Touch module and manufacturing method thereof

Abstract

A touch module and a manufacturing method thereof, the touch module includes a substrate, a bridge pattern layer, a first insulating layer, an electrode pattern layer, and a second insulating layer. The bridge pattern layer is disposed on the substrate and includes a bridge electrode. The first insulating layer is disposed on the bridge pattern layer and has two exposed regions adjacent to opposite ends of the bridge electrode. The first insulating layer includes a first insulating block and a second insulating block formed at the opposite ends of the bridge electrode, respectively, and a third insulating block located between the first insulating block and the second insulating block through the exposed regions. The electrode pattern layer is disposed on the first insulating layer and electrically connected to the bridge electrode through the exposed regions. The electrode pattern layer includes a first transparent conductive layer, a metal layer, and a second transparent conductive layer stacked in sequence and having a first resistance value, a second resistance value, and a third resistance value, respectively, and has two via regions directly above the bridge electrode. The second insulating layer is disposed on the electrode pattern layer and covers and fills the via regions. Thus, the problem of cracks in the electrode pattern layer disposed on the first insulating layer can be effectively improved.

Description

Technical Field

[0001] This disclosure relates to a touch module and its manufacturing method. Background Technology

[0002] As touchscreen devices continue to grow in size and become indispensable for gaming applications, the most crucial change is the continuous improvement of display refresh rates. For example, mobile phone screen refresh rates will increase from 120Hz to 180Hz, and even to a higher level of 240Hz (for example, mobile phones using OLED displays have higher screen refresh rates). There is also a need to improve the refresh rates of high-end laptop screens.

[0003] However, traditional one-glass solution (OGS) touch panels use simple indium tin oxide (ITO) electrodes, which cannot effectively reduce the RC value, thus failing to meet refresh rate requirements when expanding from small to large sizes. Taiwan Patent Certificate No. TW I480999 teaches the use of composite electrodes on both sides of the substrate to effectively reduce manufacturing costs and improve conductivity. Additionally, as... Figure 9 As shown, a conventional touch module 900 includes a substrate 910, a bridging pattern layer 920, a first insulating layer 930, an electrode pattern layer 940, and a second insulating layer 950. However, for the OGS architecture (i.e., using the glass reference plane as the single-sided bridging touch electrode formation surface), cracks are prone to occur where the electrode pattern layer 940 climbs onto the bridging pattern layer 920 (as indicated by the dotted line in the figure). In particular, when using a glass reference plane as the formation surface, the use of composite electrode layers on a single side (i.e., OGS-SITO architecture; singleside) inevitably raises the issue of how to reduce or avoid cracks when there are height differences in the electrode layers in space. Therefore, a thickness adjustment section based on the glass formation surface is designed in the structure. Comparing the OGS-SITO architecture with in-cell, since in-cell pixels themselves have a high-low undulation formation surface due to thin-film transistors, it is not necessary to form an additional thickness adjustment section on the plane. U.S. Patent Application No. 20180323240A1 discloses an OLED display device using In-cell touch (i.e., touch on the encapsulation layer) technology. Its transparent conductive layer 161 covers the opaque conductive layer 163, which limits the light transmittance. Therefore, the structure is significantly different from that of display devices using OGS-SITO technology (i.e., touch on the substrate). The irregular thickness adjustment part in the pixel space is also not easy to be converted to the planar glass formation surface of the OGS-SITO architecture.

[0004] Therefore, how to propose a touch module and its manufacturing method that can solve the above problems, especially the spatial feature design based on the planar glass forming surface of the OGS-SITO architecture, is one of the problems that the industry is eager to invest R&D resources to solve. Summary of the Invention

[0005] In view of this, one objective of this disclosure is to provide a touch module and a method for manufacturing the same that can solve the above problems.

[0006] To achieve the above objectives, according to one embodiment of this disclosure, a touch module includes a substrate, a bridging pattern layer, a first insulating layer, an electrode pattern layer, and a second insulating layer. The bridging pattern layer is disposed on the substrate and includes bridging electrodes. The first insulating layer is disposed on the bridging pattern layer and has two exposed areas adjacent to opposite ends of the bridging electrodes. The first insulating layer includes a first insulating block and a second insulating block formed at opposite ends of the bridging electrodes, and a third insulating block located between the first and second insulating blocks separated by the exposed areas. The electrode pattern layer is disposed on the first insulating layer and electrically connected to the bridging electrodes via the exposed areas. The electrode pattern layer includes a first transparent conductive layer, a metal layer, and a second transparent conductive layer stacked sequentially and having first, second, and third resistance values, respectively, and has two via areas directly above the bridging electrodes. The second insulating layer is disposed on the electrode pattern layer and covers and fills the via areas.

