in the third direction Z extending from the third groove G3 of the third lower connecting portion 213.

[0082] Figure 7 and Figure 8 This is a diagram illustrating the upper connecting portion and the lower connecting portion according to another embodiment of the present invention. For ease of explanation, the main description will be based on references. Figure 5 and Figure 6 The characteristics described are different.

[0083] Reference Figure 7 and Figure 8 The cross-sectional areas of the first upper connecting part 111, the second upper connecting part 112, and the third upper connecting part 113 can be equal to or less than the cross-sectional areas of the first lower connecting part 211, the second lower connecting part 212, and the third lower connecting part 213, respectively.

[0084] Specifically, the cross-sectional area of ​​the first upper connecting portion 111 can be equal to the cross-sectional area of ​​the first lower connecting portion 211. The first groove G1 of the first lower connecting portion 211 can have the same circular shape as the cross-section of the first upper connecting portion 111. In this case, the diameter of the first groove G1 can be equal to the first diameter D1 of the first upper connecting portion 111. Therefore, when the first upper connecting portion 111 is inserted into the first groove G1 of the first lower connecting portion 211, the first upper connecting portion 111 can be firmly fixed in the first groove G1.

[0085] The cross-sectional area of ​​the second upper connecting portion 112 can be smaller than the cross-sectional area of ​​the second lower connecting portion 212. The second groove G2 of the second lower connecting portion 212 can have a circular shape larger than the cross-section of the second upper connecting portion 112. That is, the fourth diameter D4 of the second groove G2 of the second lower connecting portion 212 can be larger than the second diameter D2 of the second upper connecting portion 112. Therefore, when the second upper connecting portion 112 is inserted into the second groove G2 of the second lower connecting portion 212, the second upper connecting portion 112 can move within the second groove G2 of the second lower connecting portion 212 without being fixed in any direction.

[0086] The cross-sectional area of ​​the third upper connecting portion 113 can be smaller than the cross-sectional area of ​​the third lower connecting portion 213. The third groove G3 of the third lower connecting portion 213 can have a third width W3 and can extend a third length L3 in a direction perpendicular to the third width W3. The third width W3 of the third groove G3 can be equal to the third diameter D3 of the third upper connecting portion 113. Therefore, when the third upper connecting portion 113 is connected to the third lower connecting portion 213, the third upper connecting portion 113 can be fixed inside the third groove G3 of the third lower connecting portion 213 in the direction of the third width W3.

[0087] The third length L3 of the third groove G3 is greater than the third diameter D3 of the third upper connecting portion 113 inserted into the third groove G3. Therefore, when the third upper connecting portion 113 is inserted into the third lower connecting portion 213, the third upper connecting portion 113 can move in the direction in which the third groove G3 of the third lower connecting portion 213 extends.

[0088] Figure 9 This is a diagram illustrating the coefficients of thermal expansion of the upper and lower plates according to an embodiment of the present invention.

[0089] Reference Figure 9 The upper plate 100 and the lower plate 200 may have different coefficients of thermal expansion. Specifically, the coefficient of thermal expansion of the upper plate 100 may be less than that of the lower plate 200. The upper plate 100 and the lower plate 200 may be made of different materials. The upper plate 100 may be made of invar or ceramic materials.

[0090] When the upper plate 100 and lower plate 200 raise and lower the substrate, the upper plate 100 and lower plate 200 may expand due to heat transferred from the electrostatic chuck. At this time, the upper plate 100, whose coefficient of thermal expansion is smaller than that of the lower plate 200, may expand less than the lower plate 200. Conversely, the lower plate 200, whose coefficient of thermal expansion is larger than that of the upper plate 100, may expand more than the upper plate 100. Therefore, the movement of the lifting pin 300 supported by the upper plate 100 in the direction parallel to the upper plate 100 due to the thermal expansion of the upper plate 100 can be reduced. Furthermore, the amount of positional deformation of the lifting pin 300 supported by the upper plate 100 due to the thermal expansion of the upper plate 100 can be less than the amount of positional deformation of the shaft 240 and bushing 250 supported by the lower plate 200 due to the thermal expansion of the lower plate 200.

[0091] Figure 10 and Figure 11 This is a diagram illustrating the operation of a substrate lifting device according to an embodiment of the present invention.

[0092] Reference Figure 10If the substrate lifting device 10 does not deform due to heat, the first upper connecting part 111 can be positioned inside the first groove G1 of the first lower connecting part 211, away from the lower central hole 230 (see reference). Figure 6 Recently, similarly, the second upper connecting portion 112 can be positioned inside the second groove G2 of the second lower connecting portion 212 at a distance from the lower central hole 230 (see reference). Figure 6 Recently, the upper magnet 120 and the lower magnet 220 can completely overlap. At this time, the first lifting pin 301 and the second lifting pin 302 can be spaced apart by a first distance DS1.

