Light emitting module

Abstract

The application discloses a light-emitting module, which comprises a light guide plate, a light-emitting assembly and an adhesive member. The light-emitting assembly is arranged correspondingly to the light guide plate, and the light-emitting assembly comprises a substrate and a plurality of light-emitting elements. The substrate comprises a first surface, the first surface comprises an element arrangement area and a flat area, the substrate comprises a base material, a first conductive layer, a second conductive layer, a first insulating layer and a second insulating layer, the first insulating layer and the second insulating layer are arranged on opposite surfaces of the base material respectively, the first conductive layer is arranged between the first insulating layer and the base material, and the second conductive layer is arranged between the second insulating layer and the base material. The plurality of light-emitting elements are arranged on the element arrangement area. The adhesive member connects the light guide plate and the flat area. The application can improve the uneven light and dark phenomenon and improve the optical taste.

Description

[0001] This application is a divisional application of Chinese invention patent application filed on May 9, 2018, with application number "201810436224.5" and entitled "Display Device and Assembly Method Thereof". Technical Field

[0002] This application relates to a display device and its assembly method, and particularly to a display device and its assembly method that can improve uneven brightness. Background Technology

[0003] In recent years, continuous improvements in the manufacturing process and materials of light-emitting diodes (LEDs) have led to a significant increase in their luminous efficiency. Unlike ordinary fluorescent lamps or energy-saving light bulbs, LEDs have characteristics such as low power consumption, long lifespan, high safety, short light-emitting response time, and small size. Therefore, they are increasingly being used in lighting equipment, such as indoor lamps, flashlights, car headlights, and other lighting devices, or in backlight modules of flat panel displays.

[0004] Taking an edge-lit backlight module used in liquid crystal display devices as an example, an edge-lit backlight module generally includes a light-emitting component and a light guide plate corresponding to the light-emitting component. The light-emitting component is, for example, an LED light bar, which is located on the side of the light guide plate to emit light that is incident on the light guide plate. The function of the light guide plate is to guide the direction of light transmission and to provide a uniform surface light source through total internal reflection.

[0005] In the current design of light-emitting components, a groove is made on the front side of the light-emitting element to electrically insulate the traces or conductive film layers with different electrical properties from each other. However, the groove can easily cause air bubbles to form on the adhesive, causing the adhesive to peel off and making it impossible to fix the light guide plate. This results in uneven brightness (hotspot) in the display device, affecting its optical quality. Summary of the Invention

[0006] The purpose of this application is to provide a display device and its assembly method, which can improve uneven brightness and enhance the optical quality of the display device.

[0007] This application discloses a display device including a backlight module, which comprises a light guide plate, a light-emitting component, and an adhesive. The light-emitting component is correspondingly disposed with the light guide plate and includes a substrate and a plurality of light-emitting elements. The substrate includes a first surface, which includes an element placement area and a flat area. A first gap exists between the flat area and the element placement area, and the flat area and the element placement area are electrically insulated from each other. The light-emitting elements are disposed on the element placement area. The adhesive connects the light guide plate and the flat area.

[0008] This application also proposes a method for assembling a display device, comprising: providing a light guide plate; providing a light-emitting component, such that the light-emitting component and the light guide plate are correspondingly disposed, wherein the light-emitting component includes a substrate and a light-emitting element, the substrate has a first surface, the first surface includes an element placement area and a flat area, the flat area and the element placement area have a first gap, and the flat area and the element placement area are electrically insulated from each other, and the light-emitting element is disposed on the element placement area; disposing an adhesive on the flat area of ​​the substrate or the light guide plate; and connecting the light guide plate and the flat area of ​​the substrate through the adhesive.

[0009] As described above, in the display device and its assembly method of this application, the first surface of the substrate of the backlight module includes a component placement area and a flat area. The flat area and the component placement area are spaced apart and electrically insulated from each other, and the adhesive connects the light guide plate and the flat area. Since the flat area of ​​the substrate is generally flat, it is less likely to generate air bubbles after the adhesive is pasted, thus forming a generally flat surface. Therefore, after the light guide plate is placed on the adhesive, the adhesive is not easy to peel off, thereby solving the problem of uneven brightness in the display device and improving its optical quality. Attached Figure Description

[0010] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings, wherein:

[0011] Figure 1A This is a cross-sectional schematic diagram of a display device according to an embodiment of this application.

