Combined backplane and enclosure for bump bonded chip components
By using a single metal plate in the quantum chip components as both a backplane and a penny to form an electromagnetic resonance chamber, the problems of substrate warping and unstable bonding of electronic components are solved, thereby improving stability and electromagnetic radiation shielding.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- INTERNATIONAL BUSINESS MACHINE CORPORATION
- Filing Date
- 2021-08-13
- Publication Date
- 2026-07-31
AI Technical Summary
Existing technologies struggle to effectively prevent substrate warping and ensure stable bonding of electronic components when forming quantum chip parts, especially in the process of bonding with backplanes and pence.
A single metal plate is used as both a backplane and a penny to form a cavity for encapsulating electronic components. By forming a seal between the substrate and the metal plate, the electronic components are ensured to be encapsulated in an electromagnetic resonance chamber. Indium seals and vacuum or gas insulators are used to improve stability.
This improves the combination of substrate stability and electronic component reliability, reduces the risk of warpage, and enhances the shielding effect against electromagnetic radiation, ensuring efficient encapsulation and stability of electronic components.
Smart Images
Figure CN116018682B_ABST
Abstract
Description
Background Technology
[0001] The embodiments currently claimed in this invention relate to an electronic chip component and a corresponding method.
[0002] Quantum computers typically include qubits (qubits) as part of a quantum qubit chip, which is formed as a quantum component. This quantum chip can be part of a quantum chip assembly, where the quantum qubit chip is bonded to a quantum interposer chip, which in turn is bonded to a printed circuit board (PCB). The assembly may have multiple metal plates (called "penny") attached to opposing surfaces of the PCB, which enclose the quantum chip within a microwave cavity defined by these pennies.
[0003] During the fabrication of the quantum chip component, two pennies are placed near the quantum chip and attached to the PCB on opposite surfaces. The quantum chip is positioned within holes formed in the PCB. In manufacturing, the quantum bit chip is first bonded to the quantum interposer chip using indium bumps, and then the quantum interposer chip is bonded to the PCB. During this process, a metal backplate is screwed onto the PCB to provide a flat and stable surface, allowing for accurate and repeatable bonding. Once the quantum interposer chip is bonded to the PCB, the metal backplate is removed, and then the two pennies are bonded to the PCB. Summary of the Invention
[0004] One aspect claimed by the present invention is to provide a method for forming an electronic chip component. A first metal plate is coupled to a first side of a substrate to form a backplane. A first cavity is created extending through the substrate to at least extend into the first metal plate. An electronic component is bonded to the substrate such that the electronic component is located within the first cavity. A second metal plate having a second cavity is disposed on a second side of the substrate and above the first cavity, such that the electronic component is enclosed within the first and second cavities by the first and second metal plates.
[0005] According to some embodiments, a first cavity is created within a first metal plate. According to some embodiments, the first cavity and the second cavity form an electromagnetic resonant chamber having a wavelength cutoff to exclude electromagnetic radiation with wavelengths below the cutoff. According to some embodiments, the electronic component includes a quantum qubit chip and a quantum interposer chip bonded to the quantum qubit chip, wherein the quantum interposer chip is bonded to a substrate. According to some embodiments, bonding the quantum interposer chip to the substrate is performed after the first metal plate is coupled to a first side of the substrate.
[0006] According to some embodiments, the substrate is either a printed circuit board (PCB) or a laminate. According to some embodiments, the first and second metal plates comprise aluminum or copper. According to some embodiments, when the electronic component is enclosed within a first and second cavity by the first and second metal plates, the electronic component is separated from the first and second metal plates by an insulator. According to some embodiments, the insulator is a gas or a vacuum.
[0007] According to some embodiments, coupling the first metal plate to a first side of the substrate includes forming a seal between the first metal plate and the substrate. According to some embodiments, the seal includes an indium seal. According to some embodiments, the seal is formed in a groove in at least one of the first metal plate or the substrate. According to some embodiments, the first cavity has the same or smaller cross-section in the substrate as in the first metal plate.
[0008] Another aspect claimed by the present invention is to provide a method for forming electronic chip components. A first metal plate is coupled to a first side of a substrate to form a backplane. A first cavity is created extending through the substrate to at least extend into the first metal plate. A plurality of electronic components are bonded to the substrate, each electronic component including a quantum interposer chip and a quantum qubit chip, such that the quantum qubit chip is located within the first cavity. A second metal plate having a second cavity is disposed on a second side of the substrate and over the first cavity, such that the electronic components are enclosed within the first and second cavities by the first and second metal plates.
[0009] According to some embodiments, a first cavity is created to extend into a first metal plate.
