Display device

Abstract

A display device according to an exemplary embodiment of the disclosure includes a main FPCB including a plurality of LEDs in a block unit on one surface and a connector connected to the LEDs on another surface, a sub FPCB connected to the connector of the main FPCB, and a bottom cover in which the main FPCB is disposed and the sub FPCB is connected to the outside through an opening area. In each block, the plurality of LEDs are disposed in series through a plurality of first connection electrodes and a plurality of second connection electrodes. Also, a first through-hole and a second through-hole are disposed within the block, and one end of the first connection electrode and one end of the second connection electrode are exposed through the first through-hole and the second through-hole. Accordingly, a wiring area and a bezel area can be reduced.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2021-0136728, filed on October 14, 2021, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference. Technical Field

[0003] This disclosure relates to a display device, and more specifically, to a light-emitting diode (LED) display device having a reduced bezel size. Background Technology

[0004] Liquid crystal display (LCD) devices and organic light-emitting diode (OLED) devices, which are already widely used, are being applied more and more.

[0005] LCD and OLED devices offer advantages such as high screen resolution, thinness, and light weight. Therefore, they are widely used in the screens of everyday electronic devices such as mobile phones and laptops, and their applications are continuously expanding.

[0006] However, in both LCD and OLED devices, there may be limitations in reducing the size of the bezel area visible to the user but not displaying images. For example, in LCD devices, sealants are needed to seal the liquid crystal and bond the upper and lower substrates. Therefore, there are limitations in reducing the size of the bezel area. Furthermore, in OLED devices, organic light-emitting diodes (OLEDs) are made of organic materials, making them susceptible to moisture and oxygen. Therefore, encapsulation units are needed to protect the OLEDs, further limiting the reduction of the bezel area. In particular, ultra-large screens cannot be achieved with a single panel. Therefore, when achieving ultra-large screens by stacking multiple liquid crystal display panels or multiple OLED panels, the user can see the bezel area between adjacent panels.

[0007] As an alternative, a light-emitting diode (LED) display device incorporating LEDs has been proposed. Because LEDs are made of inorganic rather than organic materials, they offer superior reliability and a longer lifespan compared to LCD or OLED devices. Furthermore, LEDs are suitable for ultra-large screens due to their high light emission speed, low power consumption, and strong shock resistance, resulting in excellent stability and the ability to display high-brightness images. Summary of the Invention

[0008] LED display devices can include micro LED display devices or mini LED display devices depending on the size of the LEDs.

[0009] In LED display devices, LEDs are designed for each block as the smallest unit of a series configuration to reduce the bezel area and the area of ​​film-on-film (FOF) bonding pads. However, to reduce the FOF bonding pad area, the order of the pads may be changed and the number of layers may be increased, depending on the via avoidance design.

[0010] Therefore, the inventors have invented an LED display device in which a novel block structure reduces the FOF bonding pad area without requiring via avoidance design and without increasing the number of layers, thereby minimizing or reducing the bezel area.

[0011] In addition, the inventors have invented an LED display device in which sensor units are arranged between LEDs to reduce the space occupied by the sensor units and enable additional functions, such as skin care or disinfection.

[0012] The technical advantages of this disclosure are not limited to those described above, and those skilled in the art can clearly understand other advantages not mentioned above through the following description.

[0013] According to one embodiment of this disclosure, a display device includes: a main flexible printed circuit board (FPCB) including a plurality of light-emitting diodes (LEDs) arranged in a block unit on one surface and connectors connected to the plurality of LEDs on another surface. The display device also includes a sub-FPCB, a connector connected to the main FPCB, and a bottom cover, in which the main FPCB is disposed, and the sub-FPCB is connected to the outside through an opening area. In each block, the LEDs are arranged in series via a plurality of first connecting electrodes and a plurality of second connecting electrodes. Furthermore, a first through-hole and a second through-hole are disposed within the blocks, through which one end of the first connecting electrode and one end of the second connecting electrode are exposed.

[0014] Further details of the embodiments are included in the detailed description and the accompanying drawings.

[0015] In the display device according to this disclosure, the connector and through-hole between the anode and cathode are aligned horizontally within the block. Furthermore, the blocks above and below the opening area are connected on the same layer by connecting lines or on different layers by connecting lines through a first through-hole and a second through-hole. Therefore, the wiring area and bezel area can be reduced. Consequently, the cost of the flexible printed circuit board (FPCB) can be reduced, and process errors can be minimized.

[0016] Furthermore, in the display device according to this disclosure, sensor units such as illuminance sensors, proximity sensors, and fingerprint sensors are disposed between the LEDs. Therefore, the space occupied by the sensor units can be reduced, and skin care functions using near-infrared light or disinfection functions using ultraviolet (UV) light can be achieved.

[0017] The effects of the display device according to exemplary embodiments of the present disclosure are not limited to the effects described above, and include various other effects in the present disclosure.

[0018] The effects of this disclosure are not limited to those illustrated above, and this specification includes many more effects. Attached Figure Description

[0019] The above and other aspects, features, and other advantages of this disclosure will be more clearly understood through the following detailed description, taken in conjunction with the accompanying drawings, in which:

[0020] Figure 1 This is a perspective view schematically showing an LED assembly according to a first exemplary embodiment of the present disclosure;

[0021] Figure 2 This is a cross-sectional view showing a partial structure of an LED assembly according to a first exemplary embodiment of the present disclosure;

[0022] Figure 3 It is shown Figure 2 A cross-sectional view of the structure of the LED shown;

[0023] Figure 4 This is a perspective view schematically showing an LED display device in which multiple LED components are laid out;

[0024] Figure 5 This is a schematic cross-sectional view of an LED display device according to a first embodiment of the present disclosure;

[0025] Figure 6 An example of a wiring layout in an LED assembly according to a first exemplary embodiment of the present disclosure is shown;

[0026] Figure 7 yes Figure 6 A magnified view of part A;

[0027] Figure 8 schematically shown Figure 7 The block structure shown;

[0028] Figure 9 An example of a block structure based on a comparative example is shown;

[0029] Figure 10 An example of the wiring layout in an LED assembly according to a comparative example is shown;

[0030] Figure 11 This is a schematic cross-sectional view of an LED display device according to a second exemplary embodiment of the present disclosure;

[0031] Figure 12 An example of a circuit layout in an LED assembly according to a third exemplary embodiment of the present disclosure is shown; and

[0032] Figure 13 This is a schematic cross-sectional view of an LED display device according to a fourth exemplary embodiment of the present disclosure. Detailed Implementation

[0033] The advantages and features of this disclosure, as well as methods for implementing such advantages and features, will become clear from the exemplary embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in different forms. These embodiments are provided by way of example only so that those skilled in the art can fully understand the disclosure and scope of this disclosure. Therefore, this disclosure is limited only by the scope of the appended claims.

