A backlight plate

Abstract

The application belongs to the technical field of backlight lamp plates, and provides a backlight lamp plate which comprises a substrate, a circuit layer and a plurality of light emitting chips, one side of the circuit layer is arranged on the substrate, and the light emitting chips are arranged on the other side of the circuit layer; the backlight lamp plate further comprises an encapsulation adhesive layer and a plurality of reflection patterns, the encapsulation adhesive layer covers the substrate and the light emitting chips, the reflection patterns are arranged on the upper surface of the encapsulation adhesive layer, the reflection patterns comprise a plurality of spaced reflection units, air gaps are formed between the reflection units, the reflection units comprise resin and reflection particles dispersed in the resin, the reflection particle density of a central region of the reflection patterns is greater than the reflection particle density of a peripheral region of the reflection patterns; the backlight lamp plate further comprises a light reflection layer, the light reflection layer is arranged on the side of the circuit layer connected with the light emitting chips, and one side of the encapsulation adhesive layer covers the light reflection layer and the light emitting chips. The backlight lamp plate has good light emitting uniformity and good application effect.

Description

Technical Field

[0001] This invention belongs to the field of backlight panel technology, and particularly relates to a backlight panel. Background Technology

[0002] The conventional packaging process for MINI COB backlight boards involves bonding flip-chip LEDs onto the circuit layer of a substrate, then covering the LED chips and circuit layer with a layer of transparent protective adhesive for protection. Since LED chips are generally Lambertian type, meaning the light emission is stronger in the center and weaker on the sides, existing technologies typically cover the LED chip with a reflective layer to achieve a wider emission angle and more uniform light emission in order to obtain a larger emission angle and more uniform light emission. This causes the light emitted from the front of the LED chip to reflect to both sides. However, although this method can achieve a larger emission angle, because the reflective layer is opaque, the light emitted by the LED chip is reflected multiple times between the reflective layer and the substrate. The reflectivity of the substrate does not reach 100%, so the substrate absorbs some light during the multiple reflections, resulting in significant light loss and a marked reduction in the luminous efficiency and brightness of the backlight board. At the same time, the brightness above the LED chip is relatively low, leading to poor uniformity of the backlight board. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a backlight panel with relatively high luminous efficacy and brightness, good light uniformity, and good application effect.

[0004] The technical solution of the present invention is as follows: a backlight panel, comprising a substrate, a circuit layer, and a plurality of light-emitting chips, wherein one side of the circuit layer is disposed on the substrate, and the light-emitting chips are disposed on the other side of the circuit layer; the backlight panel further comprises an encapsulating adhesive layer and a plurality of reflective patterns, wherein the encapsulating adhesive layer covers the substrate and the light-emitting chips, the reflective patterns are disposed on the upper surface of the encapsulating adhesive layer, the reflective patterns comprising a plurality of spaced reflective units, with air gaps formed between the reflective units, each reflective unit comprising resin and reflective particles dispersed in the resin, the reflective particle density in the central region of the reflective pattern being greater than the reflective particle density in the peripheral region of the reflective pattern; the backlight panel further comprises a reflective layer, wherein the reflective layer is disposed on the side of the circuit layer connected to the light-emitting chips, and one side of the encapsulating adhesive layer covers the reflective layer and the light-emitting chips.

[0005] Optionally, in one of the reflective patterns, the area of ​​the air gap accounts for 20% to 80% of the area of ​​the outline of the reflective pattern; and / or, the thickness of the reflective pattern is 10 to 60 μm.

[0006] Optionally, the reflective unit includes a reflective ring located in the central region of the reflective pattern.

[0007] Optionally, the reflective unit includes a plurality of reflective rings arranged concentrically, with a gap between adjacent reflective rings.

[0008] Optionally, the outer periphery of the reflective ring is provided with reflective points, and the distribution density of each reflective point decreases as it moves away from the center of the reflective pattern.

[0009] Optionally, the reflective unit includes a plurality of reflective points surrounding the center of the reflective pattern, the area of ​​which decreases with increasing distance from the center of the reflective pattern.

[0010] Optionally, the reflectivity of the reflective elements in the central region of the reflective pattern is greater than the reflectivity of the reflective elements in the peripheral region of the reflective pattern.