[0012] Figure 1B for Figure 1A A three-dimensional schematic diagram of the light-emitting components and light guide plate of the display device.

[0013] Figure 2A This is a partial top view of the first surface of a substrate according to an embodiment of this application.

[0014] Figure 2B This is a partial top view of the second surface of a substrate according to an embodiment of this application.

[0015] Figure 2C for Figure 2A A cross-sectional view of the substrate along line AA.

[0016] Figure 3 This is a circuit diagram of a light-emitting element according to an embodiment of this application.

[0017] Figure 4A This is a circuit diagram of a light-emitting element according to another embodiment of this application.

[0018] Figure 4B This is a partial top view of the front of a substrate according to another embodiment of this application.

[0019] Figure 4C This is a partial top view of the front of a substrate according to another embodiment of this application.

[0020] Figure 5A and Figure 5B These are assembly process flowcharts for a display device according to an embodiment of this application.

[0021] Figure 6 This is a schematic diagram of a display device according to another embodiment of this application. Detailed Implementation

[0022] The following provides a detailed description of component substrates, display devices, and manufacturing methods of display devices according to some embodiments of this application. It should be understood that the following description provides many different embodiments or examples to implement different variations of some embodiments of this application. The specific components and arrangements described below are merely for simple and clear description of some embodiments of this application. Of course, these are only examples and not limitations of this application. Furthermore, repeated reference numerals or designations may be used in different embodiments. These repetitions are only for simple and clear description of some embodiments of this application and do not represent any connection between the different embodiments and / or structures discussed. Moreover, when a first material layer is mentioned as being located on or above a second material layer, this includes the case where the first material layer and the second material layer are in direct contact. Alternatively, there may be a situation where one or more other material layers are spaced apart, in which case the first material layer and the second material layer may not be in direct contact.

[0023] Here, the terms "about," "approximately," and "roughly" generally indicate within 20%, preferably within 10%, and even more preferably within 5%, or within 3%, or within 2%, or within 1%, or within 0.5%, of a given value or range. The quantity or degree given here is an approximate quantity or degree, that is, the meaning of "about," "approximately," and "roughly" may still be implied even without specific mention of "about," "approximately," or "roughly."

[0024] Please refer to Figure 1A and Figure 1B As shown, where, Figure 1A This is a cross-sectional schematic diagram of a display device according to an embodiment of this application. Figure 1B for Figure 1A A three-dimensional schematic diagram of the light-emitting components and light guide plate of the display device.

[0025] like Figure 1A and Figure 1B As shown, the display device 1 includes a backlight module 2 and a display panel 3. The backlight module 2 and the display panel 3 are arranged opposite to each other. The backlight module 2 can emit light that passes through the display panel 3, so that the display panel 3 displays an image.

[0026] The backlight module 2 includes a light guide plate 21, a light-emitting component 22, and an adhesive 23. The light guide plate 21 is correspondingly disposed with respect to the light-emitting component 22. The light guide plate 21 includes an incident light surface 211 and an emitting light surface 212. For example, light emitted by the light-emitting component 22 can enter the light guide plate 21 through the incident light surface 211 and exit through the emitting light surface 212. The light guide plate 21 may contain a light-transmitting material, such as acrylic resin, polycarbonate, polyethylene resin, or glass, and is not limited thereto. In addition, the cross-sectional shape of the light guide plate 21 may be, for example, flat or wedge-shaped. Here, a flat light guide plate 21 is taken as an example. It is worth mentioning that in other embodiments, another light-emitting component (not shown in the figure) may be disposed on the opposite side of the incident light surface 211 of the light guide plate 21, so that the two light-emitting components respectively emit light into the light guide plate 21 from the light-emitting surfaces on opposite sides, and this application is not limited thereto.

