Combined i / o module module and server

Abstract

The embodiment of the application provides a combined I / O module module and a server, the combined I / O module module comprises: a base assembly and a plurality of I / O modules, the base assembly is detachably inserted into a case; the plurality of I / O modules are detachably arranged in the base assembly and are fixed in the case through the base assembly. Through the application, the problem that the I / O module module cannot be pulled out of the case and cannot be expanded in the related art is solved, and then modular processing is realized, the installation efficiency is improved, each I / O module can be combined and detached arbitrarily, and the effect of being more flexible and convenient is achieved.

Description

Technical Field

[0001] This application relates to the field of computers, and more specifically, to a combined I / O module and server. Background Technology

[0002] Most servers today are primarily designed for future maintenance, so many I / O functions are provided directly on the motherboard. Currently, I / O modules are mostly fixed and single-type, and are largely assembled inside the server machine. Limited space on the front of the server limits the functionality supported by each I / O module. Furthermore, while some I / O modules can be pulled out to increase their supported functions, additional functions require replacing them with different modules, increasing the purchase cost for consumers. Summary of the Invention

[0003] This application provides a modular I / O module and server to at least solve the problem in related technologies that I / O module modules cannot be pulled out of the chassis and cannot be expanded.

[0004] According to one embodiment of this application, a combined I / O module is provided, characterized in that it includes:

[0005] Base assembly, which is detachably inserted into the chassis;

[0006] Multiple I / O modules are detachably mounted within the base assembly and secured to the chassis via the base assembly.

[0007] In one exemplary embodiment, the base assembly is provided with positioning protrusions for engaging with positioning holes on the chassis.

[0008] In one exemplary embodiment, the base component includes:

[0009] The base and the top cover are positioned on top of the base.

[0010] A spring is provided on the upper cover, and a positioning protrusion is provided on the spring.

[0011] In one exemplary embodiment, the combined I / O module further includes:

[0012] A movable lever is movably mounted on the base assembly to move according to the number of I / O modules and to position multiple I / O modules.

[0013] In one exemplary embodiment, the movable rod moves along the length of the base assembly, and the combined I / O module further includes:

[0014] A connecting rod, one end of which is movably mounted on a movable rod along the width direction of the base assembly, and the other end of which is rotatably connected to the I / O module.

[0015] In one exemplary embodiment, the base assembly has two parallel guide grooves that extend along the length of the base assembly, and the two ends of the moving rod are respectively movably disposed in the two guide grooves to slide along the guide grooves.

[0016] In one exemplary embodiment, multiple I / O modules are detachably connected to each other.

[0017] In one exemplary embodiment, multiple I / O modules are foldably connected to each other.

[0018] In one exemplary embodiment, the combined I / O module further includes:

[0019] A hinge assembly is positioned between two adjacent I / O modules, and each I / O module is rotatably connected to the hinge assembly.

[0020] In an exemplary embodiment, the rotating shaft assembly includes two rotating plates arranged at intervals in a vertical direction. Each rotating plate has a connection hole at both ends, and an I / O module has a connection post. The connection posts on two adjacent I / O modules are rotatably connected to the connection holes at both ends of the rotating plate.

[0021] In one exemplary embodiment, multiple I / O modules are connected sequentially, with adjacent I / O modules having an unfolded state and a folded state. The combined I / O module further includes:

[0022] A torsion spring is mounted on the pivot assembly, wherein the torsion spring is connected to two adjacent I / O modules respectively to apply a force to the two adjacent I / O modules toward a folded state.

[0023] In one exemplary embodiment, the combined I / O module further includes:

[0024] A latch is detachably mounted on the I / O module, wherein the latch is used to connect two adjacent I / O modules to fix the two adjacent I / O modules in the unfolded state.

[0025] In an exemplary embodiment, one end of the handle is rotatably disposed on the I / O module, and the other end of the handle is provided with a locking hole. The I / O module is provided with a first locking pin and a second locking pin. When the locking hole is connected to the first locking pin on the I / O module, two adjacent I / O modules can move into a folded state. When the locking hole is connected to the second locking pin on the adjacent I / O module, the two adjacent I / O modules are fixed in an unfolded state.

