Display module packaging method and display module

Abstract

The application discloses a display module packaging method, which comprises the following steps: providing a lamp plate, wherein the lamp plate comprises a substrate and a plurality of light emitting chips installed on the front surface of the substrate; providing a protective film, wherein the protective film comprises a transparent adhesive layer, a black adhesive layer arranged below the transparent adhesive layer, and a transparent functional layer arranged on the transparent adhesive layer, and the thickness of the black adhesive layer is less than the height of the light emitting chips; and pasting the protective film on the front surface of the substrate through the transparent adhesive layer and the black adhesive layer, wherein the transparent adhesive layer and the black adhesive layer are filled between the adjacent light emitting chips, part of the black adhesive layer contacts the front surface of the substrate, and part of the black adhesive layer is pushed by the light emitting chips to the transparent adhesive layer, so that the black adhesive layer above the light emitting chips is broken or opened to be thinner than the black adhesive layer above the substrate. The application further discloses a display module. Compared with the prior art, the packaging process of the application is simple and low in cost.

Description

Technical Field

[0001] This invention relates to the manufacture of display modules, and more particularly to the packaging of display modules. Background Technology

[0002] To improve screen contrast, a protective film with a coating is often applied to LED displays. This protective film generally includes a light-transmitting layer, a black layer formed on the light-transmitting layer, and a surface protective layer formed on the black layer. However, because the black layer is too far from the light-emitting surface of the LED chip in the display, it often blocks too much light source while improving screen contrast. Therefore, existing technicians often blacken the side of the substrate where the LED chip is installed before packaging the display module. This process is relatively complex and adds extra spraying, curing, and other processes, resulting in high costs.

[0003] Therefore, there is an urgent need for a display module packaging method to solve the above problems. Summary of the Invention

[0004] The purpose of this invention is to provide a display module packaging method and a display module, which has a simple packaging process and low cost.

[0005] To achieve the above objectives, the present invention discloses a display module packaging method, comprising: providing a lamp board, the lamp board including a substrate and a plurality of light-emitting chips mounted on the front side of the substrate; providing a protective film, the protective film including a transparent adhesive layer, a black adhesive layer disposed below the transparent adhesive layer and a transparent functional layer disposed on the transparent adhesive layer, the thickness of the black adhesive layer being less than the height of the light-emitting chips; attaching the protective film to the front side of the substrate through the transparent adhesive layer and the black adhesive layer, the transparent adhesive layer and the black adhesive layer filling the spaces between adjacent light-emitting chips, and a portion of the black adhesive layer contacting the front side of the substrate, and a portion of the black adhesive layer being pushed out by the light-emitting chips toward the transparent adhesive layer, so that the black adhesive layer above the light-emitting chips is broken or stretched to be thinner than the black adhesive layer above the substrate.

[0006] Preferably, before the step of "attaching the protective film to the front side of the substrate through the transparent adhesive layer and the black adhesive layer", the adhesive layer is further reduced to reduce the adhesion of the black adhesive layer at the position corresponding to the light-emitting chip.

[0007] Specifically, one of the transparent adhesive layer and the black adhesive layer is a photosensitive adhesive, and the other of the transparent adhesive layer and the black adhesive layer is a thermosensitive adhesive. The method for reducing the adhesion of the black adhesive layer corresponding to the position of the light-emitting chip includes: curing or partially curing the black adhesive layer corresponding to the position of the light-emitting chip.

[0008] Specifically, after reducing the adhesion of the black adhesive layer corresponding to the position of the light-emitting chip, when the protective film is attached to the front side of the substrate through the transparent adhesive layer and the black adhesive layer, the light-emitting chip breaks through the black adhesive layer around the cured boundary or the middle of the cured portion, and the cured or partially cured black adhesive layer adheres to the light-emitting chip, or the light-emitting chip extends from the broken opening and is attached to the transparent adhesive layer. The black adhesive layer covers the substrate between adjacent light-emitting chips and exposes the light-emitting chip.

