Inspection apparatus and inspection method

Abstract

This invention relates to an inspection apparatus and an inspection method. The inspection apparatus includes: a mounting member for mounting a substrate; a holding portion for holding a probe card having probes that contact the substrate; a plurality of positioning members that contact the upper surface of the mounting member or the lower surface of the holding portion to define the height of the mounting member relative to the probes; an adjustment mechanism for adjusting the height of the positioning members; a detection unit for detecting the probes, the mounting member, and the positioning members; and a control unit that performs the following steps: obtaining the height of the probes, the height of the mounting member, and the height of the positioning members using the detection unit; positioning the positioning members at a reference height where the overdrive amount is zero using the adjustment mechanism based on the detection results of the probes, the mounting member, and the positioning members obtained using the detection unit; and obtaining the height of the positioning members to a desired overdrive amount while adjusting the drive amount of the adjustment mechanism to raise the mounting member until the positioning members are at that height.

Description

Technical Field

[0001] This invention relates to an inspection apparatus and an inspection method. Background Technology

[0002] Patent Document 1 discloses a wafer inspection apparatus that pressurizes a probe card to make contact with a wafer for wafer inspection. In this wafer inspection apparatus, the pressure of the vacuum attraction applied between the probe card and the wafer in the surrounding space by evacuation of a vacuum mechanism is approximately precisely the same as the pressure of the pressing force applied between the probe card and the wafer by the upward push of the moving stage and the top of the chuck (also called the chuck head).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2016-58506 Summary of the Invention

[0006] The technical problem the invention aims to solve

[0007] The technology involved in this invention enables the probe to make proper contact with the substrate in an inspection apparatus for inspecting substrates, regardless of the probe height.

[0008] Technical solutions for solving technical problems

[0009] One aspect of the present invention is an inspection apparatus for inspecting a substrate, the inspection apparatus comprising: a mounting member for mounting the substrate; a holding portion for holding a probe card having probes in contact with the substrate; a plurality of positioning members that contact an upper surface of the mounting member or a lower surface of the holding portion to define the height of the mounting member relative to the probes; an adjustment mechanism for adjusting the height of the positioning members; a detection unit for detecting the probes, the mounting member, and the positioning members; and a control unit configured to perform the following steps: based on the detection result of the probes obtained using the detection unit, obtaining the height of the probes. The steps include: obtaining the height of the mounting component based on the detection result of the mounting component obtained using the detection unit; obtaining the height of the positioning component based on the detection result of the positioning component obtained using the detection unit; positioning the positioning component at a reference height where the overdrive amount is zero using the adjustment mechanism based on the detection results of the probe, the mounting component, and the positioning component obtained using the detection unit; and obtaining the height of the positioning component such that it becomes the desired overdrive amount, while adjusting the drive amount of the adjustment mechanism, and raising the mounting component until the positioning component is at that height.

[0010] The effects of the invention

[0011] According to the present invention, in the inspection apparatus for inspecting substrates, the probe can be made to make proper contact with the substrate regardless of the probe height. Attached Figure Description

[0012] Figure 1 This is a schematic cross-sectional view showing the structure of the inspection device according to this embodiment.

[0013] Figure 2 This is a schematic longitudinal cross-sectional view showing the structure of the inspection device according to this embodiment.

[0014] Figure 3 This is a side cross-sectional view of the inspection area.

[0015] Figure 4 This is a cross-sectional view of the perimeter of the elastic frame.

[0016] Figure 5 This is a schematic enlarged view of the lower surface of the elastic frame.

[0017] Figure 6 This diagram illustrates the inspection process performed using the inspection apparatus of this embodiment.

[0018] Figure 7 This diagram illustrates the inspection process performed using the inspection apparatus of this embodiment.

[0019] Figure 8 This diagram illustrates the inspection process performed using the inspection apparatus of this embodiment.

[0020] Figure 9 This diagram illustrates the inspection process performed using the inspection apparatus of this embodiment.

[0021] Figure 10 This diagram illustrates the inspection process performed using the inspection apparatus of this embodiment.

[0022] Figure 11 This diagram illustrates the inspection process performed using the inspection apparatus of this embodiment.