[0026] In one exemplary embodiment, the I / O module includes:

[0027] The positioning base has positioning space for mounting the positioning circuit board;

[0028] The positioning cover is detachably connected to the positioning seat to stop the circuit board on the positioning seat.

[0029] In one exemplary embodiment, the positioning base is provided with a hook for fixing the circuit board in the positioning space.

[0030] In one exemplary embodiment, the positioning cover is snapped into the positioning seat, wherein the positioning cover is provided with a wire hole for threading a cable connected to the circuit board.

[0031] In one exemplary embodiment, the I / O module is provided with a latching assembly for connecting to a latching hole on the chassis.

[0032] According to another embodiment of this application, a server is provided, comprising:

[0033] The chassis has mounting holes.

[0034] A modular I / O module, wherein the modular I / O module is detachably mounted in a mounting hole, and the modular I / O module is the aforementioned modular I / O module.

[0035] In one exemplary embodiment, a limiting plate is provided on the inner wall of the mounting hole, which is used to position the combined I / O module within the mounting hole.

[0036] In one exemplary embodiment, the top of the chassis is provided with a positioning hole that communicates with the mounting hole. The positioning hole is a through hole to engage with a positioning protrusion on the combined I / O module.

[0037] The modular I / O module embodiments provided in this application can be executed in mobile terminals, computer terminals, or similar computing devices and servers. Taking a server as an example, a modular I / O module includes: a base assembly and multiple I / O modules. The base assembly is detachably inserted into a chassis; the multiple I / O modules are detachably disposed within the base assembly and fixed within the chassis by the base assembly. The model and quantity of each I / O module can be configured and expanded as needed. The length of each I / O module matches the width of the base assembly, allowing each I / O module to be folded and placed inside the base assembly. This application achieves modular processing and improves installation efficiency by providing a base assembly that can be matched and installed with different I / O modules. After each I / O module is placed inside the base assembly, it is fixed within the mounting holes of the chassis by the base assembly. This allows for flexible and convenient combination and disassembly of the I / O modules. Attached Figure Description

[0038] Figure 1 This is a schematic diagram of one side of the server's I / O module in the unfolded state according to an embodiment of this application;

[0039] Figure 2 This is a schematic diagram of the I / O module of a server in an unfolded state according to an embodiment of this application.

[0040] Figure 3 This is a schematic diagram of a combined I / O module according to an embodiment of this application;

[0041] Figure 4 This is a schematic diagram of one side of the base assembly of the combined I / O module according to an embodiment of this application;

[0042] Figure 5 This is a schematic diagram of the other side of the base assembly of the combined I / O module according to an embodiment of this application;

[0043] Figure 6 This is a schematic diagram of an I / O module in a combined I / O module according to an embodiment of this application;

[0044] Figure 7 This is a schematic diagram of another I / O module in a combined I / O module according to an embodiment of this application.

[0045] 10. Base assembly; 11. Base; 12. Top cover; 13. Spring; 131. Positioning protrusion; 14. Moving rod; 15. Connecting rod; 16. Guide groove; 20. Chassis; 21. Positioning hole; 23. Mounting hole; 30. I / O module; 31. Connecting post; 32. Torsion spring; 33. First locking pin; 34. Second locking pin; 35. Positioning seat; 36. Positioning cover; 361. Cable hole; 37. Locking assembly; 40. Rotating shaft assembly; 41. Rotating plate; 50. Handle; 51. Locking hole. Detailed Implementation

[0046] The embodiments of this application will be described in detail below with reference to the accompanying drawings and examples.

