A passive LED module package method and package module

Abstract

The application provides a passive LED module and a laminated packaging method thereof. The laminated packaging method comprises packaging LED monomers of each light color respectively to obtain LED packaging modules corresponding to the light colors; the LED packaging module comprises LED chips arranged according to a preset array, the LED chips in the same row are connected to each other, and the LED chips in the same column are connected to each other; and the LED packaging modules of each light color are sequentially laminated to obtain the laminated packaging module. The LED monomers of at least two light colors are laminated to make the light emitting directions of the LED chips of different light colors consistent, and the light mixing effect is good. In addition, the LED chips of each light color are arranged separately, the production efficiency is greatly improved, and the production cost is reduced.

Description

Technical Field

[0001] This application relates to the field of chip packaging technology, and in particular to a method for stacked packaging of passive LED modules and a stacked packaging module. Background Technology

[0002] An LED (Light Emitting Diode) is a solid-state semiconductor device that uses a solid semiconductor chip as the light-emitting material. It emits photons by releasing energy through the recombination of charge carriers, directly converting electrical energy into light energy. LEDs have advantages such as high brightness, small size, high efficiency, and long lifespan, and are widely used in traffic signs, outdoor full-color displays, and other fields.

[0003] Currently, LED module packaging methods involve placing red, green, and blue chips side by side. However, the light emission directions of the three color chips are misaligned, resulting in poor three-color mixing. Furthermore, the arrangement process of the three color chips is inefficient and costly, especially when it comes to Mini LED and Micro LED, where the mass transfer of the three color chips is quite difficult. Summary of the Invention

[0004] In view of the aforementioned problems, this application is made to provide a method for stacking and packaging a passive LED module to overcome or at least partially solve the aforementioned problems, comprising:

[0005] A method for stacking and packaging a passive LED module, used to package LED units of at least two light colors, wherein the LED unit of the first light color (e.g., red light) includes a light-shielding substrate and an LED chip of the first light color disposed on the surface of the light-shielding substrate, and the LED units of the other light colors (e.g., blue, green light) each include a transparent substrate and an LED chip of the corresponding light color disposed on the surface of the transparent substrate; comprising:

[0006] Each LED individual of a different color is packaged to obtain an LED package module of the corresponding color; wherein, the LED package module includes LED chips arranged in a preset array, with LED chips in the same row connected to each other, and LED chips in the same column connected to each other;

[0007] The LED packaging module of the first color and the LED packaging modules of the other colors are stacked sequentially to obtain a stacked packaging module.

[0008] Preferably, the step of encapsulating the individual LEDs of each color to obtain LED package modules of the corresponding color includes:

[0009] The LED chips of the same color are arranged in the preset array;

[0010] The first electrodes of the LED chips in the same row are interconnected to form a lateral interconnection path by additive manufacturing.

[0011] The second electrodes of the LED chips in the same column are interconnected to form a vertical interconnection path by additive manufacturing.

[0012] Each LED chip is potted and encapsulated to obtain the LED package module with the corresponding light color.

[0013] Preferably, the step of arranging the LED chips of the same color according to the preset array includes:

[0014] The LEDs of the same color are arranged in the preset array;

[0015] or;

[0016] The LEDs of the same color are arranged in the preset array;

[0017] When the LED unit is the LED unit of the first light color, the light-shielding substrate is removed to form a thin film chip;

[0018] When the LED unit is of another color, the transparent substrate is removed to form a thin film chip.

[0019] Preferably, the step of interconnecting the first electrodes of the LED chips in the same row to form a lateral interconnection path by additive manufacturing includes:

[0020] The first electrodes of the LED chips in the same row are interconnected on the first surface of the LED chips to form the lateral interconnection path by means of additive manufacturing.

[0021] Preferably, the step of interconnecting the second electrodes of the LED chips in the same column to form a vertical interconnection path by additive manufacturing includes:

[0022] The second electrodes of the LED chips in the same column are interconnected on the first surface of the LED chips to form the vertical interconnection path by means of additive manufacturing.

[0023] or;

[0024] The second electrodes of the LED chips in the same row are interconnected on the second surface of the LED chips by additive manufacturing to form the vertical interconnection path.

[0025] Preferably, the step of potting and encapsulating each of the LED chips includes:

[0026] A light-shielding adhesive layer is laid on the surface of each LED chip; wherein, the light-shielding adhesive layer has a longitudinally extending light-transmitting hole corresponding to each LED chip;

[0027] A transparent adhesive layer is laid inside the light-transmitting hole.

[0028] Preferably, the step of potting and encapsulating each of the LED chips further includes:

[0029] A semi-reflective film layer is laid on the surface of the light-shielding adhesive layer and the transparent adhesive layer.

[0030] Preferably, the additive manufacturing method includes one or more of chemical vapor deposition, physical vapor deposition, atomic layer deposition, sputtering, evaporation, electroplating, and electroless plating.

[0031] A stacked packaging module prepared according to any one of the above-described stacked packaging methods includes: an LED packaging module of a first color and LED packaging modules of other colors; the LED packaging module of the first color and the LED packaging modules of other colors are stacked sequentially.

[0032] This application has the following advantages:

[0033] In the embodiments of this application, compared with the existing LED module packaging methods where the three primary color chips emit light in different directions, resulting in poor light mixing effect, and where the three primary color chips have low arrangement efficiency and high cost, this application provides a solution for stacking and packaging three primary color chips, specifically: "A stacking and packaging method for a passive LED module, used to package at least two types of LED units, wherein the first type of LED unit includes a light-shielding substrate and a first-color LED chip disposed on the surface of the light-shielding substrate, and the other types of LED units respectively include a transparent substrate and a corresponding-color LED chip disposed on the surface of the transparent substrate; including: packaging the LED units of each color respectively to obtain an LED packaging module of the corresponding color; wherein the LED packaging module includes the LED chips arranged in a preset array, the LED chips in the same row are connected to each other, and the LED chips in the same column are connected to each other; the first-color LED packaging module and the other-color LED packaging modules are stacked sequentially to obtain a stacked packaging module." By stacking and packaging LED chips of at least two different colors, the light emission direction of LED chips of different colors is consistent, the light mixing effect is better, and each type of LED chip is arranged separately, which greatly improves production efficiency and reduces production costs. Attached Figure Description

