Fan assembly and computing device

Abstract

Embodiments of the present application provide a fan assembly and a computing device, and relate to the technical field of fans. The fan assembly comprises a first frame, a fan structure, a second frame and a waveguide plate. The first frame is connected with the second frame to enclose a fan accommodating cavity, and the fan structure is installed in the fan accommodating cavity. The fan structure comprises a fan body and a fan blade, the fan blade is rotationally connected with the fan body, and the fan body is connected with the first frame and the second frame. The first frame comprises a first panel, and the first panel is provided with a first air inlet. The second frame comprises a second panel, and the second panel is provided with a first air outlet. The fan blade is used to drive air to flow to the first air outlet through the first air inlet. The first air inlet penetrates along a first direction, and the waveguide plate is embedded in the first air inlet along the first direction. The waveguide plate is embedded in the first air inlet along the first direction, so that the occupied space of the fan assembly can be reduced, and the space utilization in the computing device can be improved.

Description

Technical Field

[0001] Embodiments of this application relate to the technical field of fans, and more particularly to a fan assembly and a computing device. Background Technology

[0002] Computing devices typically include fan assemblies, which are used to dissipate heat from the processing chips inside the device. However, fan assemblies usually occupy a significant amount of space within the computing device, impacting space utilization. Summary of the Invention

[0003] The purpose of embodiments of this application is to provide a fan assembly and a computing device for reducing the space occupied by the fan assembly within the computing device and improving the space utilization rate within the computing device.

[0004] To achieve the above objectives, the following technical solution is provided:

[0005] On one hand, embodiments of this application provide a fan assembly. The fan assembly includes a first frame, a fan structure, a second frame, and a waveguide plate. The first frame and the second frame are connected to form a fan housing cavity, and the fan structure is installed within the fan housing cavity. The fan structure includes a fan body and fan blades, the fan blades being rotatably connected to the fan body, and the fan body being connected to the first frame and the second frame. The first frame includes a first panel with a first air inlet. The second frame includes a second panel with a first air outlet. The fan blades drive air to flow from the first air inlet to the first air outlet. The first air inlet extends through the first direction, and the waveguide plate is embedded in the first air inlet along the first direction.

[0006] In the embodiments of this application, the fan structure is installed in the fan housing cavity enclosed by the first frame and the second frame, which can isolate the fan structure from other components (such as cables) in the computing device, reduce the risk of the fan structure rubbing against cables or other foreign objects, and improve the reliability of the fan assembly.

[0007] Furthermore, the fan blades are rotatably connected to the fan body, allowing the blades to drive air from the first air inlet to the first air outlet, thereby enabling the fan assembly to dissipate heat from electronic components (such as processing chips). In addition, the connection between the fan body and the first and second frames reduces the risk of the fan body wobbling or even shifting relative to the first and second frames, improving the reliability of the fan assembly.

[0008] Understandably, the waveguide plate can be embedded in the first air inlet along the first direction, allowing the fan structure to drive air through the waveguide plate and flow to the first air outlet. This straightens the turbulent airflow, reducing disturbances in the airflow on the intake side of the fan assembly. This reduces the impact of airflow disturbances on electronic devices (e.g., hard disk drives), improving the read / write speed and accuracy of the hard disk drive, and ultimately enhancing the speed and accuracy of data processing in computing devices. Furthermore, the waveguide plate also helps to uniformly distribute airflow, thereby reducing noise from the fan assembly.

[0009] Furthermore, the waveguide plate can be embedded in the first air inlet along the first direction, allowing it to be integrated with the first frame, eliminating the need to externally mount the waveguide plate on the side of the fan frame (e.g., the first frame) away from the fan structure. In other words, by embedding the waveguide plate in the first air inlet along the first direction, there can be spatial overlap between the waveguide plate and the first panel, reducing the space occupied by the waveguide plate along the first direction. This reduces the thickness of the fan assembly along the first direction, decreases the volume of the fan assembly, and improves the space utilization within the computing device.

[0010] In addition, the waveguide plate can be embedded in the first air inlet without the need for edge banding or other treatments, which reduces the cost of the waveguide plate and thus the cost of the fan assembly.

[0011] Furthermore, the waveguide plate can be embedded in the first air inlet, so that one fan structure can correspond to one waveguide plate, reducing the length of the waveguide plate along the second direction (the direction intersecting with the first direction) and improving the ease of installation of the waveguide plate.

[0012] In some embodiments, the fan assembly further includes a limiting plate located between the waveguide plate and the fan body. The limiting plate is connected to the first frame to restrict the displacement of the waveguide plate towards the fan body. This arrangement allows the limiting plate to restrict the displacement of the waveguide plate towards the fan body, reducing the risk of the waveguide plate moving towards the fan body and detaching from the first air inlet, thus improving the reliability of the fan assembly. Furthermore, the limiting plate between the waveguide plate and the fan body isolates the waveguide plate from the fan blades, protecting the waveguide plate and reducing the risk of scratches caused by the fan blades rotating, further improving the reliability of the fan assembly.

[0013] In some embodiments, the limiting plate has a second air inlet, which is connected to the first air inlet. This arrangement allows air to flow to the first air outlet via the first and second air inlets under the drive of the fan blades, reducing the impact of the limiting plate on airflow and increasing the air intake volume of the fan assembly.

[0014] In some embodiments, the first panel further has a first connecting hole, and the fan body has a second connecting hole. The fan assembly also includes a first shock-absorbing connector. The first shock-absorbing connector includes a first connecting portion, a second connecting portion, and a first buffer portion. One end of the first buffer portion is connected to the end of the first connecting portion, and the other end of the first buffer portion is connected to the end of the second connecting portion. The first connecting portion is used to fit into the first connecting hole, and the second connecting portion is used to fit into the second connecting hole. The first buffer portion is located between the first panel and the fan body along a first direction, so that there is a first gap between the first panel and the fan body along the first direction, and at least a portion of the limiting plate is located within the first gap. This arrangement allows the fan body and the first frame to be connected through the first shock-absorbing connector, improving the ease of connection between the fan body and the first frame. Furthermore, when the first connecting part is embedded in the first connecting hole and the second connecting part is embedded in the second connecting hole, the first buffer part can be located between the first panel and the fan body (e.g., the fan housing of the fan body) along the first direction. This allows the first buffer part to absorb and buffer the vibration of the fan housing, thus enabling the first shock-absorbing connector to perform shock absorption, reducing the impact of the fan housing vibration on the first frame, and consequently reducing the impact of the fan blade rotation on the hard disk drive, thereby improving the read / write speed and accuracy of the hard disk drive. In addition, at least a portion of the limiting plate can be located within the first gap, meaning that at least a portion of the limiting plate can have a spatial overlap with the first buffer part in the first direction. This reduces the space occupied by the limiting plate along the first direction, thereby reducing the thickness of the fan assembly along the first direction, reducing the volume of the fan assembly, and improving the space utilization within the computing device.

[0015] In some embodiments, the first panel includes a folded edge structure that bends and extends away from the limiting plate to enclose a first air inlet. The outer periphery of the waveguide plate abuts against the inner periphery of the folded edge structure to be embedded in the first air inlet. This arrangement allows the folded edge structure to accommodate the waveguide plate, thus protecting it and reducing the risk of damage caused by the waveguide plate being scratched by cables or other foreign objects inside the computing device, thereby improving the reliability of the fan assembly.

[0016] In some embodiments, the fan assembly further includes a first air inlet grille. The first air inlet grille is located on the side of the waveguide plate away from the limiting plate and is connected to the folded edge structure to limit the displacement of the waveguide plate away from the fan body. This configuration allows the first air inlet grille to limit the displacement of the waveguide plate away from the fan body, reducing the risk of the waveguide plate moving away from the fan body and detaching from the first air inlet, thus improving the reliability of the fan assembly. Furthermore, the first air inlet grille also isolates the waveguide plate from other components (e.g., cables) within the computing device, protecting the waveguide plate and reducing the risk of damage caused by cables or other foreign objects, thereby extending the waveguide plate's lifespan.

[0017] In some embodiments, the fan assembly further includes an exhaust grille connected to the edge of the first air outlet. This arrangement allows the exhaust grille to isolate the fan structure from other components (e.g., cables) within the computing device, reducing the risk of the fan structure rubbing against cables or other foreign objects and improving the reliability of the fan assembly.

[0018] In some embodiments, the surface of the waveguide plate near the limiting plate is flush with the surface of the first panel near the limiting plate; and / or, the surface of the waveguide plate away from the limiting plate is flush with the surface of the first panel away from the limiting plate. This arrangement improves the neatness of the waveguide plate embedded in the first air inlet, facilitates the connection between the limiting plate and the first frame, and enhances the ease of installation of the fan assembly. Furthermore, it facilitates the connection between the first air inlet grille and the end of the folded edge structure away from the limiting plate, improving the processing ease of the first frame.

[0019] In some embodiments, the fan assembly further includes a fan frame base, which encloses a fan frame receiving cavity. A first frame and a second frame are both located within the fan frame receiving cavity, and at least one of the first and second frames is detachably connected to the fan frame base. The fan frame base includes a base panel with a third air inlet communicating with a first air inlet. A folded edge structure is embedded within the third air inlet. Understandably, the arrangement of the first and second frames within the fan frame receiving cavity allows the fan frame base to protect the first frame, the second frame, and the fan structure located within the fan receiving cavity. Furthermore, the detachable connection between the fan frame base and at least one of the first and second frames facilitates maintenance and replacement of the fan assembly, improving its ease of use. By providing a third air inlet on the base panel, and ensuring its communication with the first air inlet, air can flow through both the third and first air inlets to the first air outlet, reducing the obstruction of airflow by the base panel and increasing the air intake of the fan assembly. The folded edge structure can be embedded in the third air inlet. In this way, there can be a spatial overlap between the folded edge structure and the base panel in the first direction, which reduces the space occupied by the base panel in the first direction, thereby reducing the thickness of the fan assembly in the first direction, reducing the volume of the fan assembly, and improving the space utilization rate inside the computing device.

[0020] In some embodiments, the fan frame base includes a base side plate with a first groove, and at least a portion of the edge of the first panel is embedded in the first groove. This configuration allows the first frame to snap onto the fan frame base, improving the reliability of the connection between the first frame and the fan frame base.

