Cutting apparatus and method of manufacturing cut product

Abstract

A cutting apparatus includes a cutting mechanism. The cutting mechanism has a blade for cutting a cutting object. The blade has a first side surface and a second side surface. The cutting apparatus also includes a first pressing mechanism and a second pressing mechanism. The first pressing mechanism is disposed at a position opposite the first side surface. The second pressing mechanism is disposed at a position opposite the second side surface. The first pressing mechanism and the second pressing mechanism each press the cutting object from above toward below. When a half-cut is applied, the relative positional relationship of each of the first pressing mechanism and the second pressing mechanism to the cutting object changes in the same manner as the relative positional relationship of the cutting mechanism to the cutting object.

Description

Technical Field

[0001] This invention relates to a cutting device and a method for manufacturing a cut product. Background Technology

[0002] Japanese Patent Application Publication No. 2008-112961 (Patent Document 1) discloses a method for manufacturing a semiconductor device. In this method, a half-cut is performed using a dicing saw, thereby forming grooves on a lead frame. Subsequently, a plating layer is formed on the grooves, and the lead frame is cut along the grooves using a narrow dicing saw. This yields a semiconductor device cut into individual sheets (see Patent Document 1).

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2008-112961 Summary of the Invention

[0006] (The problem the invention aims to solve)

[0007] When cutting objects such as wire frames, warping may occur. If a partial cut is applied to the object while it is being cut along its length, the depth of the groove formed on the object will be inconsistent. Patent Document 1 does not disclose a solution to this problem.

[0008] The present invention was made to solve this problem, and its purpose is to provide a cutting device and a method for manufacturing a cut-off article, which can reduce the deviation in the depth of the groove formed on the object to be cut by a semi-cut.

[0009] (Technical solution used to solve the problem)

[0010] According to one embodiment of the present invention, a cutting device is configured to apply a partial cut in the thickness direction of a resin-molded object to be cut. The cutting device includes a cutting mechanism. The cutting mechanism has a blade for cutting the object. The blade has a first side surface and a second side surface. The cutting device further includes a first pressing mechanism and a second pressing mechanism. The first pressing mechanism is positioned opposite the first side surface. The second pressing mechanism is positioned opposite the second side surface. Both the first and second pressing mechanisms are configured to press the object to be cut from above to below. When a partial cut is applied, the relative positional relationship between the first and second pressing mechanisms and the object to be cut changes in the same manner as the relative positional relationship between the cutting mechanism and the object to be cut.

[0011] According to another aspect of the present invention, the method for manufacturing a cut-off article is a method for manufacturing a cut-off article using the above-described cutting device. This method includes the following steps: preparing a cutting device with a blade of a first thickness; applying a partial cut to the object to be cut; replacing the blade with a blade of a second thickness thinner than the first thickness; and cutting the object along the position where the partial cut was applied.

[0012] (Invention Effects)

[0013] According to the present invention, a cutting device and a method for manufacturing a cut article are provided, which can reduce the deviation in the depth of the groove formed on the object to be cut by a semi-cut. Attached Figure Description

[0014] Figure 1 This is a diagram schematically showing a portion of the plane of the cutting device according to Embodiment 1.

[0015] Figure 2 It is a perspective view schematically representing a semiconductor package.

[0016] Figure 3 This diagram is used to illustrate the method for forming the step difference.

[0017] Figure 4 This is a schematic diagram showing a part of the cutting device from the side.

[0018] Figure 5 This is a schematic diagram showing the relationship between the pushing mechanism and the blade from the side.

[0019] Figure 6 This is a schematic top view representing the pushing mechanism.

[0020] Figure 7 This is a schematic diagram showing the relationship between the pushing mechanism and the blade from the front.

[0021] Figure 8 This is a schematic diagram illustrating the positional relationship between the blade and the roller when a half-cut is applied to the packaging substrate.

[0022] Figure 9 This is a schematic diagram showing the comparison object, which is a part of the cutting device, from the side.

[0023] Figure 10 This diagram illustrates the effectiveness of the pushing mechanism in the cutting device.

[0024] Figure 11 This is a schematic diagram showing the relationship between the pushing mechanism and the blade when the diameter of the blade is reduced, viewed from the side.

