Circuit board and method of manufacturing the same

Abstract

The application provides a manufacturing method of a circuit board, comprising the following steps: providing a circuit substrate, wherein the circuit substrate comprises a substrate layer and a conductive pattern arranged on the substrate layer, the conductive pattern is provided with an opening, and part of the substrate layer is exposed at the bottom of the opening; arranging a groove on the exposed part of the substrate layer, and the side of the groove is flush with the side of the opening; arranging a first metal layer in the groove, and arranging a second metal layer on the conductive pattern, the end of the second metal layer extends towards the first metal layer to form a bending part, the bending part is electrically connected with the first metal layer, and the circuit board is obtained. The manufacturing method provided by the application can reduce the risk of the conductive pattern falling off. In addition, the application also provides a circuit board.

Description

Technical Field

[0001] This application relates to a circuit board and a method for manufacturing the same. Background Technology

[0002] Gold fingers are multiple gold-colored conductive pads arranged in an array on a circuit board, used to insert into a slot of another component to achieve electrical conductivity with that component.

[0003] Normally, gold fingers are formed on the surface of the circuit board through electroplating or chemical plating, resulting in weak adhesion between the gold fingers and the circuit board. Repeated insertion and removal can cause the gold fingers to peel off from the circuit board. Summary of the Invention

[0004] To address the problems in the background art, this application provides a method for manufacturing a circuit board.

[0005] In addition, it is necessary to provide a circuit board.

[0006] A method for manufacturing a circuit board includes the following steps:

[0007] A circuit board is provided, the circuit board including a substrate layer and a conductive pattern disposed on the substrate layer, the conductive pattern having a through opening, and a portion of the substrate layer exposed at the bottom of the opening. A groove is formed on the exposed portion of the substrate layer, the side of the groove being flush with the side of the opening. A first metal layer is disposed within the groove, and a second metal layer is disposed on the conductive pattern, the end of the second metal layer extending toward the first metal layer to form a bend, the bend being electrically connected to the first metal layer, thereby obtaining the circuit board.

[0008] Furthermore, before setting the second metal layer, the method further includes: setting a third metal layer on the conductive pattern, wherein the end of the third metal layer extends toward the first metal layer to form a substrate layer. The manufacturing method further includes: setting the second metal layer on the third metal layer, wherein the bent portion is attached to the substrate layer.

[0009] Furthermore, after forming a third metal layer on the conductive pattern, the method further includes forming a seed layer on the third metal layer. The manufacturing method also includes forming a second metal layer on the seed layer.

[0010] Furthermore, before setting the first metal layer, the method further includes: setting a first cover layer on the conductive pattern and the exposed portion of the substrate layer, the first cover layer having a first opening corresponding to the groove. After setting the first metal layer, the method further includes: removing the first cover layer.

[0011] Further, before setting the second metal layer, the method further includes: setting a second cover layer on the exposed portion of the substrate layer and a portion of the first metal layer, the second cover layer having a second opening, the second opening being provided corresponding to the conductive pattern and a portion of the groove adjacent to the conductive pattern. After setting the second metal layer, the method further includes: removing the second cover layer.

[0012] Furthermore, it also includes the step of removing the portion of the first metal layer that does not correspond to the bent portion.

[0013] A circuit board includes a circuit board substrate, a first metal layer, a second metal layer, and a bending portion. The circuit board substrate includes a base layer and a conductive pattern disposed on the base layer. The conductive pattern has a through-hole, and a portion of the base layer is exposed at the bottom of the opening. A groove is formed on the exposed portion of the base layer, and the side of the groove is flush with the side of the opening. The first metal layer is disposed within the opening. The second metal layer is disposed on the conductive pattern, and an end of the second metal layer extends toward the first metal layer to form a bending portion, the bending portion being electrically connected to the first metal layer.

[0014] Furthermore, the conductive pattern includes a plurality of connecting lines arranged side by side at intervals, and the first metal layer is electrically connected to each of the connecting lines.

[0015] Furthermore, the circuit board also includes a third metal layer and a substrate layer, with the second metal layer disposed on the third metal layer, the third metal layer facing the first metal layer to form the substrate layer, and the bent portion attached to the substrate layer.

[0016] Furthermore, the first metal layer and the third metal layer are made of copper, and the second metal layer is made of gold.

[0017] The circuit board provided in this application extends a bend in the second metal layer, which can significantly increase the adhesion between the second metal layer and the conductive pattern. In particular, it can resist or counteract the pulling or frictional forces acting on the conductive pattern, thereby reducing the risk of the conductive pattern falling off. Attached Figure Description

[0018] Figure 1 This is a cross-sectional schematic diagram of a circuit board provided in an embodiment of this application.

[0019] Figure 2 for Figure 1 The diagram shows a cross-sectional view of the circuit board with a first opening and a second opening.

