Panel level packaging method of LED module and LED packaging module

Abstract

The application provides a panel-level packaging method of an LED module and an LED packaging module. The panel-level packaging method is used for packaging one or several LED chips of different colors, and comprises the following steps: extending each chip electrode upward to a preset plane by an additive manufacturing method; placing a circuit substrate on the preset plane; wherein the circuit substrate comprises an insulating layer, a conductive layer and a driving circuit; the circuit substrate is provided with a substrate through hole corresponding to the position of the chip electrode; extending each chip electrode along the substrate through hole and connecting the chip electrode with the conductive layer by the additive manufacturing method; and pouring glue to package each LED chip and the circuit substrate to obtain the LED packaging module. The application realizes the electrical interconnection between the LED chip and the circuit substrate by the additive manufacturing method, solves the problem that the quality of a welding spot is difficult to guarantee caused by a traditional welding process, improves the quality and reliability of the product, and can package multiple LED chips in batches, thereby improving the production efficiency.

Description

Technical Field

[0001] This application relates to the field of chip packaging technology, and in particular to a panel-level packaging method for an LED module and an LED packaging module. Background Technology

[0002] An LED (Light Emitting Diode) is a solid-state semiconductor device that uses a solid semiconductor chip as the light-emitting material. It emits photons by releasing energy through the recombination of charge carriers, directly converting electrical energy into light energy. LEDs have advantages such as high brightness, small size, high efficiency, and long lifespan, and are widely used in traffic signs, outdoor full-color displays, and other fields.

[0003] Currently, LED module packaging methods primarily employ thermal soldering processes such as solder paste bonding, eutectic bonding, and laser bonding to weld LED chips onto the circuit board surface. However, the following problems still exist: during the soldering process, it is difficult to guarantee the quality and reliability of the solder joints; furthermore, LED chips are prone to misalignment, undulation, and rotation during the soldering process, making it difficult to ensure the flatness of the light-emitting surface and the consistency of light output in the LED packaged module. Summary of the Invention

[0004] In view of the aforementioned problems, this application is made to provide a panel-level packaging method for an LED module and an LED packaging module that overcomes or at least partially solves the aforementioned problems, comprising:

[0005] A panel-level packaging method for an LED module, used to package LED chips of one or more light colors, wherein the LED chips are provided with chip electrodes; comprising:

[0006] Each chip electrode is extended upward to a predetermined plane using additive manufacturing.

[0007] A circuit board is placed on the preset plane; wherein, the circuit board includes an insulating layer, a conductive layer disposed on the surface of the insulating layer, and a driving circuit disposed on the surface of the conductive layer; the insulating layer faces the LED chip; the circuit board is provided with substrate through holes corresponding to the number of chip electrodes, and the substrate through holes correspond to the positions of the chip electrodes;

[0008] Each chip electrode is extended along the through-hole of the substrate and connected to the conductive layer by additive manufacturing.

[0009] The LED chips and the circuit board are encapsulated with potting compound to obtain an LED package module.

[0010] Preferably, the step of extending each of the chip electrodes upward to a predetermined plane by additive manufacturing includes:

[0011] Each of the LED chips is placed on the surface of the first carrier plate; wherein the electrodes of each chip face upwards;

[0012] A transition adhesive layer is laid on the surface of each LED chip; wherein, the transition adhesive layer has longitudinally extending transition through holes corresponding to the electrodes of each chip;

[0013] The chip electrodes are extended along the transition vias to the surface of the transition adhesive layer using additive manufacturing.

[0014] Preferably, the step of laying a transition adhesive layer on the surface of each of the LED chips includes:

[0015] An initial transition adhesive layer is laid on the surface of each LED chip;

[0016] The target portion inside the initial transition adhesive layer is etched away to form the transition adhesive layer; wherein the target portion is a longitudinally extending columnar structure corresponding to each of the chip electrodes.

[0017] Preferably, the step of extending each of the chip electrodes along the transition via to the surface of the transition adhesive layer by additive manufacturing includes:

[0018] A first conductive pillar is fabricated along the interior of the transition via using additive manufacturing; wherein one end of the first conductive pillar is connected to the chip electrode, and the other end extends to the surface of the transition adhesive layer.