[0025] Figure 12This is a schematic diagram used to illustrate the operation of the pushing mechanism.

[0026] Figure 13 This is a schematic diagram showing a portion of the cutting device according to Embodiment 2 from the side.

[0027] Figure 14 This is a schematic diagram showing the relationship between the pushing mechanism and the blade in Embodiment 2 from the side.

[0028] Figure 15 This is a schematic top view of the pushing mechanism in Embodiment 2.

[0029] Figure 16 This is a schematic diagram showing the relationship between the pushing mechanism and the blade in Embodiment 2 from the front.

[0030] Figure 17 This is a diagram schematically showing the relationship between the pushing mechanism and the blade in Embodiment 2 when the diameter of the blade is reduced, viewed from the side. Detailed Implementation

[0031] Hereinafter, an embodiment of one aspect of the present invention (hereinafter also referred to as "this embodiment") will be described in detail with reference to the drawings. Furthermore, the same or equivalent parts in the drawings will be given the same reference numerals without repeating their descriptions. Additionally, for ease of understanding, appropriate objects will be omitted or exaggerated and depicted schematically in each drawing. Furthermore, the directions indicated by the arrows in each drawing are common to all drawings.

[0032] [1. Implementation Method 1]

[0033] <1-1. Summary>

[0034] Figure 1 This is a schematic diagram showing a portion of the plane of the cutting device 10 according to Embodiment 1. (See diagram below.) Figure 1 As shown, the cutting device 10 includes a cutting table 30 and a cutting mechanism 40.

[0035] The cutting stage 30 holds the packaged substrate 20 to be cut. The cutting stage 30 includes a holding member 31, a rotating mechanism 32, and a moving mechanism 33. The holding member 31 adsorbs the packaged substrate 20 from below, thereby holding the packaged substrate 20. The rotating mechanism 32 allows the holding member 31 to rotate in the θ direction shown in the figure. The moving mechanism 33 moves the holding member 31 along the Y-axis shown in the figure. Additionally, in the packaged substrate 20, a substrate or lead frame to which semiconductor chips are connected is resin-encapsulated. Furthermore, as described later... Figure 2 The packaging substrate 20 used in the manufacture of the semiconductor package 50 is illustrated using a lead frame packaging substrate as an example.

[0036] The cutting mechanism 40 includes a blade 41. The cutting mechanism 40 cuts the packaging substrate 20 using the blade 41, thereby cutting the packaging substrate 20 into multiple semiconductor packages of individual sheets. The cutting mechanism 40 is movable along the X and Z axes shown in the figure. Alternatively, the cutting device 10 can be configured as a dual-spindle assembly with two cutting mechanisms 40, or as a single-spindle assembly with one cutting mechanism 40.

[0037] Alternatively, the cutting mechanism 40 can be configured to remove a portion of the packaging substrate 20 by means of a blade 41, thereby forming a groove on the packaging substrate 20. That is, the cutting mechanism 40 can apply a half-cut in the thickness direction of the packaging substrate 20. The concept of the term "cutting" included in the name of the cutting device 10 (cutting device) includes separating the cutting object into multiple parts and removing a portion of the cutting object.

[0038] The cutting device 10, for example, is designed to manufacture a wettable flank QFN (Quad Flat No-leaded) package, such as a semiconductor package 50, and has the function of applying a half-cut to the package substrate 20. Next, the semiconductor package 50 and its manufacturing method will be described.

[0039] Figure 2 This is a schematic perspective view of semiconductor package 50. (Example) Figure 2 As shown, in the semiconductor package 50, a step difference 51 is formed at the boundary between the top surface (the side where the terminal 52 is formed) and the side surface. When the semiconductor package 50 is surface mounted, solder enters the step difference 51. Therefore, a three-dimensional solder connection structure can be achieved with respect to the semiconductor package 50. Furthermore, because solder enters the step difference 51, the solder joints can be easily observed from the side surface of the semiconductor package 50 during post-installation visual inspection.