[0023] Figure 12 This diagram illustrates the inspection process performed using the inspection apparatus of this embodiment.

[0024] Explanation of reference numerals in the attached figures

[0025] 1. Inspection device

[0026] 22 Control Department

[0027] 70 Chuck Top

[0028] 80 cameras

[0029] 90 Spring Frame

[0030] 100 probe cards

[0031] 102 probes

[0032] 130 positioning pin

[0033] 140 Adjustment Mechanism

[0034] W chip. Detailed Implementation

[0035] In semiconductor manufacturing processes, a large number of semiconductor devices with prescribed circuit patterns are formed on a semiconductor wafer (hereinafter referred to as a "wafer"). The formed semiconductor devices are then inspected for electrical characteristics and other properties, and sorted into qualified and unqualified products. Inspection of semiconductor devices is performed, for example, on the wafer before it is diced into individual semiconductor devices, using an inspection device.

[0036] The inspection apparatus includes a probe card with numerous needle-shaped contact terminals, i.e., probes. During electrical characteristic checks, the wafer is first brought close to the probe card, and the probes of the probe card contact the electrodes of the semiconductor device formed on the wafer. In this state, an electrical signal is supplied to the semiconductor device from a tester positioned above the probe card via the probes. Then, based on the electrical signals received by the tester from the semiconductor device via the probes, it is determined whether the semiconductor device is defective.

[0037] An inspection apparatus for performing such electrical characteristic checks is known to include one that depressurizes a sealed space between the top of a chuck holding a wafer and a spring-loaded frame holding a probe card, thereby bringing the wafer contained within this space into contact with the probes of the probe card. In this apparatus, by depressurizing and shortening the sealed space, the top of the chuck moves closer to the probe card, i.e., rises, causing the wafer on the top of the chuck to abut against the probes of the probe card. At this time, the height of the top of the chuck is a height exceeding a predetermined overdrive amount from the point where the wafer on the top of the chuck contacts the probes. Thus, the electrodes of the wafer contact the probes regardless of whether the wafer has a protective film or the like.

[0038] Additionally, the top of the chuck is held by an aligner, which allows it to move horizontally and vertically. However, during the stage where the wafer on the top of the chuck contacts the probe for electrical characteristic checks, the top of the chuck is not supported by the aligner, but by a bellows forming the aforementioned enclosed space.

[0039] In addition, the height of the chuck top has traditionally been set based on the spring frame or alignment device. Specifically, the height of the chuck top has traditionally been set as a predetermined value based on the detection results of a height sensor installed on the spring frame or alignment device, for example, the distance from the spring frame or alignment device to the top of the chuck.

[0040] However, the height of the probes on the probe card (specifically, the height of the contact end where the probe contacts the wafer) varies depending on the temperature of the probe card, and the spring frame also varies due to thermal expansion or contraction. Therefore, when the height of the chuck top is set based on the spring frame or alignment device as described above for checking electrical characteristics, it is sometimes impossible to ensure proper contact between the probes and the wafer (specifically, the electrodes).

[0041] In view of the above problems, the technology of the present invention enables the probe to make proper contact with the substrate in an inspection apparatus for inspecting substrates, regardless of the probe height.

[0042] Hereinafter, the inspection apparatus and inspection method of this embodiment will be described with reference to the accompanying drawings. Furthermore, in this specification and the accompanying drawings, elements having substantially the same function and structure are given the same reference numerals, and repeated descriptions are omitted.

[0043] <Inspection Device>

[0044] Figure 1 and Figure 2 These are schematic cross-sectional and longitudinal cross-sectional views, respectively, showing the structure of the inspection device according to this embodiment. Additionally, in Figure 2 In this context, the aligner described later is only a part of it.

[0045] Figure 1 and Figure 2 The inspection apparatus 1 inspects a wafer W, which serves as a substrate, specifically, it inspects the electrical characteristics of a semiconductor device formed on the wafer W that is the object of inspection. The inspection apparatus 1 has a housing 10, in which a loading / unloading area 11, a transport area 12, and an inspection area 13 are provided. The loading / unloading area 11 is the area where the inspection apparatus 1 loads and unloads the wafer W. The transport area 12 is the area connecting the loading / unloading area 11 and the inspection area 13. The inspection area 13 is the area where the electrical characteristics of the semiconductor device formed on the wafer W are inspected.