[0034] To more clearly illustrate the technical solution of this application, the drawings used in the description of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0035] Figure 1 This is a flowchart illustrating the steps of a passive LED module stacking and packaging method according to an embodiment of this application;

[0036] Figure 2 This is a schematic diagram of the first part of a stacked packaging method for a passive LED module provided in a specific implementation of this application;

[0037] Figure 3 This is a schematic diagram of the second part of a stacked packaging method for a passive LED module provided in a specific implementation of this application;

[0038] Figure 4 This is a schematic diagram of the third part of a stacked packaging method for a passive LED module provided in a specific implementation of this application;

[0039] Figure 5 This is a schematic diagram of the structure of a stacked packaging module provided in a specific implementation of this application;

[0040] Figure 6 This is a schematic diagram of the first part of a stacked packaging method for a passive LED module provided in another specific implementation of this application;

[0041] Figure 7 This is a schematic diagram of the second part of a stacked packaging method for a passive LED module provided in another specific implementation of this application;

[0042] Figure 8 This is a schematic diagram of the third part of a stacked packaging method for a passive LED module provided in another specific implementation of this application;

[0043] Figure 9 This is a schematic diagram of the structure of a stacked packaging module provided in another specific implementation of this application;

[0044] Figure 10 This is a schematic diagram of the first part of a stacked packaging method for a passive LED module provided in another specific implementation of this application;

[0045] Figure 11 This is a schematic diagram of the second part of a stacked packaging method for a passive LED module provided in another specific implementation of this application;

[0046] Figure 12This is a schematic diagram of the third part of a stacked packaging method for a passive LED module provided in another specific implementation of this application;

[0047] Figure 13 This is a schematic diagram of a stacked encapsulation module provided in another specific implementation of this application.

[0048] The reference numerals in the accompanying drawings are as follows:

[0049] 100, LED unit; 110, LED chip; 111, lateral interconnection path; 112, vertical interconnection path; 120, light-shielding substrate; 130, transparent substrate; 20, LED packaging module; 210, protective adhesive layer; 220, light-shielding adhesive layer; 230, transparent adhesive layer; 240, semi-reflective film layer; 30, first carrier board; 40, second carrier board; 50, third carrier board. Detailed Implementation

[0050] To make the objectives, features, and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0051] It should be noted that, in any embodiment of this application, the stacked packaging method is used to package at least two types of LED units 100, wherein the first type of LED unit 100 includes a light-shielding substrate 120 and an LED chip 110 of the first type of LED disposed on the surface of the light-shielding substrate 120, and the other types of LED units 100 respectively include a transparent substrate 130 and an LED chip 110 of the corresponding type of LED disposed on the surface of the transparent substrate 130. As an example, the LED unit 100 includes a red LED unit 100(R) and a green LED unit 100(R). The LED assembly includes a single unit 100(G) and a blue LED single unit 100(B). The red LED single unit 100(R) includes the light-shielding substrate 120 and a red LED chip 110(R) disposed on the surface of the light-shielding substrate 120. The green LED single unit 100(G) includes the transparent substrate 130(G) and a green LED chip 110(G) disposed on the surface of the transparent substrate 130(G). The blue LED single unit 100(B) includes the transparent substrate 130(B) and a blue LED chip 110(B) disposed on the surface of the transparent substrate 130(B).

[0052] Reference Figure 1 This application illustrates a method for stacking and packaging a passive LED module according to an embodiment of the present application, comprising:

[0053] S110. Each LED individual 100 of each color is encapsulated to obtain an LED encapsulation module 20 of the corresponding color; wherein, the LED encapsulation module 20 includes LED chips 110 arranged in a preset array, the LED chips 110 in the same row are connected to each other, and the LED chips 110 in the same column are connected to each other.

[0054] S120. The LED packaging module 20 of the first color and the LED packaging modules 20 of the other colors are stacked in sequence to obtain a stacked packaging module.

[0055] In the embodiments of this application, compared with the existing LED module packaging methods where the three primary color chips emit light in different directions, resulting in poor light mixing effect, and where the three primary color chips have low arrangement efficiency and high cost, this application provides a solution for stacking and packaging three primary color chips, specifically: "A stacking and packaging method for a passive LED module, used to package at least two types of LED units 100, wherein the first type of LED unit 100 includes a light-shielding substrate 120 and a first type of LED chip 110 disposed on the surface of the light-shielding substrate 120, and the other types of LED units 100 are distributed..." The device includes a transparent substrate 130 and LED chips 110 of corresponding colors disposed on the surface of the transparent substrate 130. The process includes: encapsulating each LED chip 100 of a different color to obtain an LED encapsulation module 20 of the corresponding color; wherein the LED encapsulation module 20 includes LED chips 110 arranged in a preset array, with LED chips 110 in the same row interconnected and LED chips 110 in the same column interconnected; the LED encapsulation module 20 of the first color and the LED encapsulation modules 20 of the remaining colors are sequentially stacked to obtain a stacked encapsulation module. By stacking and encapsulating at least two colors of LED chips 100, the light emission direction of the LED chips 110 of different colors is consistent, resulting in better light mixing. Furthermore, the separate arrangement of each color of LED chip 110 significantly improves production efficiency and reduces production costs.

[0056] The following will further describe a method for stacking and packaging a passive LED module in this exemplary embodiment.

[0057] As described in step S110, each LED individual 100 of each color is packaged to obtain an LED packaging module 20 of the corresponding color; wherein, the LED packaging module 20 includes LED chips 110 arranged in a preset array, the LED chips 110 in the same row are connected to each other, and the LED chips 110 in the same column are connected to each other.

[0058] The LED chips 110 of the same color are arranged in the preset array, and the LED chips 110 in the same row are connected to each other by additive manufacturing (AM), and the LED chips 110 in the same column are connected to each other by additive manufacturing. Each LED chip 110 is then encapsulated with potting resin to obtain the LED package module 20 of the corresponding color.