[0027] The light-emitting component 22 may include a substrate 221 and a plurality of light-emitting elements 222. The substrate 221 may be a flexible circuit board, a printed circuit board, a rigid-flex board, or other suitable substrate. In this embodiment, the substrate 221 is a flexible circuit board, and a flexible printed circuit (FPC) is used as an example; its material includes, but is not limited to, polyimide (PI). The substrate 221 has a first surface S1 and a second surface S2 opposite to the first surface S1. Figure 1B In this embodiment, the first surface S1 can be the upper surface (front) of the substrate 221, and the second surface S2 can be the lower surface (back) of the substrate 221. The light-emitting element 222 is disposed on the substrate 221 along direction D1. In this embodiment, as... Figure 1B As shown, direction D1 is parallel to the light incident surface 211 of the light guide plate 21, and a plurality of light-emitting elements 222 are spaced apart along direction D1 on the first surface S1 of the substrate 221. The light-emitting elements 222 may include light-emitting diodes (LEDs), organic light-emitting diodes (OLEDs), or micro light-emitting diodes (or mini light-emitting diodes). Here, the light-emitting component 22 is exemplified by an LED light bar. In some embodiments, the chip size of the light-emitting diode is approximately between 300 micrometers (μm) and 10 millimeters (mm), the chip size of the sub-millimeter type light-emitting diode (mini LED) is approximately between 100 micrometers (μm) and 300 micrometers (μm), and the chip size of the micro light-emitting diode (microLED) is approximately between 1 micrometer (μm) and 100 micrometers (μm), but this application is not limited thereto.

[0028] Figure 2A This is a partial top view schematic diagram of the first surface of a substrate according to an embodiment of the present application. Figure 2B This is a partial top view schematic diagram of the second surface of a substrate according to an embodiment of the present application, while Figure 2C is Figure 2A A cross-sectional view of the substrate along line A-A. Herein, Figure 2A is a partial schematic view of looking down on the first surface S1 of the substrate 221 (referred to as the front side herein), while Figure 2B is a partial schematic view of looking up at the second surface S2 of the substrate 221 (referred to as the back side herein).

[0029] Please refer to Figure 1A and Figure 1B and Figure 2A shown. In this embodiment, the first surface S1 includes an element setting area S11 and a flat area S12. There is a first gap d1 between the flat area S12 and the element setting area S11, and the flat area S12 and the element setting area S11 are electrically insulated from each other. In this embodiment, the flat area S12 and the element setting area S11 are electrically insulated by the first gap d1. This first gap d1 can be greater than 0 millimeters (mm) and less than 0.3 millimeters (0 mm < d1 < 0.3 mm). In some embodiments, the first gap d1 can be greater than 0.1 millimeter and less than 0.2 millimeters (0.1 mm < d1 < 0.2 mm), for example, 0.15 millimeters. In one embodiment, an insulating material can be disposed between the flat area S12 and the element setting area S11 to make the flat area S12 and the element setting area S11 electrically insulated from each other. The width of the insulating material is equivalent to the first gap d1. Additionally, the first gap d1 has an extending direction. As Figure 1B and Figure 2A shown, a plurality of light-emitting elements 222 are arranged along this extending direction, and this extending direction is the aforementioned direction D1.

[0030] In addition, the element setting area S11 of this embodiment includes a plurality of pairs of electrically connected pads P1, P2 ( Figure 2A ), so that the two positive and negative electrodes (not shown) of the light-emitting element 222 can be disposed in the element setting area S11 through the electrically connected pads P1, P2. In some embodiments, the minimum distance d3 between the electrically connected pads P1, P2 and the flat area S12 can be between 0.075 millimeters and 0.3 millimeters (0.075 mm ≤ d3 ≤ 0.3 mm).

[0031] The light guide plate 21 is disposed on the flat area S12 ( Figure 1B ), and the light-emitting elements 222 are arranged along the direction D1 and disposed in the element setting area S11 ( Figure 1B and Figure 2A), and is disposed opposite to the light-incident surface 211 of the light guide plate 21. In one embodiment, the adhesive 23 (e.g., but not limited to double-sided tape, or formed by curing an adhesive material) is adhered and disposed on the flat area S12. Figure 1B The adhesive 23 connects the light guide plate 21 and the flat area S12, so that the light incident surface 211 of the light guide plate 21 can face the light-emitting element 222.