[0046] The loading / unloading area 11 is equipped with a control unit 22, which includes a port 20 for receiving and storing a cassette C containing multiple wafers W, a loader 21 for storing probe cards (described later), and controls for the various components of the inspection device 1. The control unit 22 is, for example, a computer equipped with a CPU, memory, etc., and has a storage unit (not shown) for storing various information. The storage unit stores programs, such as those for performing inspection processing. Furthermore, the programs are recorded on a computer-readable storage medium, or can be installed from that storage medium onto the control unit 22. The storage medium can be temporary or non-temporary. Additionally, part or all of the program can be implemented using dedicated hardware (circuit board). The storage unit can be, for example, a storage device such as an HDD, a memory such as RAM storing temporary information required for program operations, or a combination thereof.

[0047] A transport device 30 is provided in the transport area 12, capable of moving while holding wafers W, etc. This transport device 30 transports wafers W between the cassette C within the port 20 of the loading / unloading area 11 and the inspection area 13. Additionally, the transport device 30 transports probe cards requiring maintenance from the probe cards fixed on the spring frame (described later) within the inspection area 13 to the loader 21 of the loading / unloading area 11. Furthermore, the transport device 30 transports new or maintained probe cards from the loader 21 into the inspection area 13.

[0048] Inspection area 13 is equipped with multiple testers 40. Specifically, inspection area 13 is, for example, as follows: Figure 2 As shown, the vertical direction is divided into three sections, and in each section 13a, a tester array consisting of four testers 40 arranged in the horizontal direction (X direction in the figure) is provided. Additionally, each section 13a is provided with one aligner 50 serving as a moving mechanism and one upper camera 60. The number and arrangement of the testers 40, aligner 50, and upper camera 60 can be arbitrarily selected.

[0049] The tester 40 receives and transmits electrical signals for power characteristic inspection between itself and the wafer W. The aligner 50 is configured to hold the chuck top 70 (described later) and allow it to move horizontally (X and Y directions in the figure, and θ direction centered on the Z-axis in the figure) and vertically (Z direction in the figure). Furthermore, the aligner 50 is used for aligning the wafer W, mounted on the chuck top 70, with the probes of the probe card (described later).

[0050] The upper camera 60 is configured to take images from below. In one embodiment, the upper camera 60 is movable in the horizontal direction. The upper camera 60 is located, for example, in the area in front of each tester 40 in the inspection (the negative side of the Y direction in the figure), which is an area that does not overlap with the spring frame described later when viewed from above. The upper camera 60 takes images of the wafer W placed on the top 70 of the chuck on the alignment device 50.

[0051] The upper camera 60 is controlled by the control unit 22. Furthermore, the shooting results from the upper camera 60 are output to the control unit 22.

[0052] The chuck top component 70 is an example of a mounting component used to mount a wafer W. The chuck top 70 can hold the mounted wafer W, for example, by means of adsorption or the like.

[0053] In this inspection apparatus 1, while the transport device 30 is transporting a wafer W toward a tester 40, other testers 40 are able to inspect the electrical characteristics of electronic devices formed on other wafers W.

[0054] <Inspection Area>

[0055] Next, use Figures 3-5 A more detailed description of the structure of the inspection area 13 is provided. Figure 3 This is a side cross-sectional view of inspection area 13. Figure 4 This is a cross-sectional view of the perimeter of the elastic frame, which will be described later. Figure 5 This is a schematic enlarged view of the lower surface of the elastic frame, which will be described later. Figure 5 The diagram of the probe, which will be described later, is omitted in the text.

[0056] As described above, an alignment device 50 and an upper camera 60 are provided in each segmented area 13a of the inspection area 13. Additionally, as... Figure 3 As shown, a lower camera 80, a spring frame 90, and a probe card 100 (described later) are provided in each segmented area 13a.

[0057] Aligner 50 may have, for example, an X stage 51, a Y stage 52, and a Z stage 53.

