Method of manufacturing an electronic device, apparatus and electronic device

Abstract

The application discloses a kind of production method, device and electronic device of electronic device, and belongs to electronic component manufacturing technical field, and the production method of electronic device includes: placing steel sheet on PCB, steel sheet has multiple through hole groups and multiple positioning through holes, multiple positioning through holes are one-to-one with multiple standard Mark on PCB Mark alignment;Place steel net on PCB, steel net has multiple tin hole groups corresponding to multiple through hole groups and multiple positioning tin holes corresponding to multiple positioning through holes;Solder paste printing is carried out on PCB, to print fixed solder paste group on the pad of PCB, and positioning solder paste is printed on PCB;Identify positioning solder paste as mounting reference and mount surface-mounted component to pad;Surface-mounted component is welded on the pad where it is mounted, to obtain electronic device.The application can avoid the problem of surface-mounted component on PCB air welding or monument bad, so that the yield of the electronic device produced is higher.

Description

Technical Field

[0001] This invention relates to the field of electronic component manufacturing technology, and in particular to a method, apparatus and electronic device for manufacturing an electronic device. Background Technology

[0002] Electronic products consist of multiple electronic components, each of which includes a PCB (Printed Circuit Board); a Printed Circuit Board and multiple components fixed on the PCB.

[0003] In existing technology, the manufacturing process of electronic devices includes: first, placing a stencil on a PCB; then, placing a stencil on the stencil; next, printing solder paste on the stencil; then, removing the stencil and stencil and inspecting the solder paste; and finally, placing components using a pick-and-place machine. During the placement process, the machine uses position identification points on the PCB as position references to place multiple components, thus obtaining the electronic device. However, due to the expansion and contraction of the PCB during manufacturing, there is a positional deviation between the solder paste printing and the pads on the PCB. Specifically, the solder paste on the pads may not completely cover the center area of ​​the pads. Since the pick-and-place machine still uses the position identification points on the PCB as position references, and the component placement position is the center area of ​​the pads, this results in uneven solder paste distribution at both ends of the component. During subsequent reflow soldering, the solder paste tension at both ends of the component is inconsistent, leading to open circuits or poor tombstoning.

[0004] Therefore, there is an urgent need for a method, apparatus, and electronic device for manufacturing electronic devices to solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to provide a method, apparatus and electronic device for manufacturing electronic devices, which can avoid problems such as poor soldering or tombstoning of surface-mount components on PCBs, and thus achieve a higher yield of manufactured electronic devices.

[0006] Based on the above concept, the technical solution adopted by this invention is as follows:

[0007] The manufacturing method of electronic devices includes the following steps:

[0008] A steel sheet is placed on a PCB. The steel sheet has multiple through-hole groups and multiple positioning through-holes. The multiple positioning through-holes are aligned one-to-one with multiple standard Mark bits on the PCB. The standard Mark bits are the Mark bits on the PCB when it is not expanding or contracting.

[0009] A stencil is placed on the PCB on which the steel sheet is placed. The stencil has a plurality of solder hole groups corresponding one-to-one with the plurality of through hole groups and a plurality of positioning solder holes corresponding one-to-one with the plurality of positioning through holes.

[0010] Solder paste is printed on the PCB through the stencil, and solder paste is printed and fixed on the pads of the PCB through the through-hole group and the solder hole group, and positioning solder paste is printed on the PCB through the positioning through-hole and the positioning solder hole.

[0011] The surface mount components are mounted onto the pads by identifying the positioning solder paste as the mounting reference.

[0012] The surface-mount components are soldered onto the pads on which they are mounted to obtain electronic devices.

[0013] Optionally, the plurality of positioning solder pastes are aligned one-to-one with the plurality of actual Mark bits on the PCB, and some or all of the positioning solder pastes are formed on the corresponding actual Mark bits, wherein the actual Mark bits are the Mark bits on the PCB after expansion or contraction.

[0014] Optionally, the PCB is mounted on a positioning carrier before the steel sheet is placed on the PCB.