[0007] In one or more embodiments disclosed herein, the first insulating block, the second insulating block, and the third insulating block have slopes.

[0008] In one or more embodiments disclosed herein, the through-hole region connects to the third insulating block and spans the opposite sides of the third insulating block.

[0009] In one or more embodiments disclosed herein, each exposed area spans opposite sides of the bridging electrode.

[0010] In one or more embodiments disclosed herein, the electrode pattern layer includes two first electrode blocks and a second electrode block. The first electrode blocks are electrically connected to bridging electrodes via exposed areas. The second electrode blocks are located between the first electrode blocks, separated by vias.

[0011] In one or more embodiments disclosed herein, the bridging pattern layer includes a copper oxide layer. The copper oxide layer is disposed on a substrate.

[0012] In one or more embodiments disclosed herein, the bridging pattern layer further comprises a metal layer. This metal layer is stacked on the copper oxide layer.

[0013] In one or more embodiments disclosed herein, the bridging pattern layer further comprises a transparent oxide conductive layer. The transparent oxide conductive layer is stacked on the aforementioned metal layer.

[0014] In one or more embodiments disclosed herein, the first transparent conductive layer is a first transparent oxide conductive layer, and the second transparent conductive layer is a second transparent oxide conductive layer.

[0015] In one or more embodiments disclosed herein, at least one of the first transparent oxide conductive layer and the second transparent oxide conductive layer has a first region and a second region. The oxygen content of the first region is greater than the oxygen content of the second region.

[0016] In one or more embodiments disclosed herein, the second region is located between the first region and the metal layer.

[0017] In one or more embodiments disclosed herein, the bridging pattern layer further includes a peripheral bonding electrode. The first insulating layer further includes a barrier structure. The barrier structure is disposed on the peripheral bonding electrode and surrounds to form another exposed area. The electrode pattern layer is electrically connected to the peripheral bonding electrode at least through this other exposed area. The barrier structure has at least one through-drainage groove.

[0018] In one or more embodiments disclosed herein, the electrode pattern layer is also electrically connected to the peripheral bonding electrode via the aforementioned at least one drainage groove.

[0019] To achieve the above objectives, according to one embodiment of the present disclosure, a method for manufacturing a touch module includes: forming a bridging pattern layer on a substrate, wherein the bridging pattern layer includes bridging electrodes; forming a first insulating layer on the bridging pattern layer, wherein the first insulating layer has two exposed areas adjacent to opposite ends of the bridging electrodes, and the first insulating layer includes a first insulating block and a second insulating block formed at opposite ends of the bridging electrodes, and a third insulating block located between the first insulating block and the second insulating block separated by the exposed areas; forming an electrode pattern layer on the first insulating layer, such that the electrode pattern layer is electrically connected to the bridging electrodes via the exposed areas, wherein the electrode pattern layer includes a first transparent conductive layer, a metal layer, and a second transparent conductive layer stacked sequentially and having a first resistance value, a second resistance value, and a third resistance value, respectively; forming two via areas on the electrode pattern layer directly above the bridging electrodes; and forming a second insulating layer on the electrode pattern layer to cover and fill the via areas.

[0020] In one or more embodiments disclosed herein, the step of forming a first insulating layer on a bridging pattern layer includes: forming an insulating material on the bridging pattern layer; and etching exposed areas on the insulating material to form a first insulating block, a second insulating block, and a third insulating block.

[0021] In one or more embodiments disclosed herein, the step of etching exposed areas in the insulating material is to make the first insulating block, the second insulating block and the third insulating block have slopes.

[0022] In one or more embodiments disclosed herein, the step of forming a via region on the electrode pattern layer directly above the bridging electrode includes: etching the via region on the electrode pattern layer such that the via region connects to the third insulating block and spans the opposite sides of the third insulating block.

[0023] In one or more embodiments disclosed herein, the first transparent conductive layer is a first transparent oxide conductive layer, and the second transparent conductive layer is a second transparent oxide conductive layer. The step of forming an electrode pattern layer on the first insulating layer includes: forming a first region of at least one of the first transparent oxide conductive layer and the second transparent oxide conductive layer with a first oxygen flux; and forming a second region of the aforementioned at least one of the first transparent oxide conductive layer and the second transparent oxide conductive layer with a second oxygen flux lower than the first oxygen flux.

