原子层沉积设备
The atomic layer deposition equipment, designed with rotating components and multiple sets of air intake components, solves the problem of low processing efficiency of existing equipment, realizes simultaneous processing and efficient deposition of multiple samples, and features a compact design with a small footprint, while improving deposition quality and uniformity.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENZHEN YUANSU OPTOELECTRONICS TECH CO LTD
- Filing Date
- 2023-01-16
- Publication Date
- 2026-07-17
AI Technical Summary
Existing atomic layer deposition equipment has low processing efficiency, especially in single-wafer and furnace-type equipment. Single-wafer equipment has low processing efficiency, while furnace-type equipment, although it can process multiple wafers at once, has a long cycle time and large equipment size.
Design an atomic layer deposition apparatus that includes a reaction chamber, a substrate holder, a support device, and a gas supply device. The substrate holder is driven to rotate by a rotating component, allowing it to come into contact with various reaction gases. Combined with multiple sets of gas inlet components and protective gas pipelines, it can process multiple samples simultaneously and reduce rinsing time.
It improves the processing efficiency and quantity of atomic layer deposition equipment, with a compact structure, small footprint, and improved deposition quality and uniformity.
Smart Images
Figure CN116005136B_ABST