Method for manufacturing thick copper wiring board and thick copper wiring board

Abstract

The application provides a thick copper circuit board manufacturing method and a thick copper circuit board. The thick copper circuit board manufacturing method comprises the following steps: obtaining a glass epoxy substrate; pre-fixing a certain amount of PP sheet on the glass epoxy substrate after dust removal operation, and pre-fixing a copper foil with a thickness greater than or equal to 2 oz on the PP sheet to form a combination; performing a pressing operation on the combination; performing a digging operation at the position of the positioning hole to form a dug hole, wherein the aperture of the dug hole is 30 mil smaller than the aperture of the positioning hole, the difference between the outer aperture of the copper foil and the aperture of the positioning hole is greater than the difference between the aperture of the positioning hole and the aperture of the dug hole; performing a drilling operation on the positioning hole at the dug hole to obtain the positioning hole; and performing a copper plating operation on the thick copper circuit board semi-finished product positioning hole to make the thick copper circuit board semi-finished product positioning hole conductive. The thick copper circuit board manufacturing method has high manufacturing efficiency and good use performance.

Description

Technical Field

[0001] This invention relates to the technical field of thick copper circuit boards, and in particular to a method for manufacturing a thick copper circuit board and the thick copper circuit board itself. Background Technology

[0002] In printed circuit boards (PCBs), a layer of copper foil is bonded to a glass epoxy substrate. When the copper foil thickness is ≥2 oz (ounce; 1 oz means the average weight of copper foil per square foot is 28.35g; the average thickness of copper foil is expressed in terms of weight per unit area), the copper foil is defined as a thick copper plate. Therefore, PCBs with thick copper plates are defined as thick copper circuit boards. Thick copper circuit boards are widely used in various home appliances, high-tech products, military, medical, and other electronic devices. In existing technologies, for thick copper circuit boards, the drill bit experiences significant resistance during drilling due to the thickness of the copper foil. Furthermore, the inherent ductility of copper makes the drill bit prone to breakage under the combined effects of this resistance and the copper's inherent ductility. This necessitates frequent drill bit replacements, resulting in low drilling efficiency and consequently, low manufacturing efficiency for thick copper circuit boards. Moreover, since the copper foil is bonded to the glass epoxy substrate using PP (pre-pregnant) sheets, the bonding strength between the copper foil and the epoxy substrate gradually decreases with increasing distance. The bonding strength is greatest at the interface between the copper foil and the epoxy substrate, and then decreases progressively along the thickness of the copper foil until the end face of the copper foil facing away from the interface. At this point, the bonding strength between the copper foil and the epoxy substrate weakens. The bonding force between glass epoxy substrates is minimal. When drilling thick copper circuit boards, the drill bit first contacts the end face of the copper foil. Due to the weak bonding force between the end face of the copper foil and the glass epoxy substrate, the bonding force between the end face of the copper foil and the glass epoxy substrate cannot resist the pulling force of the drill bit during drilling. This makes it easier for the inner copper layer of the hole near the end face of the copper foil on the thick copper circuit board to be pulled out of the hole wall. As a result, the hole wall of the thick copper circuit board is rough, which is not conducive to the insertion of lead components, and thus makes the performance of the thick copper circuit board poor. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a method for manufacturing thick copper circuit boards that improves manufacturing efficiency and performance.

[0004] The objective of this invention is achieved through the following technical solution: A method for manufacturing a thick copper circuit board includes: Obtain glass epoxy resin plates; The surface of the glass epoxy board is subjected to dust removal. A fixed quantity of PP sheets is pre-fixed onto the glass epoxy board after the dust removal operation; Copper foil with a thickness greater than or equal to 2 oz is pre-fixed onto the PP sheet to form a bond; The composite material is pressed together to obtain a thick copper circuit board semi-finished product. A hole positioning operation is performed on the thick copper circuit board semi-finished product to determine the position of the positioning hole; A cut-out operation is performed at the location of the positioning hole to form a cut-out hole, wherein the diameter of the cut-out hole is 30 mil smaller than the diameter of the positioning hole, so that the difference between the outer ring diameter of the copper foil and the diameter of the positioning hole is greater than the difference between the diameter of the positioning hole and the diameter of the cut-out hole. A drilling operation is performed at the cut-out hole to obtain the positioning hole, wherein the diameter of the positioning hole is greater than or equal to 1.4 mm. A copper plating operation is performed on the positioning holes of the thick copper circuit board semi-finished product to make the positioning holes of the thick copper circuit board semi-finished product conductive. The thick copper circuit board semi-finished product after copper plating is tested to determine whether the thick copper circuit board semi-finished product meets the standards. If the thick copper circuit board semi-finished product meets the standards, the thick copper circuit board semi-finished product is cleaned to obtain the thick copper circuit board.