[0024] In one or more embodiments disclosed herein, the step of forming a bridging pattern layer on the substrate further includes a peripheral bonding electrode in the bridging pattern layer. The step of forming a first insulating layer on the bridging pattern layer further includes: forming an insulating material on the bridging pattern layer; etching a barrier structure on the insulating material onto the peripheral bonding electrode, wherein the barrier structure surrounds to form another exposed area; and etching the barrier structure to form at least one through-drainage groove.

[0025] In one or more embodiments disclosed herein, the step of forming an electrode pattern layer on a first insulating layer is to electrically connect the electrode pattern layer to a peripheral bonding electrode via the aforementioned other exposed area and the aforementioned at least one drainage groove.

[0026] In summary, in the touch module disclosed herein, since the electrode pattern layer is a composite conductive structure composed of two transparent oxide conductive layers with high resistance and a metal layer with low resistance sandwiched between them, the resistance of the circuitry within the touch module can be effectively reduced, making the touch module suitable for medium to large-sized products. More importantly, this disclosure addresses the issue of cracks easily generated during multilayer fabrication of composite conductive structures. By including three insulating blocks in the first insulating layer to form a buffer ramp design (to improve the coverage and adhesion between film layers in thin film processes such as vapor deposition / coating during multilayer stacking, and to improve dead angles at transition points), and arranging them along the extension direction of the bridging electrode on the bridging electrode, the problem of cracks in the electrode pattern layer disposed on the first insulating layer can be effectively improved. By adding a copper oxide layer to the bridging pattern layer, the visual effect can be effectively improved. By providing drainage grooves on the baffle structure of the first insulating layer disposed on the peripheral bonding electrode, the strong etching solution used to etch the electrode pattern layer can be drained away, thereby reducing the problem of over-etching.

[0027] The above description is only used to illustrate the problem to be solved by this disclosure, the technical means to solve the problem, and the effects produced, etc. The specific details of this disclosure will be described in detail in the following implementation method and related drawings. Attached Figure Description

[0028] To make the above and other objects, features, advantages and embodiments disclosed herein more apparent and understandable, the accompanying drawings are described below:

[0029] Figure 1 A schematic diagram illustrating a touch module according to an embodiment of this disclosure;

[0030] Figure 2 For illustration Figure 1 A magnified view of a portion of the touch module;

[0031] Figure 3 For illustration Figure 2 The structure in the diagram is shown in a cross-sectional view along line segment 3-3;

[0032] Figure 4 For illustration Figure 2 A partial cross-sectional view of the bridging pattern layer in the middle;

[0033] Figure 5 For illustration Figure 2 A partial cross-sectional view of the electrode pattern layer in the image;

[0034] Figure 6 For illustration Figure 1 Another enlarged view of a portion of the touch module;

[0035] Figure 7A For illustration Figure 6The cross-sectional view of the structure along line segment 7A-7A;

[0036] Figure 7B For illustration Figure 6 The cross-sectional view of the structure along line segment 7B-7B;

[0037] Figure 8 A flowchart illustrating a method for manufacturing a touch module according to an embodiment of this disclosure;

[0038] Figure 9 This is a schematic diagram illustrating an existing touch module.

[0039] [Symbol Explanation]

[0040] 100, 900: Touch module

[0041] 110,910:Substrate

[0042] 120,920: Bridging pattern layer

[0043] 120a: Copper oxide layer

[0044] 120b, 142: Metal layer

[0045] 120c: Transparent oxide conductive layer

[0046] 121: Bridging electrode

[0047] 122: Peripheral bonding electrode

[0048] 130,930: First insulating layer

[0049] 130a, 130b, 132a: Exposed areas

[0050] 131a: First insulating block

[0051] 131b: Second insulating block

[0052] 131c: Third insulating block

[0053] 132: Retaining Wall Structure

[0054] 132b: Drainage channel

[0055] 140,940: Electrode pattern layer

[0056] 140a1, 140a2: First electrode block

[0057] 140b: Second electrode block

[0058] 140c1, 140c2: Through-hole area

[0059] 141: First transparent oxide conductive layer

[0060] 141a, 143a: First Region

[0061] 141b, 143b: Second Region

[0062] 143: Second transparent oxide conductive layer

[0063] 150, 950: Second insulating layer

[0064] 160: Wiring

[0065] 170: Flexible Circuit Board

[0066] Z1: Touch area

[0067] Z2: Surrounding Area Detailed Implementation

[0068] The following describes several embodiments of this disclosure with reference to the accompanying drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this disclosure. That is, in some embodiments of this disclosure, these practical details are not essential. Furthermore, for the sake of simplicity, some known and conventional structures and elements will be shown in the drawings in a simple schematic manner.