[0019] Preferably, the step of placing the circuit board on the preset plane includes:

[0020] An initial circuit board is obtained; wherein the initial circuit board includes the insulating layer and the conductive layer disposed on the surface of the insulating layer; the initial circuit board is provided with substrate vias corresponding to the number of chip electrodes;

[0021] The initial circuit board is placed on the preset plane; wherein the insulating layer faces the LED chip; and the vias of the board correspond to the positions of the chip electrodes.

[0022] The driving circuit is connected to the conductive layer to form the circuit substrate.

[0023] Preferably, the step of placing the circuit board on the preset plane includes:

[0024] An initial circuit board is obtained; wherein the initial circuit board includes the insulating layer and the conductive layer disposed on the surface of the insulating layer; the initial circuit board is provided with substrate vias corresponding to the number of chip electrodes;

[0025] The driving circuit is connected to the conductive layer to obtain the circuit substrate;

[0026] The circuit board is placed on the preset plane; wherein the insulating layer faces the LED chip; and the through holes of the board correspond to the positions of the chip electrodes.

[0027] Preferably, the step of extending each of the chip electrodes along the through-holes of the substrate and connecting them to the conductive layer by additive manufacturing includes:

[0028] A second conductive pillar is fabricated along the interior of the through-hole of the substrate using additive manufacturing; wherein one end of the second conductive pillar is connected to the chip electrode, and the other end extends to the surface of the conductive layer.

[0029] Preferably, the step of potting and encapsulating each of the LED chips and the circuit board includes:

[0030] A first encapsulating adhesive layer is laid on the surface of each LED chip and the circuit board;

[0031] Each of the LED chips and the circuit board is flipped onto the surface of the second carrier board, and the first carrier board is removed;

[0032] The transition adhesive layer is etched away, and a second encapsulating adhesive layer is deposited on the surface of each LED chip and the circuit board.

[0033] Preferably, the additive manufacturing method includes one or more of chemical vapor deposition, physical vapor deposition, atomic layer deposition, sputtering, evaporation, electroplating, and electroless plating.

[0034] An LED packaging module prepared according to any one of the panel-level packaging methods described above includes: the LED chip, the circuit substrate, and the encapsulating adhesive layer; each of the LED chips is connected to the conductive layer; and the encapsulating adhesive layer is wrapped around the outside of each of the LED chips and the circuit substrate.

[0035] This application has the following advantages:

[0036] In the embodiments of this application, in response to the problem that the solder joint quality and reliability are difficult to guarantee in existing LED module packaging methods, this application provides a solution for achieving electrical interconnection between LED chips and circuit boards through additive manufacturing. Specifically, it is as follows: "A panel-level packaging method for an LED module, used to package one or more LED chips of different colors, wherein the LED chip is provided with chip electrodes; including: extending each of the chip electrodes upward to a preset plane through additive manufacturing; placing a circuit board on the preset plane; wherein the circuit board includes an insulating layer, a conductive layer disposed on the surface of the insulating layer, and a driving circuit disposed on the surface of the conductive layer; the insulating layer faces the LED chip; the circuit board is provided with substrate through holes corresponding to the number of chip electrodes, and the substrate through holes correspond to the positions of the chip electrodes; extending each of the chip electrodes along the substrate through holes and connecting them to the conductive layer through additive manufacturing; potting and encapsulating each of the LED chips and the circuit board to obtain an LED packaging module." The additive manufacturing method enables electrical interconnection between the LED chip and the circuit board, solving the problem of difficulty in guaranteeing solder joint quality caused by traditional welding processes, improving product quality and reliability, and enabling batch packaging of multiple LED chips, thereby improving production efficiency. Attached Figure Description

[0037] To more clearly illustrate the technical solution of this application, the drawings used in the description of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0038] Figure 1 This is a flowchart illustrating the steps of a panel-level packaging method for an LED module according to an embodiment of this application;

[0039] Figure 2 This is a flowchart illustrating a panel-level packaging method for an LED module provided in a specific implementation of this application;

[0040] Figure 3 This is a flowchart illustrating a panel-level packaging method for an LED module provided in another specific implementation of this application;

[0041] Figure 4 This is a schematic diagram of the structure of an LED packaging module provided in one embodiment of this application.