[0058] The X-stage 51 moves along the guide rail 51a in the X-axis direction of the coordinate system constituting the moving plane (XY plane) of the aligner 50. For this X-stage 51, a position detection mechanism (not shown) is provided to detect the position of the X-stage 51 in the X-direction, i.e., the position of the chuck top 70 in the X-axis direction. This position detection mechanism is, for example, a linear encoder.

[0059] The Y-stage 52 moves on the X-stage 51. Specifically, it moves along the guide rail 52a in the Y-axis direction of the coordinate system constituting the moving plane (XY plane) of the aligner 50. The Y-stage 52 is provided with a position detection mechanism (not shown) that detects the position of the Y-stage 52 in the Y-axis direction, i.e., the position of the chuck top 70 in the Y-axis direction. This position detection mechanism is, for example, a linear encoder.

[0060] The Z-stage 53 moves in the Z-direction via a telescopic shaft 53a that is retractable in the height direction (Z-direction) orthogonal to the moving plane (XY plane) of the aligner 50. The Z-stage 53 is provided with a position detection mechanism (not shown) that detects the position of the Z-stage 53 in the Z-direction, i.e., the position of the chuck top 70 in the Z-direction. This position detection mechanism is, for example, a linear encoder.

[0061] Additionally, the chuck top 70 is detachably held on the Z-stage 53. The Z-stage 53 holds the chuck top 70 by means of vacuum adsorption or the like using an adsorption holding mechanism (not shown).

[0062] The lower camera 80 is an example of a detection unit, used to detect the probes and positioning pins (described later) installed on the probe card 100. Additionally, the lower camera 80 is an example of an imaging unit, used to take images from above.

[0063] The lower camera 80 is fixed to the aligner 50. Specifically, the lower camera 80 is fixed to the Z-stage 53 of the aligner 50. Because of this fixing, the lower camera 80 can move together with the chuck top 70 via the aligner 50. The lower camera 80 is located, for example, in the area below the probe card 100 fixed to the spring frame 90, and takes pictures of the probe card 100.

[0064] The alignment device 50 and the lower camera 80 are controlled by the control unit 22. In addition, the shooting results of the lower camera 80 and the position detection results of the position detection mechanisms set on the X worktable 51, Y worktable 52 and Z worktable 53 are output to the control unit 22.

[0065] like Figure 4 As shown, the tester 40 has a tester mainboard 41 at its bottom. Multiple inspection circuit boards (not shown) are mounted on the tester mainboard 41 in an upright position. Additionally, multiple electrodes (not shown) are provided on the bottom surface of the tester mainboard 41. Furthermore, a spring frame 90 is provided below the tester 40.

[0066] The spring frame 90 is an example of a retaining part, holding the probe card 100. Furthermore, the spring frame 90 electrically connects the probe card 100 to the tester 40. For this electrical connection, the spring frame 90 has pogo pins 91, specifically, spring members 92 that hold multiple pogo pins 91. Additionally, the spring frame 90 has a frame body 93 for mounting the spring members 92. The probe card 100 is fixed to the lower surface of the spring frame 90 in a position aligned with a predetermined location.

[0067] Additionally, via an exhaust mechanism (not shown), the tester mainboard 41 is vacuum-adsorbed onto the elastic frame 90, and the probe card 100 is also vacuum-adsorbed onto the elastic frame 90. Through the vacuum attraction used for these vacuum adsorptions, the lower ends of each elastic pin 91 of the elastic frame 90 contact the corresponding electrodes on the upper surface of the card body 101 of the probe card 100 (described later), and the upper ends of each elastic pin 91 are pressed against the corresponding electrodes on the lower surface of the tester mainboard 41.

[0068] The probe card 100 has a circular card body 101 with multiple electrodes on its upper surface. Multiple needle-shaped contact terminals, i.e., probes 102, extending downward are provided on the lower surface of the card body 101.

[0069] The aforementioned plurality of electrodes disposed on the upper surface of the card body 101 are electrically connected to corresponding probes 102. Furthermore, during inspection, the probes 102 contact the electrodes (not shown) of the semiconductor devices formed on the wafer W. Therefore, during electrical characteristic inspection, electrical signals involved in the inspection are transmitted and received between the tester mainboard 41 and the semiconductor devices on the wafer W via the spring pin 91, the electrodes disposed on the upper surface of the card body 101, and the probes 102.

