一种去高次模介质微带天线
By optimizing the structure and placement of the metal patch in the dielectric microstrip antenna, the problem of high-order modes affecting antenna performance was solved, resulting in improved bandwidth and directivity.
CN115986414BActive Publication Date: 2026-07-17DONGGUAN HAIYUE INTELLIGENT TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- DONGGUAN HAIYUE INTELLIGENT TECH CO LTD
- Filing Date
- 2022-12-07
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
Existing microstrip antennas suffer from the problem of high-order modes affecting antenna performance.
Method used
The structure design employs a radiating metal patch and four coupled metal patches. By optimizing the shape and size of the metal patches and combining the positions of the short-circuit pillars and the transceiver feed points, the effect of eliminating higher-order modes is achieved.
Benefits of technology
The bandwidth of the microstrip antenna was improved, the influence of higher-order modes was reduced, and the directivity and radiation characteristics of the antenna were enhanced.
✦ Generated by Eureka AI based on patent content.
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Figure CN115986414B_ABST
Abstract
本申请公开了一种去高次模介质微带天线，包括介质板，介质板表面设有辐射贴片组件，介质板底面安装有振荡板，还包括短路柱子收发馈点；辐射贴片组件包括一辐射金属贴片，辐射金属贴片呈正方形结构设置，且其中一组对角分别设有一斜切角，还包括平行排布于辐射金属贴片各侧边的耦合金属贴片，耦合金属贴片呈平行四边形结构设置，且耦合金属贴片与辐射金属贴片之间设有耦合缝隙；短路柱子和收发馈点均位于辐射金属贴片上，短路柱子位于辐射金属贴片的中心位置，收发馈点位于短路柱子垂直于其中一耦合金属贴片的方向上。本申请技术方案解决了现有的微带天线存在高次模影响天线性能的问题。
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