[0042] The reference numerals in the accompanying drawings are as follows:

[0043] 100, First carrier board; 200, Second carrier board; 300, LED chip; 310, Chip electrode; 320, First conductive post; 330, Second conductive post; 400, Circuit board; 410, Insulating layer; 420, Conductive layer; 430, Driving circuit; 500, Transition adhesive layer; 600, Encapsulating adhesive layer; 610, First encapsulating adhesive layer; 620, Second encapsulating adhesive layer. Detailed Implementation

[0044] To make the objectives, features, and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0045] It should be noted that, in any embodiment of this application, the panel-level packaging method is used to package one or more LED chips 300 of different colors. As one example, the LED chip 300 includes only a red LED chip. As another example, the LED chip 300 includes a red LED chip, a green LED chip, and a blue LED chip. The LED chip 300 is provided with chip electrodes 310. Specifically, the LED chip 300 is a flip chip, that is, the chip electrodes 310 are disposed on the same surface of the LED chip 300.

[0046] Reference Figure 1 This application illustrates a panel-level packaging method for an LED module according to an embodiment of the present application, comprising:

[0047] S110. Each chip electrode 310 is extended upward to a predetermined plane by additive manufacturing.

[0048] S120. Place the circuit board 400 on the preset plane; wherein, the circuit board 400 includes an insulating layer 410, a conductive layer 420 disposed on the surface of the insulating layer 410, and a driving circuit 430 disposed on the surface of the conductive layer 420; the insulating layer 410 faces the LED chip 300; the circuit board 400 is provided with substrate through holes corresponding to the number of chip electrodes 310, and the substrate through holes correspond to the positions of the chip electrodes 310;

[0049] S130, Each chip electrode 310 is extended along the through hole of the substrate and connected to the conductive layer 420 by additive manufacturing.

[0050] S140. The LED chips 300 and the circuit board 400 are encapsulated with potting compound to obtain an LED package module.

[0051] In the embodiments of this application, in view of the problem that it is difficult to guarantee the quality and reliability of solder joints in the existing LED module packaging methods, this application provides a solution for achieving electrical interconnection between LED chip 300 and circuit board 400 through additive manufacturing, specifically: "A panel-level packaging method for an LED module, used to package one or more LED chips 300 of different colors, wherein the LED chip 300 is provided with chip electrodes 310; including: extending each of the chip electrodes 310 upward to a preset plane through additive manufacturing; placing the circuit board 400 on the preset plane; wherein the circuit board..." The board 400 includes an insulating layer 410, a conductive layer 420 disposed on the surface of the insulating layer 410, and a driving circuit 430 disposed on the surface of the conductive layer 420; the insulating layer 410 faces the LED chip 300; the circuit board 400 has substrate through holes corresponding to the number of chip electrodes 310, and the positions of the substrate through holes and the chip electrodes 310 are corresponding; each chip electrode 310 extends along the substrate through holes and connects to the conductive layer 420 by additive manufacturing; each LED chip 300 and the circuit board 400 are encapsulated with potting compound to obtain an LED package module. The additive manufacturing method realizes the electrical interconnection between the LED chip 300 and the circuit board 400, solves the problem of difficult-to-guarantee solder joint quality caused by traditional welding processes, improves product quality and reliability, and allows multiple LED chips 300 to be packaged in batches, improving production efficiency.

[0052] The panel-level packaging method for an LED module in this exemplary embodiment will be further described below.

[0053] As described in step S110, each of the chip electrodes 310 is extended upward to a preset plane by additive manufacturing.

[0054] The LED chips 300 are arranged at intervals on the same horizontal plane with the chip electrodes 310 facing upwards. First conductive pillars 320 are formed on the surface of each chip electrode 310 by additive manufacturing (AM) so that each chip electrode 310 extends upwards to the preset plane.