[0021] In some embodiments, the first frame further includes a hot-melt column located on the side of the first panel near the limiting plate and connected to the first panel. A limiting hole is formed on the limiting plate, through which the hot-melt column passes. After the end of the hot-melt column away from the first panel is hot-melted and solidified, it engages with the limiting hole to restrict the displacement of the limiting plate. This arrangement allows the hot-melt column to engage with the limiting hole, thereby limiting the displacement of the limiting plate, reducing the risk of the limiting plate shifting or even detaching relative to the first panel, and improving the reliability of the fan assembly. Furthermore, using the method of hot-melting and solidifying the end of the hot-melt column away from the first panel to engage with the limiting hole to restrict the displacement of the limiting plate eliminates the need for complex mechanical structures, simplifying the structure of the first frame and reducing its cost.

[0022] In some embodiments, the limiting plate is snapped into the first frame. This configuration enables tool-free installation between the limiting plate and the first frame, thereby improving the ease of installation.

[0023] In some embodiments, the first frame further includes a first side plate and a second side plate. The first side plate and the second side plate are located on the same side of the first panel and are disposed opposite to each other. The first side plate is connected to one side edge of the first panel, and the second side plate is connected to one side edge of the first panel away from the first side plate. The first side plate includes a first snap-fit ​​portion, and the limiting plate includes a second snap-fit ​​portion for snapping with the first snap-fit ​​portion. And / or, the second side plate includes a third snap-fit ​​portion, and the limiting plate includes a fourth snap-fit ​​portion for snapping with the third snap-fit ​​portion. This arrangement allows the limiting plate to be connected to the first frame by snap-fit, improving the ease of connection between the limiting plate and the first frame.

[0024] In some embodiments, the number of fan structures is at least two, and the at least two fan structures are arranged along a second direction. The second direction intersects with the first direction. Setting the number of fan structures to at least two can increase the airflow of the fan assembly, thereby improving the heat dissipation effect of the fan assembly on the processing chip. Furthermore, arranging at least two fan structures along the second direction can reduce the space occupied by the fan assembly along the first direction and enable the fan assembly to dissipate heat from the processing chip at different locations, thus improving the heat dissipation performance of the fan assembly.

[0025] In some embodiments, the waveguide plate has multiple waveguide holes that extend along a first direction. This arrangement allows air to pass through the waveguide holes along the first direction under the drive of the fan structure, thereby straightening out turbulent airflow, reducing the impact of airflow disturbance on the hard drive, and improving the read / write speed and accuracy of the hard drive. Furthermore, the waveguide holes also help to uniformly distribute airflow, thus reducing the noise of the fan assembly.

[0026] On the other hand, embodiments of this application provide a computing device. The computing device includes electronic components and a fan assembly as described above, with the electronic components located on the air intake side of the fan assembly.

[0027] The computing device provided in the embodiments of this application includes the fan assembly as described above, and therefore has all the aforementioned beneficial effects, which will not be repeated here.

[0028] Understandably, placing the electronic components on the air intake side of the fan assembly can reduce the distance between the fan assembly and the processing chip located on the air exhaust side of the fan assembly, thereby improving the heat dissipation effect of the fan assembly on the processing chip.

[0029] In some embodiments, the electronic device includes a hard disk drive (HDD). This configuration reduces the impact of airflow disturbances on the HDD, improves its read / write speed and accuracy, and consequently enhances the speed and accuracy of data processing by the computing device. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in some embodiments of this application will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this application.

[0031] Figure 1 Structural diagrams of computing devices provided in some embodiments of this application;

[0032] Figure 2A Structural diagrams of waveguide plates provided in some embodiments of this application;

[0033] Figure 2B This application provides a diagram showing the positional relationship between the waveguide plate and the fan frame in some embodiments.

[0034] Figure 2C This application provides a diagram showing the positional relationship between the waveguide plate and the fan frame base in some embodiments.

[0035] Figure 3A Structural diagrams of fan assemblies provided in some embodiments of this application;

[0036] Figure 3B for Figure 3A Exploded view of the central fan assembly;

[0037] Figure 4A A structural diagram of the first frame provided in some embodiments of this application at a first angle;

[0038] Figure 4B Structural diagram of the first frame provided in some embodiments of this application at a second angle;

[0039] Figure 4C Structural diagrams of the second frame provided in some embodiments of this application;

[0040] Figure 5 Structural diagrams of fan structures provided in some embodiments of this application;

[0041] Figure 6 Structural diagram of the first shock-absorbing connector provided in some embodiments of this application;

[0042] Figure 7A A diagram showing the positional relationship between the waveguide plate and the first air inlet provided in some embodiments of this application;

[0043] Figure 7BA diagram showing the positional relationship between the waveguide plate and the first air inlet provided in other embodiments of this application;

[0044] Figure 7C A diagram showing the positional relationship between the waveguide plate and the first air inlet provided in some embodiments of this application;

[0045] Figure 8A This is a structural diagram of the fan frame base provided in some embodiments of this application;

[0046] Figure 8B A diagram showing the positional relationship between the fan frame assembly and the first and second frames provided in some embodiments of this application;

[0047] Figure 8C for Figure 3A Cross-sectional view along the AA direction;

[0048] Figure 8D for Figure 8C A magnified view of a portion of region P in the middle;

[0049] Figure 9 This is a structural diagram of a limiting plate provided in some embodiments of this application. Detailed Implementation

[0050] The technical solutions in some embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application are within the scope of protection of this application.

[0051] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this application. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0052] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0053] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0054] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0055] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0056] Figure 1 This is a structural diagram of a computing device provided for some embodiments of this application.

[0057] like Figure 1 As shown, in some examples, embodiments of this application provide a computing device 200. It is understood that the computing device 200 can be an electronic device with processing, computing, and communication functions. In some examples, the computing device 200 can be a server, switch, computer, or repeater, etc. Embodiments of this application do not further limit the type of computing device 200.

[0058] In some examples, such as Figure 1As shown, computing device 200 may include a housing 201, a motherboard (not shown), and multiple electronic components 210. For example, the housing 201 may enclose a receiving space, within which the motherboard and multiple electronic components 210 may be located. In some examples, the motherboard may include a printed circuit board (PCB), and the multiple electronic components 210 may be electrically connected to the printed circuit board.

[0059] In some examples, such as Figure 1 As shown, the multiple electronic components 210 may include electronic devices 202, memory modules 203, and processing chips 204. In some examples, the multiple electronic components 210 may also include circuit boards, etc. (not shown in the figure).

[0060] For example, electronic device 202 may include hard disks, such as hard disk drives (HDD), solid state drives (SSD), and hybrid hard drives (HHD).

[0061] Understandably, the hard drive and memory module 203 can be used to store data, and the processing chip 204 can be used to process and perform calculations on the data. In some examples, the processing chip 204 may include a central processing unit (CPU) or a graphics processing unit (GPU), etc.

[0062] Understandably, the electronic device 202 and the memory module 203 can be electrically connected to the processing chip 204 via the motherboard, so that data can be transmitted not only between the electronic device 202 and the processing chip 204, but also between the memory module 203 and the processing chip 204.

[0063] In some examples, such as Figure 1 As shown, the number of processing chips 204 can be two, and the two processing chips 204 can be arranged at intervals along the second direction X. The number of memory modules 203 can be multiple, and the multiple memory modules 203 can be spaced apart and located on both sides of the processing chips 204 along the second direction X. The number of electronic devices 202 can be one or more. For example, as shown... Figure 1 As shown, the electronic device 202 can be located on one side of the processing chip 204 and the memory module 203 along the first direction Y.

[0064] For example, the second direction X can intersect the first direction Y. In some examples, the second direction X can be perpendicular or approximately perpendicular to the first direction Y.

[0065] Understandably, the processing chip 204 generates a significant amount of heat during operation. To dissipate heat from the processing chip 204 and reduce the risk of it malfunctioning due to overheating, in some examples, such as... Figure 1 As shown, the computing device 200 may also include a fan assembly 100.

[0066] Understandably, the fan assembly 100 can drive airflow. In some examples, the fan assembly 100 may include a fan housing and a fan structure, the fan housing enclosing a fan receiving cavity, and the fan structure being installed within the fan receiving cavity, so that the fan housing can protect the fan structure.

[0067] In some examples, the fan structure may include a fan body and fan blades, the fan blades being rotatably connected to the fan body to drive air to flow from the inlet side of the fan assembly 100 to the outlet side of the fan assembly 100.

[0068] For example, the air inlet side and air outlet side of the fan assembly 100 can be arranged opposite each other along the first direction Y. The processing chip 204 can be located on the air outlet side of the fan assembly 100, so that the fan blades can drive the air to flow towards the processing chip 204, thereby carrying away the heat dissipated by the processing chip 204, realizing heat dissipation of the processing chip 204, reducing the risk that the processing chip 204 will not work properly due to excessive temperature, and improving the operational reliability of the processing chip 204.

[0069] In some examples, the fan body may include a fan housing and a motor. The motor may be located inside the fan housing, and the fan blades may be located inside the fan housing and connected to the motor shaft, allowing the fan blades to be rotatably connected to the fan body. Understandably, when the motor shaft rotates, it drives the fan blades to rotate, enabling the fan blades to drive airflow, thus converting electrical energy into mechanical energy and then into wind energy, thereby achieving heat dissipation for the processing chip 204.

[0070] In some examples, there may be multiple fan assemblies 100, which may be arranged at intervals along the second direction X to improve the heat dissipation effect on the processing chip 204. It is understood that the embodiments of this application do not further limit the number of fan assemblies 100.

[0071] In some examples, the housing 201 of the computing device 200 may have ventilation holes (not shown in the figure). Air from outside the computing device 200 can flow into the housing space enclosed by the housing 201 through the ventilation holes under the drive of the fan assembly 100. Air in the housing space can flow out of the computing device 200 through the ventilation holes under the drive of the fan assembly 100, thereby achieving heat dissipation for the processing chip 204.

[0072] In some examples, computing device 200 may also include heat sink fins (not shown). The heat dissipated by processing chip 204 can be transferred to the heat sink fins, which can exchange heat with the air, improving the heat dissipation efficiency of processing chip 204 and reducing the risk that processing chip 204 will not function properly due to overheating.