[0020] Figure 3 for Figure 2The diagram shows a cross-sectional view of the circuit board with the first and second grooves.

[0021] Figure 4 for Figure 3 The diagram shows a cross-sectional view of the circuit board with a first cover layer.

[0022] Figure 5 for Figure 4 The diagram shows a cross-sectional view of the circuit board with the first metal layer.

[0023] Figure 6 for Figure 5 The diagram shows a cross-sectional view of the circuit board with a third metal layer.

[0024] Figure 7 for Figure 6 The diagram shows a cross-sectional view of the circuit board with a second cover layer.

[0025] Figure 8 for Figure 7 The diagram shows a cross-sectional view of the circuit board with a second metal layer.

[0026] Figure 9 for Figure 8 The diagram shows a cross-sectional view of the circuit board after the second cover layer has been removed.

[0027] Figure 10 A schematic cross-sectional view of a circuit board provided in an embodiment of this application ( Figure 11 (Cross-sectional view along line XI-XI).

[0028] Figure 11 This is a top view of a circuit board provided in one embodiment of this application.

[0029] Explanation of main component symbols

[0030] Circuit board 100

[0031] Circuit board 10

[0032] Substrate layer 11

[0033] First groove 111

[0034] Second groove 112

[0035] First conductive pattern 12

[0036] First opening 121

[0037] First connecting line 122

[0038] Second conductive pattern 13

[0039] Second opening 131

[0040] Second connecting line 132

[0041] Multi-layer circuit structure 14

[0042] First metal layer 21

[0043] First covering layer 22

[0044] First window 221

[0045] Second metal layer 31

[0046] Third metal layer 32

[0047] Substrate 321

[0048] Second covering layer 41

[0049] Second window 411

[0050] Base plate 50

[0051] First copper foil layer 51

[0052] Second copper foil layer 52

[0053] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0054] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0055] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or may also exist in an intervening component. When a component is considered to be "set on" another component, it can be directly set on the other component or may also exist in an intervening component.

[0056] Please see Figures 1 to 11 This application provides a method for manufacturing a circuit board 100, including the following steps:

[0057] S1: Please see Figure 2A circuit board 10 is provided, the circuit board 10 including a substrate layer 11, a first conductive pattern 12, and a second conductive pattern 13. The first conductive pattern 12 and the second conductive pattern 13 are respectively disposed on two opposite surfaces of the substrate layer 11. The first conductive pattern 12 is provided with a first opening 121, and a portion of the substrate layer 11 is exposed at the bottom of the first opening 121. The second conductive pattern 13 is provided with a second opening 131, and a portion of the substrate layer 11 is exposed at the bottom of the second opening 131. The first opening 121 and the second opening 131 are correspondingly disposed.

[0058] In this embodiment, please refer to Figure 2 The substrate layer 11 also contains a multilayer circuit structure 14 and an interlayer conductor (not shown in the figure). The interlayer conductor passes through the substrate layer 11 and is electrically connected to the first conductive pattern 12, the second conductive pattern 13 and the multilayer circuit structure 14.

[0059] In this embodiment, the substrate layer 11 is made of materials including but not limited to polyimide (PI), polyester resin (PET), polyethylene naphthalate (PEN), liquid crystal polymer (LCP), and modified polyimide (MPI).

[0060] In this embodiment, please refer to the following: Figure 2 Please see also Figure 11 The first conductive pattern 12 includes a plurality of first connecting lines 122 arranged side by side, with the plurality of first connecting lines 122 spaced apart. The second conductive pattern 13 includes a plurality of second connecting lines 132 arranged side by side, with the plurality of second connecting lines 132 spaced apart.

[0061] In this embodiment, please refer to Figure 1 and Figure 2 The manufacturing method of the circuit board 10 includes:

[0062] S10: Please refer to Figure 1A substrate 50 is provided, the substrate 50 including a substrate layer 11, a first copper foil layer 51, a second copper foil layer 52, a multilayer circuit structure 14, and an interlayer conductor. The first copper foil layer 51 and the second copper foil layer 52 are respectively disposed on opposite surfaces of the substrate layer 11, the multilayer circuit structure 14 is disposed within the substrate layer 11, and the interlayer conductor passes through the substrate layer 11, electrically connecting the first copper foil layer 51, the second copper foil layer 52, and the multilayer circuit structure 14.

[0063] S11: Please refer to Figure 2 The first copper foil layer 51 is etched to form the first conductive pattern 12, the first conductive pattern 12 having the first opening 121, and the second copper foil layer 52 is etched to form the second conductive pattern 13, the second conductive pattern 13 having the second opening 131.