[0015] Optionally, surface-mount components are soldered onto the pads on which they are mounted to obtain an electronic device, including the following steps:

[0016] Perform pre-reflow optical inspection on the PCB with the surface mount components mounted;

[0017] The PCB after inspection is reflow soldered to solder the surface mount components onto the mounting pads.

[0018] The PCB after reflow soldering is subjected to post-reflow optical inspection to obtain electronic components.

[0019] An apparatus for manufacturing electronic devices, applied to the aforementioned method for manufacturing electronic devices, includes:

[0020] The steel sheet has multiple through-hole groups and multiple positioning through-holes, and the multiple positioning through-holes correspond one-to-one with multiple standard Mark positions, which are the Mark positions on the PCB when no expansion or contraction occurs.

[0021] A stencil, the stencil having multiple groups of solder holes and multiple positioning solder holes, the multiple groups of solder holes corresponding one-to-one with the multiple groups of through holes, and the multiple positioning solder holes corresponding one-to-one with the multiple positioning through holes;

[0022] Solder paste printing mechanism is used to print solder paste on the PCB through the stencil, to print and fix solder paste groups on the pads of the PCB through the through-hole group and the solder hole group, and to print positioning solder paste on the PCB through the positioning through-hole and the positioning solder hole.

[0023] A surface mount mechanism is used to identify the positioning solder paste as a mounting reference and mount the surface mount components onto the pads.

[0024] A welding mechanism for welding the surface mount component onto the mounting pad.

[0025] Optionally, multiple through-hole groups are arranged in an array, with the through-hole groups in adjacent rows staggered. The steel sheet has positioning through holes around its perimeter between two adjacent through-hole groups and between two adjacent rows of through-hole groups. Each through-hole group includes a first through-hole and a second through-hole. The second through-hole of several through-hole groups located at the edge communicates with several positioning through-holes located around the perimeter of the steel sheet.

[0026] Optionally, the plurality of positioning solder pastes correspond one-to-one with the plurality of actual Mark bits of the PCB, and some or all of the positioning solder pastes are formed on the corresponding actual Mark bits.

[0027] An electronic device, manufactured by the above-described method, includes a PCB, a fixed solder paste assembly, positioning solder paste, and surface mount components. The PCB has multiple pads and multiple actual mark bits. Each pad has a fixed solder paste assembly, and the PCB has multiple positioning solder pastes. The surface mount components are soldered to the pads via the fixed solder paste assembly.

[0028] Optionally, the actual Mark position is a groove structure, and some or all of the positioning solder paste is formed in the corresponding groove structure; or, the actual Mark position is a protruding structure, and the actual Mark position has a top surface, the positioning solder paste is formed on the top surface of the actual Mark position, and the cross-section of the positioning solder paste is smaller than the top surface of the actual Mark position.

[0029] Optionally, the positioning solder paste is cylindrical, prismatic, frustum-shaped, prismatic, or conical.

[0030] The beneficial effects of this invention are:

[0031] The present invention provides a method, apparatus, and electronic device for manufacturing electronic devices. A stencil has positioning through-holes on a steel sheet that align one-to-one with the standard Mark positions of the PCB before expansion or contraction. A stencil also has positioning solder holes that align one-to-one with the standard Mark positions. This allows solder paste to be printed on the PCB (excluding the pads) through the positioning solder holes and positioning through-holes during solder paste printing, thus obtaining positioning solder paste. The positioning solder paste is then used as a mounting reference to mount surface-mount components onto the pads. Compared to using the actual Mark positions after PCB expansion or contraction as the mounting reference, this method avoids uneven solder paste distribution at both ends of the surface-mount component due to PCB expansion or contraction. It ensures consistent solder paste tension at both ends of the surface-mount component during soldering, reducing the probability of open solder joints or tombstoning defects, resulting in a higher yield rate for the manufactured electronic devices. Attached Figure Description

[0032] Figure 1 This is a flowchart of the manufacturing method of the electronic device provided in the embodiments of the present invention;

[0033] Figure 2 This is a schematic diagram of the PCB structure provided in an embodiment of the present invention. Figure 1 ;