[0073] As can be seen from the above, if Figure 1 As shown, the electronic device 202 can be located on one side of the processing chip 204 along the first direction Y. In some examples, such as Figure 1 As shown, the electronic device 202 can be located along the first direction Y on the side of the fan assembly 100 away from the processing chip 204. That is, along the first direction Y, the processing chip 204 and the electronic device 202 can be located on opposite sides of the fan assembly 100. Understandably, since the processing chip 204 needs to be located on the exhaust side of the fan assembly 100, in some examples, the electronic device 202 can be located on the intake side of the fan assembly 100.

[0074] Understandably, placing the electronic device 202 on the air intake side of the fan assembly 100 can reduce the distance between the processing chip 204 located on the air outlet side of the fan assembly 100 and the fan assembly 100, improve the heat dissipation effect of the fan assembly 100 on the processing chip 204, reduce the risk that the processing chip 204 will not work properly due to excessive temperature, and improve the operational reliability of the computing device 200.

[0075] In other examples, the processing chip 204 and the electronic device 202 may also be located on the same side of the fan assembly 100 along the first direction Y. That is, along the first direction Y, the processing chip 204 and the electronic device 202 may both be located on the air outlet side of the fan assembly 100.

[0076] Understandably, by placing both the processing chip 204 and the electronic device 202 on the exhaust side of the fan assembly 100, the fan assembly 100 can not only dissipate heat from the processing chip 204, but also from the electronic device 202, thereby reducing the risk that the electronic device 202 may malfunction due to overheating and improving the operational reliability of the computing device 200.

[0077] The embodiments of this application take the example of the processing chip 204 being located on the air outlet side of the fan assembly 100, the electronic device 202 being a hard disk drive, and the hard disk drive being located on the air inlet side of the fan assembly 100, and will be further illustrated by examples.

[0078] In some examples, a hard disk drive (HDD) may include read / write heads and platters; for instance, the number of platters may be one or more. For instance, a platter may include a substrate, the material of which may include aluminum or glass, and a ferromagnetic material may be coated on the substrate to form the platter. The read / write head contacts the platter, and the platter can rotate relative to the read / write head to achieve functions such as data reading and storage.

[0079] Understandably, when the computing device 200 is working, the disk will be spinning at high speed. At this time, if the hard drive is subjected to vibration or other interference, causing the read / write head to vibrate or even shift relative to the disk, it will affect the read / write speed of the hard drive, and may even lead to read / write errors.

[0080] Understandably, since the hard disk drive (HDD) can be located on the intake side of the fan assembly 100, the disturbance of the airflow when the fan assembly 100 drives the air to flow from the intake side to the exhaust side will affect the HDD's read / write head, causing the head to vibrate or even shift relative to the platter. This results in a decrease in the HDD's Input / Output Operations Per Second (IOPS), leading to a decrease in the HDD's read / write speed and increasing the risk of read / write errors. This affects the HDD's read / write performance and consequently the speed and accuracy of the computing device 200 in processing data.

[0081] However, as the power consumption of the processing chip 204 continues to increase, the fan blades of the fan assembly 100 need to rotate at high speed to meet the heat dissipation requirements of the processing chip 204. Understandably, the higher the fan blade speed, the greater the airflow vibration frequency (i.e., the disturbance of the airflow) on the intake side of the fan assembly 100, the greater the adverse effect on the hard drive, and the lower the read and write performance of the hard drive.

[0082] Figure 2A The diagram shows the structure of a waveguide plate provided in some embodiments of this application. Figure 2B This is a diagram showing the positional relationship between the waveguide plate and the fan frame provided in some embodiments of this application. Figure 2C This diagram illustrates the positional relationship between the waveguide plate and the fan frame base in some embodiments of this application.

[0083] In some examples, such as Figure 2AAs shown, the fan assembly 100 may include a waveguide plate 140. It is understood that the waveguide plate 140 may be a square plate structure, a hexagonal plate structure, an octagonal plate structure, or other irregularly shaped plate structures. It is understood that the embodiments of this application do not further limit the shape of the waveguide plate 140.

[0084] In some examples, such as Figure 2A As shown, the waveguide plate 140 may have multiple waveguide holes 141, which can extend along a first direction Y. For example, the first direction Y can be the thickness direction of the waveguide plate 140, that is, the waveguide holes 141 can extend along the thickness direction of the waveguide plate 140.

[0085] In some examples, such as Figure 2A As shown, waveguide aperture 141 can be a honeycomb-like (hexagonal or approximately hexagonal) aperture structure. In other examples, waveguide aperture 141 can also be a square, circular, or other irregularly shaped aperture structure. Understandably, multiple waveguide apertures 141 can have the same or different shapes.

[0086] Understandably, since the air inlet side and air outlet side of the fan assembly 100 can be arranged opposite each other along the first direction Y, and the fan blades can drive air to flow from the air inlet side to the air outlet side of the fan assembly 100, that is, the fan blades can drive air to flow along the first direction Y. In this way, the waveguide hole 141 is provided to pass through along the first direction Y, so that air can pass through the waveguide hole 141 under the drive of the fan blades.

[0087] Understandably, the waveguide aperture 141 can straighten out turbulent airflow. By placing the waveguide plate 140 between the fan structure and the hard disk drive (HDD), the impact of airflow disturbance on the HDD can be reduced, improving the HDD's read / write speed and accuracy, thereby enhancing the speed and accuracy of data processing by the computing device 200. Furthermore, the waveguide aperture 141 also helps to uniformly distribute airflow, thus reducing the noise of the fan assembly 100.

[0088] In some examples, a perforated thin-walled metal material can be bonded or welded to form the waveguide plate 140. In other examples, multiple waveguide holes 141 can be formed on a metal plate to form the waveguide plate 140.

[0089] The following reference Figure 2B and Figure 2C The placement of waveguide plate 140 is illustrated with an example.

[0090] As can be seen from the above, if Figure 2BAs shown, the fan assembly 100 may include a fan housing 170, and the fan structure 130 may be mounted within a receiving cavity enclosed by the fan housing 170. In some implementations, such as Figure 2B As shown, the waveguide plate 140 can be located on the side of the fan housing 170 away from the fan structure 130.

[0091] For example, such as Figure 2B As shown, the waveguide plate 140 can be edged, and a buckle can be provided at the edge. A slot is provided on the fan frame 170 at the position corresponding to the buckle, so that the waveguide plate 140 can be externally attached to the side of the fan frame 170 away from the fan structure 130 by snap-fit.

[0092] However, mounting the waveguide plate 140 externally onto the fan housing 170 increases the thickness of the fan assembly 100 along the first direction Y, reducing the space utilization within the computing device 200 and affecting its high-density characteristics. Furthermore, edge-wrapping the waveguide plate 140 increases its cost, thereby increasing the cost of the fan assembly 100.

[0093] And, as Figure 2B As shown, when there are multiple fan structures 130, multiple fan structures 130 share a single waveguide plate 140, resulting in a longer waveguide plate 140 and reducing the ease of installation of the waveguide plate 140.

[0094] In other implementations, such as Figure 2C As shown, the fan assembly 100 may also include a fan frame base 180. For example, the fan frame base 180 may enclose a fan frame receiving cavity, and the fan frame 170 and the fan structure 130 located within the fan frame 170 may both be located within the fan frame receiving cavity.

[0095] For example, such as Figure 2C As shown, the fan frame base 180 may include a rear base frame 187 and a front base frame 188. The rear base frame 187 may have a waveguide plate receiving groove, and the waveguide plate 140 may be embedded in the waveguide plate receiving groove. The front base frame 188 may be snapped onto the rear base frame 187, thereby limiting the position of the waveguide plate 140.

[0096] However, the above implementation is still equivalent to attaching the waveguide plate 140 to one side of the fan frame 170, which will increase the thickness of the fan assembly 100 along the first direction Y, reduce the space utilization rate inside the computing device 200, and affect the high-density characteristics of the computing device 200.

[0097] Figure 3A This is a structural diagram of a fan assembly provided in some embodiments of this application. Figure 3B for Figure 3AExploded view of the fan assembly.

[0098] In order to reduce the thickness of the fan assembly 100 along the first direction Y, thereby reducing the space occupied by the fan assembly 100 and improving the space utilization within the computing device 200, some embodiments of this application provide a fan assembly 100. The fan assembly 100 provided in the embodiments of this application will be illustrated below.

[0099] In some examples, the fan assembly 100 may include a fan housing 170, a fan structure 130, and a waveguide plate 140 that can be mounted within a fan housing cavity enclosed by the fan housing 170.

[0100] In some examples, such as Figure 3A and Figure 3B As shown, the fan housing 170 may include a first housing 110 and a second housing 120. That is, in some examples, such as... Figure 3A and Figure 3B As shown, the fan assembly 100 may include a first frame 110, a second frame 120, a fan structure 130, and a waveguide plate 140. For example, the first frame 110 may be connected to the second frame 120 to enclose a fan housing cavity, and the fan structure 130 may be installed inside the fan housing cavity.

[0101] Understandably, installing the fan structure 130 within the fan housing cavity enclosed by the first frame 110 and the second frame 120 can isolate the fan structure 130 from other components (such as cables) within the computing device 200, reducing the risk of the fan structure 130 rubbing against cables or other foreign objects and improving the reliability of the fan assembly 100.

[0102] Figure 4A This is a structural diagram of the first frame provided in some embodiments of this application at a first angle. Figure 4B This is a structural diagram of the first frame provided in some embodiments of this application at a second angle. Figure 4C This is a structural diagram of the second frame provided in some embodiments of this application. Referring below... Figures 4A to 4C The structure of the first frame 110 and the second frame 120 will be illustrated with examples.

[0103] In some examples, such as Figure 4A and Figure 4BAs shown, the first frame 110 may include a first panel 111, a first side panel 116, and a second side panel 117. The first side panel 116 and the second side panel 117 may be located on the same side of the first panel 111, and the first side panel 116 and the second side panel 117 may be arranged opposite to each other. The first side panel 116 may be connected to one side edge of the first panel 111, and the second side panel 117 may be connected to one side edge of the first panel 111 away from the first side panel 116. The first panel 111 may have a first air inlet 112.

[0104] Understandably, such as Figure 4A and Figure 4B As shown, since the first side plate 116 and the second side plate 117 can be located on the same side of the first panel 111 and are arranged opposite to each other, the first side plate 116 can be connected to one side edge of the first panel 111, and the second side plate 117 can be connected to one side edge of the first panel 111 away from the first side plate 116.