[0005] In one embodiment, the step of dust removal operation on the surface of the glass epoxy board specifically involves using a vacuum cleaner to remove dust from the surface of the glass epoxy board.

[0006] In one embodiment, the step of pressing the assembly specifically involves using a pressure cooker to press the assembly.

[0007] In one embodiment, the step of locating holes in the thick copper circuit board semi-finished product includes: covering the copper foil of the thick copper circuit board semi-finished product with a dry film; exposing the dry film to reveal the holes on the copper foil, thereby completing the hole location on the thick copper circuit board semi-finished product and determining the position of the positioning holes.

[0008] In one embodiment, the step of performing a scooping operation at the location of the positioning hole specifically involves controlling the drilling device to perform a scooping operation at the location of the positioning hole.

[0009] In one embodiment, the step of controlling the drilling device to perform a hollowing operation at the location of the positioning hole includes: fixing the thick copper circuit board semi-finished product to the operating table of the drilling device; selecting a first drill bit with a diameter 30 mil smaller than that of the positioning hole and assembling it on the drilling device; controlling the first drill bit of the drilling device to drill and remove the positioning hole to obtain the hollowed-out hole, such that the diameter of the hollowed-out hole is 30 mil smaller than that of the positioning hole.

[0010] In one embodiment, the step of drilling a positioning hole at the cut-out hole to obtain the positioning hole includes: shutting down the drilling device and removing the first drill bit from the drilling device; selecting a second drill bit with the same diameter as the positioning hole and assembling it into the drilling device; and controlling the second drill bit of the drilling device to perform drilling at the cut-out hole to obtain the positioning hole.

[0011] In one embodiment, a needle gauge is used to measure the positioning hole.

[0012] In one embodiment, the step of inspecting the thick copper circuit board semi-finished product after copper plating to determine whether the thick copper circuit board semi-finished product meets the standards includes: inspecting the external dimensions of the thick copper circuit board semi-finished product after copper plating; inspecting the appearance of the thick copper circuit board semi-finished product after copper plating; and inspecting the hole metallization quality status of the holes on the thick copper circuit board semi-finished product after copper plating.

[0013] A thick copper circuit board is manufactured using the thick copper circuit board manufacturing method described in any of the above embodiments.

[0014] Compared with the prior art, the present invention has at least the following advantages: 1. By performing a hollowing-out operation at the location of the positioning hole, the copper foil on the thick copper circuit board semi-finished product is removed to form a hollowing-out hole. The positioning hole is then drilled at the hollowing-out hole. When the positioning hole is obtained, the drill bit experiences less resistance under the action of the hollowing-out hole, resulting in less resistance when drilling the thick copper circuit board. At the same time, the hollowing-out operation destroys the ductility of the copper foil itself, thus reducing the impact of resistance and the ductility of the copper foil on the drill bit during drilling. This makes the drill bit less likely to break, thus reducing the need for operators to frequently change drill bits when drilling thick copper circuit boards. Consequently, the drilling efficiency of thick copper circuit boards is higher, leading to higher production efficiency. 2. Because the drilling operation is performed at the location of the positioning hole to form a cut-out hole, the resistance experienced by the drill bit under the action of the cut-out hole is small, resulting in a smaller pulling force of the drill bit during drilling. At the same time, the difference between the outer diameter of the copper foil and the diameter of the positioning hole is greater than the difference between the diameter of the positioning hole and the diameter of the cut-out hole. This makes the bonding force between the end face of the copper foil and the glass epoxy board greater than the pulling force of the drill bit during drilling under the action of the cut-out hole. As a result, the bonding force between the end face of the copper foil and the glass epoxy board is sufficient to resist the pulling force of the drill bit during drilling. This makes it more difficult for the inner copper layer of the hole near the end face of the copper foil on the thick copper circuit board to be pulled out of the hole wall. This makes the hole wall of the hole on the thick copper circuit board flatter, which facilitates the insertion of lead components, and thus makes the performance of the thick copper circuit board better. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 A flowchart illustrating a method for manufacturing a thick copper circuit board according to one embodiment; Figure 2 This is a schematic diagram of the cut-out hole structure on a thick copper circuit board according to one embodiment. Figure 3 This is a schematic diagram of the cut-out hole structure on a thick copper circuit board according to one embodiment. Figure 4 This is a schematic diagram of the structure of a hole cut out on a thick copper circuit board according to one embodiment. Detailed Implementation