[0059] It should be noted that additive manufacturing, also known as 3D printing, is a manufacturing technology that uses digital model files as a basis and employs software and CNC systems to deposit specialized metallic, non-metallic, or medical / biological materials layer by layer through methods such as extrusion, sintering, melting, photopolymerization, and spraying to create physical objects. Specifically, the additive manufacturing methods involved in this application can be one or more of chemical vapor deposition, physical vapor deposition, atomic layer deposition, sputtering, evaporation, electroplating, and electroless plating.

[0060] As described in step S120, the LED packaging module 20 of the first color and the LED packaging modules 20 of the other colors are stacked sequentially to obtain a stacked packaging module.

[0061] The LED packaging module 20 of the first color and the LED packaging modules 20 of the other colors are stacked and connected to each other in sequence, so that the LED chips 110 in each LED packaging module 20 are positioned in the height direction of the LED packaging module 20, thus obtaining the stacked packaging module.

[0062] In one embodiment of this application, the specific process of "encapsulating the LED individual units 100 of each color to obtain the corresponding LED package module 20" can be further described in conjunction with the following description.

[0063] The LED chips 110 of the same color are arranged in the preset array.

[0064] The first electrodes of the LED chips 110 in the same row are interconnected to form lateral interconnection paths 111 by additive manufacturing. Specifically, the lateral interconnection paths 111 are fabricated on the surface of the LED chips 110 in the same row by additive manufacturing, thereby interconnecting the first electrodes of the LED chips 110 in the same row. When the LED chip 110 is a first color LED chip 110, the lateral interconnection path 111 can be made of a colored conductive material; when the LED chip 110 is a LED chip of other colors, the lateral interconnection path 111 is made of a transparent conductive material.

[0065] The second electrodes of the LED chips 110 in the same row are interconnected to form a vertical interconnection path 112 by additive manufacturing. Specifically, the vertical interconnection path 112 is fabricated on the surface of the LED chips 110 in the same row by additive manufacturing, so that the second electrodes of the LED chips 110 in the same row are interconnected. When the LED chip 110 is an LED chip of a first light color and the vertical interconnection path 112 is located on different sides of the horizontal interconnection path 111, the vertical interconnection path 112 is made of a transparent conductive material; when the LED chip 110 is an LED chip of another light color, the vertical interconnection path 112 is made of a transparent conductive material.

[0066] Each of the LED chips 110 is potted and encapsulated to obtain the LED encapsulation module 20 with the corresponding light color. Specifically, each of the LED chips 110 is potted and encapsulated so that the light emitted by the LED chips 110 can be emitted along the height direction of the LED encapsulation module 20 to obtain the LED encapsulation module 20 with the corresponding light color.

[0067] In one embodiment of this application, the specific process of "arranging the LED chips 110 of the same color according to the preset array" can be further explained in conjunction with the following description.

[0068] The LEDs 100 of the same color are arranged in the preset array. Specifically, the LEDs 100 of the same color are placed on the surface of the first carrier plate 30, with the LED chips 110 facing upwards. The LEDs 100 are arranged in the preset array, and a protective adhesive layer 210 is laid on the surface of each LED 100. The LEDs 100 and the protective adhesive layer 210 are then flipped onto the surface of the second carrier plate 40, and the first carrier plate 30 is removed. The first carrier plate 30 can be tape, PE (Polyethylene) film, glass plate, or other flat support structure. The second carrier plate 40 can be tape, PE film, glass plate, or other flat support structure. The protective adhesive layer 210 has good insulation and sealing properties, providing protection and preventing the product from getting damp.

[0069] or;

[0070] The LEDs 100 of the same color are arranged in the preset array. Specifically, the LEDs 100 of the same color are placed on the surface of the first carrier plate 30, with the LED chips facing upwards. The LEDs 100 are arranged in the preset array, and a protective adhesive layer 210 is laid on the surface of each LED 100. The LEDs 100 and the protective adhesive layer 210 are then flipped onto the surface of the second carrier plate 40, and the first carrier plate 30 is removed. The first carrier plate 30 can be tape, PE film, glass plate, or other flat support structure. The second carrier plate 40 can be tape, PE film, glass plate, or other flat support structure. The protective adhesive layer 210 has good insulation and sealing properties, providing protection and preventing the product from getting damp.

[0071] When the LED chip 100 is the LED chip of the first light color, the light-shielding substrate 120 is removed to form a thin film chip. Specifically, when the LED chip 100 is the LED chip of the first light color, at least one of the following methods is used: chemical etching, laser ablation, or physical polishing, to remove each of the light-shielding substrates 120, leaving each of the LED chips 110 and the protective adhesive layer 210 with the same height as the top of the LED chip 110.

[0072] When the LED chip 100 is of a different color, the transparent substrate 130 is removed to form a thin film chip. Specifically, when the LED chip 100 is of a different color, at least one of the following methods is used: chemical etching, laser ablation, or physical polishing, to remove each transparent substrate 130, leaving each LED chip 110 and the protective adhesive layer 210 with the same height as the top of the LED chip 110.

[0073] In the embodiments of this application, the option of retaining the substrate or removing the substrate can be selected as needed. If the option of removing the substrate is selected, the light-shielding substrate 120 or the transparent substrate 130 is peeled off to form a thin film chip, which can improve the light extraction efficiency and reduce the thickness of the finished product.

[0074] In one embodiment of this application, the specific process of "interconnecting the first electrodes of the LED chips 110 in the same row to form a lateral interconnection path 111 by additive manufacturing" can be further described in conjunction with the following description.

[0075] The first electrodes of the LED chips 110 in the same row are interconnected on the first surface of the LED chips 110 by additive manufacturing to form the lateral interconnection path 111. Specifically, the horizontally extending lateral interconnection path 111 is prepared on the surface of the LED chips 110 in the same row by additive manufacturing, so that the first electrodes of the LED chips 110 in the same row are interconnected.

[0076] In one embodiment of this application, the specific process of "connecting the first electrodes of the LED chips 110 in the same row to each other on the first surface of the LED chips 110 to form the lateral interconnection path 111 by means of additive manufacturing" can be further described in conjunction with the following description.