[0011] Optionally, the reflective units in the central region of the reflective pattern contain titanium dioxide particles, and the reflective units in the peripheral region of the reflective pattern contain silicon dioxide particles.

[0012] Optionally, the reflective pattern is formed by screen printing, and the sidewall of the reflective unit is provided with a release slope.

[0013] Optionally, the backlight panel further includes an optical film disposed above the encapsulating adhesive layer, the surface of which is printed with a diffusion pattern, and the diffusion pattern and the reflection pattern of the optical film are arranged alternately.

[0014] The backlight panel provided by this invention includes a reflective pattern comprising multiple spaced reflective units. A portion of the light emitted by the light-emitting chip is reflected between the reflective units and the reflective layer on the substrate, ultimately exiting from the surface of the encapsulating adhesive. This expands the light emission range of the light-emitting chip after passing through the encapsulating adhesive layer. Simultaneously, air gaps are formed between the reflective units, allowing some light to pass directly through these gaps. This avoids dark areas and reduces light loss caused by repeated reflections between the reflective units and the reflective layer. Furthermore, considering the strong light emission at the center of the light-emitting chip and the weaker emission at the periphery, the reflective particle density in the central region of the reflective pattern is set to be greater than that in the outer region. This effectively modulates the brightness above the light-emitting chip (i.e., directly in front of the light emission direction), ensuring the luminous efficacy and brightness of the backlight panel, improving the light emission uniformity of the panel, and resulting in good application performance. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a cross-sectional schematic diagram of a backlight panel provided in an embodiment of the present invention;

[0017] Figure 2 This is a planar schematic diagram of a backlight panel (with a higher density of reflective areas near the center of the light-emitting chip) provided in an embodiment of the present invention;

[0018] Figure 3 This is a plan view of a backlight panel (with a release slope for the reflective pattern) provided in an embodiment of the present invention;

[0019] Figure 4 This is a planar schematic diagram of a backlight panel (with a circular reflective area) provided in an embodiment of the present invention;

[0020] Figure 5 This is a planar schematic diagram of a backlight panel (with a larger reflective area near the center of the light-emitting chip) provided in an embodiment of the present invention;

[0021] Figure 6 This is a cross-sectional schematic diagram of a backlight panel with an optical film provided in an embodiment of the present invention;

[0022] Figure 7 This is a planar schematic diagram of a backlight panel with an optical film provided in an embodiment of the present invention. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0024] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on the other component or may have an intervening component present. When a component is referred to as "connected to" another component, it can be directly connected to the other component or may have an intervening component present.

[0025] Furthermore, in embodiments of this invention, terms such as "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are used to indicate orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, or in a conventional placement or usage state. These terms are merely for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the structures, features, devices, or elements referred to must have a specific orientation or positional relationship, nor that they must be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0026] The various specific technical features and embodiments described in the detailed embodiments can be combined in any suitable manner without contradiction. For example, different implementation methods can be formed by combining different specific technical features / embodiments. In order to avoid unnecessary repetition, the various possible combinations of the various specific technical features / embodiments in this invention will not be described separately.

[0027] like Figure 1 As shown in the figure, an embodiment of the present invention provides a backlight panel, including a substrate 100, a circuit layer 110, and a plurality of light-emitting chips 210. One side of the circuit layer 110 is disposed on the substrate 100, and the light-emitting chips 210 are disposed on the other side of the circuit layer 110. The backlight panel also includes an encapsulating adhesive layer 130 and a plurality of reflective patterns 300. The encapsulating adhesive layer 130 covers the substrate 100 and the light-emitting chips 210. The reflective patterns 300 are disposed on the upper surface of the encapsulating adhesive layer 130, and the light-emitting surface of the light-emitting chip 210 faces the reflective patterns 300. The reflective pattern 300 includes a plurality of spaced-apart reflective units 320, with air gaps 310 formed between the reflective units 320. Each reflective unit 320 includes resin and reflective particles dispersed in the resin. The reflective particle density in the central region of the reflective pattern 300 is greater than that in the peripheral region. The reflective pattern 300 can reflect part of the light emitted from the light-emitting surface of the light-emitting chip 210. The backlight panel also includes a reflective layer 120, which can be a white adhesive layer and may be embedded with reflective particles in a dispersed manner. The reflective layer 120 is disposed on the side of the circuit layer 110 connected to the light-emitting chip 210, and one side (back side) of the encapsulating adhesive layer 130 covers the reflective layer 120 and the light-emitting chip 210.