[0069] Please refer to Figure 1 This is a schematic diagram illustrating a touch module 100 according to an embodiment of the present disclosure. Figure 1 As shown, in this embodiment, the touch module 100 includes a substrate 110, a touch electrode layer, a plurality of traces 160, and a flexible circuit board 170. A touch area Z1 and a peripheral area Z2 are defined on the substrate 110. The peripheral area Z2 is located at the outer edge of the touch area Z1. The touch electrode layer is disposed within the touch area Z1. The traces 160 are located within the peripheral area Z2, and both ends of each trace 160 are connected to the touch electrode layer and the flexible circuit board 170, respectively, thereby transmitting the touch signals generated by the touch electrode layer to the flexible circuit board 170.

[0070] In some embodiments, the substrate 110 is made of glass, but this disclosure is not limited thereto.

[0071] Please refer to Figure 2 as well as Figure 3 . Figure 2 For illustration Figure 1 A partial enlarged view of the touch module 100. Figure 3 For illustration Figure 2 The structure in the diagram is shown in a cross-sectional view along line segment 3-3. Figure 2 The area shown is located within the touch area Z1. For example... Figure 2 and Figure 3As shown, in this embodiment, the touch electrode layer includes a bridging pattern layer 120 and an electrode pattern layer 140. The touch module 100 further includes a first insulating layer 130 and a second insulating layer 150. The bridging pattern layer 120 is disposed on the substrate 110 and includes a plurality of bridging electrodes 121. The following description focuses on one of the bridging electrodes 121. The first insulating layer 130 is disposed on the bridging pattern layer 120 and has two exposed areas 130a and 130b adjacent to opposite ends of the bridging electrode 121. The electrode pattern layer 140 is disposed on the first insulating layer 130 and is electrically connected to the bridging electrode 121 via the exposed areas 130a and 130b. The electrode pattern layer 140 has two via areas 140c1 and 140c2 directly above the bridging electrode 121. The second insulating layer 150 is disposed on the electrode pattern layer 140 and covers and fills the via areas 140c1 and 140c2.

[0072] In some embodiments, the thickness of the first insulating layer 130 is about 1.25 μm and the thickness of the second insulating layer 150 is about 2 μm, but this disclosure is not limited thereto.

[0073] In detail, such as Figure 2 and Figure 3 As shown, in this embodiment, the electrode pattern layer 140 includes two first electrode blocks 140a1 and 140a2 and a second electrode block 140b. The first electrode blocks 140a1 and 140a2 are electrically connected to the bridging electrode 121 via exposed areas 130a and 130b, respectively. The second electrode block 140b is located between the first electrode blocks 140a1 and 140a2, separated by vias 140c1 and 140c2. Thus, the two first electrode blocks 140a1 and 140a2 can transmit touch signals via the bridging electrode 121 and are electrically isolated from the second electrode block 140b.

[0074] In some embodiments, the electrode pattern layer 140 includes a plurality of first-axis conductive units spaced apart from each other and a plurality of second-axis conductive units spaced apart from each other and spanning the first-axis conductive units. Specifically, the aforementioned "first axis" and "second axis" are, for example, two axes perpendicular to each other (e.g., the Y-axis and the X-axis). In other words, the first-axis conductive units are conductive lines extending along the first axis and arranged at intervals. The combination of the aforementioned two first electrode blocks 140a1, 140a2 and the bridging electrode 121 is part of one of the first-axis conductive units. The second-axis conductive units are conductive lines extending along the second axis and arranged at intervals. The aforementioned second electrode block 140b is one of the second-axis conductive units, which spans across opposite sides of the bridging electrode 121 (separated by the first insulating layer 130). Thus, the aforementioned via regions 140c1, 140c2 span opposite sides and divide the electrode pattern layer 140 into the first electrode blocks 140a1, 140a2 and the second electrode block 140b.

[0075] like Figure 3 As shown, in this embodiment, the electrode pattern layer 140 includes a first transparent oxide conductive layer 141 (i.e., a first transparent conductive layer), a metal layer 142, and a second transparent oxide conductive layer 143 (i.e., a second transparent conductive layer), which are stacked sequentially and have a first resistance value, a second resistance value, and a third resistance value, respectively. The first resistance value and the third resistance value are greater than the second resistance value. By constructing the touch electrode layer using the electrode pattern layer 140 with the aforementioned composite conductive structure, the resistance of the circuitry within the touch module 100 can be effectively reduced, thereby making the touch module 100 suitable for use in medium to large-sized products.