[0032] It is worth mentioning that the aforementioned component placement area S11 refers to the area where light-emitting elements (e.g., LEDs) 222 and / or other components are placed on the substrate 221, while the flat area S12 is a region separated from the component placement area S11 by a first interval d1 and is a region where no light-emitting elements 222 are placed. Since the substrate 221 is generally flat in the flat area S12, the adhesive 23, when attached to the flat area S12, also forms a generally flat surface, thus making it difficult for the adhesive 23 to peel off after the light guide plate 21 is attached to it.

[0033] In one embodiment, the flat region S12 can achieve a generally flat surface by, for example, providing a filler layer. This filler layer can be a conductive material layer, a polymer material layer, or other suitable filler layer. Highly conductive materials are generally also highly thermally conductive materials, so using a filler layer made of conductive material can help the light-emitting component 22 dissipate heat. In some embodiments, this filler layer can be fabricated using the same conductive material (e.g., but not limited to, a copper layer) and process as the element placement region S11 to form the flat region S12, thereby reducing the manufacturing cost of the light-emitting component 22 (if different materials are used, different processes will be used, increasing the cost). Of course, in another embodiment, a different material than that used in the element placement region S11 can also be used to form the flat region S12. In yet another embodiment, the Young's modulus of the filler layer can be between 6 × 10⁻⁶. 10 Pa (60 GPa) and 15 × 10 10 Between 150 GPa, for example, 10 × 10 10 Pa. When the Young's modulus of the fill layer is low, for example below 6 × 10⁻⁶. 10 When the Young's modulus of the filler layer is high, for example, higher than 15 × 10⁻⁶, the substrate 221 is prone to bending or warping. 10 When the substrate 221 is not easily deformed, most of the stress will be borne by the reflector 24 during impact or shaking. Figure 1A This absorption increases the likelihood of damage to the reflector 24.

[0034] In this embodiment, as Figure 2AAs shown, the flat area S12 has a first width w1 (i.e., the width of the filler layer) along the vertical extension direction (direction D1) in direction D2, and the substrate 221 has a second width w2 (i.e., the width of the substrate 2211) along the vertical extension direction (D1) in direction D2. The ratio of the first width w1 to the second width w2 (w1 / w2) can be between 0.20 and 0.85 (0.2≦(w1 / w2)≦0.85). In some embodiments, the first width w1 can be between 2 mm and 5 mm, for example, 3.5 mm. The second width w2 can be between 2.35 mm and 25 mm, for example, 5 mm, 10 mm, or 15 mm, and the width of the conductive material layer (e.g., copper layer) of the component placement area S11 along direction D2 can be between 0.6 mm and 1.2 mm.

[0035] Additionally, please refer to Figure 2A , Figure 2B and cooperate Figure 2C As shown, the substrate 221 of this embodiment includes a first protective layer 223a, an adhesive layer 224a, a leveling layer 225a, a substrate 2211, and conductive layers 225b and 225c (e.g., but not limited to, copper layers). In some embodiments, the substrate 221 may include a leveling layer 225a and conductive layers 225b and 225c, respectively disposed on opposite sides of the substrate 2211. In some embodiments, the substrate 221 may also include a first protective layer 223a and an adhesive layer 224a, with the adhesive layer 224a disposed on the leveling layer 225a and the first protective layer 223a disposed on the adhesive layer 224a. For example, the first protective layer 223a may be disposed on the flat region S12. In another embodiment, the substrate 221 may further include a second protective layer 223b and an adhesive layer 224b, wherein the adhesive layer 224b is disposed on the conductive layers 225b and 225c, and the second protective layer 223b is disposed on the adhesive layer 224b. Figure 2CThe upper surface of the substrate 2211 can be referred to as the first surface S1, and the lower surface of the substrate 2211 can be referred to as the second surface S2. The first protective layer 223a, the adhesive layer 224a, and the planarizing layer 225a are located on the upper surface (the first surface S1) of the substrate 2211, while the conductive layer 225b, the conductive layer 225c, the adhesive layer 224b, and the second protective layer 223b are located on the lower surface (the second surface S2) of the substrate 2211. Among them, the first protective layer 223a is attached to the planarizing layer 225a by the adhesive layer 224a, and the second protective layer 223b is attached to the conductive layer 225b and the conductive layer 225c by the adhesive layer 224b to protect the planarizing layer 225a and the conductive layer 225b and 225c respectively. The first protective layer 223a and the second protective layer 223b can have the same or different materials, or the same or different thicknesses, which are not limited in this application. In some embodiments, the materials of the first protective layer 223a and the second protective layer 223b can be, for example but not limited to, epoxy resin or acrylic.