[0028] The reflective unit 320, also known as the reflective area 320 (used to reflect light), and the air gap 310, also known as the hollow area (used to allow light to pass through), are all part of the light emitted by the light-emitting chip 210 directed towards the reflective area (e.g., the air gap 310 is the hollow area). Figure 1 (901 in the middle), part of which is directly emitted from the hollowed-out area (such as 901). Figure 1 In step 902), light rays incident on the reflective area are reflected by the reflective area to form reflected light rays. A portion of the reflected light rays are reflected by the reflective layer and then emitted from the hollowed-out area and sides of the light-emitting chip 210. Addressing the characteristic that the light emission from the center of the LED chip is stronger than that from the periphery, in this embodiment, by creating a hollowed-out structure on the reflective pattern 300 to form a hollowed-out area, the proportion and distribution of the hollowed-out area can be modulated so that the reflective particle density in the central area of ​​the reflective pattern 300 is greater than that in the peripheral area. This weakens the light intensity emitted from the encapsulating adhesive layer 130 from the central area of ​​the front of the light-emitting chip 210 and increases the light intensity on the sides of the light-emitting chip 210. The light intensity emitted from the encapsulating adhesive layer 130 in the area allows part of the light emitted by the light-emitting chip 210 to pass directly through the hollow area and be emitted from the front, while part is reflected by the reflective area. This can effectively modulate the brightness above the light-emitting chip 210 (i.e., in front of the light-emitting chip 210, referring to the front of the light-emitting direction of the light-emitting chip 210), ensuring the light efficiency and brightness of the backlight board. At the same time, under the local reflection effect of the reflective pattern 300, some light is reflected to the side area of ​​the light-emitting chip 210, increasing the light emission angle of the light-emitting chip 210 after passing through the encapsulating adhesive layer 130. This improves the brightness of the light emitted from the periphery of the light-emitting chip 210, improves the light emission uniformity of the light board, and has a good application effect.

[0029] Specifically, the light-emitting chip 210 can be a flip-chip MINI LED chip, which is soldered to the circuit layer 110 via pads 220. Specifically, the reflective layer 120 can have a clearance window 121 corresponding to the light-emitting chip 210, and the encapsulating adhesive layer 130 can fill the gap between the clearance window 121 and the light-emitting chip 210. The reflective pattern 300 is disposed on the other side (front) of the encapsulating adhesive layer 130; alternatively, the reflective pattern 300 can be embedded inside the encapsulating adhesive layer 130, i.e., the reflective pattern 300 can also be sandwiched within the encapsulating adhesive layer 130 to form a sandwich structure, and the reflective pattern 300 can be protected by the encapsulating adhesive layer 130 to prevent accidental damage. In this embodiment, the reflective pattern 300 can be formed on the other side (front) of the encapsulating adhesive layer 130 by screen printing with a steel stamp. This process is simple and reliable, allows for precise control of the cutout size and cutout ratio, results in good product consistency, high production efficiency, and low cost.

[0030] Specifically, in one of the reflective patterns 300, the area of ​​the air gap 310 (the hollowed-out area) can account for 20% to 80% of the area of ​​the outline of the reflective pattern 300, which helps to ensure light efficiency and light emission uniformity. In specific applications, the area of ​​the air gap 310 can account for 30% to 60% of the area of ​​the outline of the reflective pattern 300, which improves the light efficiency and brightness of the backlight panel while ensuring the uniformity of light emission from the backlight panel.

[0031] In practical applications, the thickness of the reflective pattern 300 can be 10 to 60 μm, which has good reflective effect and low application cost.

[0032] In specific applications, the reflective pattern 300 can be made of white glue, that is, white glue is screen-printed into a reflective pattern 300 with a hollow area, and the white glue can be white silicone resin.

[0033] Alternatively, the reflective pattern 300 may include white adhesive (white silicone resin) and reflective particles embedded in the white adhesive. The reflective particles may be titanium dioxide reflective particles or / and silicon dioxide reflective particles to improve the light reflection efficiency. In this embodiment, the reflectivity of the reflective area of ​​the reflective pattern 300 is ≥88%.