[0034] The shapes, dimensions, ratios, angles, quantities, etc., shown in the accompanying drawings used to describe exemplary embodiments of this disclosure are merely examples, and this disclosure is not limited thereto. Throughout the specification, the same reference numerals generally refer to the same elements. Furthermore, in the following description of this disclosure, detailed descriptions of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of this disclosure. Terms such as “comprising,” “having,” and “including” as used herein are generally intended to allow for the addition of additional components, unless these terms are used in conjunction with the term “only.” Unless otherwise stated, any reference to the singular may include the plural.

[0035] Even without explicit explanation, components are interpreted as including the normal tolerance range.

[0036] When using terms such as “on top of,” “above,” “below,” and “near” to describe the positional relationship between two parts, one or more parts may be located between the two parts unless the terms “immediately adjacent” or “directly” are used.

[0037] When one element or layer is placed "on" another element or layer, other layers or other elements may be placed on or between the other element.

[0038] Although the terms "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, the first component mentioned below can be the second component in the technical concept of this disclosure.

[0039] Throughout the specification, the same reference numerals generally refer to the same elements.

[0040] The dimensions and thicknesses of each component shown in the accompanying drawings are for ease of description and this disclosure is not limited to the dimensions and thicknesses of the components shown.

[0041] The features of the various embodiments of this disclosure may be combined or integrated with each other in part or in whole, and may be technically interconnected and operable in various ways, and the embodiments may be implemented independently or in connection with each other.

[0042] In the following, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0043] Figure 1 This is a perspective view schematically showing an LED assembly according to a first exemplary embodiment of the present disclosure.

[0044] Reference Figure 1 The LED assembly 100 according to a first exemplary embodiment of the present disclosure may include a main flexible printed circuit board (FPCB) 110 and a plurality of LEDs 140 disposed on the main FPCB 110.

[0045] Multiple pixel regions P can be defined in the main FPCB 110.

[0046] Pixel regions P can form blocks, which are the smallest units in a series configuration of LEDs 140.

[0047] Although not shown in the accompanying drawings, the main FPCB 110 can be a TFT array substrate, and thin-film transistors and various lines for driving LED 140 can be formed in the pixel region P. When the thin-film transistors are turned on, a drive signal input from the outside through the lines is applied to LED 140, and LED 140 emits light. LED 140 can be used as a backlight or can be used to realize an image.

[0048] In each pixel region P of the main FPCB 110, nine LEDs 140R, 140G, and 140B are repeatedly arranged, each LED 140R, 140G, and 140B emitting monochromatic light such as R, G, and B. Therefore, the LEDs 140R, 140G, and 140B emitting R, G, and B light can respond to signals applied from the outside to emit light of the colors R, G, and B. However, this disclosure is not limited to the number of LEDs 140R, 140G, and 140B arranged in each pixel region P (i.e., each block).

[0049] LEDs 140R, 140G, and 140B can be manufactured using a process separate from the TFT array process of the main FPCB 110. In typical organic light-emitting display devices, both the TFT array substrate and the organic light-emitting layer are formed using photolithography. However, in the LED display device according to this disclosure, while the thin-film transistors and various lines disposed on the main FPCB 110 are formed using photolithography, LEDs 140R, 140G, and 140B can be manufactured using separate processes. In this case, LEDs 140R, 140G, and 140B can be disposed on the substrate 111 using a transfer process, but are not limited thereto.

[0050] LED 140 can have dimensions ranging from a few μm to several hundred μm. LED 140 can be formed by growing thin films of various inorganic materials (such as Al, Ga, N, P, As, In, etc.) on a sapphire substrate or silicon substrate, and then cutting and separating the sapphire substrate or silicon substrate.

[0051] Therefore, LEDs 140 are formed into miniature sizes, allowing them to be transferred onto flexible substrates such as plastic substrates. This enables the manufacture of flexible display devices. Furthermore, unlike organic light-emitting layers, LEDs 140 are formed by growing thin films of inorganic materials, thus simplifying the manufacturing process and increasing yield. Additionally, LEDs 140 can be easily transferred onto large-area substrates, enabling the manufacture of large-area display devices. Moreover, compared to LEDs made with organic light-emitting materials, LEDs 140 made from inorganic materials offer advantages such as higher brightness and longer lifespan.

[0052] Although not shown in the accompanying drawings, multiple gate lines and multiple data lines can be arranged vertically or horizontally on the main FPCB 110 to define multiple pixel regions P in a matrix form. In this case, the gate lines and data lines are connected to the LED 140, and the gate pads and data pads connected to the outside are respectively located at the ends of the gate lines and the ends of the data lines. Therefore, signals from the outside can be applied to the LED 140 through the gate lines and data lines, causing the LED 140 to operate and emit light.

[0053] Figure 2 This is a cross-sectional view showing a partial structure of an LED assembly according to a first exemplary embodiment of the present disclosure.

[0054] For ease of description, Figure 2 An example of the structure of subpixels disposed on the exterior of an LED display device is shown. However, this disclosure is not limited thereto.

[0055] Reference Figure 2Thin-film transistors (TFTs) can be disposed in the display area of ​​substrate 111, and pads 152 can be disposed in the pad area.

[0056] The substrate 111 is made of a transparent material such as glass, but is not limited to this, and may be made of other transparent materials. In addition, the substrate 111 may be made of a flexible transparent material.

[0057] A thin-film transistor (TFT) may include a gate 101, a semiconductor layer 103, a source 105, and a drain 107.

[0058] Reference Figure 2 The gate 101 can be formed on the substrate 111. Furthermore, the gate insulating layer 112 can be formed over the entire area of ​​the substrate 111 and can cover the gate 101. In addition, the semiconductor layer 103 can be formed on the gate insulating layer 112, and the source 105 and drain 107 can be formed on the semiconductor layer 103.