[0076] In some embodiments, the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 are made of indium tin oxide (ITO). This allows the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 to have good light transmittance. In some embodiments, the metal layer 142 is made of silver, but this disclosure is not limited thereto. In some embodiments, the metal layer 142 may be a nano-silver ink layer, a nano-silver paste layer, or a nano-sputtered layer, etc., but is not limited thereto. This allows the metal layer 142 to have a low resistance.

[0077] In some embodiments, the thickness of the first transparent oxide conductive layer 141 is about 40 nm, but this disclosure is not limited thereto. In some embodiments, the thickness of the metal layer 142 is from about 8.5 nm to about 9.5 nm, but this disclosure is not limited thereto. In some embodiments, the thickness of the second transparent oxide conductive layer 143 is about 40 nm, but this disclosure is not limited thereto.

[0078] like Figure 2 and Figure 3As shown, in this embodiment, the first insulating layer 130 includes a first insulating block 131a and a second insulating block 131b formed at opposite ends of the bridging electrode 121, and a third insulating block 131c located between the first insulating block 131a and the second insulating block 131b, separated by exposed areas 130a and 130b. Specifically, the first insulating block 131a and the second insulating block 131b cover opposite ends of the bridging electrode 121 and are not exposed. The first insulating block 131a, the third insulating block 131c, and the second insulating block 131b sequentially cover the bridging electrode 121 along its extension direction. Exposed areas 130a and 130b are formed between the first insulating block 131a and the third insulating block 131c, and between the third insulating block 131c and the second insulating block 131b, respectively. Furthermore, as... Figure 3 As shown, the first insulating block 131a, the second insulating block 131b, and the third insulating block 131c have slopes. Specifically, the first insulating block 131a, the second insulating block 131b, and the third insulating block 131c are shaped like hills with slopes.

[0079] The aforementioned structural configuration effectively mitigates the problem of cracks in the electrode pattern layer 140 disposed on the first insulating layer 130. Specifically, since the electrode pattern layer 140 is positioned above the opposite ends of the bridging electrode 121 by climbing over the first insulating block 131a and the second insulating block 131b, the problem of cracks in the electrode pattern layer 140 at the opposite ends of the bridging electrode 121 is effectively mitigated. It should be noted that since display devices employing In-cell touch technology do not possess the spatial feature design prerequisite of a planar glass forming surface based on the OGS-SITO architecture, the aforementioned crack problem does not exist.

[0080] like Figure 2 As shown, in this embodiment, exposed areas 130a and 130b span opposite sides of the bridging electrode 121. This increases the contact area between the first electrode blocks 140a1 and 140a2 of the electrode pattern layer 140 and the bridging electrode 121, thereby reducing impedance.

[0081] Please refer to Figure 4 It is a drawing Figure 2 A partial cross-sectional view of the bridging pattern layer 120 in the image. (See image for details.) Figure 4As shown, in this embodiment, the bridging pattern layer 120 includes a copper oxide layer 120a, a metal layer 120b, and a transparent oxide conductive layer 120c. The copper oxide layer 120a, the metal layer 120b, and the transparent oxide conductive layer 120c are sequentially stacked on the substrate 110. It should be noted that since the reflectivity of the copper oxide layer 120a is less than about 10%, adding the copper oxide layer 120a to the bridging pattern layer 120 can effectively improve the visual effect.

[0082] In some embodiments, the material of the metal layer 120b of the bridging pattern layer 120 may include copper, but this disclosure is not limited thereto.

[0083] In some embodiments, the transparent oxide conductive layer 120c of the bridging pattern layer 120 is made of indium tin oxide, but this disclosure is not limited thereto.

[0084] Please refer to Figure 5 It is a drawing Figure 2 A partial cross-sectional view of the electrode pattern layer 140 in the image. (See image for details.) Figure 5 As shown, in this embodiment, the first transparent oxide conductive layer 141 has a first region 141a and a second region 141b. The oxygen content of the first region 141a is greater than the oxygen content of the second region 141b. The second region 141b of the first transparent oxide conductive layer 141 is located between the first region 141a and the metal layer 142. The second transparent oxide conductive layer 143 has a first region 143a and a second region 143b. The second region 143b of the second transparent oxide conductive layer 143 is located between the first region 143a and the metal layer 142. With this structural configuration, the metal layer 142 can be effectively sandwiched between the second region 141b of the first transparent oxide conductive layer 141 with a low oxygen content and the second region 143b of the second transparent oxide conductive layer 143 with a low oxygen content, with the aim of reducing unnecessary oxidation.