[0036] In some embodiments, as Figure 2C shown, the thickness d5 of the first protective layer 223a can be greater than 0 micrometers and less than 30 micrometers (0μm < d5 < 30μm). In some embodiments, the thickness d5 of the first protective layer 223a can be greater than 10 micrometers and less than 26 micrometers (10μm < d5 < 26μm), for example, 25 micrometers. In the known art, the thickness of the protective layer of the light-emitting component is less than 10 micrometers. In this embodiment, the relatively thick first protective layer 223a is used to cover the film layer (the planarizing layer 225a). In addition to having a greater protective effect, it can also reduce the gap between the conductive layers 225b and 225c on the second surface S2 (that is Figure 2B and Figure 2C the d2) on the flat area S12 of the first surface S1, thereby increasing the flatness of the flat area S12, so that it is not easy to form bubbles and peel between the adhesive member 23 and the substrate 221.

[0037] Please refer to Figures 2A to 2C again. Here, the conductive layers 225b and 225c located on the second surface S2 are electrically insulated from each other and are respectively connected to two electrodes of the light-emitting element 222. Specifically, the light-emitting element 222 in this embodiment can be at least partially connected in series in sequence. Figure 3 is a circuit schematic diagram of the light-emitting element 222 according to an embodiment of this application. In this embodiment, some adjacent light-emitting elements can be electrically connected in series. Here, 40 light-emitting elements 222 are taken as an example, but this application is not limited thereto. As Figure 1B shown, these 40 light-emitting elements 222 are arranged in sequence along the direction D1, which are respectively the 1st, the 2nd, the 3rd,... and the 40th (as Figure 3As shown, the arrangement order is marked above the corresponding light-emitting elements). For example, the light-emitting elements adjacent to the second light-emitting element 222 are the first light-emitting element 222 and the third light-emitting element 222. In some embodiments, such as Figure 3 As shown in the electrical connection relationship between the light-emitting elements 222, among the 40 light-emitting elements 222, for example, 10 consecutive adjacent light-emitting elements 222 are electrically connected in series in sequence. Therefore, after obtaining 4 groups of light-emitting element groups that are electrically connected in series in sequence, these 4 groups are then electrically connected in parallel to each other. It should be noted that in Figure 3 In the electrical connection diagram, the second light-emitting element 222 is adjacent to the twelfth light-emitting element 222, but in the physical position, the second light-emitting element 222 is not adjacent to the twelfth light-emitting element 222. As Figure 2A shown, there are no traces in the flat area S12 of the first surface S1. Moreover, the lines connecting the positive and negative electrodes of the light-emitting element 222 (i.e., Figure 2B the conductive layers 225b, 225c) are all provided on the second surface S2 of the substrate 221, and the conductive layers 225c and 225b are electrically insulated from each other, and there is a second interval d2 between the conductive layers 225b and 225c. This second interval d2 can be greater than 0 mm and less than 0.3 mm (0 mm < d2 < 0.3 mm). In some embodiments, the second interval d2 can be greater than 0 mm and less than 0.2 mm (0 mm < d2 < 0.2 mm), for example, 0.1 mm.