[0047] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0048] The combined I / O module embodiments provided in this application can be executed in mobile terminals, computer terminals, or similar computing devices and servers. For example... Figures 1 to 7 As shown, taking a server as an example, a modular I / O module includes a base assembly 10 and multiple I / O modules 30. The base assembly 10 is detachably inserted into a chassis 20. The multiple I / O modules 30 are detachably disposed within the base assembly 10 and fixed within the chassis 20 by the base assembly 10. The model and quantity of each I / O module 30 can be configured and expanded as needed. The length of each I / O module 30 matches the width of the base assembly 10, allowing each I / O module 30 to be folded and placed inside the base assembly 10. This application achieves modular processing and improves installation efficiency by providing a base assembly 10 that can be matched and installed with different I / O modules 30. After each I / O module 30 is placed inside the base assembly 10, it is fixed within the mounting holes 23 of the chassis 20 by the base assembly 10. The modularity of the I / O modules 30 is improved, and they can be arbitrarily combined and disassembled, making the installation more flexible and convenient.

[0049] The aforementioned I / O module 30 is connected to the base assembly 10 via a snap-fit ​​connection, and the base assembly 10 is connected to the chassis 20 via a snap-fit ​​connection.

[0050] The base assembly 10 is provided with a positioning protrusion 131 for engaging with the positioning hole 21 on the chassis 20. The base assembly 10 includes a base 11, a spring 13, and a top cover 12. The top cover 12 is disposed on the top of the base 11; the spring 13 is disposed on the top cover 12, wherein the positioning protrusion 131 is disposed on the spring 13. The spring 13 is made of a metal sheet or plastic material with a certain degree of elasticity. When the base assembly 10 is inserted into the mounting hole 23, the positioning protrusion 131 will insert into the positioning hole 21 on the top cover of the chassis 20, thereby fixing the base assembly 10 to the chassis 20. When disassembling, the positioning protrusion 131 is pressed down, and then the base assembly 10 can be pulled out.

[0051] The modular I / O module further includes a movable rod 14, which is movably mounted on the base assembly 10 to move according to the number of I / O modules 30 and to position multiple I / O modules 30. The movable rod 14 moves along the length of the base assembly 10. The modular I / O module also includes a connecting rod 15, one end of which is movably mounted on the movable rod 14 along the width of the base assembly 10, and the other end of which is rotatably connected to the I / O module 30. The base assembly 10 has two parallel guide grooves 16 extending along the length of the base assembly 10, and both ends of the movable rod 14 are movably mounted in the two guide grooves 16 to slide along the guide grooves 16.

[0052] The movable rod 14 described above extends along the width direction of the base assembly 10, and the guide groove 16 is arranged along the length direction of the base assembly 10. Both ends of the movable rod 14 are respectively inserted into the guide groove 16. The position of the movable rod 14 in the guide groove 16 is adjusted according to the number of I / O modules 30. A sliding groove is provided on the movable rod 14. One end of the connecting rod 15 is slidably arranged in the sliding groove. The other end of the connecting rod 15 is rotatably connected to one end of the innermost I / O module 30. When the I / O module 30 is installed into the base assembly 10, the innermost I / O module 30 pushes the movable rod 14 to move through the connecting rod 15. At the same time, the connecting rod 15 can also pull the I / O module 30 to prevent the I / O module 30 from being pulled away.

[0053] In order to achieve any combination among the various I / O modules 30, the multiple I / O modules 30 of this application are detachably connected.

[0054] Furthermore, to improve space utilization within the base assembly 10, multiple I / O modules 30 are foldably connected. This ensures that the I / O modules 30 are parallel to each other after being installed within the base assembly 10.

[0055] To achieve folding connections between the various I / O modules 30, the combined I / O module module of this application further includes a pivot assembly 40. The pivot assembly 40 is disposed between two adjacent I / O modules 30, and the two I / O modules 30 are rotatably connected to the pivot assembly 40. The pivot assembly 40 includes two rotating plates 41, which are spaced apart vertically. Each rotating plate 41 has a connection hole at both ends. Each I / O module 30 has a connecting post 31, and the connecting posts 31 on two adjacent I / O modules 30 are rotatably connected to the connection holes at both ends of the rotating plate 41. Multiple I / O modules 30 are connected sequentially, and two adjacent I / O modules 30 have an unfolded state and a folded state. The combined I / O module module further includes a torsion spring 32, which is disposed on the pivot assembly 40. The torsion spring 32 is connected to two adjacent I / O modules 30 to apply a force to the two adjacent I / O modules 30 toward the folded state.