[0034] Specifically, the reflective unit 320 may include a dotted structure (e.g., Figure 1 As shown), the reflective area can have a block structure, a linear structure, a grid structure, or a ring structure. In specific applications, the reflective unit 320 can be in the shape of a dot or a ring (e.g., Figure 4 As shown), the reflective area can be in the form of polygons, polygonal rings (hollow polygons), straight lines, wavy lines, broken lines, etc., and the reflective area can also be in the form of rectangular grids, rhomboid grids, etc.

[0035] In specific applications, such as Figure 1 As shown, the density of the reflective area near the center of the light-emitting chip 210 can be greater than that of the reflective area far from the center of the light-emitting chip 210. That is, the reflective area is arranged with a relatively dense center (referring to the center of the light-emitting chip 210) and a relatively sparse periphery. This can effectively modulate the brightness above the light-emitting chip 210 and enhance the brightness around the light-emitting chip 210, resulting in good uniformity of light effect.

[0036] Specifically, the hollowed-out area can include a dotted structure, a line structure, a grid structure, or a ring structure. In specific applications, the hollowed-out area can be in the form of dots, rings, polygons, polygonal rings, straight lines, wavy lines, broken lines, etc., and can also be in the form of rectangular grids, rhomboid grids, etc.

[0037] In specific applications, such as Figure 2As shown, the density of the hollow area near the center of the light-emitting chip 210 can be less than that of the hollow area far from the center of the light-emitting chip 210. That is, the air gaps are arranged with relatively sparse air at the center (referring to the center of the light-emitting chip 210) and relatively dense air around the periphery. This can effectively modulate the brightness above the light-emitting chip 210 and enhance the brightness around the light-emitting chip 210, resulting in good uniformity of light effect.

[0038] Of course, in some embodiments, the air gaps may be set randomly or uniformly.

[0039] Specifically, one or at least two light-emitting chips 210 are provided. The reflective area includes a central reflective area and a peripheral reflective area. Each light-emitting chip 210 has a central reflective area directly in front of it along the light emission direction. The peripheral reflective area is located around the central reflective area. The reflective area density of the central reflective area is greater than that of the peripheral reflective area, which is beneficial for modulating the brightness above the light-emitting chip 210 and enhancing the brightness around the light-emitting chip 210, thus achieving good uniformity of light effect.

[0040] As one of the possible solutions for the reflective area, such as Figure 4 As shown, the reflective unit 320 includes multiple reflective rings 321 arranged concentrically, with a gap between adjacent reflective rings 321, the area corresponding to the gap being an air gap; the reflective rings 321 can be circular or polygonal rings. The gap between adjacent reflective rings 321 can be equal, or the gap size near the center of the reflective ring group can be smaller than the gap size away from the center of the reflective ring group. The reflective rings 321 can be circular, and the larger the radius of the reflective ring 321, the larger the gap between its outer side and the adjacent reflective ring 321, in order to match the light emission characteristics of the light-emitting chip 210, which has strong light emission at the center and weak light emission at the edge. The light emitted after passing through the reflective layer 120 is more uniform, thereby modulating the brightness above the light-emitting chip 210 and enhancing the brightness around the light-emitting chip 210, which can make the light efficiency more uniform.

[0041] Specifically, such as Figure 2 In the diagram, the dashed box represents the light-emitting chip 210. Each light-emitting chip 210 has a corresponding reflective ring group positioned directly in front of it along the light-emitting direction, and the center of the reflective ring group corresponds to the center of the light-emitting chip 210, which can effectively modulate the brightness above the light-emitting chip 210.

[0042] Specifically, the periphery of the reflective ring can be provided with a scattered reflective structure, which can be dot-shaped, strip-shaped, or ring-shaped, i.e., the scattered reflective structure can be a reflective point. In specific applications, the scattered reflective structures are evenly distributed, or the density of the scattered reflective structures decreases as they move away from the center of the reflective pattern 300, which helps to enhance the brightness around the light-emitting chip 210 and improve the uniformity of the light effect. In specific applications, the scattered reflective structure can be a reflective point 322, which can be distributed in a spaced-out dot-like pattern in the circumferential direction. The reflective point 322 can be circular or polygonal, etc., and can be evenly arranged at intervals along the circumferential direction of one or at least two concentric circles (concentric with the reflective ring 321). The larger the radius of the concentric circle, the larger the interval of the reflective point 322 in the circumferential direction, i.e., the larger the radius of the concentric circle, the fewer the number of reflective points 322 on the concentric circle. Figure 6 As shown, the light intensity distribution curve of the backlight panel in this embodiment is shown. It can be seen that the brightness above the chip can be effectively modulated by the reflection pattern 300, which is beneficial to improving the light output uniformity of the backlight panel.