[0017] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0018] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0020] This invention provides a method for manufacturing a thick copper circuit board, comprising: obtaining a glass epoxy board; performing a dust removal operation on the surface of the glass epoxy board; pre-fixing a predetermined amount of PP sheet onto the dust-removed glass epoxy board; pre-fixing copper foil with a copper thickness greater than or equal to 2 oz onto the PP sheet to form a composite; performing a pressing operation on the composite to obtain a thick copper circuit board semi-finished product; performing a hole positioning operation on the thick copper circuit board semi-finished product to determine the position of the positioning holes; performing a hollowing operation at the position of the positioning holes to form hollowed-out holes, wherein the diameter of the hollowed-out holes is 30 mil smaller than the diameter of the positioning holes (Malfunction Indicator). Lamp (a unit of length, 1 mil = 0.0254 mm) is used to make the difference between the outer diameter of the copper foil and the diameter of the positioning hole greater than the difference between the diameter of the positioning hole and the diameter of the cut-out hole. A drilling operation is performed at the cut-out hole to obtain the positioning hole, the diameter of which is greater than or equal to 1.4 mm. Copper plating is performed on the positioning holes of the thick copper circuit board semi-finished product to make them conductive. The thick copper circuit board semi-finished product after copper plating is inspected to determine if it meets the standards. If it meets the standards, the thick copper circuit board semi-finished product is cleaned to obtain the thick copper circuit board.

[0021] The aforementioned method for manufacturing thick copper circuit boards involves a hollowing-out operation at the location of the positioning hole. This hollowing-out operation removes the copper foil from the semi-finished thick copper circuit board, creating a hollowed-out hole. The positioning hole is then drilled at this hollowed-out hole. This reduces the resistance experienced by the drill bit when drilling through the hollowed-out hole, resulting in less resistance during drilling. Simultaneously, the hollowing-out operation disrupts the ductility of the copper foil, further minimizing the impact of resistance and ductility on the drill bit during drilling. This makes the drill bit less prone to breakage, reducing the need for frequent drill bit replacements and improving the drilling efficiency of thick copper circuit boards, ultimately leading to higher overall manufacturing efficiency. Because the drilling operation is performed at the location of the positioning hole to form a cut-out hole, the resistance experienced by the drill bit under the action of the cut-out hole is small, resulting in a smaller pulling force of the drill bit during drilling. At the same time, the difference between the outer diameter of the copper foil and the diameter of the positioning hole is greater than the difference between the diameter of the positioning hole and the diameter of the cut-out hole. This makes the bonding force between the end face of the copper foil and the glass epoxy board greater than the pulling force of the drill bit during drilling under the action of the cut-out hole. As a result, the bonding force between the end face of the copper foil and the glass epoxy board is sufficient to resist the pulling force of the drill bit during drilling. This makes it more difficult for the inner copper layer of the hole near the end face of the copper foil on the thick copper circuit board to be pulled out of the hole wall. This makes the hole wall of the hole on the thick copper circuit board flatter, which facilitates the insertion of lead components, and thus makes the performance of the thick copper circuit board better.

[0022] To better understand the technical solution and beneficial effects of the present invention, the present invention will be further described in detail below with reference to specific embodiments: like Figures 1 to 2 As shown, an embodiment of the method for manufacturing a thick copper circuit board is used to obtain a thick copper circuit board 10. Further, the method for manufacturing a thick copper circuit board includes some or all of the following steps: S101, Obtain glass epoxy plate 100.

[0023] In this embodiment, the glass epoxy board 100 is cut to obtain a glass epoxy board 100 of suitable size and shape.

[0024] S103, perform a dust removal operation on the surface of the glass epoxy board 100.

[0025] In this embodiment, a dust removal operation is performed on the surface of the glass epoxy board 100 to remove the dust adhering to the surface of the glass epoxy board 100, thereby improving the adhesion of the glass epoxy board 100 surface.

[0026] S105, a fixed quantity of PP sheet 200 is pre-fixed onto the glass epoxy board 100 after the dust removal operation.

[0027] In this embodiment, a fixed amount of PP sheet 200 and glass epoxy board 100 are stacked together.

[0028] S107, a copper foil 300 with a copper thickness greater than or equal to 2 oz is pre-fixed onto the PP sheet 200 to form a bond.

[0029] In this embodiment, the glass epoxy board 100, PP sheet 200 and copper foil 300 are stacked together to form a composite, so that the composite can be used for subsequent operations, thereby improving the manufacturing efficiency of the thick copper circuit board 10.

[0030] S109, the composite is pressed to obtain a thick copper circuit board semi-finished product.

[0031] In this embodiment, the composite is subjected to high-temperature and high-pressure pressing to melt the PP sheet 200, thereby increasing the bonding force between the copper foil 300 and the glass epoxy board 100.

[0032] S111, Perform hole positioning operation on the thick copper circuit board semi-finished product to determine the position of the positioning hole.

[0033] In this embodiment, a hole positioning operation is performed on the thick copper circuit board semi-finished product to determine the position of the positioning hole 120 on the thick copper circuit board semi-finished product, thereby improving the manufacturing efficiency of the thick copper circuit board 10.