[0009] Specifically, when the adhesion of the black adhesive layer at the position corresponding to the light-emitting chip is reduced so that the adhesion of the black adhesive layer at the position corresponding to the light-emitting chip is less than a first preset value and greater than a second preset value, when the protective film is attached to the front side of the substrate through the transparent adhesive layer and the black adhesive layer, the light-emitting chip breaks through the black adhesive layer around the cured boundary or the middle of the cured portion, and the cured or partially cured black adhesive layer is attached to the light-emitting chip.

[0010] Specifically, when the adhesion of the black adhesive layer at the position corresponding to the light-emitting chip is reduced to less than a second preset value, and the protective film is applied to the front side of the substrate through the transparent adhesive layer and the black adhesive layer, the light-emitting chip extends out from the ruptured opening and is adhered to the transparent adhesive layer. The black adhesive layer covers the substrate between adjacent light-emitting chips and exposes the light-emitting chip.

[0011] Preferably, before the step of "attaching the protective film to the front side of the substrate through the transparent adhesive layer and the black adhesive layer", the method further includes: punching a hole in the film at a position corresponding to the light-emitting chip to break through the black adhesive layer, so that when the protective film is attached to the front side of the substrate through the transparent adhesive layer and the black adhesive layer, the light-emitting chip breaks through the black adhesive layer around the edge of the hole, and the black adhesive layer in the middle of the hole adheres to the light-emitting chip.

[0012] Preferably, the black adhesive layer is thinner than the transparent adhesive layer.

[0013] Preferably, the transparent adhesive layer is OCA transparent adhesive.

[0014] Preferably, the transparent functional layer includes a polyester film layer disposed on the transparent adhesive layer and a surface protective layer disposed on the polyester film layer.

[0015] This invention discloses a display module, including a substrate, a light-emitting chip mounted on the front side of the substrate, and a protective film attached to the front side of the substrate. The method of attaching the protective film to the front side of the substrate is the display module packaging method described above.

[0016] Compared with the prior art, the present invention coats a black adhesive layer under the transparent adhesive layer at the bottom of the protective film, and attaches the protective film with the black adhesive layer on the bottom to the lamp board on which the light-emitting chip is installed. This allows the black adhesive layer to be directly broken or opened by the light-emitting chip, which can not only effectively reduce the occlusion rate of the light emitted by the light-emitting chip, but also eliminates the need to spray black paint on the substrate. The display module can be packaged by directly attaching the protective film, which is simple to operate and low in cost. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of step S1 in the display module packaging method of the present invention.

[0018] Figure 2 This is a structural diagram of a display module manufactured by the display module packaging method in the first embodiment of the present invention.

[0019] Figure 3 These are structural diagrams of the display modules manufactured using the display module packaging methods in the second and third embodiments of the present invention.

[0020] Figure 4 This is a structural diagram of a display module manufactured by the display module packaging method in the fourth embodiment of the present invention. Detailed Implementation

[0021] To illustrate the technical content, structural features, objectives, and effects of the present invention in detail, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0022] refer to Figure 1 and Figure 2 The present invention discloses a display module packaging method, including steps S1 and S2.

[0023] Step S1, provide a light panel (such as...) Figure 1 As shown), the lamp panel includes a substrate 11 and a plurality of light-emitting chips 12 mounted on the front side of the substrate 11; a protective film 20 is provided (e.g., Figure 1 As shown, the protective film 20 includes a transparent adhesive layer 22, a black adhesive layer 21 disposed below the transparent adhesive layer 22, and transparent functional layers (23, 24) disposed on the transparent adhesive layer 22. The thickness of the black adhesive layer 21 is less than the height of the light-emitting chip 12.

[0024] The substrate 11 can be a PCB board, glass substrate, etc. The light-emitting chip 12 is an LED chip.