[0070] In addition, the inspection device 1 provides a plurality of probes 102 in a manner that covers approximately the entire lower surface of the card body 101 in order to perform electrical characteristic inspections of a plurality of semiconductor devices formed on the wafer W at the same time.

[0071] Additionally, a bellows 94 is installed on the lower surface of the elastic frame 90. The bellows 94 is an example of a cylindrical member, configured to be telescopic and formed into a cylindrical shape, creating a sealed space S between the chuck top 70 and the elastic frame 90. Furthermore, the bellows 94 hangs down from the elastic frame 90 around the probe clip 100. Figure 4 As shown by the dashed line, the bellows 94 is positioned below the probe card 100 to hold the top 70 of the chuck.

[0072] Furthermore, the bellows 94 holds the top 70 of the chuck in place by adsorption, forming a sealed space S for housing the probe card 100 and the wafer W. The sealed space S is surrounded by the elastic frame 90, the bellows 94, and the top 70 of the chuck, and is connected to one end of the exhaust path 93a formed in the frame body 93 of the elastic frame 90. At the other end of the exhaust path 93a, the pressure reduction mechanism 110 and the atmospheric opening mechanism 120 are connected.

[0073] The pressure reduction mechanism 110 reduces the pressure in the sealed space S. This maintains the contact between the wafer W and the probe 102. The pressure reduction mechanism 110 includes a vacuum pump for venting the sealed space S and a switching valve for switching the start and stop of the vacuum pump's venting, and is controlled by the control unit 22.

[0074] The atmospheric opening mechanism 120 is a mechanism for returning the sealed space S to atmospheric pressure by introducing air into the sealed space S. The atmospheric opening mechanism 120 includes a switching valve for switching the start and stop of introducing air into the sealed space S, and is controlled by the control unit 22. To return the sealed space S to atmospheric pressure, an inert gas or the like can also be introduced instead of air.

[0075] Therefore, in this embodiment, a plurality of positioning pins 130 are provided. The positioning pin 130 is an example of a positioning component, protruding downwards from the side of the spring frame 90 and contacting the upper surface of the chuck top 70, defining the height of the chuck top 70 relative to the probe 102. Specifically, the positioning pin 130 protrudes downwards from the lower surface of the spring frame 90, with its lower end contacting the upper surface of the chuck top 70, defining the height of the upper surface of the chuck top 70.

[0076] In addition, multiple positioning pins 130, for example, Figure 5 As shown, in the region outside the bellows 94, along the outer periphery of the bellows 94, on the same circumference centered on the center of the probe card 100, the locating pins 130 are spaced apart (specifically, equally spaced). Each locating pin 130 is, for example, cylindrical in shape.

[0077] The number of locating pins 130 is not limited to Figure 5 The example of four, can also be five or more or three, as long as the posture of the chuck top 70 at the specified height using the positioning pin 130 can be maintained horizontally.

[0078] In addition, in this embodiment, each positioning pin 130 is provided with an adjustment mechanism 140 for adjusting the height of the positioning pin 130.

[0079] Specifically, the adjusting mechanism 140 adjusts the height of the lower end of the positioning pin 130. In other words, the adjusting mechanism 140 adjusts the protrusion length (i.e., protrusion amount) of the positioning pin 130 protruding downward from the lower surface of the elastic frame 90.

[0080] The adjustment mechanism 140 includes a drive unit (not shown) for adjusting the height of the corresponding positioning pin 130, which drives the positioning pin 130 to rise and fall. The drive unit includes, for example, an electric motor (not shown) as a drive mechanism to generate the driving force for the aforementioned rising and falling. Additionally, the drive unit includes an encoder (not shown) connected to the electric motor. The encoder outputs a number of pulses corresponding to the amount of movement of the positioning pin 130 driven by the electric motor to the control unit 22. The control unit 22 can obtain the height of the corresponding positioning pin 130 based on the output from the encoder.