[0040] Figure 3 This is a diagram used to explain the method of forming the step difference 51. (Refer to...) Figure 3 To form the step difference portion 51, firstly, a groove G1 is formed on the packaging substrate 20 by a blade 41 having a first thickness. Then, the packaging substrate 20 is cut at position P1 by a blade 41 having a second thickness (thinner than the first thickness), thereby cutting the packaging substrate 20 into individual sheets. Thus, multiple semiconductor packages 50 having the step difference portion 51 are manufactured.

[0041] As described above, the semiconductor package 50 has various advantages. A step difference 51 can be formed in the semiconductor package 50 by applying a half-cut. The cutting device 10, for example, has the function of applying a half-cut to the package substrate 20 for manufacturing the semiconductor package 50.

[0042] When performing a half-cut on the packaging substrate 20, it is important to form a groove with a uniform depth on the packaging substrate 20 as much as possible. The cutting device 10 incorporates a design that can suppress deviations in the depth of the grooves formed by the half-cut. The configuration of the cutting device 10 will be described in detail below.

[0043] <1-2. Composition of the Cutting Device>

[0044] Figure 4 This is a schematic diagram showing a portion of the cutting device 10 from the side. (See diagram below.) Figure 4 As shown, the cutting device 10 includes a cutting table 30, a cutting mechanism 40, a pushing mechanism 60, and a discharging mechanism 70.

[0045] The pressing mechanism 60 and the ejection mechanism 70 are respectively mounted on the cutting mechanism 40. The pressing mechanism 60 is mounted at the rear of the cutting mechanism 40, and the ejection mechanism 70 is mounted at the front of the cutting mechanism 40. Furthermore, "front" of the cutting mechanism 40 refers to the direction in which the cutting table 30 moves towards the position below the blade 41. The blade 41 is held in the Y-axis direction by the pressing mechanism 60 and the ejection mechanism 70. The pressing mechanism 60 is positioned on the opposite side of the ejection mechanism 70 relative to the blade 41. Therefore, both the pressing mechanism 60 and the ejection mechanism 70 can be mounted on the cutting mechanism 40.

[0046] The pressing mechanism 60 is configured to press the packaging substrate 20 disposed on the cutting table 30 from top to bottom. The configuration of the pressing mechanism 60 and the reasons for providing the pressing mechanism 60 are explained in detail below.

[0047] The dispensing mechanism 70 includes three nozzles (e.g., a first nozzle, a second nozzle, and a third nozzle) configured to dispense processing fluid. The first nozzle dispenses processing fluid toward the blade 41. The second nozzle dispenses processing fluid toward the contact point (cutting portion) between the blade 41 and the packaging substrate 20. The third nozzle dispenses processing fluid toward the unwanted edge material generated when the packaging substrate 20 is cut. However, the dispensing mechanism 70 does not necessarily have to include three nozzles. For example, the dispensing mechanism 70 may be configured with one or two nozzles, or even four or more nozzles. The dispensing mechanism 70 dispenses processing fluid supplied from a water tank or a tap water pipe, for example. If the processing fluid is sprayed onto the rotating blade 41 by the dispensing mechanism 70, a large amount of processing fluid contacts the blade 41, which can more effectively cool the blade 41. Furthermore, if the processing fluid is sprayed onto the cutting portion, a large amount of processing fluid is supplied to the processing point, which can suppress the heat generated during cutting and properly cut the packaging substrate 20. In addition, by spraying the processing fluid onto the stubble portion, the residual stubble portion on the cutting table 30 can be removed.

[0048] Figure 5 This is a schematic diagram showing the relationship between the pushing mechanism 60 and the blade 41 from the side. Figure 6 This is a schematic top view of the pushing mechanism 60. Figure 7 This is a schematic diagram showing the relationship between the pushing mechanism 60 and the blade 41 from the front.

[0049] Reference Figure 5 , Figure 6 and Figure 7 The pressing mechanism 60 includes a first pressing mechanism 61 and a second pressing mechanism 62. The first pressing mechanism 61 is located on one side near the blade 41, and the second pressing mechanism 62 is located on the other side near the blade 41. When the blade 41 cuts the encapsulation substrate 20, the blade 41 is located in the area between the first pressing mechanism 61 and the second pressing mechanism 62. That is, when the blade 41 cuts the encapsulation substrate 20, in a side view, a portion of the first pressing mechanism 61 faces one side of the blade, and a portion of the second pressing mechanism 62 faces the other side of the blade.