[0034] S113, a cut-out operation is performed at the position of the positioning hole 120 to form a cut-out hole 110, wherein the diameter of the cut-out hole is 30 mil smaller than the diameter of the positioning hole 120, so that the difference between the diameter of the outer ring 130 of the copper foil 300 and the diameter of the positioning hole 120 is greater than the difference between the diameter of the positioning hole 120 and the diameter of the cut-out hole 110.

[0035] In this embodiment, 30mil = 0.762mm, meaning the diameter of the cut-out hole 110 is 0.762mm smaller than the diameter of the positioning hole 120. It can be understood that the difference between the diameter of the positioning hole 120 and the diameter of the cut-out hole 110 is 0.762mm. Therefore, the difference between the diameter of the outer ring 130 of the copper foil 300 and the diameter of the positioning hole 120 is greater than 0.762mm. Wherein, the diameter of the positioning hole 120 that needs to be cut out is ≥1.4mm, then the diameter of the outer ring 130 of the copper foil 300 needs to be greater than 2.162mm.

[0036] S115, Drilling operation is performed at the cut-out hole to obtain the positioning hole, the diameter of the positioning hole is greater than or equal to 1.4mm.

[0037] In this embodiment, a drilling operation is performed at the cut-out hole to obtain the required positioning hole 120.

[0038] S117, perform copper plating on the positioning hole 120 of the thick copper circuit board semi-finished product to make the positioning hole 120 of the thick copper circuit board semi-finished product conductive.

[0039] In this embodiment, copper plating is performed on the positioning holes 120 of the thick copper circuit board semi-finished product to make the positioning holes 120 conductive, thereby improving the performance of the thick copper circuit board 10.

[0040] S119, Perform an inspection operation on the thick copper circuit board semi-finished product after copper plating to determine whether the thick copper circuit board semi-finished product meets the standards.

[0041] In this embodiment, the thick copper circuit board semi-finished product after the copper plating operation is inspected to determine whether the thick copper circuit board semi-finished product meets the standard, thereby improving the pass rate of the thick copper circuit board semi-finished product; if the thick copper circuit board semi-finished product is determined to be substandard, it is scrapped.

[0042] S121, if the thick copper circuit board semi-finished product meets the standard, the thick copper circuit board semi-finished product is cleaned to obtain the thick copper circuit board 10.

[0043] In this embodiment, the thick copper circuit board semi-finished product is cleaned to remove the debris generated during drilling. After the thick copper circuit board semi-finished product is dried, the thick copper circuit board 10 is obtained.

[0044] The aforementioned method for manufacturing thick copper circuit boards involves a hollowing-out operation at the positioning hole 120, which removes the copper foil 300 from the semi-finished thick copper circuit board to form a hollowing-out hole 110. Drilling of the positioning hole 120 at this hollowing-out hole reduces the resistance experienced by the drill bit under the action of the hollowing-out hole 110, thus minimizing resistance during drilling of the thick copper circuit board 10. Simultaneously, the hollowing-out operation disrupts the ductility of the copper foil 300, further reducing the resistance and ductility of the copper foil during drilling, making the drill bit less prone to breakage. This eliminates the need for frequent drill bit replacements, resulting in higher drilling efficiency for the thick copper circuit board 10 and consequently, higher manufacturing efficiency. Because the drilling operation is performed at the location of the positioning hole 120 to form the drill hole 110, the resistance experienced by the drill bit under the action of the drill hole 110 is small, resulting in a smaller pulling force of the drill bit during drilling. At the same time, the difference between the diameter of the outer ring 130 of the copper foil 300 and the diameter of the positioning hole 120 is greater than the difference between the diameter of the positioning hole 120 and the diameter of the drill hole 110. This makes the bonding force between the end face of the copper foil 300 and the glass epoxy board 100 greater than the pulling force of the drill bit during drilling under the action of the drill hole 110. As a result, the bonding force between the end face of the copper foil 300 and the glass epoxy board 100 is sufficient to resist the pulling force of the drill bit during drilling. This makes it more difficult for the inner copper layer of the hole on the thick copper circuit board 10 near the end face of the copper foil 300 to be pulled out of the hole wall. This makes the hole wall on the thick copper circuit board 10 flatter, which facilitates the insertion of lead components, and thus makes the performance of the thick copper circuit board 10 better.

[0045] In one embodiment, the step of dust removal from the surface of the glass epoxy board 100 specifically involves using a vacuum cleaner to remove dust from the surface of the glass epoxy board 100. In this embodiment, the vacuum cleaner removes the dust from the surface of the glass epoxy board 100, thus completing the dust removal operation and resulting in better surface adhesion of the glass epoxy board 100.

[0046] In one embodiment, the pressing operation of the assembly specifically involves pressing the assembly using a pressure cooker. In this embodiment, the assembly is pressed in a pressure cooker to obtain a thick copper circuit board semi-finished product. The thick copper circuit board semi-finished product is then removed from the pressure cooker, and excess edge material is trimmed to improve the appearance of the thick copper circuit board 10.