[0105] In some examples, the first panel 111, the first side panel 116, and the second side panel 117 can be an integrally formed structure to improve the reliability of the connection between the first panel 111 and the first side panel 116 and the second side panel 117.

[0106] In some examples, the first air inlet 112 can extend along a first direction Y, for example, the first direction Y can be the thickness direction of the first panel 111.

[0107] In some examples, the first air inlet 112 can be square, hexagonal, octagonal, or other irregular shapes.

[0108] In some examples, such as Figure 4A and Figure 4B As shown, the first frame 110 may also include a first air inlet grille 118, which may be connected to the edge of the first air inlet 112.

[0109] Understandably, the first air intake grille 118 can isolate the fan structure 130 from other components (such as cables) within the computing device 200, reducing the risk of the fan structure 130 rubbing against cables or other foreign objects and improving the reliability of the fan assembly 100.

[0110] In some examples, such as Figure 4A and Figure 4B As shown, the first panel 111 may include a folded edge structure 114, which may be bent and extended in a direction away from the fan structure 130 to enclose a first air inlet 112. In some examples, the folded edge structure 114 may be bent and extended in a first direction Y away from the fan structure 130.

[0111] In some examples, the first air intake grille 118 may be connected to the folded edge structure 114.

[0112] In some examples, such as Figure 4A and Figure 4B As shown, the first side plate 116 and the second side plate 117 may be provided with clearance holes 119 to avoid the electronic components 210 on the computing device 200, reduce the spatial interference between the fan assembly 100 and the electronic components 210, and improve the space utilization rate inside the computing device 200.

[0113] In some examples, such as Figure 4C As shown, the second frame 120 may include a second panel 121, a third side panel 125, and a fourth side panel 126. The third side panel 125 and the fourth side panel 126 may be located on the same side of the second panel 121, and may be arranged opposite to each other. The third side panel 125 may be connected to one edge of the second panel 121, and the fourth side panel 126 may be connected to one edge of the second panel 121 away from the third side panel 125. The second panel 121 may have a first air outlet 122.

[0114] Understandably, such as Figure 4C As shown, since the third side panel 125 and the fourth side panel 126 can be located on the same side of the second panel 121 and are arranged opposite each other, the third side panel 125 can be connected to one side edge of the second panel 121, and the fourth side panel 126 can be connected to one side edge of the second panel 121 away from the third side panel 125.

[0115] In some examples, the second panel 121, the third side panel 125, and the fourth side panel 126 can be integrally formed to improve the reliability of the connection between the second panel 121 and the third side panel 125 and the fourth side panel 126.

[0116] In some examples, the first air outlet 122 can extend along the first direction Y, for example, the first direction Y can be the thickness direction of the first panel 111. Understandably, since both the first air inlet 112 and the first air outlet 122 can extend along the first direction Y, the fan assembly 100 can drive air to flow along the first direction Y, thereby achieving heat dissipation for the processing chip 204.

[0117] In some examples, the first air outlet 122 can be square, hexagonal, octagonal, or other irregular shapes. Understandably, the first air inlet 112 and the first air outlet 122 can have the same or different shapes.

[0118] In some examples, such as Figure 4CAs shown, the fan assembly 100 may also include an air outlet grille 127, which may be connected to the edge of the first air outlet 122.

[0119] Understandably, the exhaust grille 127 can isolate the fan structure 130 from other components (such as cables) within the computing device 200, reducing the risk of the fan structure 130 rubbing against cables or other foreign objects and improving the reliability of the fan assembly 100.

[0120] In some examples, the first frame 110 and the second frame 120 can be connected by a snap-fit ​​mechanism to enclose a fan housing cavity. The following provides an example illustrating the snap-fit ​​mechanism between the first frame 110 and the second frame 120.

[0121] In some examples, such as Figure 4A and Figure 4B As shown, the first side plate 116 may include a first side plate connecting portion 116a, and the second side plate 117 may include a second side plate connecting portion 117a. Figure 4C As shown, the third side plate 125 may include a third side plate connecting portion 125a, and the fourth side plate 126 may include a fourth side plate connecting portion 126a.

[0122] For example, the first side panel connecting part 116a can be snapped into the third side panel connecting part 125a, and the second side panel connecting part 117a can be snapped into the fourth side panel connecting part 126a, so that the first frame 110 and the second frame 120 can be connected by snapping to form a fan housing cavity.

[0123] In some examples, such as Figure 4A and Figure 4B As shown, the first side panel connecting part 116a can be a snap fastener, such as... Figure 4C As shown, the third side panel connecting portion 125a can be a slot. In other examples, the first side panel connecting portion 116a can be a slot, and the third side panel connecting portion 125a can be a snap fastener.

[0124] In some examples, such as Figure 4A and Figure 4B As shown, the second side panel connecting part 117a can be a snap-fit, such as... Figure 4C As shown, the fourth side panel connecting portion 126a can be a slot. In other examples, the second side panel connecting portion 117a can be a slot, and the fourth side panel connecting portion 126a can be a snap fastener.

[0125] In some examples, such as Figure 4A and Figure 4BAs shown, there can be two first side plate connecting portions 116a, and the two first side plate connecting portions 116a can be spaced apart along the edge of the first side plate 116. It can be understood that, as Figure 4C As shown, the number of third side plate connecting parts 125a can be the same as the number of first side plate connecting parts 116a, and the setting position of the third side plate connecting parts 125a can correspond to the setting position of the first side plate connecting parts 116a.

[0126] In some examples, such as Figure 4A and Figure 4B As shown, the number of second side plate connecting portions 117a can also be two, and the two second side plate connecting portions 117a can be spaced apart along the edge of the second side plate 117. It can be understood that, as Figure 4C As shown, the number of fourth side plate connecting portions 126a can be the same as the number of second side plate connecting portions 117a, and the location of the fourth side plate connecting portions 126a can correspond to the location of the second side plate connecting portions 117a.

[0127] Understandably, by connecting the first frame 110 and the second frame 120 through a snap-fit ​​mechanism to enclose the fan housing cavity, the connection between the first frame 110 and the second frame 120 can be made more convenient, enabling tool-free installation of the first frame 110 and the second frame 120, thus improving the ease of installation of the fan assembly 100.

[0128] In some examples, the first side plate 116 and the second side plate 117 may have the same length along the first direction Y; the third side plate 125 and the fourth side plate 126 may also have the same length along the first direction Y, in order to improve the structural regularity of the first frame 110 and the second frame 120.

[0129] In other examples, the lengths of the first side panel 116 and the second side panel 117 along the first direction Y may be different; the lengths of the third side panel 125 and the fourth side panel 126 along the first direction Y may also be different, thereby improving the flexibility of use of the first frame 110 and the second frame 120.

[0130] Understandably, adjusting the lengths of the first side plate 116 and the second side plate 117 along the first direction Y, and / or adjusting the lengths of the third side plate 125 and the fourth side plate 126 along the first direction Y, can adjust the length of the fan housing cavity along the first direction Y, so that the fan housing cavity can accommodate different types of fan structures 130, improving the compatibility of the fan housing cavity and thus improving the applicability of the fan assembly 100.

[0131] For example, the fan housing cavity can accommodate fan structures 130 of various models, such as 8038 (i.e., the length of the fan body 131 along the first direction Y is 38cm, unit: centimeters), 8056 (i.e., the length of the fan body 131 along the first direction Y is 56cm), and 8080 (i.e., the length of the fan body 131 along the first direction Y is 80cm), to meet different usage needs.

[0132] In some examples, the number of fan structures 130 can be at least two, and at least two fan structures 130 can be arranged along the second direction X.

[0133] Understandably, setting at least two fan structures 130 can increase the airflow of the fan assembly 100, thereby improving the heat dissipation effect of the fan assembly 100 on the processing chip 204. Furthermore, arranging at least two fan structures 130 along the second direction X can reduce the space occupied by the fan assembly 100 along the first direction Y, and enable the fan assembly 100 to dissipate heat from the processing chip 204 at different locations, thus improving the heat dissipation performance of the fan assembly 100.

[0134] In some examples, the number of first frames 110 and second frames 120 may be the same as the number of fan structures 130, and a fan structure 130 may be located within a fan housing cavity enclosed by a first frame 110 and a second frame 120.

[0135] Figure 5 This is a structural diagram of a fan structure provided in some embodiments of this application. Figure 6 This is a structural diagram of a first shock-absorbing connector provided in some embodiments of this application.

[0136] In some examples, such as Figure 5 As shown, the fan structure 130 may include a fan body 131 and fan blades (not shown in the figure), the fan blades being rotatably connected to the fan body 131. Understandably, since the fan structure 130 can be installed within the fan housing cavity enclosed by the first frame 110 and the second frame 120, the fan blades can drive air to flow through the first air inlet 112 to the first air outlet 122, thereby enabling the fan assembly 100 to dissipate heat from the processing chip 204.

[0137] In some examples, the fan body 131 may include a fan housing 131a and a motor (not shown in the figure), the motor may be located inside the fan housing 131a, the fan blades may also be located inside the fan housing 131a, and the fan blades may be connected to the motor shaft so that the fan blades can be rotatably connected to the fan body 131.

[0138] In some examples, the fan body 131 can be connected to the first frame 110 and the second frame 120, so that the fan structure 130 can be installed in the fan housing cavity enclosed by the first frame 110 and the second frame 120, reducing the risk of the fan body 131 shaking or even shifting relative to the first frame 110 and the second frame 120, and improving the reliability of the fan assembly 100.

[0139] Since the fan body 131 may include a fan housing 131a, in some examples, the fan housing 131a may be connected to the first frame 110 and the second frame 120. The connection method between the fan housing 131a and the first frame 110 and the second frame 120 is illustrated below.

[0140] In some examples, such as Figure 5 As shown, the fan housing 131a may include a first connecting plate 135 and a second connecting plate 136 disposed opposite to each other. The first connecting plate 135 may be connected to the first panel 111, and the second connecting plate 136 may be connected to the second panel 121, so that the fan structure 130 can be installed in the fan housing cavity.

[0141] See again in some examples Figure 4A and Figure 4B The first panel 111 may have a first connecting hole 113. In some examples, the first connecting hole 113 may penetrate the first panel 111 along its thickness (i.e., the first direction Y). For example... Figure 5 As shown, the fan body 131 may have a second connection hole 133. For example, as shown... Figure 5 As shown, the second connecting hole 133 can be opened on the first connecting plate 135 of the fan housing 131a, and the second connecting hole 133 can penetrate the first connecting plate 135 along the thickness direction (that is, the first direction Y).