[0059] The gate 101 may be made of metals such as Cr, Mo, Ta, Cu, Ti, Al, or alloys thereof. The gate insulating layer 112 may be formed as a single layer of inorganic material such as SiOx or SiNx, or as a multilayer of SiOx and SiNx.

[0060] The semiconductor layer 103 can be made of an amorphous semiconductor such as amorphous silicon or an oxide semiconductor such as indium gallium zinc oxide (IGZO), TiO2, ZnO, WO3, or SnO2. If the semiconductor layer 103 is made of an oxide semiconductor, the size of the thin-film transistor (TFT) can be reduced, the driving power can be reduced, and the electromobility can be improved. However, in this disclosure, the semiconductor layer of the thin-film transistor is not limited to a specific material.

[0061] The source 105 and drain 107 can be made of metals such as Cr, Mo, Ta, Cu, Ti, Al, or alloys thereof. In this case, the drain 107 can be used as the first electrode to apply a signal to the LED 140.

[0062] Furthermore, although the thin-film transistor (TFT) is shown as a bottom-gate type TFT in the accompanying drawings, this disclosure is not limited thereto. Thin-film transistors with various structures, such as top-gate type TFTs, can be applied.

[0063] The pads 152 disposed in the pad area can be made of metals such as Cr, Mo, Ta, Cu, Ti, Al, or alloys thereof. The pads 152 can be formed using a different process than that used for the gate 101 of the thin-film transistor (TFT). However, to simplify the process, the pads 152 can also be formed using the same process as that used for the gate 101.

[0064] Although not shown in the accompanying drawings, pad 152 can be formed on the gate insulating layer 112. In this case, pad 152 can be formed using a different process than that used for the source 105 and drain 107 of the thin-film transistor TFT. However, to simplify the process, pad 152 can also be formed using the same process as that used for the source 105 and drain 107.

[0065] Furthermore, the second electrode 109 can be formed on the gate insulating layer 112 in the display area. In this case, the second electrode 109 can be made of a metal such as Cr, Mo, Ta, Cu, Ti, Al, or an alloy thereof. Moreover, the second electrode 109 can be formed using the same process as the source 105 and drain 107 of the thin-film transistor TFT.

[0066] Furthermore, the first insulating layer 114 can be formed on a substrate 111 on which a thin-film transistor (TFT) has already been formed, and the LED 140 can be disposed on the first insulating layer 114 in the display area. Although a portion of the first insulating layer 114 is shown removed and the LED 140 is disposed in the removed area in the figures, the first insulating layer 114 may not be removed. The first insulating layer 114 can be formed as an organic layer such as photoacrylic acid, or it can have a multilayer structure including an inorganic layer and an organic layer, or an inorganic layer, an organic layer, and an inorganic layer.

[0067] LED 140 is primarily made of III-V group nitride semiconductor materials, but is not limited to this.

[0068] Figure 3 It is shown Figure 2 The diagram shows a cross-sectional view of the LED structure.

[0069] Reference Figure 3 For example, the LED 140 according to a first exemplary embodiment of the present disclosure may include an undoped GaN layer 144 and an n-type GaN layer 145 disposed on the GaN layer 144. Furthermore, for example, the LED 140 may include an active layer 146 having a multiple quantum well (MQW) structure disposed on the n-type GaN layer 145, and a p-type GaN layer 147 disposed on the active layer 146. Furthermore, for example, the LED 140 may include an ohmic contact layer 148 made of a transparent conductive material disposed on the p-type GaN layer 147, and a p-type electrode 141 in contact with a portion of the ohmic contact layer 148. Furthermore, for example, the LED 140 may include an n-type electrode 143 in contact with a portion of the n-type GaN layer 145 exposed by etching the active layer 146, the p-type GaN layer 147, and a portion of the ohmic contact layer.

[0070] The n-type GaN layer 145 is a layer used to supply electrons to the active layer 146, and can be formed by doping the GaN semiconductor layer with an n-type impurity such as Si.

[0071] The active layer 146 is a layer in which injected electrons combine with holes to emit light.

[0072] The MQW structure of the active layer 146 includes multiple alternating barrier layers and multiple well layers. The well layers are formed as InGaN layers, and the barrier layers are formed as GaN layers, but are not limited to these.

[0073] The p-type GaN layer 147 is a layer used to inject holes into the active layer 146, and can be formed by doping the GaN semiconductor layer with p-type impurities such as Mg, Zn and Be.

[0074] The ohmic contact layer 148 is a layer used for the ohmic contact between the p-type GaN layer 147 and the p-type electrode 141. The ohmic contact layer 148 can be made of a transparent metal oxide such as indium tin oxide (ITO), indium gallium zinc oxide (IGZO), or indium zinc oxide (IZO).

[0075] The p-type electrode 141 and the n-type electrode 143 can be formed as a single layer or multiple layers of at least one metal or alloy selected from Ni, Au, Pt, Ti, Al and Cr.

[0076] In the LED 140 configured as described above, when a voltage is applied to the p-type electrode 141 and the n-type electrode 143, electrons and holes are injected from the n-type GaN layer 145 and the p-type GaN layer 147 into the active layer 146, respectively. Excitons are then generated within the active layer 146. As the excitons decay, light corresponding to the energy difference between the lowest unoccupied molecular orbital (LUMO) and the highest occupied molecular orbital (HOMO) of the emitter layer is generated and emitted to the outside.

[0077] The wavelength of light emitted from LED 140 can be adjusted by changing the thickness of the barrier layer in the MQW structure of the active layer 146.

[0078] Although not shown in the accompanying drawings, the LED 140 can be manufactured by forming a buffer layer on a substrate and growing a GaN thin film on the buffer layer. In this case, sapphire, silicon (Si), GaN, silicon carbide (SiC), gallium arsenide (GaAs), zinc oxide (ZnO), etc., can be used as substrates for growing GaN thin films.

[0079] An n-type GaN layer 145 can be formed by growing an undoped GaN layer 144 on top of an undoped thin film and then doping it with an n-type impurity such as Si. Alternatively, a p-type GaN layer 147 can be formed by growing an undoped GaN thin film and then doping it with p-type impurities such as Mg, Zn, and Be.