[0081] Furthermore, a torque detection unit is provided for the drive section of the adjustment mechanism 140 as a detection unit for detecting the load of the drive section. The torque detection unit detects, for example, the torque of the motor of the drive section and outputs the detection result to the control unit 22. The control unit 22 can detect the contact between the corresponding positioning pin 130 and the top of the chuck 70 based on the output from the torque detection unit.

[0082] <Inspection process using inspection device 1>

[0083] Next, use Figures 6-12 The inspection process using inspection device 1 will be explained.

[0084] (S1: Move in)

[0085] First, the wafer W to be inspected is transported to the desired segmentation region 13a.

[0086] Specifically, the conveying device 30, etc., is controlled by the control unit 22 to take out the wafer W from the cassette C in the port 20 of the loading and unloading area 11, for example, to the middle dividing area 13a, and place it on the top 70 of the chuck that is held in place by the alignment device 50.

[0087] (S2: Obtain the probe's position and height in the horizontal direction)

[0088] Then, the control unit 22 acquires the horizontal position (hereinafter referred to as "horizontal position") and height of the probe 102 based on the detection results obtained from the lower camera 80. Specifically, under the control of the control unit 22, as... Figure 6 As shown, the chuck top component 70 is moved by the aligner 50, so that the lower camera 80 is located in the area below the probe chuck 100. Then, the horizontal position and height of the probe 102 are obtained by the control unit 22 based on the shooting results of the lower camera 80 and the detection results of the position detection mechanism of the aligner 50.

[0089] The horizontal position and height of probe 102 are, for example, the horizontal position and height of the center of gravity (center) of the lower end of probe 102 at multiple predetermined locations in probe 102 of probe card 100.

[0090] (S3: Get the height of the positioning pin)

[0091] Then, the height of the positioning pin 130 is obtained using the lower camera 80 via the control unit 22. Specifically, under the control of the control unit 22, such as... Figure 7 As shown, the chuck top 70 is moved by the aligner 50, so that the lower camera 80 is located in the area below the positioning pin 130. Then, the control unit 22 obtains the height of the positioning pin 130 based on the shooting result of the lower camera 80 and the detection result of the position detection mechanism of the aligner 50. Specifically, the height of the positioning pin 130 is the height of the lower end of the positioning pin 130.

[0092] In another embodiment, the height of each positioning pin 130 is obtained.

[0093] (S4: Obtaining the horizontal position and height of the chip)

[0094] Next, the upper camera 60, controlled by the control unit 22, acquires the horizontal position and height of the wafer W on the chuck top 70 held by the alignment device 50. Specifically, under the control of the control unit 22, as... Figure 8 As shown, the chuck top 70 is moved to the area below the upper camera 60 by the aligner 50. Then, the horizontal position and height of the wafer W on the chuck top 70 are obtained by the control unit 22 based on the shooting results of the upper camera 60 and the detection results of the position detection mechanism of the aligner 50.

[0095] The horizontal position of the aforementioned wafer W is, for example, the horizontal position of the center of gravity of the electrodes located at a predetermined location in the electrodes of the wafer W.

[0096] (S5: Obtaining the height of the top of the chuck)

[0097] Additionally, the height of the chuck top 70 held by the alignment device 50 is obtained using the upper camera 60 via the control unit 22. Specifically, under the control of the control unit 22, as... Figure 9 As shown, the chuck top 70 is moved to the area below the upper camera 60 by the alignment device 50. Then, the control unit 22 obtains the height of the chuck top 70 contacted by the positioning pin 130 based on the shooting result of the upper camera 60 and the detection result of the position detection mechanism of the alignment device 50. Specifically, the height of the chuck top 70 is the height of the upper surface of the outer periphery of the chuck top 70.

[0098] (S6: Adjust the locating pin to the reference height)

[0099] Subsequently, based on the height of probe 102, the height of positioning pin 130, the height of wafer W, and the height of chuck top 70 obtained by control unit 22, the height of positioning pin 130, i.e., the downward protrusion length, is set so that the overdrive amount OD is zero. That is, by adjusting mechanism 140, positioning pin 130 is positioned at a reference height where the overdrive amount OD is zero. This reference height is set such that the moment when probe 102 contacts wafer W and the moment when positioning pin 130 contacts chuck top 70 are approximately the same.