[0043] As an alternative to the reflective ring, the air gap may include a perforated ring group, which comprises multiple perforated rings arranged concentrically with intervals between adjacent perforated rings; the perforated rings may be circular or polygonal. The intervals between adjacent perforated rings may be equal, or the interval size near the center of the perforated ring group may be larger than the interval size away from the center of the perforated ring group, in order to modulate the brightness above the light-emitting chip 210 and enhance the brightness around the light-emitting chip 210, thereby improving the uniformity of light efficiency.

[0044] As an alternative to using a reflective ring as the reflective area, the reflective area includes a strip-shaped reflective band and reflective points. The reflective points are located on the periphery of the reflective band, that is, in the area close to the center of the light-emitting chip 210. In the circumferential direction, the reflective band is continuously distributed in a strip shape, and the reflective points in the peripheral area of ​​the light-emitting chip 210 can be distributed in a spaced-out dot shape in the circumferential direction. Each light-emitting chip 210 has a corresponding reflective band directly in front of it along the light-emitting direction; multiple reflective bands are provided, and each reflective band can be spaced apart or / and intersect; the reflective points are circular or polygonal, etc., to modulate the brightness above the light-emitting chip 210 and enhance the brightness around the light-emitting chip 210, thereby improving the uniformity of light effect.

[0045] In specific applications, the reflection points are evenly distributed, or the area of ​​the reflection points decreases as they move away from the center of the reflection pattern. This helps to enhance the brightness around the light-emitting chip 210 and improve the uniformity of the light effect.

[0046] In a specific application, the reflective unit 320 includes a plurality of reflective points surrounding the center of the reflective pattern 300.

[0047] In specific applications, the encapsulating adhesive layer 130 can be a transparent adhesive layer to avoid light loss.

[0048] Specifically, the thickness of the encapsulating adhesive layer 130 can be 200 to 400 μm, allowing the light to have a certain reflection distance and space, which is beneficial to improving the light efficiency.

[0049] In specific applications, such as Figure 3 As shown, the reflective unit 320 may be provided with a demolding slope 131 on its side wall to facilitate the demolding of the screen printing plate and improve the product yield.

[0050] In specific applications, such as Figure 5 As shown, the reflective region includes multiple reflective blocks. The area of ​​each reflective block decreases along the direction away from the center of the light-emitting chip 210. The closer each reflective block is to the light-emitting chip 210, the larger its individual area. That is, the reflective blocks include a central block 327 close to the light-emitting chip 210 and peripheral blocks 328 located around the central block 327. The size of the central block 327 is larger than the size of the light-emitting chip 210 to effectively modulate the brightness above the light-emitting chip 210 and enhance the brightness around the light-emitting chip 210, thus achieving good light uniformity.

[0051] In specific applications, such as Figure 1 , 2 and Figure 5 As shown, the reflectivity of the reflective unit 320 in the central region of the reflective pattern 300 is greater than that of the reflective unit 320 in the peripheral region of the reflective pattern 300. The reflective unit 320 in the central region of the reflective pattern 300 contains titanium dioxide particles, and the reflective unit 320 in the peripheral region of the reflective pattern 300 contains silicon dioxide particles. Titanium dioxide particles can be disposed in the portion of the reflective region close to the light-emitting chip 210, and silicon dioxide particles can be disposed in the portion of the reflective region away from the light-emitting chip 210. That is, the reflective block includes a central block 327 close to the light-emitting chip 210 and a peripheral block 328 located around the central block 327. The reflectivity of the central block 327 is greater than that of the peripheral block 328. The central block 327 can be disposed of with titanium dioxide particles, and the peripheral block 328 can be disposed of with silicon dioxide particles. The central block 327 can be larger or equal to the size of the outer block 328 in order to effectively modulate the brightness above the light-emitting chip 210, enhance the brightness around the light-emitting chip 210, and make the light effect uniformity better.