[0034] Figure 3 This is a schematic diagram of the PCB structure provided in an embodiment of the present invention. Figure 2 ;

[0035] Figure 4 This is a schematic diagram of the steel sheet structure provided in an embodiment of the present invention. Figure 1 ;

[0036] Figure 5 This is a schematic diagram of the steel sheet structure provided in an embodiment of the present invention. Figure 2 ;

[0037] Figure 6 This is a schematic diagram of the steel mesh structure provided in an embodiment of the present invention. Figure 1 ;

[0038] Figure 7 This is a schematic diagram of the steel mesh structure provided in an embodiment of the present invention. Figure 2 ;

[0039] Figure 8 This is the present invention. Figure 7 The enlarged schematic diagram at point A is shown below;

[0040] Figure 9 This is a schematic diagram of a PCB fixed on a carrier according to an embodiment of the present invention;

[0041] Figure 10 This is a schematic diagram of the structure of the electronic device provided in the embodiments of the present invention. Figure 1 ;

[0042] Figure 11 This is a schematic diagram of the structure of the electronic device provided in the embodiments of the present invention. Figure 2 ;

[0043] Figure 12 This is the present invention. Figure 11 The enlarged schematic diagram at point B is shown.

[0044] In the picture:

[0045] 1. Steel sheet; 11. Through-hole group; 111. First through-hole; 112. Second through-hole; 12. Positioning through-hole; 13. Connecting hole; 2. Steel mesh; 21. Tin hole group; 211. First tin hole; 212. Second tin hole; 22. Positioning tin hole; 3. Positioning carrier;

[0046] 10. PCB; 101. Solder pad; 102. Actual Mark bit; 20. Fixed solder paste group; 201. First fixed solder paste; 202. Second fixed solder paste; 30. Positioning solder paste. Detailed Implementation

[0047] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely for explaining the present invention and are not intended to limit the present invention. Furthermore, it should be noted that, for ease of description, only the parts related to the present invention are shown in the accompanying drawings, not all of them.

[0048] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0049] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0050] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0051] Example 1

[0052] This embodiment provides a method for manufacturing electronic devices, which can avoid problems such as poor soldering or tombstoning of surface-mount components on PCBs, resulting in a higher yield of manufactured electronic devices.

[0053] like Figure 1 As shown, the method for manufacturing electronic devices includes the following steps:

[0054] S1. Place a steel sheet 1 on the PCB 10. The steel sheet 1 has multiple through-hole groups 11 and multiple positioning through-holes 12. The multiple positioning through-holes 12 are aligned one-to-one with multiple standard Mark bits on the PCB 10. The standard Mark bits are the Mark bits on the PCB 10 when it does not expand or contract.

[0055] In this embodiment, the steel sheet 1 can be placed manually, or it can be placed on the PCB 10 using automated equipment such as a robotic arm. It should be noted that the PCB 10 has a mounting surface for surface-mount components, and the steel sheet 1 is located on this mounting surface. Positioning structures are provided on both the PCB 10 and the steel sheet 1 for positioning. The shape of the steel sheet 1 matches the shape of the PCB 10. In some embodiments, such as... Figure 2 As shown, PCB 10 is rectangular, as... Figure 4 and Figure 5 As shown, steel sheet 1 is rectangular.

[0056] like Figure 2 or Figure 3 As shown, multiple pads 101 on PCB 10 are arranged sequentially along the length of PCB 10. Mark bits are present at the edges and center of PCB 10. The Mark bit located in the center of PCB 10 is located between two adjacent pads 101, and multiple standard Mark bits 102 are present between two adjacent pads 101. It should be noted that "multiple" in this embodiment specifically refers to two or more.