[0047] In one embodiment, the step of locating holes in the thick copper circuit board semi-finished product includes: covering the copper foil 300 of the thick copper circuit board semi-finished product with a dry film; exposing the dry film to reveal the holes on the copper foil 300, thereby completing the hole location on the thick copper circuit board semi-finished product and determining the position of the positioning holes, so that the position of the positioning holes on the thick copper circuit board semi-finished product is determined, thereby making the production efficiency of the thick copper circuit board 10 higher.

[0048] In one embodiment, the step of performing the scooping operation at the location of the positioning hole 120 specifically involves controlling the drilling device to perform the scooping operation at the location of the positioning hole 120. In this embodiment, the positioning hole 120 is scooped out to form a scooping hole 110 inside the positioning hole 120. The scooping hole 110 is a through hole, which reduces the resistance encountered by the drilling device when drilling the positioning hole 120.

[0049] In one embodiment, the step of controlling the drilling device to perform the hollowing operation at the location of the positioning hole 120 includes: fixing the thick copper circuit board semi-finished product to the operating table of the drilling device; selecting a first drill bit with a diameter 30 mil smaller than that of the positioning hole 120 and assembling it on the drilling device; controlling the first drill bit of the drilling device to drill and remove the positioning hole 120 to obtain the hollowing hole 110, such that the diameter of the hollowing hole 110 is 30 mil smaller than that of the positioning hole 120, so that the drilling resistance of the drilling device on the positioning hole 120 under the action of the hollowing hole 110 is small, thereby making the production efficiency of the thick copper circuit board 10 higher.

[0050] In one embodiment, the step of drilling a positioning hole 120 at the cut-out hole to obtain the positioning hole includes: closing the drilling device and removing the first drill bit from the drilling device; selecting a second drill bit with the same diameter as the positioning hole 120 and assembling it into the drilling device; controlling the second drill bit of the drilling device to perform drilling at the cut-out hole to obtain the positioning hole 120, so that the resistance encountered by the second drill bit during drilling is small, thereby making the production efficiency of the thick copper circuit board 10 higher.

[0051] In one embodiment, a pin gauge is used to measure the positioning holes 120 so that the operator can obtain the diameter of all positioning holes 120, thereby improving the performance of the thick copper circuit board 10.

[0052] In one embodiment, the step of inspecting the thick copper circuit board semi-finished product after copper plating to determine whether it meets the standards includes: performing dimensional inspection on the thick copper circuit board semi-finished product after copper plating; performing visual inspection on the thick copper circuit board semi-finished product after copper plating; and performing hole metallization quality inspection on the holes on the thick copper circuit board semi-finished product after copper plating. In this embodiment, the thick copper circuit board 10 is considered a qualified product only after passing the dimensional inspection, visual inspection, and hole metallization quality inspection in sequence, resulting in a better product quality for the thick copper circuit board 10.

[0053] It is understandable that by using the first drill bit of the drilling equipment to open the positioning hole 120, an open hole 110 is formed on the inner side of the positioning hole 120. This reduces the resistance encountered by the second drill bit of the drilling equipment when drilling the thick copper circuit board semi-finished product. The open hole 110 is a through hole.

[0054] However, due to the limited length of the drill bit in the drilling equipment, sometimes the drill bit length is less than the thickness of the copper foil (300mm), resulting in the hole 110 not being fully penetrated and requiring a secondary operation. This leads to low production efficiency of the hole 110. To improve the production efficiency of the hole 110, the production method of the hole 110 includes some or all of the following steps: Furthermore, such as Figure 3 As shown, let the thickness of the copper foil 300 be h, and the diameter of the hole 110 be r. First, fix the thick copper circuit board semi-finished product on the operating table of the drilling equipment; second, select the first drill bit and assemble it on the drilling equipment. The diameter of the first drill bit is r. Control the first drill bit of the drilling equipment to drill and remove the positioning hole 120 to form the first stepped hole. The drilling depth of the first drill bit is h / 3. Next, shut down the drilling equipment, remove the first drill bit, select the second drill bit and assemble it into the drilling equipment. The diameter of the second drill bit is 2r / 3. Control the second drill bit of the drilling equipment to drill away the first stepped hole to form the second stepped hole. The drilling depth of the second drill bit is h / 3. Finally, the drilling equipment is shut down again, the second drill bit is removed, and the third drill bit is selected and installed on the drilling equipment. The diameter of the third drill bit is r / 3. The third drill bit is controlled to drill and remove the second stepped hole to form the third through hole. The drilling depth of the third drill bit is h / 3, so that the first stepped hole, the second stepped hole and the third through hole are connected in sequence to form the cut hole 110. The cut hole 110 is made in one step through segmented processing, which makes the production efficiency of the cut hole 110 high.