[0085] Table 1 below shows the process parameters for manufacturing the electrode pattern layer 140 in Examples A to C.

[0086]

[0087] It should be noted that in Table 1, layer 1 and layer 2 are the process parameters used when manufacturing the first region 141a and the second region 141b of the first transparent oxide conductive layer 141, respectively; layer 3 is the process parameter used when manufacturing the metal layer 142; and layers 4 and 5 are the process parameters used when manufacturing the second region 143b and the first region 143a of the second transparent oxide conductive layer 143, respectively. As shown in Table 1, in manufacturing the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 of Example A, the first regions 141a and 143a and the second regions 141b and 143b all use a high oxygen flux (i.e., 1.0 sccm). In manufacturing the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 of Example B, the first regions 141a and 143a and the second regions 141b and 143b all use a low oxygen flux (i.e., 0.3 sccm). In manufacturing the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 of embodiment C, the first regions 141a and 143a both use a high oxygen flow rate (i.e., 1.0 sccm), while the second regions 141b and 143b both use a low oxygen flow rate (i.e., 0.3 sccm).

[0088] Table 2 below shows the physical parameters of the electrode pattern layer 140 in Examples A to C.

[0089]

[0090] As shown in Table 2 above, the transmittance of the electrode pattern layer 140 (i.e., the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 each contain regions with different oxygen contents) in Example C can be maintained at less than 89%, and the impedance can also be maintained at less than 10 ops.

[0091] Please refer to Figure 6 , Figure 7A as well as Figure 7B . Figure 6 For illustration Figure 1 Another enlarged view of the touch module 100. Figure 7A For illustration Figure 6 The structure in the diagram is shown in a cross-sectional view along line segment 7A-7A. Figure 7B For illustration Figure 6 The structure in the diagram is shown in a cross-sectional view along line segment 7B-7B. Figure 6 The area shown is at the boundary between the touch area Z1 and the surrounding area Z2. For example... Figures 6 to 7BAs shown, in this embodiment, the bridging pattern layer 120 further includes a peripheral bonding electrode 122. The first insulating layer 130 further includes a barrier structure 132. The barrier structure 132 is disposed on the peripheral bonding electrode 122 and surrounds to form another exposed area 132a. The barrier structure 132 has a plurality of through drainage channels 132b. Therefore, the shape of the barrier structure 132 is similar to a dam. The electrode pattern layer 140 is electrically connected to the peripheral bonding electrode 122 via the exposed area 132a and the drainage channels 132b. By providing drainage channels 132b on the barrier structure 132 disposed on the peripheral bonding electrode 122 of the first insulating layer 130, the strong etching solution used to etch the electrode pattern layer 140 can be drained away during the manufacturing of the electrode pattern layer 140, thereby reducing the problem of over-etching.

[0092] Please refer to Figure 8 This is a flowchart illustrating a method for manufacturing a touch module according to an embodiment of this disclosure. Figure 8 As shown, this disclosure also provides a method for manufacturing a touch module, which includes at least steps S101 to S105. The following is in conjunction with... Figures 1 to 7B illustrate.

[0093] Step S101: A bridging pattern layer 120 is formed on the substrate 110, wherein the bridging pattern layer 120 includes bridging electrodes 121.

[0094] Step S102: A first insulating layer 130 is formed on the bridging pattern layer 120, wherein the first insulating layer 130 has two exposed areas 130a and 130b adjacent to the opposite ends of the bridging electrode 121, and the first insulating layer 130 includes a first insulating block 131a and a second insulating block 131b formed at the opposite ends of the bridging electrode 121, and a third insulating block 131c located between the first insulating block 131a and the second insulating block 131b separated by the exposed areas 130a and 130b.

[0095] Step S103: An electrode pattern layer 140 is formed on the first insulating layer 130, so that the electrode pattern layer 140 is electrically connected to the bridging electrode 121 through the exposed areas 130a and 130b.

[0096] Step S104: Two via regions 140c1 and 140c2 are formed on the electrode pattern layer 140 directly above the bridging electrode 121.

[0097] Step S105: A second insulating layer 150 is formed on the electrode pattern layer 140 to cover and fill the via regions 140c1 and 140c2.

[0098] In some embodiments, step S102 further includes: forming an insulating material on the bridging pattern layer 120; and etching exposed areas 130a and 130b on the insulating material to form a first insulating block 131a, a second insulating block 131b, and a third insulating block 131c located between the first insulating block 131a and the second insulating block 131b separated by the exposed areas 130a and 130b.

