Sorting method, system and computer device for LED chips
By acquiring wafer test data and visual inspection, compiling files, dividing independent areas, and selecting appropriate sorting modes, the problems of long sorting time and high difficulty in LED chip sorting are solved, thereby improving sorting efficiency and reducing production costs.
CN116013816BActive Publication Date: 2026-03-03JIANGXI ZHAO CHI SEMICON CO LTD
Patent Information
- Application Number
- CN202310064381.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-01-18
- Publication Date
- 2026-03-03
- Estimated Expiration
- 2043-01-18
AI Technical Summary
Technical Problem
The existing LED chip sorting process is time-consuming and difficult, affecting output speed and capacity, and requires a large number of sorting equipment.
Method used
By acquiring test data from the wafer, performing appearance inspection to obtain AOI data, synthesizing files, determining the coordinate position of the central die, dividing the wafer into at least four independent regions, and selecting a sorting mode based on the region yield for sorting.
Benefits of technology
It reduces the difficulty of sorting, improves sorting efficiency, shortens sorting time, and reduces production costs and investment in sorting equipment.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN116013816B_ABST
Abstract
The application provides a LED chip sorting method, system and computer equipment, the LED chip sorting method comprises the following steps: obtaining test data of a wafer, performing appearance detection based on original coordinates of the test data to obtain corresponding AOI data; merging the test data and the AOI data to obtain a synthesis file; determining the coordinate position of a center die according to the synthesis file, dividing the wafer into at least four independent regions based on the coordinate position of the center die in the coordinate system of the wafer; calculating the yield of dies in each independent region, and comparing the yield of dies in each independent region with a preset yield threshold respectively to select a corresponding sorting mode for sorting according to the comparison result. Through the present application, the sorting difficulty is reduced, the sorting efficiency is improved, the sorting time is shortened, the output capacity is improved, the investment in sorting equipment is reduced, and the production cost is reduced.
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Citation Information
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