[0080] Despite Figure 2 The illustration shows an LED 140 with a specific structure disposed on a first insulating layer 114; however, this disclosure is not limited to LEDs 140 with this specific structure. LEDs with various structures can be applied, such as vertically structured LEDs and horizontally structured LEDs.

[0081] Refer to Figure 2 The second insulating layer 116 can be formed on the first insulating layer 114 on which the LED 140 has already been disposed.

[0082] The second insulating layer 116 can be formed as an organic layer such as photoacrylic acid, or it can have a multilayer structure including inorganic and organic layers or inorganic, organic and inorganic layers. The second insulating layer 116 covers the upper part of the LED 140.

[0083] The first contact hole 114a and the second contact hole 114b are formed in the first insulating layer 114 and the second insulating layer 116 on the thin-film transistor TFT and the second electrode 109, respectively. Therefore, the drain 107 of the thin-film transistor TFT and the second electrode 109 can be exposed to the outside. Furthermore, the third contact hole 116a and the fourth contact hole 116b are formed in the second insulating layer 116 on the p-type electrode 141 and the n-type electrode 143 of the LED 140, respectively. Therefore, the p-type electrode 141 and the n-type electrode 143 can be exposed to the outside.

[0084] although Figure 2 Two insulating layers 114 and 116 are shown; however, this is to suppress excessive increases in process time that would occur when forming a single insulating layer. Therefore, it is not necessary to form multiple insulating layers 114 and 116, and a single insulating layer can be formed. Furthermore, the number of insulating layers 114 and 116 can be more than two.

[0085] A first connecting electrode 117a and a second connecting electrode 117b, made of a transparent metal oxide such as ITO, IGZO, or IGO, are formed on the second insulating layer 116. Therefore, the drain 107 of the thin-film transistor TFT and the p-type electrode 141 of the LED 140 can be electrically connected by the first connecting electrode 117a passing through the first contact hole 114a and the third contact hole 116a. Furthermore, the second electrode 109 and the n-type electrode 143 of the LED 140 can be electrically connected by the second connecting electrode 117b passing through the second contact hole 114b and the fourth contact hole 116b.

[0086] In addition, a buffer layer 118 made of inorganic and / or organic materials may be formed on the upper surface of the substrate 110 to cover the LED 140 and the pad 152.

[0087] Figure 4 This is a perspective view schematically showing a tiled LED display device with multiple LED components.

[0088] Figure 4 The LED display device 200 shown is a plurality of such Figure 1 The LED assembly 100 shown is incorporated into the display device. For ease of description, Figure 4 The illustration shows four LED components 100. However, six, eight or more LED components 100 can be laid to form an LED display device 200.

[0089] Reference Figure 4 A lay-up LED display device 200 according to a first exemplary embodiment of the present disclosure can be formed by placing or connecting multiple LED components 100 in a matrix.

[0090] Each LED component 100 may include multiple pixel regions P (or blocks), and multiple LEDs 140 may be set in each pixel region P.

[0091] LED 140 may include at least LED 140R, 140G, and 140B, which emit light of three colors: R, G, and B, respectively. LED 140 may emit white light.

[0092] Although not shown in the accompanying drawings, gate lines, data lines, and thin-film transistors for implementing LED 140 can be formed in each pixel region P of LED assembly 100.

[0093] Furthermore, unlike LCD or OLED devices, LED displays do not require sealants and encapsulation units or structures, thus reducing the size of the bezel area. In addition, in LED displays, each LED is designed as the smallest unit in a series configuration to reduce the bezel area and the area of ​​the film-on-film (FOF) bonding pads. However, to reduce the FOF bonding pad area, the order of the pads may be changed and the number of layers may be increased depending on the via avoidance design.

[0094] Therefore, the inventors have invented an LED display device in which a novel block structure reduces the FOF bonding pad area without requiring via avoidance design and without increasing the number of layers, thus minimizing or reducing the bezel area.

[0095] Figure 5 This is a schematic cross-sectional view of an LED display device according to a first exemplary embodiment of the present disclosure.

[0096] Figure 6 An example of the wiring layout in an LED assembly according to a first exemplary embodiment of the present disclosure is shown.

[0097] Figure 7 yes Figure 6 A magnified view of part A.

[0098] Figure 8 schematically shown Figure 7 The block structure shown.

[0099] For ease of description, Figure 8 The area where LED 140 is installed is shown.

[0100] Reference Figures 5 to 8 The LED display device according to a first exemplary embodiment of the present disclosure may include a main FPCB 110 on which a plurality of LEDs 140 are mounted. Furthermore, the LED display device may include a sub-FPCB 130 connected to the main FPCB 110 and a bottom cover 120 housing the plurality of LEDs 140 and the main FPCB 110.

[0101] For example, LED 140, main FPCB 110, and sub-FPCB 130 can form a backlight unit or backlight. In this case, a liquid crystal panel (not shown) can be disposed above the backlight unit, and a bottom cover 120 configured to cover the backlight unit can be disposed below the backlight unit. However, this disclosure is not limited thereto. LED 140 itself can realize an image. In this case, a liquid crystal panel may not be necessary.

[0102] The main FPCB 110 can be attached to the inner upper surface of the bottom cover 120 via a predetermined or selected adhesive layer 125. In this case, a connector, such as an anisotropic conductive film (ACF) 135, is provided on the rear surface of the main FPCB 110 to connect to the sub-FPCB 130. Furthermore, the sub-FPCB 130 can be connected to the ACF 135 on the rear surface of the main FPCB 110 and then connected to the outside through an opening region 136 formed in the bottom cover 120.

[0103] One end of the sub-FPCB 130 can be bent toward the rear surface of the main FPCB 110 and located within the opening region 136, and can be connected to the main FPCB 110 via ACF 135.

[0104] Furthermore, according to the first exemplary embodiment of this disclosure, no plurality of LEDs 140 are disposed in the opening region 136. That is, the LEDs 140 are configured to avoid the FOF bonding pad region W within the opening region 136. Therefore, damage to the LEDs 140 caused by being pressed when the main FPCB 110 and the sub-FPCB 130 are bonded to each other can be suppressed.

[0105] Furthermore, according to a first exemplary embodiment of this disclosure, the connector between the anode and cathode, as well as the through holes 165a and 165b, are aligned horizontally within the block. Additionally, the blocks above and below the opening region 136 are connected on the same layer via a third connecting line 166.