[0077] A photosensitive material is coated on the first surface of each LED chip 110 and the protective adhesive layer 210, and then exposed and developed to expose several rows of first target areas on the surface of each LED chip 110 and the protective adhesive layer 210; wherein each row of the first target areas is connected to a first electrode of each row of LED chips 110. Specifically, a photosensitive material is coated on the first surface of each LED chip 110 and the protective adhesive layer 210, and then exposed and developed to solidify the photosensitive material that has undergone photopolymerization to form a first photosensitive material layer, and the photosensitive material that has not undergone photopolymerization (i.e., the photosensitive material on the surface of the first target area) is washed away. The photosensitive material includes one or more of the following: photoresist (including positive photoresist and negative photoresist), photosensitive polyimide resin, photosensitive sol-gel or mixtures or compositions thereof, and a mixed solution of PhTES, N-methyl-2-pyrrolidone and polymethyl methacrylate, which has good photosensitivity.

[0078] The lateral interconnect pathway 111 is fabricated on the surface of the first target region using additive manufacturing. Specifically, the horizontally extending lateral interconnect pathway 111 is fabricated on the surface of the first target region using additive manufacturing.

[0079] Remove the photosensitive material. Specifically, remove the first photosensitive material layer using an adhesive remover.

[0080] In one embodiment of this application, the specific process of "interconnecting the second electrodes of the LED chips 110 in the same column to form a vertical interconnection path 112 by additive manufacturing" can be further described in conjunction with the following description.

[0081] The second electrodes of the LED chips 110 in the same column are interconnected on the first surface of the LED chips 110 by additive manufacturing to form the vertical interconnection path 112. Specifically, on the first surface of the LED chips 110, a vertically extending first sub-path is prepared on the surface of each LED chip 110 by additive manufacturing, and a horizontally extending second sub-path is prepared on the surface of the first sub-path in the same column by additive manufacturing to form the vertical interconnection path 112, so that the second electrodes of the LED chips 110 in the same column are interconnected.

[0082] or;

[0083] The second electrodes of the LED chips 110 in the same row are interconnected on the second surface of the LED chips 110 using additive manufacturing to form the vertical interconnection path 112. Specifically, each LED chip 110 and the protective adhesive layer 210 are flipped onto the surface of the third carrier plate 50, and the second carrier plate 40 is removed. The process involves grinding to expose each LED chip 110, and horizontally extending vertical interconnection paths 112 are fabricated on the second surface of the LED chips 110 in the same row using additive manufacturing, thereby interconnecting the second electrodes of the LED chips 110 in the same row. The third carrier plate 50 can be adhesive tape, PE film, glass plate, or other flat support structures.

[0084] In one embodiment of this application, the specific process of "connecting the second electrodes of the LED chips 110 in the same column to each other on the first surface of the LED chips 110 to form the vertical interconnection path 112 by means of additive manufacturing" can be further described in conjunction with the following description.

[0085] A transparent filler layer is laid on the first surface of each of the LED chips 110 and the protective adhesive layer 210;

[0086] A photosensitive material is coated onto the surface of the transparent filler layer, and then exposed and developed to expose a first target portion inside the transparent filler layer; wherein, the first target portion is a longitudinally extending columnar structure corresponding to the second electrode of each of the LED chips 110. Specifically, a photosensitive material is coated onto the surface of the transparent filler layer, and then exposed and developed, so that the photosensitive material that undergoes a photopolymerization reaction solidifies to form a second photosensitive material layer, and the photosensitive material that has not undergone a photopolymerization reaction (i.e., the photosensitive material on the surface of the first target portion) is washed away.

[0087] The first target area is etched away to form an extended through-hole. Specifically, the first target area is etched away by rapid chemical etching to form the extended through-hole. Different etching solutions can be selected according to the material of the transparent filler layer. The product is immersed in the etching solution, and the etching is observed. Once the first target area is etched away, it is immediately removed and washed with clean water to remove the etching solution.

[0088] A first sub-passage is fabricated along the interior of the extended through-hole using additive manufacturing. Specifically, a longitudinally extending first sub-passage is fabricated along the interior of the extended through-hole using additive manufacturing.

[0089] Remove the photosensitive material. Specifically, remove the second photosensitive material layer using a remover.

[0090] A photosensitive material is coated on the surface of each of the first sub-channels and the second photosensitive material layer, and then exposed and developed to expose several columns of second target areas on the surface of each of the first sub-channels and the transparent filler layer; wherein each column of second target areas corresponds one-to-one with each column of first sub-channels. Specifically, a photosensitive material is coated on the surface of each of the first sub-channels and the second photosensitive material layer, and then exposed and developed to solidify the photosensitive material that has undergone photopolymerization to form a third photosensitive material layer, and the photosensitive material that has not undergone photopolymerization (i.e., the photosensitive material on the surface of the second target area) is washed away.

[0091] A second sub-channel is fabricated on the surface of the second target region using additive manufacturing. Specifically, a horizontally extending second sub-channel is fabricated on the surface of the second target region using additive manufacturing.

[0092] Remove the photosensitive material. Specifically, remove the third photosensitive material layer using a remover.

[0093] In one embodiment of this application, the specific process of "connecting the second electrodes of the LED chips 110 in the same column to each other on the second surface of the LED chips 110 to form the vertical interconnection path 112 by means of additive manufacturing" can be further described in conjunction with the following description.

[0094] A photosensitive material is coated on the second surface of each LED chip 110 and the protective adhesive layer 210, and then exposed and developed to expose several columns of third target regions on the surface of each LED chip 110 and the protective adhesive layer 210; wherein each column of the third target regions is connected to a corresponding second electrode of each column of LED chips 110. Specifically, a photosensitive material is coated on the second surface of each LED chip 110 and the protective adhesive layer 210, and then exposed and developed to solidify the photosensitive material that has undergone photopolymerization to form a fourth photosensitive material layer, and the photosensitive material that has not undergone photopolymerization (i.e., the photosensitive material on the surface of the third target region) is washed away.