[0056] The aforementioned rotating shaft assembly 40 includes two rotating plates 41, one above the other. Each rotating plate 41 has connecting holes at both ends. Each I / O module 30 has connecting posts 31 at both ends for connecting with the connecting holes. In addition, a vertically arranged connecting rod 15 is provided between the two rotating plates 41. A torsion spring 32 is installed on the connecting rod 15. The torsion spring 32 always applies a folding force to the two I / O modules 30 so that the multiple I / O modules 30 remain in a folded state within the base assembly 10.

[0057] The modular I / O module also includes a handle 50, which is detachably mounted on the I / O module 30. The handle 50 is used to connect two adjacent I / O modules 30 to fix them in an unfolded state. One end of the handle 50 is rotatably mounted on the I / O module 30, and the other end of the handle 50 is provided with a locking hole 51. The I / O module 30 is provided with a first locking pin 33 and a second locking pin 34. When the locking hole 51 is connected to the first locking pin 33 on the I / O module 30, the two adjacent I / O modules 30 can move into a folded state. When the locking hole 51 is connected to the second locking pin 34 on the adjacent I / O module 30, the two adjacent I / O modules 30 are fixed in an unfolded state.

[0058] When the I / O modules 30 are pulled apart and unfolded, in order to prevent the I / O modules 30 from automatically folding under the action of the torsion spring 32, this application also provides a handle 50 on the top of each I / O module 30. In the folded state, the handle 50 is stored above the I / O module 30. At this time, the locking hole 51 of the handle 50 is connected to the first locking pin 33 on the I / O module 30 where the handle 50 is located. When the unfolded state is required, the I / O modules 30 are first pulled apart, and then the handle 50 is rotated so that the handle 50 is connected to the second locking pin 34 on the adjacent I / O module 30. At this time, the handle 50 limits the position between the two I / O modules 30 and automatically locks the two I / O modules 30 in the unfolded state.

[0059] The I / O module 30 includes a positioning base 35 and a positioning cover 36. The positioning base 35 has a positioning space for mounting a positioning circuit board. The positioning cover 36 is detachably connected to the positioning base 35 to hold the circuit board in place on the positioning base 35. The positioning base 35 has a latch for securing the circuit board within the positioning space. The positioning cover 36 is snap-fitted to the positioning base 35, and the positioning cover 36 has a wire through hole 361 for threading cables connected to the circuit board.

[0060] In order to fix the circuit board in the positioning seat 35, a flexible hook is also provided in the positioning seat 35. The hook has a certain degree of elasticity, which can tolerate the error in the size of the circuit board and firmly fix the circuit board in the positioning space. In addition, after the hook clamps the circuit board, it is connected to the positioning seat 35 to enclose the circuit board in the positioning space. In order to facilitate the transmission of signals between the circuit board and the outside world, wire holes 361 are provided at both ends of the positioning cover 36 for wire threading.

[0061] The outermost I / O module 30 is equipped with a latching assembly 37, which is used to connect with latching holes on the front or rear side of the chassis 20. Alternatively, the latching assembly 37 can be mounted on the base assembly 10 for snap-fit ​​connection with latching holes on the chassis 20.

[0062] This embodiment also provides a server for implementing the above embodiments and preferred embodiments; details already described will not be repeated. As used below, the term "module" can refer to a combination of software and / or hardware that performs a predetermined function. Although the apparatus described in the following embodiments is preferably implemented in software, hardware implementation, or a combination of software and hardware, is also possible and contemplated.

[0063] The server of this application includes: a combined I / O module and a chassis 20, the chassis 20 having mounting holes 23; the combined I / O module is detachably disposed in the mounting holes 23, wherein the combined I / O module is the combined I / O module described above.