[0010] Another aspect claimed by the present invention is to provide an electronic chip component including a substrate. A first metal plate is located on a first side of the substrate to form a backplate, wherein a first cavity extends through the substrate and into the first metal plate. At least one electronic component is positioned within the first cavity. A second metal plate having a second cavity is disposed on the first cavity such that at least one electronic component is enclosed within the first and second cavities by the first and second metal plates.
[0011] According to some embodiments, at least one electronic component includes a plurality of electronic components. According to some embodiments, the first cavity has the same or smaller cross-section in the substrate as in the first metal plate. According to some embodiments, each of the at least one electronic component includes a quantum interposer chip and a quantum qubit chip bonded to the quantum interposer chip. Attached Figure Description
[0012] The operation and function of the relevant elements of this disclosure and structure, as well as the economy of combination and manufacture of the components, will become more apparent when considered with reference to the accompanying drawings, all of which form part of this specification, wherein similar reference numerals denote corresponding components in the various drawings. However, it should be clearly understood that the drawings are for illustrative and descriptive purposes only and are not intended to be limiting of the invention.
[0013] Figure 1 This is a schematic diagram of an electronic chip component according to some embodiments;
[0014] Figure 2A This is a schematic top view of an electronic chip component having a single electronic component in a cavity, according to some embodiments.
[0015] Figure 2B This is a schematic top view of an electronic chip component having multiple electronic components in a cavity, according to some embodiments.
[0016] Figure 3A , Figure 3B and Figure 3C The process flow for forming electronic chip components according to some embodiments is shown. Detailed Implementation
[0017] According to some embodiments, instead of using a separate backplane to bond the quantum interposer chip to the substrate, then removing the backplane, and setting up pennies to form a microwave cavity for the quantum chip, the backplane is not removed. Instead, a single plate serves as both a backplane and one of the pennies. According to some embodiments, this single backplane may have suitable cutouts for the quantum qubit chip, wherein the cutouts form a cavity that is part of the entire cavity formed by these pennies. Thus, a single backplane serves as both a backplane and a pennies. In some embodiments, this has the advantage of preventing substrate warping after manufacturing and reducing handling. In some embodiments, the net benefit is increased reliability of the substrate-to-interposer bump bonding.
[0018] Figure 1 This is a schematic diagram of an electronic chip component 100 according to some embodiments. The electronic chip component 100 includes a substrate 120. The substrate 120 may be a PCB and / or a laminate, and may be formed, for example, from a resin material.
[0019] The electronic chip component 100 may further include a first metal plate 110 disposed on a first side 122 of the substrate 120 to serve as a backplane. The first metal plate 110 may be attached to the substrate 120 via screws 170. The electronic chip component 100 may include recesses 180 in the substrate 120 and / or the first metal plate 110. The recesses 180 may be filled with a sealing material 185, such as providing a seal between the first metal plate 110 and the substrate 120.
[0020] The first cavity 150 extends through the substrate 120 to at least the first metal plate 110. In some embodiments, the first cavity 150 extends into the first metal plate 110.
[0021] In some embodiments, the first cavity 150 may have a cross-section in the substrate 120 that is the same as or smaller than the cross-section in the first metal plate 110. In this way, a portion of the first cavity 150 in the first metal plate 110 does not undercut the substrate 120, and thus provides improved stability when bonding materials to the substrate 120.
[0022] In some embodiments, the electronic chip component 100 may include at least one electronic component 130. The at least one electronic component 130 is disposed within the first cavity 150. Each of the at least one electronic component 130 may be a quantum interposer chip 134 and / or a quantum qubit chip 132. Each of the at least one electronic component 130 may include a quantum interposer chip 134 and a quantum qubit chip 132 coupled to the quantum interposer chip 134, the quantum qubit chip 132 having one or more qubits. The quantum qubit chip 132 may be bonded to the quantum interposer chip 134 via, for example, a bump bond 136. For example, the quantum interposer chip 134 may also be bonded to the substrate 120 via a bump bond 136. For example, the bump bond 136 may be formed of an indium-containing material. In some embodiments, the quantum qubit chip 132 may be directly bonded to the substrate 120, for example, if the electronic component 130 does not include the quantum interposer chip 134.
[0023] The electronic chip component 100 may include a second metal plate 140. The second metal plate 140 may have a second cavity 160 disposed on the first cavity 150, such that at least one electronic component 130 is enclosed within the first cavity and the second cavity (150, 160) by the first metal plate and the second metal plate (110, 140). The first metal plate and the second metal plate (110, 140) may be formed of, for example, aluminum or copper.
[0024] The first and second cavities (150, 160) together form a total cavity that acts as a microwave cavity, the size of which determines the wavelength of the microwaves resonating within it. The first cavity 150 and the second cavity 160 can form an electromagnetic resonant chamber with a wavelength cutoff to exclude wavelengths below the cutoff. Note that by encapsulating the device using a base plate and a top plate (which together form a sealed cavity), most (if not all) of the external radiation is excluded, rather than by a cutoff mechanism.