[0106] In other words, in each block, multiple LEDs 140 are connected in series via a first connecting electrode 117a and a second connecting electrode 117b. Furthermore, a first through-hole 165a and a second through-hole 165b are respectively located at one end of the first connecting electrode 117a and one end of the second connecting electrode 117b, thus allowing connection to the first connecting line 161 and the second connecting line 162.

[0107] In fact, the first connecting electrode 117a and the second connecting electrode 117b can refer to the same component. For ease of description, the first connecting electrode 117a can refer to the electrode located on the anode side of the LED 140, while the second connecting electrode 117b can refer to the electrode located on the cathode side of the LED 140.

[0108] Figure 8 An example is shown in which twelve LEDs 140 are connected in series via a first connecting electrode 117a and a second connecting electrode 117b. However, this disclosure is not limited to the number of LEDs 140 disposed in each block.

[0109] Furthermore, one end of the first connecting electrode 117a is exposed through the first through hole 165a. The first connecting electrodes 117a of blocks that are perpendicular to each other can be connected to each other by a first connecting line 161 arranged in a vertical direction passing through the first through hole 165a of the blocks that are perpendicular to each other.

[0110] In this case, a first connecting line 161 can be set in each column, and blocks in the same column, except for the block below the opening area 136, can be connected to each other by the same first connecting line 161.

[0111] One end of each first connecting line 161 can be connected to the first connecting electrode 117a of the block on the opening region 136 through the first through hole 165a. Furthermore, the first connecting electrodes 117a of the blocks above and below the opening region 136 can be connected to each other through the third connecting line 166. In this case, the first connecting electrode 117a and the third connecting line 166 can be disposed on the same layer, and the first connecting electrode 117a and the first connecting line 161 can be disposed on different layers. However, this disclosure is not limited thereto.

[0112] Furthermore, the block below the opening region 136 also includes a first sub-connection line 161'. One end of the first sub-connection line 161' can be connected to the first connection electrode 117a through the first through-hole 165a, and its other end can extend into the opening region 136. The first connection electrode 117a and the first sub-connection line 161' can be disposed on different layers. However, this disclosure is not limited thereto.

[0113] Multiple second connection lines 162 can be provided in each column. The number of second connection lines 162 can be set to correspond to the number of blocks provided in each column, excluding the blocks below the opening region 136. For example, in the same column, one end of the second connection electrode 117b of the blocks in each row can be connected to the second connection line 162 through the second through hole 165b of the blocks in each row. That is, in the same column, one end of the second connection electrode 117b of the blocks in the first row can be connected to the first second connection line 162 provided on the far left of the same column through the second through hole 165b of the blocks in the first row. In addition, one end of the second connection electrode 117b of the blocks in the second row can be connected to the second second connection line 162 provided in the same column through the second through hole 165b of the blocks in the second row. Furthermore, one end of the second connection electrode 117b of the blocks in the (n-1)th row can be connected to the last second connection line 162 provided on the far right of the same column through the second through hole 165b of the blocks in the (n-1)th row. Here, n refers to the total number of blocks in each row, and the blocks in the (n-1)th row can refer to the blocks in the opening region 136.

[0114] Furthermore, the block in the nth row, namely the block below the opening region 136, also includes a second sub-connection line 162'. One end of the second sub-connection line 162' can be connected to the second connection electrode 117b through the second through-hole 165b, and its other end can extend to the opening region 136. The second connection electrode 117b and the second sub-connection line 162' can be disposed on different layers. However, this disclosure is not limited thereto.

[0115] Meanwhile, in the first exemplary embodiment of this disclosure, the first through-hole 165a and the second through-hole 165b are disposed within the block. Furthermore, the connector between the anode and cathode (i.e., the portion connecting the first connecting electrode 117a and the second connecting electrode 117b to the first connecting line 161 and the second connecting line 162, respectively) and the first through-hole 165a and the second through-hole 165b are aligned in the horizontal direction. That is, since the first through-hole 165a and the second through-hole 165b are disposed within the block, the increase in the size of the frame area caused by the first through-hole 165a and the second through-hole 165b can be suppressed. Furthermore, since the connector between the anode and cathode and the first through-hole 165a and the second through-hole 165b are aligned in the horizontal direction, multiple second connecting lines 162 can be arranged more densely in the opening region 136. Therefore, the width of the opening region 136 can be reduced. That is, the connector between the anode and cathode and the first through-hole 165a and the second through-hole 165b are disposed at the upper end of the block in the (n-1)th row and are aligned in the horizontal direction. Therefore, multiple second connection lines 162 can bend towards the center while avoiding the second through-hole 165b. This allows for a denser arrangement of multiple second connection lines 162 within the opening region 136. Consequently, the wiring area and border area can be reduced. Furthermore, the cost of the sub-FPCB 130 can be reduced, and process errors can be minimized.

[0116] Figure 9 An example of a block structure based on the comparison example is shown.

[0117] Figure 10 An example of the wiring layout in an LED assembly according to a comparative example is shown.

[0118] Reference Figure 9 and Figure 10 It can be seen that in the comparative example, the first through hole 65a and the second through hole 65b are located on the outside of the block. Furthermore, it can be seen that the connector between the anode and cathode, i.e., the portion connecting the first connecting electrode 17a and the second connecting electrode 17b to the first connecting line and the second connecting line respectively, and the first through hole 65a and the second through hole 65b are not aligned in the horizontal direction.

[0119] When the first through hole 65a and the second through hole 65b are provided outside the block as in the comparative example, the size of the border area increases the protruding width of the first through hole 65a and the second through hole 65b outside the block.

[0120] Furthermore, the aforementioned provisions of this disclosure cannot be provided when the connector between the anode and cathode, as well as the first through hole 65a and the second through hole 65b, are not aligned in the horizontal direction. Figure 6 and Figure 7The second connection lines shown. That is, in the comparative example, multiple second connection lines 62 cannot bend towards the center while avoiding the second via 65b. Therefore, a miniaturized wiring area design cannot be achieved. Furthermore, when implementing a via avoidance design, the order of the pads may need to be changed or the number of layers may need to be increased.

[0121] Therefore, in the comparative example, the width W2 of the opening region 36 cannot be reduced, which results in an increase in the size of the border region.