[0055] It should be noted that additive manufacturing, also known as 3D printing, is a manufacturing technology that uses digital model files as a basis and employs software and CNC systems to deposit specialized metallic, non-metallic, or medical / biological materials layer by layer through methods such as extrusion, sintering, melting, photopolymerization, and spraying to create physical objects. Specifically, the additive manufacturing methods involved in this application can be one or more of chemical vapor deposition, physical vapor deposition, atomic layer deposition, sputtering, evaporation, electroplating, and electroless plating.

[0056] The first conductive post 320 can be made of the same conductive material as the chip electrode 310.

[0057] As described in step S120, the circuit board 400 is placed on the preset plane; wherein, the circuit board 400 includes an insulating layer 410, a conductive layer 420 disposed on the surface of the insulating layer 410, and a driving circuit 430 disposed on the surface of the conductive layer 420; the insulating layer 410 faces the LED chip 300; the circuit board 400 is provided with substrate through holes corresponding to the number of chip electrodes 310, and the substrate through holes correspond to the positions of the chip electrodes 310.

[0058] The circuit board 400 is placed on top of the LED chip 300, with the insulating layer 410 facing the LED chip 300, and the vias on the board corresponding to the positions of the chip electrodes 310. The circuit board 400 includes an initial circuit board (i.e., the insulating layer 410 and the conductive layer 420) and a driving circuit 430 disposed on the surface of the initial circuit board. In actual operation, the initial circuit board can be placed on top of the LED chip 300 first, and then the driving circuit 430 can be connected to the initial circuit board. Alternatively, the driving circuit 430 can be pre-connected to the initial circuit board, and then the circuit board 400 can be placed on top of the LED chip 300.

[0059] As described in step S130, each of the chip electrodes 310 is extended along the through-hole of the substrate and connected to the conductive layer 420 by additive manufacturing.

[0060] The second conductive pillar 330 is prepared along the through-hole of the substrate by additive manufacturing, so that each chip electrode 310 extends upward to the plane where the top of the conductive layer 420 is located and is connected to the conductive layer 420.

[0061] The second conductive post 330 can be made of the same conductive material as the chip electrode 310.

[0062] As described in step S140, each of the LED chips 300 and the circuit board 400 are encapsulated with potting compound to obtain an LED packaging module.

[0063] The LED chips 300 and the circuit board 400 are encapsulated with encapsulating adhesive to obtain the chip package.

[0064] The encapsulating adhesive includes one or more of epoxy resin, silicone, PI (Polyimide) resin, PE (Polyethylene) resin, and PT (Phenolic Triazine) resin. After curing, the encapsulating adhesive exhibits good insulation and sealing properties, providing protection and preventing the product from getting damp.

[0065] In one embodiment of this application, the specific process of "extending each of the chip electrodes 310 upward to a preset plane by additive manufacturing" can be further described in conjunction with the following description.

[0066] Each of the LED chips 300 is placed on the surface of the first carrier plate 100, with the electrodes 310 of each chip facing upwards. Specifically, the LED chips 300 are arranged at intervals on the surface of the first carrier plate 100, with the electrodes 310 of each chip facing upwards; the first carrier plate 100 can be tape, PE (Polyethylene) film, glass plate, or other flat support structure. By arranging the light-emitting surfaces of the LED chips 300 in batches on the surface of the first carrier plate 100, the problem of difficulty in ensuring the flatness of the light-emitting surface and the consistency of light output in LED packaging modules caused by traditional welding processes is solved, thereby improving the quality and reliability of the product.

[0067] A transition adhesive layer 500 is laid on the surface of each LED chip 300; wherein, the interior of the transition adhesive layer 500 has longitudinally extending transition through holes corresponding to each chip electrode 310. Specifically, the transition adhesive layer 500 is poured onto the surface of the first carrier board 100, the top of the transition adhesive layer 500 extends to a position higher than the top of each chip electrode 310, and the interior of the transition adhesive layer 500 forms longitudinally extending transition through holes that correspond one-to-one with the ends of each chip electrode 310.

[0068] Each of the chip electrodes 310 is extended along the transition via to the surface of the transition adhesive layer 500 using additive manufacturing. Specifically, a longitudinally extending first conductive post 320 is fabricated inside the transition via using additive manufacturing, such that each of the chip electrodes 310 extends from the bottom to the top of the transition via.