[0142] For example, the location of the first connecting hole 113 can correspond to the location of the second connecting hole 133. Understandably, the shape of the first connecting hole 113 and the shape of the second connecting hole 133 can be the same or different.

[0143] In some examples, the fan assembly 100 may also include a first damping connector 160.

[0144] In some examples, such as Figure 6As shown, the first shock-absorbing connector 160 may include a first connecting portion 161, a second connecting portion 162, and a first buffer portion 163. One end of the first buffer portion 163 may be connected to the end of the first connecting portion 161, and the other end of the first buffer portion 163 may be connected to the end of the second connecting portion 162. The first connecting portion 161 may be used to be inserted into the first connecting hole 113, and the second connecting portion 162 may be used to be inserted into the second connecting hole 133.

[0145] Understandably, since the first connecting part 161 can be used to embed into the first connecting hole 113, the second connecting part 162 can be used to embed into the second connecting hole 133, and the first buffer part 163 can connect the first connecting part 161 and the second connecting part 162, the first shock-absorbing connector 160 can serve to connect the first connecting plate 135 and the first panel 111. That is, the fan body 131 and the first frame 110 can be connected through the first shock-absorbing connector 160, improving the ease of connection between the fan body 131 and the first frame 110.

[0146] Understandably, when the fan blades of the fan structure 130 rotate, they will cause the fan housing 131a to vibrate. The vibration of the fan housing 131a will be transmitted to the hard disk through the fan frame (e.g., the first frame 110), causing the hard disk's read and write heads to vibrate or even rotate, affecting the read and write performance of the hard disk.

[0147] Therefore, by connecting the fan body 131 to the first frame 110 via the first shock-absorbing connector 160, it can be understood that when the first connecting part 161 is embedded in the first connecting hole 113 and the second connecting part 162 is embedded in the second connecting hole 133, the first buffer part 163 can be located between the first panel 111 and the fan body 131 (e.g., the fan housing 131a of the fan body 131) along the first direction Y, so that there is a first gap between the first panel 111 and the fan body 131 along the first direction Y.

[0148] In this way, the first buffer 163 can absorb and buffer the vibration of the fan housing 131a, that is, the first shock-absorbing connector 160 can play a shock-absorbing role, reducing the impact of the vibration of the fan housing 131a on the first frame 110, that is, reducing the impact of the fan blade rotation on the hard disk, and improving the speed and accuracy of reading and writing data of the hard disk.

[0149] In some examples, the cross-sectional area of ​​the first buffer portion 163 (the cross-sectional area perpendicular to the extension direction of the first shock-absorbing connector 160) can be greater than the cross-sectional area of ​​the first connecting portion 161 and the cross-sectional area of ​​the second connecting portion 162, so as to improve the absorption and buffering effect of the first buffer portion 163 on vibration, reduce the impact of the vibration of the fan housing 131a on the first frame 110, that is, reduce the impact of the fan blade rotation on the hard disk, and improve the speed and accuracy of reading and writing data of the hard disk.

[0150] In some examples, the material of the first damping connector 160 may include rubber or silicone, etc., to improve the damping effect of the first damping connector 160.

[0151] Understandably, the lengths of the first connecting portion 161 and the second connecting portion 162 can be the same or different. In some examples, such as Figure 6 As shown, the length of the first connecting part 161 can be less than the length of the second connecting part 162.

[0152] In some examples, the first connecting hole 113 can be a circular through hole, and the first connecting part 161 can be a cylindrical or near-cylindrical structure, so that the first connecting part 161 can be embedded in the first connecting hole 113.

[0153] In some examples, when the first connection portion 161 is embedded in the first connection hole 113, the side of the first connection portion 161 away from the first buffer portion 163 may be flush with the side of the first panel 111 away from the fan structure 130.

[0154] In some examples, the second connecting hole 133 can be a circular through hole, and the second connecting part 162 can be a cylindrical or near-cylindrical structure, so that the second connecting part 162 can be embedded in the second connecting hole 133.

[0155] In some examples, when the second connecting portion 162 is inserted into the second connecting hole 133, the side of the second connecting portion 162 away from the first buffer portion 163 may be flush with the side of the first connecting plate 135 away from the first panel 111.

[0156] In some examples, such as Figure 4AAs shown, the first panel 111 can be a quadrilateral plate structure, and the number of first connecting holes 113 can be four, with each of the four first connecting holes 113 located near one of the four vertices of the first panel 111. The number of second connecting holes 133 can be the same as the number of first connecting holes 113, and the positions of the second connecting holes 133 can correspond to the positions of the first connecting holes 113. The number of first shock-absorbing connectors 160 can also be four. In this way, the fan body 131 can be connected to the four vertices of the first panel 111 through the first shock-absorbing connectors 160, improving the connection reliability between the fan body 131 and the first frame 110.

[0157] See again in some examples Figure 4C The second panel 121 may have a third connecting hole 124. In some examples, the third connecting hole 124 may penetrate the second panel 121 along its thickness direction (i.e., the first direction Y). For example... Figure 5 As shown, the fan body 131 may have a fourth connection hole 134. For example, as shown... Figure 5 As shown, the fourth connecting hole 134 can be opened on the second connecting plate 136 of the fan housing 131a, and the fourth connecting hole 134 can penetrate the second connecting plate 136 along the thickness direction (that is, the first direction Y).

[0158] For example, the location of the third connecting hole 124 can correspond to the location of the fourth connecting hole 134. Understandably, the shape of the third connecting hole 124 can be the same as or different from the shape of the fourth connecting hole 134.

[0159] In some examples, the fan assembly 100 may also include a second damping connector 190 (see...). Figure 3B ).

[0160] For example, the second damping connector 190 may include a third connecting portion, a fourth connecting portion, and a second buffer portion. One end of the second buffer portion may be connected to the end of the third connecting portion, and the other end of the second buffer portion may be connected to the end of the fourth connecting portion. The third connecting portion may be used to be fitted into a third connecting hole 124, and the fourth connecting portion may be used to be fitted into a fourth connecting hole 134.

[0161] Understandably, since the third connecting part can be used to embed into the third connecting hole 124, the fourth connecting part can be used to embed into the fourth connecting hole 134, and the second buffer part can connect the first connecting part 161 and the second connecting part 162, the second shock-absorbing connector 190 can serve to connect the second connecting plate 136 and the second panel 121. That is, the fan body 131 and the second frame 120 can be connected through the second shock-absorbing connector 190, improving the ease of connection between the fan body 131 and the second frame 120.

[0162] Furthermore, when the third connecting part is embedded in the third connecting hole 124 and the fourth connecting part is embedded in the fourth connecting hole 134, the second buffer part is positioned between the second panel 121 and the fan body 131 (e.g., the fan housing 131a of the fan body 131) along the first direction Y, so that there is a second gap between the second panel 121 and the fan body 131 along the first direction Y.

[0163] In this way, the second buffer section can absorb and buffer the vibration of the fan housing 131a, that is, the second shock-absorbing connector 190 can play a shock-absorbing role, reducing the impact of the vibration of the fan housing 131a on the second frame 120, that is, reducing the impact of the fan blade rotation on the hard disk, and improving the speed and accuracy of reading and writing data of the hard disk.

[0164] In some examples, the cross-sectional area of ​​the second buffer (the cross-sectional area perpendicular to the extension direction of the second shock-absorbing connector 190) can be larger than the cross-sectional areas of the third connector and the fourth connector to improve the absorption and buffering effect of the second buffer on vibration, reduce the impact of the vibration of the fan housing 131a on the second frame 120, that is, reduce the impact of the fan blade rotation on the hard disk, and improve the speed and accuracy of reading and writing data on the hard disk.

[0165] In some examples, the material of the second damping connector 190 may include rubber or silicone, etc., to improve the damping effect of the second damping connector 190. Understandably, the material of the second damping connector 190 may be the same as or different from the material of the first damping connector 160.

[0166] Understandably, the lengths of the third and fourth connecting parts can be the same or different. In some examples, the length of the third connecting part can be less than the length of the fourth connecting part.

[0167] In some examples, the third connecting hole 124 can be a circular through hole, and the third connecting part can be a cylindrical or near-cylindrical structure, so that the third connecting part can be embedded in the third connecting hole 124.

[0168] In some examples, when the third connector is embedded in the third connector hole 124, the side of the third connector away from the second buffer can be flush with the side of the second panel 121 away from the fan structure 130.

[0169] In some examples, the fourth connecting hole 134 can be a circular through hole, and the fourth connecting part can be a cylindrical or near-cylindrical structure, so that the fourth connecting part can be embedded in the fourth connecting hole 134.

[0170] In some examples, when the fourth connecting part is embedded in the fourth connecting hole 134, the side of the fourth connecting part away from the second buffer part can be flush with the side of the second connecting plate 136 away from the second panel 121.

[0171] In some examples, such as Figure 4C As shown, the second panel 121 can be a quadrilateral plate structure, and the number of third connecting holes 124 can be four, with each of the four third connecting holes 124 located near one of the four vertices of the second panel 121. The number of fourth connecting holes 134 can be the same as the number of third connecting holes 124, and the positions of the fourth connecting holes 134 can correspond to the positions of the third connecting holes 124. The number of second shock-absorbing connectors 190 can also be four. In this way, the fan body 131 can be connected to the four vertices of the second panel 121 through the second shock-absorbing connectors 190, improving the connection reliability between the fan body 131 and the second frame 120.

[0172] Figure 7A This is a diagram showing the positional relationship between the waveguide plate and the first air inlet provided in some embodiments of this application. Figure 7B A diagram showing the positional relationship between the waveguide plate and the first air inlet provided for other embodiments of this application. Figure 7C A diagram showing the positional relationship between the waveguide plate and the first air inlet provided in some embodiments of this application.

[0173] As described above, the first panel 111 may have a first air inlet 112, and the first air inlet 112 may extend through along the first direction Y. In some examples, such as Figures 7A to 7C As shown, the waveguide plate 140 can be embedded in the first air inlet 112 along the first direction Y, that is, the waveguide plate 140 can be embedded in the first air inlet 112 along the through direction of the first air inlet 112.