[0122] Figure 11 This is a schematic cross-sectional view of an LED display device according to a second exemplary embodiment of the present disclosure.

[0123] In addition to the LCD panel 270 being located above the backlight unit, Figure 11 The second exemplary embodiment of this disclosure shown is substantially the same as the first exemplary embodiment described above. Therefore, repeated descriptions thereof will be omitted.

[0124] Reference Figure 11 According to the second exemplary embodiment of the present disclosure, the LED display device may mainly include a liquid crystal panel 270 and a backlight unit disposed below the liquid crystal panel and supplying backlight to the liquid crystal panel.

[0125] Here, the backlight unit may include a plurality of optical sheets 250 and a main FPCB 110 on which a plurality of LEDs 140 are mounted. In addition, the backlight unit may include a sub-FPCB 130 connected to the main FPCB 110 and a bottom cover 120 that houses the plurality of LEDs 140 and the main FPCB 110.

[0126] The liquid crystal panel 270 may include pixels arranged in a matrix to output images. Furthermore, the liquid crystal panel 270 may include a color filter substrate 272 and an array substrate 271, which face each other and are bonded to maintain uniform cell spacing. Additionally, the liquid crystal panel 270 may include a liquid crystal layer formed in the cell spacing between the color filter substrate 272 and the array substrate 271.

[0127] Although not specifically shown, a common electrode and pixel electrodes can be formed on the liquid crystal panel 270, and the color filter substrate 272 and the array substrate 271 are bonded to each other to apply an electric field to the liquid crystal layer. When the voltage of the data signal applied to the pixel electrode is controlled while a voltage is applied to the common electrode, the liquid crystal in the liquid crystal layer can rotate due to the dielectric anisotropy of the electric field between the common electrode and the pixel electrode. Therefore, the liquid crystal can transmit or block light for each pixel to display text or images.

[0128] In this case, in order to control the voltage of the data signal applied to the pixel electrode for each pixel, a switching device such as a thin-film transistor (TFT) can be provided in each pixel. That is, gate lines and data lines arranged vertically and horizontally to define the pixel area can be provided on the array substrate 271, and TFTs as switching devices can be formed in the areas where the gate lines and data lines overlap.

[0129] A TFT may include a gate connected to a gate line, a source connected to a data line, and a drain connected to a pixel electrode.

[0130] The color filter substrate 272 may include a color filter comprising a plurality of sub-color filters for realizing red, green, and blue, and a black matrix capable of separating the sub-color filters and blocking light transmitted through the liquid crystal layer. Furthermore, the color filter substrate 272 may include an outer coating disposed on the color filters and the black matrix.

[0131] Polarizing plates can be attached to the outer sides of the color filter substrate 272 and the array substrate 271, respectively. The lower polarizing plate can polarize the light transmitted through the backlight unit in the direction toward the array substrate 271, and the upper polarizing plate can polarize the light transmitted through the liquid crystal panel 270.

[0132] Furthermore, a guide panel can be provided at the edge of the backlight unit below the LCD panel 270. The guide panel can support the LCD panel 270 and can accommodate the bottom cover 120 and the backlight unit disposed therein.

[0133] Multiple optical sheets 250 can be provided on the LED assembly to improve the efficiency of light emitted from the light source and to emit light onto the liquid crystal panel 270.

[0134] Simultaneously, the main FPCB 110 can be attached to the inner upper surface of the bottom cover 120 via the adhesive layer 125. A connector (e.g., an anisotropic conductive film 135) connected to the sub-FPCB 130 can be disposed on the rear surface of the main FPCB 110. Furthermore, the sub-FPCB 130 can be connected to the ACF 135 on the rear surface of the main FPCB 110 and then connected to the outside via an opening region 136 formed in the bottom cover 120.

[0135] One end of the sub-FPCB 130 can be bent toward the rear surface of the main FPCB 110 and located within the opening region 136, and can be connected to the main FPCB 110 via ACF 135.

[0136] According to a second exemplary embodiment of the present disclosure, as with the first exemplary embodiment described above, no plurality of LEDs 140 are provided in the opening region 136.

[0137] Furthermore, according to the first exemplary embodiment of this disclosure, the blocks above and below the opening region are connected on the same layer via a third connecting line; however, this disclosure is not limited thereto. The blocks above and below the opening region can be connected via a first connecting line. (Refer to...) Figure 11 This will be described in detail.

[0138] Figure 12 An example of the wiring layout in an LED assembly according to a third exemplary embodiment of the present disclosure is shown.

[0139] Except for the blocks above and below the opening area 136, which are connected by the first connecting line 361. Figure 12 The third exemplary embodiment of this disclosure shown is substantially the same as the first exemplary embodiment described above. Therefore, its repeated description will be omitted.

[0140] Reference Figure 12 In a third exemplary embodiment of this disclosure, the connector between the anode and cathode is aligned horizontally within the block with the first through-hole 165a and the second through-hole 165b. Furthermore, the blocks above and below the opening region 136 are connected by a first connecting line 361.

[0141] In other words, in each block, multiple LEDs (not shown) are connected in series via a first connecting electrode 117a and a second connecting electrode 117b. Furthermore, a first through-hole 165a and a second through-hole 165b are respectively located at one end of the first connecting electrode 117a and one end of the second connecting electrode 117b, thus allowing connection to the first connecting line 361 and the second connecting line 362.

[0142] Here, as described above, for ease of description, the first connecting electrode 117a can refer to the electrode located on the anode side of the LED, and the second connecting electrode 117b can refer to the electrode located on the cathode side of the LED.

[0143] One end of the first connecting electrode 117a is exposed through the first through hole 165a. The first connecting electrodes 117a of blocks that are perpendicular to each other can be connected to each other by a first connecting line 361 arranged in a vertical direction passing through the first through hole 165a of the blocks that are perpendicular to each other.

[0144] In this configuration, the first connecting line 361 can be placed in each column, and blocks within the same column can be connected to each other via the same first connecting line 361. Therefore, the third connecting line described in the first example is unnecessary, thereby enabling a further reduction in the border area.

[0145] That is, one end of the first connecting line 361 can be connected to the first connecting electrode 117a of the block in the same column through the first through hole 165a. In this case, the first connecting electrode 117a and the first connecting line 361 can be disposed on different layers. However, this disclosure is not limited thereto.