[0069] In one embodiment of this application, the specific process of "laying a transition adhesive layer 500 on the surface of each of the LED chips 300" can be further described in conjunction with the following description.

[0070] An initial transition adhesive layer 500 is laid on the surface of each LED chip 300. Specifically, conductive adhesive is poured onto the surface of the first carrier board 100, with the top of the conductive adhesive extending above the top of the chip electrode 310. The conductive adhesive is then dried at 60-160°C to form the initial transition adhesive layer 500. The material of the conductive transition layer is a conductive adhesive, such as epoxy resin mixed with metal powder, silicone mixed with metal powder, or a mixed adhesive mixed with metal powder. It has good conductivity and is easy to grow the chip electrode 310 along its surface by additive manufacturing.

[0071] The target portion inside the initial transition adhesive layer 500 is etched away to form the transition adhesive layer 500; wherein the target portion is a longitudinally extending columnar structure corresponding to each of the chip electrodes 310. Specifically, an etching window is formed by coating a photosensitive material and exposing and developing it to facilitate the etching away of the target portion.

[0072] In one embodiment of this application, the specific process of "etching away the target portion inside the initial transition adhesive layer 500 to form the transition adhesive layer 500" can be further described in conjunction with the following description.

[0073] A photosensitive material is coated onto the surface of the initial transition adhesive layer 500, and then exposed and developed to expose the target area of ​​the initial transition adhesive layer 500. Specifically, the photosensitive material is coated onto the surface of the initial transition adhesive layer 500, and then exposed and developed, causing the photosensitive material that has undergone photopolymerization to solidify into a photosensitive material layer, and the photosensitive material that has not undergone photopolymerization (i.e., the photosensitive material on the surface of the target area) to be washed away.

[0074] The target area is etched away to form the transition adhesive layer 500. Specifically, the target area is etched away by rapid chemical etching. Different etching solutions can be selected according to the material of the initial transition adhesive layer 500. The product is immersed in the etching solution, and the etching is observed. Once the target area is etched away, the product is immediately removed and washed with clean water to remove the etching solution.

[0075] Remove the photosensitive material. Specifically, remove the photosensitive material layer using a remover.

[0076] In one embodiment of this application, the specific process of "extending each of the chip electrodes 310 along the transition via to the surface of the transition adhesive layer 500 by additive manufacturing" can be further described in conjunction with the following description.

[0077] A first conductive post 320 is fabricated inside the transition via using additive manufacturing. One end of the first conductive post 320 is connected to the chip electrode 310, and the other end extends to the surface of the transition adhesive layer 500. Specifically, the first conductive post 320, extending longitudinally, is fabricated inside the transition via using additive manufacturing.

[0078] Remove the photosensitive material. Specifically, remove the photosensitive material layer using a remover.

[0079] The surfaces of each LED chip 300 and the transition adhesive layer 500 are ground to make the top surfaces of each first conductive post 320 and the transition adhesive layer 500 flat.

[0080] In one embodiment of this application, the specific process of "placing the circuit board 400 on the preset plane" can be further described in conjunction with the following description.

[0081] An initial circuit board is obtained; wherein the initial circuit board includes the insulating layer 410 and the conductive layer 420 disposed on the surface of the insulating layer 410; the initial circuit board is provided with substrate through holes corresponding to the number of chip electrodes 310.

[0082] The initial circuit board is placed on the preset plane; wherein the insulating layer 410 faces the LED chip 300; the substrate through-holes correspond to the positions of the chip electrodes 310. Specifically, the initial circuit board is placed on top of the LED chip 300, such that the insulating layer 410 faces the LED chip 300, and the substrate through-holes correspond to the positions of the chip electrodes 310.

[0083] The driving circuit 430 is connected to the conductive layer 420 to form the circuit board 400.

[0084] In one embodiment of this application, the specific process of "placing the circuit board 400 on the preset plane" can be further described in conjunction with the following description.

[0085] An initial circuit board is obtained; wherein the initial circuit board includes the insulating layer 410 and the conductive layer 420 disposed on the surface of the insulating layer 410; the initial circuit board is provided with substrate through holes corresponding to the number of chip electrodes 310.