[0057] like Figure 4 and Figure 5As shown, multiple through-hole groups 11 are arranged in an array on the steel sheet 1. In this embodiment, the through-hole groups 11 are arranged in two rows and seven columns. Multiple positioning through holes 12 are interspersed between the through-hole groups 11, and the steel sheet 1 also has positioning through holes 12 around its perimeter. It should be noted that each through-hole group 11 includes a first through hole 111 and a second through hole 112 spaced apart along the row direction. The second through hole 112 is located closer to the edge of the steel sheet 1 than the first through hole 111. Furthermore, the first through hole 111 and the second through hole 112 of a through-hole group 11 correspond to the same pad 101. For example, the first through hole 111 corresponds to the center of the pad 101, and the second through hole 112 corresponds to one edge of the pad 102.

[0058] It should also be noted that in this embodiment, the one-to-one alignment of multiple positioning through holes 12 with multiple standard Mark bits means that when the steel sheet 1 is stacked with the PCB 10 which has not undergone expansion or contraction, the positions of the positioning through holes 12 and the positions of the standard Mark bits are opposite to each other in the thickness direction of the steel sheet 1.

[0059] Optionally, before step S1, the PCB 10 is mounted onto the positioning carrier 3 to fix the PCB 10 in place, facilitating subsequent operations. In this embodiment, the structure of the positioning carrier 3 is described below. Figure 9 The positioning carrier 3 has a positioning mounting slot, and the PCB10 is located in the positioning mounting slot.

[0060] S2. Place a stencil 2 on the PCB 10 on which the steel sheet 1 is placed. The stencil 2 has a plurality of solder hole groups 21 corresponding to a plurality of through hole groups 11 and a plurality of positioning solder holes 22 corresponding to a plurality of positioning through holes 12.

[0061] In step S2, the stencil 1 is located between the PCB 10 and the stencil 2. The stencil 2 is used for the solder paste printing step. The shape of the stencil 2 can be seen in [reference needed]. Figure 6 .like Figure 7 and Figure 8 As shown, the arrangement of the multiple solder hole groups 21 is the same as that of the through hole group 11, and each solder hole group 21 includes a first solder hole 211 and a second solder hole 212. The first solder hole 211 and the first through hole 111 of the corresponding through hole group 11 are arranged opposite to each other in the thickness direction of the steel sheet 1; the second solder hole 212 and the second through hole 112 of the corresponding through hole group 11 are arranged opposite to each other in the thickness direction of the steel sheet 1. The solder hole group 21 is used to form solder paste for fixing surface mount components, and the specific structure of the solder hole group 21 can be set according to actual needs. This embodiment does not limit this, such as Figure 8 As shown, the first tin hole 211 and the second tin hole 212 each include multiple hole structures for forming multiple solder paste blocks.

[0062] It should be noted that, in this embodiment, the one-to-one correspondence between the multiple through-hole groups 11 and the multiple tin hole groups 21 means that when the steel mesh 2 and the steel sheet 1 are stacked, the multiple through-hole groups 11 and the multiple tin hole groups 21 are opposite to each other and connected in the thickness direction of the steel sheet 1, and the multiple positioning through holes 12 and the multiple positioning tin holes 22 are opposite to each other and connected in the thickness direction of the steel sheet 1.

[0063] S3. Solder paste is printed on PCB 10 through stencil 2, and the solder paste group 20 is printed and fixed on the pad 101 of PCB 10 through through hole group 11 and solder hole group 21, and the positioning solder paste 30 is printed on PCB 10 through positioning through hole 12 and positioning solder hole 22.

[0064] In step S3, solder paste can be printed using a solder paste printing mechanism. The specific structure and working principle of the solder paste printing mechanism can be found in existing technologies, such as solder paste printers, and will not be elaborated upon here. During the printing process, solder paste falls onto the pad 101 through the corresponding through-hole group 11 and solder hole group 21, resulting in multiple fixed solder paste groups 20. Each fixed solder paste group 20 includes multiple fixed solder pastes. In this embodiment, the fixed solder paste group 20 includes a first fixed solder paste 201 corresponding to the first solder hole 211 and a second fixed solder paste 202 corresponding to the second solder hole 212. Solder paste forms the first fixed solder paste 201 on the pad 101 through the first through-hole 111 and the first solder hole 211, and the solder paste forms the second fixed solder paste 202 on the pad 101 through the second through-hole 112 and the second solder hole 212.