[0050] The first pressing mechanism 61 and the second pressing mechanism 62 are respectively configured to press the encapsulation substrate 20 from above to below (see reference). Figure 1 Each of the first pressing mechanism 61 and the second pressing mechanism 62 includes a leaf spring 610, a pressing unit 620, base components 630 and 640, and screws 624, 625, 631, 633, and 634.

[0051] The base members 630, 640, and 650 are each made of metal, for example. Base member 650 is a plate-shaped member extending along the height direction and is mounted on the rear end of the cutting mechanism 40. Holes H1 and H2 are formed on each of the two sides of the base member 650. Holes H1 and H2 are longitudinally elongated. Screws are used to pass through holes H1 and H2 to fix the base member 650 to the cutting mechanism 40. The position of the pressing mechanism 60 in the height direction can be changed by altering the position of the screw tightening in each hole H1 and H2.

[0052] Base member 640 is a member extending forward from the lower end of base member 650 and is mounted on base member 650. Base member 630 is a rod-shaped member mounted on the top surface of base member 640 and extending forward from base member 640. Each of base members 630 and 640 has a screw hole, and base members 630 and 640 are fastened together by screws 633 and 634. The hole H3 formed on each of base members 630 and 640 has a shape that is elongated in the front-rear direction, and the position of roller 622 in the front-rear direction can be adjusted by adjusting the position of the screw fastening.

[0053] A leaf spring 610 extending obliquely downwards is mounted on the bottom surface of the base member 630. The leaf spring 610 is, for example, made of metal. A screw hole is formed in the leaf spring 610 to fasten the base member 630 and the leaf spring 610 together by a screw 632. The screw 631 passes through the screw hole in the base member 630 and pushes the leaf spring 610 from above. The position of the leaf spring 610 pushed by the screw 631 is further forward than the position where it is fastened by the screw 632. By adjusting the position of the screw 631 in the height direction, the degree of curvature of the leaf spring 610 is adjusted. Thus, the elastic force of the leaf spring 610 is adjusted.

[0054] A pressing unit 620 is mounted on the front end of the leaf spring 610. The pressing unit 620 includes a base member 621, a roller 622, a rotating shaft 623, and screws 624 and 625. The base member 621 is made of, for example, metal or resin. Screw holes are formed in the base member 621, and the base member 621 and the leaf spring 610 are fastened together by screws 624 and 625. A recess is formed at the front end of the base member 621 in plan view, and the roller 622 is located in the recess. The roller 622 is mounted on the base member 621 across the rotating shaft 623 and is rotatable relative to the base member 621. The rotating shaft 623 extends in the X-axis direction (thickness direction of the blade 41). The roller 622 is made of, for example, rubber or resin. The roller 622 is an example of the "pressing member" of the present invention. By using a roller 622 that is elastic like rubber or resin, it is possible to reduce the marks caused by the roller 622 pressing onto the packaging substrate 20. In addition, it is possible to reduce the crushing of burrs generated during half-cutting.

[0055] When there is no encapsulation substrate 20 below roller 622, the lower end of roller 622 is located below the imaginary surface Z1 used to indicate the lower end position of blade 41. Therefore, when cutting encapsulation substrate 20, the lower end of roller 622 comes to a position higher than the lower end position of blade 41, so roller 622 presses encapsulation substrate 20 downward by the elastic force of leaf spring 610.

[0056] Figure 8 This is a schematic diagram illustrating the positional relationship between the blade 41 and the roller 622 when a half-cut is applied to the packaging substrate 20. (Example) Figure 8 As shown, when a half-cut is applied to the packaging substrate 20, the blade 41 removes a portion of the packaging substrate 20. Therefore, the blade 41 extends below the top surface of the packaging substrate 20 in the height direction. On the other hand, during the half-cut, the roller 622 presses the top surface of the packaging substrate 20 downwards. Therefore, the lower end of the roller 622 moves to a position higher than the lower end of the blade 41.