[0025] Figure 1 An embodiment is shown in which a single electronic component 130 is enclosed within first and second cavities (150, 160). Figure 2A This is a top schematic diagram of an embodiment showing a quantum qubit chip 132, with a single electronic component 130 enclosed within first and second cavities (150, 160). Alternatively, as in Figure 2B As shown in the top schematic diagram, more than one quantum bit chip 132 can be encapsulated within the first and second cavities (150, 160).
[0026] Figure 3A , Figure 3B and Figure 3C The following are examples of methods for forming electronic chip components (e.g.) according to some embodiments. Figure 1 The process flow of the method for the electronic chip component 100.
[0027] like Figure 3A As shown, a first metal plate 110 is attached to a first side 122 of a substrate 120 to form a backplate on the substrate 120. The first metal plate 110 may be formed, for example, of aluminum or copper. The first metal plate 110 may be formed to have flat surfaces on both sides. The flatness of the surface of the first metal plate 110 may be sufficient to improve the bonding between the electronic component 130 and the substrate 120. In some embodiments, the first metal plate 110 may be attached to the substrate 120 such that there is no gap between the first metal plate 110 and the substrate 120. In some embodiments, the flat surface of the first metal plate 110 may be precisely ground.
[0028] The substrate 120 may be formed of resin and / or laminate material, and may be a PCB. The first metal plate 110 may be attached to a first side 122 of the substrate 120 via screws 170 or, for example, pins.
[0029] like Figure 3AAs shown, a first cavity 150 is created extending through the substrate 120 to at least extend into the first metal plate 110. For example, the first cavity 150 can be formed through the substrate 120 by chemical etching or by mechanical processes such as cutting or stamping. The first cavity 150 can be formed to extend into the first metal plate 110. For example, the first cavity 150 can be formed to extend into the first metal plate 110 by, for example, chemical etching or by mechanical processes.
[0030] In some embodiments, the first cavity 150 may be formed in the substrate 120 to have a cross-section that is the same as or smaller than the cross-section in the first metal plate 110. In this way, a portion of the first cavity 150 in the first metal plate 110 does not undercut the substrate 120, and thus provides improved stability during the bonding process of the electronic component 130 to the second surface 124 of the substrate 120.
[0031] According to some embodiments, attaching the first metal plate 110 to a first side surface 122 of the substrate 120 may include forming a seal between the first metal plate 110 and the substrate 120. The seal may be formed by forming a sealing material 185 into a recess 180 formed in one of the first metal plate 110 and the substrate 120. The sealing material 185 may, for example, include indium.
[0032] like Figure 3B As shown, the electronic component 130 is then bonded to the second surface 124 of the substrate 120. The electronic component 130 may include a quantum interposer chip 134 and a quantum qubit chip 132. The quantum interposer chip 134 and the quantum qubit chip 132 may be formed of different or the same materials. For example, both the quantum interposer chip 134 and the quantum qubit chip 132 may be formed of a semiconductor material. The quantum qubit chip 132 may have one or more qubits formed thereon. According to some embodiments, the quantum interposer chip 134 may have one or more microwave generating structures formed thereon to generate microwaves of a desired wavelength.
[0033] like Figure 3B As shown, the quantum interposer chip 134 is attached to the quantum qubit chip 132. According to some embodiments, the quantum interposer chip 134 can be attached to the quantum qubit chip 132 via a bonding process. For example, the quantum interposer chip 134 can be bonded to the quantum qubit chip 132 via a bump bonding 136. In this case, the bump bonding 136 can be heated, causing the bump bonding 136 to bond the quantum interposer chip 134 to the quantum qubit chip 132.
[0034] like Figure 3AAs shown, a quantum interposer chip 134 is attached to a substrate 120. According to some embodiments, the quantum interposer chip 134 can be attached to the substrate 120 via a bonding process. For example, the quantum interposer chip 134 can be bonded to the substrate 120 via a bump bonding 136. In this case, the bump bonding 136 can be heated such that it bonds the quantum interposer chip 134 to the substrate 120. According to some embodiments, the quantum interposer chip 134 can be bonded to a quantum qubit chip 132 before being bonded to the substrate 120.
[0035] like Figure 3C As shown, a second metal plate 140 with a second cavity 160 is disposed on the second side of the substrate 120 and above the first cavity 150, such that the quantum interposer chip 134 and the quantum qubit chip 132 are encapsulated within the first and second cavities (150, 160) by the first and second metal plates (110, 140). When the quantum interposer chip 134 and the quantum qubit chip 132 are encapsulated within the first and second cavities (150, 160) by the first and second metal plates (110, 140), the quantum interposer chip 134 and the quantum qubit chip 132 can be separated from the first and second metal plates (110, 140) by an insulator 190. The insulator 190 can be, for example, a gas or a vacuum.