[0174] In some examples, such as Figure 7A and Figure 7B As shown, the waveguide plate 140 can be fully embedded in the first air inlet 112 along the first direction Y. In other examples, such as Figure 7C As shown, the waveguide plate 140 can also be partially embedded in the first air inlet 112 along the first direction Y.

[0175] As can be seen from the above, the first panel 111 may include a folded edge structure 114, the folded edge structure 114 may form a first air inlet 112, and the first air inlet grille 118 may be connected to the folded edge structure 114.

[0176] In some examples, such as Figures 7A to 7C The outer periphery of the waveguide plate 140 can abut against the inner periphery of the folded edge structure 114 to be embedded in the first air inlet 112. For example, the waveguide plate 140 can abut against the first air inlet grille 118.

[0177] In some examples, the thickness of the waveguide plate 140 along the first direction Y can be in the range of 3 mm to 10 mm, so as to avoid the waveguide plate 140 being too thin along the first direction Y (e.g., less than 3 mm), which would affect the effect of the waveguide plate 140 on straightening the airflow; and also to avoid the waveguide plate 140 being too thick along the first direction Y (e.g., greater than 10 mm), which would increase the wind resistance of the waveguide plate 140 and affect the air intake of the fan assembly 100.

[0178] In some examples, the thickness of the waveguide 140 along the first direction Y can be 3.5 mm, 5 mm, 7 mm or 9 mm, etc.

[0179] In some examples, such as Figure 7A As shown, the thickness of the waveguide plate 140 along the first direction Y can be the same as the thickness of the first panel 111 along the first direction Y, so that the waveguide plate 140 can be fully embedded in the first air inlet 112. For example, the surface of the waveguide plate 140 away from the first air inlet grille 118 can be flush with the surface of the first panel 111 away from the first air inlet grille 118.

[0180] In other examples, such as Figure 7B As shown, the thickness of the waveguide plate 140 along the first direction Y can be less than the thickness of the first panel 111 along the first direction Y, so that the waveguide plate 140 can be fully embedded in the first air inlet 112. For example, along the first direction Y, the distance between the surface of the waveguide plate 140 away from the first air inlet grille 118 and the first air inlet grille 118 can be less than the distance between the surface of the first panel 111 away from the first air inlet grille 118 and the first air inlet grille 118.

[0181] In some other examples, such as Figure 7CAs shown, the thickness of the waveguide plate 140 along the first direction Y can be greater than the thickness of the first panel 111 along the first direction Y, so that a portion of the waveguide plate 140 can be embedded in the first air inlet 112. For example, along the first direction Y, the distance between the surface of the waveguide plate 140 away from the first air inlet grille 118 and the first air inlet grille 118 can be greater than the distance between the surface of the first panel 111 away from the first air inlet grille 118 and the first air inlet grille 118. That is, the surface of the waveguide plate 140 away from the first air inlet grille 118 can protrude beyond the surface of the first panel 111 away from the first air inlet grille 118.

[0182] Understandably, the thickness of the first panel 111 along the first direction Y can be the thickness of the first panel 111 at the position of the folded structure 114 along the first direction Y. In some examples, the thickness of the first panel 111 along the first direction Y can be in the range of 2mm to 3mm. For example, the thickness of the first panel 111 along the first direction Y can be 2.2mm, 2.5mm, or 2.8mm, etc.

[0183] Understandably, the folded edge structure 114 surrounds the first air inlet 112, and the outer periphery of the waveguide plate 140 abuts against the inner periphery of the folded edge structure 114, so that the folded edge structure 114 can accommodate the waveguide plate 140, that is, the folded edge structure 114 can protect the waveguide plate 140, reduce the risk of the waveguide plate 140 being scratched by cables or other foreign objects in the computing device 200 and causing damage to the waveguide plate 140, and improve the reliability of the fan assembly 100.

[0184] Understandably, the waveguide plate 140 is embedded in the first air inlet 112 along the first direction Y, allowing the fan structure 130 to drive air through the waveguide plate 140 and flow to the first air outlet 122. This allows the waveguide plate 140 to straighten the chaotic airflow, reducing the disturbance of the airflow on the intake side of the fan assembly 100. This reduces the impact of airflow disturbance on the hard disk drive, improving its read / write speed and accuracy, and ultimately enhancing the speed and accuracy of data processing by the computing device 200. Furthermore, the waveguide plate 140 also helps to uniformly distribute airflow, thereby reducing the noise of the fan assembly 100.

[0185] Furthermore, the waveguide plate 140 can be embedded in the first air inlet 112 along the first direction Y, allowing the waveguide plate 140 to be integrated with the first frame 110, eliminating the need to externally mount the waveguide plate 140 on the side of the fan frame (e.g., the first frame 110) away from the fan structure 130. That is, by embedding the waveguide plate 140 in the first air inlet 112 along the first direction Y, there can be spatial overlap between the waveguide plate 140 and the first panel 111 in the first direction Y, reducing the space occupied by the waveguide plate 140 along the first direction Y, thereby reducing the thickness of the fan assembly 100 along the first direction Y, reducing the volume of the fan assembly 100, and improving the space utilization within the computing device 200.

[0186] In addition, the waveguide plate 140 can be embedded in the first air inlet 112, eliminating the need for edge wrapping or other treatments on the waveguide plate 140, thus reducing the cost of the waveguide plate 140 and consequently reducing the cost of the fan assembly 100.

[0187] Furthermore, the waveguide plate 140 can be embedded in the first air inlet 112, so that one fan structure 130 can correspond to one waveguide plate 140, reducing the length of the waveguide plate 140 along the second direction X and improving the ease of installation of the waveguide plate 140.

[0188] Figure 8A This is a structural diagram of a fan frame base provided in some embodiments of this application. Figure 8B This diagram illustrates the positional relationship between the fan frame assembly and the first and second frames provided in some embodiments of this application. Figure 8C for Figure 3A Cross-sectional view along the AA direction. Figure 8D for Figure 8C A magnified view of a portion of region P.

[0189] In some examples, such as Figure 8A and Figure 8B As shown, the fan assembly 100 may further include a fan frame base 180. The fan frame base 180 may enclose a fan frame receiving cavity, and both the first frame 110 and the second frame 120 may be located within the fan frame receiving cavity, and at least one of the first frame 110 and the second frame 120 may be detachably connected to the fan frame base 180.

[0190] Understandably, the first frame 110 and the second frame 120 can both be located within the fan frame receiving cavity, and the fan structure 130 can be located within the fan receiving cavity enclosed by the first frame 110 and the second frame 120. That is, the first frame 110, the second frame 120 and the fan structure 130 can all be located within the fan frame receiving cavity.

[0191] As described above, the number of fan structures 130 can be at least two, and one fan structure 130 can be located within a fan receiving cavity enclosed by a first frame 110 and a second frame 120. In some examples, the fan frame base 180 can enclose at least two fan frame receiving cavities, and one fan structure 130 can be located within one fan frame receiving cavity.

[0192] Understandably, the first frame 110 and the second frame 120 are both located within the fan frame housing cavity, so that the fan frame base 180 can protect the first frame 110, the second frame 120, and the fan structure 130 located within the fan housing cavity. Furthermore, the fan frame base 180 is detachably connected to at least one of the first frame 110 and the second frame 120, facilitating the maintenance and replacement of the fan assembly 100 and improving its ease of use.

[0193] In some examples, the first frame 110 may include a fifth latching portion, and the fan frame base 180 may include a sixth latching portion, which can be used to latch with the fifth latching portion. And / or, the second frame 120 may include a seventh latching portion, and the fan frame base 180 may include an eighth latching portion, which can be used to latch with the seventh latching portion.

[0194] Understandably, the fifth and sixth snap-fit ​​parts are designed to snap together, allowing the first frame 110 to snap into the fan frame base 180, thus enabling tool-free installation between the first frame 110 and the fan frame base 180 and improving the ease of installation of the fan assembly 100.

[0195] In some examples, the fifth snap-fit ​​portion can be a buckle, and the sixth snap-fit ​​portion can be a slot. In other examples, the fifth snap-fit ​​portion can be a slot, and the sixth snap-fit ​​portion can be a buckle.

[0196] Understandably, the seventh and eighth snap-fit ​​parts are designed to snap together so that the second frame 120 can snap into the fan frame base 180, enabling tool-free installation between the second frame 120 and the fan frame base 180 and improving the ease of installation of the fan assembly 100.

[0197] In some examples, the seventh latching part can be a buckle, and the eighth latching part can be a slot. In other examples, the seventh latching part can be a slot, and the eighth latching part can be a buckle.

[0198] In some examples, such as Figure 8A and Figure 8B As shown, the fan frame base 180 may include a base side plate 183. (As indicated...) Figure 8C and Figure 8DAs shown, the base side plate 183 may have a first groove 184, and at least a portion of the edge of the first panel 111 may be embedded in the first groove 184.

[0199] At least a portion of the edge of the first panel 111 can be embedded in the first groove 184. That is, all the edges of the first panel 111 can be embedded in the first groove 184, or only a portion of the edge of the first panel 111 can be embedded in the first groove 184.

[0200] Understandably, a first groove 184 is provided on the base side plate 183 so that at least a portion of the edge of the first panel 111 can be embedded in the first groove 184, thereby enabling the first frame 110 to engage with the fan frame base 180, thus improving the connection reliability between the first frame 110 and the fan frame base 180.

[0201] In some examples, the fan housing 180 can snap onto the housing 201 of the computing device 200, allowing the fan assembly 100 to be connected to the housing 201. For example, by changing the snap-fit ​​on the fan housing 180, the fan housing 180 can snap onto different models of the computing device 200, improving the applicability of the fan assembly 100.

[0202] In some examples, such as Figure 8A As shown, the fan frame base 180 may include a base panel 181, and the base panel 181 may have a third air inlet 182, which is connected to the first air inlet 112. Figure 8C and Figure 8D As shown, the folded edge structure 114 can be embedded in the third air inlet 182.

[0203] Understandably, by opening a third air inlet 182 on the base panel 181 and connecting the third air inlet 182 with the first air inlet 112, air can flow through the third air inlet 182 and the first air inlet 112 to the first air outlet 122, reducing the obstruction of air by the base panel 181 and increasing the air intake of the fan assembly 100.