[0065] The solder paste also falls onto the PCB 10 through the corresponding positioning through-holes 12 and positioning solder holes 22, resulting in multiple positioning solder pastes 30. In this embodiment, the positioning solder holes 22 can be located at any position on the PCB 10 outside the pads. Therefore, in this embodiment, solder paste is printed not only on the pads 101, but also on the PCB 10 at locations other than the pads 101.

[0066] Optionally, after step S3, the method for manufacturing the electronic device further includes automatically detecting the solder paste status. Specifically, the printing status of the fixed solder paste group 20 and the printing status of the positioning solder paste 30 are both detected. Specific detection methods and equipment can be found in existing technologies, and will not be elaborated upon in this embodiment.

[0067] S4. Identify and position solder paste 30 as the mounting reference and mount the surface mount components onto pad 101.

[0068] In step S4, surface mount components can be mounted onto pads 101 using a surface mount mechanism. The specific structure and working principle of the surface mount mechanism can be found in existing technologies, such as surface mount machines; this embodiment does not limit this aspect. In step S4, when mounting surface mount components, positioning solder paste 30 is used as the mounting reference, instead of directly using the actual Mark bit 102 on the PCB 10 as the mounting reference. It should be noted that surface mount components are mounted onto pads 101 via fixed solder paste groups 20, and each fixed solder paste group 20 can mount at least one surface mount component.

[0069] In this embodiment, to facilitate the mounting of surface mount components, after step S3, the stencil 2 is removed, and the stencil sheet 1 can continue to be placed on the PCB 10. Since the through-hole group 11 on the stencil sheet 1 is relatively large, it will not affect the mounting of the surface mount components. It is understood that after step S3, the stencil sheet 1 and the stencil 2 can also be removed simultaneously, but this embodiment does not limit this.

[0070] S5. Solder the surface-mount components onto their mounting pads 101 to obtain electronic devices.

[0071] After the surface-mount components are mounted on the pads 101, they need to be soldered onto the pads 101 to improve the connection strength. Specifically, the surface-mount components can be soldered by reflow soldering to obtain the electronic device.

[0072] The electronic device manufacturing method provided in this embodiment has positioning through holes 12 on the stencil 1 that are aligned with the standard Mark positions of the PCB 10 when it has not expanded or contracted, and positioning solder holes 22 on the stencil 2 that are aligned with the standard Mark positions. This allows solder paste to be printed on the PCB 10 except for the pads during solder paste printing through the positioning solder holes 22 and the positioning through holes 12, thus obtaining positioning solder paste 30. The positioning solder paste 30 is identified as the mounting reference and the surface mount components are mounted onto the pads 101. Compared with the method of using the actual Mark position 102 of the PCB 10 after expansion or contraction as the mounting reference, this method can avoid the uneven amount of solder paste at both ends of the surface mount components caused by the expansion or contraction of the PCB 10. This ensures that the solder paste tension at both ends of the surface mount components is consistent during soldering, reducing the probability of open solder joints or tombstoning defects, and resulting in a higher yield of the manufactured electronic devices.

[0073] Optionally, such as Figure 12 As shown, multiple positioning solder pastes 30 are aligned one-to-one with multiple actual Mark bits 102 of the PCB 10, and some or all of the positioning solder pastes 30 are formed on their corresponding actual Mark bits 102. The actual Mark bits 102 are the Mark bits on the PCB 10 after expansion and contraction. That is, in this embodiment, the positioning solder pastes 30 are formed on the Mark bits to facilitate positioning and capture during mounting.

[0074] It should be noted that, due to the expansion and contraction of PCB 10, the center of some of the positioning solder pastes 30 can coincide with the center of the actual Mark position 102, while the center of another part of the positioning solder pastes 30 deviates from the center of the actual Mark position 102. This allows the positioning solder pastes 30 to be used as the mounting reference, thereby reducing mounting errors.

[0075] Optionally, step S5 includes the following steps:

[0076] Perform pre-reflow optical inspection on PCB 10, which has surface-mount components mounted on it.