[0055] Furthermore, the diameter ratio of the first step hole, the second step hole, and the third via is 3:2:1, which makes the resistance encountered by the drill bit less as it drills deeper, making it less likely for the drill bit to break, and thus making the production efficiency of the thick copper circuit board 10 higher.

[0056] like Figure 4 As shown, further, below the copper foil 300 is a glass epoxy board 100. When the thickness of the drill bit is less than the thickness of the copper foil 300, but only h / 10 of the thickness remains to penetrate the copper foil 300, the drill bit of the control drill bit device is used to perform drilling to form a hole 110. The hole 110 does not need to penetrate the copper foil 300. At this time, the hole 110 is a blind hole.

[0057] Furthermore, before carrying out the scooping operation, it is necessary to measure the length of the drill bit and the thickness of the copper foil 300 to obtain the length values ​​of the drill bit and the thickness values ​​of the copper foil 300; secondly, based on the length values ​​of the drill bit and the thickness values ​​of the copper foil 300, it is necessary to determine which method to use for the scooping operation. Furthermore, if the length of the drill bit is greater than the thickness of the copper foil (300), then the method of creating a through hole (110) is adopted. Furthermore, if the length of the drill bit is less than or equal to the thickness of the copper foil 300, but the remaining uncut copper foil 300 thickness is less than or equal to h / 10, then the method of making the cut hole 110 a blind hole is adopted. Furthermore, if the length of the drill bit is less than the thickness of the copper foil 300, and the remaining uncut copper foil 300 thickness is greater than h / 10, then the segmented processing method for making the cut hole 110 is adopted. Under the guarantee of these three conditions, the production efficiency of the cut hole 110 is relatively high.

[0058] Furthermore, in the three drilling processes, after each drilling, the method for making the hole 110 also includes: blowing air into the hole after drilling to remove debris and dust from the hole.

[0059] Specifically, after the drill bit equipment is shut down for the first time, the air nozzle of the air blowing device is aimed at the first step hole so that the debris and dust in the first step hole are blown away, which facilitates the processing of the second drill bit and improves the production efficiency of the hole 110. After shutting down the drill bit equipment for the second time, the air nozzle of the air blowing device is aimed at the second step hole so that the debris and dust in the second step hole are blown away, which facilitates the processing of the third drill bit and improves the production efficiency of the hole 110. Finally, after shutting down the drill bit equipment for the third time, aim the air nozzle of the air blowing device at the third through hole to blow away the debris and dust in the third through hole, thereby cleaning up all the debris and dust in the hollow hole 110.

[0060] It should be noted that the aperture mentioned in this invention refers to the diameter.

[0061] This invention also provides a thick copper circuit board 10, which is manufactured using the thick copper circuit board manufacturing method described in any of the above embodiments. In one embodiment, the manufacturing method of the thick copper circuit board includes: obtaining a glass epoxy board 100; performing a dust removal operation on the surface of the glass epoxy board 100; pre-fixing a fixed amount of PP sheet 200 onto the dust-removed glass epoxy board 100; pre-fixing a copper foil 300 with a copper thickness greater than or equal to 2 oz onto the PP sheet 200 to form a composite; performing a pressing operation on the composite to obtain a thick copper circuit board semi-finished product; performing a hole positioning operation on the thick copper circuit board semi-finished product to determine the position of the positioning hole; performing a hollowing operation at the position of the positioning hole 120 to form a hollowing hole 110, wherein the diameter of the hollowing hole is 30 mm smaller than the diameter of the positioning hole 120. The diameter of the copper foil 300 is mil, such that the difference between the outer ring 130 aperture and the positioning hole 120 is greater than the difference between the positioning hole 120 aperture and the cut-out hole 110 aperture; a drilling operation is performed on the positioning hole 120 at the cut-out hole to obtain the positioning hole, the aperture of the positioning hole being greater than or equal to 1.4mm; copper plating is performed on the positioning hole 120 of the thick copper circuit board semi-finished product to make the positioning hole 120 conductive; the thick copper circuit board semi-finished product after copper plating is inspected to determine whether the thick copper circuit board semi-finished product meets the standard; if the thick copper circuit board semi-finished product meets the standard, the thick copper circuit board semi-finished product is cleaned to obtain the thick copper circuit board 10.