[0057] Furthermore, the position of the rotation center of the roller 622 in the Y-axis direction (position P6) is located further forward than the position of the rotation center of the blade 41 in the Y-axis direction (position P5). This is because the starting position of the cut into the package substrate 20 caused by the blade 41 (position P7) is located further forward than the position of the rotation center of the blade 41 in the Y-axis direction (position P5). According to the cutting device 10, since the position of the rotation center of the roller 622 is further forward than the position of the rotation center of the blade 41, the package substrate 20 can be pushed by the roller 622 at a position closer to the starting position of the cut. Next, the reason for providing the pushing mechanism 60 in the cutting device 10 will be explained.

[0058] <1-3. Reasons for including the pushing device>

[0059] Figure 9 This is a schematic diagram showing a portion of the comparison object, namely the cutting device 10X, from the side. For example... Figure 9 As shown, the cutting device 10X does not have a pressing mechanism. For example, there may be a case where the package substrate 20 warps. If a half-cut is applied to the package substrate 20 while it is warped, the depth of the groove will vary depending on the position. For example, the groove formed at position P3 may be deeper than the groove formed at position P2, and the groove formed at position P4 may be deeper than the groove formed at position P3. In the cutting device 10 according to this embodiment 1, a pressing mechanism 60 is provided to solve this problem.

[0060] Figure 10 This is a diagram illustrating the effectiveness of the pressing mechanism 60 in the cutting device 10 according to Embodiment 1. Figure 10 As shown, in the cutting device 10, when a half-cut is applied to the packaging substrate 20, the roller 622 presses down the position adjacent to the cutting start position of the packaging substrate 20. The half-cut is applied to the packaging substrate 20 while the roller 622 presses down, thereby suppressing warping of the packaging substrate 20. Therefore, according to the cutting device 10, the half-cut of the packaging substrate 20 is performed while suppressing warping of the packaging substrate 20, thus suppressing deviations in the depth of the groove formed by the half-cut.

[0061] Figure 11 This is a schematic diagram showing the relationship between the pushing mechanism 60 and the blade 41 when the diameter of the blade 41 is reduced, viewed from the side. Figure 11 As shown, even if the diameter of the blade 41 becomes smaller, the roller 622 will still apply downward force through the elasticity of the leaf spring 610, so that the object to be cut can be pushed from top to bottom.

[0062] Figure 12 This is a schematic diagram illustrating the operation of the pushing mechanism 60. For example... Figure 12 As shown, a rotating shaft J1 is provided on a portion of the cutting mechanism 40 on which the pressing mechanism 60 is mounted, and this portion of the cutting mechanism 40 is configured to rotate. That is, this portion of the cutting mechanism 40 can rotate, thereby allowing the pressing mechanism 60 to avoid overlapping with the blade 41 in a side view. As a result, the blade 41 can be easily exchanged. Thus, the cutting device 10 according to this embodiment 1 can be said to include an avoidance mechanism, the rotating shaft J1 of which is configured to allow the pressing mechanism 60 to avoid overlapping with the blade 41 in a side view.

[0063] <1-4. Operation of the Cutting Device>

[0064] For example, semiconductor package 50 is manufactured using the following method (refer to...) Figure 2 A blade 41 of a first thickness is installed in the cutting device 10.

[0065] Subsequently, in the cutting device 10, the cutting table 30 moves from the front of the cutting mechanism 40 to below the blade 41. As the cutting table 30 moves in, the pressing mechanism 60 pushes the packaging substrate 20 on the cutting table 30 from top to bottom, and the blade 41 begins to perform a partial cut on the packaging substrate 20. Since the pressing mechanism 60 is installed in the cutting mechanism 40, when a partial cut is applied, the relative positional relationship between the pressing mechanism 60 and the packaging substrate 20 changes in the same way as the relative positional relationship between the cutting mechanism 40 and the packaging substrate 20.

[0066] If the half-cutting of the packaging substrate 20 is completed, the blade 41 is replaced in the cutting device 10. The replaced blade 41 has a second thickness (thinner than the first thickness).

[0067] Subsequently, in the cutting device 10, the cutting stage 30 moves from in front of the cutting mechanism 40 to below the blade 41. As the cutting stage 30 moves in, the pushing mechanism 60 pushes the packaging substrate 20 on the cutting stage 30 from top to bottom, and the blade 41 begins to cut the packaging substrate 20. The packaging substrate 20 is cut along the groove formed by the half-cut, thereby completing multiple semiconductor packages 50.