[0204] In some examples, the outer periphery of the folded edge structure 114 can abut against the inner periphery of the third air inlet 182, so that the folded edge structure 114 can be embedded in the third air inlet 182.

[0205] Understandably, the folded edge structure 114 can be embedded in the third air inlet 182. In this way, there can be a spatial overlap between the folded edge structure 114 and the base panel 181 in the first direction Y, which reduces the space occupied by the base panel 181 in the first direction Y, thereby reducing the thickness of the fan assembly 100 in the first direction Y, reducing the volume of the fan assembly 100, and improving the space utilization rate within the computing device 200.

[0206] In some examples, such as Figure 8A and Figure 8B As shown, the fan frame base 180 may also include an air guide plate 185, which is located on the side of the base panel 181 away from the first frame 110.

[0207] Understandably, the air guide plate 185 is provided on the side of the base panel 181 away from the first frame 110, which can guide the airflow, increase the air intake of the fan assembly 100, and thus improve the heat dissipation effect of the fan assembly 100 on the processing chip 204.

[0208] In some examples, such as Figure 8A and Figure 8B As shown, the fan frame base 180 also includes a sound-absorbing cotton receiving groove 186, which is located on the side of the base panel 181 away from the first frame 110.

[0209] For example, the sound-absorbing cotton receiving groove 186 can be used to hold sound-absorbing cotton, which can absorb noise, thereby reducing the noise of the fan assembly 100 and improving the performance of the fan assembly 100.

[0210] As described above, in some examples, the waveguide plate 140 can be embedded in the first air inlet 112 along the first direction Y. In some examples, the outer periphery of the waveguide plate 140 can be connected to the inner periphery of the first air inlet 112 (that is, the inner periphery of the folded edge structure 114) by adhesive bonding, which serves to limit the waveguide plate 140, reduce the risk of the waveguide plate 140 falling off the first air inlet 112, and improve the reliability of the fan assembly 100.

[0211] In other examples, the fan assembly 100 may also include limiting components to restrict the displacement of the waveguide plate 140 in directions close to and away from the fan structure 130, reducing the risk of the waveguide plate 140 detaching from the first air inlet 112. Examples of limiting components in the fan assembly 100 are described below.

[0212] In some examples, such as Figure 8C and Figure 8DAs shown, the fan assembly 100 may further include a limiting plate 150, which may be located between the waveguide plate 140 and the fan body 131. The limiting plate 150 may be connected to the first frame 110 to limit the displacement of the waveguide plate 140 toward the fan body 131.

[0213] For example, the limiting plate 150 can be a flat plate-like structure to serve as a limiting device. In some examples, the limiting plate 150 can be located between the waveguide plate 140 and the fan housing 131a of the fan body 131, and connected to the first frame 110, so that the limiting plate 150 restricts the displacement of the waveguide plate 140 towards the fan body 131, reduces the risk of the waveguide plate 140 moving towards the fan body 131 and falling off the first air inlet 112, and improves the reliability of the fan assembly 100.

[0214] Furthermore, a limiting plate 150 is provided between the waveguide plate 140 and the fan body 131, so that the limiting plate 150 can isolate the waveguide plate 140 and the fan blades of the fan body 131, thereby protecting the waveguide plate 140, reducing the risk of the waveguide plate 140 being scratched due to the rotation of the fan blades, and improving the reliability of the fan assembly 100.

[0215] In some examples, such as Figure 8D As shown, the limiting plate 150 can be located between the first panel 111 and the fan body 131. Understandably, since the waveguide plate 140 can be embedded in the first air inlet 112 along the first direction Y, the limiting plate 150 can be located between the waveguide plate 140 and the fan body 131.

[0216] In some examples, such as Figure 8D As shown, the folded edge structure 114 can be bent and extended in a direction away from the limiting plate 150 to form the first air inlet 112. The first air inlet grille 118 can be located on the side of the waveguide plate 140 away from the limiting plate 150 and connected to the folded edge structure 114 to limit the displacement of the waveguide plate 140 in a direction away from the fan body 131.

[0217] Understandably, the first air inlet grille 118 is located on the side of the waveguide plate 140 away from the limiting plate 150 and is connected to the end of the folded structure 114 away from the limiting plate 150. This allows the first air inlet grille 118 to limit the displacement of the waveguide plate 140 away from the fan body 131, reducing the risk of the waveguide plate 140 moving away from the fan body 131 and falling off the first air inlet 112, thus improving the reliability of the fan assembly 100.

[0218] Furthermore, the first air intake grille 118 can also isolate the waveguide plate 140 from other components (such as cables) within the computing device 200, thereby protecting the waveguide plate 140, reducing the risk of the waveguide plate 140 being scratched by cables or other foreign objects and causing damage to the waveguide plate 140, and extending the service life of the waveguide plate 140.

[0219] Understandably, the limiting plate 150 can be located between the waveguide plate 140 and the fan body 131 and connected to the first frame 110 to limit the displacement of the waveguide plate 140 towards the fan body 131; the first air inlet grille 118 can be located on the side of the waveguide plate 140 away from the limiting plate 150 and connected to the folded edge structure 114 to limit the displacement of the waveguide plate 140 away from the fan body 131.

[0220] That is, by setting the limiting plate 150 and the first air inlet grille 118, the waveguide plate 140 can be located between the limiting plate 150 and the first air inlet grille 118, thereby limiting the displacement of the waveguide plate 140 towards the fan body 131 and the displacement of the waveguide plate 140 away from the fan body 131, reducing the risk of the waveguide plate 140 falling off the first air inlet 112 and improving the reliability of the fan assembly 100.

[0221] In some examples, the limiting plate 150 and the first frame 110 can be fixedly connected or detachably connected. In some examples, the limiting plate 150 can be connected to the first panel 111 of the first frame 110, or to the first side panel 116 or the second side panel 117 of the first frame 110.

[0222] Figure 9 This is a structural diagram of a limiting plate provided in some embodiments of this application.

[0223] In some examples, such as Figure 9 As shown, the limiting plate 150 may have a second air inlet 154, which may be connected to the first air inlet 112.

[0224] Understandably, the second air inlet 154 can penetrate the limiting plate 150 along the thickness direction (that is, the first direction Y) and is connected to the first air inlet 112, so that the fan blades can drive the gas to flow through the first air inlet 112 and the second air inlet 154 to the first air outlet 122, thereby reducing the impact of the limiting plate 150 on the airflow and increasing the air intake of the fan assembly 100.

[0225] In some examples, such as Figure 9As shown, the limiting plate 150 may also include a second air inlet grille 155. For example, the second air inlet grille 155 may be connected to the edge of the second air inlet 154 to improve the mechanical strength of the limiting plate 150. Furthermore, the second air inlet grille 155 also serves to protect the waveguide plate 140, reducing the risk of the waveguide plate 140 being scratched by the rotation of the fan blades of the fan body 131, thus improving the reliability of the fan assembly 100.

[0226] In some examples, the material of the limiting plate 150 may include metal to increase the mechanical strength of the limiting plate 150, reduce the risk of the limiting plate 150 breaking due to the vibration caused by the fan blades rotating, and improve the reliability of the fan assembly 100.

[0227] As described above, the first frame 110 can be connected to the fan structure 130 via the first shock-absorbing connector 160. When the first connecting part 161 is embedded in the first connecting hole 113 and the second connecting part 162 is embedded in the second connecting hole 133, the first buffer part 163 can be positioned along the first direction Y between the first panel 111 and the fan body 131 (e.g., the fan housing 131a of the fan body 131), so that there is a first gap between the first panel 111 and the fan body 131 along the first direction Y. In some examples, such as Figure 8C and Figure 8D As shown, at least a portion of the limiting plate 150 is located within the first gap Q. That is, in the first direction Y, at least a portion of the limiting plate 150 is located between the two ends of the first buffer portion 163.

[0228] Understandably, in the first direction Y, the limiting plate 150 can be entirely located within the first gap Q, or it can be partially located within the first gap Q.

[0229] Understandably, at least a portion of the limiting plate 150 can be located within the first gap Q, allowing the limiting plate 150 to utilize the space of the first buffer portion 163 in the first direction Y. That is, in the first direction Y, at least a portion of the limiting plate 150 can spatially overlap with the first buffer portion 163, reducing the space occupied by the limiting plate 150 along the first direction Y, thereby reducing the thickness of the fan assembly 100 along the first direction Y, reducing the volume of the fan assembly 100, and improving the space utilization rate within the computing device 200.

[0230] In some examples, such as Figure 9As shown, the limiting plate 150 can be octagonal or approximately octagonal to avoid the first shock-absorbing connector 160, allowing at least a portion of the limiting plate 150 to be located within the first gap Q. In other examples, the limiting plate 150 may also have a through hole that extends through the limiting plate 150 along its thickness direction (i.e., the first direction Y). The first connecting portion 161 can pass through the through hole and be embedded in the first connecting hole 113, allowing at least a portion of the limiting plate 150 to be located within the first gap Q.

[0231] As described above, the limiting plate 150 can be connected to the first frame 110. In some examples, the limiting plate 150 can be snapped into the first frame 110.

[0232] Understandably, by setting the limit plate 150 to snap into the first frame 110, tool-free installation between the limit plate 150 and the first frame 110 can be achieved, thereby improving the ease of installation between the limit plate 150 and the first frame 110.

[0233] In some examples, the first side plate 116 may include a first snap-fit ​​portion, such as Figure 9 As shown, the limiting plate 150 may include a second snap-fit ​​portion 152, which can be used to snap-fit ​​with the first snap-fit ​​portion.

[0234] Understandably, by providing the first snap-fit ​​part and the second snap-fit ​​part 152, the limiting plate 150 can snap-fit ​​with the first frame 110, thereby improving the ease of connection between the limiting plate 150 and the first frame 110.

[0235] In some examples, the first card slot can be a card slot, such as Figure 9 As shown, the second latching portion 152 can be a snap fastener. In other examples, the first latching portion can be a snap fastener, and the second latching portion 152 can be a slot.

[0236] In some examples, the second side plate 117 includes a third snap-fit ​​portion, and the limiting plate 150 includes a fourth snap-fit ​​portion 153, which can be used to snap with the third snap-fit ​​portion.

[0237] Understandably, by providing the third and fourth latching parts 153, the limiting plate 150 can latch onto the first frame 110, thereby improving the ease of connection between the limiting plate 150 and the first frame 110.