[0036] The second metal plate 140 may be attached to the substrate 120. For example, the second metal plate 140 may be attached to the substrate 120 using screws. An indium pad may also be used to attach the first metal plate 110 and / or the second metal plate 140 to the substrate 120.
[0037] Figure 3C A single electronic component 130 is shown enclosed within first and second cavities (150, 160) by first and second metal plates (110, 140). Alternatively, multiple electronic components 130 may be enclosed within the first and second cavities (150, 160) by the first and second metal plates (110, 140), as shown. Figure 2B As shown.
[0038] According to some embodiments, the above-described apparatus and methods offer numerous benefits. A single backplane serves as both a backplane and a penny. In some embodiments, this has the advantage of preventing substrate warping after manufacturing and reducing handling. In some embodiments, the net benefit is increased reliability of the substrate-intermediate layer bump bonding.
[0039] Various embodiments of the invention have been described for illustrative purposes, but are not intended to be exhaustive or limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein has been chosen to best explain the principles of the embodiments, their practical application, or technical improvements to technologies found in the market, or to enable those skilled in the art to understand the embodiments disclosed herein.
Claims
1. A method for forming an electronic chip component, comprising: A first metal plate is coupled to a first side of a substrate to form a back plate, wherein coupling the first metal plate to the first side of the substrate includes forming a seal between the first metal plate and the substrate, and wherein the seal is formed in a groove in at least one of the first metal plate or the substrate; A first cavity is created that extends through the substrate to at least extend into the first metal plate; The electronic components are bonded to the substrate such that the electronic components are located within the first cavity; and A second metal plate having a second cavity is arranged on the second side of the substrate and above the first cavity, such that the electronic component is enclosed in the first cavity and the second cavity by the first metal plate and the second metal plate.
2. The method of claim 1, wherein, The process of creating the first cavity involves creating the first cavity within the first metal plate.
3. The method of claim 1 or 2, wherein, The first cavity and the second cavity form an electromagnetic resonant chamber with a wavelength cutoff to exclude electromagnetic radiation with wavelengths below the wavelength cutoff.
4. The method according to claim 1 or 2, wherein the electronic component comprises a quantum qubit chip and a quantum interposer chip bonded to the quantum qubit chip, and wherein the quantum interposer chip is bonded to the substrate.
5. The method of claim 4, wherein, After coupling the first metal plate to the first side of the substrate, the quantum intermediary chip is bonded to the substrate.
6. The method according to claim 1 or 2, wherein the substrate is a printed circuit board (PCB) or a laminate.
7. The method of claim 1 or 2, wherein, The first metal plate and the second metal plate comprise aluminum or copper.
8. The method of claim 1 or 2, wherein, When the electronic component is enclosed in the first cavity and the second cavity by the first metal plate and the second metal plate, the electronic component is separated from the first metal plate and the second metal plate by an insulator.
9. The method of claim 8, wherein, The insulator is a gas or a vacuum.
10. The method according to claim 1, wherein, The seal includes an indium seal.
11. The method of claim 1 or 2, wherein, The first cavity has the same or smaller cross-section in the substrate than in the first metal plate.
12. A method for forming an electronic chip component, comprising: A first metal plate is coupled to a first side of a substrate to form a back plate, wherein coupling the first metal plate to the first side of the substrate includes forming a seal between the first metal plate and the substrate, wherein the seal is formed in a groove in at least one of the first metal plate or the substrate; A first cavity is created that extends through the substrate to at least extend into the first metal plate; Multiple electronic components are bonded to the substrate, each electronic component including a quantum interposer chip and a quantum qubit chip, such that the quantum qubit chip is located within the first cavity; and A second metal plate having a second cavity is arranged on the second side of the substrate and above the first cavity, such that electronic components are encapsulated within the first cavity and the second cavity by the first metal plate and the second metal plate.
13. The method of claim 12, wherein, The first cavity is created to extend into the first metal plate.
14. An electronic chip component, comprising: Substrate; A first metal plate coupled to a first side of the substrate to form a back plate, wherein a first cavity extends through the substrate and into the first metal plate, wherein the coupling includes forming a seal between the first metal plate and the substrate, and wherein the seal is formed in a groove in at least one of the first metal plate or the substrate; At least one electronic component located within the first cavity; and The second metal plate has a second cavity disposed above the first cavity, such that the at least one electronic component is enclosed within the first cavity and the second cavity by the first metal plate and the second metal plate.
15. The component of claim 14, wherein, The at least one electronic component includes multiple electronic components.
16. The component of any one of claims 14-15, wherein, The first cavity has the same or smaller cross-section in the substrate than in the first metal plate.
17. The component of any one of claims 14-15, wherein, Each of the at least one electronic component includes a quantum intermediary chip and a quantum qubit chip incorporated into the quantum intermediary chip.