[0093] Reference Figure 11 In the event of thermal expansion of the substrate lifting device 10, the first upper connecting portion 111 can be positioned inside the first groove G1 of the first lower connecting portion 211, away from the lower central hole 230 (see reference). Figure 6 The furthest point. Similarly, the second upper connecting portion 112 can be positioned inside the second groove G2 of the second lower connecting portion 212 at a distance from the lower central hole 230 (see reference). Figure 6 The furthest point. The upper magnet 120 and the lower magnet 220 may not completely overlap. The position of the upper magnet 120 can be determined from the upper central hole 130 (see reference). Figure 3 The first lifting pin 301 and the second lifting pin 302 can be spaced apart by a second distance DS2.

[0094] Reference Figure 10 and Figure 11 In the event that the substrate lifting device 10 deforms due to thermal expansion, the positions of the plurality of lifting pins 300 may change. However, since the upper connecting portion 110 and the lower connecting portion 210 are connected, and the upper connecting portion 110 moves along the direction of the groove formed in the lower connecting portion 210, the direction of deformation can be limited. Therefore, the potential danger caused by the positional deformation of the lifting pins 300 can be reduced.

[0095] Figure 12 and Figure 13 This is a diagram illustrating the operation of a substrate processing apparatus according to an embodiment of the present invention.

[0096] Reference Figure 12 The substrate processing apparatus 1 includes a substrate lifting device 10, a process chamber 20, and a substrate support 30.

[0097] The substrate lifting device 10 can lift and lower the substrate W being processed inside the process chamber 20. The bellows 310 of the substrate lifting device 10 can be arranged on the outer wall of the process chamber 20 through which the lifting pin 300 passes. The bellows 310 can isolate the interior and exterior of the process chamber 20 to maintain a vacuum inside the process chamber 20. That is, the bellows 310 can seal the process chamber 20.

[0098] exist Figure 12 and Figure 13 The illustration shows a substrate lifting device 10 arranged outside the process chamber 20 to lift the substrate W, but the embodiment is not limited to this. For example, the substrate lifting device 10 can lift the substrate W by being arranged inside the process chamber 20 at the lower part of the substrate support 30.

[0099] The process chamber 20 forms an internal space for processing the substrate W. The process chamber 20 may include a door 21 on its side wall for the substrate W to enter and exit. A substrate support 30 may support the substrate W. The substrate support 30 may include an electrostatic chuck. The substrate support 30 may include a through portion 31 through which a lifting pin 300 passes.

[0100] When the substrate W is processed inside the process chamber 20, the substrate lifting device 10 can lower the substrate W so that the substrate W is placed on the substrate support 30.

[0101] Specifically, as the bushing 250 descends via the drive unit 400 about the shaft 240, the lower plate 200 and the upper plate 100 also descend. Consequently, the lifting pin 300, supported by the upper plate 100, descends. The descending of the lifting pin 300, which contacts the substrate W, prevents the lifting pin 300 from protruding upwards relative to the substrate support 30, and thus, the substrate W is positioned on the substrate support 30.

[0102] Reference Figure 13 The substrate lifting device 10 can raise the substrate W from the substrate support 30. Specifically, as the bushing 250 rises via the drive unit 400 about the shaft 240, the lower plate 200 and the upper plate 100 rise. Therefore, the lifting pin 300 supported by the upper plate 100 rises and protrudes upward relative to the substrate support 30. As the lifting pin 300, which is in contact with the substrate W, rises, the substrate W can be suspended from the substrate support 30.

[0103] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, those skilled in the art should understand that the present invention can be implemented in other specific forms without changing its technical concept or essential features. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

Claims

1. A substrate lifting device, comprising: Multiple pins contact the substrate; An upper plate is used to support the plurality of pins, and a plurality of upper connecting portions are formed on the lower surface of the upper plate; A lower plate has a plurality of lower connecting portions formed on its upper surface, which are connected to the plurality of upper connecting portions, and the lower plate is arranged below the upper plate. as well as The drive unit is used to drive the plurality of pins to move up and down. The lower plate supports a plurality of bushings on its upper surface and a plurality of shafts passing through the plurality of bushings; At least one of the plurality of lower connecting portions includes a groove. The groove extends along a first direction connecting the center of the lower plate and the lower connecting portion on the lower connecting portion. When the upper connecting part is connected to the lower connecting part, the upper connecting part can move along the extending direction of the groove in the first direction. The upper plate includes an upper magnet on the lower surface. The lower plate includes a lower magnet on the upper surface aligned with the upper magnet. The upper magnet and the lower magnet do not contact each other.