[0064] To facilitate the connection between the chassis 20 and the modular I / O module, this application provides a limiting plate on the innermost inner wall of the mounting hole 23 of the chassis 20. The limiting plate is used to position the modular I / O module within the mounting hole 23, and the limiting plate is a folded edge of a partition. The top of the chassis 20 has a positioning hole 21 that communicates with the mounting hole 23. The positioning hole 21 is a through hole that engages with the positioning protrusion 131 on the modular I / O module.

[0065] This invention proposes a tool-free modular I / O module design, which includes a base assembly 10, a top cover 12, a spring 13, a lateral moving rod 14, a connecting rod 15, multiple I / O modules of different types 30, multiple torsion springs 32, multiple handles 50, and multiple rotating shaft assemblies 40.

[0066] The base assembly 10 can be inserted into the original hard drive placement position, and is secured to the positioning hole 21 of the hard drive frame cover 12 of the chassis 20 by the spring clip 13 on the cover, preventing the base assembly 10 from sliding forward. At the rear, a limiting plate on the hard drive frame partition prevents the I / O module from sliding backward. This achieves a tool-free installation method for the I / O module.

[0067] All I / O modules 30 are assembled tool-free. The circuit board is secured by a spring-loaded hook inside the positioning base 35. The positioning cover 36 is also secured to the positioning base 35 by a spring-loaded clip on it. The handle 50 is secured to the pin on the front frame of the module by locking holes 51 in its notch, allowing the handle 50 to rotate.

[0068] The I / O modules 30 are interconnected via a hinge assembly 40 and a torsion spring 32. The purpose of the torsion spring 32 is to allow the I / O modules 30 to automatically reset when retracted into the server chassis 20 using the elastic force of the torsion spring 32.

[0069] The I / O module is fixed to the base by adding a connecting rod 15 and a lateral moving rod 14 at the rear, and then fixing them together with the base assembly 10.

[0070] The frontmost I / O module is secured to a hole in the I / O frame module by a protrusion on its side. To pull out an I / O module, press the latch on the module to disengage the positioning protrusion 131 from the positioning hole 21, and then pull it outward. Then, use the handle 50 to interlock the various I / O modules, allowing operation of different I / O modules from outside the chassis 20.

[0071] Apart from the frontmost module, all the internal I / O modules are designed to have the same width. This not only makes efficient use of the maximum space inside the positioning base 35, but also allows the positioning cover 36 to be shared, saving costs.

[0072] This I / O module allows for adjustments to the number of modules by adding or removing modules based on customer functional requirements. Furthermore, different module styles can be changed according to the functional needs of each module.

[0073] The torsion spring 32 can be made of different materials and styles according to customer needs, or it can be omitted due to cost considerations. The module is then manually reset back into the module.

[0074] It should be noted that the above modules can be implemented by software or hardware. For the latter, they can be implemented in the following ways, but are not limited to: all the above modules are located in the same processor; or, the above modules are located in different processors in any combination.

[0075] Obviously, those skilled in the art should understand that the modules or steps of this application described above can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. They can be implemented using computer-executable program code, and thus can be stored in a storage device for execution by a computing device. In some cases, the steps shown or described can be performed in a different order than those presented here, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, this application is not limited to any particular combination of hardware and software.

[0076] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.

Claims

1. A combined I / O module, characterized in that, include: Base assembly (10), which is detachably inserted into the chassis (20); Multiple I / O modules (30) are detachably disposed within the base assembly (10) and fixed within the chassis (20) by the base assembly (10). The base assembly (10) can be matched and installed with different I / O modules (30). The multiple I / O modules (30) are foldably connected to each other; The combined I / O module further includes: a pivot assembly (40), which is disposed between two adjacent I / O modules (30), and the two I / O modules (30) are rotatably connected to the pivot assembly (40); Multiple I / O modules (30) are connected sequentially, with adjacent I / O modules (30) having an unfolded state and a folded state. The combined I / O module further includes: Torsion spring (32) is disposed on the pivot assembly (40), wherein the torsion spring (32) is connected to two adjacent I / O modules (30) respectively to apply a force to the two adjacent I / O modules (30) toward the folded state.