[0077] In this embodiment, the specific method of pre-furnace optical inspection can refer to the prior art. By performing inspection, problematic PCBs 10 can be picked out in advance, and qualified PCBs 10 can be soldered, thereby improving product manufacturing efficiency.

[0078] The inspected PCB 10 is reflow soldered to solder surface-mount components onto its mounting pads 101.

[0079] Post-reflow optical inspection is performed on PCB 10 after reflow soldering to obtain electronic components.

[0080] Optical inspection can detect faulty electronic devices in a timely manner, allowing qualified electronic devices to proceed to the next stage of the process.

[0081] Example 2

[0082] This embodiment provides an apparatus for manufacturing electronic devices, applied to the method for manufacturing electronic devices in Embodiment 1, such as... Figures 3 to 12 As shown, the electronic device manufacturing apparatus includes a steel sheet 1, a stencil 2, a solder paste printing mechanism, a surface mount mechanism, and a soldering mechanism.

[0083] The stencil 1 has multiple through-hole groups 11 and multiple positioning through-holes 12, each corresponding to a standard Mark bit. The standard Mark bit is the Mark bit on the PCB 10 when it is not expanding or contracting. The stencil 2 has multiple solder hole groups 21 and multiple positioning solder holes 22, each corresponding to a through-hole group 11. The solder paste printing mechanism prints solder paste on the PCB 10 through the stencil 2, fixing solder paste groups 20 on the pads 101 of the PCB 10 through the through-hole groups 11 and solder hole groups 21, and printing positioning solder paste 30 on the PCB 10 through the positioning through-holes 12 and positioning solder holes 22. The surface mount mechanism identifies the positioning solder paste 30 as a mounting reference and mounts the surface mount components onto the pads 101. The soldering mechanism solders the surface mount components onto the mounting pads 101.

[0084] The electronic device manufacturing apparatus provided in this embodiment has positioning through holes 12 on the steel sheet 1 that are aligned with the standard Mark positions of the PCB 10 when it has not expanded or contracted, and positioning solder holes 22 on the stencil 2 that are aligned with the standard Mark positions. This allows solder paste to be printed on the PCB 10 except for the pads during solder paste printing through the positioning solder holes 22 and the positioning through holes 12, thus obtaining positioning solder paste 30. The positioning solder paste 30 is identified as the mounting reference and the surface mount components are mounted onto the pads 101. Compared with the method of using the actual Mark position 102 of the PCB 10 after expansion or contraction as the mounting reference, this method can avoid the uneven amount of solder paste at both ends of the surface mount components caused by the expansion or contraction of the PCB 10. This ensures that the solder paste tension at both ends of the surface mount components is consistent during soldering, reducing the probability of open solder joints or tombstoning defects, and resulting in a higher yield of manufactured electronic devices.

[0085] Optionally, such as Figure 4 and Figure 5 As shown, multiple through-hole groups 11 are arranged in an array, with adjacent rows of through-hole groups 11 staggered. Positioning through-holes 12 are present around the perimeter of the steel sheet 1 between adjacent through-hole groups 11 along the column direction and between adjacent rows of through-hole groups 11, enabling the formation of multiple positioning references at various locations on the PCB 10, further improving positioning accuracy. Furthermore, each through-hole group 11 includes a first through-hole 111 and a second through-hole 112. The second through-holes 112 of several through-hole groups 11 located at the edge are connected one-to-one with several positioning through-holes 12 located around the perimeter of the steel sheet 1. In this embodiment, to clearly show the connected second through-holes 112 and positioning through-holes 12, as shown... Figure 4 and Figure 5 As shown, the hole through which the second through hole 112 connects with the positioning through hole 12 is called the connecting hole 13. In this embodiment, there are two connecting holes 13, which are respectively located near two opposite corners of the steel sheet 1. By setting the connecting holes 13, and the connecting holes 13 having a large area, the amount of solder can be increased to prevent the formed positioning solder paste 30 and the second fixing solder paste 202 from having rough edges.