[0095] The longitudinal interconnect pathway 112 is fabricated on the surface of the third target region using additive manufacturing. Specifically, the horizontally extending longitudinal interconnect pathway 112 is fabricated on the surface of the third target region using additive manufacturing.

[0096] Remove the photosensitive material. Specifically, remove the fourth photosensitive material layer using a remover.

[0097] In one embodiment of this application, the specific process of "encapsulating each of the LED chips 110 with potting compound" can be further described in conjunction with the following description.

[0098] A light-shielding adhesive layer 220 is laid on the surface of each LED chip 110; wherein, the interior of the light-shielding adhesive layer 220 has longitudinally extending light-transmitting holes corresponding to each LED chip 110. Specifically, the light-shielding adhesive layer 220 is poured onto the surface of each LED chip 110 and the protective adhesive layer 210, the top of the light-shielding adhesive layer 220 extends above the top of each LED chip 110, and the interior of the light-shielding adhesive layer 220 forms longitudinally extending light-transmitting holes corresponding to each LED chip 110. The light-shielding adhesive layer 220 has good light-shielding performance and can prevent the light emitted by the LED chip 110 from passing through.

[0099] A transparent adhesive layer 230 is laid inside the light-transmitting hole. The transparent adhesive layer 230 has good light transmission properties, allowing the light emitted by the LED chip 110 to pass through.

[0100] In one embodiment of this application, the specific process of "laying a light-shielding adhesive layer 220 on the surface of each of the LED chips 110" can be further described in conjunction with the following description.

[0101] An initial light-shielding adhesive layer 220 is laid on the surface of each of the LED chips 110;

[0102] The second target portion inside the initial light-shielding adhesive layer 220 is etched away to form the light-shielding adhesive layer 220; wherein, the second target portion is a longitudinally extending columnar structure corresponding to each of the LED chips 110. Specifically, an etching window is formed by coating a photosensitive material and exposing and developing it, which facilitates the etching away of the second target portion.

[0103] In one embodiment of this application, the specific process of "etching away the second target portion inside the initial light-shielding adhesive layer 220 to form the light-shielding adhesive layer 220" can be further described in conjunction with the following description.

[0104] A photosensitive material is coated onto the surface of the initial light-shielding adhesive layer 220, and then exposed and developed to expose the second target portion of the initial light-shielding adhesive layer 220. Specifically, the photosensitive material is coated onto the surface of the initial light-shielding adhesive layer 220, and then exposed and developed, causing the photosensitive material that has undergone a photopolymerization reaction to solidify and form a fifth photosensitive material layer, while the photosensitive material that has not undergone a photopolymerization reaction (i.e., the photosensitive material on the surface of the second target portion) is washed away.

[0105] The second target area is etched away to form the light-shielding adhesive layer 220. Specifically, the second target area is etched away by rapid chemical etching. Different etching solutions can be selected according to the material of the initial light-shielding adhesive layer 220. The product is immersed in the etching solution, and the etching is observed. Once the second target area is etched away, it is immediately removed and washed with clean water to remove the etching solution.

[0106] The photosensitive material is removed. Specifically, the fifth photosensitive material layer is removed using a remover.

[0107] In one embodiment of this application, the specific process of "encapsulating each of the LED chips 110 with potting compound" can be further described in conjunction with the following description.

[0108] A semi-reflective film layer 240 is laid on the surface of the light-shielding adhesive layer 220 and the transparent adhesive layer 230. The semi-reflective film layer 240 is a one-way transparent anti-reflective film, which allows the light emitted by the LED chip 110 to pass through without being reflected back.

[0109] Reference Figure 2-5In a specific implementation of this application, the LED unit 100 includes 8*8 red LED units 100(R), 8*8 green LED units 100(G), and 8*8 blue LED units 100(B). The red LED unit 100(R) includes a light-shielding substrate 120 and a red LED chip 110(R) disposed on the surface of the light-shielding substrate 120. The green LED unit 100(G) includes a transparent substrate 130(G) and a green LED chip 110(G) disposed on the surface of the transparent substrate 130(G). The blue LED unit 100(B) includes a transparent substrate 130(B) and a blue LED chip 110(B) disposed on the surface of the transparent substrate 130(B). The stacked packaging method includes:

[0110] Each of the red LED units 100(R) is placed on the surface of the first carrier plate 30, with the red LED chip 110(R) facing upwards;

[0111] Each of the red LED units 100(R) is arranged in a preset array;

[0112] A first protective adhesive layer 210(R) is laid on the surface of each of the red LED units 100(R);

[0113] Each of the red LED units 100(R) and the first protective adhesive layer 210(R) are flipped onto the surface of the second carrier plate 40, and the first carrier plate 30 is removed.

[0114] The light-shielding substrate 120 is removed by grinding;

[0115] The first electrodes of the red LED chips 110(R) in the same row are interconnected on the first surface of the red LED chips 110(R) to form a first lateral interconnection path 111(R);

[0116] Each of the red LED chips 110(R) and the first protective adhesive layer 210(R) are flipped onto the surface of the third carrier board 50, and the second carrier board 40 is removed;

[0117] The red LED chips 110(R) are exposed by grinding;

[0118] The second electrodes of the red LED chips 110(R) in the same column are interconnected on the second surface of the red LED chips 110(R) to form a first vertical interconnection path 112(R);

[0119] A first light-shielding adhesive layer 220(R) is laid on the surface of each of the red LED chips 110(R) and the first protective adhesive layer 210(R); wherein, the interior of the first light-shielding adhesive layer 220(R) is provided with a first light-transmitting through hole extending longitudinally corresponding to each of the red LED chips 110(R);

[0120] A first transparent adhesive layer 230(R) is laid inside the first light-transmitting hole;

[0121] A first semi-reflective film layer 240(R) is laid on the surface of the first light-shielding adhesive layer 220(R) and the first transparent adhesive layer 230(R) to obtain a red LED packaging module 20(R);

[0122] Each of the green LED units 100(G) is placed on the surface of the first carrier plate 30, with the green LED chip 110(G) facing upwards;