[0099] In some embodiments, step S102 involves giving the first insulating block 131a, the second insulating block 131b, and the third insulating block 131c a ramp. Specifically, the ramp is caused by light leakage that occurs during the etching of the insulating material.

[0100] In some embodiments, step S104 further includes etching via regions 140c1 and 140c2 on the electrode pattern layer 140, such that the via regions 140c1 and 140c2 are connected to the third insulating block 131c and span across opposite sides of the third insulating block 131c.

[0101] In some embodiments, the electrode pattern layer 140 includes a first transparent oxide conductive layer 141, a metal layer 142, and a second transparent oxide conductive layer 143, which are stacked sequentially and have a first resistance value, a second resistance value, and a third resistance value, respectively. Step S103 further includes: forming at least one of the first transparent oxide conductive layer 141 (i.e., the first transparent conductive layer) and the second transparent oxide conductive layer 143 (i.e., the second transparent conductive layer) with a first oxygen flux; and forming a second region 141b and 143b of the aforementioned at least one of the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 with a second oxygen flux lower than the first oxygen flux.

[0102] In some embodiments, step S101 further includes a peripheral bonding electrode 122 in the bridging pattern layer 120. Step S102 further includes: forming an insulating material on the bridging pattern layer 120; etching a barrier structure 132 on the insulating material on the peripheral bonding electrode 122, wherein the barrier structure 132 surrounds another exposed area 132a; and etching the barrier structure 132 to form at least one through-drainage groove 132b.

[0103] In some embodiments, step S103 is to electrically connect the electrode pattern layer 140 to the peripheral bonding electrode 122 via the exposed area 132a and the drainage groove 132b.

[0104] From the detailed description of the specific embodiments disclosed above, it is evident that in the touch module of this disclosure, since the electrode pattern layer is a composite conductive structure composed of two transparent oxide conductive layers with high resistance and a metal layer with low resistance sandwiched between them, the resistance of the circuitry within the touch module can be effectively reduced, making the touch module suitable for use in medium to large-sized products. More importantly, this disclosure addresses the problem of cracks easily generated during the multilayer formation of composite conductive structures. By including three insulating blocks in the first insulating layer to form a buffer ramp design (used to improve the coverage and adhesion between film layers in thin film processes such as vapor deposition / coating during multilayer stacking, and to improve the dead angle of film formation at the transition point by means of the buffer ramp), and arranging them along the extension direction of the bridging electrode on the bridging electrode, the problem of cracks generated in the electrode pattern layer disposed on the first insulating layer can be effectively improved. By adding a copper oxide layer to the bridging pattern layer, the visual effect can be effectively improved. By providing drainage channels on the baffle structure where the first insulating layer is disposed on the peripheral bonding electrode, the strong etching solution used to etch the electrode pattern layer can be drained away, thereby reducing the problem of over-etching.

[0105] Although the present disclosure has been described above with reference to embodiments, it is not intended to limit the present disclosure. Any person skilled in the art may make various modifications and alterations without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the scope defined in the appended claims.

Claims

1. A touch module, characterized in that, Include: One substrate; A bridging pattern layer is disposed on the substrate and includes a bridging electrode, a peripheral bonding electrode and a copper oxide layer disposed on the substrate. A first insulating layer is disposed on the bridging pattern layer and has two exposed areas adjacent to the opposite ends of the bridging electrode. The first insulating layer includes a first insulating block and a second insulating block formed at the opposite ends of the bridging electrode, and a third insulating block located between the first insulating block and the second insulating block separated by the exposed areas. The first insulating block, the second insulating block and the third insulating block are shaped like hills with slopes and are separated from each other. The first insulating block, the third insulating block and the second insulating block are sequentially covered on the bridging electrode along the extension direction of the bridging electrode. The first insulating layer further includes a retaining wall structure disposed on the peripheral bonding electrode and forming another exposed area around it. The retaining wall structure has at least one through-drainage groove. An electrode pattern layer is disposed on the first insulating layer and electrically connected to the bridging electrode via the exposed areas. The electrode pattern layer is also electrically connected to the peripheral bonding electrode via at least one other exposed area. The electrode pattern layer comprises a first transparent conductive layer, a metal layer, and a second transparent conductive layer, sequentially stacked and each having a first resistance value, a second resistance value, and a third resistance value. Two via regions are located directly above the bridging electrode. The metal layer has a thickness of 8.5 nm to 9.5 nm. The first transparent conductive layer is a first transparent oxide conductive layer, and the second transparent conductive layer is a second transparent oxide conductive layer. Each of the first and second transparent oxide conductive layers has a first region and a second region, with the oxygen content of the first region being greater than that of the second region. The second regions of the first and second transparent oxide conductive layers are respectively in contact with and sandwich the metal layer. A second insulating layer is disposed on the electrode pattern layer and covers and fills the via areas.