2. The substrate lifting device according to claim 1, wherein, The coefficient of thermal expansion of the upper plate is lower than that of the lower plate.

3. The substrate lifting device according to claim 1, wherein, The plurality of upper connecting parts and the plurality of lower connecting parts are kinematically connected.

4. The substrate lifting device according to claim 1, wherein, The plurality of upper connecting portions have a shape that protrudes toward the lower plate, and The upper connecting part is inserted into the groove.

5. The substrate lifting device according to claim 1, wherein, There are three of each of the plurality of upper connecting parts, the plurality of lower connecting parts, and the plurality of pins.

6. The substrate lifting device according to claim 1, wherein, Holes for circuit passage are formed in the central portion of the upper plate and the central portion of the lower plate.

7. A substrate processing apparatus, comprising: The process chamber forms an internal space; A substrate support portion is disposed in the internal space and is used to support the substrate; as well as A substrate lifting unit is used to move the substrate up and down. The substrate lifting unit includes: Multiple pins pass through the substrate support portion and contact the substrate; An upper plate is used to support the plurality of pins, and a plurality of upper connecting portions are formed on the lower surface of the upper plate; A lower plate, having a plurality of lower connecting portions formed on its upper surface to connect with the plurality of upper connecting portions, and the lower plate being disposed below the upper plate; and The drive unit is used to drive the plurality of pins to move up and down. The lower plate supports multiple bushings on its upper surface and multiple shafts passing through the bushings. At least one of the plurality of lower connecting portions includes a groove. The groove extends along a first direction connecting the center of the lower plate and the lower connecting portion on the lower connecting portion. When the upper connecting part is connected to the lower connecting part, the upper connecting part can move along the extending direction of the groove in the first direction. The upper plate includes an upper magnet on the lower surface. The lower plate includes a lower magnet on the upper surface aligned with the upper magnet. The upper magnet and the lower magnet do not contact each other.

8. The substrate processing apparatus according to claim 7, wherein, The plurality of upper connecting portions have a shape that protrudes downward toward the lower plate, and The slot contains the plurality of upper connecting parts.

9. The substrate processing apparatus according to claim 8, wherein, When the upper connecting part is connected to the lower connecting part, the upper connecting part is guided in the first direction and fixed in a second direction different from the first direction.

10. The substrate processing apparatus according to claim 7, wherein, The substrate lifting part further includes a bellows that contacts the outer wall of the process chamber, and the plurality of pins pass through the bellows.

11. The substrate processing apparatus according to claim 7, wherein, The plurality of upper connecting portions and the plurality of lower connecting portions overlap with the plurality of pins.

12. The substrate processing apparatus according to claim 7, wherein, The coefficient of thermal expansion of the upper plate is lower than that of the lower plate.

13. A substrate lifting device, comprising: The upper plate includes a plurality of upper connecting portions arranged on its lower surface; Multiple pins are arranged on the upper surface of the upper plate; as well as The lower plate is located below the upper plate. The lower plate includes: Multiple lower connecting parts are arranged on the upper surface of the lower plate and connected to the multiple upper connecting parts; Multiple bushings are arranged on the upper surface of the lower plate and around the periphery of the multiple pins with reference to the center of the lower plate; and Multiple shafts, passing through the multiple bushings, The plurality of upper connecting portions include protrusions projecting toward the plurality of lower connecting portions, and The plurality of lower connecting portions include grooves. The groove extends in a first direction along the extension line connecting the center of the lower plate and the plurality of lower connecting portions. When the upper connecting portion is connected to the lower connecting portion, the groove guides the protrusions of the plurality of upper connecting portions to move along the extending direction of the groove in the first direction. The upper plate includes an upper magnet on the lower surface. The lower plate includes a lower magnet on its upper surface that is aligned with the upper magnet. The upper magnet and the lower magnet do not contact each other.

14. The substrate lifting device according to claim 13, wherein, An attractive force acts between the upper magnet and the lower magnet.

15. The substrate lifting device according to claim 13, further comprising: A drive unit is used to drive the plurality of pins to move up and down.

16. The substrate lifting device according to claim 13, wherein, The coefficient of thermal expansion of the upper plate is lower than that of the lower plate.

17. The substrate lifting device according to claim 13, wherein, Each of the plurality of upper connecting parts, the plurality of lower connecting parts, and the plurality of pins is symmetrical about the center of the lower plate.

18. The substrate lifting device according to claim 13, wherein, The groove has a width in a second direction perpendicular to the first direction, and The protrusion is guided in the first direction and fixed in the second direction.

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