[0123] Each of the green LED units 100(G) is arranged according to the preset array;

[0124] A second protective adhesive layer 210(G) is laid on the surface of each of the green LED units 100(G);

[0125] Each of the green LED monomers 100(G) and the second protective adhesive layer 210(G) are flipped onto the surface of the second carrier plate 40, and the first carrier plate 30 is removed;

[0126] The transparent substrate 130(G) is removed by grinding;

[0127] The first electrodes of the green LED chips 110(G) in the same row are interconnected on the first surface of the green LED chips 110(G) to form a second lateral interconnection path 111(G);

[0128] Each of the green LED chips 110(G) and the second protective adhesive layer 210(G) are flipped onto the surface of the third carrier 50, and the second carrier 40 is removed;

[0129] Each of the green LED chips 110(G) is exposed by grinding;

[0130] The second electrodes of the green LED chips 110(G) in the same column are interconnected on the second surface of the green LED chips 110(G) to form a second vertical interconnection path 112(G);

[0131] A second light-shielding adhesive layer 220(G) is laid on the surface of each of the green LED chips 110(G) and the second protective adhesive layer 210(G); wherein, the interior of the second light-shielding adhesive layer 220(G) is provided with a second light-transmitting through hole extending longitudinally corresponding to each of the green LED chips 110(G);

[0132] A second transparent adhesive layer 230(G) is laid inside the second light-transmitting hole;

[0133] A second semi-reflective film layer 240(G) is deposited on the surface of the second light-shielding adhesive layer 220(G) and the second transparent adhesive layer 230(G) to obtain a green LED encapsulation module 20(G);

[0134] Each of the blue LED units 100(B) is placed on the surface of the first carrier plate 30, with the blue LED chip 110(B) facing upwards;

[0135] Each of the blue LED units 100(B) is arranged according to the preset array;

[0136] A third protective adhesive layer 210(B) is laid on the surface of each of the blue LED units 100(B);

[0137] Each of the blue LED units 100(B) and the third protective adhesive layer 210(B) are flipped onto the surface of the second carrier plate 40, and the first carrier plate 30 is removed.

[0138] The transparent substrate 130(B) is removed by grinding;

[0139] The first electrodes of the blue LED chips 110(B) in the same row are interconnected on the first surface of the blue LED chips 110(B) to form a third lateral interconnection path 111(B).

[0140] Each of the blue LED chips 110(B) and the third protective adhesive layer 210(B) are flipped onto the surface of the third carrier board 50, and the second carrier board 40 is removed;

[0141] Each of the blue LED chips 110(B) is exposed by grinding;

[0142] The second electrodes of the blue LED chips 110(B) in the same column are interconnected on the second surface of the blue LED chips 110(B) to form a third vertical interconnection path 112(B);

[0143] A third light-shielding adhesive layer 220(B) is laid on the surface of each of the blue LED chips 110(B) and the third protective adhesive layer 210(B); wherein, the interior of the third light-shielding adhesive layer 220(B) is provided with a third light-transmitting through hole extending longitudinally corresponding to each of the blue LED chips 110(B);

[0144] A third transparent adhesive layer 230(B) is laid inside the third light-transmitting hole;

[0145] A third semi-reflective film layer 240(B) is laid on the surface of the third light-shielding adhesive layer 220(B) and the third transparent adhesive layer 230(B) to obtain a blue LED packaging module 20(B);

[0146] The red LED packaging module 20(R), the green LED packaging module 20(G), and the blue LED packaging module 20(B) are stacked sequentially to obtain a stacked packaging module.

[0147] Reference Figure 6-9 In another specific implementation of this application, the LED unit 100 includes 8*8 red LED units 100(R), 8*8 green LED units 100(G), and 8*8 blue LED units 100(B). The red LED unit 100(R) includes a light-shielding substrate 120 and a red LED chip 110(R) disposed on the surface of the light-shielding substrate 120. The green LED unit 100(G) includes a transparent substrate 130(G) and a green LED chip 110(G) disposed on the surface of the transparent substrate 130(G). The blue LED unit 100(B) includes a transparent substrate 130(B) and a blue LED chip 110(B) disposed on the surface of the transparent substrate 130(B). The stacked packaging method includes:

[0148] Each of the red LED units 100(R) is placed on the surface of the first carrier plate 30, with the red LED chip 110(R) facing upwards;

[0149] Each of the red LED units 100(R) is arranged in a preset array;

[0150] A first protective adhesive layer 210(R) is laid on the surface of each of the red LED units 100(R);

[0151] Each of the red LED units 100(R) and the first protective adhesive layer 210(R) are flipped onto the surface of the second carrier plate 40, and the first carrier plate 30 is removed.

[0152] The first electrodes of the red LED chips 110(R) in the same row are interconnected on the first surface of the red LED chips 110(R) to form a first lateral interconnection path 111(R);

[0153] Each of the red LED chips 110(R) and the first protective adhesive layer 210(R) are flipped onto the surface of the third carrier board 50, and the second carrier board 40 is removed;

[0154] The red LED chips 110(R) are exposed by grinding;

[0155] The second electrodes of the red LED chips 110(R) in the same column are interconnected on the second surface of the red LED chips 110(R) to form a first vertical interconnection path 112(R);

[0156] A first light-shielding adhesive layer 220(R) is laid on the surface of each of the red LED chips 110(R) and the first protective adhesive layer 210(R); wherein, the interior of the first light-shielding adhesive layer 220(R) is provided with a first light-transmitting through hole extending longitudinally corresponding to each of the red LED chips 110(R);

[0157] A first transparent adhesive layer 230(R) is laid inside the first light-transmitting through hole to obtain a red LED packaging module 20(R);

[0158] Each of the green LED units 100(G) is placed on the surface of the first carrier plate 30, with the green LED chip 110(G) facing upwards;

[0159] Each of the green LED units 100(G) is arranged according to the preset array;

[0160] A second protective adhesive layer 210(G) is laid on the surface of each of the green LED units 100(G);