[0062] The aforementioned method for manufacturing thick copper circuit boards involves a hollowing-out operation at the positioning hole 120, which removes the copper foil 300 from the semi-finished thick copper circuit board to form a hollowing-out hole 110. Drilling of the positioning hole 120 at this hollowing-out hole reduces the resistance experienced by the drill bit under the action of the hollowing-out hole 110, thus minimizing resistance during drilling of the thick copper circuit board 10. Simultaneously, the hollowing-out operation disrupts the ductility of the copper foil 300, further reducing the resistance and ductility of the copper foil during drilling, making the drill bit less prone to breakage. This eliminates the need for frequent drill bit replacements, resulting in higher drilling efficiency for the thick copper circuit board 10 and consequently, higher manufacturing efficiency. Because the drilling operation is performed at the location of the positioning hole 120 to form the drill hole 110, the resistance experienced by the drill bit under the action of the drill hole 110 is small, resulting in a smaller pulling force of the drill bit during drilling. At the same time, the difference between the diameter of the outer ring 130 of the copper foil 300 and the diameter of the positioning hole 120 is greater than the difference between the diameter of the positioning hole 120 and the diameter of the drill hole 110. This makes the bonding force between the end face of the copper foil 300 and the glass epoxy board 100 greater than the pulling force of the drill bit during drilling under the action of the drill hole 110. As a result, the bonding force between the end face of the copper foil 300 and the glass epoxy board 100 is sufficient to resist the pulling force of the drill bit during drilling. This makes it more difficult for the inner copper layer of the hole on the thick copper circuit board 10 near the end face of the copper foil 300 to be pulled out of the hole wall. This makes the hole wall on the thick copper circuit board 10 flatter, which facilitates the insertion of lead components, and thus makes the performance of the thick copper circuit board 10 better.

[0063] Compared with the prior art, the present invention has at least the following advantages: 1. Because the copper foil 300 on the thick copper circuit board semi-finished product is removed by the hollowing operation at the positioning hole 120 to form the hollowing hole 110, and the positioning hole 120 is drilled at the hollowing hole, the resistance encountered by the drill bit under the action of the hollowing hole 110 is small when the positioning hole 120 is obtained. This reduces the resistance encountered by the drill bit when drilling the thick copper circuit board 10. At the same time, the hollowing operation destroys the ductility of the copper foil 300 itself, so the resistance encountered by the drill bit and the influence of the ductility of the copper foil 300 itself are smaller when drilling, making it more difficult for the drill bit to break. This means that the operator does not need to frequently change the drill bit when drilling the thick copper circuit board 10, thus making the drilling efficiency of the thick copper circuit board 10 higher, and consequently the manufacturing efficiency of the thick copper circuit board 10 higher.

