用于微型LED显示器的芯片修复的取放装置
By using a nozzle device in a miniature LED display for chip repair, the problem of insufficient transfer yield was solved, enabling precise installation and efficient production.
CN116013832BActive Publication Date: 2026-07-17ENJET CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ENJET CO LTD
- Filing Date
- 2022-10-08
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
Existing technologies achieve less than 100% transfer yield in the mass transfer process of micro LED displays and struggle to achieve efficient chip repair, leading to increased costs and time in mass production.
Method used
It employs a nozzle device with a nozzle head smaller than the micro LED chip. It uses negative pressure to adsorb the chip and monitors its position and posture in real time. Combined with the image unit and the moving unit, it achieves precise installation, including pressure adjustment, image monitoring and movement control.
Benefits of technology
It enables precise mounting of micro LED chips, improves transfer yield, reduces production costs and time, and supports mass production.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN116013832B_ABST
Abstract
本发明涉及一种用于微型LED显示器的芯片修复的取放装置，本发明的用于微型LED显示器的芯片修复的取放装置的特征在于，包括：喷嘴，具有小于微型LED芯片的上端面积的喷嘴头，且为毛细管形态；压力调节部，用于对所述喷嘴的内部施加负压而将所述微型LED芯片吸附在所述喷嘴头上，并且对所述喷嘴的内部施加正压或解除所述负压而将吸附在所述喷嘴头的所述微型LED芯片安放在像素上；图像部，用于实时监控吸附在所述喷嘴头上的微型LED芯片的位置和姿势；移动部，用于使所述喷嘴移动；及控制部，用于从所述图像部接收图像信息，并控制所述压力调节部及所述移动部来在修复像素上安装所述微型LED芯片。
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