[0052] Specifically, the backlight panel may also include a transparent second encapsulating adhesive layer and a second perforated reflective layer for allowing some light to pass through. One side of the second encapsulating adhesive layer covers the reflective pattern 300 and the encapsulating adhesive layer 130, and the second perforated reflective layer is disposed on the other side of the second encapsulating adhesive layer. The air gap of the second perforated reflective layer and the air gap of the reflective pattern 300 at least partially overlap in projection onto the substrate 100, that is, the light from the light-emitting chip 210 can be modulated by two or more layers of reflection, which helps to improve the uniformity of light output. The material and thickness of the second perforated reflective layer and the reflective pattern 300 can be the same. In this embodiment, only one encapsulating adhesive layer and one perforated reflective layer are used.

[0053] In specific applications, such as Figure 6 , Figure 7 As shown, an optical film 140 can be mounted on the lamp plate. The optical film 140 can be located above the encapsulating adhesive layer 130. A diffusion pattern 141 can be printed on the surface of the optical film 140. The diffusion pattern 141 and the reflection pattern 320 of the optical film 140 can be staggered. Some light will be reflected back and forth between the staggered diffusion pattern 141 and the reflection pattern 320 before being emitted, which is beneficial to the uniformity of light output. The composition of the diffusion pattern 141 can be the same as that of the reflection pattern 320, that is, it includes resin and reflective particles dispersed in the resin.

[0054] In the above embodiments, the reflective pattern can also be set on a separate optical film and then attached to the encapsulating adhesive layer. This allows for the prefabrication of optical films with different reflective patterns. Based on the application effect, an optical film with a specific reflective pattern can be selected and attached to the encapsulating adhesive layer. Furthermore, the optical film is replaceable, making it flexible, convenient, and widely applicable. Alternatively, diffusion and reflective patterns can be screen-printed on the front and back sides of the same optical film respectively (i.e., the diffusion and reflective patterns share a single optical film as a carrier, eliminating the need for two separate optical films). The diffusion and reflective patterns can be staggered. During use, the optical film can be directly attached to the encapsulating adhesive, offering flexibility, convenience, wide applicability, and low cost.

[0055] This embodiment also provides a method for manufacturing a backlight panel, used to manufacture the aforementioned backlight panel; including the following steps:

[0056] Substrate 100 is prepared;

[0057] A circuit layer 110 is provided on the substrate 100;

[0058] A light-emitting chip 210 is connected to the circuit layer 110, and a reflective layer 120 may be provided on the circuit layer 110;

[0059] The encapsulating adhesive layer 130 is applied to the light-emitting chip 210 and the reflective layer 120.

[0060] A reflective pattern 300, which allows some light to pass through and reflects some light, is disposed on the encapsulating adhesive layer 130, with the reflective surface of the reflective pattern 300 facing the light-emitting surface of the light-emitting chip 210. A portion of the light emitted by the light-emitting chip 210 is directed towards the reflective area, while another portion passes directly through the air gap. The light directed towards the reflective area is reflected to form reflected light. A portion of the reflected light is reflected by the reflective layer 120 and then exits from the air gap and sides of the light-emitting chip 210. A portion of the reflected light is also reflected and exits from the sides of the light-emitting chip 210. Considering the strong light emission at the center of the light-emitting chip 210 and the weaker light emission at the periphery, in this embodiment, by creating a hollow structure on the reflective pattern 300 to form air gaps, the ratio of the air gap area can be modulated. By reducing the light intensity in the central area of ​​the front of the light-emitting chip 210 and increasing the light intensity in the side area of ​​the light-emitting chip 210, part of the light emitted by the light-emitting chip 210 can pass directly through the air gap and be emitted from the front, while part of it is reflected by the reflective area. This can effectively modulate the brightness above the light-emitting chip 210 (i.e., directly in front of the light-emitting direction), ensuring the luminous efficiency and brightness of the backlight panel. At the same time, under the action of the reflective pattern 300 and the reflective layer 120, the light emission angle of the light-emitting chip 210 is increased, and the brightness of the light emitted from the periphery of the light-emitting chip 210 is improved, thus improving the light emission uniformity of the lamp panel and achieving good application results.