[0068] <1-5. Characteristics>

[0069] As described above, the cutting device 10 according to Embodiment 1 includes a pressing mechanism 60. When a half-cut is applied to the packaging substrate 20, the relative positional relationship between each of the first pressing mechanism 61 and the second pressing mechanism 62 and the packaging substrate 20 changes in the same manner as the relative positional relationship between the cutting mechanism 40 and the packaging substrate 20. In the cutting device 10, when a half-cut is applied to the packaging substrate 20, the packaging substrate 20 is pressed downward by the roller 622. The half-cut is applied to the packaging substrate 20 while the roller 622 is pressing downward, thereby suppressing the warping of the packaging substrate 20. Therefore, according to the cutting device 10, the half-cut of the packaging substrate 20 is performed while suppressing the warping of the packaging substrate 20, so the deviation in the depth of the groove formed by the half-cut can be suppressed.

[0070] [2. Implementation Method 2]

[0071] The cutting device 10 according to Embodiment 1 above includes a pressing mechanism 60. The cutting device 80 according to Embodiment 2 differs from the cutting device 10 according to Embodiment 1 mainly in the construction of the pressing mechanism. Hereinafter, the description will focus on the differences from Embodiment 1.

[0072] <2-1. Composition of the Cutting Device>

[0073] Figure 13 This is a schematic diagram showing a portion of the cutting device 80 according to Embodiment 2 from the side. (See diagram below.) Figure 13 As shown, the cutting device 80 includes a cutting table 30, a cutting mechanism 40, a pushing mechanism 90, and a discharging mechanism 70.

[0074] The pressing mechanism 90 and the ejection mechanism 70 are respectively mounted on the cutting mechanism 40. The pressing mechanism 90 is mounted at the rear of the cutting mechanism 40, and the ejection mechanism 70 is mounted at the front of the cutting mechanism 40. The blade 41 is held by the pressing mechanism 90 and the ejection mechanism 70 in the Y-axis direction. The pressing mechanism 90 is positioned on the opposite side of the ejection mechanism 70 relative to the blade 41. Thus, both the pressing mechanism 90 and the ejection mechanism 70 can be mounted on the cutting mechanism 40. The pressing mechanism 90 is configured to press the packaging substrate 20 disposed on the cutting table 30 from top to bottom.

[0075] Figure 14 This is a schematic diagram showing the relationship between the pushing mechanism 90 and the blade 41 from the side. Figure 15 This is a schematic top view showing the pushing mechanism 90. Figure 16 This is a schematic diagram showing the relationship between the pushing mechanism 90 and the blade 41 from the front.

[0076] Reference Figure 14 , Figure 15 and Figure 16 The pressing mechanism 90 includes a first pressing mechanism 91 and a second pressing mechanism 92. The first pressing mechanism 91 is located on one side near the blade 41, and the second pressing mechanism 92 is located on the other side near the blade 41. When the blade 41 cuts the encapsulation substrate 20, the blade 41 is located in the area between the first pressing mechanism 91 and the second pressing mechanism 92. That is, when the blade 41 cuts the encapsulation substrate 20, in a side view, a portion of the first pressing mechanism 91 faces one side of the blade, and a portion of the second pressing mechanism 92 faces the other side of the blade.

[0077] The first pressing mechanism 91 and the second pressing mechanism 92 are respectively configured to press the encapsulation substrate 20 from above to below. The first pressing mechanism 91 includes a base member 940 and pressing units 950 and 960. The second pressing mechanism 92 includes a base member 910 and pressing units 920 and 930.

[0078] The base members 910, 940, and 970 are each made of metal, for example. The component formed by the base members 910, 940, and 970 is a slightly L-shaped component and is mounted on the rear end of the cutting mechanism 40. Holes H4 and H5 are formed on each of the two sides of this component. Holes H4 and H5 are longitudinally elongated holes. The component is fixed to the cutting mechanism 40 by screws passing through holes H4 and H5. The position of the pressing mechanism 90 in the height direction can be changed by altering the position of the screw tightening in each of holes H4 and H5. Furthermore, each of the base members 910 and 940 has a support shaft 926 extending in the X-axis direction (the thickness direction of the blade 41).