[0146] Furthermore, the block below the opening region 136 also includes a first sub-connection line 361'. One end of the first sub-connection line 361' can be connected to the first connection line 361 through the first through-hole 165a, and its other end can extend into the opening region 136. The first connection electrode 117a and the first sub-connection line 361' can be disposed on different layers. However, this disclosure is not limited thereto.

[0147] Furthermore, multiple second connecting lines 362 can be provided in each column. The number of second connecting lines 362 can be set to correspond to the number of blocks in each column, excluding the blocks below the opening region 136. For example, in the same column, one end of the second connecting electrode 117b of the blocks in each row can be connected to the second connecting line 362 through the second through hole 165b of the blocks in each row. That is, in the same column, one end of the second connecting electrode 117b of the blocks in the first row can be connected to the first second connecting line 362 provided on the leftmost side of the same column through the second through hole 165b of the blocks in the first row. In addition, one end of the second connecting electrode 117b of the blocks in the second row can be connected to the second second connecting line 362 provided in the same column through the second through hole 165b of the blocks in the second row. Furthermore, one end of the second connecting electrode 117b of the blocks in the (n-1)th row can be connected to the last second connecting line 362 provided on the rightmost side of the same column through the second through hole 165b of the blocks in the (n-1)th row. Here, n refers to the total number of blocks in each row, and the blocks in the (n-1)th row can refer to the blocks on the open region 136.

[0148] Furthermore, the block in the nth row, namely the block below the opening region 136, also includes a second sub-connection line 362'. One end of the second sub-connection line 362' can be connected to the second connection electrode 117b through the second through-hole 165b, and its other end can extend to the opening region 136. The second connection electrode 117b and the second sub-connection line 362' can be disposed on different layers. However, this disclosure is not limited thereto.

[0149] Meanwhile, in the third exemplary embodiment of this disclosure, the first through-hole 165a and the second through-hole 165b are disposed within the block. Furthermore, the connector between the anode and cathode, as well as the first through-hole 165a and the second through-hole 165b, are aligned in the horizontal direction. Therefore, the increase in the size of the border area caused by the first through-hole 165a and the second through-hole 165b can be suppressed. Furthermore, multiple second connecting lines 362 can be arranged more densely in the opening region 136, thereby reducing the width of the opening region 136. Therefore, the wiring area and the border area can be reduced. Furthermore, the cost of the sub-FPCB can be reduced, and process errors can be minimized.

[0150] Figure 13 This is a schematic cross-sectional view of an LED display device according to a fourth exemplary embodiment of the present disclosure.

[0151] In addition to the sensor unit 480 being positioned among the multiple LEDs 440, Figure 13 The fourth exemplary embodiment of this disclosure shown is substantially the same as the second exemplary embodiment described above. Therefore, its repeated description will be omitted.

[0152] Reference Figure 13 The LED display device according to the fourth exemplary embodiment of the present disclosure may mainly include a liquid crystal panel 270 and a backlight unit disposed below the liquid crystal panel and supplying backlight to the liquid crystal panel.

[0153] Here, the backlight unit may include multiple optical sheets 250 and a main FPCB 110 on which multiple LEDs 440 are mounted. In addition, the backlight unit may include a sub-FPCB 130 connected to the main FPCB 110 and a bottom cover 120 that houses the multiple LEDs 440 and the main FPCB 110.

[0154] In this case, the LED assembly may include multiple LEDs 440 and a main FPCB110 on which multiple LEDs 440 are mounted.

[0155] Optical element 250 is disposed on the LED assembly, and bottom cover 120 is disposed below the LED assembly. Therefore, the LED assembly and optical element 250 can be accommodated within bottom cover 120.

[0156] Optical sheet 250 may include at least one of a diffuser sheet, a prism sheet, a brightness enhancement film (such as DBEF), and a protective sheet.

[0157] The sensor unit 480 can be mounted on the main FPCB 110. Each sensor unit 480 can be mounted between adjacent LEDs in a plurality of LEDs 440.

[0158] The sensor unit 480 may include at least one of a proximity sensor, an illuminance sensor, a fingerprint sensor, a near-infrared (N-IR) chip, and an ultraviolet (UV) chip.

[0159] For portable terminals, proximity sensors and illuminance sensors are located on the front surface. Therefore, it is advantageous to have a non-display area primarily for the proximity and illuminance sensors. However, when the sensor units 480 are positioned between the LEDs 440, the non-display area can be reduced. This allows for a narrow bezel or bezel-less design. In conventional fingerprint sensors, fingerprint recognition can only be performed by using a physical button at a predetermined or selected location. However, when the fingerprint sensor is positioned between the LEDs 440, fingerprints can be easily recognized from any part of the display area.

[0160] The N-IR chip uses near-infrared light to provide skin care functions such as skin whitening, removing dead skin cells, inhibiting sebum secretion, and minimizing pore size. The N-IR chip uses red-based LED light with a wavelength of approximately 600 to 700 nm and IR LED light with a wavelength of approximately 800 to 980 nm to stimulate the epidermis and dermis. Therefore, the N-IR chip provides an effect that enables the skin to trigger self-repair when stimulated.

[0161] Furthermore, the UV chip uses UV light to provide a disinfection effect. For example, users can easily disinfect areas by using a portable terminal equipped with a UV chip. Additionally, the portable terminal can be used under relatively clean conditions in this scenario.

[0162] Exemplary embodiments of this disclosure can also be described as follows.

[0163] According to one aspect of this disclosure, a display device is provided. The display device includes: a main FPCB including a plurality of LEDs arranged in blocks on one surface and connectors connected to the LEDs on another surface; a sub-FPCB, the connectors connected to the main FPCB; and a bottom cover, the main FPCB disposed within the bottom cover, and the sub-FPCB connected to the outside through an opening area, wherein, in each block, the plurality of LEDs are arranged in series via a plurality of first connecting electrodes and a plurality of second connecting electrodes, wherein first through-holes and second through-holes are disposed within the blocks, and one end of each of the first and second connecting electrodes is exposed through the first and second through-holes.

[0164] LEDs may not be required in areas facing open spaces.

[0165] The first connecting electrode can be located on the anode side of the LED, and the second connecting electrode can be located on the cathode side of the LED.