[0038] In one embodiment, as Figure 2A shown, the electrical connection pads P1, P2 on the first surface S1 can be electrically connected to the conductive layers (225b, 225c) located on the second surface S2 through the conductive layers 225d, 225e. In addition, at least one through hole h can be located in the element setting area S11. Here, the through hole h can be filled with a conductive material (not shown), so that the conductive layers on the first surface S1 and the second surface S2 can be electrically connected to each other through the through hole h. Specifically, the conductive layer 225b on the second surface S2 can be electrically connected to the conductive layer 225d on the first surface S1 through the through hole h1 (and the conductive material therein), and the conductive layer 225c on the second surface S2 can be electrically connected to the conductive layer 225e on the first surface S1 through another through hole h2 (and the conductive material therein), so that electrical signals can be transmitted to the conductive layers 225d, 225e on the first surface S1 through the conductive layers 225b, 225c on the second surface S2 respectively, and then transmitted to the electrical connection pads P1, P2 and the positive and negative electrodes of the light-emitting element 222 to drive the light-emitting element 222 to emit light. It is worth mentioning that since the film layer on the flat area S12 of the first surface S1 in this embodiment is not used for the conduction of the light-emitting element 222, there is no need to set through holes on the flat area S12 to conduct the film layers on the first surface S1 and the second surface S2 of the substrate 221.

[0039] The following describes other structures of the display device 1. Referring again to 1A, the backlight module 2 of this embodiment may also include a reflector 24. In addition, the display device 1 of this embodiment may also include a back plate 11, at least one optical film 12, a frame 13, and a reflector 24a.

[0040] The backplate 11, for example but not limited to, is made of metal or plastic, and is used to support the backlight module 2 and prevent it from being damaged by impact. A reflector 24 is disposed between the backplate 11 and the light guide plate 21 to reflect light emitted from the bottom surface 213 of the light guide plate 21 back to the light guide plate 21, thereby improving light utilization. A frame 13 is disposed on the side of the light-emitting component 22 opposite to the light guide plate 21, and the supporting portion 131 of the frame 13 supports the display panel 3, allowing the display panel 3 to be positioned opposite the backlight module 2. The light-emitting component 22 and the light guide plate 21 are sandwiched between the supporting portion 131 and the backplate 11, and a reflector 24a is sandwiched between the supporting portion 131 and the light-emitting component 22. The relative relationship and technical details of the light-emitting component 22 and the light guide plate 21 have been described in detail above. The reflectors 24 and 24a can be reflective plates, reflective sheets, reflective films, or coated with a reflective film layer, etc. Here, reflectors 24 and 24a are respectively exemplified by reflective sheets. Reflectors 24 and 24a have reflective materials, which may include, for example, metals, metal oxides, high-reflectivity paint (white paint), or combinations thereof.

[0041] At least one optical film 12 is disposed between the light guide plate 21 and the display panel 3. The optical film 12 is, for example, but not limited to, a brightness enhancement film, a prism film, or a diffusion film. In practical applications, multiple optical films 12 may be designed on the light-emitting surface 212, depending on the intended use of the backlight module 2. Figure 1A The illustration shows four optical films (the component symbol is still marked as 12). This application does not limit the quantity or the use of these films.

[0042] Therefore, in the display device 1 of this embodiment, the flat area S12 of the substrate 221 is substantially flat, so that the adhesive 23, when attached to the flat area S12, also forms a substantially flat surface. Furthermore, air bubbles are less likely to form between the adhesive 23 and the substrate 221, making it less likely for the adhesive 23 to peel off after the light guide plate 21 is attached to it. Thus, the uneven brightness of the display device 1 can be resolved, improving its optical quality.

[0043] Please refer to Figure 4A and Figure 4B As shown, Figure 4A This is a circuit diagram of the light-emitting element 222a according to another embodiment of this application, and Figure 4B This is a partial top view of the front of substrate 221a according to another embodiment of this application. Here, Figure 4AThis is a circuit diagram showing the LED 222a using a jumper connection. Figure 4B This refers to the partial front-side configuration of the substrate 221a when the light-emitting element 222a is connected via a jumper.