2. The touch module according to claim 1, characterized in that, These through-hole areas connect to the third insulating block and span across the opposite sides of the third insulating block.

3. The touch module according to claim 1, characterized in that, Each of these exposed areas spans the opposite sides of the bridging electrode.

4. The touch module according to claim 1, characterized in that, The electrode pattern layer contains: The two first electrode blocks are electrically connected to the bridging electrode via the exposed areas, respectively; and A second electrode block is located between the first electrode blocks, separated by the vias.

5. The touch module according to claim 1, characterized in that, The bridging pattern layer further includes another metal layer stacked on the copper oxide layer.

6. The touch module according to claim 5, characterized in that, The bridging pattern layer further includes a transparent oxide conductive layer stacked on the other metal layer.

7. The touch module according to claim 1, characterized in that, The electrode pattern layer is also electrically connected to the peripheral bonding electrode via the at least one drainage groove.

8. A method for manufacturing a touch module, characterized in that, Include: A bridging pattern layer is formed on a substrate, wherein the bridging pattern layer includes a bridging electrode, a peripheral bonding electrode and a copper oxide layer disposed on the substrate. A first insulating layer is formed on the bridging pattern layer, wherein the first insulating layer has two exposed areas adjacent to the opposite ends of the bridging electrode, and the first insulating layer includes a first insulating block and a second insulating block formed at the opposite ends of the bridging electrode, and a third insulating block located between the first insulating block and the second insulating block separated by the exposed areas. The first insulating block, the third insulating block and the second insulating block are sequentially covered on the bridging electrode along the extension direction of the bridging electrode. The first insulating layer further includes a baffle structure disposed on the peripheral bonding electrode and forming another exposed area around it. The baffle structure has at least one through-drainage groove. An electrode pattern layer is formed on the first insulating layer, such that the electrode pattern layer is electrically connected to the bridging electrode through the exposed areas, and the electrode pattern layer is electrically connected to the peripheral bonding electrode through at least the other exposed area. The electrode pattern layer includes a first transparent conductive layer, a metal layer, and a second transparent conductive layer, which are stacked in sequence and have a first resistance value, a second resistance value, and a third resistance value, respectively. The thickness of the metal layer is 8.5 nm to 9.5 nm. The first transparent conductive layer is a first transparent oxide conductive layer, and the second transparent conductive layer is a second transparent oxide conductive layer. The first transparent oxide conductive layer and the second transparent oxide conductive layer each have a first region and a second region, and the oxygen content of the first region is greater than the oxygen content of the second region. The second regions of the first transparent oxide conductive layer and the second regions of the second transparent oxide conductive layer are respectively in contact with and sandwich the metal layer. Two through-hole areas are formed on the electrode pattern layer directly above the bridging electrode; and A second insulating layer is formed on the electrode pattern layer to cover and fill the via areas. The step of forming the first insulating layer on the bridging pattern layer includes: An insulating material is formed on the bridging pattern layer; The exposed areas are etched into the insulating material to form the first insulating block, the second insulating block and the third insulating block, and the step of etching the exposed areas into the insulating material is to make the first insulating block, the second insulating block and the third insulating block have a hill-like shape with slopes and be separated from each other; The retaining wall structure is etched onto the insulating material onto the peripheral bonding electrode, wherein the retaining wall structure surrounds and forms the other exposed area; and The retaining wall structure is etched to form at least one through-hole drainage channel. The step of forming the electrode pattern layer on the first insulating layer includes: The first region of the first transparent oxide conductive layer and the second transparent oxide conductive layer is formed with a first oxygen flux; and The second region of the first transparent oxide conductive layer and the second transparent oxide conductive layer is formed with a second oxygen flow rate lower than the first oxygen flow rate.

9. The method for manufacturing a touch module according to claim 8, characterized in that, The step of forming the via regions on the electrode pattern layer directly above the bridging electrode includes: The via regions are etched on the electrode pattern layer, such that the via regions are connected to the third insulating block and span across the opposite sides of the third insulating block.

10. The method for manufacturing a touch module according to claim 8, characterized in that, The step of forming the electrode pattern layer on the first insulating layer is to electrically connect the electrode pattern layer to the peripheral bonding electrode via the other exposed area and the at least one drainage groove.

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