[0064] S2: Please see Figure 3 A first groove 111 and a second groove 112 are respectively formed on the exposed portion of the substrate layer 11. The first groove 111 connects to the first opening 121, and the side of the first groove 111 is flush with the side of the first opening 121 (that is, the first groove 111 is formed by indentation in the portion of the substrate layer 11 near the first conductive pattern 12). The second groove 112 connects to the second opening 131, and the side of the second groove 112 is flush with the side of the second opening 131 (that is, the second groove 112 is formed by indentation in the portion of the substrate layer 11 near the second conductive pattern 13).

[0065] S3: Please see Figure 6 A first metal layer 21 is respectively disposed in the first groove 111 and the second groove 112. The first metal layer 21 disposed in the first groove 111 is electrically connected to each of the first connection lines 122, and the first metal layer 21 disposed in the second groove 112 is electrically connected to each of the second connection lines 132.

[0066] In this embodiment, please refer to Figures 4 to 5 Step S3 includes:

[0067] S30: Please refer to Figure 4A first cover layer 22 is provided on opposite sides of the circuit board 10. One first cover layer 22 covers the first conductive pattern 12 and a portion of the substrate layer 11 exposed in the first opening 121, while the other first cover layer 22 covers the second conductive pattern 13 and a portion of the substrate layer 11 exposed in the second opening 131. Both first cover layers 22 are provided with a first window 221, through which the first groove 111 and the second groove 112 are exposed.

[0068] S31: Please see Figure 5 The circuit substrate 10 with the first cover layer 22 is immersed in a chemical plating solution, thereby depositing and forming the seed layer (not shown) in the first groove 111 and the second groove 112 respectively. The two first cover layers 22 are removed, and then the first metal layer 21 is formed by electroplating on the seed layer. The first metal layer 21 is made of conductive metals such as copper, iron, and aluminum.

[0069] S4: Please see Figure 9 A second metal layer 31 is respectively disposed on the first conductive pattern 12 and the second conductive pattern 13. The second metal layer 31 disposed on the first conductive pattern 12 extends toward the first metal layer 21 disposed in the first groove 111 to form a first bent portion 311, and the first bent portion 311 is electrically connected to the first metal layer 21 disposed in the first groove 111. The second metal layer 31 disposed on the second conductive pattern 13 extends toward the first metal layer 21 disposed in the second groove 112 to form a second bent portion 312, and the second bent portion 312 is electrically connected to the first metal layer 21 disposed in the second groove 112. The material of the second metal layer 31 is gold.

[0070] In this embodiment, please refer to Figure 6 Before step S4, the procedure includes step S40: a third metal layer 32 is respectively disposed on the first conductive pattern 12 and the second conductive pattern 13, the end of the third metal layer 32 extending toward the first metal layer 21 to form a substrate layer 321. The material of the third metal layer 32 is a conductive metal such as copper, iron, or aluminum.

[0071] In this embodiment, step S4 includes the following steps:

[0072] S41: Please see Figure 7A second cover layer 41 is provided on the portion of the first metal layer 21 away from the substrate layer 321 and on the portion of the substrate layer 11 that exposes the first opening 121 or the second opening 131. The second cover layer 41 is provided with a second window 411, which corresponds to the third metal layer 32 and the portion of the first metal layer 21 adjacent to the substrate layer 321.

[0073] S42: A seed layer (not shown) is provided on the third metal layer 32;

[0074] S42: Please see Figure 8 The second metal layer 31 is formed by electroplating on the seed layer, and the first bent portion 311 and the second bent portion 312 are attached to the surface of the substrate layer 321.

[0075] S43: Please see Figure 9 Remove the second overlay 41.

[0076] S5: Please see Figure 10 The portion of the first metal layer 21 that does not correspond to the first bent portion 311 and the second bent portion 312 is etched away to obtain the circuit board 100. Each first connection line 122, the third metal layer 32 disposed on the first connection line 122, and the second metal layer 31 disposed on the third metal layer 32 together constitute a gold finger 60. The gold finger 60 can be inserted into a slot of an electronic device (not shown) to achieve electrical conduction between the circuit board 100 and the electronic device, which includes computers, mobile phones, cameras, etc.

[0077] Compared with the prior art, the manufacturing method of the circuit board 100 provided in this application has the following advantages:

[0078] (i) By extending the first bending portion 311 and the second bending portion 312 on the second metal layer 31, the first bending portion 311 can significantly increase the adhesion between the second metal layer 31 and the first conductive pattern 12, and the second bending portion 312 can increase the adhesion between the second metal layer 31 and the second conductive pattern 13. In particular, it can resist or offset the pulling force or friction force acting on the first conductive pattern 12 or the second conductive pattern 13, thereby reducing the risk of the first conductive pattern 12 or the second conductive pattern 13 falling off.