[0044] Figure 4A Taking 40 light-emitting elements 222a as an example, in some embodiments, some adjacent light-emitting elements may be electrically connected in parallel. For example, the light-emitting elements 222a are arranged sequentially along direction D1, and they are respectively the 1st, 2nd, 3rd..., 40th light-emitting elements (e.g., Figure 4A As shown (the order is indicated above the corresponding light-emitting elements), for example, the second light-emitting element 222a is adjacent to the first light-emitting element 222a. In some embodiments, "jumping" means that among the 40 light-emitting elements 222a, the light-emitting elements 222a are not connected in series sequentially, but rather non-adjacent light-emitting elements 222a are connected in series along direction D1. For example, the light-emitting elements 222a of the 1st, 5th, ..., 33rd, 37th are connected in series in the above order (a total of 10 light-emitting elements 222a), and the light-emitting elements 222a of the 2nd, 6th, ..., 34th, 38th (a total of 10 light-emitting elements 222a) are connected in series in the above order, and so on, thus obtaining four series of jump-connected light-emitting elements. These four groups of light-emitting elements are then connected in parallel with each other. Figure 4B As shown, similarly, there are no lines in the flat region S12 of the first surface S1. Furthermore, Figure 4B and Figure 2A Another difference is that, Figure 4B In the illustrated embodiment, the element placement area S11 extends in a direction away from the flat area S12, and the space extended by the element placement area S11 provides a circuit for the light-emitting element 222 to be connected. Other technical contents of the substrate 221a can be referred to the same elements of the substrate 221 described above.

[0045] Additionally, please refer to Figure 4C This is a partial top view of the front of substrate 221b according to another embodiment of this application. Substrate 221b and... Figure 4A The substrate 221b is roughly the same as the substrate 221a. The difference is that the conductive layers 225f and 225g of the substrate 221b have a larger laying area (there is an additional film layer in region B). The conductive layers 225f and 225g in this region B are connected to the electrical connection pads P1 and P2 respectively to enhance the power transmission efficiency (lower impedance, resulting in less current loss).

[0046] Additionally, please refer to Figure 5A , Figure 5B and cooperate Figure 1A and Figure 2A This is to illustrate the assembly process of a display device according to an embodiment of this application. Figure 5A and Figure 5B These are flowcharts illustrating the assembly steps of a display device 1 according to an embodiment of this application. It should be noted that... Figure 5A and Figure 5B In the assembly process, steps may be added, steps may be omitted, or the order of steps may be adjusted as additional embodiments of this application.

[0047] like Figure 1A , Figure 2A and Figure 5A As shown, the assembly method of the display device 1 may include: providing a light guide plate 21 (step S01); providing a light-emitting component 22, such that the light-emitting component 22 is correspondingly disposed with the light guide plate 21, wherein the light-emitting component 22 includes a substrate 221 and a plurality of light-emitting elements 222, the substrate 221 has a first surface S1, the first surface S1 includes an element placement area S11 and a flat area S12, the flat area S12 and the element placement area S11 have a first gap d1, and the flat area S12 and the element placement area S11 are electrically insulated from each other, and the light-emitting elements 222 are disposed in the element placement area S11 (step S02); In some embodiments, the light-emitting component 22 can be disposed on the back plate 11, and the light-emitting component 22 can be assembled first and then disposed on the back plate 11. Next, a reflective element 24 can be selectively disposed on the back plate 11, so that the reflective element 24 is adjacent to the light-emitting component 22. Then, an adhesive element 23 is disposed on the flat area S12 of the substrate 221. In some embodiments, the adhesive element 23 can also be disposed on the light guide plate 21 (step S03). Next, the light guide plate 21 is disposed on the flat area S12 to connect the light guide plate 21 and the flat area S12 of the substrate 221 through the adhesive element 23 (step S04). In some embodiments, the adhesive element 23 can be disposed on the flat area S12 simultaneously in step S02, and step S03 can be omitted.