[0086] The driving circuit 430 is connected to the conductive layer 420 to obtain the circuit board 400. Specifically, the driving circuit 430 and the conductive layer 420 are connected by a soldering process to form the circuit board 400.

[0087] The circuit board 400 is placed on the preset plane; wherein the insulating layer 410 faces the LED chip 300; the substrate through-holes correspond to the positions of the chip electrodes 310. Specifically, the circuit board 400 is placed on top of the LED chip 300, such that the insulating layer 410 faces the LED chip 300, and the substrate through-holes correspond to the positions of the chip electrodes 310.

[0088] In one embodiment of this application, the specific process of "extending each of the chip electrodes 310 along the through-holes of the substrate and connecting them to the conductive layer 420 by additive manufacturing" can be further described in conjunction with the following description.

[0089] A second conductive post 330 is fabricated inside the through-hole of the substrate using additive manufacturing. One end of the second conductive post 330 is connected to the first conductive post 320, and the other end extends to the surface of the conductive layer 420. Specifically, a longitudinally extending second conductive post 330 is fabricated inside the through-hole of the substrate using additive manufacturing.

[0090] In one embodiment of this application, the specific process of "potting and encapsulating each of the LED chips 300 and the circuit board 400" can be further described in conjunction with the following description.

[0091] A first encapsulating adhesive layer 610 is laid on the surface of each LED chip 300 and the circuit board 400. Specifically, colored encapsulating adhesive is poured onto the top of each LED chip 300 and the circuit board 400, with the top of the colored encapsulating adhesive extending above the top of the circuit board 400, and the colored encapsulating adhesive is dried at 60-160°C to form the first encapsulating adhesive layer 610.

[0092] Each of the LED chips 300 and the circuit board 400 is flipped onto the surface of the second carrier 200, and the first carrier 100 is removed. Specifically, each of the LED chips 300 and the circuit board 400 is flipped onto the surface of the second carrier 200, with the electrode 310 of each chip facing downwards, and the first carrier 100 is peeled off; the second carrier 200 can be tape, PE film, glass plate, or other flat support structure.

[0093] The transition adhesive layer 500 is etched away, and a second encapsulating adhesive layer 620 is deposited on the surface of each LED chip 300 and the circuit board 400. Specifically, the transition adhesive layer 500 is etched away by rapid chemical etching. Different etching solutions can be selected according to the material of the transition adhesive layer 500. The product is immersed in the etching solution, and the etching is observed. Once the transition adhesive layer 500 is etched away, it is immediately removed and washed with clean water to remove the etching solution. A transparent encapsulating adhesive is poured onto the top of each LED chip 300 and the circuit board 400, with the top of the transparent encapsulating adhesive extending above the top of the LED chip 300. The transparent encapsulating adhesive is then dried at 60-160°C to form the second encapsulating adhesive layer 620.

[0094] Reference Figure 2 In a specific implementation of this application, the LED chip 300 includes a red LED chip, a green LED chip, and a blue LED chip, wherein the LED chip 300 is provided with chip electrodes 310; the panel-level packaging method includes:

[0095] Each of the LED chips 300 is placed on the surface of the first carrier plate 100; wherein the electrodes 310 of each chip face upward;

[0096] An initial transition adhesive layer 500 is laid on the surface of each of the LED chips 300;

[0097] The target portion inside the initial transition adhesive layer 500 is etched away to form the transition adhesive layer 500; wherein, the target portion is a longitudinally extending columnar structure corresponding to each of the chip electrodes 310, and the target portion is etched away to form a transition via.

[0098] A first conductive post 320 is fabricated along the interior of the transition via by additive manufacturing; wherein one end of the first conductive post 320 is connected to the chip electrode 310, and the other end extends to the surface of the transition adhesive layer 500.

[0099] The surfaces of each LED chip 300 and the transition adhesive layer 500 are ground to make the top surfaces of each first conductive post 320 and the transition adhesive layer 500 flat.