[0100] The height of the positioning pin 130 can be set without using the height of the chip W obtained by the control unit 22, or it can be replaced by information such as the thickness of the chip W that has been stored in advance.

[0101] (S7: The chip W moves downwards towards the probe card)

[0102] After steps S2 to S6, under the control of the control unit 22, as follows: Figure 10 As shown, the chuck top 70 is moved downwards from the probe card 100 by the alignment device 50. At this time, the wafer W and the probe 102 of the probe card 100 are aligned based on the results obtained in steps S2 and S4.

[0103] (S8: Formation of enclosed spaces)

[0104] Next, under the control of the control unit 22, the chuck top component 70 is raised using the alignment device 50, as... Figure 11 As shown, a sealed space S is formed. Specifically, for example, under the control of the control unit 22, the chuck top 70 is raised by the alignment device 50 until it abuts against the lower end of the bellows 94, and then the chuck top 70 is held in place by the bellows 94. Thus, a sealed space S, which is surrounded by the elastic frame 90, the bellows 94, and the chuck top 70, can be formed, and which houses the probe card 100 and the wafer W inside.

[0105] (S9: Pressure reduction in the enclosed space, and contact between the positioning pin and the top of the chuck)

[0106] Next, under the control of the control unit 22, the sealed space S is depressurized, and the positioning pins 130, which have been adjusted to the reference height, are brought into contact with the upper surface of the chuck top 70. Through this contact, the wafer W on the chuck top component 70 is kept parallel to the probe 102.

[0107] Specifically, for example, under the control of the control unit 22, the chuck top 70 separates from the alignment device 50, and the sealed space S is depressurized by the depressurization mechanism 110. As a result, the chuck top 70 rises, as... Figure 12As shown, the wafer W on the chuck top component 70 is in contact with the probe 102, and the lower end of the positioning pin 130 is in contact with the upper surface of the chuck top component 70.

[0108] (S10: Adjustment of the height of the top of the chuck and the positioning pin 130)

[0109] Subsequently, the height of the positioning pin 130, i.e., the target height, which is the desired overdrive amount OD, is obtained by the control unit 22. While adjusting the driving amount of the adjustment mechanism 140 to raise the positioning pin 130, the chuck top member 70 is raised. Specifically, the control unit 22 obtains the target height from the storage unit (not shown) for all positioning pins 130 and monitors the driving amount of the adjustment mechanism 140 on the positioning pins 130, which is related to the height of the positioning pins 130, so that each positioning pin 130 is moved to the target height. At this time, by continuing to depressurize the sealed space S, the chuck top 70 rises along with the positioning pins 130. As a result, the probe 102 can make uniform contact with the wafer W with the desired contact pressure.

[0110] Furthermore, when the chuck top 70 rises, the adjustment mechanism 140 is adjusted to increase the driving amount of the locating pins 130, thereby maintaining contact between all the locating pins 130 and the chuck top 70. This ensures the parallelism of the chuck top 70.

[0111] (S11: Inspection)

[0112] Then, under the control of the control unit 22, the electrical characteristics of the electronic devices formed on the wafer W are checked.

[0113] The electrical signal used for electrical characteristic testing is input from the tester 40 to the electronic device via the spring needle 91, probe 102, etc.

[0114] (S12. Move out)

[0115] After that, the inspected chip W was taken out.

[0116] Specifically, under the control of the control unit 22, the top 70 of the chuck, which is attached to the bellows 94, is handed over to the aligner 50 and held by the aligner 50. In addition, the inspected wafer W on the top 70 of the chuck, held by the aligner 50, is removed from the inspection area 13 by the transport device 30 and sent back to the cassette C in the port 20 of the loading / unloading area 11.

[0117] The steps S1 to S12 described above are performed for each wafer W. Furthermore, during inspection by one tester 40, the alignment device 50 can be used to transfer the wafer W to be inspected to other testers 40 and to retrieve the inspected wafer W from other testers 40.

