厚度测定装置和厚度测定方法
By designing the substrate holding section and the moving mechanism, and combining the cutting section and multi-point measurement, the problem of measuring the overall thickness of overlapping wafers was solved, and the uniformity and flatness control of wafer grinding were achieved.
CN116018497BActive Publication Date: 2026-07-17TOKYO ELECTRON LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- TOKYO ELECTRON LTD
- Filing Date
- 2021-08-27
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
Existing technology cannot effectively measure the overall thickness of overlapping wafers, resulting in uneven grinding of the wafers and affecting flatness.
Method used
An overall thickness measuring device is used to measure the overall thickness of the overlapping wafers radially at multiple points, and the thickness of the upper wafer is measured by a partial thickness measuring device. The thickness of the lower wafer is then calculated to adjust the grinding process.
Benefits of technology
It enables accurate measurement of the overall thickness of overlapping wafers, ensuring the uniformity of the upper wafer grinding process and improving flatness.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN116018497B_ABST
Abstract
一种测定基板的厚度的厚度测定装置，具备：基板保持部，其保持所述基板的中央部；测定部，其测定被所述基板保持部保持的所述基板的厚度；以及移动机构，其使所述基板保持部和所述测定部相对地沿水平方向移动，其中，在所述基板保持部形成有切口部，所述切口部从该基板保持部的中心部沿径向延伸到外端部，以供所述测定部自如地相对进退。
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