[0079] The pressing units 920, 930, 950, and 960 each include a rotating member 921, a roller 922, rotating shafts 923 and 925, and a torsion spring 924. The rotating shafts 923 and 925 extend along the X-axis. The rotating member 921 is, for example, a plate-like metal member, rotatably mounted to the base member 910 or 940. The base member 910 or 940 is mounted to the rotating member 921 across the rotating shaft 925. The torsion spring 924 is mounted around the rotating shaft 925.

[0080] A roller 922 is rotatably mounted at the front end of the rotating member 921. The roller 922 is made of, for example, rubber or resin. The rotating member 921 and the roller 922 are connected together across a rotating shaft 923. One end of a torsion spring 924 pushes the rotating shaft 923 downward, and the other end of the torsion spring 924 pushes the support shaft 926 downward. Thus, a force is applied to the roller 922 in the rotational direction. In addition, the roller 922 is mounted inside the rotating member 921 in the thickness direction of the blade 41. That is, the length between the roller 922 and the blade 41 is shorter than the length between the rotating member 921 and the blade 41. Thus, when a half-cut is applied to the packaging substrate 20, the roller 922 can push closer to the half-cut position. The rotating member 921 included in the pressing units 930 and 960 is an example of the "first rotating member" of the present invention, and the roller 922 mounted on the rotating member 921 is an example of the "first pressing member" of the present invention. Furthermore, the rotating member 921 included in the pressing units 920 and 950 is an example of the "second rotating member" of the present invention, and the roller 922 mounted on the rotating member 921 is an example of the "second pressing member" of the present invention.

[0081] When there is no encapsulation substrate 20 below roller 922, the lower end of roller 922 is located below the imaginary surface Z2 used to indicate the lower end position of blade 41. Therefore, when cutting encapsulation substrate 20, the lower end of roller 922 comes to a position higher than the lower end position of blade 41, so roller 922 presses encapsulation substrate 20 down by the elastic force of torsion spring 924.

[0082] Figure 17 This diagram schematically illustrates the relationship between the pushing mechanism 90 and the blade 41 when the diameter of the blade 41 is reduced, viewed from the side. Figure 17 As shown, even if the diameter of the blade 41 becomes smaller, the roller 922 will still exert downward force through the elastic force of the torsion spring 924, so that the object to be cut can be pushed from top to bottom.

[0083] Furthermore, the cutting device 80 according to embodiment 2 is also provided with, as in Figure 12 The avoidance mechanism shown.

[0084] <2-2. Characteristics>

[0085] As described above, the cutting device 80 according to Embodiment 2 includes a pressing mechanism 90. When a half-cut is applied to the packaging substrate 20, the relative positional relationship between the first pressing mechanism 91 and the second pressing mechanism 92 and the packaging substrate 20 changes in the same manner as the relative positional relationship between the cutting mechanism 40 and the packaging substrate 20. In the cutting device 80, when a half-cut is applied to the packaging substrate 20, the packaging substrate 20 is pressed downward by the roller 922. The half-cut is applied to the packaging substrate 20 while the warping of the packaging substrate 20 is suppressed by the downward pressing of the roller 922. Therefore, according to the cutting device 80, the half-cut of the packaging substrate 20 is performed while the warping of the packaging substrate 20 is suppressed, so the deviation in the depth of the groove formed by the half-cut can be reduced.

[0086] [3. Other Implementation Methods]

[0087] The ideas of embodiments 1 and 2 described above are not limited to those embodiments 1 and 2. Hereinafter, an example of another embodiment that can be applied to the ideas of embodiments 1 and 2 described above will be described.

[0088] In embodiments 1 and 2 described above, the top surface of the retaining member 31 is flat. However, the top surface of the retaining member 31 does not necessarily have to be completely flat. For example, it can be made to warp the top surface of the retaining member 31 in accordance with the warping of the packaging substrate 20. In this case, a half-cut is applied to the packaging substrate 20 while adjusting the height of the blade 41. Even in this case, the pushing mechanism functions effectively when the packaging substrate 20 is more warped than the top surface of the retaining member 31.

