一种连接器及信号转接平台
By using S-shaped springs and support components in the connector, the problem of high driving force required for probe connection in semiconductor testing is solved, achieving low-driving-force connection and stable electrical connection, thus improving test reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BEIJING GUANZHONG JICHUANG TECH CO LTD
- Filing Date
- 2022-12-26
- Publication Date
- 2026-07-17
AI Technical Summary
In semiconductor testing, when using test probes, a lot of pressure needs to be applied to drive all probes to connect with the carrier board, which can easily cause the carrier board to deform and affect the reliability of the test.
The connector uses a spring-loaded design, with the springs arranged in an S-shape within the connection groove. When the gold fingers are inserted, they only need to overcome a small amount of friction to complete the connection. The design of the spring deformation and friction reduces the driving force required, and the support and drive mechanism improve the electrical connection effect.
This reduces the driving force required to connect the test card and the connector, improves the stability and reliability of the electrical connection, and reduces the risk of carrier board deformation.
Smart Images
Figure CN115986458B_ABST