[0161] Each of the green LED monomers 100(G) and the second protective adhesive layer 210(G) are flipped onto the surface of the second carrier plate 40, and the first carrier plate 30 is removed;

[0162] The transparent substrate 130(G) is removed by grinding;

[0163] The first electrodes of the green LED chips 110(G) in the same row are interconnected on the first surface of the green LED chips 110(G) to form a second lateral interconnection path 111(G);

[0164] Each of the green LED chips 110(G) and the second protective adhesive layer 210(G) are flipped onto the surface of the third carrier 50, and the second carrier 40 is removed;

[0165] Each of the green LED chips 110(G) is exposed by grinding;

[0166] The second electrodes of the green LED chips 110(G) in the same column are interconnected on the second surface of the green LED chips 110(G) to form a second vertical interconnection path 112(G);

[0167] A second light-shielding adhesive layer 220(G) is laid on the surface of each of the green LED chips 110(G) and the second protective adhesive layer 210(G); wherein, the interior of the second light-shielding adhesive layer 220(G) is provided with a second light-transmitting through hole extending longitudinally corresponding to each of the green LED chips 110(G);

[0168] A second transparent adhesive layer 230(G) is laid inside the second light-transmitting hole;

[0169] A second semi-reflective film layer 240(G) is deposited on the surface of the second light-shielding adhesive layer 220(G) and the second transparent adhesive layer 230(G) to obtain a green LED encapsulation module 20(G);

[0170] Each of the blue LED units 100(B) is placed on the surface of the first carrier plate 30, with the blue LED chip 110(B) facing upwards;

[0171] Each of the blue LED units 100(B) is arranged according to the preset array;

[0172] A third protective adhesive layer 210(B) is laid on the surface of each of the blue LED units 100(B);

[0173] Each of the blue LED units 100(B) and the third protective adhesive layer 210(B) are flipped onto the surface of the second carrier plate 40, and the first carrier plate 30 is removed.

[0174] The transparent substrate 130(B) is removed by grinding;

[0175] The first electrodes of the blue LED chips 110(B) in the same row are interconnected on the first surface of the blue LED chips 110(B) to form a third lateral interconnection path 111(B).

[0176] Each of the blue LED chips 110(B) and the third protective adhesive layer 210(B) are flipped onto the surface of the third carrier board 50, and the second carrier board 40 is removed;

[0177] Each of the blue LED chips 110(B) is exposed by grinding;

[0178] The second electrodes of the blue LED chips 110(B) in the same column are interconnected on the second surface of the blue LED chips 110(B) to form a third vertical interconnection path 112(B);

[0179] A third light-shielding adhesive layer 220(B) is laid on the surface of each of the blue LED chips 110(B) and the third protective adhesive layer 210(B); wherein, the interior of the third light-shielding adhesive layer 220(B) is provided with a third light-transmitting through hole extending longitudinally corresponding to each of the blue LED chips 110(B);

[0180] A third transparent adhesive layer 230(B) is laid inside the third light-transmitting hole;

[0181] A third semi-reflective film layer 240(B) is laid on the surface of the third light-shielding adhesive layer 220(B) and the third transparent adhesive layer 230(B) to obtain a blue LED packaging module 20(B);

[0182] The red LED packaging module 20(R), the green LED packaging module 20(G), and the blue LED packaging module 20(B) are stacked sequentially to obtain a stacked packaging module.

[0183] Reference Figure 10-13 In another specific implementation of this application, the LED unit 100 includes 8*8 red LED units 100(R), 8*8 green LED units 100(G), and 8*8 blue LED units 100(B). The red LED unit 100(R) includes a light-shielding substrate 120 and a red LED chip 110(R) disposed on the surface of the light-shielding substrate 120. The green LED unit 100(G) includes a transparent substrate 130(G) and a green LED chip 110(G) disposed on the surface of the transparent substrate 130(G). The blue LED unit 100(B) includes a transparent substrate 130(B) and a blue LED chip 110(B) disposed on the surface of the transparent substrate 130(B). The stacked packaging method includes:

[0184] Each of the red LED units 100(R) is placed on the surface of the first carrier plate 30, with the red LED chip 110(R) facing upwards;

[0185] Each of the red LED units 100(R) is arranged in a preset array;

[0186] A first protective adhesive layer 210(R) is laid on the surface of each of the red LED units 100(R);

[0187] Each of the red LED units 100(R) and the first protective adhesive layer 210(R) are flipped onto the surface of the second carrier plate 40, and the first carrier plate 30 is removed.

[0188] The first electrodes of the red LED chips 110(R) in the same row are interconnected on the first surface of the red LED chips 110(R) to form a first lateral interconnection path 111(R);

[0189] Each of the red LED chips 110(R) and the first protective adhesive layer 210(R) are flipped onto the surface of the third carrier board 50, and the second carrier board 40 is removed;

[0190] The red LED chips 110(R) are exposed by grinding;

[0191] The second electrodes of the red LED chips 110(R) in the same column are interconnected on the second surface of the red LED chips 110(R) to form a first vertical interconnection path 112(R);

[0192] A first light-shielding adhesive layer 220(R) is laid on the surface of each of the red LED chips 110(R) and the first protective adhesive layer 210(R); wherein, the interior of the first light-shielding adhesive layer 220(R) is provided with a first light-transmitting through hole extending longitudinally corresponding to each of the red LED chips 110(R);

[0193] A first transparent adhesive layer 230(R) is laid inside the first light-transmitting through hole to obtain a red LED packaging module 20(R);

[0194] Each of the green LED units 100(G) is placed on the surface of the first carrier plate 30, with the green LED chip 110(G) facing upwards;

[0195] Each of the green LED units 100(G) is arranged according to the preset array;

[0196] A second protective adhesive layer 210(G) is laid on the surface of each of the green LED units 100(G);

[0197] Each of the green LED monomers 100(G) and the second protective adhesive layer 210(G) are flipped onto the surface of the second carrier plate 40, and the first carrier plate 30 is removed;

[0198] The first electrodes of the green LED chips 110(G) in the same row are interconnected on the first surface of the green LED chips 110(G) to form a second lateral interconnection path 111(G);