[0118] <Main Effects of This Implementation Method>

[0119] In this embodiment, during inspection, the chuck top member 70 is raised while the positioning pin 130 is raised, based on the reference height of the positioning pin 130 calculated from the results obtained by the camera, which is the contact height (the position where the overdrive amount OD is zero) between the probe 102 and the wafer W. Therefore, the probe 102 can be made to make proper contact with the wafer W. Furthermore, because the positioning pin 130 can maintain the parallelism of the chuck top 70, uniform in-plane contact with the desired overdrive amount is possible.

[0120] Furthermore, in this embodiment, the lower camera 80 is used to actually detect the lower end of the positioning pin 130. Moreover, based on the detection results, a reference height for the positioning pin 130 is set. Therefore, the lower end of the positioning pin 130 can be positioned at the target height independently of the state of the positioning pin 130 (e.g., the degree of thermal expansion of the positioning pin 130, the tilt of the positioning pin 130). Therefore, the probe 102 can be properly contacted with the wafer W independently of the state of the positioning pin 130.

[0121] The embodiments described herein are illustrative in all respects and should not be considered limiting. The described embodiments can be omitted, substituted, or modified in various ways without departing from the scope and spirit of the invention.

[0122] For example, the locating pin 130 may be configured such that it is located on the side of the chuck top 70 and contacts the lower surface of the spring frame 90.

Claims

1. An inspection apparatus for inspecting a substrate, the inspection apparatus characterized by comprising: A mounting component capable of holding a substrate; A retaining part for the probe card, the probe card having probes capable of contacting the substrate; A plurality of positioning components that contact the upper surface of the mounting component or the lower surface of the holding portion to define the height of the mounting component relative to the probe; An adjustment mechanism for adjusting the height of the positioning component; A detection unit for detecting the probe, the mounting component, and the positioning component; and Control Department The control unit is configured to perform the following steps: The step of obtaining the height of the probe based on the detection result obtained using the detection unit; The step of obtaining the height of the mounting component based on the detection results of the mounting component obtained using the detection unit; The step of obtaining the height of the positioning component based on the detection result of the positioning component obtained using the detection unit; Based on the detection results of the probe, the mounting component, and the positioning component obtained using the detection unit, the step of using the adjustment mechanism to position the positioning component at a reference height where the overdrive amount is zero; The step of raising the mounting component to contact the positioning component; and The step of obtaining the height of the positioning member that results in the desired overdrive amount, and raising the mounting member until the positioning member is at that height while adjusting the drive amount of the adjustment mechanism.

2. The inspection device as described in claim 1, characterized in that: The reference height at which the overdrive is zero is the height at which the substrate on the mounting component contacts the probe.

3. The inspection device as described in claim 1 or 2, characterized in that, Also includes: A retractable cylindrical component that forms a sealed space between the mounting component and the retaining part; and The exhaust path that reduces pressure in the sealed space. The control unit is configured to perform a step of depressurizing the enclosed space containing the substrate and the probe card.

4. The inspection device as described in claim 1 or 2, characterized in that: The reference height is set for each of the positioning components.

5. The inspection device as described in claim 3, characterized in that: The reference height is set for each of the positioning components.

6. An inspection method for inspecting a substrate using an inspection device, characterized in that: The inspection device includes: A mounting component capable of holding a substrate; A retaining part for the probe card, the probe card having probes capable of contacting the substrate; A plurality of positioning components that contact the upper surface of the mounting component or the lower surface of the holding portion to define the height of the mounting component relative to the probe; An adjustment mechanism for adjusting the height of the positioning component; and A detection unit for detecting the probe, the mounting component, and the positioning component. The inspection method includes: The step of obtaining the height of the probe based on the detection result obtained using the detection unit; The step of obtaining the height of the mounting component based on the detection results of the mounting component obtained using the detection unit; The step of obtaining the height of the positioning component based on the detection result of the positioning component obtained using the detection unit; Based on the detection results of the probe, the mounting component, and the positioning component obtained using the detection unit, the step of using the adjustment mechanism to position the positioning component at a reference height where the overdrive amount is zero; The step of raising the mounting component to contact the positioning component; and The step of obtaining the height of the positioning member that results in the desired overdrive amount, and raising the mounting member until the positioning member is at that height while adjusting the drive amount of the adjustment mechanism.

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