[0061] Specifically, the reflective pattern 300 is screen-printed onto the surface of the encapsulating adhesive layer 130. The process is simple and reliable, and the cutout size and cutout ratio can be precisely controlled, resulting in good product consistency, high production efficiency, and low cost.

[0062] The backlight panel provided in this embodiment of the invention, by setting a reflective pattern 300, allows a portion of the light emitted by the light-emitting chip 210 to exit from the front of the reflective pattern 300 through the air gap in front of the light-emitting chip 210, while a portion is reflected by the reflective area to form reflected light. A portion of the reflected light is reflected by the reflective layer 120 and then exits from the air gaps and sides of the light-emitting chip 210, and another portion is reflected and exits from the sides of the light-emitting chip 210. Addressing the characteristic that the light emitted from the center of the light-emitting chip 210 is stronger than that from the periphery, this embodiment forms air gaps by creating a hollow structure in the reflective pattern 300. The gap can modulate the ratio and proportion of the air gap area, weaken the light intensity in the central area of ​​the front of the light-emitting chip 210 and increase the light intensity in the side area of ​​the light-emitting chip 210. It allows part of the light emitted by the light-emitting chip 210 to pass directly through the air gap and be emitted from the front, while part is reflected by the reflective area. This can effectively modulate the brightness above the light-emitting chip 210 (i.e., in front, referring to the front of the light emission direction), ensuring the light efficiency and brightness of the backlight panel. At the same time, under the action of the reflective pattern 300 and the reflective layer 120, the light emission angle of the light-emitting chip 210 is increased, the brightness of the light emitted from the periphery of the light-emitting chip 210 is improved, the light emission uniformity of the lamp panel is improved, and the application effect is good.

[0063] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions or improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A backlight panel, characterized in that, The backlight panel includes a substrate, a circuit layer, and multiple light-emitting chips. One side of the circuit layer is disposed on the substrate, and the light-emitting chips are disposed on the other side of the circuit layer. The backlight panel also includes an encapsulating adhesive layer and multiple reflective patterns. The encapsulating adhesive layer covers the substrate and the light-emitting chips. The reflective patterns are disposed on the upper surface of the encapsulating adhesive layer. Each reflective pattern includes multiple spaced-apart reflective units with air gaps between them. Each reflective unit includes resin and reflective particles dispersed in the resin. The reflective particle density in the central region of the reflective pattern is greater than the reflective particle density in the peripheral region of the reflective pattern. The backlight panel also includes a reflective layer disposed on the side of the circuit layer connected to the light-emitting chips. One side of the encapsulating adhesive layer covers the reflective layer and the light-emitting chips.

2. The backlight panel as described in claim 1, characterized in that, In one of the reflective patterns, the area of ​​the air gap accounts for 20% to 80% of the area of ​​the outline of the reflective pattern; And / or, the thickness of the reflective pattern is 10 to 60 μm.

3. The backlight panel as described in claim 1, characterized in that, The reflective unit includes a reflective ring located in the central region of the reflective pattern.

4. The backlight panel as described in claim 3, characterized in that, The reflective unit includes a plurality of reflective rings arranged concentrically, with a gap between adjacent reflective rings.

5. The backlight panel as described in claim 4, characterized in that, The outer periphery of the reflective ring is provided with reflective points, and the distribution density of each reflective point decreases as it moves away from the center of the reflective pattern.

6. The backlight panel as described in claim 1, characterized in that, The reflective unit includes a plurality of reflective points surrounding the center of the reflective pattern, the area of ​​which decreases as it moves away from the center of the reflective pattern.

7. The backlight panel as described in claim 1, characterized in that... The reflectivity of the reflective elements in the central region of the reflective pattern is greater than that in the reflective elements in the peripheral region of the reflective pattern.

8. The backlight panel as described in claim 7, characterized in that... The reflective units in the central region of the reflective pattern contain titanium dioxide particles, and the reflective units in the peripheral region of the reflective pattern contain silicon dioxide particles.

9. The backlight panel as described in any one of claims 1 to 8, characterized in that, The reflective pattern is formed by screen printing, and the sidewall of the reflective unit is provided with a release slope.

10. The backlight panel as described in claim 1, characterized in that, It also includes an optical film disposed above the encapsulating adhesive layer, the surface of which is printed with a diffusion pattern, and the diffusion pattern and the reflection pattern of the optical film are arranged alternately.

Images