[0100] An initial circuit board is obtained; wherein the initial circuit board includes an insulating layer 410 and a conductive layer 420 disposed on the surface of the insulating layer 410; the initial circuit board is provided with substrate vias corresponding to the number of chip electrodes 310;

[0101] The initial circuit board is placed on top of the LED chip 300; wherein the insulating layer 410 faces the LED chip 300; the through holes of the board correspond to the positions of the chip electrodes 310;

[0102] A circuit board 400 is formed by connecting a driver chip corresponding to the number of LED chips 300 to the conductive layer 420 through a welding process.

[0103] A second conductive post 330 is fabricated inside the through-hole of the substrate by additive manufacturing; wherein one end of the second conductive post 330 is connected to the first conductive post 320, and the other end extends to the surface of the conductive layer 420;

[0104] A first encapsulating adhesive layer 610 is laid on the surface of each of the LED chips 300 and the circuit board 400;

[0105] Each of the LED chips 300 and the circuit board 400 is flipped onto the surface of the second carrier 200, and the first carrier 100 is removed;

[0106] The transition adhesive layer 500 is etched away, and a second encapsulating adhesive layer 620 is laid on the surface of each LED chip 300 and the circuit board 400 to obtain an LED encapsulation module.

[0107] Reference Figure 3 In another specific implementation of this application, the LED chip 300 includes a red LED chip, a green LED chip, and a blue LED chip, wherein the LED chip 300 is provided with chip electrodes 310; the panel-level packaging method includes:

[0108] Each of the LED chips 300 is placed on the surface of the first carrier plate 100; wherein the electrodes 310 of each chip face upward;

[0109] An initial transition adhesive layer 500 is laid on the surface of each of the LED chips 300;

[0110] The target portion inside the initial transition adhesive layer 500 is etched away to form the transition adhesive layer 500; wherein, the target portion is a longitudinally extending columnar structure corresponding to each of the chip electrodes 310, and the target portion is etched away to form a transition via.

[0111] A first conductive post 320 is fabricated along the interior of the transition via by additive manufacturing; wherein one end of the first conductive post 320 is connected to the chip electrode 310, and the other end extends to the surface of the transition adhesive layer 500.

[0112] The surfaces of each LED chip 300 and the transition adhesive layer 500 are ground to make the top surfaces of each first conductive post 320 and the transition adhesive layer 500 flat.

[0113] A circuit substrate 400 is obtained; wherein, the circuit substrate 400 includes an insulating layer 410, a conductive layer 420 disposed on the surface of the insulating layer 410, and a TFT thin film driving circuit 430 formed on the surface of the conductive layer 420; the circuit substrate 400 is provided with substrate through holes corresponding to the number of chip electrodes 310.

[0114] The circuit board 400 is placed on top of the LED chip 300; wherein the insulating layer 410 faces the LED chip 300; the through holes of the board correspond to the positions of the chip electrodes 310;

[0115] A second conductive post 330 is fabricated inside the through-hole of the substrate by additive manufacturing; wherein one end of the second conductive post 330 is connected to the first conductive post 320, and the other end extends to the surface of the conductive layer 420;

[0116] A first encapsulating adhesive layer 610 is laid on the surface of each of the LED chips 300 and the circuit board 400;

[0117] Each of the LED chips 300 and the circuit board 400 is flipped onto the surface of the second carrier 200, and the first carrier 100 is removed;

[0118] The transition adhesive layer 500 is etched away, and a second encapsulating adhesive layer 620 is laid on the surface of each LED chip 300 and the circuit board 400 to obtain an LED encapsulation module.

[0119] Reference Figure 4 This illustration shows an LED packaging module prepared according to the panel-level packaging method described in any of the above embodiments, comprising: LED chips 300, a circuit board 400, and an encapsulating adhesive layer 600; each LED chip 300 is connected to the conductive layer 420; the encapsulating adhesive layer 600 wraps around each LED chip 300 and the circuit board 400. The LED packaging module exhibits good product reliability.

[0120] Although preferred embodiments of the present application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of the present application.