[0025] Step S2, refer to Figure 2The protective film 20 is attached to the front side of the substrate 11 through the transparent adhesive layer 22 and the black adhesive layer 21. The transparent adhesive layer 22 and the black adhesive layer 21 fill the space between adjacent light-emitting chips 12, and part of the black adhesive layer 21 contacts the front side of the substrate 11. Part of the black adhesive layer 21 is pushed out by the light-emitting chips 12 towards the transparent adhesive layer 22, so that the black adhesive layer 21 above the light-emitting chips 12 is stretched open. The black adhesive layer 21 above the light-emitting chips 12 is thinner than the black adhesive layer 21 between adjacent light-emitting chips 12.

[0026] After application, cure the transparent adhesive layer 22 and the black adhesive layer 21.

[0027] The protective film 20 has a release film 25 attached under the black adhesive layer 21. Before attaching the protective film 20 to the substrate 11 through the transparent adhesive layer 22 and the black adhesive layer 21, the release film 25 needs to be peeled off.

[0028] Preferably, the black adhesive layer 21 is thinner than the transparent adhesive layer 22. The transparent adhesive layer 22 is OCA transparent adhesive, but other soft adhesives can also be used to make the transparent adhesive layer 22, such as other pressure-sensitive adhesives, heat-sensitive adhesives, or photosensitive adhesives.

[0029] refer to Figure 1 and Figure 2 The transparent functional layer includes a polyester film layer 23 disposed on the transparent adhesive layer 22 and a surface protective layer 24 disposed on the polyester film layer. Of course, the structure of the transparent functional layer is not limited to this.

[0030] refer to Figure 3 This is the second embodiment of the present invention. Unlike the first embodiment, it includes step S1a before step S2, in which a hole is punched in the film at the position corresponding to the light-emitting chip 12 to punch open the black adhesive layer 21. This allows the light-emitting chip 12 to break through the black adhesive layer 21 along the edge of the hole when the protective film 20 is attached to the front side of the substrate 11 through the transparent adhesive layer 22 and the black adhesive layer 21. The black adhesive layer 21 in the middle of the hole is attached to the light-emitting chip 12.

[0031] Unlike the first embodiment, in a preferred embodiment of the present invention, step S1b is included before step S2 to reduce the adhesion of the black adhesive layer 21 corresponding to the position of the light-emitting chip 12. Here, one of the transparent adhesive layer 22 and the black adhesive layer 21 is a photosensitive adhesive, and the other is a thermosensitive adhesive. Step S1a includes curing or partially curing the black adhesive layer 21 corresponding to the position of the light-emitting chip 12. Of course, this is not a limitation; in this embodiment, it is sufficient to use adhesive layers with different curing methods to make the transparent adhesive layer 22 and the black adhesive layer 21.

[0032] refer to Figure 3In the third embodiment of the present invention, when the adhesive layer 21 after curing has low viscosity (viscosity lower than the first preset value and higher than the second preset value), when the protective film 20 is attached to the front side of the substrate 11 through the transparent adhesive layer 22 and the adhesive layer 21, the cured or partially cured adhesive layer 21 is attached to the light-emitting chip 12.

[0033] refer to Figure 4 In the fourth embodiment of the present invention, when the adhesive layer 21 after curing has lower viscosity (viscosity lower than the second preset value), when the protective film 20 is attached to the front side of the substrate 11 through the transparent adhesive layer 22 and the black adhesive layer 21, the black adhesive layer 21 after curing or partial curing is ruptured, the light-emitting chip 12 extends out from the ruptured crack and is attached to the transparent adhesive layer 22, and the black adhesive layer 21 covers the substrate 11 and exposes the light-emitting chip 12.

[0034] Of course, in one embodiment, the black adhesive layer 21 on the same substrate can be partially broken from the cured edge to adhere to the light-emitting chip 12, and partially broken from the middle to expose the light-emitting suction cup 12.

[0035] refer to Figures 2 to 4 The present invention also discloses a display module, including a substrate 11, a light-emitting chip 12 mounted on the front side of the substrate 11, and a protective film 20 attached to the front side of the substrate 11. The method of attaching the protective film 20 to the front side of the substrate 11 is the display module packaging method described above.

[0036] The above-disclosed embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. Therefore, any equivalent variations made in accordance with the claims of the present invention are still within the scope of the present invention.