[0064] 2. Because the drilling operation is performed at the location of the positioning hole 120 to form the drill hole 110, the resistance experienced by the drill bit under the action of the drill hole 110 is small, resulting in a smaller pulling force of the drill bit during drilling. At the same time, the difference between the diameter of the outer ring 130 of the copper foil 300 and the diameter of the positioning hole 120 is greater than the difference between the diameter of the positioning hole 120 and the diameter of the drill hole 110. This makes the bonding force between the end face of the copper foil 300 and the glass epoxy board 100 greater than the pulling force of the drill bit during drilling under the action of the drill hole 110. As a result, the bonding force between the end face of the copper foil 300 and the glass epoxy board 100 is sufficient to resist the pulling force of the drill bit during drilling. This makes it more difficult for the inner copper layer of the hole on the thick copper circuit board 10 near the end face of the copper foil 300 to be pulled out of the hole wall. This makes the hole wall on the thick copper circuit board 10 flatter, which facilitates the insertion of lead components, and thus makes the performance of the thick copper circuit board 10 better. The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method for manufacturing a thick copper circuit board, characterized in that, include: Obtain glass epoxy resin plates; The surface of the glass epoxy board is subjected to dust removal. A fixed quantity of PP sheets is pre-fixed onto the glass epoxy board after the dust removal operation; Copper foil with a thickness greater than or equal to 2 oz is pre-fixed onto the PP sheet to form a bond; The composite material is pressed together to obtain a thick copper circuit board semi-finished product. A hole positioning operation is performed on the thick copper circuit board semi-finished product to determine the position of the positioning hole; The length of the drill bit and the thickness of the copper foil are measured to obtain the length values ​​of the drill bit and the thickness values ​​of the copper foil. The method of opening the copper foil is determined based on the length of the drill bit and the thickness of the copper foil. A cut-out operation is performed at the location of the positioning hole to form a cut-out hole, wherein the diameter of the cut-out hole is 30 mil smaller than the diameter of the positioning hole, so that the difference between the outer ring diameter of the copper foil and the diameter of the positioning hole is greater than the difference between the diameter of the positioning hole and the diameter of the cut-out hole. A drilling operation is performed at the cut-out hole to obtain the positioning hole, wherein the diameter of the positioning hole is greater than or equal to 1.4 mm. A copper plating operation is performed on the positioning holes of the thick copper circuit board semi-finished product to make the positioning holes of the thick copper circuit board semi-finished product conductive. The thick copper circuit board semi-finished product after copper plating is tested to determine whether the thick copper circuit board semi-finished product meets the standards. If the thick copper circuit board semi-finished product meets the standard, the thick copper circuit board semi-finished product is cleaned to obtain the thick copper circuit board. The specific steps for creating the cut-out hole at the location of the positioning hole are as follows: The drill bit device is controlled to perform a scooping operation at the position of the positioning hole, so that the positioning hole is scooped out by the first drill bit of the drill bit device, so that the scooping hole is formed on the inner side of the positioning hole. The steps for controlling the drilling equipment to perform the scooping operation at the location of the positioning hole include: The thick copper circuit board semi-finished product is fixed to the operating table of the drilling equipment; A first drill bit with a diameter 30 mil smaller than that of the positioning hole is selected and assembled into the drilling device; The first drill bit of the drilling device is controlled to drill away from the position of the positioning hole to obtain the cut-out hole, and the diameter of the cut-out hole is 30 mil smaller than the diameter of the positioning hole. The step of controlling the first drill bit of the drilling device to drill away from the position of the positioning hole to obtain the cut-out hole includes: Let the thickness of the copper foil be h, the diameter of the hole be r, the first drill bit be the first drill bit, and the diameter of the first drill bit be r. The first drill bit of the drilling device is controlled to drill and remove the positioning hole to form a first stepped hole; wherein, the drilling depth of the first drill bit is h / 3. The drilling device is shut down, the first drill bit is removed, and the air nozzle of the air blowing device is simultaneously aligned with the first stepped hole to blow air into the first stepped hole. A second drill bit is selected and assembled into the drilling device. The diameter of the second drill bit is 2r / 3. The second drill bit of the drilling device is controlled to drill and remove the first stepped hole to form a second stepped hole. The drilling depth of the second drill bit is h / 3. The drilling device is shut down again, the second drill bit is removed, and the air nozzle of the air blowing device is simultaneously aligned with the second stepped hole to blow air into the second stepped hole. A third drill bit is selected and installed on the drilling device. The diameter of the third drill bit is r / 3. The third drill bit of the drilling device is controlled to drill and remove material from the second stepped hole to form a third through hole. The first stepped hole, the second stepped hole, and the third through hole are connected in sequence to form the cut-out hole. The drilling depth of the third drill bit is h / 3. The drill bit device is shut off for the third time, and the air nozzle of the air blowing device is aimed at the third through hole to perform an air blowing operation on the third through hole; The step of determining which method to use for the opening operation based on the length of the drill bit and the thickness of the copper foil includes: If the length of the drill bit is greater than the thickness of the copper foil, then the hole is made as a through hole. If the length of the drill bit is less than or equal to the thickness of the copper foil, but the remaining uncut copper foil thickness is less than or equal to h / 10, then the cut hole is a blind hole. If the length of the drill bit is less than the thickness of the copper foil, and the remaining uncut copper foil thickness is greater than h / 10, then the method of creating the cut hole in segments is adopted.

2. The method for manufacturing a thick copper circuit board according to claim 1, characterized in that, The specific steps for dust removal from the surface of the glass epoxy board are as follows: The surface of the glass epoxy board is cleaned using a vacuum cleaner.

3. The method for manufacturing a thick copper circuit board according to claim 1, characterized in that, The specific steps for performing the pressing operation on the composite are as follows: The combined body is pressed together using a pressure cooker.

4. The method for manufacturing a thick copper circuit board according to claim 1, characterized in that, The steps for locating holes in the thick copper circuit board semi-finished product include: A dry film is applied to the copper foil of the thick copper circuit board semi-finished product; The dry film is exposed to reveal the hole positions on the copper foil, thereby completing the hole positioning on the thick copper circuit board semi-finished product and determining the position of the positioning hole.

5. The method for manufacturing a thick copper circuit board according to claim 1, characterized in that, The steps of drilling a positioning hole at the cut-out hole to obtain the positioning hole include: Shut down the drill bit device and remove the first drill bit from the drill bit device; A second drill bit with the same diameter as the positioning hole is selected and assembled into the drilling device; The second drill bit of the drilling device is controlled to drill and remove material at the cut-out hole to obtain the positioning hole.

6. The method for manufacturing a thick copper circuit board according to claim 5, characterized in that, The positioning hole was measured using a pin gauge.

7. The method for manufacturing a thick copper circuit board according to claim 1, characterized in that, The steps for inspecting the thick copper circuit board semi-finished product after copper plating to determine whether the thick copper circuit board semi-finished product meets the standards include: The external dimensions of the thick copper circuit board semi-finished product after copper plating are inspected. Perform visual inspection on the thick copper circuit board semi-finished product after copper plating. The hole metallization quality status of the holes on the thick copper circuit board semi-finished product after copper plating is inspected.

8. A thick copper circuit board, characterized in that, It is manufactured using the method described in any one of claims 1 to 7 for the production of thick copper circuit boards.

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