[0079] (ii) By providing a first metal layer 21 in the first groove 111 or the second groove 112, the bending portion 312 can be disposed on the first metal layer 21. The first bending portion 311 connects the first conductive pattern 12 and the first metal layer 21 into one unit, and the second bending portion 312 connects the second conductive pattern 13 and the first metal layer 21 into one unit, thereby further reducing the risk of the first conductive pattern 12 or the second conductive pattern 13 falling off.

[0080] Please see Figure 10 and Figure 11 This application also provides a circuit board 100, which includes a circuit board 10, a first metal layer 21, a second metal layer 31, and a bending portion 312.

[0081] The circuit board 10 includes a substrate layer 11 and a first conductive pattern 12 and a second conductive pattern 13 disposed on the substrate layer 11. The first conductive pattern 12 is provided with a first opening 121, and the second conductive pattern 13 is provided with a second opening 131. The first opening 121 and the second opening 131 are correspondingly disposed, and a portion of the substrate layer 11 is exposed at the bottom of the first opening 121 and the second opening 131.

[0082] The exposed portion of the substrate layer 11 is provided with a first groove 111 and a second groove 112. The first groove 111 is connected to the first opening 121, and the side of the first groove 111 is flush with the side of the first opening 121. The second groove 112 is connected to the second opening 131, and the side of the second groove 112 is flush with the side of the second opening 131.

[0083] The first metal layer 21 is disposed in the first groove 111 and the second groove 112, and the second metal layer 31 is disposed on the first conductive pattern 12 and the second conductive pattern 13. The end of the second metal layer 31 extends toward the first metal layer 21 to form the bent portion 312, and the bent portion 312 is electrically connected to the first metal layer 21.

Claims

1. A method for manufacturing a circuit board, characterized in that, Including steps: A circuit board is provided, the circuit board including a substrate layer and a conductive pattern disposed on the substrate layer, the conductive pattern having an opening through which a portion of the substrate layer is exposed at the bottom of the opening; A groove is provided on the exposed portion of the substrate layer, and the side of the groove is flush with the side of the opening; A first metal layer is disposed within the groove; as well as A second metal layer is disposed on the conductive pattern, and the end of the second metal layer extends toward the first metal layer to form a bend, the bend being electrically connected to the first metal layer to obtain the circuit board.

2. The manufacturing method as described in claim 1, characterized in that, Before setting the second metal layer, the method further includes: setting a third metal layer on the conductive pattern, wherein the end of the third metal layer extends toward the first metal layer to form a substrate layer; The manufacturing method further includes: depositing the second metal layer on the third metal layer, wherein the bent portion is attached to the substrate layer.

3. The manufacturing method as described in claim 2, characterized in that, After setting a third metal layer on the conductive pattern, the method further includes setting a seed layer on the third metal layer; The manufacturing method further includes: depositing the second metal layer on the seed layer.

4. The manufacturing method as described in claim 1, characterized in that, Before setting the first metal layer, the following steps are also included: A first cover layer is provided on the conductive pattern and the exposed portion of the substrate layer. The first cover layer is provided with a first window, which corresponds to the groove. After setting the first metal layer, the process also includes: removing the first cover layer.

5. The manufacturing method as described in claim 2, characterized in that, Before applying the second metal layer, the following steps are also included: A second cover layer is provided on the exposed portion of the substrate layer and a portion of the first metal layer. The second cover layer is provided with a second opening, which corresponds to the substrate layer and the portion of the first metal layer adjacent to the substrate layer. The process after setting the second metal layer also includes: removing the second cover layer.

6. The manufacturing method as described in claim 1, characterized in that, It also includes the following steps: Remove the portion of the first metal layer that does not correspond to the bent portion.

7. A circuit board, characterized in that, include: A circuit board includes a substrate layer and a conductive pattern disposed on the substrate layer. The conductive pattern has an opening through it, and a portion of the substrate layer is exposed at the bottom of the opening. A groove is disposed on the exposed portion of the substrate layer, and the side of the groove is flush with the side of the opening. A first metal layer is disposed within the opening; A second metal layer is disposed on the conductive pattern; The bending portion is formed by the end of the second metal layer extending toward the first metal layer, and the bending portion is electrically connected to the first metal layer.

8. The circuit board as described in claim 7, characterized in that, The conductive pattern includes multiple connecting lines arranged side by side at intervals, and the first metal layer is electrically connected to each of the connecting lines.

9. The circuit board as described in claim 7, characterized in that, The circuit board further includes a third metal layer and a substrate layer. The second metal layer is disposed on the third metal layer. The third metal layer faces the first metal layer to form the substrate layer. The bent portion is attached to the substrate layer.

10. The circuit board as described in claim 9, characterized in that, The first metal layer and the third metal layer are made of copper, and the second metal layer is made of gold.

Images