[0048] In addition to steps S01 to S04, such as Figure 5B As shown, a frame 13 is then placed on one side of the light-emitting component 22 behind the light guide plate 21, and a reflector 24a is sandwiched between the frame 13 and the light-emitting component 22 (step S05). Here, the reflector 24a can first be placed on the lower side of the support portion 131 of the frame 13, and then the frame 13 with the reflector 24a is placed adjacent to the light-emitting component 22 and the light guide plate 21, so that the reflector 24a can be sandwiched between the support portion 131 and the back plate 11; next, at least one optical film 12 is placed on the light guide plate 21 (step S06); finally, the display panel 3 is placed on the support portion 131 of the frame 13 (step S06), so that the display panel 3 and the backlight module can be arranged opposite each other.

[0049] Please refer to Figure 6 As shown, this is a schematic diagram of a display device 1a according to another embodiment of this application. Figure 6In the display device 1a, the assembly process may include: setting a reflector 24 on a back plate 11; setting a frame 13 on the back plate 11 and attaching the frame 13 to the inner sidewall 111 of the back plate 11; combining a light guide plate 21, an adhesive 23, a light-emitting component 22a and another adhesive 28 (e.g., masking tape), and setting the surface F of the light-emitting element 222 away from the substrate 221 facing downward on the reflector 24 (i.e., the light-emitting component 22a is reversed on the reflector 24), wherein the reflector 24 is sandwiched between the light guide plate 21 and the back plate 11; setting at least one optical film 12 on the light guide plate 21, and having the substrate 221 of the light-emitting component 22a support the at least one optical film 12; and setting a display panel 3 on the adhesive 28 and the at least one optical film 12, and having the optical film 12 sandwiched between the display panel 3 and the light guide plate 21.

[0050] In summary, in the display device and its assembly method of this application, the first surface of the substrate of the light-emitting component includes an element placement area and a flat area. The flat area and the element placement area are spaced apart and electrically insulated from each other. The light guide plate is disposed on the flat area by an adhesive, so that the flat area of ​​the substrate is generally flat. Furthermore, the adhesive is attached to the flat area and also forms a generally flat surface. Therefore, after the light guide plate is disposed on the adhesive, the adhesive is not easy to peel off. Thus, the uneven brightness of the display device can be solved, and its optical quality can be improved.

[0051] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be defined by the claims.

Claims

1. A backlight module, characterized in that it comprises: A light guide plate; A light-emitting component is disposed corresponding to the light guide plate, the light-emitting component comprising: A substrate includes a first surface. In a top view of the backlight module, the first surface includes a component placement area and a flat area, with a first gap between the flat area and the component placement area. In a cross-sectional view of the backlight module, the substrate includes a base material, a leveling layer, a conductive layer, a first protective layer, and a second protective layer. The first protective layer and the second protective layer are respectively disposed on opposite sides of the base material. The leveling layer is disposed between the first protective layer and the base material, and the conductive layer is disposed between the second protective layer and the base material. Multiple light-emitting elements are disposed on the element placement area; and An adhesive component connects the light guide plate and the flat area; The plurality of light-emitting elements extend along a first direction, the flat region has a first width along a second direction perpendicular to the first direction, the substrate has a second width along the second direction, and the ratio of the first width to the second width is between 0.20 and 0.

85.

2. The backlight module as described in claim 1, characterized in that, The first interval is greater than 0 mm and less than 0.3 mm.

3. The backlight module as described in claim 1, characterized in that, The component placement area includes a plurality of paired electrical connection pads, wherein the minimum spacing between the electrical connection pads and the flat area is between 0.075 mm and 0.3 mm.

4. The backlight module as described in claim 1, characterized in that, Some of the adjacent light-emitting elements are connected in series.

5. The backlight module as described in claim 1, characterized in that, Some of the adjacent light-emitting elements are connected in parallel.

6. The backlight module as described in claim 1, characterized in that, The substrate includes at least one through hole, which is located in the component placement area.

7. The backlight module as described in claim 6, characterized in that, The at least one through hole contains conductive material.

8. The backlight module as described in claim 1, characterized in that, The thickness of the first protective layer is greater than 0 micrometers and less than 30 micrometers.

Images