[0166] The display device may also include a first connecting line disposed on the main FPCB along the row direction, wherein the first connecting electrodes of a plurality of LEDs can be connected to each other through the first connecting line passing through the first through-holes of the plurality of LEDs in the row direction.

[0167] A first connecting line can be set in each column, and blocks in the same column, except for the block below the opening area, can be connected to each other by the same first connecting line.

[0168] One end of each first connecting line can be connected to the first connecting electrode of the block on the opening region through the first through hole, and the first connecting electrodes of the blocks above and below the opening region can be connected to each other through the third connecting line.

[0169] A first connector can be set in each column, and blocks in the same column can be connected to each other through the same first connector.

[0170] One end of the first connecting line can be connected to the first connecting electrode of the block in the same column through the first through hole.

[0171] The block below the opening region may also include a first sub-connecting line, one end of which can be connected to the first connecting electrode through a first through hole, and the other end of which can extend to the opening region.

[0172] Multiple second connection lines can be set in each column, and the number of second connection lines can be set to correspond to the number of blocks in each column other than the blocks below the open area.

[0173] In the same column, one end of the second connection electrode of the block in each row can be connected to the second connection line through the second through hole of the block in each row.

[0174] In the same column, one end of the second connecting electrode of the block in the first row can be connected to the first second connecting line set on the far left of the same column through the second through hole of the block in the first row. One end of the second connecting electrode of the block in the second row can be connected to the second second connecting line set in the same column through the second through hole of the block in the second row. One end of the second connecting electrode of the block in the (n-1)th row can be connected to the last second connecting line set on the far right of the same column through the second through hole of the block in the (n-1)th row. n refers to the total number of blocks in each row, and the blocks in the (n-1)th row refer to the blocks in the opening area.

[0175] The block in the nth row may also include a second sub-connection line, one end of which can be connected to the second connection electrode through a second through hole, and the other end of which can extend to the opening region.

[0176] In the block of row n-1, multiple second connecting lines can be bent toward the center of the opening area while avoiding the second through hole, thereby being arranged more densely in the opening area.

[0177] The first through hole and the second through hole are arranged on the same line in the column direction.

[0178] The portions of the first connecting electrode and the second connecting electrode that are respectively connected to the first connecting line and the second connecting line can be aligned with the first through hole and the second through hole in the column direction.

[0179] The LEDs are positioned facing the opening area.

[0180] The display device may also include a sensor unit disposed among multiple LEDs.

[0181] Although exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and may be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are exemplary in all respects and do not limit the present disclosure. The scope of protection of the present disclosure should be interpreted based on the appended claims, and all technical concepts within the equivalent scope thereof should be understood to fall within the scope of protection of the present disclosure.

Claims

1. A display device, comprising: The main FPCB includes multiple LEDs in blocks on one surface and connectors connected to the LEDs on another surface; The sub-FPCB is connected to the connector of the main FPCB; The bottom cover, wherein the main FPCB is disposed in the bottom cover, and the sub FPCB is connected to the outside through an opening area; First connecting lines are spaced apart along the row direction on the main FPCB; and Multiple second connection lines are set in each column. In each block, the plurality of LEDs are connected in series via a plurality of first connecting electrodes and a plurality of second connecting electrodes. The first through hole and the second through hole are disposed within the block, and One end of the first connecting electrode is exposed through the first through-hole, and one end of the second connecting electrode is exposed through the second through-hole. Specifically, the LED is not installed at the location facing the opening area. Specifically, the portion where the first connecting electrode is connected to the first connecting line, the portion where the second connecting electrode is connected to the second connecting line, and the first through hole and the second through hole are aligned in the horizontal direction.

2. The display device according to claim 1, wherein, The first connecting electrode is located on the anode side of the LED, and the second connecting electrode is located on the cathode side of the LED.

3. The display device according to claim 2, in, The first connection electrodes of the plurality of LEDs are connected to each other by the first connection line passing through the first through hole in the column direction.

4. The display device according to claim 3, wherein, Set the first connecting line in each column, and Blocks in the same column, except for the block below the opening area, are connected to each other by the same first connecting line.

5. The display device according to claim 4, wherein, One end of each first connecting line is connected through the first through hole to the first connecting electrode of the block on the opening region, and The first connecting electrodes of the blocks above and below the opening region are connected to each other via a third connecting line.

6. The display device according to claim 3, wherein, Set the first connecting line in each column, and Blocks in the same column are connected to each other by the same first connecting line.

7. The display device according to claim 6, wherein, One end of the first connecting line is connected to the first connecting electrode of the block in the same column through the first through hole.

8. The display device according to any one of claims 5 and 7, wherein, The block below the opening area also includes a first sub-connecting line, and One end of the first sub-connecting line is connected to the first connecting electrode through the first through hole, and the other end of the first sub-connecting line extends into the opening region.

9. The display device according to claim 8, in, The number of the second connecting lines is set to correspond to the number of blocks in each column, excluding the block below the opening area.

10. The display device according to claim 9, wherein, In the same column, one end of the second connection electrode of the block in each row is connected to the second connection line through the second through hole of the block in each row.

11. The display device according to claim 10, wherein, In the same column, one end of the second connecting electrode of the block in the first row is connected to the first second connecting line disposed on the leftmost side of the same column through the second through hole of the block in the first row. One end of the second connecting electrode of the block in the second row is connected to the second connecting line arranged in the same column through the second through hole of the block in the second row. One end of the second connecting electrode of the block in the (n-1)th row is connected to the last second connecting line set on the rightmost side of the same column through the second through hole of the block in the (n-1)th row. n refers to the total number of blocks in each row, and The block in the (n-1)th row refers to the block on the opening region.

12. The display device according to claim 11, wherein, The block in line n also includes a second sub-connector, and One end of the second sub-connecting line is connected to the second connecting electrode through the second through hole, and the other end of the second sub-connecting line extends to the opening area.

13. The display device according to claim 11, wherein, In the block of the (n-1)th row, the plurality of second connecting lines bend toward the center of the opening region while avoiding the second through hole, thereby being arranged more densely in the opening region.

14. The display device according to claim 1, further comprising: A sensor unit is disposed among the plurality of LEDs.

15. The display device according to claim 6, wherein, The block below the opening area also includes a first sub-connecting line, and One end of the first sub-connecting line is connected to the first connecting electrode through the first through hole, and the other end extends to the opening area.

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