[0238] In some examples, the third latching part can be a latching slot, such as Figure 9 As shown, the fourth latching portion 153 can be a snap fastener. In other examples, the third latching portion can be a snap fastener, and the fourth latching portion 153 can be a slot.

[0239] In some examples, the first frame 110 may also include a hot-melt column 115 (see Figure 4A The hot melt column 115 can be located on the side of the first panel 111 near the limiting plate 150 and connected to the first panel 111.

[0240] Understandably, when the temperature rises, the end of the hot melt column 115 away from the first panel 111 can melt, and when the temperature drops, the end of the hot melt column 115 away from the first panel 111 can solidify.

[0241] In some examples, the first panel 111 and the hot melt pillar 115 can be an integrally formed structure to improve the reliability of the connection between the first panel 111 and the hot melt pillar 115.

[0242] In some examples, such as Figure 9 As shown, a limiting hole 151 can be formed on the limiting plate 150. The hot melt column 115 is used to pass through the limiting hole 151 so that after the end of the hot melt column 115 away from the first panel 111 is hot melted and solidified, it cooperates with the limiting hole 151 to limit the displacement of the limiting plate 150.

[0243] Understandably, the limiting hole 151 can penetrate the limiting plate 150 along the through direction (that is, the first direction Y) so that the hot melt column 115 can pass through the limiting hole 151.

[0244] In some examples, the limiting hole 151 can be a circular through hole, and the hot melt pillar 115 can be a cylindrical or near-cylindrical structure, so that the hot melt pillar 115 can pass through the limiting hole 151.

[0245] Understandably, after the limiting plate 150 is engaged with the first frame 110, the hot melt column 115 can pass through the limiting hole 151. Understandably, when the hot melt column 115 passes through the limiting hole 151, the end of the hot melt column 115 away from the first panel 111 can protrude from the limiting plate 150.

[0246] In this way, after the end of the hot-melt column 115 away from the first panel 111 is hot-melted and solidified, it can cooperate with the limiting hole 151 to limit the displacement of the limiting plate 150, reduce the risk of the limiting plate 150 shifting relative to the first frame 110 or even falling off relative to the first frame 110, improve the connection reliability between the limiting plate 150 and the first frame 110, and thus improve the limiting reliability of the limiting plate 150 for the waveguide plate 140.

[0247] Furthermore, by using the hot-melt column 115 to be hot-melted and solidified at the end away from the first panel 111 and then engaging with the limiting hole 151, the displacement of the limiting plate 150 is restricted. This eliminates the need for complex mechanical structures, simplifies the structure of the first frame 110, and reduces the cost of the first frame 110.

[0248] In some examples, such as Figure 9 As shown, the number of limiting holes 151 can be two. The number of hot melt pillars 115 can be the same as the number of limiting holes 151. One hot melt pillar 115 can pass through one limiting hole 151 to improve the limiting effect of the hot melt pillar 115 on the limiting plate 150 and reduce the risk of the limiting plate 150 shifting or even falling off relative to the first panel 111.

[0249] In some examples, after the limiting plate 150 is snapped into the first frame 110 and the hot melt column 115 passes through the limiting hole 151, the end of the hot melt column 115 away from the first panel 111 can be hot melted and solidified so that the hot melt column 115 can cooperate with the limiting hole 151 and play a limiting role for the limiting plate 150.

[0250] In some examples, such as Figure 8D As shown, the surface of the waveguide plate 140 near the limiting plate 150 (that is, the surface of the waveguide plate 140 away from the first air inlet grille 118) is flush with the surface of the first panel 111 near the limiting plate 150 (that is, the surface of the first panel 111 away from the first air inlet grille 118); and / or, the surface of the waveguide plate 140 away from the limiting plate 150 (that is, the surface of the waveguide plate 140 near the first air inlet grille 118) is flush with the surface of the first panel 111 away from the limiting plate 150 (that is, the surface of the first panel 111 near the first air inlet grille 118).

[0251] Understandably, setting the surface of the waveguide plate 140 near the limiting plate 150 to be flush with the surface of the first panel 111 near the limiting plate 150 can improve the structural regularity of the waveguide plate 140 after it is embedded in the first air inlet 112, facilitate the connection between the limiting plate 150 and the first frame 110, and improve the ease of installation of the fan assembly 100.

[0252] Understandably, setting the surface of the waveguide plate 140 away from the limiting plate 150 to be flush with the surface of the first panel 111 away from the limiting plate 150 can improve the structural regularity of the waveguide plate 140 after it is embedded in the first air inlet 112, facilitate the connection between the first air inlet grille 118 and the end of the folded structure 114 away from the limiting plate 150, and improve the processing convenience of the first frame 110.

[0253] In summary, the embodiments of this application have at least the following beneficial effects:

[0254] In the embodiments of this application, the fan structure 130 is installed in the fan receiving cavity enclosed by the first frame 110 and the second frame 120, which can isolate the fan structure 130 from other components (such as cables) in the computing device 200, reduce the risk of the fan structure 130 rubbing against cables or other foreign objects, and improve the reliability of the fan assembly 100.

[0255] Furthermore, the fan blades are rotatably connected to the fan body 131, allowing the fan blades to drive air through the first air inlet 112 to the first air outlet 122, thereby enabling the fan assembly 100 to dissipate heat from components such as the processing chip 204. In addition, the fan body 131 is connected to the first frame 110 and the second frame 120, reducing the risk of the fan body 131 wobbling or even shifting relative to the first frame 110 and the second frame 120, thus improving the reliability of the fan assembly 100.

[0256] Understandably, the waveguide plate 140 can be embedded in the first air inlet 112 along the first direction Y, so that the fan structure 130 can drive air through the waveguide plate 140 and flow to the first air outlet 122. This allows the waveguide plate 140 to straighten the messy airflow, reduce the disturbance of the airflow on the air intake side of the fan assembly 100, thereby reducing the impact of the airflow disturbance on the hard disk drive, improving the read and write speed and accuracy of the hard disk drive, and thus improving the speed and accuracy of data processing of the computing device 200.

[0257] Furthermore, the waveguide plate 140 can be embedded in the first air inlet 112 along the first direction Y, allowing the waveguide plate 140 to be integrated with the first frame 110, eliminating the need to externally mount the waveguide plate 140 on the side of the fan frame (e.g., the first frame 110) away from the fan structure 130. That is, by embedding the waveguide plate 140 in the first air inlet 112 along the first direction Y, there can be spatial overlap between the waveguide plate 140 and the first panel 111 in the first direction Y, reducing the space occupied by the waveguide plate 140 along the first direction Y, thereby reducing the thickness of the fan assembly 100 along the first direction Y, reducing the volume of the fan assembly 100, and improving the space utilization within the computing device 200.

[0258] In addition, the waveguide plate 140 can be embedded in the first air inlet 112, eliminating the need for edge wrapping or other treatments on the waveguide plate 140, thus reducing the cost of the waveguide plate 140 and consequently reducing the cost of the fan assembly 100.

[0259] Furthermore, the waveguide plate 140 can be embedded in the first air inlet 112, so that one fan structure 130 can correspond to one waveguide plate 140, which reduces the length of the waveguide plate 140 along the second direction X (the direction intersecting with the first direction Y) and improves the ease of installation of the waveguide plate 140.

[0260] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A fan assembly, characterized in that, It includes a first frame, a fan structure, a second frame, and a waveguide plate; The first frame and the second frame are connected to form a fan housing cavity; the fan structure is installed in the fan housing cavity; the fan structure includes a fan body and fan blades, the fan blades are rotatably connected to the fan body, and the fan body is connected to the first frame and the second frame; The first frame includes a first panel with a first air inlet; the second frame includes a second panel with a first air outlet; the fan blades drive air to flow from the first air inlet to the first air outlet; wherein the first air inlet is through in a first direction, and the waveguide plate is embedded in the first air inlet in the first direction; the first panel also has a first connecting hole, and the fan body has a second connecting hole. A limiting plate is located between the waveguide plate and the fan body; the limiting plate is connected to the first frame to restrict the displacement of the waveguide plate toward the fan body; The first shock-absorbing connector includes a first connecting part, a second connecting part, and a first buffer part; one end of the first buffer part is connected to the end of the first connecting part, and the other end of the first buffer part is connected to the end of the second connecting part; the first connecting part is used to be embedded in the first connecting hole, and the second connecting part is used to be embedded in the second connecting hole. The first buffer portion is located between the first panel and the fan body along the first direction, so that there is a first gap between the first panel and the fan body along the first direction; at least a portion of the limiting plate is located within the first gap.

2. The fan assembly according to claim 1, characterized in that, The first panel includes a folded edge structure, which bends and extends away from the limiting plate to form a first air inlet; the outer peripheral side of the waveguide plate abuts against the inner peripheral side of the folded edge structure to be embedded in the first air inlet.

3. The fan assembly according to claim 2, characterized in that, Also includes: The first air intake grille is located on the side of the waveguide plate away from the limiting plate and is connected to the folded edge structure to limit the displacement of the waveguide plate away from the fan body.

4. The fan assembly according to claim 1, characterized in that, The surface of the waveguide plate near the limiting plate is flush with the surface of the first panel near the limiting plate; and / or, The surface of the waveguide plate away from the limiting plate is flush with the surface of the first panel away from the limiting plate.

5. The fan assembly according to claim 2, characterized in that, Also includes: A fan frame base, the fan frame base enclosing a fan frame receiving cavity, the first frame and the second frame are both located within the fan frame receiving cavity, and at least one of the first frame and the second frame is detachably connected to the fan frame base; The fan frame base includes a base panel, the base panel having a third air inlet, the third air inlet being connected to the first air inlet; the folded edge structure is embedded in the third air inlet.

6. The fan assembly according to claim 1, characterized in that, The limiting plate is engaged with the first frame.

7. The fan assembly according to claim 1, characterized in that, The number of fan structures is at least two, and the at least two fan structures are arranged along a second direction; the second direction intersects with the first direction.

8. The fan assembly according to any one of claims 1 to 7, characterized in that, The waveguide plate has multiple waveguide holes, which are continuous along the first direction.

9. A computing device, characterized in that, include: Electronic devices; The fan assembly as described in any one of claims 1 to 8, wherein the electronic device is located on the air intake side of the fan assembly.

10. The computing device according to claim 9, characterized in that, The electronic device includes a hard disk drive.

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