[0089] In embodiments 1 and 2 described above, the packaging substrate 20 is cut by moving the cutting table 30 in the Y-axis direction. However, the cutting method is not limited to this. The cutting table 30 may be configured to perform only a rotational motion, and the packaging substrate 20 may be cut by moving the cutting mechanism 40 in the Y-axis direction. That is, the packaging substrate 20 can be cut simply by moving the cutting table 30 relative to the cutting mechanism 40.

[0090] In addition, in the above-described embodiment 1, for example, the base components 630, 640, and 650 can also be integrally formed.

[0091] In addition, in the above-described embodiment 2, for example, the base components 910, 940, and 970 can also be integrally formed.

[0092] The above description illustrates embodiments of the present invention. Specifically, detailed descriptions and drawings have been provided for illustrative purposes. Therefore, the constituent elements described in the detailed descriptions and drawings may include elements that are not essential for solving the problem. Therefore, even though these non-essential constituent elements are described in the detailed descriptions and drawings, they should not be immediately assumed to be essential.

[0093] Furthermore, the above embodiments are merely illustrative of the present invention in various aspects. Various modifications and variations can be made to the above embodiments within the scope of the present invention. That is, appropriate specific configurations can be adopted corresponding to the embodiments for implementation of the present invention.

[0094] (Label Explanation)

[0095] 10, 10X, 80 Cutting device, 20 Package substrate, 30 Cutting table, 31 Holding member, 32 Rotating mechanism, 33 Moving mechanism, 40 Cutting mechanism, 41 Blade, 50 Semiconductor package, 51 Step difference section, 52 Terminal, 60, 90 Pushing mechanism, 61, 91 First pushing mechanism, 62, 92 Second pushing mechanism, 70 Dispensing mechanism, 610 Leaf spring, 620, 920, 930, 950, 960 Pushing unit, 621, 6 30, 640, 650, 910, 940, 970 base components, 622, 922 rollers, 623, 923, 925, J1 rotating shaft, 624, 625, 631, 632, 633, 634 screws, 921 rotating component, 924 torsion spring, 926 support shaft, G1 groove, H1, H2, H3, H4, H5 holes, P1, P2, P3, P4, P5, P6, P7 positions, Z1, Z2 imaginary surfaces.

Claims

1. A cutting device configured to apply a partial cut in the thickness direction of a resin-molded object to be cut. The cutting device includes a cutting mechanism with a blade for cutting the object to be cut. The blade has a first side and a second side. The cutting device also includes a first pressing mechanism and a second pressing mechanism. The first pushing mechanism is positioned opposite the first side. The second pushing mechanism is positioned opposite the second side. The first pushing mechanism includes: A leaf spring extending forward from the rear of the blade; and The first pressing member, which is formed by rollers at the front end of the leaf spring along the extension of the direction in which the leaf spring extends, The second pushing mechanism includes: A leaf spring extending forward from the rear of the blade; and The second pushing member, which is formed by rollers at the front end of the leaf spring along the extension line of the direction in which the leaf spring extends, The first and second pushing mechanisms are each configured to push the object to be cut from above to below at a position further forward than the rotation center of the blade. When the half-cut is applied, the relative positional relationship between the first pressing mechanism and the second pressing mechanism and the object being cut changes in the same way as the relative positional relationship between the cutting mechanism and the object being cut.

2. The cutting device according to claim 1, wherein, The cutting device also includes an avoidance mechanism configured to, in a side view, allow the first and second pressing mechanisms to avoid overlapping with the blade.

3. The cutting device according to claim 2, wherein, The cutting device also includes a dispensing mechanism for dispensing processing fluid from the front of the blade. The avoidance mechanism is positioned on the opposite side of the ejection mechanism, relative to the blade.

4. A method for manufacturing a cut article, comprising a method for manufacturing a cut article using the cutting device according to any one of claims 1 to 3. The method for manufacturing the cut-off product includes the following steps: The step of preparing the cutting device with the blade of the first thickness; The step of applying a partial cut to the object to be cut; The step of replacing the blade with a blade of a second thickness that is thinner than the first thickness; as well as The step of cutting the object along the location where the half-cut was applied.

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