[0086] Optionally, such as Figure 11 and Figure 12 As shown, multiple positioning solder pastes 30 correspond one-to-one with multiple actual Mark bits 102 of PCB 10, and some or all of the positioning solder pastes 30 are formed on their corresponding actual Mark bits 102.

[0087] Example 3

[0088] This embodiment provides an electronic device manufactured using the method described in Embodiment 1. Figure 11As shown, the electronic components include a PCB 10, a fixed solder paste assembly 20, a positioning solder paste 30, and surface mount components (not shown).

[0089] The PCB 10 has multiple pads 101 and multiple actual Mark bits 102. Each pad 101 has a fixed solder paste group 20. The PCB 10 has multiple positioning solder pastes 30. Surface mount components are soldered to the pads 101 through the fixed solder paste group 20.

[0090] In some embodiments, such as Figure 12 As shown, the actual Mark 102 is a groove structure, and part or all of the positioning solder paste 30 is formed in the corresponding groove structure, so that the setting of the positioning solder paste 30 will not increase the thickness of PCB 10 too much, reducing interference with subsequent manufacturing processes.

[0091] In some other embodiments, the actual Mark bit 102 is a protruding structure and has a top surface. The positioning solder paste 30 is formed on the top surface of the actual Mark bit 102, and the cross-section of the positioning solder paste 30 is smaller than the top surface of the actual Mark bit 102. That is, the positioning solder paste 30 is a protruding structure on the top surface of the actual Mark bit 102, rather than a structure covering the top surface of the Mark bit 102, so as to have the function of serving as an identification reference.

[0092] Optionally, the positioning solder paste 30 may be cylindrical, prismatic, frustum-shaped, pyramidal, conical, etc., but this embodiment does not limit this.

[0093] In the manufacturing process of the electronic device provided in this embodiment, the steel sheet 1 has positioning through holes 12 that are aligned with the standard Mark positions of the PCB 10 when it has not expanded or contracted, and the stencil 2 has positioning solder holes 22 that are aligned with the standard Mark positions. This allows solder paste to be printed on the PCB 10 except for the pads during solder paste printing through the positioning solder holes 22 and the positioning through holes 12, thus obtaining positioning solder paste 30. The positioning solder paste 30 is identified as the mounting reference and the surface mount components are mounted onto the pads 101. Compared with the method of using the actual Mark position 102 of the PCB 10 after expansion or contraction as the mounting reference, this method can avoid the uneven amount of solder paste at both ends of the surface mount components caused by the expansion or contraction of the PCB 10. This ensures that the solder paste tension at both ends of the surface mount components is consistent during soldering, reducing the probability of open solder joints or tombstoning defects, and resulting in a higher yield of the manufactured electronic device.

[0094] The above embodiments merely illustrate the basic principles and characteristics of the present invention. The present invention is not limited to the above embodiments. Various changes and modifications can be made to the present invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

[0095] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A method for manufacturing an electronic device, characterized in that, Includes the following steps: A steel sheet (1) is placed on a PCB (10). The steel sheet (1) has multiple through-hole groups (11) and multiple positioning through-holes (12). The multiple positioning through-holes (12) are aligned one-to-one with multiple standard Mark bits on the PCB (10). The standard Mark bits are the Mark bits on the PCB (10) when it does not expand or contract. A stencil (2) is placed on a PCB (10) on which the steel sheet (1) is placed. The stencil (2) has a plurality of solder hole groups (21) corresponding one-to-one with the plurality of through hole groups (11) and a plurality of positioning solder holes (22) corresponding one-to-one with the plurality of positioning through holes (12). Solder paste is printed on the PCB (10) through the stencil (2) to fix the solder paste group (20) on the pads (101) of the PCB (10) through the through hole group (11) and the solder hole group (21), and to fix the solder paste group (30) on the PCB (10) through the positioning through hole (12) and the positioning solder hole (22). The positioning solder paste (30) is used as a mounting reference to mount the surface mount components onto the pads (101); The surface-mount component is soldered onto the mounting pad (101) to obtain an electronic device; The multiple positioning solder pastes (30) are aligned one-to-one with the multiple actual Mark bits (102) on the PCB (10). Some or all of the positioning solder pastes (30) are formed on the corresponding actual Mark bits (102). The actual Mark bits (102) are the Mark bits on the PCB (10) after expansion and contraction.