[0199] The second electrodes of the green LED chips 110(G) in the same column are interconnected on the first surface of the green LED chips 110(G) to form a second vertical interconnection path 112(G);

[0200] A second light-shielding adhesive layer 220(G) is laid on the surface of each of the green LED chips 110(G) and the second protective adhesive layer 210(G); wherein, the interior of the second light-shielding adhesive layer 220(G) is provided with a second light-transmitting through hole extending longitudinally corresponding to each of the green LED chips 110(G);

[0201] A second transparent adhesive layer 230(G) is laid inside the second light-transmitting through hole to obtain a green LED packaging module 20(G);

[0202] Each of the blue LED units 100(B) is placed on the surface of the first carrier plate 30, with the blue LED chip 110(B) facing upwards;

[0203] Each of the blue LED units 100(B) is arranged according to the preset array;

[0204] A third protective adhesive layer 210(B) is laid on the surface of each of the blue LED units 100(B);

[0205] Each of the blue LED units 100(B) and the third protective adhesive layer 210(B) are flipped onto the surface of the second carrier plate 40, and the first carrier plate 30 is removed.

[0206] The first electrodes of the blue LED chips 110(B) in the same row are interconnected on the first surface of the blue LED chips 110(B) to form a third lateral interconnection path 111(B).

[0207] The second electrodes of the blue LED chips 110(B) in the same column are interconnected on the first surface of the blue LED chips 110(B) to form a third vertical interconnection path 112(B);

[0208] A third light-shielding adhesive layer 220(B) is laid on the surface of each of the blue LED chips 110(B) and the third protective adhesive layer 210(B); wherein, the interior of the third light-shielding adhesive layer 220(B) is provided with a third light-transmitting through hole extending longitudinally corresponding to each of the blue LED chips 110(B);

[0209] A third transparent adhesive layer 230(B) is laid inside the third light-transmitting hole to obtain a blue LED packaging module 20(B);

[0210] The red LED packaging module 20(R), the green LED packaging module 20(G), and the blue LED packaging module 20(B) are stacked sequentially to obtain a stacked packaging module.

[0211] Reference Figure 8 This illustration shows a stacked packaging module prepared according to the stacked packaging method described in the above embodiment, comprising: an LED packaging module 20 of a first color and LED packaging modules 20 of other colors; the LED packaging module 20 of the first color and the LED packaging modules 20 of other colors are stacked sequentially. In the stacked packaging module, the LED chips 110 of different colors emit light in the same direction, resulting in good light mixing effect.

[0212] Although preferred embodiments of the present application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of the present application.

[0213] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0214] The above provides a detailed description of a passive LED module stacking packaging method and a stacking packaging module provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A method for stacking and packaging passive LED modules, used to package LED units of at least two light colors, wherein, The LED unit of the first light color includes a light-shielding substrate and an LED chip of the first light color disposed on the surface of the light-shielding substrate; the LED units of the other light colors each include a transparent substrate and an LED chip of the corresponding light color disposed on the surface of the transparent substrate; characterized in that it includes: Each LED individual of a different color is packaged to obtain an LED packaging module of the corresponding color; wherein, the LED packaging module includes LED chips arranged in a preset array, the LED chips in the same row are connected to each other by additive manufacturing, and the LED chips in the same column are connected to each other by additive manufacturing. The LED packaging module of the first color and the LED packaging modules of the other colors are stacked sequentially to obtain a stacked packaging module.

2. The stacked packaging method according to claim 1, characterized in that, The step of encapsulating the individual LEDs of each color to obtain LED package modules of the corresponding colors includes: The LED chips of the same color are arranged in the preset array; The first electrodes of the LED chips in the same row are interconnected to form a lateral interconnection path by additive manufacturing. The second electrodes of the LED chips in the same column are interconnected to form a vertical interconnection path by additive manufacturing. Each LED chip is potted and encapsulated to obtain the LED package module with the corresponding light color.

3. The stacked packaging method according to claim 2, characterized in that, The step of arranging the LED chips of the same color according to the preset array includes: The LEDs of the same color are arranged in the preset array; or; The LEDs of the same color are arranged in the preset array; When the LED unit is the LED unit of the first light color, the light-shielding substrate is removed to form a thin film chip; When the LED unit is of another color, the transparent substrate is removed to form a thin film chip.

4. The stacked packaging method according to claim 2, characterized in that, The step of interconnecting the first electrodes of the LED chips in the same row to form a lateral interconnection path by additive manufacturing includes: The first electrodes of the LED chips in the same row are interconnected on the first surface of the LED chips to form the lateral interconnection path by means of additive manufacturing.

5. The stacked packaging method according to claim 4, characterized in that, The step of interconnecting the second electrodes of the LED chips in the same column to form a vertical interconnection path by additive manufacturing includes: The second electrodes of the LED chips in the same column are interconnected on the first surface of the LED chips to form the vertical interconnection path by means of additive manufacturing. or; The second electrodes of the LED chips in the same row are interconnected on the second surface of the LED chips by additive manufacturing to form the vertical interconnection path.

6. The stacked packaging method according to claim 2, characterized in that, The step of potting and encapsulating each of the LED chips includes: A light-shielding adhesive layer is laid on the surface of each LED chip; wherein, the light-shielding adhesive layer has a longitudinally extending light-transmitting hole corresponding to each LED chip; A transparent adhesive layer is laid inside the light-transmitting hole.

7. The stacked packaging method according to claim 6, characterized in that, The step of potting and encapsulating each of the LED chips further includes: A semi-reflective film layer is laid on the surface of the light-shielding adhesive layer and the transparent adhesive layer.

8. The stacked packaging method according to claim 2, characterized in that, The additive manufacturing methods include one or more of chemical vapor deposition, physical vapor deposition, atomic layer deposition, sputtering, evaporation, electroplating, and electroless plating.

9. A stacked packaging module prepared by the stacked packaging method according to any one of claims 1-8, characterized in that, include: The LED packaging module of the first light color and the LED packaging modules of the other light colors; The LED packaging module of the first color and the LED packaging modules of the other colors are stacked sequentially.

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