[0121] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0122] The panel-level packaging method and LED packaging module of the LED module provided in this application have been described in detail above. Specific examples have been used to illustrate the principle and implementation of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this application. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A panel-level packaging method for an LED module, used to package LED chips of one or more light colors, wherein, The LED chip is provided with chip electrodes; characterized in that it includes: Each chip electrode is extended upward to a predetermined plane using additive manufacturing. A circuit board is placed on the preset plane; wherein, the circuit board includes an insulating layer, a conductive layer disposed on the surface of the insulating layer, and a driving circuit disposed on the surface of the conductive layer; the insulating layer faces the LED chip; the circuit board is provided with substrate through holes corresponding to the number of chip electrodes, and the substrate through holes correspond to the positions of the chip electrodes; Each chip electrode is extended along the through-hole of the substrate and connected to the conductive layer by additive manufacturing. The LED chips and the circuit board are encapsulated with potting resin to obtain an LED package module; The step of extending each chip electrode upward to a predetermined plane by additive manufacturing includes: Each of the LED chips is placed on the surface of the first carrier plate; wherein the electrodes of each chip face upwards; A transition adhesive layer is laid on the surface of each LED chip; wherein, the transition adhesive layer has longitudinally extending transition through holes corresponding to the electrodes of each chip; Each chip electrode is extended along the transition via to the surface of the transition adhesive layer using additive manufacturing. The step of potting and encapsulating each of the LED chips and the circuit board includes: A first encapsulating adhesive layer is laid on the surface of each LED chip and the circuit board; Each of the LED chips and the circuit board is flipped onto the surface of the second carrier board, and the first carrier board is removed; The transition adhesive layer is etched away, and a second encapsulating adhesive layer is deposited on the surface of each LED chip and the circuit board.

2. The panel-level packaging method according to claim 1, characterized in that, The step of laying a transition adhesive layer on the surface of each of the LED chips includes: An initial transition adhesive layer is laid on the surface of each LED chip; The target portion inside the initial transition adhesive layer is etched away to form the transition adhesive layer; wherein the target portion is a longitudinally extending columnar structure corresponding to each of the chip electrodes.

3. The panel-level packaging method according to claim 1, characterized in that, The step of extending each of the chip electrodes along the transition via to the surface of the transition adhesive layer by additive manufacturing includes: A first conductive pillar is fabricated along the interior of the transition via using additive manufacturing; wherein one end of the first conductive pillar is connected to the chip electrode, and the other end extends to the surface of the transition adhesive layer.

4. The panel-level packaging method according to claim 1, characterized in that, The step of placing the circuit board on the preset plane includes: An initial circuit board is obtained; wherein the initial circuit board includes the insulating layer and the conductive layer disposed on the surface of the insulating layer; the initial circuit board is provided with substrate vias corresponding to the number of chip electrodes; The initial circuit board is placed on the preset plane; wherein the insulating layer faces the LED chip; and the vias of the board correspond to the positions of the chip electrodes. The driving circuit is connected to the conductive layer to form the circuit substrate.

5. The panel-level packaging method according to claim 1, characterized in that, The step of placing the circuit board on the preset plane includes: An initial circuit board is obtained; wherein the initial circuit board includes the insulating layer and the conductive layer disposed on the surface of the insulating layer; the initial circuit board is provided with substrate vias corresponding to the number of chip electrodes; The driving circuit is connected to the conductive layer to obtain the circuit substrate; The circuit board is placed on the preset plane; wherein the insulating layer faces the LED chip; and the through holes of the board correspond to the positions of the chip electrodes.

6. The panel-level packaging method according to claim 1, characterized in that, The step of extending each chip electrode along the through-hole of the substrate and connecting it to the conductive layer by additive manufacturing includes: A second conductive pillar is fabricated along the interior of the through-hole of the substrate using additive manufacturing; wherein one end of the second conductive pillar is connected to the chip electrode, and the other end extends to the surface of the conductive layer.

7. The panel-level packaging method according to claim 1, characterized in that, The additive manufacturing methods include one or more of chemical vapor deposition, physical vapor deposition, atomic layer deposition, sputtering, evaporation, electroplating, and electroless plating.

8. An LED packaging module prepared by the panel-level packaging method according to any one of claims 1-7, characterized in that, include: The LED chip, the circuit board, and the encapsulating adhesive layer; each LED chip is connected to the conductive layer. The encapsulating adhesive layer is wrapped around the outside of each LED chip and the circuit board.

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