2. The method for manufacturing an electronic device according to claim 1, characterized in that, Before placing the steel sheet (1) on the PCB (10), the PCB (10) is mounted on the positioning carrier (3).

3. The method for manufacturing an electronic device according to claim 1, characterized in that, Soldering surface-mount components onto the mounting pads (101) to obtain an electronic device includes the following steps: The PCB (10) with the surface mount components mounted is subjected to pre-reflow optical inspection; The PCB (10) after inspection is reflow soldered to solder the surface mount components onto the pads (101) on which they are mounted. The PCB (10) after reflow soldering is subjected to post-reflow optical inspection to obtain electronic devices.

4. An apparatus for manufacturing an electronic device, applied to the method for manufacturing the electronic device according to any one of claims 1-3, characterized in that, include: The steel sheet (1) has multiple through-hole groups (11) and multiple positioning through-holes (12). The multiple positioning through-holes (12) correspond one-to-one with multiple standard Mark bits. The standard Mark bits are the Mark bits on the PCB (10) when it does not expand or contract. The stencil (2) has multiple tin hole groups (21) and multiple positioning tin holes (22), the multiple tin hole groups (21) correspond one-to-one with the multiple through hole groups (11), and the multiple positioning tin holes (22) correspond one-to-one with the multiple positioning through holes (12); Solder paste printing mechanism for printing solder paste on the PCB (10) through the stencil (2), for printing a fixed solder paste group (20) on the pads (101) of the PCB (10) through the through hole group (11) and the solder hole group (21), and for printing positioning solder paste (30) on the PCB (10) through the positioning through hole (12) and the positioning solder hole (22). The surface mount mechanism is used to identify the positioning solder paste (30) as a mounting reference and mount the surface mount components onto the pads (101); A soldering mechanism for soldering the surface mount element onto the pad (101) on which it is mounted.

5. The apparatus for manufacturing an electronic device according to claim 4, characterized in that, Multiple through-hole groups (11) are arranged in an array, and the through-hole groups (11) in adjacent rows are staggered. Between two adjacent through-hole groups (11) and between two adjacent rows of through-hole groups (11), the steel sheet (1) has positioning through holes (12) around its perimeter. The through-hole group (11) includes a first through hole (111) and a second through hole (112). The second through hole (112) of several through-hole groups (11) located at the edge is connected to several positioning through holes (12) located around the steel sheet (1).

6. The apparatus for manufacturing an electronic device according to claim 4, characterized in that, The multiple positioning solder pastes (30) correspond one-to-one with the multiple actual Mark bits (102) of the PCB (10), and some or all of the positioning solder pastes (30) are formed on the corresponding actual Mark bits (102).

7. An electronic device, manufactured by the method of manufacturing the electronic device according to any one of claims 1-3, characterized in that, The device includes a PCB (10), a fixed solder paste set (20), a positioning solder paste (30), and surface mount components. The PCB (10) has multiple pads (101) and multiple actual Mark bits (102). Each pad (101) has a fixed solder paste set (20), and the PCB (10) has multiple positioning solder pastes (30). The surface mount components are soldered to the pads (101) through the fixed solder paste set (20).

8. The electronic device according to claim 7, characterized in that, The actual Mark position (102) is a groove structure, and part or all of the positioning solder paste (30) is formed in the corresponding groove structure. Alternatively, the actual Mark position (102) is a protruding structure, and the actual Mark position (102) has a top surface. The positioning solder paste (30) is formed on the top surface of the actual Mark position (102), and the cross-section of the positioning solder paste (30) is smaller than the top surface of the actual Mark position (102).

9. The electronic device according to claim 7, characterized in that, The positioning solder paste (30) is cylindrical, prismatic, frustum-shaped, prismatic, or conical.

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