Claims

1. A method for packaging a display module, characterized in that: include: A lamp board is provided, the lamp board including a substrate and a plurality of light-emitting chips mounted on the front side of the substrate; A protective film is provided, the protective film comprising a transparent adhesive layer, a black adhesive layer disposed below the transparent adhesive layer, and a transparent functional layer disposed on the transparent adhesive layer, wherein the thickness of the black adhesive layer is less than the height of the light-emitting chip; The black adhesive layer at the position corresponding to the light-emitting chip is cured or partially cured to reduce the stickiness of the black adhesive layer at the position corresponding to the light-emitting chip. The protective film is attached to the front side of the substrate through the transparent adhesive layer and the black adhesive layer. The transparent adhesive layer and the black adhesive layer fill the space between adjacent light-emitting chips, and part of the black adhesive layer contacts the front side of the substrate. Part of the black adhesive layer is pushed out by the light-emitting chips towards the transparent adhesive layer, so that the black adhesive layer above the light-emitting chips is broken or stretched to be thinner than the black adhesive layer above the substrate.

2. The display module packaging method as described in claim 1, characterized in that: One of the transparent adhesive layer and the black adhesive layer is a photosensitive adhesive, and the other of the transparent adhesive layer and the black adhesive layer is a heat-sensitive adhesive.

3. The display module packaging method as described in claim 1, characterized in that: After reducing the adhesion of the black adhesive layer corresponding to the position of the light-emitting chip, when the protective film is attached to the front side of the substrate through the transparent adhesive layer and the black adhesive layer, the light-emitting chip breaks through the black adhesive layer around the cured boundary or the middle of the cured portion, and the cured or partially cured black adhesive layer adheres to the light-emitting chip, or the light-emitting chip extends from the broken opening and is attached to the transparent adhesive layer. The black adhesive layer covers the substrate between adjacent light-emitting chips and exposes the light-emitting chip.

4. The display module packaging method as described in claim 3, characterized in that: When the adhesion of the black adhesive layer at the position corresponding to the light-emitting chip is reduced so that the adhesion of the black adhesive layer at the position corresponding to the light-emitting chip is less than a first preset value and greater than a second preset value, when the protective film is attached to the front side of the substrate through the transparent adhesive layer and the black adhesive layer, the light-emitting chip breaks through the black adhesive layer around the cured boundary or the middle of the cured part, and the cured or partially cured black adhesive layer is attached to the light-emitting chip. When the adhesiveness of the black adhesive layer at the position corresponding to the light-emitting chip is reduced to less than a second preset value, and the protective film is applied to the front side of the substrate through the transparent adhesive layer and the black adhesive layer, the light-emitting chip extends out from the ruptured opening and is adhered to the transparent adhesive layer. The black adhesive layer covers the substrate between adjacent light-emitting chips and exposes the light-emitting chip.

5. The display module packaging method as described in claim 1, characterized in that: Before the step of "attaching the protective film to the front side of the substrate through the transparent adhesive layer and the black adhesive layer", the method further includes: punching a hole in the film at the position corresponding to the light-emitting chip to break through the black adhesive layer, so that when the protective film is attached to the front side of the substrate through the transparent adhesive layer and the black adhesive layer, the light-emitting chip breaks through the black adhesive layer around the edge of the hole, and the black adhesive layer in the middle of the hole adheres to the light-emitting chip.

6. The display module packaging method as described in claim 1, characterized in that: The black adhesive layer is thinner than the transparent adhesive layer.

7. The display module packaging method as described in claim 1, characterized in that: The transparent adhesive layer is OCA transparent adhesive.

8. The display module packaging method as described in claim 1, characterized in that: The transparent functional layer includes a polyester film layer disposed on the transparent adhesive layer and a surface protective layer disposed on the polyester film layer.

9. A display module, characterized in that: The device includes a substrate, a light-emitting chip mounted on the front side of the substrate, and a protective film attached to the front side of the substrate. The method of attaching the protective film to the front side of the substrate is the display module packaging method as described in any one of claims 1-8.

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