2. The combined I / O module according to claim 1, characterized in that, The base assembly (10) is provided with a positioning protrusion (131) for engaging with a positioning hole (21) on the chassis (20).

3. The combined I / O module according to claim 2, characterized in that, The base assembly (10) includes: A base (11) and a top cover (12), the top cover (12) being disposed on top of the base (11); A spring sheet (13) is disposed on the upper cover (12), wherein the positioning protrusion (131) is disposed on the spring sheet (13).

4. The combined I / O module according to claim 1, characterized in that, The combined I / O module also includes: A movable rod (14) is movably disposed on the base assembly (10) to move according to the number of I / O modules (30) and to position the plurality of I / O modules (30).

5. The combined I / O module according to claim 4, characterized in that, The movable rod (14) moves along the length direction of the base assembly (10), and the combined I / O module further includes: A connecting rod (15) is provided at one end on the moving rod (14) along the width direction of the base assembly (10), and the other end of the connecting rod (15) is rotatably connected to the I / O module (30).

6. The combined I / O module according to claim 4, characterized in that, The base assembly (10) is provided with two parallel guide grooves (16), which extend along the length of the base assembly (10). The two ends of the moving rod (14) are respectively movably disposed in the two guide grooves (16) to slide along the guide grooves (16).

7. The combined I / O module according to claim 1, characterized in that, The multiple I / O modules (30) are detachably connected to each other.

8. The combined I / O module according to claim 1, characterized in that, The rotating shaft assembly (40) includes two rotating plates (41), which are arranged at intervals in the vertical direction. Each of the rotating plates (41) has a connecting hole at both ends. The I / O module (30) has a connecting post (31), and the connecting posts (31) on two adjacent I / O modules (30) are rotatably connected to the connecting holes at both ends of the rotating plate (41).

9. The combined I / O module according to claim 1, characterized in that, The combined I / O module also includes: A handle (50) is detachably mounted on the I / O module (30), wherein the handle (50) is used to connect two adjacent I / O modules (30) to fix the two adjacent I / O modules (30) in the unfolded state.

10. The combined I / O module according to claim 9, characterized in that, One end of the handle (50) is rotatably mounted on the I / O module (30), and the other end of the handle (50) is provided with a locking hole (51). The I / O module (30) is provided with a first locking pin (33) and a second locking pin (34). When the locking hole (51) is connected to the first locking pin (33) on the I / O module (30), two adjacent I / O modules (30) can move to the folded state. When the locking hole (51) is connected to the second locking pin (34) on the adjacent I / O module (30), two adjacent I / O modules (30) are fixed in the unfolded state.

11. The combined I / O module according to claim 1, characterized in that, The I / O module (30) includes: Positioning seat (35), the positioning seat (35) having positioning space for mounting positioning circuit board; A positioning cover (36) is detachably connected to the positioning seat (35) to stop the circuit board on the positioning seat (35).

12. The combined I / O module according to claim 11, characterized in that, The positioning seat (35) is provided with a hook, which is used to fix the circuit board in the positioning space.

13. The combined I / O module according to claim 11, characterized in that, The positioning cover (36) is snapped into the positioning base (35), wherein the positioning cover (36) is provided with a wire hole (361) for threading a cable connected to the circuit board.

14. The combined I / O module according to claim 1, characterized in that, The I / O module (30) is provided with a latching assembly (37), which is used to connect with the latching hole on the chassis (20).

15. A server, characterized in that, include: The chassis (20) is provided with mounting holes (23); A modular I / O module, wherein the modular I / O module is detachably disposed within the mounting hole (23), wherein the modular I / O module is the modular I / O module as described in any one of claims 1 to 14.

16. The server according to claim 15, characterized in that, A limiting plate is provided on the inner wall of the mounting hole (23), and the limiting plate is used to position the combined I / O module within the mounting hole (23).

17. The server according to claim 15, characterized in that, The top of the chassis (20) is provided with a positioning hole (21), which is connected to the mounting hole (23). The positioning hole (21) is a through hole to cooperate with the positioning protrusion (131) on the combined I / O module.

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